CN109913157B - Preparation method of environment-friendly organic silicon-acrylate adhesive with light diffusion function, product and application thereof - Google Patents
Preparation method of environment-friendly organic silicon-acrylate adhesive with light diffusion function, product and application thereof Download PDFInfo
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- CN109913157B CN109913157B CN201910241351.4A CN201910241351A CN109913157B CN 109913157 B CN109913157 B CN 109913157B CN 201910241351 A CN201910241351 A CN 201910241351A CN 109913157 B CN109913157 B CN 109913157B
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- environment
- light diffusion
- friendly
- acrylate
- diffusion function
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 84
- 239000000853 adhesive Substances 0.000 title claims abstract description 77
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 77
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 37
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 16
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 239000011253 protective coating Substances 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 238000002834 transmittance Methods 0.000 claims abstract description 6
- -1 alkenyl aromatic compound Chemical class 0.000 claims description 33
- 239000000178 monomer Substances 0.000 claims description 31
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000003999 initiator Substances 0.000 claims description 16
- 150000001336 alkenes Chemical class 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 239000002270 dispersing agent Substances 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 8
- 239000004005 microsphere Substances 0.000 claims description 8
- 239000003921 oil Substances 0.000 claims description 8
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 claims description 5
- 239000012966 redox initiator Substances 0.000 claims description 5
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 claims description 4
- 241000220223 Fragaria Species 0.000 claims description 4
- 235000016623 Fragaria vesca Nutrition 0.000 claims description 4
- 235000011363 Fragaria x ananassa Nutrition 0.000 claims description 4
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 150000005690 diesters Chemical class 0.000 claims description 4
- 238000004821 distillation Methods 0.000 claims description 4
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical group C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 150000001993 dienes Chemical class 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 claims description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000012752 auxiliary agent Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 claims description 2
- 238000007142 ring opening reaction Methods 0.000 claims description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 238000001132 ultrasonic dispersion Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000003860 storage Methods 0.000 abstract description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- SLDXSSRFNABVCN-UHFFFAOYSA-N 3-diethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[SiH](OCC)CCCOC(=O)C(C)=C SLDXSSRFNABVCN-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000005456 alcohol based solvent Substances 0.000 description 3
- 239000004210 ether based solvent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- IJNRGJJYCUCFHY-UHFFFAOYSA-N ethenyl-dimethoxy-phenylsilane Chemical compound CO[Si](OC)(C=C)C1=CC=CC=C1 IJNRGJJYCUCFHY-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- OBRYRJYZWVLVLF-UHFFFAOYSA-N 1-ethenyl-4-ethoxybenzene Chemical compound CCOC1=CC=C(C=C)C=C1 OBRYRJYZWVLVLF-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 1
- SMSKIVCCLIQXFD-UHFFFAOYSA-N 1-tert-butyl-3-ethenylbenzene Chemical compound CC(C)(C)C1=CC=CC(C=C)=C1 SMSKIVCCLIQXFD-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- NDSYZZUVPRGESW-UHFFFAOYSA-N 2-(2-octoxyethoxy)ethanol Chemical compound CCCCCCCCOCCOCCO NDSYZZUVPRGESW-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- BZCWFJMZVXHYQA-UHFFFAOYSA-N 3-dimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[SiH](OC)CCCOC(=O)C(C)=C BZCWFJMZVXHYQA-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- PMZXJPLGCUVUDN-UHFFFAOYSA-N 4-ethenyl-1,2-dimethylbenzene Chemical compound CC1=CC=C(C=C)C=C1C PMZXJPLGCUVUDN-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical class CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229960000892 attapulgite Drugs 0.000 description 1
- UKZUEVUVZSWEPG-UHFFFAOYSA-N benzoyl benzenecarboperoxoate cobalt Chemical compound [Co].C(C1=CC=CC=C1)(=O)OOC(C1=CC=CC=C1)=O UKZUEVUVZSWEPG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- 238000012674 dispersion polymerization Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 239000012934 organic peroxide initiator Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052625 palygorskite Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XQIZMIMBOWVMCX-UHFFFAOYSA-N tris(dimethylsilyloxy)-ethenylsilane Chemical compound C[SiH](C)O[Si](O[SiH](C)C)(O[SiH](C)C)C=C XQIZMIMBOWVMCX-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a preparation method of an environment-friendly organic silicon-acrylate adhesive with a light diffusion function, and a product and application thereof. A preparation method of an environment-friendly organic silicon-acrylate adhesive with a light diffusion function comprises the following components: (1) 40-99 wt% of environment-friendly acrylate resin, (2) 0-50 wt% of environment-friendly solvent, and (3) 1-30 wt% of light diffusant with the particle size of 100 nm-100 mu m, and the light diffusant is obtained by stirring and mixing, and the product prepared by the method has the advantages of low price, moisture absorption resistance, good heat resistance, single component, rapid curing, good storage stability, high bonding strength, convenient gluing and the like; the material integrates the functions of bonding and light diffusion, has the haze of more than 80 percent and the transmittance of more than 90 percent, and can be applied to light diffusion function protective coatings and light diffusion function protective adhesives of lighting equipment, liquid crystal display and LED equipment.
Description
Technical Field
The invention relates to an organic silicon-acrylate adhesive with a light diffusion function, in particular to a preparation method, a product and an application of an environment-friendly organic silicon-acrylate adhesive with the light diffusion function.
Background
The light diffusion material has wide application in the illumination field and the display field, is an important component of a Liquid Crystal Display (LCD) backlight module, and has good light transmission and light scattering properties. In the field of liquid crystal displays, since LCDs do not emit light themselves, additional light sources are required. The common LED point light source has high brightness, and a dazzling feeling can be generated when the LED point light source is directly viewed. The point light source can be converted into the area light source by using the light diffusion material, so that the light uniformizing effect is achieved, the light source is more uniform, softer and fuller, and the light uniformizing method has important significance for improving the use experience of the liquid crystal display.
The adhesive is widely used for bonding, sealing, encapsulating and coating protection. In particular, in the field of electric appliances, in order to ensure that a circuit board, an electronic device, an LED chip, and the like maintain good insulating properties during use, avoid external impact and damage, and are not affected by machinery, heat, moisture, dust, oil smoke, corrosive gas, and the like, it is necessary to coat a protective coating or perform packaging treatment on the circuit board, the electronic device, the LED chip, and the like. The currently commonly used adhesives comprise an epoxy resin type adhesive, an organic silicon adhesive, a solvent type polyurethane adhesive and a solvent type phenolic adhesive, wherein the organic silicon adhesive comprises room temperature vulcanized silicone rubber or organic silicon gel which is used for encapsulating, bonding and sealing electronic and electrical elements; the epoxy resin adhesive has good bonding performance and low price, but is easy to crack and has poor ultraviolet resistance and temperature resistance; solvent-based polyurethane or phenolic resin adhesives are severely restricted in use today with increasingly stringent environmental requirements due to the large amount of organic solvents.
With the development of the electronic industry toward miniaturization and precision and the increasing demand for environmental protection, the application of adhesives in the electronic industry is receiving more and more attention in the production of electronic components, integrated circuits, liquid crystal displays, electronic packages, LED packages, printed circuits, and the like, and becomes a hot spot in research and development nowadays. The demand of high-performance adhesives is increasing day by day, the application prospect is very wide, and for the electronic industry which is rapidly developed at present, the development of adhesive products which have high cost performance, moisture absorption resistance, good heat resistance, single component, rapid curing, good storage stability, high bonding strength and convenient gluing is urgently needed.
In recent years, as the demand of people for computers, ipads, mobile phones, liquid crystal televisions and the like increases, the flat panel display industry has made higher demands on backlight modules, and the demand for light diffusion materials has also increased significantly. The adhesive is not easy to crack, does not pollute the environment and is safe to use, and has stronger application value and practical significance.
Patent numbers: ZL201610280235.X discloses an organosilicon modified acrylate adhesive and a preparation method thereof, and relates to an acrylate resin adhesive and a preparation method thereof. The invention aims to solve the problems of low bonding strength and narrow application range of the organic silicon modified acrylate resin adhesive prepared by the prior art. The organic silicon modified acrylate adhesive is prepared from organic silicon modified acrylate, an initiator, an accelerator and an auxiliary accelerator; the organic silicon modified acrylate is prepared from acrylate, ethyl orthosilicate, titanate catalyst and acid catalyst. The preparation method comprises the following steps: and mixing the organic silicon modified acrylate, the initiator, the accelerator and the auxiliary accelerator, and then uniformly stirring to obtain the organic silicon modified acrylate adhesive. The invention is mainly used for preparing the organic silicon modified acrylate adhesive.
Application No.: 201210344910.2 discloses a method for preparing light diffusion material by using soft silicon as additive, which relates to the technical field of new material and material modification, and the soft silicon is used as light diffusion agent and added into organic silicon material, thermosetting/light curing resin or thermoplastic resin material to endow the material with light diffusion function. The light diffusion material is prepared by taking the soft silicon as the light diffusion agent, the produced light diffusion material has good quality and guaranteed quality, the production technology of the soft silicon realizes industrialization and has low price, and the light diffusion material produced by taking the soft silicon as the light diffusion agent not only can change the situation of long-term dependence on the light diffusion agent which has high price in import and abroad, but also can reduce the production cost and improve the market competitiveness.
Patent numbers: ZL201010158420.4 discloses an adhesive for a polaroid, which comprises a solvent type acrylate pressure-sensitive adhesive and diffusion particles with the average particle size of 1-20 mu m, wherein the mass ratio of the diffusion particles to the pressure-sensitive adhesive is 0.001-0.1: 1, and the invention further discloses the polaroid.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a preparation method of an environment-friendly organic silicon-acrylate adhesive with a light diffusion function, which does not need large investment on the existing equipment and can prepare a product with good heat resistance, good weather resistance and no pollution.
Still another object of the present invention is to: provides an environment-friendly organic silicon-acrylate adhesive with light diffusion function obtained by the method. So as to overcome the problems that the prior adhesive is easy to crack and pollutes the environment.
The invention also aims to provide the application of the environment-friendly organic silicon-acrylate adhesive with the light diffusion function, integrates the bonding function and the light diffusion function, and provides a protective bonding material with the light diffusion function for the application process of liquid crystal screens, LED equipment and the like.
The purpose of the invention is to adopt the following technical scheme: a preparation method of an environment-friendly organic silicon-acrylate adhesive with a light diffusion function comprises the following components: (1) 40-99 wt% of environment-friendly acrylate resin, (2) 0-50 wt% of environment-friendly solvent, (3) 1-30 wt% of light diffusant with the grain diameter of 100 nm-100 mu m, and stirring and mixing the materials to obtain the light diffusant,
the environment-friendly acrylate resin is prepared by dissolving 25-65 wt% of acrylate monomer or acrylic acid modified epoxy resin, 10-40 wt% of vinyl organosilicon monomer, 5-40 wt% of olefin monomer and 0-30 wt% of alkenyl aromatic compound monomer in 20-60 wt% of environment-friendly solvent, and copolymerizing by adopting 0.1-1 wt% of thermal initiator or redox initiator by a solution polymerization method to obtain the environment-friendly acrylate resin with the solid content of 20-80 wt%;
the preparation method of the environment-friendly organic silicon-acrylate adhesive with the light diffusion function comprises the following specific steps:
(1) adding acrylate monomers or acrylic acid modified epoxy resin, vinyl organic silicon monomers, olefin monomers, alkenyl aromatic compound monomers and optional blending resin into a solvent at the temperature of not higher than 100 ℃, mixing, and uniformly stirring at the rotating speed of 1500rpm of 100-;
(2) adding a thermal initiator or a redox initiator and an unnecessary auxiliary agent into an unnecessary solvent for mixing, and uniformly stirring at the rotating speed of 100-5000 rpm;
(3) adding the product obtained in the step (1) into the product obtained in the step (2), and reacting for 1-100h at the rotating speed of 1500rpm and 100-.
(4) And (3) uniformly mixing the product obtained by the reaction in the step (3) with a light diffusion agent at the rotating speed of 100-2000rpm to obtain the environment-friendly organic silicon-acrylate adhesive with the light diffusion function.
The thermal initiator or redox initiator may be, for example, an organic peroxide initiator, an azo initiator, an organic peroxide-reducing agent (Fe)2+、Co2+) One of isovalent ions and organic peroxide-tertiary amine organic compounds.
On the basis of the scheme, the acrylic ester monomer is one or more of C3-C45 alkyl acrylate, alkyl methacrylate, acrylic acid, methacrylic acid, hydroxyalkyl acrylate and hydroxyalkyl methacrylate monomers; the method specifically comprises the following steps: acrylic acid, ethyl acrylate, butyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, methyl 2-cyanoacrylate, methacrylic acid, methyl methacrylate, butyl methacrylate, pentyl methacrylate, 2-methyl methacrylate, propyl acrylate, pentyl acrylate, hexyl acrylate, dimethylaminoethyl methacrylate, n-octyl methacrylate, etc., hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, etc.;
the acrylic acid modified epoxy resin is one or two of epoxy resin with double bonds obtained by ring-opening reaction of acrylic acid or methacrylic acid and bisphenol A type epoxy resin, bisphenol F type epoxy resin and alicyclic epoxy resin;
the alkene organosilicon monomer is one or more of vinyl siloxane containing C7-C40;
the olefin monomer is one or more of C4-C45 olefin, diolefin, cycloolefine, cyclodiolefine and halogenated olefin monomers;
the alkenyl aromatic compound monomer is one or more of C8-C45 alkenyl aromatic compounds, and specifically comprises vinyltrimethoxysilane, vinyltriethoxysilane, vinylphenyldimethoxysilane, vinyltris (dimethylsiloxy) silane, 1- (trimethylsiloxane) cyclohexene, allyldisiloxane, methacryloxypropyldiethoxysilane, methacryloxypropyldimethoxysilane, tetramethyltetravinylcyclotetrasiloxane and 1-methacryloxypropyl-3, 5, 7-trivinyl 1,3,5, 7-tetramethylcyclotetrasiloxane and the like;
the alkenyl aromatic monomer specifically includes styrene, α -methylstyrene, 3-tert-butylstyrene, 3, 4-dimethylstyrene, 4-ethoxystyrene, divinylbenzene, etc., but is not limited to these alkenyl aromatic monomers;
the olefin monomer is one or more of C2-C45 olefin, diene, cycloolefin and cyclodiolefin. Specifically included are ethylene, butadiene, isobutylene, cyclopentadiene and chlorinated propenes.
Furthermore, the solid content of the environment-friendly acrylate resin is 40-80 wt%.
On the basis of the scheme, the environment-friendly solvent is environment-friendly, non-toxic and harmless and can be one or more of C3-C50 alcohol solvents, alcohol ether solvents, pyrrolidone solvents, environment-friendly solvent oil with the distillation range of more than 230 ℃ and C6-C20 diacid diester solvents.
Further, the environment-friendly solvent is one or more of C3-C10 alcohol solvents, C4-C10 propylene glycol ether solvents, C5-C15 propylene glycol ether alkanoate solvents, environment-friendly solvent oil with the distillation range of more than 230 ℃, pyrrolidone solvents and C6-C10 diacid diester solvents.
Specifically, the C3-C50 alcohol solvents include, for example, propylene glycol, glycerol (glycerin), diethylene glycol (diethylene glycol), triethylene glycol (triethylene glycol), tetraethylene glycol, 2-ethyl-1, 3-hexanediol, 2-methyl-2, 4-pentanediol, 2-ethyl-2, 6-pentanediol, benzyl alcohol, etc.; alcohol ether solvents include, for example, tetrahydrofurfuryl alcohol, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol phenyl ether, propylene glycol monomethyl ether, and the like; the propylene glycol ether alkanoate solvents comprise propylene glycol butyl ether acetate, propylene glycol phenyl ether, diethylene glycol monoethyl ether, diethylene glycol butyl ether, diethylene glycol octyl ether, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, dipropylene glycol methyl ether, triethylene glycol butyl ether, tripropylene glycol butyl ether, triethylene glycol ethyl ether and the like; pyrrolidone type solvents such as N-methylpyrrolidone, etc.; diacid diester solvents of C6-C20 such as dimethyl adipate, dimethyl glutarate, dimethyl succinate and the like; the distillation range is more than 230 ℃, such as D40 environment-friendly solvent oil, D65 environment-friendly solvent oil, D95 environment-friendly solvent oil and the like. But are not limited to these enumerated materials.
On the basis of the scheme, the light diffusant is preferably one or more of an inorganic light diffusant, an organic light diffusant and an organic-inorganic hybrid light diffusant with the particle size of 500 nm-50 microns, and the structure of the light diffusant can be spherical, strawberry-shaped, needle-shaped, rod-shaped, dendritic, blocky and the like.
On the basis of the scheme, the structure of the light diffusion agent can be one or more of a solid sphere, a solid strawberry shape, a solid dumbbell shape, a hollow sphere, a hollow strawberry shape, a perforated sphere and the like. The method specifically comprises the following steps: white carbon black, titanium dioxide, attapulgite, calcium carbonate, mica powder, zirconia, polystyrene, polymethyl methacrylate, polyacrylic acid, polylactic acid, polycarbonate, paraffin, silica/polystyrene, titanium dioxide/polymethyl methacrylate, zirconia/epoxy resin, calcium carbonate/polylactic acid and the like. But are not limited to these enumerated materials. But is not limited to the above-listed structures.
On the basis of the scheme, the paint also comprises 0-20 wt% of processing aids, wherein the processing aids comprise one or more of dispersing agents, defoaming agents, flatting agents, flame retardants, anti-settling agents, pigments and UV absorbers in adhesives or coatings.
On the basis of the scheme, the initiator comprises the following components: one of cyclohexanone peroxide, dibenzoyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, tert-butyl hydroperoxide, p-menthane hydroperoxide, diisopropyl peroxydicarbonate, azobisisobutyronitrile, azobisisoheptonitrile, cyclohexanone peroxide-ferrous naphthenate, dibenzoyl peroxide-cobalt naphthenate, dibenzoyl peroxide-mercaptan, tert-butyl hydroperoxide-N, N-dimethyldodecylamine, cyclohexanone peroxide-dimethyldodecylamine, and dodecyl dimethyl tertiary amine. But are not limited to these initiators.
The invention also provides an organosilicon-acrylate adhesive product with light diffusion function, which is prepared by the preparation method, wherein the haze is not lower than 80%, and the transmittance is not lower than 90%.
The invention also provides an application of the organic silicon-acrylate adhesive with the light diffusion function, which is used for light diffusion function protective coatings of lighting equipment, liquid crystal display and LED equipment, or light diffusion function protective adhesives.
The invention has the advantages that:
on one hand, the adhesive has the advantages of low price, moisture absorption resistance, good heat resistance, single component, rapid curing, good storage stability, high bonding strength, convenient adhesive coating and the like;
on the other hand, the material integrates the functions of bonding and light diffusion, is widely applied, has the haze of more than 80 percent and the transmittance of more than 90 percent, and can be applied to light diffusion function protective coatings and light diffusion function protective adhesives of lighting equipment, liquid crystal display and LED equipment.
Drawings
FIG. 1 is a TEM photograph of a light diffuser prepared according to the present invention, including FIGS. 1 a-d;
FIG. 2 is a graph of the effect of various light diffusing adhesives prepared in accordance with the present invention on LED devices, including FIGS. 2 a-l.
Detailed Description
Example 1
1. An environment-friendly organic silicon-acrylate resin is prepared by the following steps:
slowly adding 25 g of butyl methacrylate, 10 g of hydroxyethyl methacrylate, 15 g of methacrylic acid-2-methyl ester, 15 g of methacryloxypropyldiethoxysilane, 5 g of cyclopentadiene and 5 g of styrene into a mixed solvent of 10 g of propylene glycol butyl ether and 15 g of N-methyl pyrrolidone, uniformly stirring, and reacting for 7 hours at 70-90 ℃ by adopting a solution polymerization method by using cyclohexanone peroxide as an initiator to obtain the environment-friendly organic silicon-acrylate resin.
2. Preparing a silicone-acrylate adhesive with a light diffusion function:
10 g of methyl methacrylate, 1 g of (2- (methacryloyloxy) ethyl), 10 g of silica sol, 27 g of ethanol and 63 g of water are subjected to dispersion polymerization for 5 hours at 80-90 ℃ by using azobisisobutyronitrile as an initiator to obtain the hollow polymethacrylic acid composite light diffusion microsphere, and a TEM photograph of the light diffusion microsphere is shown in FIG. 1 a. And then, uniformly mixing the organic silicon-acrylate resin with 70 g of the environment-friendly organic silicon-acrylate resin obtained in the step 1 to obtain the environment-friendly organic silicon-acrylate adhesive with the light diffusion function.
The adhesive can be used for light diffusion function protective coatings and light diffusion function protective adhesives of lighting equipment, liquid crystal display and LED equipment, and has the haze of more than 80 percent and the transmittance of more than 90 percent. Fig. 2a-b are diagrams illustrating the effect of applying different light diffusing adhesives to LED devices according to the present invention.
Example 2
1. An environment-friendly organic silicon-acrylate resin is prepared by the following steps:
slowly adding 5 g of butyl acrylate, 5 g of methacrylic acid, 15 g of methyl 2-cyanoacrylate, 10 g of vinyl phenyl dimethoxysilane, 5 g of allyl disiloxane and 10 g of chlorinated propylene into 30 g of N-methyl pyrrolidone and 20 g of D65 environment-friendly solvent oil, uniformly mixing, and reacting for 10 hours at 70-90 ℃ by adopting a solution polymerization method by taking azobisisobutyronitrile as an initiator to obtain the environment-friendly organic silicon-acrylate resin.
2. Preparing an organic silicon-acrylate adhesive with a light diffusion function:
adding 15 g of hollow glass microspheres with the particle size of 10 microns and 0.3 g of dispersing agent into 40 g of propylene glycol butyl ether acetate, and dispersing at a high speed of 3000 rpm for 3 hours to serve as a light diffusing agent, wherein FIG. 1b is a TEM photograph of the light diffusing agent in the embodiment; and (3) adding 45 g of the environment-friendly organic silicon-acrylate resin obtained in the step (1) and uniformly mixing to obtain the organic silicon-acrylate adhesive with the light diffusion function.
The organic silicon-acrylate adhesive with the light diffusion function can be used as a light diffusion function protective coating and a light diffusion function protective adhesive of lighting equipment, liquid crystal display and LED equipment, and fig. 2 is an effect diagram of the coating on the LED equipment. The haze of the coating reaches more than 80%, and the transmittance of the coating reaches more than 90%. Fig. 2c-d are graphs showing the effect of different light-diffusing adhesives prepared according to the present invention on LED devices.
Example 3
1. Preparing an organic silicon-acrylate adhesive with a light diffusion function:
stirring 5 g of titanium dioxide microspheres with the surface provided with hydroxyl and the particle size of 800 nanometers, 1 g of gamma-methacryloxypropyltrimethoxysilane, 20 g of ethanol and 4 g of water at the temperature of 70-90 ℃ for 20 hours to obtain a light dispersing agent with good dispersibility, wherein as shown in a figure 1c, a TEM photograph of the light dispersing agent prepared by the invention is shown; and then, polymerizing the product after the solvent is removed, 10 g of styrene, 5 g of butyl acrylate, 5 g of acrylic acid, 3 g of allyl disiloxane, 5 g of sodium dodecyl benzene sulfonate and 50 g of water at the temperature of 70-80 ℃ for 10 hours by taking potassium persulfate as an initiator to obtain the environment-friendly organic silicon-acrylate resin with the light diffusion function, wherein the environment-friendly organic silicon-acrylate resin is directly used for the environment-friendly organic silicon-acrylate adhesive with the light diffusion function.
2. And (2) adding 0.3 g of fluorescent marking agent into 30 g of diethylene glycol, dispersing at the speed of 1000 rpm for 30 minutes, adding 70 g of the silicone-acrylate resin with the light diffusion function obtained in the step (1), and uniformly mixing to obtain the silicone-acrylate adhesive with the light diffusion function.
The organic silicon-acrylate adhesive with the light diffusion function can be used as a light diffusion function protective coating and a light diffusion function protective adhesive of lighting equipment, liquid crystal display and LED equipment, and for example, fig. 2e-g are effect diagrams of different light diffusion adhesives prepared by the invention acting on the LED equipment.
Example 4
1. Preparation of an environment-friendly organic silicon-acrylate resin with a light diffusion function:
5 g of polyorganosiloxane microspheres with alkoxy on the surface and the average particle size of 5 microns are dispersed by ultrasound, as shown in figure 1 d; and 10 g of butyl acrylate, 5 g of acrylic acid, 5 g of methacryloxypropyldiethoxysilane, 30 g of diethylene glycol monoethyl ether and 20 g of tripropylene glycol butyl ether are subjected to solution polymerization for 8 hours at the temperature of between 70 and 90 ℃ by taking dibenzoyl peroxide as an initiator to obtain the environment-friendly organic silicon-acrylate resin with the light diffusion function.
2. The preparation of the environment-friendly organic silicon-acrylate adhesive with the light diffusion function comprises the following steps:
adding 15 g of quartz powder and 0.3 g of dispersing agent into 40 g of propylene glycol butyl ether acetate, dispersing at a high speed of 3000 r/min for 3 hours, adding 45 g of the environment-friendly organic silicon-acrylate resin with the light diffusion function, and uniformly mixing to obtain the organic silicon-acrylate adhesive with the light diffusion function.
The organic silicon-acrylate adhesive with the light diffusion function can be used as a light diffusion function protective coating and a light diffusion function protective adhesive of lighting equipment, liquid crystal display and LED equipment, and for example, fig. 2i-l are effect diagrams of different light diffusion adhesives prepared by the invention acting on the LED equipment.
Claims (9)
1. A preparation method of an environment-friendly organic silicon-acrylate adhesive with a light diffusion function comprises the following components: (1) 40-99 wt% of environment-friendly acrylate resin, (2) 0-50 wt% of environment-friendly solvent, (3) 1-30 wt% of light diffusant with the particle size of 100 nm-100 mu m, and the light diffusant is obtained by stirring and mixing, wherein the haze is not lower than 80%, the transmittance is not lower than 90%,
the environment-friendly acrylate resin is prepared by dissolving 25-65 wt% of acrylate monomer or acrylic acid modified epoxy resin, 10-40 wt% of vinyl organosilicon monomer, 5-40 wt% of olefin monomer, 0-30 wt% of alkenyl aromatic compound monomer in 20-60 wt% of environment-friendly solvent, and copolymerizing by adopting 0.1-1 wt% of thermal initiator or redox initiator by solution polymerization method to obtain the environment-friendly acrylate resin with the solid content of 20-80 wt%, so that the total amount of all components reaches 100%;
the preparation method of the environment-friendly organic silicon-acrylate adhesive with the light diffusion function comprises the following specific steps:
(1) at the temperature of not higher than 100 ℃, adding acrylate monomers or acrylic acid modified epoxy resin, vinyl organic silicon monomers, olefin monomers, alkenyl aromatic compound monomers and optional blended resin into a solvent for mixing, and uniformly stirring at the rotation speed of 100-1500 rpm;
(2) adding a thermal initiator or a redox initiator and an unnecessary auxiliary agent into an unnecessary solvent for mixing, and uniformly stirring at the rotating speed of 100-5000 rpm;
(3) adding the product obtained in the step (1) into the product obtained in the step (2), and reacting at the rotating speed of 1500rpm for 1-100h to obtain the environment-friendly organic silicon-acrylate adhesive with the light diffusion function;
(4) uniformly mixing the product obtained by the reaction in the step (3) with a light diffusion agent at the rotating speed of 100-2000rpm to obtain the environment-friendly organic silicon-acrylate adhesive with the light diffusion function;
wherein,
the light diffusant with the grain diameter of 100 nm-100 mm is prepared by the following method:
(1) adding 15 g of hollow glass microspheres with the particle size of 10 microns and 0.3 g of dispersing agent into 40 g of propylene glycol butyl ether acetate, and dispersing at a high speed of 3000 rpm for 3 hours to obtain a light dispersing agent; or,
(2) stirring 5 g of titanium dioxide microspheres with the surface provided with hydroxyl and the particle size of 800 nanometers, 1 g of gamma-methacryloxypropyltrimethoxysilane, 20 g of ethanol and 4 g of water at the temperature of 70-90 ℃ for 20 hours to obtain a light-dispersing agent with good dispersibility; or,
(3) 5 g of polyorganosiloxane microspheres with alkoxy on the surface and with the average grain diameter of 5 microns are subjected to ultrasonic dispersion to be used as a light dispersing agent and participate in copolymerization of a solution polymerization method as a component to obtain the environment-friendly acrylate resin with the solid content of 20-80 wt%.
2. The method for preparing the environment-friendly organosilicon-acrylate adhesive with the light diffusion function according to claim 1, wherein the acrylate monomer is one or more of C3-C45 alkyl acrylate, alkyl methacrylate, acrylic acid, methacrylic acid, hydroxyalkyl acrylate and hydroxyalkyl methacrylate monomers; the acrylic acid modified epoxy resin is one or two of epoxy resin with double bonds obtained by ring-opening reaction of acrylic acid or methacrylic acid and bisphenol A type epoxy resin, bisphenol F type epoxy resin and alicyclic epoxy resin; the alkene organic silicon monomer is one or more of vinyl siloxane containing C7-C40; the olefin monomer is one or more of C4-C45 olefin, diolefin, cycloolefine, cyclodiolefine and halogenated olefin monomers; the alkenyl aromatic compound monomer is one or more of alkenyl aromatic compounds of C8-C45.
3. The method for preparing the environment-friendly organosilicon-acrylate adhesive with the light diffusion function according to claim 1, wherein the solid content of the environment-friendly acrylate resin is 40-80 wt%.
4. The method for preparing the environment-friendly silicone-acrylate adhesive with the light diffusion function according to claim 1, wherein the environment-friendly solvent is one or more of an alcohol solvent of C3-C10, a propylene glycol ether solvent of C4-C10, a propylene glycol ether alkanoate solvent of C5-C15, an environment-friendly solvent oil with the distillation range of more than 230 ℃, a pyrrolidone solvent and a diacid diester solvent of C6-C10.
5. The method for preparing environment-friendly organosilicon-acrylate adhesive with light diffusion function according to claim 1, wherein the structure of the light diffusion agent is one or more of solid sphere, solid strawberry shape, solid dumbbell shape, hollow sphere, hollow strawberry shape, perforated sphere, etc.
6. The preparation method of the environment-friendly organosilicon-acrylate adhesive with the light diffusion function according to claim 1, characterized by further comprising 0-20 wt% of processing aids, wherein the processing aids comprise one or more of a dispersing agent, a defoaming agent, a leveling agent, a flame retardant, an anti-settling agent, a pigment and a UV absorbent in an adhesive or a coating.
7. The method of claim 1, wherein the initiator is one of cyclohexanone peroxide, dibenzoyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, tert-butyl hydroperoxide, p-menthane hydroperoxide, diisopropyl peroxydicarbonate, azobisisobutyronitrile, azobisisoheptonitrile, cyclohexanone peroxide-ferrous naphthenate, dibenzoyl peroxide-cobaltous naphthenate, dibenzoyl peroxide-mercaptan, tert-butyl hydroperoxide-N, N-dimethyldodecylamine, cyclohexanone peroxide-dimethyldodecylamine, and dodecyl dimethyl tertiary amine.
8. An environment-friendly silicone-acrylate adhesive with a light diffusion function, obtained by the preparation method according to any one of claims 1 to 7.
9. Use of the environment-friendly silicone-acrylate adhesive with light diffusion function according to claim 8, wherein the adhesive is used for light diffusion function protective coatings of lighting equipment, liquid crystal displays and LED equipment, or light diffusion function protective adhesives.
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