CN109967812A - A kind of soldering connecting method of CoCrCuFeNi high-entropy alloy - Google Patents
A kind of soldering connecting method of CoCrCuFeNi high-entropy alloy Download PDFInfo
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- CN109967812A CN109967812A CN201910272585.5A CN201910272585A CN109967812A CN 109967812 A CN109967812 A CN 109967812A CN 201910272585 A CN201910272585 A CN 201910272585A CN 109967812 A CN109967812 A CN 109967812A
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- China
- Prior art keywords
- entropy alloy
- cocrcufeni
- connecting method
- solder
- soldering
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
The invention discloses a kind of soldering connecting methods of CoCrCuFeNi high-entropy alloy, soldered CoCrCuFeNi high-entropy alloy plate is cleaned by ultrasonic, the solder being made of Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn is filled between two blocks of high-entropy alloy plates to be welded, high-entropy alloy plate is placed in vacuum drying oven and heats, keep the temperature, the soldering connection of CoCrCuFeNi high-entropy alloy is completed after natural cooling.The brazed rear alloy intensity with higher and plasticity of CoCrCuFeNi high-entropy alloy of the present invention, it is ensured that alloy can be connected effectively during engineer application.
Description
Technical field
The present invention relates to a kind of soldering connection technology, especially a kind of soldering that can be realized CoCrCuFeNi high-entropy alloy
Connection method.
Background technique
High-entropy alloy is a kind of novel alloy system.It breaches traditional material based on a certain alloying element
Design of material theory, entire alloy are made of the equal element of a variety of atomic ratios, and finally formed material has high mixing
Entropy.This high entropy of mixing, promotes the mixing between element, so that alloy phase composition forms single solid solution structure, it is such as single
One body-centered cubic or face-centred cubic structure or the mixed structure of the two, it is suppressed that the formation of weld metal zone brittle intermetallic thing.This
Kind metal structure shows to make it have the incomparable performance of some conventional alloys in addition to excellent mechanical property, such as high-strength
Degree, high rigidity, abrasion resistant and corrosion resistant, high thermal resistance, resistance, excellent magnetic performance.CoCrCuFeNi high-entropy alloy is quilt earliest
The high-entropy alloy system of research, the good toughness of the alloy is slight moderate, there is certain application prospect.But the related alloy
The work carried out in terms of soldering connection is less, limits the application of the alloy.
Summary of the invention
The object of the present invention is to provide a kind of soldering connecting methods of CoCrCuFeNi high-entropy alloy.Ensure that alloy exists
It can effectively be connected during engineer application.
Technical solution of the present invention: a kind of soldering connecting method of CoCrCuFeNi high-entropy alloy, to soldered
CoCrCuFeNi high-entropy alloy plate is cleaned by ultrasonic, the solder that will be made of Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn
It is filled between two blocks of high-entropy alloy plates to be welded, high-entropy alloy plate is placed in vacuum drying oven and heats, keep the temperature, it is i.e. complete after natural cooling
At the soldering connection of CoCrCuFeNi high-entropy alloy.
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, by Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si,
In the solder of Sn composition, each component is according to mass percent are as follows: Co 3-6%, Cr 3-6%, Cu 40-60%, Fe 3-6%,
Ni 3-6%, Mn 0.01-0.1%, Ag 0.1-0.5%, Si 0.05-0.4%, Sn 0.1-1.5%, surplus Zn.
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, by Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si,
In the solder of Sn composition, each component is according to mass percent are as follows: Co 4-5%, Cr 4-5%, Cu 45-55%, Fe 4-5%,
Ni 4-5%, Mn 0.03-0.08%, Ag 0.2-0.4%, Si 0.07-0.34%, Sn 0.3-1.2%, surplus Zn.
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, by Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si,
In the solder of Sn composition, each component is according to mass percent are as follows: Co 4.5%, Cr 4.5%, Cu 50%, Fe 4.5%, Ni
4.5%, Mn 0.05%, Ag 0.3%, Si 0.2%, Sn 0.7%, surplus Zn.
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, by high-entropy alloy plate be placed in vacuum drying oven heating,
Heat preservation, holding temperature are 600-1200 DEG C, and soaking time is 10-60 minutes, vacuum degree 10-4-1Pa。
Alloy sheets are placed in vacuum drying oven and heat, keep the temperature by the soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned,
Holding temperature is 900 DEG C, and soaking time is 30 minutes, vacuum degree 10-3Pa。
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, in solder filling process, it should be ensured that alloy sheets table
Face is covered by solder completely, and is compacted.
The soldering connecting method of CoCrCuFeNi high-entropy alloy above-mentioned, high-entropy alloy plate carry out ultrasonic cleaning the time be 30
Minute.
Beneficial effects of the present invention: compared with prior art, the soldering connection of CoCrCuFeNi high-entropy alloy of the invention
Method postwelding intensity with higher and plasticity.Applicant distinguishes the CoCrCuFeNi high entropy that testing example 1,2,3 is welded
Alloy and high-entropy alloy strength of parent and plasiticity index, every group survey 10 times, test result is averaged, and records test result, is seen
Table 1.
1 the performance test results of table
As seen from table, by embodiment 1,2 and the CoCrCuFeNi high-entropy alloy mechanical property of 3 postweldings close to base material.
To sum up, the brazed rear alloy intensity with higher and plasticity of CoCrCuFeNi high-entropy alloy of the present invention, it is ensured that
Alloy can be connected effectively during engineer application.
Specific embodiment
Below with reference to embodiment, the present invention is further illustrated, but is not intended as the foundation limited the present invention.
The embodiment of the present invention 1:
Having a size of 250 × 50 × 3 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections.
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, solder is uniform
Another block of alloy is pressed on solder by the surface for spreading into one of alloy.By to-be-welded pieces be put into vacuum resistance furnace into
Row heating, vacuum degree 10-4Pa.After being warming up to 900 DEG C, heat preservation 30 minutes, welding is completed in furnace cooling.
Solder ingredient: Co 4.5%, Cr 4.5%, Cu 50%, Fe 4.5%, Ni 4.5%, Mn 0.05%, Ag
0.3%, Si 0.2%, Sn 0.7%, surplus Zn.
The embodiment of the present invention 2:
Having a size of 300 × 10 × 5 and 400 × 10 × 4 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections；
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, according to embodiment 1
Mode solder is sprawled between two pieces of alloy sheets, be compacted.Part to be welded is put into the vacuum electric furnace of induction heating, vacuum degree
For 1Pa, it is brought rapidly up to 950 DEG C, heat preservation powers off after 50 minutes, and it is cooling, complete welding.
Solder ingredient: Co 3%, Cr 3%, Cu 40%, Fe 4.5%, Ni 3%, Mn 0.09%, Ag 0.5%, Si
0.4%, Sn 1.4%, surplus Zn.
The embodiment of the present invention 3:
Having a size of 800 × 100 × 3 and 20 × 100 × 3 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections；
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, according to embodiment 1
Mode solder is sprawled between two pieces of alloy sheets, be compacted.Part to be welded is put into the vacuum electric furnace of resistance heating, vacuum degree
It is 10-3Pa is brought rapidly up to 1100 DEG C, and heat preservation powers off after twenty minutes, cooling, completes welding.
Solder ingredient: Co 6%, Cr 6%, Cu 60%, Fe 6%, Ni 6%, Mn 0.01%, Ag 0.1%, Si
0.05%, Sn 0.1%, surplus Zn.
The embodiment of the present invention 4:
Having a size of 10 × 60 × 3 and 250 × 60 × 3 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections；
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, according to embodiment 1
Mode solder is sprawled between two pieces of alloy sheets, be compacted.Part to be welded is put into the vacuum electric furnace of Elema heating, vacuum
Degree is 10-2Pa is brought rapidly up to 600 DEG C, and heat preservation powers off after sixty minutes, cooling, completes welding.
Solder ingredient: Co 3.1%, Cr 3.3%, Cu 41%, Fe 3.4%, Ni 3.5%, Mn 0.1%, Ag
0.5%, Si 0.4%, Sn 0.7%, surplus Zn.
The embodiment of the present invention 5:
Having a size of 80 × 70 × 3 and 200 × 70 × 3 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections；
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, according to embodiment 1
Mode solder is sprawled between two pieces of alloy sheets, be compacted.Part to be welded is put into the vacuum electric furnace of Si-Mo rod heating, vacuum
Degree is 10-1Pa is brought rapidly up to 1200 DEG C, and heat preservation powers off after ten minutes, cooling, completes welding.
Solder ingredient: Co 4%, Cr 5%, Cu 50%, Fe 4%, Ni 6%, Mn 0.07%, Ag 0.4%, Si
0.3%, Sn 1.2%, surplus Zn.
The embodiment of the present invention 6:
Having a size of 250 × 50 × 3 millimeters of two pieces of CoCrCuFeNi high-entropy alloy soldering connections；
Welding procedure: high-entropy alloy surface is polished flat, after being cleaned by ultrasonic 30 minutes using acetone, according to embodiment 1
Mode solder is sprawled between two pieces of alloy sheets, be compacted.Part to be welded is put into the vacuum electric furnace of Si-Mo rod heating, vacuum
Degree is 10-3Pa is brought rapidly up to 900 DEG C, and heat preservation powers off after 30 minutes, cooling, completes welding.
Solder ingredient: Co 4.5%, Cr 4.5%, Cu 50%, Fe 4.5%, Ni 4.5%, Mn 0.05%, Ag
0.3%, Si 0.2%, Sn 0.7%, surplus Zn.
Claims (8)
1. a kind of soldering connecting method of CoCrCuFeNi high-entropy alloy, it is characterised in that: to soldered CoCrCuFeNi high
Entropy alloy sheets are cleaned by ultrasonic, by the solder being made of Co, Cr, Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn be filled in two pieces to
It welds between high-entropy alloy plate, high-entropy alloy plate is placed in vacuum drying oven and heats, keep the temperature, CoCrCuFeNi is completed after natural cooling
The soldering connection of high-entropy alloy.
2. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 1, it is characterised in that: by Co, Cr,
In the solder of Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn composition, each component is according to mass percent are as follows: Co 3-6%, Cr 3-6%,
Cu 40-60%, Fe 3-6%, Ni 3-6%, Mn 0.01-0.1%, Ag 0.1-0.5%, Si 0.05-0.4%, Sn 0.1-
1.5%, surplus Zn.
3. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 2, it is characterised in that: by Co, Cr,
In the solder of Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn composition, each component is according to mass percent are as follows: Co 4-5%, Cr 4-5%,
Cu 45-55%, Fe 4-5%, Ni 4-5%, Mn 0.03-0.08%, Ag 0.2-0.4%, Si 0.07-0.34%, Sn
0.3-1.2%, surplus Zn.
4. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 3, it is characterised in that: by Co, Cr,
In the solder of Cu, Fe, Ni, Zn, Mn, Ag, Si, Sn composition, each component is according to mass percent are as follows: Co 4.5%, Cr 4.5%,
Cu 50%, Fe 4.5%, Ni 4.5%, Mn 0.05%, Ag 0.3%, Si 0.2%, Sn 0.7%, surplus Zn.
5. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 1, it is characterised in that: close high entropy
Golden plate, which is placed in vacuum drying oven, to be heated, keeps the temperature, and holding temperature is 600-1200 DEG C, and soaking time is 10-60 minutes, and vacuum degree is
10-4-1Pa。
6. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 1, it is characterised in that: by alloy sheets
It is placed in vacuum drying oven and heats, keeps the temperature, holding temperature is 900 DEG C, and soaking time is 30 minutes, vacuum degree 10-3Pa。
7. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 1, it is characterised in that: solder filling
In the process, it should be ensured that alloy plate surface is covered by solder completely, and is compacted.
8. the soldering connecting method of CoCrCuFeNi high-entropy alloy according to claim 1, it is characterised in that: high-entropy alloy
Plate carry out ultrasonic cleaning the time be 30 minutes.
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| CN201910272585.5A CN109967812B (en) | 2019-04-04 | 2019-04-04 | Brazing connection method of CoCrCuFeNi high-entropy alloy |
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| CN201910272585.5A CN109967812B (en) | 2019-04-04 | 2019-04-04 | Brazing connection method of CoCrCuFeNi high-entropy alloy |
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Cited By (4)
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| CN110405300A (en) * | 2019-07-29 | 2019-11-05 | 浙江工业大学 | A method of high intensity AlCoCrFeNi high-entropy alloy connector is prepared using Ni base solder |
| CN111101045A (en) * | 2020-01-03 | 2020-05-05 | 余果润 | High-entropy alloy material and preparation method thereof |
| CN111922468A (en) * | 2020-07-07 | 2020-11-13 | 安徽工程大学 | SiC ceramic brazing method based on multi-element high-entropy alloy and brazing material |
| CN115106675A (en) * | 2022-08-09 | 2022-09-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
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| CN115106675A (en) * | 2022-08-09 | 2022-09-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
| CN115106675B (en) * | 2022-08-09 | 2024-02-27 | 哈尔滨工业大学（威海） | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
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