CN110003812A - A kind of production method for the ultra-thin heat dissipation material inside electronic product - Google Patents
A kind of production method for the ultra-thin heat dissipation material inside electronic product Download PDFInfo
- Publication number
- CN110003812A CN110003812A CN201910242526.3A CN201910242526A CN110003812A CN 110003812 A CN110003812 A CN 110003812A CN 201910242526 A CN201910242526 A CN 201910242526A CN 110003812 A CN110003812 A CN 110003812A
- Authority
- CN
- China
- Prior art keywords
- ultra
- heat dissipation
- printing ink
- thin heat
- electronic product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
Abstract
The invention discloses a kind of production methods for the ultra-thin heat dissipation material inside electronic product, and nano-carbon material is coated on copper foil surface using special process, and the ultra-thin heat dissipation material sheet resistance X-Y/Z made of this method is respectively less than 0.08 Ω/inch to resistance2, carbon face is anti-oxidant, resistance to hundred lattice, anti-finger mark, anti-alcohol, wipes carbon face 60 times without obvious decoloration with the cloth for being stained with alcohol, material thickness can reach down to 0.010mm, thermal coefficient: 2000W, while this material has good thermal diffusivity, meets ultrathin demand.
Description
Technical field
The present invention relates to heat sink material field, in particular to a kind of production side for the ultra-thin heat dissipation material inside electronic product
Method.
Background technique
As electronic product is increasingly intended to ultrathin, the requirement for heat dissipation is also increasingly harsher, and tradition uses metallic copper
Demand is much not achieved in foil heat dissipation, and nano-sized carbon copper product can be by converting heat energy into infrared radio frequency, transmitting heat dissipation effect
Can, reach cooling efficiency, have compared with high heat dispersion, thickness is but unable to satisfy the demand of ultrathin, therefore develops a ultra-thin scattered
Hot material has become extremely urgent demand.
Summary of the invention
The technical problem to be solved by the present invention is to provide one kind to reach compared with high heat dispersion, while meeting the one of ultrathin demand
Production method of the kind for the ultra-thin heat dissipation material inside electronic product.
The technical solution adopted by the present invention to solve the technical problems is: a kind of ultra-thin heat dissipation material for inside electronic product
Production method, it is characterised in that:
Substrate layer is made using copper foil in step 1；
Nanometer carbon printing ink is carried out mechanical stirring, is diluted using 11.1~66.7% diluents by step 2；
Conductive particle is added in the nanometer carbon printing ink stirred and makes conductive particle complete in nanometer carbon printing ink by step 3
Dispersion；
The proportion of the nanometer carbon printing ink and conductive particle is 3.3:1~10:1；
Electrical-conductive nanometer carbon printing ink is uniformly coated on after copper foil surface by three-stage baking oven using coating machine, is made by step 4
It obtains nanometer carbon printing ink and copper foil is combined with each other to form the hot composite material of electrical-conductive nanometer；
Coating rod mesh number in the coating machine is 150 mesh, and surface tension is set as 10~50mN/m；
Step 5 encloses conducting resinl in the hot composite material copper face of electrical-conductive nanometer, becomes conductive radiator nano-sized carbon copper adhesive tape, i.e., ultra-thin
Heat dissipation adhesive tape.
Further, the nanometer carbon printing ink include the nano carbon black pigment of weight ratio 5%~25%, weight ratio 0.5%~
The auxiliary agent mineral oil of 2% binder, weight ratio 0.2%~0.7%, the thermosetting modified resin of weight ratio 25%~53% and again
Measure the solvent than 10%~40%.
Further, the conductive particle includes one of bronze, copper powder, silver powder, nickel powder, aluminium powder or multiple combinations.
Further, the hot thickness of composite material of electrical-conductive nanometer is 0.010~0.015mm, the copper thickness is 0.006
~0.008mm.
Further, the temperature of the three-stage baking oven is respectively set to 90~130 DEG C, 100~180 DEG C and 100~180
DEG C, the speed of service in three-stage baking oven is 8~13m/min.
The beneficial effects of the present invention are: the ultra-thin heat dissipation material sheet resistance X-Y/Z made of this method is respectively less than to resistance
0.08Ω/inch2, carbon face is anti-oxidant, resistance to hundred lattice, anti-finger mark, anti-alcohol, wipes carbon face 60 times without obvious de- with the cloth for being stained with alcohol
Color, material thickness can reach down to 0.010mm, thermal coefficient: 2000W, while this material has good thermal diffusivity, full
Sufficient ultrathin demand.
Detailed description of the invention
Fig. 1 is ultra-thin heat dissipation material structure chart.
In the figure, it is marked as the hot composite material of 100, electrical-conductive nanometer；200, heat-conducting glue layer；300, release layer.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and detailed description.
The technical solution adopted by the present invention to solve the technical problems is: a kind of ultra-thin heat dissipation material for inside electronic product
Production method, it is characterised in that:
Substrate layer is made using copper foil in step 1；
Nanometer carbon printing ink is carried out mechanical stirring, is diluted using 11.1~66.7% diluents, the diluent by step 2
Ratio can be 11.1%, 30%, 66.7%；
Conductive particle is added in the nanometer carbon printing ink stirred and makes conductive particle complete in nanometer carbon printing ink by step 3
Dispersion；
The proportion of the nanometer carbon printing ink and conductive particle is 3.3:1~10:1, concretely 3.3:1,5:1,10:1 etc.；
Electrical-conductive nanometer carbon printing ink is uniformly coated on after copper foil surface by three-stage baking oven using coating machine, is made by step 4
It obtains nanometer carbon printing ink and copper foil is combined with each other to form the hot composite material of electrical-conductive nanometer；
Coating rod mesh number in the coating machine is 150 mesh, and surface tension is set as 10~50mN/m, concretely 10mN/m,
20mN/m, 40mN/m, 50mN/m etc., such setting can guarantee the uniformity of coating；
Step 5 encloses conducting resinl in the hot composite material copper face of electrical-conductive nanometer, becomes conductive radiator nano-sized carbon copper adhesive tape, i.e., ultra-thin
Heat dissipation adhesive tape.
On the basis of the above, the nanometer carbon printing ink includes the nanometer carbon black pigment of weight ratio 5%~25%, weight ratio 0.5%
The auxiliary agent mineral oil of~2% binder, weight ratio 0.2%~0.7%, the thermosetting modified resin of weight ratio 25%~53% and
The solvent of weight ratio 10%~40%, wherein the pigment particle size of nanometer carbon printing ink has reached nanoscale, than common carbon-loaded inks
1000 times small, so that nano-carbon layer heat dissipation effect is more preferable, above-mentioned binder can be made of various substances, such as various stemness plants
Oil.It is the main constituents of ink, plays dispersion pigment, gives ink viscosity, mobility and transfer function appropriate, with
And so that pigment is bonded to the effect of printed matter surface by film forming after printing, it is commonly called as adjusting ink, and specific embodiment is as described below:
Embodiment 1:
The nanometer carbon printing ink includes the nano carbon black pigment of weight ratio 5%, the binder of weight ratio 2%, weight ratio 0.7%
Auxiliary agent mineral oil, the thermosetting modified resin of weight ratio 53% and the solvent of weight ratio 39.3%.
Embodiment 2:
The nanometer carbon printing ink includes the nano carbon black pigment of weight ratio 10%, the binder of weight ratio 0.5%, weight ratio
0.2% auxiliary agent mineral oil, the thermosetting modified resin of weight ratio 50% and the solvent of weight ratio 39.3%.
On the basis of the above, the conductive particle includes one of bronze, copper powder, silver powder, nickel powder, aluminium powder or multiple combinations,
Conductive particle partial size can select between 2 to 5 microns according to different demands.
On the basis of the above, the hot thickness of composite material of the electrical-conductive nanometer be less than 0.010mm, the copper thickness be 0.006~
0.008mm, so that this material has thin characteristic.
On the basis of the above, the temperature of the three-stage baking oven is respectively set to 90~130 DEG C, 100~180 DEG C and 100~180
DEG C, the speed of service in three-stage baking oven is 8~13m/S, every section of average length of three-stage baking oven between 4.5-5.5,
Length is 14-16 meters altogether, concretely 90 DEG C of first segment temperature, 110 DEG C, 130 DEG C, concretely 100 DEG C of second segment temperature,
150 DEG C, 180 DEG C, concretely 100 DEG C of third section temperature, 140 DEG C, 180 DEG C, so that the combination of nanometer carbon printing ink and copper foil is more
Securely.
The ultra-thin heat dissipation material sheet resistance X-Y/Z made of this method is respectively less than 0.08 Ω/inch to resistance2, carbon face antioxygen
Change, resistance to hundred lattice, anti-finger mark, anti-alcohol wipe carbon face 60 times without obvious decoloration with the cloth for being stained with alcohol, and material thickness can be down to
0.010mm, thermal coefficient can reach: 2000W, while this material has good thermal diffusivity, meets ultrathin demand.
The following are specific experiment results
As a result: quality standard
1 > appearance: electrical-conductive nanometer carbon copper adhesive tape, a face electrical-conductive nanometer carbon-coating, a face conducting resinl
2 > quality index meets following table requirement
Example one: the hot composite material of electrical-conductive nanometer
Example two: ultra-thin heat dissipation material
Particular embodiments described above has carried out further specifically the purpose of the present invention, technical scheme and beneficial effects
It is bright, it should be understood that the above is only a specific embodiment of the present invention, it is not intended to restrict the invention, it is all at this
Within the spirit and principle of invention, any modification, equivalent substitution, improvement and etc. done should be included in protection model of the invention
Within enclosing.
Claims (5)
1. a kind of production method for the ultra-thin heat dissipation material inside electronic product, it is characterised in that:
Substrate layer is made using copper foil in step 1；
Nanometer carbon printing ink is carried out mechanical stirring, is diluted using 11.1~66.7% diluents by step 2；
Conductive particle is added in the nanometer carbon printing ink stirred and makes conductive particle complete in nanometer carbon printing ink by step 3
Dispersion；
The proportion of the nanometer carbon printing ink and conductive particle is 3.3:1~10:1；
Electrical-conductive nanometer carbon printing ink is uniformly coated on after copper foil surface by three-stage baking oven using coating machine, is made by step 4
It obtains nanometer carbon printing ink and copper foil is combined with each other to form the hot composite material of electrical-conductive nanometer；
Coating rod mesh number in the coating machine is 150 mesh, and surface tension is set as 10~50mN/m；
Step 5 encloses conducting resinl in the hot composite material copper face of electrical-conductive nanometer, becomes conductive radiator nano-sized carbon copper adhesive tape, i.e., ultra-thin
Heat dissipation adhesive tape.
2. a kind of production method for the ultra-thin heat dissipation material inside electronic product as described in claim 1, it is characterised in that:
The nanometer carbon printing ink includes the nano carbon black pigment of weight ratio 5%~25%, the binder of weight ratio 0.5%~2%, weight
Auxiliary agent mineral oil than 0.2%~0.7%, the thermosetting modified resin of weight ratio 25%~53% and weight ratio 10%~40%
Solvent.
3. a kind of production method for the ultra-thin heat dissipation material inside electronic product as described in claim 1, it is characterised in that:
The conductive particle includes one of bronze, copper powder, silver powder, nickel powder, aluminium powder or multiple combinations.
4. a kind of production method for the ultra-thin heat dissipation material inside electronic product as described in claim 1, it is characterised in that:
The hot thickness of composite material of electrical-conductive nanometer is 0.010~0.015mm, and the copper thickness is 0.006~0.008mm.
5. a kind of production method for the ultra-thin heat dissipation material inside electronic product as described in claim 1, it is characterised in that:
The temperature of the three-stage baking oven is respectively set to 90~130 DEG C, 100~180 DEG C and 100~180 DEG C, in three-stage baking oven
The speed of service be 8~13m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242526.3A CN110003812A (en) | 2019-03-28 | 2019-03-28 | A kind of production method for the ultra-thin heat dissipation material inside electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242526.3A CN110003812A (en) | 2019-03-28 | 2019-03-28 | A kind of production method for the ultra-thin heat dissipation material inside electronic product |
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| CN110003812A true CN110003812A (en) | 2019-07-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040650A (en) * | 2019-12-30 | 2020-04-21 | 太仓金煜电子材料有限公司 | Production method of ultrathin printed heat-conducting label and label |
| CN111669957A (en) * | 2020-06-15 | 2020-09-15 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
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Application publication date: 20190712 |
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