CN109971154A - Dielectric materials - Google Patents

Dielectric materials Download PDF

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Publication number
CN109971154A
CN109971154A CN201910318441.9A CN201910318441A CN109971154A CN 109971154 A CN109971154 A CN 109971154A CN 201910318441 A CN201910318441 A CN 201910318441A CN 109971154 A CN109971154 A CN 109971154A
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Prior art keywords
dielectric materials
weight
parts
styrene
following group
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鄞盟松
陈礼君
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LIANMAO (WUXI) ELECTRONICS TECHNOLOGY Co Ltd
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LIANMAO (WUXI) ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201910318441.9A priority Critical patent/CN109971154A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The present invention includes in relation to a kind of dielectric materials: the polyphenylene oxide of (i) 5-50 parts by weight, number average molecular weight (Mn)=1000-4000, weight average molecular weight (Mw)=1000-7000 and Mw/Mn=1.0-1.8；(ii) liquid crystal polymer with allyl of 10-90 parts by weight, Mn=1000-4000, Mw=1000-5000, Mw/Mn=1.0-1.8；(iii) bimaleimide resin of 0.01-15 parts by weight；And the polymeric additive of (iV) 0.01-10 parts by weight, wherein dielectric materials Dk value: 3.4-4.0, Df value: 0.0025-0.0050.The dielectric materials can be applied to semi-solid preparation film or circuit substrate insulating layer, and the characteristic with high Tg, low thermal coefficient of expansion, low water absorption and superior dielectric performance such as dielectric constant (Dk) and dielectric loss (Df).

Description

Dielectric materials
Technical field
The present invention is in relation to a kind of dielectric materials, especially in regard to resin combination.
Background technique
With booming and high-frequency transmission technology the leap of wireless transmission product, existing epoxy resin and phenolic resin The material of system has been unable to satisfy the demand of advanced application, especially high frequency printed circuit board.
The baseplate material of printed circuit board as low-dielectric loss has fluorine resin, but such resin is at high cost, adds Work is not easy, using being confined to military and aerospace applications.In addition, polyphenylene oxide (PPE) resin because have good mechanical property with it is excellent Different dielectric properties, such as dielectric constant (Dk) and dielectric loss (Df), become the resin of the substrate first choice of high frequency printed circuit board Material.
However, polyphenylene oxide is a kind of thermoplastic resin, it is directly used in copper clad laminate and has the disadvantage in that melting is glutinous Degree is high, it is difficult to machine-shaping；Poor solvent resistance easily causes conducting wire attached in the environment of print circuit plates making process solvent cleaning Loosely or fall off；And fusing point is close with glass transition temperature (Tg), it is difficult to bear to weld for 250 DEG C or more in printed circuit board technology Tin operation.Therefore, PPE can just meet the requirement of printed circuit board by thermosetting property modification.
The thermosetting property modification of PPE generally has following two mode: crosslinkable active group is introduced on PPE molecular structure Group, makes thermosetting resin.Alternatively, introducing other thermosetting property trees by modification or netted (IPN) technology of interpenetrating is blended Rouge forms the same with thermosetting compound material of blending.But due to the difference in chemical structure polarity, PPE and those active groups or Often there is compatible bad, processing and is not easy or loses the original excellent characteristics of PPE and limited in thermosetting resin.
Therefore, how to develop with superior dielectric performance and meet other property requirements of printed circuit board, it is such as high The material of the characteristic of Tg, low thermal coefficient of expansion, low water absorption, and it is applied to the manufacture of high frequency printed circuit board, it is existing Stage, printed circuit board material supplier wanted to solve the problems, such as.
Summary of the invention
In view of this, there is superior dielectric performance, low thermal expansion the purpose of the present invention is to provide a kind of dielectric materials Coefficient and low water absorbable.
In order to reach the purpose of aforementioned present invention, proposes a kind of dielectric materials, include: the polyphenyl of (i) 5-50 parts by weight Ether, number average molecular weight (Mn)=1000-4000, weight average molecular weight (Mw)=1000-7000 and Mw/Mn=1.0- 1.8；(ii) liquid crystal polymer with allyl of 10-90 parts by weight, Mn=1000-4000, Mw=1000-5000, Mw/Mn =1.0-1.8；(iii) bimaleimide resin of 0.01-15 parts by weight；And the macromolecule of (iV) 0.01-10 parts by weight adds Add agent.The Dk value of the dielectric materials: 3.4-4.0, Df value: 0.0025-0.0050.
In dielectric materials of the invention, the structural formula of polyphenylene oxide is as follows:
Its
In dielectric materials of the invention, bismaleimide is selected from least one of following group:
Phenylmethane maleimide (Phenylmethane maleimide)
Wherein n=≤1；
Bisphenol-A Diphenyl Ether Bismaleimide (Bisphenol A diphenyl ether bismaleimide)
3,3 '-dimethyl -5,5 '-diethyl -4,4 '-diphenylethane bismaleimide (3,3 '-dimethyl-5,5 ' - diethyl-4,4’-diphenylethane bismaleimide)
1,6- bismaleimide-(2,2,4- trimethyl) hexane (1,6-bismaleimide- (2,2,4- trimethyl)hexane)
In dielectric material, which can be selected from least one of following group:
Dienite (Homopolymers of Butadiene)
Wherein y=70%, x+z=30%；
Butadiene and styrene random copolymer (Random copolymers of butadiene and styrene)
Wherein y=30%, x+z=70%, w=≤1, styrene-content 25wt%；
Maleation polybutadiene (Maleinized Polybutadiene)
Wherein y=28%, x+z=72%, maleic anhydride (MA) content=8wt%；
The copolymer of butadiene, styrene and divinylbenzene；And
Styrene-maleic anhydride copolymer closes object (Styrene Maleic Anhydride copolymer)
Wherein X=1~8, n≤1.
In preferred case, still selectivity addition crosslinking agent (crosslinking in dielectric materials of the invention Agent the crosslink density of resin) is further increased, crosslinking agent can be selected from least one in the following group of 40~80 parts by weight Kind:
Triallyl isocyanate (TAIC)
Triallyl cyanate (TAC)
4- t-butyl styrene (TBS)
And
Front three is for allyl iso cyanurate (TMAIC)
The peroxide of appropriate 10 hour half-life period, 116 DEG C~128 DEG C of temperature range can be added in dielectric materials of the invention Compound is as catalyst (catalyst) or is crosslinking accelerator, for making crosslinking agent and its kind resin that bond effectively occur and make With.The peroxide that the present invention is suitble to, such as cumyl peroxide, α, bis- (tert-butyl peroxy base) diisopropylbenzene (DIPB)s and 2,5- of α '- Dimethyl -2,5- bis(t-butylperoxy) hexin -3.
It can further be added in dielectric materials of the invention inorganic fillings (filler), to increase the heat of dielectric material Conductibility improves the characteristics such as its thermal expansivity and mechanical strength.The inorganic fillings that the present invention is suitble to such as fused silica, Spherical silica, talcum, alumina silicate and soft silica, such as siliesoft, wherein soft silica can be used for dropping Drill point is worn away when low PCB drills.Soft silica has 0.5 μm -10 μm of particle size range.
In order to improve the flame retardancy of dielectric materials of the invention, the present invention still adds halogen-system fire retardant or non-halogen Flame retardant.Halogen-system fire retardant includes, such as decabromodiphenylethane.Non-halogen fire retardant includes, such as by ALBEMARLE Phosphonium flame retardant, the phosphoric acid ester of company's product.Bis- [two (2,6 3,5-dimethylphenyl) phosphoric acid of phosphoric acid ester such as resorcinol Ester], HCA derivative (I), HCA derivative (II) and HCA derivative (III).Bis- [two (2,6 3,5-dimethylphenyl) phosphorus of resorcinol Acid esters] compound with following molecular formula:
〔OC6H3(CH3)2〕2P(O)OC6H4OP(O)〔OC6H3(CH3)2〕2
HCA derivative (I) has to diphenylphosphino dibenzyl structure
HCA derivative (II) has a structure that
When B structure is-CH2- or-CH (CH3)-, m=1 and n=1-3；When B structure is=CHCH=when, m=2 and n =0.
HCA derivative (III) has following structure (XP-7866, Albemarle):
Wherein A is direct key, C6-C12Aryl, C3-C12Naphthenic base or C3-C12Cycloalkenyl, wherein the naphthenic base or Cycloalkenyl can be by C1-C6Alkyl optionally replaces；Each R1、R2、R3And R4It independently is hydrogen, C1-C15Alkyl, C6-C12Aryl, C7-C15Aralkyl or C7-C15Alkaryl；Or R1With R2Or R3With R4Saturated or unsaturated cyclic rings can be formed by being combined together, Wherein the saturated or unsaturated ring can be by C1-C6Alkyl optionally replaces；Each m independently is 1,2,3 or 4；Each R5With R6It independently is hydrogen or C1-C6Alkyl；And each n independently is 0,1,2,3,4 or 5；Condition is when A is aryl or direct key When, n cannot be 0.
Dielectric materials of the invention have the advantages that superior dielectric performance, low thermal coefficient of expansion and low water absorbable.
Detailed description of the invention
Fig. 1 shows the FTIR spectrum figure of the liquid crystal polymer of one embodiment of the invention.
Specific embodiment
In order to which above-mentioned purpose and other purposes of the invention, features and advantages can be clearer and more comprehensible, spy lifts several implementations Detailed description are as follows for example:
Following example 4-1~4-7 is solid in a continuous manufacture in the process half using thermoset composition of the invention Change piece.Substrate is usually made with glass fabric.The glass fabric of web-like enters upper glue groove continuously across a series of idler wheels, Thermoset composition of the invention is housed in slot.Glass fabric is sufficiently infiltrated by resin in upper glue groove, then by metering Roller strikes off extra resin, bakes the regular hour into gluing baking oven, evaporates solvent and make resin solidification to a certain degree, cold But, it winds, forms prepreg.
The superposition alignment of prepreg made of the dipped above-mentioned resin of 2116 glass fabric of electron level by certain number, on Under respectively match the electrolytic copper foil of a loz, in the vacuum press, at pressure 40-900psi, temperature in 30min by 80 DEG C in being risen To 200 DEG C, then in 200 DEG C of hot pressing 120min, it is cooled to room temperature in 30min, certain thickness double face copper is made. Generally, 1.0mm thickness needs 4 2116 prepregs, and 0.8mm needs 4 2116 prepregs, and 2.0mm needs 10 21160 prepregs.
The present invention provides compositions of thermosetting resin and forms stable homogeneous phase solution in low boiling point solvent, is manufactured with it Copper-clad plate carries out glass transition temperature, thermal decomposition temperature, thermally stratified layer time, scolding tin heat resistance (288 referring to IPC-TM-650 DEG C), thermal expansion coefficient, water absorption rate, pyroconductivity, dielectric constant and dielectric loss factor, flame resistance Indexs measure, testing result Show: have high glass-transition temperature (Tg), superior dielectric performance, low thermal coefficient of expansion, low water absorption, high heat resistance impact and The characteristics such as high thermoconductivity, suitable for making the baseplate material of electronic building brick and integrated circuit (IC) encapsulation.
(embodiment)
The influence of table 1-1 PPE resin content
The use ratio relationship of Tg and Dk, Df and PPE are compared, PPE amount is too high or the too low Tg that will lead to is too low, while PPE Amount also have an impact to Dk, Df, when PPE amount is high, Dk, Df are all high, and when PPE amount is low, Dk, Df are all low.It is intended to preferable situation, Dk It is all low with Df.In addition, addition PPE can promote thermal expansion coefficient, therefore thermal expansion coefficient is reduced in a manner of adding BMI.Table 1-1 It is poly- 2,6- dimethyl-Isosorbide-5-Nitrae-phenylate, abbreviation PPO that middle PPE model SA9000, which is by Sabic company product chemical name, (Polyphenylene Oxide) or PPE (Polypheylene ether), also known as polyphenylene oxide or polyhenylene Ether.
The influence of table 1-2 LCP content
Liquid crystal polymer (LCP) usually show it is good chemically, moisture-proof and heat resistance and good mechanical strength, And the film with high level structural integrity can be formed.However, the cost and/or dielectric of the film of exclusive use LCP manufacture are normal Number may be too high for the application of some cushions.
LCP of the invention be selected from a liquid crystals macromolecule (or can be formed select anisotropy dissolve phase thermoplasticity high score Son) it can be processed in molten state.The chemical formula of LCP is simultaneously not particularly restricted, if its liquid crystals macromolecule that can dissolve processing, and Its example may include vinyl-type thermoplastic liquid crystal polymer, aromatic polyamides thermoplastic liquid crystal polymer or aromatic polyester Thermoplastic liquid crystal polymer, and preferably allyl modification is imported by end and/or side.LCP of the invention can be by alkene Propyl carries out radical reaction to form interpenetrating net high-polymer.Embodiment C13 in table 1-2 uses the glass fibers of low Dk Dimension and embodiment C8 and embodiment C9 use E- glass fibre.
Vinyl-type thermoplastic liquid crystal polymer has a structure that
Aromatic polyamides thermoplastic liquid crystal polymer has a structure that
Fig. 1 shows the FTIR spectrum figure of the liquid crystal polymer of one embodiment of the invention.FTIR absorption peak is described as follows, wave Peak 3472cm-1Related-OH or-NH is stretched.Wave crest 3097cm-1Related vinyl or-CH2 asymmetry stretch.Wave crest 2950cm-1、 2919cm-1、2874cm-1And 2842cm-1Related-C ≡ C-H ,-C=CH2 ,-C-CH3 orWave crest 1730cm-1With 1715cm-1In relation to aromatics esters, C=O are stretched, the C=O of saturation is stretched or aromatics C=O.Wave crest 1640cm-1And 1605cm-1Have Pass-C=C or annular C=C.Wave crest 1640cm-1、1570cm-1And 1482cm-1Related-NH bending or asymmetricIt draws It stretches.Wave crest 1459cm-1And 1377cm-1It is relatedMidplane extrusion.Wave crest 1299cm-1、1244cm-1、1188cm-1、 1153cm-1、1043cm-1And 1023cm-1Related-C-O- ,-C-O-C- or-C-C-C-.Wave crest 1377cm-1To 1023cm-1It is related Amide, acid imide ,-CN are stretched.Wave crest 827cm-1to 691cm-1In relation to-C=C- on phenyl ring, the benzene of contraposition or meta position substitution Base or-NH go out plane and wave or individually.By that can find vinyl-type thermoplastic liquid crystal polymer and virtue in the FTIR spectrum figure of Fig. 1 The absorption peak signal of polyamide thermoplastic liquid crystal polymer structure.
The influence of table 2 BMI resin structure and proportional difference
Table 2-connects
The use ratio relationship of thermal expansion coefficient and BMI is compared, the ratio of BMI is higher, and thermal expansion coefficient drops lower.This The comparison of BMI can be divided into three parts in embodiment, and A1~A5 is the one species BMI resin of different proportion, and A6-A8 is identical Ratio but different types of BMI, A9-A15 are the comparisons for mixing a variety of BMI.BMI model 2300,4000,5100, TMH are in table It is produced by big and chemical conversion industry (Daiwakasei Industry CO., LTD), the following table of comparisons of chemical name.
From the point of view of A1~A5, the different proportion of identical type BMI can effectively reduce thermal expansion coefficient, but to water absorption rate The effect that can be improved.From the point of view of A6-A8, different BMI can effectively reduce thermal expansion coefficient, but also have shadow to water absorption rate It rings.In terms of A9-A15, different BMI combinations also can effectively reduce thermal expansion coefficient, can also take into account water absorption rate.Present invention addition The purpose of BMI is thermal expansion coefficient to be reduced, but is improved because water absorption rate also can be with the use ratio and combination difference of BMI, therefore Water absorption rate is reduced again to add polymeric additive.
The influence of table 3 polymeric additive structure and proportional difference
Table 3-connects
The use ratio relationship for comparing water absorption rate and polymeric additive (polymer additives), uses polybutadiene Alkene (Polybutadiene) and styrene-maleic anhydride copolymer close two kinds of object (SMA), when using same polybutadiene, than Example is higher, and water absorption rate is lower, but thermal expansion coefficient also can be with raising.Polybutadiene not of the same race, and collocation SMA is being used to use When, it can be seen that SMA is more effective to water absorption rate is reduced, and can also reduce thermal expansion coefficient, but poor in the performance of the part of Df, and makes SMA can be but made up with polybutadiene in the deficiency of the part Df.Butadiene model Ricon100, Ricon130MA8 in table, Ricon150, Ricon257 are produced by Sartomer, the following table of comparisons of chemical name.
It is to indicate styrene (Styrene) and maleic anhydride (Maleic Anhydride) that SMA, which lists S:M=3:1, in table Ratio, general more common proportional region is 1:1~12:1.
The influence of 4 type of crosslinking agent difference of table
Dielectric materials of the invention further include 40~80 parts by weight selected from least one of following group crosslinking agent: Triallyl cyanate, triallyl isocyanate, 4- t-butyl styrene and front three are for allyl iso cyanurate (TMAIC). Influence of the different crosslinking agents (crosslinking agent) to physical property of the present invention is compared, is used triallyl cyanate (TAC) Tg, thermal expansion coefficient it is poor, Dk, Df and water absorption rate are then general.Using triallyl isocyanate (TAIC) physical property then It is more average.However, being had using TAIC one the disadvantage is that it is volatile during hot pressing.TAIC can be effectively improved using TMAIC High volatile its characteristic can be kept simultaneously in mean level because TMAIC molten point with higher and being not easy to evaporate.It uses The thermal expansion coefficient of 4- t-butyl styrene (TBS), water absorption rate and Df are preferable, but Dk value is then relatively low.
The influence of 5 fire retardant Species differences of table
The part of fire retardant can allow different fire retardants depending on physical property demand.Part containing halogen flame can add The decabromodiphenylethane of 7~15phr (with the calculating of PPE, LCP, BMI, polymeric additive and crosslinking agent summation) (decabromodiphenyl ethane), the part of halogen-free flame-retardant can add 12~14phr (with PPE, LCP, BMI, height Molecular additives and crosslinking agent summation calculate) at least one selected from following group: produced by ALBEMARLE company Phosphonium flame retardant and phosphoric acid ester.Bis- [two (2,6 3,5-dimethylphenyl) phosphates] (Tetrakis of phosphoric acid ester such as resorcinol (2,6-dimethylphenyl) 1,3-phenylene bisphosphate), HCA derivative (I), HCA derivative (II) and HCA derivative (III), wherein the HCA derivative (III) with ProductName XP7866 includes organic filler material, 10-15% phosphorus. XP7866 has 0.5 μm -60 μm of particle size range.
The influence of table 6 inorganic fillings type and proportional difference
Table 6-connects
As for inorganic fillings, depending on physical property demand, can add 8~50phr (with PPE, LCP, BMI, polymeric additive and Crosslinking agent summation calculates) different inorganic fillings, such as fused silica, spherical silica and soft silica, Such as siliesoft, wherein soft silica can be used for reducing PCB drilling when drill point wear away, comparing embodiment F1-F3 with F8-F9.Soft silica has 0.5 μm -10 μm of particle size range.The fused silica of same ratio, spherical silica In the case where, using spherical silica, Dk, Df are all low compared with using fused silica.
The influence of table 7 crosslinking accelerator type and proportional difference
Table 7-connects
It is (total with PPE, LCP, BMI, polymeric additive and crosslinking agent that dielectric materials of the invention further include 2~8phr And calculate) 116 DEG C~128 DEG C of 10 hours half life temperature ranges of peroxide.Crosslinking accelerator (catalyst (catalysts)) part can allow different crosslinking accelerators depending on physical property demand.The present invention, which can be used 10 hours half, to decline Phase, 116 DEG C~128 DEG C of temperature range of peroxide preferably use 10 hour half-life period, 119 DEG C of temperature of peroxide.
Dielectric materials of the present invention are using PPE but do not add epoxy resin because addition epoxy resin will lead to Dk/Df without Method reaches desired value, and reason, which is epoxy resin after ring opening, can generate excessive OH base, and then causes Dk and Df value can not It reduces.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.

Claims (8)

1. a kind of dielectric materials, which is characterized in that it includes:
(i) polyphenylene oxide resin of 5-50 parts by weight, number average molecular weight (Mn)=1000-4000, weight average molecular weight (Mw)=1000-7000 and Mw/Mn=1.0-1.8, wherein the structural formula of polyphenylene oxide resin is as follows:
Y is at least one carbon, at least one oxygen, at least one phenyl ring or combination of the above；
(ii) liquid crystal polymer with allyl of 10-90 parts by weight, Mn=1000-4000, Mw=1000-5000, Mw/Mn =1.0-1.8；
(iii) bimaleimide resin of 0.01-15 parts by weight；And
(iV) polymeric additive of 0.01-10 parts by weight；
Wherein dielectric materials Dk value: 3.4-4.0, Df value: 0.0025-0.0050；
The bimaleimide resin is selected from least one of following group:
Phenylmethane maleimide (Phenylmethane maleimide)
Wherein n≤1；
Bisphenol-A Diphenyl Ether Bismaleimide
3,3 '-dimethyl -5,5 '-diethyl -4,4 '-diphenylethane bismaleimide
1,6- bismaleimide-(2,2,4- trimethyl) hexane
The polymeric additive is selected from least one of following group:
Dienite
Wherein y=70%, x+z=30%；
Butadiene and styrene random copolymer
Wherein y=30%, x+z=70%, w=≤1, styrene-content=25wt%；
Maleation polybutadiene
Wherein y=28%, x+z=72%, maleic anhydride content=8wt%；
The copolymer of butadiene, styrene and divinylbenzene；And
Styrene-maleic anhydride copolymer closes object
Wherein X=1~8, n≤1.
2. dielectric materials as described in claim 1, which is characterized in that further include 40~80 parts by weight is selected from following group At least one of crosslinking agent:
Triallyl isocyanate (TAIC)
Triallyl cyanate (TAC)
4- t-butyl styrene (TBS)
And
Front three is for allyl iso cyanurate (TMAIC)
3. dielectric materials as claimed in claim 2, which is characterized in that further include 10 hours half life temperatures of 2~8phr The peroxide that 116 DEG C~128 DEG C of range, wherein 2~8phr is total with PPE, LCP, BMI, polymeric additive and crosslinking agent And calculating.
4. dielectric materials as claimed in claim 3, which is characterized in that the peroxide system in following group at least A kind of crosslinking accelerator: cumyl peroxide, α, bis- (tert-butyl peroxy base) diisopropylbenzene (DIPB)s of α '-and 2,5- dimethyl -2,5- are double (t-butylperoxy) hexin -3.
5. dielectric materials as claimed in claim 2, which is characterized in that further include 8~50phr in following group extremely Few a kind of inorganic fillings: fused silica, spherical silica, talcum, alumina silicate and soft silica；Wherein 8~ 50phr is with the calculating of PPE, LCP, BMI, polymeric additive and crosslinking agent summation.
6. dielectric materials as claimed in claim 5, which is characterized in that the soft silica has 0.5 μm of particle size range- 10μm。
7. dielectric materials as claimed in claim 2, which is characterized in that further include 12~14phr and be selected from following group extremely It is one of few: phosphonium flame retardant and phosphate；Wherein 12~14phr is with PPE, LCP, BMI, polymeric additive and crosslinking Agent summation calculates.
8. dielectric materials as claimed in claim 7, which is characterized in that the phosphonium flame retardant be selected from by HCA derivative (I), The group of HCA derivative (II) and HCA derivative (III) composition,
HCA derivative (I) has to diphenylphosphino dibenzyl structure:
HCA derivative (II) has a structure that
When B structure is-CH2Or-CH (CH3)-when, m=1 and n=1-3；When B structure is=CHCH=when, m=2 and n=0； and
HCA derivative (III) has following structure (XP-7866, Albemarle):
Wherein A is direct key, C6-C12Aryl, C3-C12Naphthenic base or C3-C12Cycloalkenyl, wherein the naphthenic base or cyclenes Base can be by C1-C6Alkyl optionally replaces；Each R1、R2、R3And R4It independently is hydrogen, C1-C15Alkyl, C6-C12Aryl, C7-C15 Aralkyl or C7-C15Alkaryl；Or R1With R2Or R3With R4Saturated or unsaturated cyclic rings can be formed by being combined together, wherein The saturated or unsaturated ring can be by C1-C6Alkyl optionally replaces；Each m independently is 1,2,3 or 4；Each R5And R6Solely It is on the spot hydrogen or C1-C6Alkyl；And each n independently is 0,1,2,3,4 or 5；Condition is the n when A is aryl or direct key It cannot be 0.
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