CN109981847A - Electronic equipment, glass cover-plate and its manufacturing method - Google Patents
Electronic equipment, glass cover-plate and its manufacturing method Download PDFInfo
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- CN109981847A CN109981847A CN201910231348.4A CN201910231348A CN109981847A CN 109981847 A CN109981847 A CN 109981847A CN 201910231348 A CN201910231348 A CN 201910231348A CN 109981847 A CN109981847 A CN 109981847A
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- China
- Prior art keywords
- cloth
- cover
- main body
- plate main
- electronic equipment
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Abstract
This application discloses a kind of electronic equipment, glass cover-plate and its manufacturing methods.Manufacturing method includes obtaining cloth；The cloth is placed in resin glue and is infiltrated；The cloth after infiltration is set on the cover plate main body, the cloth and the cover plate main body are placed in jig, and heat deaeration.According to the manufacturing method of the glass cover-plate of the electronic equipment of the application, it is impregnated with the cloth of resin glue, on the one hand, by being arranged on cover plate main body convenient for showing distinctive and dimensionally stable grain effect on cover plate main body；On the other hand, by the way that cloth to be combined on cover plate main body, the strong characteristic of toughness that can use cloth promotes the structural strength of glass, and then can promote the fall strength of briquette of cover plate main body, so as to promote service performance, the drop resistant performance of glass cover-plate.
Description
Technical field
This application involves technical field of communication equipment, more particularly, to a kind of electronic equipment, glass cover-plate and its manufacturer
Method.
Background technique
With the continuous progress of science and technology, the function of smart phone is more and more, this just proposes the accessory of smart phone
More and more to require, in order to meet the multi-functional demand of smart phone, more and more new materials be used to produce and make
It makes.The hand-set lid accessory common as mobile phone, the difficulty of processing of cover board is also higher and higher, for example, by taking metal cover board as an example, gold
Belonging to cover board has the advantages that good hand touch, moulding are changeable, but it has shielding action to mobile phone signal, is not able to satisfy smart phone
Signal transfer function；For another example, by taking glass cover-plate as an example, glass is always as a kind of inorganic non-crystalline material, drop performance
It applies short slab.Currently, being a great problem in face of enterprise to the improvement of the manufacturing process of hand-set lid.
Summary of the invention
The application proposes the manufacturing method of the glass cover-plate of electronic equipment, the manufacturing method simple, glass with process
The good advantage of cover board performance.
The application also proposes that the glass cover-plate of a kind of electronic equipment, the glass cover-plate are made up of the above method.
The application proposes a kind of electronic equipment again, and the electronic equipment includes glass cover-plate as described above.
According to the manufacturing method of the glass cover-plate of the electronic equipment of the embodiment of the present application, include the following steps:
Obtain cloth；
The cloth is placed in resin glue and is infiltrated；
The cloth after infiltration is set on the cover plate main body, the cloth and the cover plate main body are placed in and are controlled
In tool, and heat deaeration.
According to the manufacturing method of the glass cover-plate of the electronic equipment of the embodiment of the present application, soaked by being arranged on cover plate main body
Profit has the cloth of resin glue, on the one hand, convenient for showing distinctive and dimensionally stable grain effect on cover plate main body；Separately
On the one hand, by the way that cloth is combined on cover plate main body, can use cloth the strong characteristic of toughness promoted glass structure it is strong
Degree, and then the fall strength of briquette of cover plate main body can be promoted, so as to promote service performance, the drop resistant performance of glass cover-plate.
In some embodiments, after heating deaeration technique, AF film is formed on the cover plate main body.
In some embodiments, before the cloth is placed in the cover plate main body, first on the cover plate main body
Printing picture and character information.
In some embodiments, when infiltrating to the cloth, infiltrating time length is 1min-120min, preferably
20min-60min。
In some embodiments, during being infiltrated to the cloth, the cloth is first placed in infiltration and is held
In device, then the resin glue poured into the soaking vessel.
In some embodiments, when carrying out heating deaeration to the cloth, by the cloth and the lid after infiltration
It is placed in plate main body in vacuum drying oven to carry out heating deaeration.
In some embodiments, when carrying out heating deaeration to the cloth, heating temperature be 50 DEG C -110 DEG C, preferably 80
℃-100℃。
In some embodiments, the cloth is cotton, chemical fabric, wool spinning cloth, silk, blended fabric or cloth-like undulation degree
Material, the cloth with a thickness of 0.05mm-0.5mm, preferably 0.1-0.3mm.
In some embodiments, when cutting the cloth, the laser cutting cloth is utilized.
According to the glass cover-plate of the electronic equipment of the embodiment of the present application, including cover plate main body and bed of cloth, the bed of cloth
It is formed for the cloth by resin glue infiltration, the cover plate main body and the bed of cloth pass through the resin glue sticking.
According to the glass cover-plate of the electronic equipment of the embodiment of the present application, resin glue is impregnated with by being arranged on cover plate main body
Cloth, on the one hand, convenient for showing distinctive and dimensionally stable grain effect on cover plate main body；On the other hand, pass through
Cloth is combined on cover plate main body, the strong characteristic of toughness that can use cloth promotes the structural strength of glass, and then can be with
The fall strength of briquette of cover plate main body is promoted, so as to promote service performance, the drop resistant performance of glass cover-plate.
According to the electronic equipment of the embodiment of the present application, including front cover and rear cover, the rear cover is connect with the front cover with structure
Accommodating chamber is produced, at least one of the front cover and the rear cover are constructed by glass cover-plate, and the glass cover-plate includes lid
Plate main body and bed of cloth, the bed of cloth are that the cloth infiltrated by resin glue is formed, the cover plate main body and the cloth
Layer passes through the resin glue sticking.
According to the electronic equipment of the embodiment of the present application, it is impregnated with the cloth of resin glue by being arranged on cover plate main body, one
Aspect, convenient for showing distinctive and dimensionally stable grain effect on cover plate main body；On the other hand, by answering cloth
It closes on cover plate main body, the strong characteristic of toughness that can use cloth promotes the structural strength of glass, and then can promote cover board
The fall strength of briquette of main body, so as to promote service performance, the drop resistant performance of glass cover-plate.
In some embodiments, the bed of cloth be located at the cover plate main body towards the surface inside the accommodating chamber,
Or the bed of cloth be located at the cover plate main body towards the surface outside the accommodating chamber.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the flow chart according to the manufacturing method of the glass cover-plate of the electronic equipment of the embodiment of the present application；
Fig. 2 is the flow chart according to the manufacturing method of the glass cover-plate of the electronic equipment of the embodiment of the present application；
Fig. 3 is the structural schematic diagram according to the glass cover-plate of the electronic equipment of the embodiment of the present application；
Fig. 4 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Fig. 5 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Fig. 6 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Fig. 7 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Fig. 8 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Fig. 9 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application；
Figure 10 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application.
Appended drawing reference:
Cover plate main body 110, cloth 120, bed of cloth 121,
Electronic equipment 200, display component 210, accommodating chamber 220,
Front cover 101, front cover periphery 1011, rear cover 102.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Below with reference to Fig. 1, Fig. 3 description according to the manufacturing method of the glass cover-plate 100 of the electronic equipment of the embodiment of the present application.
It should be noted that electronic equipment 200 can be mobile phone, smart phone, tablet computer or laptop etc..In addition, glass
Cover board 100 may be used as the rear cover or front cover of mobile phone, and rear cover can be the battery cover or back casing of mobile phone, and front cover can be used for
Display component 210 is installed, such as the entirety of rear cover can use glass cover-plate 100 and construct；For another example, the peripheral region of front cover can
To be constructed using glass cover-plate 100.
As shown in Figure 1, the manufacturing method of the glass cover-plate 100 of electronic equipment includes the following steps:
T10: cloth 120 is obtained.It should be noted that in cutting cloth 120, it can be according to the shape of cover plate main body 110
Shape cutting cloth 120 so that the cloth 120 after processing can be layed on cover plate main body 110, and can satisfy cover board master
The use demand of body 110.For example, being cut when the surface of the cover plate main body 110 after needing to process is paved with cloth 120 completely
When cloth 120,120 cutting profile of cloth and area can be identical as the surface area of cover plate main body 110.
T20: the cloth 120 is placed in resin glue and is infiltrated.It should be noted that resin glue can be to melt shape in heat
The colloid of state, so that resin glue is combined with each other with cloth 120, is thus convenient for by infiltrating cloth 120 in resin glue
The characteristic that textural shape is presented on cloth 120, while also can use cloth 120 promotes the stability of textural shape, Jin Erke
To promote grain effect.In addition, resin is in cooling procedure, some meeting expansions, some meetings are shunk, are set to by cloth 120
On cover plate main body 110 and make cloth 120 and cover plate main body 100 it is compound to construct glass cover-plate 100 when, can use uniformly
The pretightning force that the thermoplastic resin contraction or expansion being distributed in fibrous material gap generates, it is possible thereby to promote glass cover-plate 100
Structural strength, and then the fall strength of briquette of glass cover-plate 100 can be promoted.
T30: the cloth 120 after infiltration is set on cover plate main body 110, then by the cloth and the cover plate main body
It is placed in jig, and heats deaeration.It is understood that cloth 120 is set on cover plate main body 110.Herein, by adding
The cloth 120 of work can be combined into one structure with cover plate main body 110, be applied to electronic equipment with accessory structure as a whole
On 200.It should be noted that infiltrating the cloth of resin glue after the cloth 120 for infiltrating resin glue is routed on cover plate main body 110
Material 120 forms bed of cloth 121 in main body cover plate 110.
Further, using heating and deaeration technique, cloth 120 and resin glue can be made sufficiently compound, so as into
One step promotes the grain effect of cloth 120, while after cloth 120 is set on cover plate main body 110, can also be further
Promote the structural strength of cover plate main body 110.In addition, " jig " here can be to have one inside profiling jig, such as jig
Shape the chamber of shape, and the cloth 120 for being impregnated with resin glue is heated in the chamber, deaeration, while chamber is to the shape of cloth 120
Shape has certain plastotype effect, to be conducive to for the cloth 120 after deaeration being set on cover plate main body 110.The shape of chamber
Can be consistent with the surface of cover plate main body 110, so as to be conducive to promote the Compound Degree of cloth 120 and cover plate main body 110.
According to the manufacturing method of the glass cover-plate 100 of the electronic equipment of the embodiment of the present application, by cover plate main body 110
The cloth 120 for being impregnated with resin glue is set, on the one hand, distinctive and dimensionally stable convenient for showing on cover plate main body 110
Grain effect；On the other hand, by the way that cloth 120 to be combined on cover plate main body 110, the toughness that can use cloth 120 is strong
Characteristic promotes the structural strength of glass, and then can promote the fall strength of briquette of cover plate main body 110, so as to promote glass cover-plate
100 service performance, drop resistant performance.
In some embodiments of the present application, after heating deaeration technique, AF film is formed on cover plate main body 110.It needs
Illustrate, AF film is properly termed as Anti-finger film or fingerprint proof membrane again.AF film is the appearance for being plated in cover plate main body 110
Face, its effect are to be not easy to shelter evil people and countenance evil practices so that the outer surface of glass cover-plate 100 is more smooth, water droplet presented on surface it is spherical,
To be easier to slide, principle sets AF film similar to the water droplet effect on lotus leaf, therefore by the plating on the surface of glass cover-plate, can
To reduce the probability of glass surface adherency foreign matter.
In some embodiments, when forming AF film on cover plate main body 110, the technique of plated film can be used, such as covering
AF film is plated in plate main body 110.
It, can be first in cover board before cloth 120 is placed in cover plate main body 110 in some embodiments of the present application
Printing picture and character information in main body 110.It is possible thereby to increase cover plate main body 110 using graph text information (such as logo, trade mark etc.)
Diversity.Furthermore it is also possible to avoid cover plate main body 110 from filling using the graph text information in 120 cover sheet main body 110 of cloth
Being worn or avoid electronic equipment 200 with graph text information in the process, graph text information is worn in use.
In some embodiments of the present application, when infiltrating to cloth 120, infiltrating time length can be 1min-
120min, preferably 20min-60min.It is possible thereby to come into full contact with resin glue with cloth 120, and then cloth 120 can be made to fill
Sub-dip profit.In some embodiments, during being infiltrated to cloth 120, cloth 120 first can be placed in infiltration and held
In device, then resin glue poured into soaking vessel.On the one hand, the abundant degree of infiltration of cloth 120 can be promoted；On the other hand,
The infiltrating time of cloth 120 can also be shortened, and then cover plate main body 110 and the compound production cycle of cloth 120 can be shortened.
It in some embodiments, can be by the cloth 120 and cover board after infiltration when carrying out heating deaeration to cloth 120
It is placed in main body 110 in vacuum drying oven to carry out heating deaeration.In other words, cloth 120 is heated, deaeration when, can be with
Cloth 120 and main body 110, jig are placed in vacuum environment, then it is heated in vacuum environment, deaeration.By
This can promote the syncretizing effect between cloth 120 and resin glue, improve deaeration efficiency.Further to promote cloth 120 and tree
Syncretizing effect between rouge glue, in some embodiments, when carrying out heating deaeration to cloth 120, heating temperature can be 50
DEG C -110 DEG C, preferably 80 DEG C -100 DEG C.It should be noted that resin can be regarded as solid-state glue, after heat melts after image water equally
Ability toughness, just at solid after cooling, viscosity is reduced, therefore resin glue and cover plate main body 110 can be carried out heating simultaneously and taken off
Bubble, it is finally cooling simultaneously, jig is taken out.
According to some embodiments of the present application, cloth 120 can be cotton, chemical fabric, wool spinning cloth, silk, blended fabric
Or cloth-like fibrous material.It should be noted that cloth-like fibrous material can be Kevlar, aramid fiber, carbon fiber or glass fibers
Dimension.In order to improve the cutting flatness at 120 edge of cloth, in some embodiments, in cutting cloth 120, can use sharp
Light cutting cloth 120.Cloth 120 with a thickness of 0.05mm-0.5mm, preferably 0.1-0.3mm.
As shown in figure 3, according to the glass cover-plate 100 of the electronic equipment of the embodiment of the present application, including cover plate main body 110 and cloth
The bed of material 121, the bed of cloth 121 are that the cloth 120 infiltrated by resin glue is formed, the cover plate main body 110 and the cloth
The bed of material 121 passes through the resin glue sticking.Certainly, glass cover-plate 100 can be the glass of manufacturing method as described above manufacture
Cover board 100.
According to the glass cover-plate 100 of the electronic equipment of the embodiment of the present application, it is impregnated with by being arranged on cover plate main body 110
The cloth 120 of resin glue, on the one hand, convenient for showing distinctive and dimensionally stable grain effect on cover plate main body 110；
On the other hand, by the way that cloth 120 to be combined on cover plate main body 110, it can use the strong characteristic promotion glass of the toughness of cloth 120
The structural strength of glass, and then the fall strength of briquette of cover plate main body 110 can be promoted, so as to promote the use of glass cover-plate 100
Performance, drop resistant performance.
In some embodiments, glass cover-plate 100 may include cover plate main body 110 and cloth 120, and cloth 120 is layed in
The surface of cover plate main body 110.Cloth 120 can be compound to cover board after laser cutting, resin glue infiltration, heating in vacuum deaeration
In main body 110, to construct glass cover-plate 100.The glass cover-plate 100 not only has textural shape stabilization, clearly appearance effect
Fruit also has the advantages that intensity is high, resistance to fall performance good.It is infiltrated for example, the cloth is placed in resin glue, then will be after infiltration
The cloth is set on the cover plate main body 110, so that the cloth after infiltration forms bed of cloth on cover plate main body 110
121, then the cloth and the cover plate main body are placed in jig, and heat deaeration.
As shown in Fig. 4, Figure 10, the electronic equipment 200 according to the embodiment of the present application may include glass cover-plate 100, glass
Cover board 100 includes cover plate main body 110 and bed of cloth 121, and the bed of cloth 121 is that the cloth 120 infiltrated by resin glue is formed
, the cover plate main body 110 passes through the resin glue sticking with the bed of cloth 121.Certainly, glass cover-plate 100 can be for such as
The glass cover-plate 100 of the upper manufacturing method manufacture.
According to the electronic equipment 200 of the embodiment of the present application, the cloth of resin glue is impregnated with by being arranged on cover plate main body 110
Material 120, on the one hand, convenient for showing distinctive and dimensionally stable grain effect on cover plate main body 110；On the other hand, lead to
Cross and cloth 120 be combined on cover plate main body 110, can use cloth 120 the strong characteristic of toughness promoted glass structure it is strong
Degree, and then the fall strength of briquette of cover plate main body 110 can be promoted, so as to promote service performance, the crash resistance of glass cover-plate 100
Energy.
As shown in Fig. 4, Figure 10, in some embodiments, electronic equipment 200 may include display component 210 and glass cover
Plate 100.Wherein, glass cover-plate 100 can be connect with display component 210, and glass cover-plate 100 and display component 210 limit jointly
Accommodating chamber 220 is made, the components such as battery, mainboard can be placed in accommodating chamber 220.
In some embodiments, electronic equipment 200 may include front cover 101 and rear cover 102.Wherein, rear cover 102 and front cover
To construct accommodating chamber 220, at least one of front cover 101 and rear cover 102 are constructed by glass cover-plate 100, described for 101 connections
Glass cover-plate 110 includes cover plate main body 110 and bed of cloth 121, and the cloth 120 is placed in resin glue and is infiltrated, then will infiltration
The cloth 120 afterwards is set on the cover plate main body 110, so that the shape on cover plate main body 110 of the cloth 120 after infiltration
It is placed in jig at bed of cloth 121, then by the cloth 120 and the cover plate main body 110, and heats deaeration.
For example, as shown in figure 4, entire rear cover 102 can be constructed by glass cover-plate 100；For another example, such as Fig. 4, Tu10Suo
Show, can be constructed by glass cover-plate 100 at the peripheral position of front cover 101, that is, display component 210 is embedded in front cover 101
On, front cover periphery 1011 is looped around around display component 210, and being looped around front cover periphery 1011 around display component 210 can be with
It is constructed by glass cover-plate 100.
In some embodiments, bed of cloth 121 be located at cover plate main body 110 towards the surface inside accommodating chamber 220.By
This, can block cover plate main body 110, and then to avoid bed of cloth 121 convenient for making cover plate main body 110 show different colors.Example
Such as, as shown in Figure 5, Figure 6, when rear cover 102 is constructed by glass cover-plate 100, outside the cover plate main body 110 of glass cover-plate 100
Surface (surface towards outside accommodating chamber 220) constructs the partial appearance face of electronic equipment 200, the cover board of glass cover-plate 100
The inner surface (surface towards inside accommodating chamber 220) of main body 110 is bonded with bed of cloth 121；For another example, as shown in figs. 4 and 6, when
When front cover 101 is constructed by glass cover-plate 100, the outer surface of the cover plate main body 110 of glass cover-plate 100 is (towards outside accommodating chamber 220
The surface in portion) construct the partial appearance face of electronic equipment 200, the inner surface (direction of the cover plate main body 110 of glass cover-plate 100
Surface inside accommodating chamber 220) it is bonded with bed of cloth 121；For another example, as shown in fig. 6, when rear cover 102 and front cover 101 are by glass
When cover board 100 constructs, the outer surface (surface towards outside accommodating chamber 220) of the cover plate main body 110 of glass cover-plate 100 is constructed
The partial appearance face of electronic equipment 200 out, the inner surface of the cover plate main body 110 of glass cover-plate 100 is (towards inside accommodating chamber 220
Surface) be bonded with bed of cloth 121.
In some embodiments, bed of cloth 121 be located at cover plate main body 110 towards the surface outside accommodating chamber 220.That is,
Bed of cloth 121 constructs the partial appearance face of electronic equipment 200.Thus, it is possible to promote the sense of touch of glass cover-plate 100.For example, such as
Shown in Fig. 8, Fig. 9, when rear cover 102 is constructed by glass cover-plate 100, the outer surface of the cover plate main body 110 of glass cover-plate 100
(surface towards outside accommodating chamber 220) is bonded with bed of cloth 121；For another example, as shown in Fig. 7, Fig. 9, when front cover 101 is by glass cover
When plate 100 constructs, the outer surface (surface towards outside accommodating chamber 220) of the cover plate main body 110 of glass cover-plate 100 is bonded with
Bed of cloth 121；For another example, as shown in figure 9, when rear cover 102 and front cover 101 are constructed by glass cover-plate 100, glass cover-plate
The outer surface (surface towards outside accommodating chamber 220) of 100 cover plate main body 110 is bonded with bed of cloth 121.
The manufacturer of the glass cover-plate 100 of electronic equipment according to the embodiment of the present application is described below with specific embodiment
Method.It should be noted that described below be merely illustrative, rather than to the concrete restriction of the application.
As shown in Figure 2 and Figure 3, the manufacturing method of the glass cover-plate 100 of electronic equipment includes the following steps:
S10: laser cutting cloth 120 is utilized.It should be noted that cloth 120 needs and cover board master after processing
Body 110 is compound to construct glass cover-plate 100.In cutting cloth 120, cloth can be cut according to the shape of cover plate main body 110
Material 120 so that the cloth 120 after processing can be layed on cover plate main body 110, and can satisfy cover plate main body 110
Use demand.For example, when the surface of the cover plate main body 110 after needing to process is paved with cloth 120 completely, in cutting cloth 120
When, 120 cutting profile of cloth and area can be identical as cover plate main body 110.Herein, cloth 120 can be cotton, chemical fibre
Cloth, wool spinning cloth, silk, blended fabric or cloth-like fibrous material.Explanation is needed further exist for, cloth-like fibrous material can be virtue
Synthetic fibre fiber, carbon fiber or glass fibre.
In addition, cover plate main body 110 can be obtained and buying on the market, for example, healthy and free from worry 6th generation glass.
Cloth 120: being first placed in soaking vessel, then resin glue poured into soaking vessel by S20, so that cloth 120
It is infiltrated in resin glue.It should be noted that by the way that cloth 120 is infiltrated in resin glue, so that resin glue and cloth 120 are multiple
It is combined, thus convenient for textural shape is presented on cloth 120, while the characteristic that also can use cloth 120 promotes texture
The stability of shape, and then grain effect can be promoted.In addition, resin is in cooling procedure, some meeting expansions, some meetings are received
Cloth 120 is being set on cover plate main body 110 and is making cloth 120 and cover plate main body 100 compound to construct glass cover by contracting
When plate 100, the pretightning force that the thermoplastic resin contraction or expansion being uniformly distributed in fibrous material gap generates can use, thus
The structural strength of glass cover-plate 100 can be promoted, and then the fall strength of briquette of glass cover-plate 100 can be promoted.
When infiltrating to cloth 120, infiltrating time length can be 1min-120min.It is possible thereby to make resin glue
It is come into full contact with cloth 120, and then cloth 120 can be made sufficiently to infiltrate.
S30: the printing picture and character information on cover plate main body 110.It is possible thereby to increase lid using graph text information (such as logo)
The diversity of plate main body 110.Furthermore it is also possible to avoid cover board using the graph text information in 120 cover sheet main body 110 of cloth
The graph text information in assembling process of main body 110 is worn or avoids electronic equipment 200, and graph text information is ground in use
Damage.
S40: the cloth 120 after infiltration is set on cover plate main body 110, then by the cloth and the cover plate main body
110 are placed in jig, and are heated in vacuum drying oven, deaeration.It is understood that cloth 120 is set to cover plate main body
On 110.Herein, it can be combined into one with cover plate main body 110 structure by the cloth of processing 120, with accessory as a whole
Structure is applied on electronic equipment 200.Further, using heating and deaeration technique, can be promoted cloth 120 and resin glue it
Between syncretizing effect, improve deaeration efficiency so that cloth 120 and resin glue are sufficiently compound, so as to further promote cloth
120 grain effect, while after cloth 120 is set on cover plate main body 110, it can also further promote cover plate main body
110 structural strength.
In addition, " jig " here can be to have effigurate chamber inside profiling jig, such as jig, it is impregnated with
The cloth 120 of resin glue is heated in the chamber, deaeration, while chamber has certain plastotype effect to the shape of cloth 120,
To be conducive to for the cloth 120 after deaeration being set on cover plate main body 110.The shape of chamber can be with cover plate main body 110
Surface is consistent, so as to be conducive to promote the Compound Degree of cloth 120 and cover plate main body 110.In addition, being controlled by using profiling
Tool, also helps and carries out pressurization preload to cloth 120, to promote the deaeration efficiency of cloth 120.
Further to promote the syncretizing effect between cloth 120 and resin glue, when carrying out heating deaeration to cloth 120,
Heating temperature can be 50 DEG C -110 DEG C.For the ease of cloth 120 and cover plate main body 110 are combined with each other, to cloth 120
After carrying out heating deaeration, first cloth 120 is cooled down, subsequent processing then is carried out to cloth 120 again.
S50: AF film is plated on cover plate main body 110.It should be noted that AF film is also known as Anti-finger film or anti-finger
Line film, AF film are the outer surfaces for being plated in cover plate main body 110, its effect be so that the outer surface of glass cover-plate 100 is more smooth,
Be not easy to shelter evil people and countenance evil practices, water droplet presented on surface it is spherical, to be easier to slide, principle similar to the water droplet effect on lotus leaf, because
This sets AF film by the plating on the surface of glass cover-plate, can reduce the probability of glass surface adherency foreign matter.
In order to facilitate understanding, below with the structural strength of specific experiment test glass cover-plate 100.Wherein table one are as follows: with cloth
Expect 120 test to carry out for carbon fiber, Kevlar, cotton to the glass four point bending strength of glass cover-plate 100；Table two
Are as follows: by cloth 120 be carbon fiber, the glass height of the fall ball of glass cover-plate 100 is carried out for Kevlar, cotton test.
Table one: the glass four point bending strength after different clothes are compound
Table two: the glass height of the fall ball after different clothes are compound
| Material | Falling sphere intensity/cm (110g steel ball smashes height) |
| With a thickness of the glass of 0.55mm | 30~40 |
| With a thickness of the glass+0.2mm carbon fiber of 0.55mm | 60~70 |
| With a thickness of the glass+0.2mm Kevlar of 0.55mm | 70~80 |
| With a thickness of the glass+0.2mm cotton of 0.55mm | 50~60 |
It is impregnated with the cloth 120 of resin glue, on the one hand, by being arranged on cover plate main body 110 as a result, convenient in cover board master
Distinctive and dimensionally stable grain effect is showed on body 110；On the other hand, by the way that cloth 120 is combined to cover plate main body
On 110, the strong characteristic of toughness that can use cloth 120 promotes the structural strength of glass, and then can promote cover plate main body 110
Fall strength of briquette, so as to promote service performance, the drop resistant performance of glass cover-plate 100.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (12)
1. the manufacturing method of the glass cover-plate of a kind of electronic equipment, which is characterized in that the manufacturing method includes:
Obtain cloth；
The cloth is placed in resin glue and is infiltrated；
The cloth after infiltration is set on the cover plate main body, the cloth and the cover plate main body are placed in jig
In, and heat deaeration.
2. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that in heating deaeration work
After skill, AF film is formed on the cover plate main body.
3. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that by the cloth
It is placed in front of the cover plate main body, first the printing picture and character information on the cover plate main body.
4. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that the cloth
When being infiltrated, infiltrating time length is 1min-120min, preferably 20min-60min.
5. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that the cloth
During being infiltrated, first the cloth is placed in soaking vessel, then the resin glue is poured into the soaking vessel
In.
6. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that the cloth
When carrying out heating deaeration, it is de- that heating is carried out by being placed in vacuum drying oven in the cloth and the cover plate main body after infiltration
Bubble.
7. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that the cloth
When carrying out heating deaeration, heating temperature is 50 DEG C -110 DEG C, preferably 80 DEG C -100 DEG C.
8. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that the cloth is cotton
Cloth, chemical fabric, wool spinning cloth, silk, blended fabric or cloth-like fibrous material, the cloth with a thickness of 0.05mm-0.5mm, it is excellent
Select 0.1-0.3mm.
9. the manufacturing method of the glass cover-plate of electronic equipment according to claim 1, which is characterized in that cutting the cloth
When material, the laser cutting cloth is utilized.
10. the glass cover-plate of a kind of electronic equipment, which is characterized in that including cover plate main body and bed of cloth, the bed of cloth is warp
The cloth formation of resin glue infiltration is crossed, the cover plate main body and the bed of cloth pass through the resin glue sticking.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes:
Front cover；
Rear cover, the rear cover are connect to construct accommodating chamber, at least one of the front cover and the rear cover with the front cover
It is constructed by glass cover-plate, the glass cover-plate includes cover plate main body and bed of cloth, and the bed of cloth is to infiltrate by resin glue
Cloth formed, the cover plate main body and the bed of cloth pass through the resin glue sticking.
12. electronic equipment according to claim 11, which is characterized in that the bed of cloth is located at the court of the cover plate main body
To inside the accommodating chamber surface or the bed of cloth be located at the cover plate main body towards the table outside the accommodating chamber
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910231348.4A CN109981847A (en) | 2019-03-26 | 2019-03-26 | Electronic equipment, glass cover-plate and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910231348.4A CN109981847A (en) | 2019-03-26 | 2019-03-26 | Electronic equipment, glass cover-plate and its manufacturing method |
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| CN109981847A true CN109981847A (en) | 2019-07-05 |
Family
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| CN201910231348.4A Pending CN109981847A (en) | 2019-03-26 | 2019-03-26 | Electronic equipment, glass cover-plate and its manufacturing method |
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Application publication date: 20190705 |
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