CN109980069A - LED component and packaging method, backlight module, liquid crystal display die set and terminal - Google Patents
LED component and packaging method, backlight module, liquid crystal display die set and terminal Download PDFInfo
- Publication number
- CN109980069A CN109980069A CN201711450875.1A CN201711450875A CN109980069A CN 109980069 A CN109980069 A CN 109980069A CN 201711450875 A CN201711450875 A CN 201711450875A CN 109980069 A CN109980069 A CN 109980069A
- Authority
- CN
- China
- Prior art keywords
- glue
- fluorescent
- led component
- adhesive layer
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a kind of LED component and packaging method, backlight module, liquid crystal display die set and terminals, the packaging method of the LED component obtains previously prepared liquid fluorescent glue by the different fluorescent powder of mixing at least two and encapsulation glue, baking liquid fluorescent glue obtains fluorescent adhesive layer, light transmission glue-line is obtained based on fluorescent adhesive layer, it is cut to obtain single luminescence component after the mixed fluorescent powder surface bonding luminescence chip for being located at light transmission glue-line top surface, is cut to obtain LED component after bonding luminescence component on pcb board；LED component made from this method is small in size, thickness is low, the backlight more demanding to light and thin degree suitable for mobile phone etc., solve the problems, such as traditional support rack type LED component be difficult to reduce the size, production yield it is low, simultaneously, the utilization rate that can be improved fluorescent glue by way of according to fluorescent glue made from stringent match, is further ensured that the brightness and color area concentration degree of LED component.
Description
Technical field
The present invention relates to LED encapsulation technology fields, more specifically, be related to a kind of LED component and its packaging method and
Backlight module, liquid crystal display die set and terminal.
Background technique
Light emitting diode (LED) is a kind of solid-state semiconductor device, using solid semiconductor chip as luminescent material, when
Both ends add forward voltage, and the carrier generation in semiconductor is compound, release superfluous energy and cause photon transmitting generation can
It is light-exposed.In production, in addition to be welded to two electrodes of LED chip, to draw except positive and negative electrode, it is also necessary to right
LED chip and two electrodes are protected, i.e. progress LED encapsulation.
Currently, the LED packing forms of mainstream are the LED light source of belt supporting frame on the market, this packing forms packaged light source
Size is more much bigger than chip size itself, and phosphor process continues to use traditional dispensing, spraying etc., but this traditional encapsulation
Form has gradually been unable to satisfy user to LED product miniaturization, integrated, high brightness demand, especially with electricity such as mobile phones
Sub- product increasingly pursues narrow frame and lightening, the LED lamp bead as backlight also to accomplish it is smaller and thinner, according to tradition
The structure of stent-type backlight product designs, and supporting structure is reduced to the size that can then reduce LED chip, to reduce the bright of lamp bead
Degree, but for backlight product, lamp bead brightness is to continue to increase, the product for reducing brightness is bound to not connect by consumer
By, meanwhile, for the LED of rack-like structures due to being limited by packaging technology, the smaller difficulty of processing of size is higher, works as LED lamp bead
When thickness is less than or equal to 0.3mm, supporting structure is difficult to realize.
Therefore, because being limited and being led by die bond board height when chip mount in conventional stent-type LED encapsulation structure
It causes that large size chip can not be placed under the premise of supporting structure reduces, is not able to satisfy user further and high brightness demand is asked
Topic is urgently to be resolved.
Summary of the invention
Technical problem to be solved by the present invention lies in: since existing conventional stent type LED component size is too big and uncomfortable
For light and thin type product, and the problem of user is to high brightness demand it is not able to satisfy, the present invention provides a kind of LED component and its encapsulation
Backlight module, liquid crystal display die set and the terminal that method and the LED component made from the packaging method of the LED component are constituted.
In order to solve the above technical problems, the present invention provides a kind of single side luminous LED component, the device include pcb board and
Luminescence chip, the light transmission glue-line set gradually far from pcb board；Luminescence chip, light transmission glue-line form luminescence component, luminescence component side
Face is provided with side sealant layer；Light transmission glue-line is at least made of fluorescent adhesive layer, and fluorescent adhesive layer is made of the baking of liquid fluorescent glue.
Optionally, fluorescent adhesive layer is affixed on luminescence chip；First fluorescent powder, the second fluorescence are included at least by fluorescent adhesive layer
Powder, the first fluorescent powder, the second fluorescent powder integrated distribution are in the fluorescent adhesive layer close to luminescence chip；The transmitting light of first fluorescent powder
Wave-length coverage is 500-680nm, and the wavelength of transmitted light range of the second fluorescent powder is 500-680nm.
Optionally, the first fluorescent powder, the second fluorescent powder include silicate fluorescent powder, sialon fluorescent powder, phosphate phosphor,
Diverse fluorescent powder in sulphide fluorescent material.
Further, the present invention also provides a kind of packaging methods of the luminous LED component of single side comprising following step
It is rapid:
S1, at least two different fluorescent powders are mixed with encapsulation glue, liquid fluorescent glue is made；
S2, the first adhesive film is pasted in substrate surface, uniform auxiliary tapping state fluorescent glue, liquid in the first glue film layer surface
Fluorescent powder integrated distribution in fluorescent glue is close to the first adhesive film side；
S3, baking liquid fluorescent glue form fluorescent adhesive layer, and light transmission glue-line is made based on fluorescent adhesive layer, glimmering in light transmission glue-line
Optical cement layer is located above the first adhesive film and contacts；
S4, the first adhesive film of removal, light transmission glue-line is separated with substrate；
S5, the second adhesive film is pasted in substrate surface, light transmission glue-line is inverted in the second adhesive film；
S6, an at least luminescence chip is bonded on the fluorescent adhesive layer surface of light transmission glue-line, and is toasted, make luminescence chip
Light-emitting surface be adhesively fixed on fluorescent adhesive layer；
Semi-finished product obtained by S7, the gap cutting step S6 along luminescence chip, obtain single luminescence component；
S8, at least two luminescence components are adhered on pcb board, and carry out curing process, make the luminescence chip of luminescence component
It is fixed on pcb board；
S9, the filling with sealant water around luminescence component, baking-curing sealing glue form side around luminescence component
Encapsulate glue-line；
S10, the sealing glue for removing luminescence component top surface, the gap of adjacent two luminescence components is cut along pcb board
It cuts, obtains the luminous LED component of single side.
Optionally, include: the step of light transmission glue-line obtained based on fluorescent adhesive layer in step S3
Light transmission glue-line directly is made using fluorescent adhesive layer as light transmission glue-line；
Or,
S31, top capsulation glue is coated on fluorescent adhesive layer surface, is toasted after application, keep top capsulation glue solid
Change, light transmission glue-line is made.
Optionally, the process of the baking-curing top capsulation glue in step S31 are as follows: first with the heating of 1-10 DEG C/min
The fluorescent adhesive layer that rate is coated with top capsulation glue rises to 50-80 DEG C by room temperature, 1-3h is kept the temperature, then with 1-10 DEG C/min
Heating rate be warming up to 100-200 DEG C, keep the temperature 1-9h.
Optionally, the process of the baking-curing top capsulation glue in step S31 are as follows: first with the heating of 1-10 DEG C/min
The fluorescent adhesive layer that rate is coated with top capsulation glue rises to 50-80 DEG C by room temperature, 1-3h is kept the temperature, then with 1-10 DEG C/min
Heating rate be warming up to 100-200 DEG C, keep the temperature 1-9h.
Optionally, in step S31 light transmission glue-line obtained with a thickness of 100-400 μm.
Optionally, the curing process in step S8 includes: baking-curing, reflux solidification.
Optionally, the process of the liquid fluorescent glue-line of relative hierarchical is toasted in step S3 are as follows: first with 1-10 DEG C/min's
Liquid fluorescent glue-line is risen to 40-60 DEG C by room temperature by heating rate, 0.5-2h is kept the temperature, then with the heating rate of 1-10 DEG C/min
It is warming up to 65-90 DEG C, keeps the temperature 0.5-4h, is finally warming up to 120-200 DEG C with the heating rate of 1-10 DEG C/min, keeps the temperature 1-12h.
Optionally, fluorescent powder includes silicate, aluminate, fluoride, phosphate, nitride or sulphide fluorescent material, hair
The wavelength of transmitted light of optical chip is 230-480nm；The temperature that fixed luminescence chip is toasted in step S6 is 120-180 DEG C.
Further, the present invention also provides a kind of backlight module, which includes LED component encapsulation side as described above
The LED component that method is prepared.
Further, the present invention also provides a kind of liquid crystal display die set, which includes back as described above
Optical mode group.
Further, the present invention also provides a kind of terminals, which is characterized in that the terminal includes liquid crystal display as described above
Mould group.
The utility model has the advantages that
The luminous LED component of single side provided by the invention, the luminescence chip set gradually including pcb board and separate pcb board,
Light transmission glue-line composition, the luminescence component side that luminescence chip, light transmission glue-line are formed are provided with side sealant layer, wherein light transmission
Glue-line includes at least fluorescent adhesive layer, and fluorescent adhesive layer is directly made of liquid fluorescent glue, and liquid fluorescent glue includes at least two different
The fluorescent powder of type is made, and since the device has lesser size, is applicable in and the backlight of light and thin type electronic product, simultaneously
Again since the size of the device is smaller, so can be mentioned by increasing the method for LED component quantity on light and thin type electronic product
The overall brightness of high mobile phone backlight.
The present invention also provides a kind of packaging method of LED component that single side as above is luminous, this method by mix to
Few two different fluorescent powders and encapsulation glue obtain previously prepared liquid fluorescent glue, and baking liquid fluorescent glue obtains fluorescent glue
Layer, obtains light transmission glue-line based on fluorescent adhesive layer, obtained light transmission glue-line is inverted on substrate, is being located at light transmission glue-line top surface
Mixed fluorescent powder surface bonds luminescence chip, is cut after baking-curing luminescence chip and obtains single luminescence component,
It is cut after bonding at least two luminescence components on pcb board, the luminous LED component of single side, passes through this method after being encapsulated
LED component obtained is small in size, thickness is low, and the backlight more demanding to light and thin degree suitable for mobile phone etc. solves traditional
Support rack type LED component is difficult to reduce the size, and the problem that the production yield for producing obtained small size LED component is low, meanwhile,
The utilization rate that can be improved fluorescent glue by way of according to fluorescent glue made from stringent match, is further ensured that LED component
Brightness and color area concentration degree.
Further, the present invention also provides backlight module, liquid crystal display die set, terminal, the backlight modules, liquid crystal display
Mould group and terminal all include the LED component that the packaging method of LED component as described above is prepared；Due to such as packaging method
The LED component size being prepared is smaller, it is possible to meet user by way of increasing LED component to backlight module, liquid
The demand of brilliant display module, terminal high brightness, simultaneously as the LED component size is small, the backlight mould made of the LED component
During carrying out raising brightness by increasing LED component, there is no influenced by existing firmware for group, liquid crystal display die set
Caused by can not be the problem of placing large scale LED component.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the structural schematic diagram of the luminous LED component of the single side of the embodiment of the present invention；
Fig. 2 is the schematic diagram of the section structure of the luminous LED component of the first single side of the embodiment of the present invention.
Fig. 3 is the schematic diagram of the section structure of the luminous LED component of second of single side of the embodiment of the present invention.
Fig. 4 is the structural schematic diagram of single luminescence component in the luminous LED component of the single side of the embodiment of the present invention；
Fig. 5 is the general view for illustrating the luminous LED component manufacturing method of the single side of the embodiment of the present invention.
Appended drawing reference indicates in figure are as follows: 1-PCB plate；2- luminescence chip；3- light transmission glue-line；The first fluorescent powder of 31-；32-
Two fluorescent powders；33- encapsulates glue-line；The side 4- encapsulates glue-line；5- top capsulation glue-line；A-A ' line in Fig. 1 structural schematic diagram
Section line obtains the schematic diagram of the section structure of Fig. 2, Fig. 3.
Specific embodiment
In order to make the content of the present invention more clearly understood, below according to specific embodiments of the present invention to this hair
It is bright to be described in further detail.
Embodiment 1
The present embodiment provides the LED components that a kind of single side shines, and as shown in Figs. 1-2, device includes pcb board 1 and along separate
Luminescence chip 2 that 1 direction of pcb board is sequentially arranged, light transmission glue-line 3, light transmission glue-line include the first fluorescent powder 31, the second fluorescent powder
32, glue 33 is encapsulated, luminescence chip 2, light transmission glue-line 3 form a luminescence component, and luminescence component side is provided with side sealing
Glue-line 4.
In practical applications, light transmission glue-line 3 further includes top capsulation glue-line 5, as shown in Figure 3.
Specifically, fluorescent adhesive layer is affixed on luminescence chip；First fluorescent powder, the second fluorescence are included at least by fluorescent adhesive layer
Powder, the first fluorescent powder, the second fluorescent powder integrated distribution are in the fluorescent adhesive layer close to luminescence chip；The transmitting light of first fluorescent powder
Wave-length coverage is 500-680nm, and the wavelength of transmitted light range of the second fluorescent powder is 500-680nm.
In some examples of the present embodiment, the first fluorescent powder, the second fluorescent powder include silicate fluorescent powder, Sialon fluorescence
Powder, phosphate phosphor, diverse fluorescent powder in sulphide fluorescent material.
The present embodiment also provides a kind of LED component packaging method that single side is luminous comprising following steps:
S1, at least two different fluorescent powders are mixed with encapsulation glue, liquid fluorescent glue is made.
In some examples of this implementation, mixing include at least the first fluorescent powder, the fluorescent powder including the second fluorescent powder with
Encapsulation glue obtains previously prepared liquid fluorescent glue, and the wavelength of transmitted light range of the first fluorescent powder is 500-680nm, and second is glimmering
The wavelength of transmitted light range of light powder is 500-680nm.
S2, the first adhesive film is pasted in substrate surface, uniform auxiliary tapping state fluorescent glue, liquid in the first glue film layer surface
Fluorescent powder integrated distribution in fluorescent glue is close to the first adhesive film side.
S3, baking liquid fluorescent glue form fluorescent adhesive layer, and light transmission glue-line is made based on fluorescent adhesive layer, glimmering in light transmission glue-line
Optical cement layer is located above the first adhesive film and contacts.
In this embodiment, the step of light transmission glue-line being made based on fluorescent adhesive layer include:
Light transmission glue-line directly is made using fluorescent adhesive layer as light transmission glue-line；
Or,
S31, top capsulation glue is coated on fluorescent adhesive layer surface, is toasted after application, keep top capsulation glue solid
Change, light transmission glue-line is made.
In some examples of this implementation, the process of the baking-curing top capsulation glue in step S31 are as follows: first with 1-
The fluorescent adhesive layer that the heating rate of 10 DEG C/min is coated with top capsulation glue rises to 50-80 DEG C by room temperature, keeps the temperature 1-3h, so
It is warming up to 100-200 DEG C with the heating rate of 1-10 DEG C/min afterwards, keeps the temperature 1-9h.
In some examples of this implementation, light transmission glue-line obtained with a thickness of 100-400 μm in step S31.
In some examples of this implementation, the process of the liquid fluorescent glue-line of relative hierarchical is toasted in step S3 are as follows: first
Liquid fluorescent glue-line is risen to 40-60 DEG C by room temperature with the heating rate of 1-10 DEG C/min, 0.5-2h is kept the temperature, then with 1-10
DEG C/heating rate of min is warming up to 65-90 DEG C, 0.5-4h is kept the temperature, 120- is finally warming up to the heating rate of 1-10 DEG C/min
200 DEG C, keep the temperature 1-12h.
S4, the first adhesive film of removal, light transmission glue-line is separated with substrate.
S5, the second adhesive film is pasted in substrate surface, light transmission glue-line is inverted in the second adhesive film.
S6, an at least luminescence chip is bonded on the fluorescent adhesive layer surface of light transmission glue-line, and is toasted, make luminescence chip
Light-emitting surface be adhesively fixed on fluorescent adhesive layer.
In some examples of this implementation, fluorescent powder include silicate, aluminate, fluoride, phosphate, nitride or
Sulphide fluorescent material, the wavelength of transmitted light of luminescence chip are 230-480nm；The temperature of the fixed luminescence chip of baking is in step S6
120-180℃。
Semi-finished product obtained by S7, the gap cutting step S6 along luminescence chip, obtain single luminescence component.
S8, at least two luminescence components are adhered on pcb board, and carry out curing process, make the luminescence chip of luminescence component
It is fixed on pcb board.
S9, the filling with sealant water around luminescence component, baking-curing sealing glue form side around luminescence component
Encapsulate glue-line.
S10, the sealing glue for removing luminescence component top surface, the gap of adjacent two luminescence components is cut along pcb board
It cuts, obtains the luminous LED component of single side.
Embodiment 2
The present embodiment provides the LED component packaging methods that a kind of single side shines comprising following steps:
S1, a substrate is provided, substrate is glass substrate, pyrolysis adhesive film is pasted in substrate surface, in pyrolysis adhesive film table
Paste liquid fluorescent glue on face, liquid fluorescent glue is by two different fluorescent powders and is filled in the encapsulation glue of fluorescent powder and mixes
It is made, toasts liquid fluorescent glue, so that the encapsulation glue curing of liquid fluorescent glue is obtained fluorescent adhesive layer, fluorescent adhesive layer is not processed
Obtain light transmission glue-line.
Fluorescent powder integrated distribution in liquid fluorescent glue is in downside, wherein mixed fluorescent powder is by the first fluorescent powder, second glimmering
Two kinds of fluorescent powder compositions of light powder, the first phosphor powder layer raw material are the silicate fluorescent powder of commercially available doping with rare-earth ions, transmitting
The a length of 580nm of light wave, the raw material of the second phosphor powder layer are sialon fluorescent powder, wavelength of transmitted light 500nm, physical vapour deposition (PVD)
In the process, chamber pressure 100Pa, power are 100 watts.
S2, heating removal pyrolysis adhesive film, light transmission glue-line is separated with substrate.
S3, pyrolysis adhesive film is pasted again in substrate surface, the inversion of light transmission glue-line is covered on adhesive film.
S4, in the first phosphor powder layer surface coated with adhesive, and bond several luminescence chips on preset position, obtain
The luminescence component of full wafer, the luminescence chip of bonding are LED flip chip, wavelength of transmitted light 480nm, the semi-finished product that will be obtained
Being placed in baking oven and toasting at 120 DEG C solidifies binder, the blue light of luminescence chip transmitting by with the feux rouges of the first phosphor powder layer, the
The green light of two phosphor powder layers is compound, to form white light emission.
S5, full wafer luminescence component is cut along the gap of LED chip, is divided into single luminescence component, the knife of cutting
Piece is with a thickness of 0.05mm.
S6, single LED is adhered to pcb board 1 with elargol electroconductive binder, then by binder baking-curing, then existed
Filling with sealant water around LED, sealing glue can be high viscosity silicone resin, and reflectivity is greater than or equal to 75%, will seal
Glue baking-curing.
Sealing glue at the top of S7, removal LED chip, retains the sealing glue of side, obtains side sealant layer, then
Two adjacent gaps LED are cut to get the LED component to shine to individual single side along pcb board.
Embodiment 3
The present embodiment provides the LED component packaging methods that a kind of single side shines comprising following steps:
S1, a substrate is provided, substrate is ceramic substrate, UV adhesive film is pasted in substrate surface, in UV glue film layer surface
Pasting liquid fluorescent glue, liquid fluorescent glue is by mixed fluorescent powder and is filled in the encapsulation glue of mixed fluorescent powder and is mixed,
Liquid fluorescent glue is toasted, so that the encapsulation glue curing of liquid fluorescent glue is encapsulated glue-line and obtains mixing fluorescent adhesive layer, it is glimmering mixing
Optical cement layer surface coats top capsulation glue, and carrying out baking after application makes top capsulation glue curing, obtains top capsulation glue
Layer, top capsulation glue-line are formed with fluorescent adhesive layer is mixed with a thickness of 100-400 μm of light transmission glue-line.
Liquid fluorescent glue is made of the first fluorescent powder and the second fluorescent powder, and the first phosphor raw material is commercially available rare earth doped
The phosphate phosphor of ion, wavelength of transmitted light 680nm, the raw material of the second fluorescent powder are the vulcanization doped with rare earth ion
Matter fluorescent powder, wavelength of transmitted light 580nm, in processes of physical vapor deposition, chamber pressure 1000Pa, power is 500 watts.
Baking-curing top capsulation glue obtains the process of top capsulation glue-line are as follows: first with the heating speed of 1-10 DEG C/min
Rate is coated with the mixing fluorescent adhesive layer of top capsulation glue and rises to 50-80 DEG C by room temperature, keeps the temperature 1-3h, then with 1-10 DEG C/
The heating rate of min is warming up to 100-200 DEG C, keeps the temperature 1-9h.
S2, removal UV adhesive film, fluorescent film is separated with substrate.
S3, pyrolysis adhesive film is pasted again in substrate surface, fluorescent film inversion is covered on adhesive film, makes the first fluorescent powder
Layer is located at top layer (upper surface of light transmission glue-line).
S4, in the first phosphor powder layer surface coated with adhesive, and bond several luminescence chips on preset position, obtain
The luminescence component of full wafer, the luminescence chip of bonding are that the wavelength of transmitted light of LED flip chip LED flip chip is 230nm, will
To semi-finished product be placed in baking oven and toasted at 180 DEG C and solidify binder, the ultraviolet light and the first fluorescent powder of luminescence chip transmitting
Feux rouges, the green light of the second phosphor powder layer of layer are compound, to form white light emission.
S5, full wafer luminescence component is cut along the gap of LED chip, is divided into single luminescence component, the knife of cutting
Piece is with a thickness of 0.05mm.
S6, single LED is adhered to pcb board 1 with tin cream, tin cream is solidified in reflow soldering, is then filled out around LED
Sealing glue is filled, sealing glue can be greater than or equal to 75% for its reflectivity of high viscosity silicone resin, and sealing glue baking is solid
Change.
Sealing glue at the top of S7, removal LED chip, retains the sealing glue of side, obtains side sealant layer, then
Two adjacent gaps LED are cut to get the LED component to shine to individual single side along pcb board.
Embodiment 4
The present embodiment provides the LED component packaging methods that a kind of single side shines comprising following steps:
S1, a substrate is provided, substrate is aluminium sheet, pyrolysis adhesive film is pasted in substrate surface, in pyrolysis glue film layer surface
Pasting liquid fluorescent glue, liquid fluorescent glue is by mixed fluorescent powder and is filled in the encapsulation glue of mixed fluorescent powder and is mixed,
Liquid fluorescent glue is toasted, so that the encapsulation glue curing of liquid fluorescent glue is encapsulated glue-line and obtains mixing fluorescent adhesive layer, it is glimmering to mixing
Optical cement layer is not processed to obtain light transmission glue-line.
Mixing includes the first phosphor powder layer and the second phosphor powder layer in fluorescent adhesive layer, and the first phosphor powder layer raw material is commercially available
The silicate fluorescent powder of doping with rare-earth ions, wavelength of transmitted light 615nm, the raw material of the second phosphor powder layer are Sialon fluorescence
Powder, wavelength of transmitted light 525nm, in processes of physical vapor deposition, chamber pressure 600Pa, power is 300 watts.
S2, heating removal pyrolysis adhesive film, light transmission glue-line is separated with substrate.
S3, pyrolysis adhesive film is pasted again in substrate surface, the inversion of light transmission glue-line is covered on adhesive film, makes the first fluorescence
Bisque is located at top layer (upper surface of light transmission glue-line).
S4, in the first phosphor powder layer surface coated with adhesive, and bond several luminescence chips on preset position, obtain
The luminescence component of full wafer, the luminescence chip of bonding are LED flip chip, and the wavelength of transmitted light of LED flip chip is 370nm, will
Obtained semi-finished product, which are placed in baking oven and toast at 160 DEG C, solidifies binder, the ultraviolet light and the first fluorescence that luminescence chip 2 emits
The feux rouges of bisque, the green light of the second phosphor powder layer are compound, to form white light emission.
S5, full wafer luminescence component is cut along the gap of LED chip, is divided into single LED, the blade thickness of cutting is
1mm。
S6, single LED elargol or other electroconductive binders are adhered to pcb board, then by binder baking-curing, so
The filling with sealant water around LED afterwards, sealing glue can be greater than or equal to 75% for its reflectivity of high viscosity silicone resin, will be close
Sealing water baking-curing.
Sealing glue at the top of S7, removal LED chip, retains the sealing glue of side, obtains side sealant layer, then
Two adjacent gaps LED are cut to get the LED component to shine to individual single side along pcb board.
Embodiment 5
The present embodiment provides a kind of backlight module, liquid crystal display die set and terminal, the backlight modules, liquid crystal display die set
In include the LED component that is prepared of LED component packaging method as described above；The terminal includes liquid crystal display mode as described above
Group.
In the present embodiment, backlight module is made of LED component, and the LED component is by LED component packaging method as described above
It is made.The backlight module can be applied to display backlight field, can be the backlight module of the terminals such as TV, display, mobile phone,
When being applied to key-press backlight field, which can be used as the key that mobile phone, calculator, keyboard etc. have press key equipment
Back light.
In the present embodiment, liquid crystal display die set is made of backlight module, which includes by LED as described above again
LED component made from device packaging method.The liquid crystal display die set can be applied to: electric power observation and control terminal, injection molding machine computer, number
Control system, man-machine interface, Medical Instruments, biochemical analysis, textile machine control, tax control machine, lottery tickets machine, food inspection, chromatography point
The fields such as analysis, electronic surveying, environmental test device, security against fire, automotive electronics and data acquisition.
In the present embodiment, terminal is made of above-mentioned liquid crystal display die set, and liquid crystal display die set includes display module, should
Display module LED component made from LED component packaging method as described above is constituted；The terminal may include such as mobile phone, put down
It is plate computer, laptop, palm PC, personal digital assistant (Personal Digital Assistant, PDA), convenient
Formula media player (Portable Media Player, PMP), navigation device, wearable device, Intelligent bracelet, pedometer etc.
Mobile terminal with liquid crystal display, and number TV, desktop computer etc. have the fixed terminal of liquid crystal display.
It is to be appreciated that the LED component being prepared by the packaging method of LED component as described above, can be applied to
Various illumination fields are not limited only to backlight module, liquid crystal display die set and terminal, apply also for shooting field, household shines
Bright field, lighting for medical use field, furnishing fields, automotive field, field of traffic etc.:
When applied to shooting field, the flash lamp of camera can be fabricated to；
When applied to home lighting field, floor lamp, desk lamp, headlamp, ceiling lamp, downlight, projecting lamp can be fabricated to
Deng；
When applied to lighting for medical use field, operating lamp, low electromagnetism headlamp etc. can be fabricated to；
Various ornament lamps, such as various color lamps, landscape spotlight, advertising lamp can be fabricated to when applied to furnishing fields；
When applied to automotive field, automobile lamp, automobile indicator etc. can be fabricated to；
When applied to field of traffic, various traffic lights can be made, various street lamps can also be made.
Above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED's in the present embodiment
Using several fields that it is not limited to the above example.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments, right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
Change, there is no necessity and possibility to exhaust all the enbodiments, and it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of LED component, which is characterized in that the device includes the luminous core that pcb board and the separate pcb board are set gradually
Piece, light transmission glue-line；The luminescence chip, light transmission glue-line form luminescence component, and the luminescence component side is provided with side sealing
Glue-line；The light transmission glue-line is at least made of fluorescent adhesive layer, and the fluorescent adhesive layer is made of the baking of liquid fluorescent glue.
2. LED component as described in claim 1, which is characterized in that the fluorescent adhesive layer is affixed on the luminescence chip；It is described
First fluorescent powder, the second fluorescent powder, first fluorescent powder, the distribution of the second fluorescent powder Relatively centralized are included at least by fluorescent adhesive layer
In the fluorescent adhesive layer close to the luminescence chip；The wavelength of transmitted light range of first fluorescent powder is 500-680nm, described
The wavelength of transmitted light range of second fluorescent powder is 500-680nm.
3. a kind of LED component packaging method of LED component as described in claim 1, which comprises the steps of:
S1, at least two different fluorescent powders are mixed with encapsulation glue, liquid fluorescent glue is made；
S2, the first adhesive film is pasted in substrate surface, it is uniformly auxiliary in the first glue film layer surface to put the liquid fluorescent glue, it is described
Fluorescent powder Relatively centralized in liquid fluorescent glue is distributed in close to the first adhesive film side；
S3, the baking liquid fluorescent glue form fluorescent adhesive layer, and light transmission glue-line, the light transmission glue is made based on the fluorescent adhesive layer
Fluorescent adhesive layer in layer is located above first adhesive film and contacts；
S4, removal first adhesive film, the light transmission glue-line is separated with substrate；
S5, the second adhesive film is pasted in substrate surface, the light transmission glue-line is inverted in second adhesive film；
S6, an at least luminescence chip is bonded on the fluorescent adhesive layer surface of the light transmission glue-line, and is toasted, make described shine
The light-emitting surface of chip is adhesively fixed on the fluorescent adhesive layer；
Semi-finished product obtained by S7, the gap cutting step S6 along luminescence chip, obtain single luminescence component；
S8, at least two luminescence components are adhered on pcb board, and carry out curing process, make the luminescence chip of the luminescence component
It is fixed on pcb board；
S9, the filling with sealant water around the luminescence component, sealing glue is around the luminescence component described in baking-curing
It forms side and encapsulates glue-line；
S10, the sealing glue for removing the luminescence component top surface, the gap of adjacent two luminescence components is cut along pcb board
It cuts, obtains LED component.
4. LED component packaging method as claimed in claim 3, which is characterized in that be based on the fluorescent glue in the step S3
Layer obtained light transmission glue-line the step of include:
By the fluorescent adhesive layer directly as the light transmission glue-line；
Or,
S31, top capsulation glue is coated on the fluorescent adhesive layer surface, and is toasted, make the top capsulation glue curing,
The light transmission glue-line is made.
5. the luminous LED component packaging method of single side as claimed in claim 4, which is characterized in that the baking in the step S31
The roasting process for solidifying top capsulation glue are as follows: top capsulation glue is coated with the heating rate of 1-10 DEG C/mi n first
Fluorescent adhesive layer rises to 50-80 DEG C by room temperature, keeps the temperature 1-3h, is then warming up to 100-200 with the heating rate of 1-10 DEG C/mi n
DEG C, keep the temperature 1-9h.
6. the LED component packaging method to shine such as the described in any item single sides of claim 3-5, which is characterized in that the step
The process that the liquid fluorescent glue forms fluorescent adhesive layer is toasted in S3 are as follows: first will be described with the heating rate of 1-10 DEG C/mi n
Liquid fluorescent glue rises to 40-60 DEG C by room temperature, keeps the temperature 0.5-2h, is then warming up to 65-90 with the heating rate of 1-10 DEG C/mi n
DEG C, 0.5-4h is kept the temperature, is finally warming up to 120-200 DEG C with the heating rate of 1-10 DEG C/mi n, keeps the temperature 1-12h.
7. such as the described in any item LED component packaging methods of claim 3-5, which is characterized in that the fluorescent powder includes silicic acid
Salt, aluminate, fluoride, phosphate, nitride or sulphide fluorescent material, the wavelength of transmitted light of the luminescence chip are 230-
480nm；The temperature toasted in the step S6 is 120-180 DEG C.
8. a kind of backlight module, which is characterized in that the backlight module includes LED component encapsulation side as claimed in claim 3
LED component made from method.
9. a kind of liquid crystal display die set, which is characterized in that the liquid crystal display die set includes backlight mould as claimed in claim 8
Group.
10. a kind of terminal, which is characterized in that the terminal includes liquid crystal display die set as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711450875.1A CN109980069A (en) | 2017-12-27 | 2017-12-27 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711450875.1A CN109980069A (en) | 2017-12-27 | 2017-12-27 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109980069A true CN109980069A (en) | 2019-07-05 |
Family
ID=67071936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711450875.1A Pending CN109980069A (en) | 2017-12-27 | 2017-12-27 | LED component and packaging method, backlight module, liquid crystal display die set and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109980069A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| US20150311405A1 (en) * | 2012-12-10 | 2015-10-29 | Citizen Holding Co., Ltd. | Led device and manufacturing method thereof |
| CN105720166A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip preparation method |
| CN105938869A (en) * | 2016-06-21 | 2016-09-14 | 深圳市兆驰节能照明股份有限公司 | Double-layer chip scale package (CSP) light source and manufacturing method thereof |
| CN107275460A (en) * | 2017-07-12 | 2017-10-20 | 惠州市聚飞光电有限公司 | A kind of luminous LED component of one side and method for packing |
-
2017
- 2017-12-27 CN CN201711450875.1A patent/CN109980069A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150311405A1 (en) * | 2012-12-10 | 2015-10-29 | Citizen Holding Co., Ltd. | Led device and manufacturing method thereof |
| CN105720166A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip preparation method |
| CN104916763A (en) * | 2015-05-29 | 2015-09-16 | 广州市鸿利光电股份有限公司 | Packaging method for chip scale packaging LED |
| CN105938869A (en) * | 2016-06-21 | 2016-09-14 | 深圳市兆驰节能照明股份有限公司 | Double-layer chip scale package (CSP) light source and manufacturing method thereof |
| CN107275460A (en) * | 2017-07-12 | 2017-10-20 | 惠州市聚飞光电有限公司 | A kind of luminous LED component of one side and method for packing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101123286A (en) | LED encapsulation structure and method | |
| CN103534822A (en) | Light emitting device and method for manufacturing same | |
| TW200836377A (en) | White light emitting device and white light source module using the same | |
| CN202948972U (en) | White light light emitting diode (LED) module packaging structure | |
| CN202094175U (en) | Far fluorescent powder LED encapsulating structure | |
| CN101937966A (en) | Packaging structure and packaging technology of light emitting diode | |
| CN101230245A (en) | Gluewater for packaging light-emitting diode and uses thereof | |
| CN107275460A (en) | A kind of luminous LED component of one side and method for packing | |
| CN108400220A (en) | A kind of encapsulating structure of miniature LED display module | |
| CN100565000C (en) | Utilize the YAG crystalline ceramics to prepare the method for white light LEDs | |
| CN102683555A (en) | Packaging structure and packaging method for light-emitting diode | |
| CN109273579A (en) | LED lamp bead preparation method | |
| CN102130282A (en) | Packaging structure and packaging method for white LED (light-emitting diode) | |
| CN108987549A (en) | A kind of white chip preparation method | |
| CN102891242A (en) | LED (Light-Emitting Diode) package device | |
| CN201708188U (en) | Ceramic high-power light emitting diode | |
| CN103165797A (en) | Preformed phosphor thin film for white light-emitting diode (LED) thin film packaging and preparation method for thin film | |
| CN109285938A (en) | A kind of chip-scale LED encapsulation method of high heat stability and products thereof | |
| CN109713112A (en) | White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method | |
| CN109713110A (en) | Wafer-level package LED and preparation method thereof | |
| TWM393643U (en) | LED device with coating structure | |
| CN103258936B (en) | A kind of LED package substrate and the method for shape-preserving coating | |
| CN101980385A (en) | Method for encapsulating light-emitting diode (LED), LED and LED illumination device | |
| CN208142212U (en) | White-light LED chip | |
| CN108987556A (en) | A kind of white chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190823 Address after: 516000 No. 6 Lujiao Road, Huinan High-tech Industrial Park, Huizhou City, Guangdong Province Applicant after: Huizhou flying photoelectric Co., Ltd. Address before: 518111, Shenzhen, Guangdong province Longgang District, Pinghu Street goose community Ling goose Industrial Zone No. 4 Applicant before: Shenzhen City Jufei Optoelectronic Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190705 |
|
| RJ01 | Rejection of invention patent application after publication |