CN109906025A - A kind of U-shaped temperature-uniforming plate and radiator - Google Patents
A kind of U-shaped temperature-uniforming plate and radiator Download PDFInfo
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- CN109906025A CN109906025A CN201910333089.6A CN201910333089A CN109906025A CN 109906025 A CN109906025 A CN 109906025A CN 201910333089 A CN201910333089 A CN 201910333089A CN 109906025 A CN109906025 A CN 109906025A
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- 239000007788 liquid Substances 0.000 claims description 37
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 20
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 239000003507 refrigerant Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 208000002925 dental caries Diseases 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to technical field of heat dissipation, and in particular to a kind of U-shaped temperature-uniforming plate and radiator.U-shaped temperature-uniforming plate of the invention, the connecting plate including the first temperature-uniforming plate and the second temperature-uniforming plate and connection first temperature-uniforming plate and second temperature-uniforming plate, first temperature-uniforming plate is interior to be equipped with the first cavity, is equipped with the second cavity in second temperature-uniforming plate.U-shaped temperature-uniforming plate of the invention is connected the first temperature-uniforming plate and the second temperature-uniforming plate by connecting plate for traditional structure, so set, can increase the contact area of U-shaped temperature-uniforming plate and heat source, improves the radiating efficiency of U-shaped temperature-uniforming plate.
Description
Technical field
The present invention relates to technical field of heat dissipation, and in particular to a kind of U-shaped temperature-uniforming plate and radiator.
Background technique
As power electronic equipment and device are to miniaturization, integrated, efficient fast development, device performance and heat dissipation
Amount constantly increases, local heat flux density uneven along with heat flux distribution greatly, heat be gathered in regional area, part
The generation for a series of problems, such as temperature is excessively high, these problems propose new challenge to the thermal design of power electronic equipment, need
Heat management system meets high-performance, high compact, highly reliable, high flexibility requirement.
Flat-plate heat pipe is applied to replace traditional pure metal heatsink fins with its powerful phase-change heat transfer ability
Piece can reduce heat source and air thermal resistance to the maximum extent, effectively enhance heat convection and the heat radiation of spreader surface.
But the application of flat-plate heat pipe is confined to that flat-plate heat pipe is directly mounted on this form on foot of radiator at present, although flat
In the presence of the cavity that phase-change working substance can be housed in plate heat pipe, still, contact area is smaller certain between flat-plate heat pipe and pedestal
Whole heat dissipation effect is reduced in degree.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of higher U-shaped temperature-uniforming plate of radiating efficiency and radiator.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of U-shaped temperature-uniforming plate, the U-shaped temperature-uniforming plate include the first temperature-uniforming plate and the second temperature-uniforming plate and connection described first
The connecting plate of temperature-uniforming plate and second temperature-uniforming plate, is equipped with the first cavity in first temperature-uniforming plate, in second temperature-uniforming plate
Equipped with the second cavity.
Further, at least one interface channel, first cavity and second cavity are equipped in the connecting plate
It is interconnected by the interface channel.
Further, the width of the interface channel is 3~10mm.
Further, the height of the interface channel is 1.5~3mm.
Further, the interface channel is arranged close to the one end of the connecting plate along its length.
Further, it is filled with phase-change working substance in first cavity, the second cavity and the interface channel, as the U
Shape temperature-uniforming plate is greater than 0 degree along the length direction of the connecting plate and the angle of horizontal plane and is less than or equal to 90 degree of placements, and institute
When stating interface channel and being located at the lower end of the connecting plate, the liquid level of first cavity or the intracorporal phase-change working substance of the second chamber is higher than
The interface channel.
Further, first temperature-uniforming plate and second temperature-uniforming plate are parallel to each other and perpendicular to the connecting plate.
A kind of radiator comprising pedestal and above-mentioned U-shaped temperature-uniforming plate, the pedestal are equipped with and the U-shaped temperature-uniforming plate
The fitting groove that connecting plate matches.
Further, when in use, the interface channel is located at the lower end of the connecting plate vertical direction to the radiator,
The interface channel is immersed in below the liquid level of the phase-change working substance.
Further, it is equipped with multiple pillars in the fitting groove, corresponds to the pillar on the connecting plate of the U-shaped temperature-uniforming plate
Position be equipped with the through-hole or groove that match with the pillar.
Further, deepen and widen to form escape groove in the position that the fitting groove corresponds to the interface channel.
First temperature-uniforming plate and the second temperature-uniforming plate are passed through connection for traditional structure by U-shaped temperature-uniforming plate of the invention
Plate connects, so set, can increase the contact area of U-shaped temperature-uniforming plate and source of heat release, improves radiating efficiency.
Further, U-shaped temperature-uniforming plate of the invention is by the first cavity and the second temperature-uniforming plate in the first temperature-uniforming plate
Two cavitys are connected to by the interface channel on connecting plate, closed cavity are formed in U-shaped temperature-uniforming plate, since the closed cavity is in
One whole communicating passage only need to once fill i.e. it is therefore not necessary to fill phase-change working substance respectively to the first cavity and the second cavity
Can, filling efficiency is improved, filling cost is saved.
Radiator of the invention can not only be matched with connecting plate by fitting groove between pedestal and U-shaped temperature-uniforming plate and be connect, but also
It can be cooperatively connected by through-hole on pillar on pedestal and connecting plate or groove, further increase pedestal and U-shaped temperature-uniforming plate
Between contact area, improve radiating efficiency.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the schematic perspective view of U-shaped temperature-uniforming plate in embodiment one；
Fig. 2 is the structural schematic diagram of pedestal in embodiment one；
Fig. 3 is the main view of U-shaped temperature-uniforming plate in embodiment one；
Fig. 4 is the cross-sectional view in Fig. 3 along D-D；
Fig. 5 is the schematic perspective view of radiator in embodiment two；
Fig. 6 is the deployed configuration schematic diagram of U-shaped temperature-uniforming plate in embodiment two；
Fig. 7 is schematic perspective view when U-shaped temperature-uniforming plate is placed vertically in embodiment two；
Fig. 8 is the schematic perspective view of pedestal in embodiment two；
Fig. 9 is the main view of radiator in embodiment two；
Figure 10 is the cross-sectional view in Fig. 9 along C-C；
Figure 11 is the enlarged diagram in Figure 10 at B；
Figure 12 is the deployed configuration schematic diagram of U-shaped temperature-uniforming plate in embodiment three.
In figure: parts title and number are respectively as follows: in figure
1 fitting groove of pedestal, 11 pillar 12
13 U-shaped temperature-uniforming plate of escape groove, 2 first temperature-uniforming plate 21
Second temperature-uniforming plate, 22 connecting plate, 23 first cavity 211
Second cavity, 221 interface channel 231
Specific embodiment
Presently in connection with attached drawing, the present invention is described in detail.This figure is simplified schematic diagram, is only illustrated in a schematic way
Basic structure of the invention, therefore it only shows the composition relevant to the invention.
Embodiment one
The embodiment of the present invention one provides a kind of radiator, please refers to Fig. 1-Fig. 4, and the radiator includes pedestal 1 and position
In the U-shaped temperature-uniforming plate 2 on pedestal 1, the U-shaped temperature-uniforming plate 2 includes the first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 and connection institute
The connecting plate 23 of the first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 is stated, first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 are parallel to each other
And perpendicular to connecting plate 23.It is equipped with the first cavity 211 in first temperature-uniforming plate 21, is equipped with the second cavity in the second temperature-uniforming plate 22
221.It is filled with liquid phase-change working medium in first cavity 211 and the second cavity 221, when work, the first cavity 211 and second
It is vaporized after the heat of liquid phase-change working medium absorption heat source in cavity 221, gaseous state phase-change working substance expands rapidly and then full of entire
In cavity, cooling liquid after gaseous state phase-change working substance moves to condensation segment, subsequent liquid phase-change working medium guides again is back to chamber
The evaporator section of body.
Pedestal 1 and U-shaped temperature-uniforming plate 2 are assembled by press-fit approach in present embodiment.Pedestal 1 is equipped with equal with U-shaped
The fitting groove 11 that the connecting plate 23 of warm plate 2 matches is equipped with multiple pillars 12, even for assembling U-shaped temperature-uniforming plate 2 in fitting groove 11
The corresponding position of fishplate bar 23 offers and multiple multiple through-holes 232 to match with pillar 12, the through-hole 232 and the pillar
12 interference fits.
In use, the inside (that is, side far from U-shaped temperature-uniforming plate 2) that the heat source to radiate will be needed to be mounted on pedestal 1, or
Close to the inside of pedestal 1, the inside of heat from the pedestal 1 of heat source is transmitted to the outside of pedestal 1 (that is, close to U-shaped temperature-uniforming plate 2
Side), it is vaporized after the heat absorption of liquid phase-change working medium, the condensation segment exothermic condensation for flowing to U-shaped temperature-uniforming plate 2 is liquid phase-change working medium, is returned
It flow to the evaporator section of U-shaped temperature-uniforming plate 2.
The first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 are connected by connecting plate 23 in present embodiment, pass through connecting plate 23
The contact area of U-shaped temperature-uniforming plate 2 Yu heat source can be increased, improve radiating efficiency.
Embodiment two
Fig. 5-Figure 11 is please referred to, second embodiment of the present invention provides a kind of radiator, including pedestal 1 and is located on pedestal 1
U-shaped temperature-uniforming plate 2, the U-shaped temperature-uniforming plate 2 includes the first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 and connection first samming
The connecting plate 23 of plate 21 and the second temperature-uniforming plate 22, first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 are parallel to each other and perpendicular to even
Fishplate bar 23.It is equipped with the first cavity 211 in first temperature-uniforming plate 21, is equipped with the second cavity 221, connecting plate in the second temperature-uniforming plate 22
An interface channel 231 is equipped in 23, first cavity 211, the second cavity 221 are interconnected by interface channel 231.Institute
It states the first cavity 211, the second cavity 221 and interface channel 231 and constitutes closed cavity.Liquid is filled in the closed cavity
Phase-change working substance, when work, the intracorporal liquid phase-change working medium of closed chamber vaporizes after absorbing the heat of heat source, and gaseous state phase-change working substance is rapid
It expands and then is full of in entire closed cavity, cooling liquid after gaseous state phase-change working substance moves to condensation segment, subsequent liquid phase-change
Working medium guides the evaporator section of reflux closed cavity again.The width a of the interface channel 231 is 3~10mm, interface channel 231
Height h be 1.5~3mm to guarantee that liquid phase-change working medium and gaseous state phase-change working substance can flow rapidly along interface channel 231.This
The setting of interface channel 231 in embodiment by disposably vacuumizing, disposably fills phase-change working substance and solder up
The filling of 221 working medium of the first cavity 211 and the second cavity is completed, technique is more simple.
The one end of interface channel 231 close to connecting plate 23 along its length in present embodiment.Dissipating in present embodiment
For hot device in use state, the U-shaped temperature-uniforming plate 2 places (the i.e. described connecting plate along the length direction of the connecting plate 23 vertically
23 and horizontal plane), at this point, interface channel 231 is located at the lower end of 23 vertical direction of connecting plate, the liquid level of liquid refrigerant
Higher than the top of interface channel 231, i.e. interface channel 231 is immersed in liquid level or less and plays the role of linker, to guarantee first
Liquid refrigerant in cavity 211 and the second cavity 221 can mutually be circulated by interface channel 231, so that 211 He of the first cavity
Liquid level in second cavity 221 is equal, guarantees that U-shaped temperature-uniforming plate 2 has uniform heat dissipation effect.In other embodiments, it dissipates
In use state, the U-shaped temperature-uniforming plate 2 may be hot device along the length direction of the connecting plate 23 and the angle of horizontal plane
Acute angle (be greater than 0 degree and less than 90 degree), as long as at this point, guarantee interface channel 231 is located at connecting plate 23 close to one end of horizontal plane,
And the liquid level of liquid refrigerant is higher than the top of interface channel 231, i.e. interface channel 231 is immersed in liquid level or less and plays linker
Effect, can mutually be circulated by interface channel 231 with the liquid refrigerant guaranteed in the first cavity 211 and the second cavity 221 be
Can, that is, it can guarantee that U-shaped temperature-uniforming plate 2 has preferable heat dissipation effect.
The U-shaped temperature-uniforming plate 2 of embodiment of the present invention is in use, U-shaped temperature-uniforming plate 2 is placed vertically or horizontal by a clamp
Angle setting, if interface channel 231 is located at the one end of connecting plate 23 far from horizontal plane, because interface channel 231 is located at the first cavity
211 and the second liquid refrigerant in cavity 221 liquid level more than, when U-shaped temperature-uniforming plate 2 works, because interface channel 231 cannot be fine
Ground is connected to the liquid refrigerant in the first cavity 211 and the second cavity 221, and the heat dissipation effect of U-shaped temperature-uniforming plate 2 is poor.Further,
At this point, if the first temperature-uniforming plate 21 is different from the power of heat source of the second temperature-uniforming plate 22, it is assumed that the heat of 21 evaporator section of the first temperature-uniforming plate
Source power is greater than the power of heat source of 22 evaporator section of the second temperature-uniforming plate, then the flow that liquid phase working fluid phase transformation is evaporated in the first temperature-uniforming plate 21
It is larger, if the first cavity 211 is not connected to mutually with the second cavity 221, since liquid phase working fluid evaporates flow in the first cavity 211
Greatly, evaporation is very fast, and the medium level of the first cavity 211 will be less than the liquid level of the second cavity 221, when serious in first cavity 211
Liquid phase working fluid evaporating completely and cisco unity malfunction.
Two cavitys connection of U-shaped temperature-uniforming plate 2 in present embodiment, in the first cavity 211, the second cavity 221 liquid level from
Dynamic balancing, therefore the U-shaped temperature-uniforming plate 2 of present embodiment has unbalanced heat source the working medium equilibrium liquid of automatic adjustment temperature-uniforming plate
The effect of position and flow, thus there is better heat dissipation performance.
Since interface channel 231 is immersed in liquid refrigerant liquid level hereinafter, the first cavity 211 and the second chamber in present embodiment
The lower end of body 221 is interconnected liquid phase, and top is mutual disconnected gas phase, therefore the lower end of the first cavity 211 (is evaporated
Section), 221 lower end of the second cavity (evaporator section) liquid refrigerant heat absorption after evaporate, flow to the first cavity 211, the second cavity respectively
221 upper end condensation segment, flows back into evaporator section below cavity after cooling, circulation heat absorption evaporates and then play the role of heat dissipation.
Pedestal 1 and U-shaped temperature-uniforming plate 2 are assembled by press-fit approach in present embodiment.In present embodiment on pedestal 1
It is used to assemble U-shaped temperature-uniforming plate 2 equipped with the fitting groove 11 that the connecting plate 23 with U-shaped temperature-uniforming plate 2 matches, is equipped in fitting groove 11 more
A pillar 12, the corresponding position of connecting plate 23 offer and multiple multiple through-holes 232 to match with pillar 12, the through-hole
232 are interference fitted with the pillar 12, and the interface channel 231 on connecting plate 23 avoids the position of through-hole 232.In present embodiment
The position width that fitting groove 11 is correspondingly connected with channel 231 is widened and depth down forms escape groove 13, so that during press fitting
The corresponding position of interface channel 231 does not stress or stress is smaller, avoids interface channel 231 from wrinkling because of extruding flat.
When the U-shaped temperature-uniforming plate 2 of present embodiment carries out bending to plate using Bending Mould in process, bender
Tool also is provided with width on the position of the correspondence interface channel 231 and widens and the escape groove of depth down, in order to avoid shrivel connection
Channel.
It should be understood that can be provided only in other unshowned embodiments, on pedestal 1 and 23 phase of connecting plate
The fitting groove 11 matched is pressed between pedestal 1 and U-shaped temperature-uniforming plate 2 by connecting plate 23 and fitting groove 11.
It should be understood that being equipped with multiple pillars, the U in the fitting groove 11 in other unshowned embodiments
One side far from first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 on the connecting plate 23 of shape temperature-uniforming plate 2 corresponds to the pillar 12
Position is equipped with the groove to match with the pillar 12, and the groove avoids the position of the interface channel 231, i.e., in other realities
Apply the through-hole 232 that can be replaced using groove in embodiment two in mode.
It should be understood that groove can be set in fitting groove 11 in other unshowned embodiments, pillar setting
In the position of 23 respective slot of connecting plate.
It should be understood that U-shaped temperature-uniforming plate 2 can be two or more in other unshowned embodiments.
Negative pressure state is set as in closed cavity described in present embodiment, as a result, the liquid phase under negative pressure state
The boiling point for matter of exchanging work reduces, to be conducive to the heated rear rapid evaporation of phase-change working substance, radiates in time.It is to be appreciated that institute
Stating phase-change working substance includes but is not limited to water, alcohol and propyl alcohol.In addition, since the closed cavity is in a whole communicating passage, because
This only need to once fill, improve without filling the phase-change working substance respectively to the first cavity 211 and the second cavity 221
Efficiency is filled, filling cost is saved.
In use, the inside (that is, side far from U-shaped temperature-uniforming plate 2) that the heat source to radiate will be needed to be mounted on pedestal 1, or
Close to the inside of pedestal 1, the inside of heat from the pedestal 1 of heat source is transmitted to the outside of pedestal 1 (that is, close to U-shaped temperature-uniforming plate 2
Side), it is vaporized after the heat absorption of liquid phase-change working medium, the condensation segment exothermic condensation for flowing to U-shaped temperature-uniforming plate 2 is liquid phase-change working medium, is returned
It flow to the evaporator section of U-shaped temperature-uniforming plate 2.
Embodiment three
It please refers to Figure 12, the U-shaped temperature-uniforming plate of present embodiment, including the first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 and connects
The connecting plate 23 of first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 is connect, first temperature-uniforming plate 21 and the second temperature-uniforming plate 22 are mutually
Parallel and perpendicular to connecting plate 23.It is equipped with the first cavity (not shown) in first temperature-uniforming plate 21, is set in the second temperature-uniforming plate 22
There is the second cavity (not shown), is equipped with multiple interface channels 231 in connecting plate 23, first cavity, the second cavity pass through company
Road 231 is connected to be interconnected.First cavity, the second cavity and interface channel 231 constitute closed cavity.The closing chamber
It is filled with liquid phase-change working medium in vivo, when work, the intracorporal liquid phase-change working medium of closed chamber vaporizes after absorbing the heat of heat source, gas
State phase-change working substance is expanded rapidly and then is full of in entire closed cavity, coolant liquid after gaseous state phase-change working substance moves to condensation segment
Change, subsequent liquid phase-change working medium guides the evaporator section of reflux closed cavity again.
The radiator of present embodiment, including pedestal and above-mentioned U-shaped temperature-uniforming plate, pedestal and U-shaped temperature-uniforming plate pass through press fitting side
Formula assembles.Pedestal is equipped with the fitting groove to match with the connecting plate 23 of U-shaped temperature-uniforming plate for assembling U in present embodiment
Shape temperature-uniforming plate, fitting groove be equipped with multiple pillars, the corresponding position of connecting plate 23 offer it is multiple match with pillar it is multiple
Through-hole, the through-hole and the pillar are interference fitted, and the interface channel 231 on connecting plate 23 avoids lead to the hole site.This embodiment party
The width that fitting groove is correspondingly connected with the position fitting groove in channel 231 in formula is widened and depth down forms escape groove, so that pressing
The corresponding position of interface channel 231 does not stress during dress or stress is smaller, avoids interface channel 231 from wrinkling because of extruding flat.
The high-speed communication of the first cavity and the second cavity may be implemented in the setting of multiple interface channels 231 in the present embodiment,
Heat dissipation effect is improved, can satisfy the heat dissipation needs on high-power equipment surface.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff
Various changes and amendments can be carried out without departing from the scope of the present invention completely.The technical scope of this invention is not
The content being confined on specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (10)
1. a kind of U-shaped temperature-uniforming plate, which is characterized in that the U-shaped temperature-uniforming plate includes the first temperature-uniforming plate and the second temperature-uniforming plate and company
It connects the connecting plate of first temperature-uniforming plate and second temperature-uniforming plate, is equipped with the first cavity in first temperature-uniforming plate, described the
The second cavity is equipped in two temperature-uniforming plates.
2. U-shaped temperature-uniforming plate according to claim 1, which is characterized in that it is logical to be equipped at least one connection in the connecting plate
Road, first cavity and second cavity are interconnected by the interface channel.
3. U-shaped temperature-uniforming plate according to claim 2, which is characterized in that the width of the interface channel is 3~10mm.
4. U-shaped temperature-uniforming plate according to claim 2, which is characterized in that the interface channel is close to the connecting plate along long
Spend one end setting in direction.
5. U-shaped temperature-uniforming plate according to claim 2, which is characterized in that first cavity, the second cavity and the connection
Phase-change working substance is filled in channel, when the U-shaped temperature-uniforming plate is greater than 0 along the length direction of the connecting plate and the angle of horizontal plane
Degree and it is less than or equal to 90 degree and places, and when the interface channel is located at the lower end of the connecting plate, first cavity or the
The liquid level of the intracorporal phase-change working substance of two chambers is higher than the interface channel.
6. U-shaped temperature-uniforming plate according to claim 1, which is characterized in that first temperature-uniforming plate and second temperature-uniforming plate
It is parallel to each other and perpendicular to the connecting plate.
7. a kind of radiator, which is characterized in that it includes pedestal and U-shaped temperature-uniforming plate described in any one of claims 1-6, described
Pedestal is equipped with the fitting groove to match with the connecting plate of the U-shaped temperature-uniforming plate.
8. radiator according to claim 7, which is characterized in that the interface channel is located at the radiator when in use
The lower end of the connecting plate vertical direction, the interface channel are immersed in below the liquid level of phase-change working substance.
9. radiator according to claim 7, which is characterized in that be equipped with multiple pillars in the fitting groove, the U-shaped is equal
The position that the pillar is corresponded on the connecting plate of warm plate is equipped with the through-hole or groove to match with the pillar.
10. radiator according to claim 7, which is characterized in that the fitting groove corresponds to the position of the interface channel
Deepen and widens to form escape groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910333089.6A CN109906025B (en) | 2019-04-24 | 2019-04-24 | U-shaped temperature equalization plate and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910333089.6A CN109906025B (en) | 2019-04-24 | 2019-04-24 | U-shaped temperature equalization plate and radiator |
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| Publication Number | Publication Date |
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| CN109906025A true CN109906025A (en) | 2019-06-18 |
| CN109906025B CN109906025B (en) | 2024-02-20 |
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| CN201910333089.6A Active CN109906025B (en) | 2019-04-24 | 2019-04-24 | U-shaped temperature equalization plate and radiator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087925A (en) * | 2020-09-07 | 2020-12-15 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
| EP4033600A4 (en) * | 2019-09-19 | 2023-10-25 | KMW Inc. | Antenna device |
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