CN115746740A - Electromagnetic shielding protection film - Google Patents
Electromagnetic shielding protection film Download PDFInfo
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- CN115746740A CN115746740A CN202211376853.6A CN202211376853A CN115746740A CN 115746740 A CN115746740 A CN 115746740A CN 202211376853 A CN202211376853 A CN 202211376853A CN 115746740 A CN115746740 A CN 115746740A
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- conductive adhesive
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- electromagnetic shielding
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- 239000010410 layer Substances 0.000 claims abstract description 88
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000011888 foil Substances 0.000 claims abstract description 30
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 23
- -1 organosiloxane modified acrylate Chemical class 0.000 claims abstract description 21
- 239000011231 conductive filler Substances 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 9
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims description 2
- 229940112669 cuprous oxide Drugs 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- IJNRGJJYCUCFHY-UHFFFAOYSA-N ethenyl-dimethoxy-phenylsilane Chemical compound CO[Si](OC)(C=C)C1=CC=CC=C1 IJNRGJJYCUCFHY-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to the technical field of electromagnetic shielding films, and provides an electromagnetic shielding protective film which comprises a metal foil layer, a first conductive adhesive layer and a second conductive adhesive layer, wherein the first conductive adhesive layer and the second conductive adhesive layer are arranged on two sides of the metal foil layer; an insulating layer is arranged on one side, away from the metal foil layer, of the first conductive adhesive layer; a release film layer is arranged on one side, away from the metal foil layer, of the second conductive adhesive layer; first conductive adhesive layer and second conductive adhesive layer all include: organosiloxane modified acrylate pressure sensitive adhesives and conductive fillers; the organic siloxane modified acrylate pressure-sensitive adhesive is vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive; the electromagnetic shielding protective film disclosed by the invention has excellent long-term service performance stability, is simple in structure and is easy to carry out industrial production.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding films, in particular to an electromagnetic shielding protective film.
Background
The electromagnetic shielding film is a core material for realizing electromagnetic shielding of the FPC so as to ensure normal work, and the demand of pulling the FPC is increased in the fields of consumer electronics, automotive electronics and the like, so that high demands on the quantity and quality of electromagnetic shielding are brought. Electromagnetic shielding is to use shielding material to block or attenuate electromagnetic energy propagation between the shielded area and the outside. The electromagnetic shielding utilizes the reflection, absorption and guide functions of the shielding body on electromagnetic energy flow, and is closely related to the phenomena of electric charges, electric currents and polarization induced on the surface of the shielding structure and inside the shielding body. When the electronic components work, electromagnetic waves can be generated, and the electromagnetic waves can have larger or smaller action with the electronic components and generate a certain degree of interference phenomenon. Meanwhile, the electronic components can not only be subjected to self electromagnetic interference, but also be subjected to electromagnetic interference from the outside, and if the electromagnetic interference exceeds the bearing value of the electronic components, the normal use efficiency of the electronic components can be influenced.
The electromagnetic shielding film is generally a composite structure formed by a plurality of layers of functional films, and mainly comprises an insulating layer, a metal layer and a conductive layer, wherein the insulating layer is used for protecting the metal layer from being damaged, the metal layer is mainly used for shielding external electromagnetic interference, and the conductive layer is used for leading out charges. With the increasing diversification and complication of electronic components in electronic equipment, the performance requirements on the electromagnetic shielding film are higher and higher. The existing electromagnetic shielding film has certain defects in shielding performance, bonding strength between layers and other performances when used for a long time.
Disclosure of Invention
The invention aims to provide an electromagnetic shielding protective film which has excellent long-term service performance stability in both shielding performance and bonding strength among layers, has a simple structure and is easy to industrially produce.
The embodiment of the invention is realized by the following technical scheme:
an electromagnetic shielding protective film comprises a metal foil layer, a first conductive adhesive layer and a second conductive adhesive layer, wherein the first conductive adhesive layer and the second conductive adhesive layer are arranged on two sides of the metal foil layer; an insulating layer is arranged on one side, away from the metal foil layer, of the first conductive adhesive layer; a release film layer is arranged on one side of the second conductive adhesive layer away from the metal foil layer;
first conductive adhesive layer and second conductive adhesive layer all include: organosiloxane modified acrylate pressure sensitive adhesives and conductive fillers; the organic siloxane modified acrylate pressure-sensitive adhesive is vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive.
Further, the molecular structure of the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive is as follows:
wherein w =8-35, x =10-30, y =1-5, z =5-50.
Further, the thickness of the first conductive adhesive layer is 5-45 μm; the thickness of the second conductive adhesive layer is 5-65 μm; the thickness of the metal foil layer is 0.3-1.5 μm.
Further, the metal foil layer is one of a copper foil, a nickel foil, a zinc foil and an aluminum foil.
Further, the conductive filler includes reduced graphene oxide and a metal oxide.
Further, the mass ratio of the reduced graphene oxide to the organic siloxane modified acrylate pressure-sensitive adhesive is 1; the mass ratio of the metal oxide to the organic siloxane modified acrylate pressure-sensitive adhesive is 1.
Further, the reduced graphene oxide is of a lamellar structure, and the lamellar structure contains one or more of carboxyl, hydroxyl, epoxy and carbonyl; the metal oxide is one or a mixture of more of ferroferric oxide, nickel oxide, zinc oxide, antimony dioxide, tin oxide and cuprous oxide.
Furthermore, an insulating layer is arranged on one side, away from the metal foil layer, of the first conductive adhesive layer; one side that the second conductive adhesive layer kept away from the metal foil layer is provided with from the type rete.
Further, the insulating layer is a fluorine-containing polyimide film, and the insulating layer is made of a fluorine-containing polyimideInsulation layer volume resistance of 10 14-16 Omega cm, thickness of 5-50 μm;
the preparation method of the polyimide film comprises the following steps: 2, 2-bis [4- (4-amino-2-trifluoroethoxy phenoxy) phenyl ] hexafluoropropane and pyromellitic dianhydride are prepared by processes of polycondensation, tape casting, imidization and the like; the molecular structure of the polyimide film is as follows:
further, the release film layer is a release film which takes a PET film as a base material and is coated with an organic silicon release agent; the thickness of the release film layer is 5-100 μm.
A preparation method of the electromagnetic shielding protective film comprises the following steps: the method comprises the following steps of firstly coating a first conductive adhesive layer on an insulating layer, coating a metal foil layer after curing by an oven, coating a second conductive adhesive layer on the metal foil layer, and coating a release film layer after curing by the oven.
Specifically, the coating mode is micro-concave coating, and the used micro-concave roller is a ceramic micro-concave roller or a metal micro-concave roller with the mesh number of 40 meshes, 45 meshes, 50 meshes, 60 meshes, 70 meshes or 80 meshes; the metal foil layer lamination pressure is 0.15-0.32 MPa; the laminating pressure of the release film layer is 0.13-0.26 MPa.
The technical scheme of the embodiment of the invention at least has the following advantages and beneficial effects:
1. the conductive adhesive layer adopts the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive as an adhesive, and the pressure-sensitive adhesive has good high-temperature resistance; meanwhile, delocalized electrons existing in the conjugated large pi bond in the vinyl di (methoxy) phenyl silane have conductivity, so that the conductivity of the conductive adhesive layer can be further enhanced.
2. The conductive adhesive layer simultaneously adopts reduced graphene oxide and metal oxide as conductive fillers, and hydrophilic carboxyl, hydroxyl, epoxy, carbonyl and lipophilic carbon six-membered ring exist in the graphene oxide lamellar structure, so that the graphene oxide lamellar structure can be used as a Pickering emulsifier, and the dispersibility of the metal oxide in glue is improved; meanwhile, the synergistic conduction of the two fillers enables the conductive cable to have better conductive capability, so that the shielding effectiveness is higher; in addition, a synergistic heat conduction effect is generated between the reduced graphene oxide and the metal oxide, so that the heat dissipation capacity of the composite material is high.
3. The fluorine-containing polyimide film is used as the insulating layer, and the insulating layer has high dielectric constant, high breakdown voltage resistance, good resistance and good flame retardance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of an electromagnetic shielding protective film provided in embodiment 1 of the present invention;
icon: 1-an insulating layer, 2-a first conductive adhesive layer, 3-a metal foil layer, 4-a second conductive adhesive layer and 5-a release film layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
An electromagnetic shielding protective film comprises a metal foil layer 3 (a nickel foil layer), and a first conductive adhesive layer 2 and a second conductive adhesive layer 4 which are arranged on two sides of the nickel foil layer; one side of the first conductive adhesive layer 2, which is far away from the nickel foil layer, is provided with a fluorine-containing polyimide film layer; a release film layer 5 is arranged on one side of the second conductive adhesive layer 4 far away from the nickel foil layer;
wherein, first conductive glue layer 2 and second conductive glue layer 4 all include: vinyl di (methoxy) phenyl silane modified acrylate pressure sensitive adhesive and conductive filler; the conductive filler is a composite conductive filler doped with reduced graphene oxide and ferroferric oxide; the release film layer 5 is a release film which takes a PET film as a base material and is coated with an organic silicon release agent; the fluorine-containing polyimide film layer of the insulating layer 1 is obtained by carrying out polycondensation, tape casting, imidization and the like on 2, 2-bis [4- (4-amino-2-trifluoroethoxy phenoxy) phenyl ] hexafluoropropane and pyromellitic dianhydride, and the volume resistance of the insulating layer 1 reaches 1014-16 omega cm;
the specific adding proportion is as follows: the mass ratio of the reduced graphene oxide to the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive is 1; the metal oxide conductive filler is ferroferric oxide, and the mass ratio of the ferroferric oxide to the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive is 1;
the specific thickness is: the thickness of the nickel foil layer is 0.5 mu m, the thickness of the first conductive adhesive layer 2 is 15 mu m, the thickness of the second conductive adhesive layer 4 is 25 mu m, the thickness of the insulating layer 1 is 20 mu m, and the thickness of the release film layer 5 is 15 mu m;
a preparation method of an electromagnetic shielding protective film comprises the following steps: firstly, coating a first conductive adhesive layer 2 on an insulating layer 1, laminating a metal foil layer 3 after curing by an oven, coating a second conductive adhesive layer 4 on the metal foil layer 3, and laminating a release film layer 5 after curing by the oven; the coating modes are micro-concave coating, and the used micro-concave roller is a 45-mesh ceramic micro-concave roller; the laminating pressure of the metal foil layer 3 is 0.18MPa; the laminating pressure of the release film layer 5 is 0.16MPa; the oven temperatures are shown in table 1:
TABLE 1 oven temperature conditions
Example 2
This example differs from example 1 in that:
the metal foil layer is copper foil, and the thickness of the metal foil layer is 0.3 mu m;
the thickness of the first conductive adhesive layer is 10 micrometers, and the thickness of the second conductive adhesive layer is 15 micrometers;
the mass ratio of the reduced graphene oxide to the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive is 1;
the thickness of the insulating layer is 10 micrometers, and the thickness of the release film layer 5 is 25 micrometers; the micro-concave roller is a 50-mesh metal micro-concave roller.
Example 3
The present example differs from example 1 in that:
the metal foil layer is zinc foil, and the thickness of the metal foil layer is 0.4 mu m;
the thickness of the first conductive adhesive layer is 15 micrometers, and the thickness of the second conductive adhesive layer is 15 micrometers;
the mass ratio of the reduced graphene oxide to the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive is 1.
The thickness of the insulating layer 1 is 15 micrometers, and the thickness of the release film layer 5 is 10 micrometers; the micro-concave roller is a 60-mesh metal micro-concave roller.
Comparative example 1
The comparative example differs from example 1 in that: the pressure-sensitive adhesive is conventional acrylate pressure-sensitive adhesive, the added conductive filler is ferroferric oxide, and the insulating layer is a conventional polyimide film without fluorine.
Comparative example 2
The comparative example differs from example 3 in that: the added conductive filler is antimony dioxide, and the insulating layer is a PET film.
Experimental example 1
The electromagnetic shielding protective films obtained in examples 1 to 3 and comparative examples 1 and 2 were subjected to the relevant performance tests, and the results are shown in table 2.
TABLE 2 Properties of electromagnetic shielding protective films obtained in examples and comparative examples
As can be seen from the data in Table 2, the electromagnetic shielding protective film has excellent shielding performance, and the conductive adhesive layer of the electromagnetic shielding protective film adopts the vinyl di (methoxy) phenyl silane modified acrylate pressure-sensitive adhesive as an adhesive, so that the electromagnetic shielding protective film has good high-temperature resistance under the synergistic action of the adhesive and can enhance the conductive capability of the adhesive layer; the invention adopts the fluorine-containing polyimide film as the insulating layer, and the insulating layer has very high dielectric constant, high breakdown voltage resistance and very good resistance.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The electromagnetic shielding protective film is characterized by comprising a metal foil layer, a first conductive adhesive layer and a second conductive adhesive layer, wherein the first conductive adhesive layer and the second conductive adhesive layer are arranged on two sides of the metal foil layer;
first conductive adhesive layer and second conductive adhesive layer all include: organosiloxane modified acrylate pressure sensitive adhesives and conductive fillers.
2. The electromagnetic shielding protective film according to claim 1, wherein the organosiloxane-modified acrylate pressure-sensitive adhesive is a vinyldi (methoxy) phenylsilane-modified acrylate pressure-sensitive adhesive.
3. The electromagnetic shielding protective film according to claim 2, wherein the molecular structure of the vinylbis (methoxy) phenylsilane modified acrylate pressure-sensitive adhesive is:
wherein w =8-35, x =10-30, y =1-5, z =5-50.
4. The protective film for electromagnetic shielding of claim 1, wherein the thickness of the first conductive adhesive layer is 5 μm to 45 μm; the thickness of the second conductive adhesive layer is 5-65 μm; the thickness of the metal foil layer is 0.3-1.5 μm.
5. The protective electromagnetic shielding film according to claim 1, wherein the conductive filler comprises reduced graphene oxide and a metal oxide.
6. The electromagnetic shielding protective film according to claim 5, wherein the mass ratio of the reduced graphene oxide to the organic siloxane-modified acrylate pressure-sensitive adhesive is 1; the mass ratio of the metal oxide to the organic siloxane modified acrylate pressure-sensitive adhesive is (1).
7. The electromagnetic shielding protective film according to claim 6, wherein the reduced graphene oxide is a lamellar structure, and the lamellar structure contains a hydrophilic group and a lipophilic group; the metal oxide is one or a mixture of more of ferroferric oxide, nickel oxide, zinc oxide, antimony dioxide, tin oxide and cuprous oxide.
8. The electromagnetic shielding protective film according to claim 1, wherein an insulating layer is disposed on a side of the first conductive adhesive layer away from the metal foil layer; one side of the second conductive adhesive layer, which is far away from the metal foil layer, is provided with a release film layer.
9. The electromagnetic shielding protective film according to claim 8, wherein the insulating layer is a fluorine-containing polyimide film, and the insulating layer has a volume resistance of 10 14-16 Omega cm, thickness of 5-50 μmm。
10. The electromagnetic shielding protection film according to claim 8, wherein the release film layer is a release film coated with an organic silicon release agent and using a PET film as a substrate; the thickness of the release film layer is 5-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211376853.6A CN115746740A (en) | 2022-11-04 | 2022-11-04 | Electromagnetic shielding protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211376853.6A CN115746740A (en) | 2022-11-04 | 2022-11-04 | Electromagnetic shielding protection film |
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| Publication Number | Publication Date |
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| CN115746740A true CN115746740A (en) | 2023-03-07 |
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| CN202211376853.6A Pending CN115746740A (en) | 2022-11-04 | 2022-11-04 | Electromagnetic shielding protection film |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102816547A (en) * | 2011-06-09 | 2012-12-12 | 第一毛织株式会社 | Adhesive composition, and surface protection film using it |
| CN107072130A (en) * | 2017-06-26 | 2017-08-18 | 俞秀英 | A kind of electromagnetic shielding film |
| CN109913157A (en) * | 2019-03-28 | 2019-06-21 | 上海西怡新材料科技有限公司 | Environment-friendly type organosilicon-acrylate adhesive preparation method with light diffusion function and products thereof and application |
| CN111148426A (en) * | 2020-01-16 | 2020-05-12 | 广东桑泰科技有限公司 | Electromagnetic shielding film with high shielding performance and production process thereof |
-
2022
- 2022-11-04 CN CN202211376853.6A patent/CN115746740A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102816547A (en) * | 2011-06-09 | 2012-12-12 | 第一毛织株式会社 | Adhesive composition, and surface protection film using it |
| CN107072130A (en) * | 2017-06-26 | 2017-08-18 | 俞秀英 | A kind of electromagnetic shielding film |
| CN109913157A (en) * | 2019-03-28 | 2019-06-21 | 上海西怡新材料科技有限公司 | Environment-friendly type organosilicon-acrylate adhesive preparation method with light diffusion function and products thereof and application |
| CN111148426A (en) * | 2020-01-16 | 2020-05-12 | 广东桑泰科技有限公司 | Electromagnetic shielding film with high shielding performance and production process thereof |
Non-Patent Citations (1)
| Title |
|---|
| 赵彤等: ""高性能热固性树脂"", vol. 1, 中国铁道出版社有限公司, pages: 398 * |
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