CN109233674A - A kind of conductive tape - Google Patents
A kind of conductive tape Download PDFInfo
- Publication number
- CN109233674A CN109233674A CN201710458614.8A CN201710458614A CN109233674A CN 109233674 A CN109233674 A CN 109233674A CN 201710458614 A CN201710458614 A CN 201710458614A CN 109233674 A CN109233674 A CN 109233674A
- Authority
- CN
- China
- Prior art keywords
- layer
- graphite guide
- metal conducting
- guide electric
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
Abstract
The invention discloses a kind of conductive tapes, including the release layer, basal layer, conductive layer and insulating layer set gradually, the conductive layer includes the metal conducting layer set gradually and graphite guide electric layer, the area of the graphite guide electric layer is less than or equal to the area of the metal conducting layer, is provided at least one through-hole that the partial region of the metal conducting layer is exposed in the graphite guide electric layer.The present invention is by setting metal conducting layer and graphite guide electric layer for conductive layer, greatly strengthen the electric conductivity of adhesive tape, through-hole is set in graphite guide electric layer simultaneously, so that the heat dissipation effect of metal conducting layer is obviously improved, to improve the service performance of conductive tape.
Description
Technical field
The present invention relates to field of material technology, more particularly to a kind of conductive tape.
Background technique
Currently, the structure with electronic equipment is more and more frivolous, this structure makes electronic equipment internal power density bright
Aobvious to improve, generated heat is not easy to be discharged, is easy to accumulate rapidly and form high temperature in operation.And high temperature can reduce electronic equipment
Performance, reliability and service life.On the other hand, in the prior art, the electric conductivity of conductive tape is bad, thus can shadow
Ring the service performance of electronic equipment.
Therefore, Current electronic industry proposes increasingly higher demands for conductive rubber belt material, and there is an urgent need to a kind of high
It imitates thermally conductive, light material to transfer heat away from rapidly, while also ensuring good electric conductivity, to ensure electronic equipment
It operates normally.
For this reason, it is necessary in view of the above-mentioned problems, propose a kind of conductive tape.
Summary of the invention
The purpose of the present invention is to provide a kind of conductive tapes.
To achieve the above object, the invention provides the following technical scheme:
A kind of conductive tape, including the release layer, basal layer, conductive layer and insulating layer set gradually, the conductive layer packet
The metal conducting layer set gradually and graphite guide electric layer are included, the area of the graphite guide electric layer is less than or equal to the metallic conduction
The area of layer, be provided in the graphite guide electric layer at least one the partial region of the metal conducting layer is exposed it is logical
Hole.
Preferably, the metal conducting layer is contacted with the basal layer, and the graphite guide electric layer is contacted with the insulating layer.
Preferably, the through-hole is located in the graphite guide electric layer in the projection of plane where the graphite guide electric layer.
Preferably, metal used in the metal conducting layer is copper.
Preferably, the basal layer is film resin layer.
Preferably, the film resin is one of polyethylene, polypropylene, nylon or polyethylene terephthalate.
Compared with the prior art, the advantages of the present invention are as follows: the present invention by by conductive layer be set as metal conducting layer and
Graphite guide electric layer greatly strengthens the electric conductivity of adhesive tape, while through-hole is arranged in graphite guide electric layer, so that metal conducting layer
Heat dissipation effect be obviously improved, to improve the service performance of conductive tape.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in invention, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 show the structural schematic diagram of one of specific embodiment of the invention conductive tape.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out detailed retouch
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, those of ordinary skill in the art's every other implementation obtained without making creative work
Example, shall fall within the protection scope of the present invention.
For a further understanding of the present invention, the following describes the present invention in detail with reference to examples.
In the prior art, the problem of electric conductivity difference existing for the conductive tape in electronic equipment, and electronic equipment is transported
Generated heat is not easy to be discharged in row.To solve problem of the prior art, the present invention proposes that a kind of electric conductivity is good, radiate effect
The good conductive tape of fruit, including the release layer, basal layer, conductive layer and insulating layer set gradually, the conductive layer includes successively
The metal conducting layer and graphite guide electric layer of setting, the area of the graphite guide electric layer are less than or equal to the face of the metal conducting layer
It is long-pending, at least one through-hole that the partial region of the metal conducting layer is exposed is provided in the graphite guide electric layer.
Compared with the prior art, the advantages of the present invention are as follows: the present invention by by conductive layer be set as metal conducting layer and
Graphite guide electric layer greatly strengthens the electric conductivity of adhesive tape, while through-hole is arranged in graphite guide electric layer, so that metal conducting layer
Heat dissipation effect be obviously improved, to improve the service performance of conductive tape.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of one of specific embodiment of the invention conductive tape.The conduction
Adhesive tape includes the release layer 1, basal layer 2, conductive layer and insulating layer 5 set gradually.Here, the basal layer 2 is film resin
Layer, specifically, the film resin are one of polyethylene, polypropylene, nylon or polyethylene terephthalate.
Wherein, the conductive layer includes the metal conducting layer 3 set gradually and graphite guide electric layer 4, the metal conducting layer 3
It is contacted with the basal layer 2, the graphite guide electric layer 4 is contacted with the insulating layer 5.
Further, the metal in metal conducting layer 3 is copper.Using copper as metal conducting layer, not only have good
Electric action, but also there is good heat dissipation effect.
Please continue to refer to Fig. 1, the area of the graphite guide electric layer 4 is less than or equal to the area of the metal conducting layer 3, tool
Body, if the area of the graphite guide electric layer 4 is less than or equal to the area of the metal conducting layer 3, graphite guide electric layer 4 is located at
The middle position of metal conducting layer 3.Insulating layer 5 is provided in graphite guide electric layer 4, the edge of the insulating layer 5 exceeds the stone
Black conductive layer 4, graphite guide electric layer 4 is covered.
In an embodiment of the present invention, at least one is additionally provided in the graphite guide electric layer 4 by the metal conducting layer 3
The through-hole that is exposed of partial region.Wherein, the through-hole is located at described in the projection of the 4 place plane of graphite guide electric layer
In graphite guide electric layer 4, that is, the through-hole is located in the plane of the graphite guide electric layer 4.The through-hole is round hole, rectangular opening
Or the partial region of metal conducting layer 3 can be exposed for one of slotted eye or a variety of, the through-hole.By in conduction
Through-hole is set in graphite guide electric layer in adhesive tape, the heat dissipation effect of electronic equipment is enabled to be obviously improved.
The embodiments of the present invention described shown in attached drawing and with reference to the accompanying drawings are only exemplary, and the present invention is simultaneously
It is not limited to these embodiments.Here, it should also be noted that, in order to avoid having obscured the present invention because of unnecessary details,
Illustrate only in attached drawing with closely related structure and/or processing step according to the solution of the present invention, and be omitted and this hair
The little other details of bright relationship.The above is only the specific embodiment of the application, it is noted that for the art
Those of ordinary skill for, under the premise of not departing from the application principle, several improvements and modifications can also be made, these change
Into the protection scope that also should be regarded as the application with retouching.
Claims (6)
1. a kind of conductive tape, including the release layer, basal layer, conductive layer and insulating layer set gradually, which is characterized in that described
Conductive layer includes the metal conducting layer set gradually and graphite guide electric layer, and the area of the graphite guide electric layer is less than or equal to described
The area of metal conducting layer is provided at least one partial region exposure by the metal conducting layer in the graphite guide electric layer
Through-hole out.
2. conductive tape according to claim 1, which is characterized in that the metal conducting layer is contacted with the basal layer,
The graphite guide electric layer is contacted with the insulating layer.
3. conductive tape according to claim 1, which is characterized in that the through-hole is in plane where the graphite guide electric layer
Projection be located in the graphite guide electric layer.
4. conductive tape according to claim 1, which is characterized in that metal used in the metal conducting layer is copper.
5. conductive tape according to claim 1, which is characterized in that the basal layer is film resin layer.
6. conductive tape according to claim 5, which is characterized in that the film resin is polyethylene, polypropylene, nylon
Or one of polyethylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710458614.8A CN109233674A (en) | 2017-06-16 | 2017-06-16 | A kind of conductive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710458614.8A CN109233674A (en) | 2017-06-16 | 2017-06-16 | A kind of conductive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109233674A true CN109233674A (en) | 2019-01-18 |
Family
ID=65083174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710458614.8A Withdrawn CN109233674A (en) | 2017-06-16 | 2017-06-16 | A kind of conductive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109233674A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110003812A (en) * | 2019-03-28 | 2019-07-12 | 昆山汉品电子有限公司 | A kind of production method for the ultra-thin heat dissipation material inside electronic product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103059761A (en) * | 2012-12-28 | 2013-04-24 | 斯迪克新型材料（江苏）有限公司 | High-heat conductivity coefficient graphite heat-radiation adhesive tape |
| CN204392757U (en) * | 2015-02-13 | 2015-06-10 | 品硕光电股份有限公司 | Electrographite thin slice and graphite substrate |
| WO2016033522A1 (en) * | 2014-08-29 | 2016-03-03 | Materion Corporation | Conductive bond foils |
-
2017
- 2017-06-16 CN CN201710458614.8A patent/CN109233674A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103059761A (en) * | 2012-12-28 | 2013-04-24 | 斯迪克新型材料（江苏）有限公司 | High-heat conductivity coefficient graphite heat-radiation adhesive tape |
| CN104263267A (en) * | 2012-12-28 | 2015-01-07 | 斯迪克新型材料（江苏）有限公司 | Multipurpose electric-conducting heat-conducting composite adhesive tape |
| WO2016033522A1 (en) * | 2014-08-29 | 2016-03-03 | Materion Corporation | Conductive bond foils |
| CN204392757U (en) * | 2015-02-13 | 2015-06-10 | 品硕光电股份有限公司 | Electrographite thin slice and graphite substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110003812A (en) * | 2019-03-28 | 2019-07-12 | 昆山汉品电子有限公司 | A kind of production method for the ultra-thin heat dissipation material inside electronic product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190118 |