CN109988945A - A kind of pack alloy and preparation method thereof and communication product - Google Patents
A kind of pack alloy and preparation method thereof and communication product Download PDFInfo
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- 239000000956 alloy Substances 0.000 title claims abstract description 145
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 144
- 238000004891 communication Methods 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 40
- 239000010703 silicon Substances 0.000 claims abstract description 38
- 239000011777 magnesium Substances 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 30
- 239000010936 titanium Substances 0.000 claims abstract description 30
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 28
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011572 manganese Substances 0.000 claims abstract description 27
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 27
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052742 iron Inorganic materials 0.000 claims abstract description 26
- 239000011701 zinc Substances 0.000 claims abstract description 26
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 26
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000004411 aluminium Substances 0.000 claims abstract description 24
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 24
- 239000012535 impurity Substances 0.000 claims abstract description 16
- 238000005266 casting Methods 0.000 claims description 30
- 238000004512 die casting Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 20
- 229910000765 intermetallic Inorganic materials 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 11
- 229910019752 Mg2Si Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 abstract description 25
- 230000007797 corrosion Effects 0.000 abstract description 24
- 238000000465 moulding Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 29
- 239000000463 material Substances 0.000 description 19
- 239000013078 crystal Substances 0.000 description 16
- 239000006104 solid solution Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229910016343 Al2Cu Inorganic materials 0.000 description 7
- 230000005855 radiation Effects 0.000 description 6
- 210000000515 tooth Anatomy 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910000632 Alusil Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910018619 Si-Fe Inorganic materials 0.000 description 3
- 229910008289 Si—Fe Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- -1 form a micro cell Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 241000555268 Dendroides Species 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
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- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
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- 229920001296 polysiloxane Polymers 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
- C22C21/04—Modified aluminium-silicon alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/002—Castings of light metals
- B22D21/007—Castings of light metals with low melting point, e.g. Al 659 degrees C, Mg 650 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Continuous Casting (AREA)
- Conductive Materials (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
The embodiment of the invention provides a kind of pack alloys, it is made of the component of following mass percent: silicon: 4.0%-8.0%, magnesium: 0.2%-1.0%, copper :≤0.1%, manganese :≤0.1%, zinc :≤0.1%, iron :≤1.3%, titanium :≤0.2%, inevitable impurity content≤0.15%, remaining is aluminium.The pack alloy has both high thermal conductivity, excellent formability energy, high corrosion resistance and good mechanical property, it can solve the problem of that pack alloy is difficult to take into account high thermal conductivity in the prior art and good processability leads to not meet the high heat consumption density of labyrinth, the molding of high-power communication products and radiating requirements simultaneously.The embodiment of the invention also provides the preparation method of the pack alloy and communication products.
Description
Technical field
The present invention relates to aluminum alloy materials technical fields, more particularly to a kind of pack alloy and preparation method thereof and lead to
Interrogate product.
Background technique
With the development of the 4G/5G communication technology, communication products are continued to develop towards high-power, miniaturization, lightweight, thus
Requirement to the heat-sinking capability of communication products die-casting material is higher and higher.Currently, common communication products die-casting material is mainly
Pack alloy, however the universal thermal conductivity of pack alloy is 90-150W/ (mK) in communication products industry, can not
Meets the needs of following high heat consumption density, high-power product.In addition, usually structure is complicated for communication die casting, there is large amount of complex thin
Wall radiation tooth, height boss and deep cavity configuration, and size is larger, and the radiation tooth layout of the following radiator will more crypto set it is light
It is thin, gear piece shape is more complicated, therefore the requirement to the casting fluidity of communication products die-casting material also will be higher.And current industry
Interior common aluminium silicon (Al-Si) series die-casting alloy aluminum, with the increase of silicon content, mobility can be promoted, and be arrived at nearly eutectic composition,
Mobility is best, but the thermal conductivity of alloy can reduce simultaneously, thus is difficult to combine high thermal conductivity and good processability.
Therefore, currently, develop and a kind of have both high thermal conductivity and the pack alloy of good processability has become the communications industry
Urgent need.
Summary of the invention
In consideration of it, first aspect of the embodiment of the present invention provides a kind of pack alloy, high thermal conductivity and good is had both
Processability is difficult to take into account high thermal conductivity and good processability to solve pack alloy in the prior art, leads to not same
When meet the high heat consumption density of labyrinth, the molding of high-power communication products and the problem of radiating requirements.
Specifically, first aspect of the embodiment of the present invention provides a kind of pack alloy, by the group of following mass percent
Divide and constitute:
Silicon: 4.0%-8.0%,
Magnesium: 0.2%-1.0%,
Copper :≤0.1%,
Manganese :≤0.1%,
Zinc :≤0.1%,
Iron :≤1.3%,
Titanium :≤0.2%,
The embodiment of the present invention is led by controlling the content of silicon in pack alloy in 4.0%-8.0% with improving aluminium alloy
Heating rate, and guarantee the processability of aluminium alloy, while the content by rationally controlling the elements such as magnesium enables aluminium alloy to have one
Fixed mechanical property and corrosion resistance, and the content for making the other elements in aluminium alloy in addition to aluminum total is lower, to protect
The heating conduction of card aluminium alloy is in higher level.
Inevitable impurity content≤0.15%, remaining is aluminium.
In first aspect present invention, the mass percent of the silicon is 5.5%-6.5%.
In first aspect present invention, the mass percent of the silicon is 5.8%-6.3%.
In first aspect present invention, the mass percent of the silicon is 5.7%.
In first aspect present invention, the mass percent of the silicon is 4.3%-5.0%.
In first aspect present invention, the mass percent of the silicon is 4.4%-4.8%.
In first aspect present invention, the mass percent of the silicon is 6.5%-7.5%.
In first aspect present invention, the mass percent of the magnesium is 0.3%-0.8%.
In first aspect present invention, the mass percent of the magnesium is 0.4%-0.7%.
In first aspect present invention, the mass percent of the magnesium is 0.5%-0.6%.
In first aspect present invention, the mass percent of the copper is 0.001%-0.05%.
In first aspect present invention, the mass percent of the copper is 0.01%-0.03%.
In first aspect present invention, the mass percent of the manganese is 0.001%-0.006%.
In first aspect present invention, the mass percent of the manganese is 0.002%-0.004%.
In first aspect present invention, the mass percent of the zinc is 0.001%-0.02%.
In first aspect present invention, the mass percent of the zinc is 0.001%-0.008%.
In first aspect present invention, the mass percent of the iron is 0.3%-1.0%.
In first aspect present invention, the mass percent of the iron is 0.5%-0.7%.
In first aspect present invention, the mass percent of the titanium is 0.001%-0.06%.
In first aspect present invention, the mass percent of the titanium is 0.01%-0.03%.
In pack alloy of the present invention, the gross mass percentage of the other elements except aluminium is less than 10%.
In pack alloy of the present invention, the gross mass percentage of the other elements except aluminium is 5.0%-8.0%.
Inside the institutional framework of the pack alloy mutually includes hypoeutectic α-Al phase, eutectic α-Al phase, common reciever
And intermetallic compound, the intermetallic compound are distributed in grain boundary sites or are precipitated in the hypoeutectic α-Al phase and described total
In brilliant α-Al phase, the intermetallic compound includes Mg2Si phase.When pack alloy component composition in further include Fe element, Cu
When element, the intermetallic compound further includes Al3Fe phase, Al2Cu phase and Al-Si-Fe ternary compound phase.
The thermal coefficient of pack alloy of the present invention is 170W/ (mK) -195W/ (mK).
The Brinell hardness of pack alloy of the present invention be 60HBW-80HBW, tensile strength 170MPa-220MPa,
Yield strength >=100MPa, elongation percentage >=2%.
The pack alloy that first aspect of the embodiment of the present invention provides, has both high thermal conductivity and excellent formability energy, together
When there is high corrosion resistance and good mechanical property, and it is at low cost, the molding and heat dissipation of labyrinth communication products can be met
Demand.
Second aspect of the embodiment of the present invention provides a kind of preparation method of pack alloy, comprising the following steps:
Constituted according to the component of pack alloy and raw material be provided, after casting and forming, at 180 DEG C -375 DEG C arbitrary temp into
Row heat treatment, obtains pack alloy, the pack alloy is made of the component of following mass percent: silicon: 4.0%-
8.0%, magnesium: 0.2%-1.0%, copper :≤0.1%, manganese :≤0.1%, zinc :≤0.1%, iron :≤1.3%, titanium :≤0.2%,
Inevitable impurity content≤0.15%, remaining is aluminium.
Above-mentioned heat treatment process can be constant temperature, be also possible to non-constant temperature.In some implementations, can 180 DEG C-
Some temperature is chosen in 375 DEG C to be heat-treated;In other implementations, multiple temperature can be chosen in 180 DEG C -375 DEG C
Spend the heat treatment temperature respectively as multiple heat treatment stages.
In preparation method of the present invention, the casting and forming is using liquid die casting, semisolid pressure casting, evacuated die-casting process, fusible pattern casting
It makes, the mode of gravitational casting or extrusion casint carries out.
In preparation method of the present invention, the time of the heat treatment is 0.2h-8h.
The preparation method that second aspect of the present invention provides, simple process, the pack alloy being prepared have both high thermal conductivity
Performance, excellent formability energy, while there is high corrosion resistance and excellent mechanical performances.
The third aspect of the embodiment of the present invention provides a kind of communication product, including shell and to be located at the shell intracorporal
Power supply circuit and functional circuit, the power supply circuit are functional circuit power supply, and the shell is using the embodiment of the present invention the
On the one hand the pack alloy provided is cast.
The communication product that the third aspect of the embodiment of the present invention provides has both high thermal conductivity, excellent formability energy, high anti-corrosion
Performance and certain mechanical properties can meet high density high powe design demand.
Specific embodiment
Below in conjunction with certain specific embodiments of the invention, the embodiment of the present invention is illustrated.
As communication products are continued to develop towards high-power, miniaturization, lightweight, industry is to communication products die-casting material
Heat-sinking capability proposes increasingly higher demands.Currently, common communication products die-casting material is mainly pack alloy, however
The universal thermal conductivity of pack alloy is 90-150W/ (mK) in communication products industry, and it is close to can no longer meet the following high heat consumption
The demand of degree, high-power product.In addition, usually structure is complicated for communication die casting, there are large amount of complex thin-walled radiation tooth, height boss
With deep cavity configuration, and size is larger, and the radiation tooth layout of the following radiator will more crypto set be frivolous, gear piece shape is more complicated,
It therefore also will be higher to the casting fluidity requirement of communication products die-casting material.And common Al-Si system die casting in industry at present
Aluminium alloy, with the increase of silicon content, mobility can be promoted, and be arrived at nearly eutectic composition, mobility is best, but the heat of alloy simultaneously
Conductance can reduce, thus be difficult to combine high thermal conductivity and good processability.In consideration of it, current, develop one kind and have both height and lead
The pack alloy of hot and good processability has become the urgent need of the communications industry.Further, since the use of communication products
Environment multiplicity, many places are in relatively rugged environment, such as seawater, acid rain atmosphere, high/low temperature alternation environment, while to guarantee communication products
It is non-maintaining, therefore it is required that pack alloy is provided simultaneously with higher corrosion resistance and mechanical property.
Specifically, the embodiment of the invention provides a kind of pack alloys, have both high thermal conductivity and excellent formability energy,
The pack alloy is made of the component of following mass percent:
Silicon: 4.0%-8.0%,
Magnesium: 0.2%-1.0%,
Copper :≤0.1%,
Manganese :≤0.1%,
Zinc :≤0.1%,
Iron :≤1.3%,
Titanium :≤0.2%,
Inevitable impurity content≤0.15%, remaining is aluminium.
High thermal conductivity cast aluminium alloy gold provided in an embodiment of the present invention, component are to comprehensively consider each chemical element to alloy
The contribution of integrated performance index (including thermal conductivity, mobility, corrosion resistance, hardness, intensity etc.) and determination, by above-mentioned specific
The synergy of each element of content, balanced various performances, forms stable crystal structure, to obtain comprehensive performance
Excellent pack alloy.
Inside the institutional framework of the pack alloy of the embodiment of the present invention mutually includes hypoeutectic α-Al phase, eutectic α-
Al phase, common reciever and intermetallic compound, the intermetallic compound are distributed in grain boundary sites or are precipitated in the α-Al phase
It is interior.Wherein, the phase refers to the uniformly continuous component part with same chemical component, same atom coherent condition and property,
There is interface to separate between different phases.The intermetallic compound refers to the compound that metal and metal, metal and metalloid are formed,
Specifically, in the crystal structure of pack alloy of the present invention, the intermetallic compound mainly includes Mg2Si phase, works as die casting aluminium
When further including Fe element, Cu element in alloy compositions composition, the intermetallic compound further includes Al3Fe phase, Al2Cu phase and Al-
Si-Fe ternary compound is equal.The iron, copper, magnesium, manganese, zinc, titanium are partially solid-solubilized in the hypoeutectic α-Al with atomic form
Mutually and inside the eutectic α-Al phase.The Al2Cu phase and Mg2Si phase disperse is uniformly distributed.
The addition of silicon (Si) element can promote the casting fluidity of Al-Si alloy, and wherein Si and Al forms (α-Al+
Si) eutectic phase is the main reason for improving alusil alloy casting fluidity.But with the increase of Si content, the thermal conductivity of alloy
Rate can reduce, and the thermal conductivity of such as Japan grade aluminium alloy ADC12 (silicone content 9.6%-12%) only has 95W/ (mK).This be by
Mainly exist in a large amount of Si in Al-Si alloy with primary silicon, eutectic Si or the form being solid-solution in Al matrix, so that alloy
Thermal conductivity substantially reduces.Therefore, higher thermal conductivity is obtained, Si needs to control in lower content.Comprehensively consider mobility
And thermal conductivity, the embodiment of the present invention control the mass percent of silicon in 4.0%-8.0%.Further, the present invention one is implemented
In mode, it is further 5.8%-6.3% or 5.7% that it is 5.5%-6.5% that the mass percent of the silicon, which specifically controls,
Or 6.0%.In another embodiment of the present invention, it is 4.3%-5.0% that the mass percent of the silicon, which specifically controls, further
Ground is 4.4%-4.8% or 4.5% or 4.7%.In other embodiments of the present invention, the mass percent of silicon be can also be
6.5%-7.5% is further 7.0%.
Magnesium (Mg) element is the main intensified element in alusil alloy, forms Mg with Si2Si phase, disperse are evenly distributed on conjunction
In the institutional framework of gold, play a part of dispersion-strengtherning.Dispersion-strengtherning, which refers to, mixes material obtained for heterogeneous structure
Expect strengthening effect, the essence of dispersion-strengtherning is that the movement of dislocation is hindered using the ultrafine dust of disperse, to improve material in height
Mechanical property under temperature.In the case where guaranteeing that the weight ratio of Mg and Si meets Mg/Si < 1.73, Mg constituent content is higher, closes
The mechanical property of gold is better;But Mg element is excessive, crystal grain quantity increases, so that the crystal boundary of crystal grain increases, and crystal boundary is structure
It is identical and be orientated the interface between different crystal grain, i.e. contact interface between crystal grain and crystal grain, on crystal boundary face, atomic arrangement from
One orientation is transitioned into another orientation, and grain boundaries atomic arrangement is in an interim state, so that thermally conductive pathways can lose in grain boundaries
Continuity is gone, the thermal conductivity of material is eventually reduced.Therefore, comprehensively consider mechanical property and thermal conductivity, embodiment of the present invention
In, the mass percent of Mg element is controlled in 0.2%-1.0%.Further, in embodiment of the present invention, the matter of the magnesium
Amount percentage is 0.3%-0.8%;It is further 0.4%-0.7%, 0.5%-0.6%.
Copper (Cu) element is also main intensified element in alusil alloy, forms Al with Al2Cu phase, disperse are evenly distributed on
In the institutional framework of alloy, play the role of dispersion-strengtherning.Since the copper pairing fitting of solid solution has the cathodic process of height, enter
Copper ion in liquid corrosive medium solution can be plated in aluminum alloy surface with the fine particle state of metallic copper again, be formed
Low-alloyed corrosion resistance, drops in the even greater corrosion galvanic couple of activity, specifically, has different potentials in the copper and alloy of solid solution
Metal in the presence of corrosive medium solution, form a micro cell, copper serves as cathode, and the more negative metal of other current potentials serves as
Anode, in cell reaction, the copper ion in corrosive medium solution is reduced into metallic copper and is deposited on aluminum alloy surface, further speeds up
Electrochemical corrosion.Therefore, in order to obtain superior corrosion resisting property, need to control the content of copper to control the content of copper in solid solution, with
Galvanic corrosion is reduced, in embodiment of the present invention, the mass percent of Cu element is controlled≤0.1%.Further, this hair
In a bright embodiment, the mass percent of the copper is 0.001%-0.05%, further, the quality percentage of the copper
Than for 0.003%-0.005%, 0.008%-0.01% or 0.01%-0.03%, 0.02%-0.05%, 0.03%-
0.04%.In another embodiment of the present invention, the mass percent of the copper is 0.07%-0.1%, further for
0.08%-0.09%.
Iron (Fe) element will form acicular brittlement phase in pack alloy, its presence can isolate matrix, be easy
Stress is generated around it to concentrate, and so that alloy is generated fatigue crack or static load fracture occurs, to drop low-alloyed mechanical property.Cause
This Fe content has certain limitation.But Fe content is too low, the risk of sticking to mould when will increase casting, and Fe element is to leading
Heat affecting is relatively small, therefore after comprehensively considering, and the embodiment of the present invention controls the mass percent of Fe element≤1.3%.
In embodiment of the present invention, the mass percent of the iron is 0.3%-1.0%, further for 0.5%-0.7% or
0.7%-0.9% or 0.8%-1.0%.In embodiment of the present invention, the mass percent of the iron can also be 0.2%-
0.4% or 0.25%-0.45%, 1.1%-1.2%.
The addition of manganese (Mn) element can promote the mechanical property and corrosion resistance of alusil alloy.But Mn is simultaneously to warm
Conductance is affected, and can drop low-alloyed heating conduction.Therefore the content range of Mn element specifically can containing according to Fe element
Depending on amount, specifically control in the embodiment of the present invention≤0.1%.In an embodiment of the present invention, the mass percent of the manganese
It is further 0.002%-0.003% for 0.001%-0.006%.In other embodiments of the present invention, the quality hundred of manganese
Ratio is divided to can also be 0.004%-0.005%, 0.008%-0.01%, 0.12%-0.05%, 0.04%-0.06%,
0.07%-0.08%.
Titanium (Ti) element preferentially reacts to form Al with Al in aluminium alloy casting process3Ti grain refiner can make α-Al
Crystal grain is changed into the equiax crystal of fine uniform from coarse dendroid, improves the intensity and plasticity of aluminium alloy, but can reduce simultaneously
The heating conduction of material.Al3Ti grain refiner has excellent thinning effect, improves surface quality of continuous castings, obtains casting carefully
The hair crystalline substance and column crystal that small equiax crystal, especially reduction casting cold shut eliminate, can improve casting efficiently against casting crack
Part appearance.Equiax crystal, that is, crystal grain size in all directions differs lesser crystal grain.Therefore, thermal conductivity and power in comprehensive actual production
Considering for performance is learned, the embodiment of the present invention controls the mass percent of titanium≤0.2%.Further, the present invention one is implemented
In mode, the mass percent of the titanium is 0.001%-0.06%, further for 0.001%-0.003% or
0.01%-0.03%, 0.004%-0.005%, 0.008%-0.01%, 0.12%-0.05%, 0.04%-0.06%.This hair
In bright another embodiment, the mass percent of the titanium is greater than zero less than 0.001%.In other embodiments of the present invention,
The mass percent of titanium can also be 0.07%-0.08% or 0.1%-0.15%.
In an embodiment of the present invention, the mass percent of the zinc is specially 0.001%-0.02%, further
For 0.001%-0.008%.In another embodiment of the present invention, the mass percent of the zinc is greater than zero and is less than or equal to
0.001%.In other embodiments of the present invention, the mass percent of zinc can also be 0.03%-0.06%, 0.07%-
0.08% or 0.09%-0.1%.
In embodiment of the present invention, since the increase of impurity element can reduce the thermal conductivity of material, so the present invention is implemented
Example controls the content of inevitable impurity element≤0.15%.
In the embodiment of the invention, the pack alloy is made of the component of following mass percent: silicon:
5.8%-6.3%, magnesium: 0.3%-0.4%, copper: < 0.1%, manganese: < 0.08%, zinc: < 0.02%, iron: 0.2%-
0.68%, titanium: < 0.02%, inevitable impurity content≤0.15%, remaining is aluminium.
In another specific embodiment of the present invention, the pack alloy is made of the component of following mass percent: silicon:
5.7%, magnesium: 0.33%, copper: 0.1%, manganese: 0.001%, zinc: < 0.001%, iron: 0.58%, titanium: < 0.001%, it can not
Impurity content≤0.15% is avoided, remaining is aluminium.
The ordered arrangement of material lattice can all be reduced since various elements being added in pure metallic aluminum, cause distortion of lattice,
Electron period limitation of movement, so that the thermal conductivity of material is reduced, therefore in order to obtain higher heating conduction, the present invention
In embodiment, in the pack alloy, the control of the gross mass percentage of the other elements except aluminium is less than 10%, into one
The control of step ground is in 5.0%-8.0%, 5.5%-7.5%, 6.0%-6.5%.
In embodiment of the present invention, under the comprehensive function of element-specific certain content, the pack alloy it is thermally conductive
Coefficient reaches 170W/ (mK) -195W/ (mK), Brinell hardness 60HBW-80HBW, tensile strength 170MPa-
220MPa, yield strength >=100MPa, elongation percentage >=2%.
Wherein, tensile strength is the critical value that metal is plastically deformed transition by uniformly shaped plastic property deflecting concentration of local, and
Maximum load-carrying capacity of the metal under quiet stretching condition.Tensile strength is to characterize the drag of material maximum uniform plastic deformation, is drawn
Sample is stretched before bearing maximum tension stress, deformation is uniform, but after exceeding, metal starts necking occur,
It generates and concentrates deformation.Yield strength is yield limit when yield phenomenon occurs for metal material, that is, resists micro plasticity
The stress of deformation.The metal material occurred for no remarkable yield phenomenon with generating the stress value of 0.2% residual deformation, it is specified that made
For its yield limit, referred to as proof stress or yield strength.Elongation percentage refers to the index of description material plasticity performance, is
The percentage of the ratio between total deformation Δ L of gauge length section and former gauge length L after sample tension failure.
Pack alloy provided in an embodiment of the present invention, have both high thermal conductivity, excellent formability energy, high corrosion resistance and
Certain mechanical property, be applicable to harsh outdoor environment, it can be achieved that complexity, thin-section casting (such as radiator) molding, it is full
Sufficient high density high powe design demand is particularly applicable to mobile phone, laptop, communication apparatus industry, automobile, residential hardware
Equal fields.More specifically, the embodiment of the invention provides a kind of communication product, including shell and to be located at the shell intracorporal
Power supply circuit and functional circuit, the power supply circuit are functional circuit power supply, and the shell is mentioned using the embodiment of the present invention
The pack alloy of confession is cast.The communication product can be radiator.Certainly in communication product, other available aluminium are closed
The pack alloy that the embodiment of the present invention can also be used in the component of golden product is cast, and such as handle, maintenance chamber lid, slideway, is turned
Axis, supporting element etc..
Correspondingly, the embodiment of the invention also provides a kind of preparation methods of pack alloy, comprising the following steps:
S10, offer raw material is constituted according to the component of pack alloy, using liquid die casting, semisolid pressure casting, vacuum pressure
Casting, model casting, the mode of gravitational casting or extrusion casint are cast;
S20, casting and forming and after cooling down, are heat-treated at 180 DEG C -375 DEG C, obtain pack alloy, described
Pack alloy is made of the component of following mass percent: silicon: 4.0%-8.0%, magnesium: 0.2%-1.0%, copper :≤
0.1%, manganese :≤0.1%, zinc :≤0.1%, iron :≤1.3%, titanium :≤0.2%, inevitable impurity content≤0.15%,
Remaining is aluminium.
In the present invention, in step S10, the liquid die casting, semisolid pressure casting, evacuated die-casting process, model casting, gravity casting
Make, the mode of extrusion casint is existing common process, the present invention does not make special limit to raw material needed for each technique and technological parameter
It is fixed, it is set according to selection is required and be actually needed in industry.
In the present invention, in step S20, further, the temperature of the heat treatment is 200 DEG C -300 DEG C, 240 DEG C -280
℃.The heat treatment process can be constant temperature, be also possible to non-constant temperature.Optionally, the time of the heat treatment is 0.2h-8h,
Further, the time of heat treatment is 1h-5h, 2h-6h.Heat treatment in the present invention can reinforced alloys, can not only mention
The mechanical property (intensity, hardness, elongation percentage etc.) of high alloy, while physical property (including the density, conductance of casting can be improved
Rate and thermal conductivity) and chemical property (including solid solution bulk potential).For alloying element, in the form of solid solution exist than
The form that intermetallic compound is formed in conjunction with other elements more easily leads to the reduction of alloy conductivity and thermal conductivity, so for
Production high heat-conductivity conducting component is with greater need for being heat-treated.It, can be with after 180 DEG C -375 DEG C of Low Temperature Heat Treatment of the present invention
Low-alloyed point defect, such as vacancy, solid solution atom drop.Specifically, under lower heat treatment temperature of the invention, vacancy can
To be transferred to alloy surface evolution from material internal, low-alloyed distortion of lattice is dropped, the thermal conductivity of alloy is greatly improved, without dropping
Low-alloyed mechanical property;Dispersion strengthening phase (such as Mg simultaneously2Si、Al2Cu it) is precipitated from solid solution, reduces containing for solid solution atom
Amount, optimizes the intensity of alloy and conductivity all.In pack alloy of the present invention, Mg the and Cu element overwhelming majority is with disperse
Hardening constituent Mg2Si、Al2The form of Cu is precipitated, and only minute quantity is present in inside α-Al phase in the form of being dissolved atom.
That inside the institutional framework for the pack alloy that the embodiment of the present invention is prepared mutually includes hypoeutectic α-Al
Phase, eutectic α-Al phase, common reciever and intermetallic compound, the intermetallic compound are distributed in grain boundary sites or are precipitated in institute
It states in α-Al phase.The intermetallic compound mainly includes Al3Fe phase, Al2Cu phase, Mg2Si phase, Al-Si-Fe ternary compound
It is equal.The iron, copper, magnesium, manganese, zinc, titanium are partially solid-solubilized in the hypoeutectic α-Al phase and eutectic α-Al phase with atomic form
Portion.The Al2Cu phase and Mg2Si phase disperse is uniformly distributed.
In an embodiment of the present invention, it is 5.5%-6.5% that the mass percent of the silicon, which specifically controls, further
For 4.3%-4.8% or 4.4%-5.0%.In other embodiments of the present invention, the mass percent of silicon be can also be
4.5%-5.0%, 6.0%-7.0% or 6.5%-7.5%.
In embodiment of the present invention, the mass percent of the magnesium is 0.3%-0.7%;It is further 0.4%-
0.5%, 0.6%-0.8%.
In an embodiment of the present invention, the mass percent of the copper is 0.001%-0.05%.Another implementation of the present invention
In mode, the mass percent of the copper is 0.08%-0.1%.In other embodiments, the mass percent of copper can be with
It is 0.003%-0.005%, 0.008%-0.01%, 0.02%-0.05%, 0.04%-0.06%.
In embodiment of the present invention, it is further 0.5%- that the mass percent of the iron, which is 0.3%-1.0%,
0.7%.In embodiment of the present invention, the mass percent of the iron can also be 0.25%-0.45%, 0.7%-0.9%,
1.1%-1.2%, 0.8%-1.0%.
In an embodiment of the present invention, the mass percent of the manganese is 0.001%-0.006%, further for
0.002%-0.003%.In other embodiments of the present invention, the mass percent of manganese can also be 0.004%-0.005%,
0.008%-0.01%, 0.12%-0.05%, 0.04%-0.06%, 0.07%-0.08%.
In an embodiment of the present invention, the mass percent of the titanium is 0.001%-0.003%.Another implementation of the present invention
In mode, the mass percent of the titanium is greater than zero less than 0.001%.
In an embodiment of the present invention, the mass percent of the zinc is specially 0.001%-0.008%.
In another embodiment of the present invention, the mass percent of the zinc is greater than zero and is less than or equal to 0.001%.
In the embodiment of the invention, the pack alloy is made of the component of following mass percent: silicon:
5.8%-6.3%, magnesium: 0.3%-0.4%, copper: < 0.1%, manganese: < 0.08%, zinc: < 0.02%, iron: 0.2%-
0.68%, titanium: < 0.02%, inevitable impurity content≤0.15%, remaining is aluminium.
In another specific embodiment of the present invention, the pack alloy is made of the component of following mass percent: silicon:
5.7%, magnesium: 0.33%, copper: 0.1%, manganese: 0.001%, zinc: < 0.001%, iron: 0.58%, titanium: < 0.001%, it can not
Impurity content≤0.15% is avoided, remaining is aluminium.
The preparation method of pack alloy provided in an embodiment of the present invention, simple process, the pack alloy being prepared,
Have both high thermal conductivity, excellent formability energy, high corrosion resistance and excellent mechanical performances.
Divide multiple embodiments that the embodiment of the present invention is further detailed below.
Embodiment 1
A kind of pack alloy is made of the component of following mass percent: silicon: 5.8%-6.3%, magnesium: 0.3%-
0.4%, copper: < 0.1%, manganese: < 0.08%, zinc: < 0.02%, iron: 0.2-0.68%, titanium: < 0.02% is inevitable miscellaneous
Matter content≤0.15%, remaining is aluminium.
By the pack alloy of the present embodiment component be cast into a complex thin-wall communication shell, preparation method, including with
Lower step:
It is constituted according to the component of above-mentioned pack alloy, by fine aluminium A00 aluminium ingot (purity 99.7%), pure magnesium ingot, AlSi26
The smelting, semi-solid slurrying, semisolid pressure casting molding as raw material such as intermediate alloy, AlFe20 intermediate alloy, after cooling, then
It is heat-treated 0.2-8 hours at 180 DEG C -375 DEG C, obtains thin-walled communication shell.
Embodiment 2
A kind of pack alloy is made of the component of following mass percent: silicon: 5.7%, magnesium: and 0.33%, copper:
0.1%, manganese: 0.001%, zinc: < 0.001%, iron: 0.58%, titanium: < 0.001%, inevitable impurity content≤
0.15%, remaining is aluminium.
The pack alloy of the present embodiment component is cast into complex thin-wall communication shell in the way of the embodiment of the present invention 1
Body.
Embodiment 3
A kind of pack alloy is made of the component of following mass percent: silicon: 4.7%, magnesium: and 0.33%, copper: <
0.1%, manganese: < 0.05%, zinc: < 0.01%, iron: 0.58%, titanium: < 0.1%, inevitable impurity content≤0.15%,
Remaining is aluminium.
The pack alloy of the present embodiment component is cast into complex thin-wall communication shell in the way of the embodiment of the present invention 1
Body.
Embodiment 4
A kind of pack alloy is made of the component of following mass percent: silicon: 4.5%, magnesium: and 0.46%, copper: <
0.1%, manganese: < 0.1%, zinc: < 0.001%, iron: 0.4%-0.58%, inevitable impurity content≤0.15%, remaining is
Aluminium.
The pack alloy of the present embodiment component is cast into complex thin-wall communication shell in the way of the embodiment of the present invention 1
Body.
Effect example
To provide powerful support for technical solution bring beneficial effect of the embodiment of the present invention, following properties of product are provided
Test:
By the thermal conductivity of the pack alloy of 1-4 of the embodiment of the present invention and ADC12 alloy, processability, mechanical property (packet
Include hardness, tensile strength, yield strength, elongation percentage) test is compared, as a result as follows:
1, thermal conductivity
By the carry out thermal conductivity test of the pack alloy of 1-4 of the embodiment of the present invention and ADC12 alloy, thermal conductivity test is adopted
It is tested with laser flash method (ASTM E 1461-01), sample is having a size of Φ 12.7mm × (2-4) mm;Specific heat is referring to ISO
11357 and ASTM E1269;Density is referring to ISO 1183-1:2004, and the results are shown in Table 1 for the thermal conductivity of each alloy.
The thermal conductivity of each alloy of table 1 compares
Alloy designations | Thermal conductivity (w/mk) |
ADC12 | 95 |
Embodiment 1 | 185 |
Embodiment 2 | 190 |
Embodiment 3 | 182 |
Embodiment 4 | 180 |
It can know from 1 result of table, the pack alloy of the embodiment of the present invention has superior compared to ADC12 aluminium alloy
Heating conduction can meet high heat consumption density, the radiating requirements of high-power communication products of labyrinth.
2, processability
By three kinds of embodiment of the present invention 1, the alloy of embodiment 2 and ADC12 alloy alloys, die casting obtains complex thin-wall respectively
Communicate shell.When the processability of alloy is bad, thin-walled radiation tooth, which is easy to appear, lacks material defect.It is continuous now to count every kind of alloy
30 die castings are produced, the three-dimensional full-size of material feature is lacked each of on 25 radiation tooths, statistical result is as shown in table 2.
Three-dimensional full-size (R) point three classes are described: 0.5mm≤R≤1.0mm;1.0mm < R≤3mm;R > 3mm.
The scarce material characteristic statistics of 2 different-alloy die casting of table
3, corrosion resistance
The pack alloy of 1-4 of the embodiment of the present invention is subjected to corrosion resistance test, compares the corrosion resistance of itself and existing alloy
Difference, the results are shown in Table 3.The corrosion resisting property of alloy is indicated with corrosion rate, and the test method of corrosion rate defers to standard
GB/T19292.4 and standard GB/T 16545, specimen size are 120 × 100 × 5mm.For the influence for eliminating edge effect, corrosion
The edge of rate test sample adhesive tape bound edge.After neutral salt spray tests 1440h, pass through the variation of weight before and after salt fog
Calculate average corrosion rate.
The comparison between corrosion of each alloy of table 3
Alloy designations | Corrosion rate (mg/ (dm2*d)) |
ADC12 | 34.0 |
Embodiment 1 | 4.5 |
Embodiment 2 | 4.3 |
Embodiment 3 | 5.0 |
Embodiment 4 | 4.6 |
4, mechanical property
The difference die casting of the embodiment of the present invention 1, the alloy of embodiment 2 and ADC12 alloy is obtained into complex thin-wall and communicates shell
Product cuts standard tensile mechanics test piece according to the requirement of GB/T 228 from product, mechanical property is tested on cupping machine
Can, the results are shown in Table 4.
The mechanical property of each alloy of table 4
Alloy designations | Tensile strength (MPa) | Yield strength (MPa) | Elongation percentage (%) | Hardness (HBW) |
ADC12 | 260 | ≥100 | 0.7 | 92 |
Embodiment 1 | 210 | 136 | 4.6 | 79 |
Embodiment 2 | 199 | 132 | 4.0 | 70 |
It can be seen from the above, pack alloy obtained by the embodiment of the present invention, has both high thermal conductivity and excellent formability energy, together
When there is high corrosion resistance and good mechanical property, solve in the prior art that pack alloy heating conduction is bad, can not
The problem of meeting high heat consumption density, high-power communication products radiating requirements, therefore, it is possible to prevente effectively from there is die casting yields
Low, product fever is serious to burn machine, corrodes in the harsh environment such as coastal, mechanical property deficiency cause assembly difficulty or
The problems such as serious is deformed under the conditions of wind load.
Claims (29)
1. a kind of pack alloy, which is characterized in that be made of the component of following mass percent:
Silicon: 4.0%-8.0%,
Magnesium: 0.2%-1.0%,
Copper :≤0.1%,
Manganese :≤0.1%,
Zinc :≤0.1%,
Iron :≤1.3%,
Titanium :≤0.2%,
Inevitable impurity content≤0.15%, remaining is aluminium.
2. pack alloy as described in claim 1, which is characterized in that the mass percent of the silicon is 5.5%-6.5%.
3. pack alloy as claimed in claim 2, which is characterized in that the mass percent of the silicon is 5.8%-6.3%.
4. pack alloy as claimed in claim 2, which is characterized in that the mass percent of the silicon is 5.7%.
5. pack alloy as described in claim 1, which is characterized in that the mass percent of the silicon is 4.3%-5.0%.
6. pack alloy as claimed in claim 5, which is characterized in that the mass percent of the silicon is 4.4%-4.8%.
7. pack alloy as described in claim 1, which is characterized in that the mass percent of the silicon is 6.5%-7.5%.
8. such as the described in any item pack alloys of claim 1-7, which is characterized in that the mass percent of the magnesium is
0.3%-0.8%.
9. pack alloy as claimed in claim 8, which is characterized in that the mass percent of the magnesium is 0.4%-0.7%.
10. pack alloy as claimed in claim 9, which is characterized in that the mass percent of the magnesium is 0.5%-
0.6%.
11. such as the described in any item pack alloys of claim 1-10, which is characterized in that the mass percent of the copper is
0.001%-0.05%.
12. pack alloy as claimed in claim 11, which is characterized in that the mass percent of the copper is 0.01%-
0.03%.
13. such as the described in any item pack alloys of claim 1-12, which is characterized in that the mass percent of the manganese is
0.001%-0.006%.
14. pack alloy as claimed in claim 13, which is characterized in that the mass percent of the manganese is 0.002%-
0.004%.
15. such as the described in any item pack alloys of claim 1-14, which is characterized in that the mass percent of the zinc is
0.001%-0.02%.
16. pack alloy as claimed in claim 15, which is characterized in that the mass percent of the zinc is 0.001%-
0.008%.
17. such as the described in any item pack alloys of claim 1-16, which is characterized in that the mass percent of the iron is
0.3%-1.0%.
18. pack alloy as claimed in claim 9, which is characterized in that the mass percent of the iron is 0.5%-
0.7%.
19. such as the described in any item pack alloys of claim 1-18, which is characterized in that the mass percent of the titanium is
0.001%-0.06%.
20. pack alloy as claimed in claim 19, which is characterized in that the mass percent of the titanium is 0.01%-
0.03%.
21. such as the described in any item pack alloys of claim 1-20, which is characterized in that in the pack alloy, aluminium it
The gross mass percentage of outer other elements is less than 10%.
22. pack alloy as claimed in claim 21, which is characterized in that in the pack alloy, other except aluminium
The gross mass percentage of element is 5.0%-8.0%.
23. pack alloy as described in claim 1, which is characterized in that inside the institutional framework of the pack alloy
It mutually include that hypoeutectic α-Al phase, eutectic α-Al phase, common reciever and intermetallic compound, the intermetallic compound are distributed in crystalline substance
Boundary position is precipitated in the hypoeutectic α-Al phase and the eutectic α-Al phase, and the intermetallic compound includes Mg2Si phase.
24. such as the described in any item pack alloys of claim 1-23, which is characterized in that the thermally conductive system of the pack alloy
Number is 170W/ (mK) -195W/ (mK).
25. such as the described in any item pack alloys of claim 1-24, which is characterized in that the Bu Shi of the pack alloy is hard
Degree is 60HBW-80HBW, tensile strength 170MPa-220MPa, yield strength >=100MPa, elongation percentage >=2%.
26. a kind of preparation method of pack alloy, which comprises the following steps:
It is constituted according to the component of pack alloy and raw material is provided, after casting and forming, arbitrary temp carries out heat at 180 DEG C -375 DEG C
Processing, obtains pack alloy, the pack alloy is made of the component of following mass percent: silicon: 4.0%-8.0%,
Magnesium: 0.2%-1.0%, copper :≤0.1%, manganese :≤0.1%, zinc :≤0.1%, iron :≤1.3%, titanium :≤0.2%, it can not keep away
Exempt from impurity content≤0.15%, remaining is aluminium.
27. preparation method as claimed in claim 26, which is characterized in that the casting and forming uses liquid die casting, semisolid
Die casting, evacuated die-casting process, model casting, the mode of gravitational casting or extrusion casint carry out.
28. preparation method as claimed in claim 26, which is characterized in that the time of the heat treatment is 0.2h-8h.
29. a kind of communication product, including shell and it is located at the intracorporal power supply circuit of the shell and functional circuit, the power supply
Circuit is functional circuit power supply, which is characterized in that the shell uses such as the described in any item die casting of claim 1-25
Aluminium alloy is cast.
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EP18248147.3A EP3505649B1 (en) | 2017-12-29 | 2018-12-28 | Die casting aluminum alloy, production method of die casting aluminum alloy, and communications product |
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CN114606417A (en) * | 2020-12-04 | 2022-06-10 | 比亚迪股份有限公司 | Al-Si series die-casting aluminum alloy material, preparation method thereof and heat radiating element |
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EP3505649A1 (en) | 2019-07-03 |
US20190203324A1 (en) | 2019-07-04 |
EP3505649B1 (en) | 2021-12-08 |
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