CN109905581A - Imaging modules, CCD camera assembly and electronic device - Google Patents
Imaging modules, CCD camera assembly and electronic device Download PDFInfo
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- CN109905581A CN109905581A CN201910218671.8A CN201910218671A CN109905581A CN 109905581 A CN109905581 A CN 109905581A CN 201910218671 A CN201910218671 A CN 201910218671A CN 109905581 A CN109905581 A CN 109905581A
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Abstract
The application provides a kind of imaging modules, CCD camera assembly and electronic device.Imaging modules include: shell, turn optical element, imaging sensor, electromagnetic component and sensing element.Shell offers light inlet.Turn optical element setting inside the shell.Imaging sensor setting is turning optical element side, and imaging sensor is for passing through the light of light inlet by turning optical element sensing.Electromagnetic component setting is turning optical element side.Sensing element is arranged on the outside of electromagnetic component, for detecting the rotational angle for turning optical element.Electromagnetic component is used to turn according to the data-driven that sensing element detects optical element and rotates so that imaging modules realize optical anti-vibration.So, sensing element is arranged on the outside of electromagnetic component, in an assembling process when the positional shift of sensing element, it can be larger to avoid the sensed data deviation detected, while guaranteeing that sensing element normally participates in optical anti-vibration, the precision that the collected data of sensing element can be improved is conducive to the accuracy for improving optical anti-vibration.
Description
Technical field
This application involves field of electronic devices more particularly to a kind of imaging modules, CCD camera assembly and electronic device.
Background technique
In the related art, in order to improve the effect of taking pictures of mobile phone, the camera of mobile phone uses periscope type lens mould group.?
In periscope type lens mould group, optical anti-vibration (Optical image is generally carried out by Hall sensor and magnetic element
Stabilization, OIS) closed-loop control.However, in an assembling process, the position of Hall sensor can generate deviation, lead
Cause the inaccuracy of the collected data of Hall sensor.
Summary of the invention
In view of this, the application provides a kind of imaging modules, CCD camera assembly and electronic device.
The imaging modules of the application embodiment, comprising:
Shell, the shell offer light inlet；
It is arranged in the shell and turns optical element；
The imaging sensor for turning optical element side is set, and described image sensor is used to turn optical element by described
Sensing passes through the light of the light inlet；
The electromagnetic component for turning optical element side is set；With
Sensing element on the outside of the electromagnetic component is set, it is described for detecting the rotational angle for turning optical element
Electromagnetic component according to the data-driven that the sensing element detects for turning optical element rotation so that the imaging modules
Realize optical anti-vibration.
The CCD camera assembly of the application embodiment includes the first imaging modules and the second imaging modules, first imaging
Mould group is above-mentioned imaging modules.Second imaging modules are set side by side with first imaging modules, second imaging
The field angle of mould group is greater than the field angle of first imaging modules.
The electronic device of the application embodiment includes casing and above-mentioned CCD camera assembly, and the CCD camera assembly passes through
The casing exposes.
In the imaging modules of the application embodiment, CCD camera assembly and electronic device, sensing element setting is in electromagnetism member
, can be larger to avoid the sensed data deviation detected in an assembling process when the positional shift of sensing element on the outside of part, it is protecting
While card sensing element normally participates in optical anti-vibration, the precision of the collected data of sensing element can be improved, be conducive to mention
The accuracy of high optical anti-vibration.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the electronic device of the application embodiment；
Fig. 2 is the stereoscopic schematic diagram of the CCD camera assembly of the application embodiment；
Fig. 3 is the stereoscopic schematic diagram of the first imaging modules of the application embodiment；
Fig. 4 is the decomposition diagram of the first imaging modules of the application embodiment；
Fig. 5 is the diagrammatic cross-section of the first imaging modules of the application embodiment；
Fig. 6 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application；
Fig. 7 is the simulation result schematic diagram of the sensing element of the relevant technologies；
Fig. 8 is the simulation result schematic diagram of the sensing element of the application embodiment；
Fig. 9 is the floor map of the driving device of the application embodiment；
Figure 10 is the stereoscopic schematic diagram for turning optical element of the application embodiment；
Figure 11 is the light catoptric imaging schematic diagram of imaging modules in the related technology；
Figure 12 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment；
Figure 13 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description:
Electronic device 1000, ontology 110, sliding block 200, gyroscope 120；
CCD camera assembly 100, the first imaging modules 20, shell 21, light inlet 211, groove 212, roof 213, side wall
214, turn optical element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23, the first Lens assembly
24, eyeglass 241, loading member 25, intermediate plate 222, the first imaging sensor 26, driving mechanism 27, driving device 28, sensing element
281, electromagnetic component 282, the first center line 2821, the second center line 2822, magnetic element 283, gap 284, distance A, size
B, drive circuit board 285, pivot center 29, the second imaging modules 30, the second Lens assembly 31, the second imaging sensor 32,
Three imaging modules 40, bracket 50.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 1000 of the application embodiment includes casing 102 and CCD camera assembly 100.Camera shooting
Head assembly 100 is exposed by casing 102.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.
Specifically, electronic device 1000 can be mobile phone or smart phone (for example, being based on iPhone system (apple
Fruit system), it is based on the phone of Android system (Android system)), portable gaming device (such as iPhone (apple hand
Machine)), laptop computer, palm PC (personal digital assistant, PDA), portable Internet appliance, sound
Happy player and data storage device, other handheld devices and such as wrist-watch, In-Ear Headphones, pendant, headphone
Deng.
Electronic device 100 can also be other wearable devices (for example, such as electronic glasses, electronics clothes, electronic hand
Bracelet, electronics necklace, electronics tatoo, the headset equipment (head mount display, HMD) of electronic equipment or smartwatch).
Casing 102 is the exterior components of electronic device 1000, plays the inner body of protection electronic device 1000
Effect.Casing 102 can be the rear cover of electronic device 1000, the components such as battery of overlay electronic device 1000.
In present embodiment, 100 postposition of CCD camera assembly, in other words, CCD camera assembly 100 are arranged in electronic device 1000
The back side so that electronic device 1000 can carry out postposition camera shooting.As Fig. 1 example in, CCD camera assembly 100 be arranged in machine
Upper position position in shell 102.
It will be appreciated, of course, that CCD camera assembly 100 can be set the top-left position of casing 102 or upper-right position etc. its
His position.The position that casing 102 is arranged in CCD camera assembly 100 is not limited to the example of the application.
Incorporated by reference to Fig. 2, CCD camera assembly 100 includes the first imaging modules 20, the second imaging modules 30, third imaging modules
40 and bracket 50.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in bracket 50 and and bracket
50 are fixedly connected.Bracket 50 can reduce what the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 were subject to
Impact improves the first imaging modules 20,40 service life of the second imaging modules 30 and third imaging modules.
In present embodiment, the field angle FOV3 of third imaging modules 40 is greater than the field angle FOV1 of the first imaging modules 20
And less than the field angle FOV2 of the second imaging modules 30, in other words, FOV1 < FOV3 < FOV2.In this way, different field angles
Three imaging modules make CCD camera assembly 100 can satisfy the shooting demand under different scenes.
In one example, the field angle FOV1 of the first imaging modules 20 is 10-30 degree, the visual field of the second imaging modules 30
Angle FOV2 is 110-130 degree, and the field angle FOV3 of third imaging modules 40 is 80-110 degree.
For example, 20 field angle FOV1 of the first imaging modules be 10 degree, 12 degree, 15 degree, 20 degree, 26 degree or 30 degree angularly.
Second imaging modules, 30 field angle FOV2 be 110 degree, 112 degree, 118 degree, 120 degree, 125 degree or 130 degree angularly.Third imaging
40 field angle FOV3 of mould group be 80 degree, 85 degree, 90 degree, 100 degree, 105 degree or 110 degree angularly.
Since the field angle FOV1 of the first imaging modules 20 is smaller, it will be understood that the focal length of the first imaging modules 20 is larger,
Therefore, the first imaging modules 20 can be used for shooting shooting distant view, to obtain distant view clearly image.Second imaging modules 30
Field angle FOV2 it is larger, it will be understood that the focal length of the second imaging modules 30 is shorter, and therefore, the second imaging modules 30 can be used
In shooting close shot, to obtain the close up fragmentary image of object.Third imaging modules 40 can be used for normal photographing object.
In this way, passing through the combination of the first imaging modules 20, the second imaging modules 30 and third imaging modules 40, can obtain
The image effects such as background blurring, picture part sharpening.
40 laid out in parallel of first imaging modules 20, the second imaging modules 30 and third imaging modules.In present embodiment, the
One imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged along same straight line.Further, the second imaging mould
Group 30 is between the first imaging modules 20 and third imaging modules 40.
Due to the field angle factor of the first imaging modules 20 and third imaging modules 40, in order to enable the first imaging modules 20
The preferable image of quality is obtained with third imaging modules 40, the first imaging modules 20 and third imaging modules 40 can be configured with light
Learn anti-shake apparatus, and optical anti-vibration device is typically arranged with more magnetic element, therefore, the first imaging modules 20 and third at
As mould group 40 can produce magnetic field.
In present embodiment, by the second imaging modules 30 between the first imaging modules 20 and third imaging modules 40,
So that the first imaging modules 20 and third imaging modules 40 may be located remotely from, the magnetic field for preventing the first imaging modules 20 from being formed and third
The magnetic field that imaging modules 40 are formed interferes with each other and influences the normal use of the first imaging modules 20 and third imaging modules 40.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 can refer to along the arrangement of same straight line
It is that the first imaging modules 20, the second imaging modules 30 and the arrangement of third imaging modules 40 are substantially in line-styled, can also refers to the
The light inlet central point of one imaging modules 20, the second imaging modules 30 and third imaging modules 40 is located at same straight line.
In other embodiments, the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 can arrange
It arranges L-shaped.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 arrange it is L-shaped also refer to, first
Imaging modules 20, the second imaging modules 30 and the arrangement of third imaging modules 40 are substantially L-shaped, can also refer to the first imaging modules
20, the line of the light inlet central point of the second imaging modules 30 and third imaging modules 40 is L-shaped.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 can be spaced setting, and adjacent two
Imaging modules can also be abutted against each other together.
In the first imaging modules 20, the second imaging modules 30 and third imaging modules 30, any one imaging modules can
Think black and white camera, RGB camera or infrared camera.
Please refer to Fig. 3-6, in present embodiment, the first imaging modules 20 include shell 21, turn optical element 22, mounting base
23, the first Lens assembly 24, loading member 25, the first imaging sensor 26, driving mechanism 27 and driving device 28.
Turn optical element 22, mounting base 23, the first Lens assembly 24, loading member 25 to be arranged in shell 21.Turn light member
Part 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on loading member 25.Loading member 25 is arranged in the first figure
As 26 side of sensor.Further, loading member 25 is located at and turns between optical element 22 and the first imaging sensor 26.
Driving mechanism 27 connects loading member 25 and shell 21.After incident light enters shell 21, by turning 22 turns of optical element
To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside
Boundary's image.Driving mechanism 27 is for driving loading member 25 to be moved along the optical axis of the first Lens assembly 24 so that the first Lens assembly
24 focus on the first imaging sensor 26 is imaged.
Shell 21 is generally square shaped, and shell 21 has light inlet 211, and incident light enters the first imaging from light inlet 211
In mould group 20.That is, turning optical element 22 for after turning to from the incident incident light of light inlet 211 and through the first lens set
The first imaging sensor 26 is reached after part 24 so that the first imaging sensor 26 senses the incident light outside the first imaging modules 20.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group.Compared to vertical lens module, periscopic
The height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical lens module refers to camera lens
The optical axis of mould group is straight line.In other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens module
On part.
It is appreciated that light inlet 211 by through-hole 11 expose so that ambient after through-hole 11 from light inlet 211 into
Enter in the first imaging modules 20.
Specifically, Fig. 4 please be join, shell 21 includes roof 213 and side wall 214.Side wall 214 is from the side of roof 213 2131
It extends to form.Roof 213 includes two opposite sides 2131.The quantity of side wall 214 is two, and each side wall 214 is certainly corresponding
A side 2131 extend.In other words, side wall 214 is separately connected the opposite two sides of roof 213.Light inlet 211 is formed in top
Wall 213.
Turning optical element 22 is prism or plane mirror.In one example, when turning optical element 22 is prism, prism can be
Triangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle,
To which another right-angle side is emitted after the reflection of bevel edge.
Certainly, incident light can be emitted after refraction by prism, and without reflection.Prism can use glass, plastics
Etc. the relatively good material of translucency be made.It in one embodiment, can be anti-in one of surface silver coating of prism etc.
Luminescent material is to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when turning optical element 22 is plane mirror.
More, Fig. 5 and Figure 10 are please referred to, turning optical element 22 has incidence surface 222, shady face 224, turns 226 and of smooth surface
Light-emitting surface 228.Incidence surface 222 close to and towards light inlet 211.Shady face 224 far from light inlet 211 and with 222 phase of incidence surface
Back.Turn smooth surface 226 and connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face 224.Light-emitting surface
228 the first imaging sensors 26 of direction.Turn smooth surface 226 to be obliquely installed relative to incidence surface 222.Light-emitting surface 228 and turn smooth surface 226
It is disposed opposite to each other.
Specifically, in the steering procedure of light, light, which passes through light inlet 211 and entered by incidence surface 222, turns optical element 22
In, then via the steering of smooth surface 226 is turned, finally reflected from light-emitting surface 228 and turn optical element 22, complete the process of light conversion.And
Shady face 224 and mounting base 23 are fixedly installed, and are keeping stablizing so as to turn optical element 22.
As shown in figure 11, in the related art, due to the needs of reflection incident ray, turn optical element 22a turns smooth surface
226a is tilted relative to horizontal direction, and turning optical element 22a on the reflection direction of light is unsymmetric structure.Thus, turn light
The opposite practical optical area turned above optical element 22a in the lower section of element 22a is smaller.It is to be understood that far from light inlet
It is less or can not reflection light that part turns smooth surface 226a.
Therefore, please join Figure 12, the application embodiment turn optical element 22 relative in the related technology turn optical element 22a
The corner angle far from light inlet have been cut off, have not only turned the effect of the reflection light of optical element 22 without influence in this way, has also reduced and turns
The integral thickness of optical element 22.
Referring to Fig. 5, turn smooth surface 226 relative to the angle [alpha] of incidence surface 222 in 45 degree of inclinations.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Further, turning optical element 22 can be made of relatively good materials of translucency such as glass, plastics.In a reality
It applies in mode, it can be in reflectorized materials such as the one of surface silver coatings for turning optical element 22 to reflect incident light.Certainly, turn light
Element 22 can use light total reflection principle and realize that incident light turns to.At this point, without being coated with reflectorized material turning optical element 22.
As Fig. 5 example in, incidence surface 222 is arranged in parallel with shady face 224.
In this way, can make to turn 22 held stationary of optical element, incidence surface 222 when shady face 224 and mounting base 23 are fixedly installed
Also it is rendered as plane, incident light imitates the conversion of light in the optical path of the conversion process for turning optical element 22 also formation rule
Rate is preferable.Specifically, entering light direction along light inlet 211, the section for turning optical element 22 is substantially trapezoidal, in other words, turns light member
The substantially trapezoidal body of part 22.
As Fig. 5 example in, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, can be formed it is more regular turn optical element 22, keep the optical path of incident ray more straight, improve turning for light
Change efficiency.
In one example, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.For example, incidence surface 222
The distance between shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..In other words, incidence surface 222 and shady face 224
Distance range it is to be understood that turn optical element 22 height be 4.8-5.0mm.
The incidence surface 222 of the above distance range is formed by that turn 22 volume of optical element moderate with shady face 224, can be preferable
Suit in the first imaging modules 20, forms the first imaging modules 20, CCD camera assembly 100 and the electricity of more compact property and miniaturization
Sub-device 1000 meets the more demands of consumer.
Optionally, incidence surface 222, shady face 224, turn smooth surface 226 and the equal cure process of light-emitting surface 228 is formed with hardening
Layer.
When turning optical element 22 and being made of materials such as glass, the material for turning optical element 22 itself is more crisp, turns light member to improve
The intensity of part 22, can be to turning the incidence surface 222 of optical element 22, shady face 224, turn smooth surface 226 and light-emitting surface 228 is done at hardening
Reason.More, cure process can be done to all surface for turning optical element, to further increase the intensity for turning optical element.
Further, cure process can be infiltration lithium ion, or in the premise for not influencing to turn optical element 22 and converting light
It is lower to give above each film on surface etc..
In one example, turning optical element 22 for the angle turned to from the incident incident light of light inlet 211 is 90 degree.Example
Such as, incidence angle of the incident light on the surface of emission for turning optical element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, turn optical element 22
By incident light turn to angle can also be other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned to
First imaging sensor 26.
In present embodiment, the quantity for turning optical element 22 is one, at this point, incident light reaches first after once turning to
Imaging sensor 26.In other embodiments, it is multiple for turning the quantity of optical element 22, at this point, incident light is by least twice
The first imaging sensor 26 is reached after steering.
Mounting base 23 turns optical element 22 for installing, and in other words, mounting base 23 is the carrier for turning optical element 22.Turn optical element
22 are fixed in mounting base 23.Make the position for turning optical element 22 in this way it was determined that being conducive to turn the reflection of optical element 22 or folding
Penetrate incident light.Turning optical element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
Specifically, in present embodiment, mounting base 23 is provided with position limiting structure 232, and the connection of position limiting structure 232 turns optical element
22 turn position of the optical element 22 in mounting base 23 with limitation.
In this way, position limiting structure 232 limitation turn position of the optical element 22 in mounting base 23 so that turn optical element 22 by
Positional shift will not occur in the case where shock, be conducive to 20 normal use of the first imaging modules.
It is appreciated that in one example, turning optical element 22 and being fixed on by way of bonding in mounting base 23, if saved
Slightly position limiting structure 232, then, when the first imaging modules 20 are impacted, if turned between optical element 2222 and mounting base 23
Bonding force is insufficient, turns optical element 22 and is easy to fall off from mounting base 23.
In present embodiment, mounting base 23 is formed with mounting groove 233, turns optical element 22 and is arranged in mounting groove 233, limit
Structure 232 is arranged in the edge of mounting groove 233 and against turning optical element 22.
In this way, mounting groove 233 can to turn optical element 22 to be easily mounted in mounting base 23.Position limiting structure 232 is arranged
Mounting groove 233 edge and against the edge for turning optical element 22, the position for turning optical element 22 not only can be limited, also not
It can interfere to turn optical element 22 for incident light emitting to the first imaging sensor 26.
Further, position limiting structure 232 includes the protrusion 234 of the edge protrusion of self installation slot 233, and protrusion 234 is against out
The edge of smooth surface 228.
Be mounted in mounting base 23 due to turning optical element 22 by turning smooth surface 226, and light-emitting surface 228 with turn 226 phase of smooth surface
Back setting.Therefore, turn optical element 22 to be more easier that position occurs towards the side of light-emitting surface 228 when being impacted.And this reality
Apply in mode, position limiting structure 232 against the edge of light-emitting surface 228, not only can anti-rotation stop optical element 22 to 228 side of light-emitting surface
Displacement, it can also be ensured that light normally goes out light from light-emitting surface 228.
Certainly, in other implementations, position limiting structure 232 may include other structures, turn light as long as can limit
The position of element 22.For example, position limiting structure 232 is formed with card slot, turns optical element 22 and be formed with limited post, the limited post
It is fastened on the position for turning optical element 22 to limitation in card slot.
In present embodiment, protrusion 234 is in a strip shape and extends along the edge of light-emitting surface 228.In this way, protrusion 234 and light out
The contact area at the edge in face 228 is big, allows and turns optical element 22 and be more seated firmly on mounting base 23.
Certainly, in other embodiments, protrusion 234 can also be in other structures such as bulks.
Referring to Fig. 4, in one example, mounting base 23 is movable to be arranged in shell 21.For example, mounting base 23
It is arranged by shaft in shell 21.Mounting base 23 can be rotated relative to shell 21 to adjust and turn optical element 22 and turn to incident light
Direction.
Mounting base 23 can be rotated towards the opposite direction of the shake of the first imaging modules 20 together with turn optical element 22, from
And the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in loading member 25, and further, the setting of the first Lens assembly 24 is turning light member
Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26
On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus real
Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 is mobile, the
The whole focal length of one Lens assembly 24 changes, so that the function of 20 zoom of the first imaging modules is realized, more, by driving mechanism
27 driving loading members 25 move in shell 21 to reach zoom purpose.
In the example of hgure 5, loading member 25 is cylindrical in shape, and multiple eyeglasses 241 in the first Lens assembly 24 are first along loading
The axially spaced-apart of part 25 is fixed in loading member 25.As Fig. 6 example in, loading member 25 include two intermediate plates 252, two
Eyeglass 241 is folded between two intermediate plates 252 by intermediate plate 252.
It is appreciated that since loading member 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required loading member 25
Very little larger, loading member 25 can have the structure of cavity for cylindrical shape, square tube shape etc..Such loading member 25 is cylindrical in shape, and is filled
Multiple eyeglasses 241 can be preferably arranged by carrying element 25, and can preferably protect eyeglass 241 in being not easy, eyeglass 241 in cavity
It shakes.
In addition, in the example of fig. 6, multiple eyeglasses 241 are held between two intermediate plates 252 by loading member 25, both had
Standby certain stability, can also reduce the weight of loading member 25, can reduce driving mechanism 27 and drive needed for loading member 25
Power, and the design difficulty of loading member 25 is relatively low, and eyeglass 241 is also easier to be set on loading member 25.
Certainly, loading member 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations,
Loading member 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way
More simple structure；Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241
Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member
Part.
Driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving mechanism.
Specifically, in the case where driving mechanism 27 is electromagnetic drive mechanism, driving mechanism 27 includes magnet and conductor, magnetic
Body is for generating magnetic field, and conductor is for driving loading member 25 mobile.When magnetic field is relative to conductor motion, sense is generated in conductor
Electric current is answered, makes conductor by the effect of Ampere force to drive loading member 25 to move.
In the case where driving mechanism 27 is drive mechanism, the inverse piezoelectric effect based on piezoceramic material can be with
Voltage is applied to driving mechanism 27, so that driving mechanism 27 generates mechanical stress.In other words, by between electric energy and mechanical energy
Conversion, control 27 mechanically deform of driving mechanism, thus drive loading member 25 move.
In the case where driving mechanism 27 is memorial alloy driving mechanism, driving mechanism 27 can be made to remember default shape in advance
Shape.When needing that loading member 25 is driven to move, driving mechanism 27 can be heated to the corresponding temperature of preset shape, so as to drive
Motivation structure 27 is restored to preset shape, so that loading member 25 be driven to move.
Referring to Fig. 5, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for
Driving is rotated with the mounting base 23 for turning optical element 22 around pivot center 29.Driving device 28 is for drive installation seat 23 along rotation
The axial movement of axis 29.
Pivot center 29 perpendicular to the optical axis of light inlet 211 and the photosensitive direction of the first imaging sensor 26 so that
First imaging modules 20 realize the optical anti-vibration in the optical axis of light inlet 211 and the axial direction of pivot center 29.
In this way, 28 drive installation seat 23 of driving device is two sides since the volume for turning optical element 22 is smaller compared with lens barrel
It moves upwards, the first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first one-tenth
As the small volume of mould group 20.
It please join Fig. 4-Fig. 5, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to short transverse
It is defined as Y-direction, length direction is defined as Z-direction.As a result, the optical axis of light inlet 211 be Y-direction, the first imaging sensor 26 it is photosensitive
Direction is Z-direction, the axial direction of pivot center 29 be X to.
28 drive installation seat 23 of driving device rotation, so that turning optical element 22 around X to rotation, so that the first imaging mould
Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,
So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with
Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, turning optical element 22 around X to when rotation, the light for turning the reflection of optical element 22 moves in Y-direction, so that
First imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Turn optical element 22 along X to shifting
When dynamic, the light for turning the reflection of optical element 22 is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X
Image with realize X to anti-shake effect.
Referring to Fig. 5, driving device 28 includes sensing element 281, electromagnetic component 282, magnetic element 283 and driving
Circuit board 285.
The setting of sensing element 281 is in 282 outside of electromagnetic component.Sensing element 281 is for detecting the rotation for turning optical element 22
Angle.The setting of electromagnetic component 282 is turning 22 side of optical element.Electromagnetic component 282 is used for the number detected according to sensing element 281
Turn optical element 22 according to driving to rotate so that the first imaging modules 20 realize optical anti-vibration.
Further, the rotation of data-driven mounting base 23 that electromagnetic component 282 is used to be detected according to sensing element 281 with
Band turn optical element 22 rotates.
Optionally, sensing element 281 is Hall sensor, and electromagnetic component 282 is coil, and magnetic element 283 is permanent magnet.
In this way, the setting of sensing element 281 is in 282 outside of electromagnetic component, the position of sensing element 281 is inclined in an assembling process
, can be larger to avoid the sensed data deviation detected when shifting, the same of optical anti-vibration is participated in guaranteeing that sensing element 281 is normal
When, the precision of the collected data of sensing element 281 can be improved, be conducive to the accuracy for improving optical anti-vibration.
The center of coil is generally arranged in Hall sensor by the relevant technologies, so that the initial value of Hall sensor is 0, from
And keep the range of Hall sensor maximum.However, the position of element can shift, and cause during the assembling of each element
The data that Hall sensor measures have error.For example, Hall sensor is arranged in the center of coil, Hall sensor initial value
For 0mv, after assembling, the offset of position causes Hall sensor the deviation of 10mv actually occur, influences caused by deviation at this time
It is 100%.
And if Hall sensor to be arranged in the outside of coil, Hall sensor then forms the initial of a non-zero
Value, can reduce influence caused by deviation in this way.For example, after Hall sensor to be arranged in the outside of coil, Hall sensor
Initial value be 140mv, after assembling, the offset of position causes Hall sensor the deviation of 10mv actually occur, at this time deviation
Caused by influence be 7%.
Defining the direction U is to turn optical element 22 along X to the direction moved, and the direction V is to turn optical element 22 around X to the side of rotation
To.
Fig. 7 and Fig. 8 are please referred to, defining the direction U is to turn optical element 22 along X to the direction moved, and the direction V is to turn optical element 22
Around X to the direction of rotation.
Fig. 7 is the simulation result of the deviation ratio of the direction U and the direction V Hall sensor in the related technology.Fig. 8 is in the application
The simulation result of the deviation ratio of Hall sensor on the direction the U and direction V.Wherein, horizontal axis is deviation ratio, and the longitudinal axis is to fall into correspondence
The quantity of the sample of deviation ratio.Deviation ratio (%)=(range of (actual value-central value)/Hall sensor) × 100%.Hall
The range of sensor is in the range of ± 1.5 °.
As can be seen from Figures 7 and 8, the application compared to the prior art, on the direction V, more concentrate by data, that is to say
It says, deviation ratio is smaller.Further, deviation ratio of the Hall sensor on the direction V can be reduced into the prior art by the application
Deviation ratio one thousandth.
Referring to Fig. 9, electromagnetic component 282 is annular, electromagnetic component 282 has the first center line 2821, sensing element 281
Deviate the setting of the first center line 2821.First center line, the 2821 distance A at the center of sensing element 281 and electromagnetic component 282
Range be 0.5mm-1.0mm.
It is 0.5mm- in the range of the 2821 distance A of the first center line at the center and electromagnetic component 282 of sensing element 281
In the case where 1.0mm, the initial value after offset is more appropriate.It is appreciated that the initial value after offset cannot be too small, in this way can not
More reduce deviation ratio；Initial value after offset can not be excessive, and the range that will lead to Hall sensor in this way is inadequate.
Preferably, the center of sensing element 281 is 0.75mm at a distance from the first center line 2821 of electromagnetic component 282.
In another example, the 2821 distance A of the first center line at the center of sensing element 281 and electromagnetic component 282
For 0.5mm；In another example, the center of sensing element 281 and the 2821 distance A of the first center line of electromagnetic component 282
For 0.8mm；In further example, the center of sensing element 281 and the 2821 distance A of the first center line of electromagnetic component 282
For 1mm.Herein not to the specific value at the center of sensing element 281 and the 2821 distance A of the first center line of electromagnetic component 282
It is defined.
It is appreciated that electromagnetic component 282 or round, rectangular or other arbitrary shapes, herein not to electromagnetic component
282 concrete shape is defined.
In addition, in the example of figure 9, sensing element 281 is located at the side of electromagnetic component 282, it will be understood that in others
In example, sensing element 281 can be located at the other side of electromagnetic component 282.As long as sensing element 281 not with the first imaging modules
20 existing structures interfere, and are not defined herein to the specific location of sensing element 281.
Electromagnetic component 282 has the second center line 2822, and the second center line 2822 is vertical with the first center line 2821, and second
Center line 2822 and the first center line 2821 intersect at the center of electromagnetic component 282, and the quantity of sensing element 281 is two, and two
A sensing element 281 is symmetrical arranged about the second center line 2822 of electromagnetic component 282.
In this way, the data that electromagnetic component 282 can be made to measure are more accurate.It specifically, can be by two electromagnetic components
The data of 282 outputs are calculated, such as are averaged, to obtain more accurate data.In addition, an electromagnetism wherein
When element 282 is abnormal, being normally carried out for optical anti-vibration can also be guaranteed by another electromagnetic component 282, be conducive to improve
The reliability of driving device 28.
Certainly, in other examples, the quantity of sensing element 281 may be 3,4 or any other quantity,
This is not defined the particular number of sensing element 281.
In mounting base 23, electromagnetic component 282 acts on after being used to apply voltage with magnetic element 283 setting of magnetic element 283
With the rotation of drive installation seat 23.
In this way, can be rotated by drive installation seat 23, come so that turning the rotation of optical element 22, to realize optical anti-vibration.
Specifically, for sensing element 281 after detecting rotational angle, processor can be according to data it is determined that being applied to electromagnetic component
282 voltage, electromagnetic component 282 generate magnetic field, effect of the magnetic element 283 by magnetic field, to drive after application of a voltage
Mounting base 23 rotates to compensate the shake of the first imaging modules 10.Optical anti-vibration can be realized in this way.
Gap 284 is formed between sensing element 281 and magnetic element 283.The size B range in gap 284 is 0.20mm-
0.25mm。
In this way, the space of magnetic element 283 and the rotation of mounting base 23 can be merged out, guarantee magnetic element 283 and installation
Seat 23 will not interfere in the course of rotation with sensing element 281.Specifically, gap 284 is the air gap.
Preferably, the size B in gap 284 is 0.22mm.In another example, the size in gap 284 is 0.20mm；?
In another example, the size B in gap 284 is 0.21mm；In further example, the size B in gap 284 is 0.25mm.?
This is not defined the specific value of the size B in gap 284.
Drive circuit board 285 is arranged in shell 21.Further, shell 21 includes roof 213 and opposite with roof 213
Bottom wall 216, roof 213 are formed with light inlet 211, and drive circuit board 285 is arranged in bottom wall 216.Electromagnetic component 282 and induction member
Part 281 is arranged at drive circuit board 285.
In this way, the first imaging modules can be made while guaranteeing that drive circuit board 285 powers to electromagnetic component 282
20 structure is more compact, is conducive to the miniaturization of the first imaging modules 20.Specifically, drive circuit board 285 can be flexibility
Circuit board, printed circuit board or other kinds of circuit board.
Drive circuit board 285 can be by the modes such as welding, being bonded in bottom wall 216.In one example, drive circuit board
285 can be by adhesive tape gluing in bottom wall 216.
During assembling, electromagnetic component 282 and sensing element 281 first can be fixed on drive circuit board 285, then
Drive circuit board 285 is fitted in bottom wall 216, bottom wall 216 is finally assembled into shell 21.In this way, it is simple and convenient, it can be improved
The efficiency of assembling.
It should be pointed out that the bottom wall 216 of shell 21 is arranged in drive circuit board 285.Can refer to drive circuit board 285 with
The bottom wall 216 of shell 21, which contacts, to be fixed, and can also refer to that drive circuit board 285 is solid by the bottom wall 216 of other elements and shell 21
Fixed connection.
Please refer to Figure 13, in present embodiment, the second imaging modules 30 are vertical lens module, certainly, in other implementations
In mode, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for
Light is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31
It is overlapped.
In present embodiment, the second imaging modules 30 can be tight shot mould group, therefore, the mirror of the second Lens assembly 31
Piece 241 is less, so that 30 height of the second imaging modules is lower, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be able to be with the type of the first imaging sensor 26 it is the same, it is no longer superfluous herein
It states.
The structure of third imaging modules 40 is similar with the structure of the second imaging modules 30, for example, third imaging modules 40
For vertical lens module.Therefore, the feature of third imaging modules 40 please refers to the feature of the second imaging modules 40, herein not superfluous
It states.
To sum up, the first imaging modules 20 include shell 21, turn optical element 22, the first imaging sensor 26, electromagnetic component 282
With sensing element 281.
Shell 21 offers light inlet 211.Turn optical element 22 to be arranged in shell 21.The setting of first imaging sensor 26 exists
Turn 22 side of optical element, the first imaging sensor 26 is used to pass through by turning the sensing of optical element 22 light of light inlet 211.Electromagnetism
The setting of element 282 is turning 22 side of optical element.The setting of sensing element 281 turns optical element for detecting in 282 outside of electromagnetic component
22 rotational angle.Electromagnetic component 282 be used for according to the data-driven that sensing element 281 detects turn optical element 22 rotate so that
First imaging modules 20 realize optical anti-vibration.
In this way, the setting of sensing element 281 is in 282 outside of electromagnetic component, the position of sensing element 281 is inclined in an assembling process
, can be larger to avoid the sensed data deviation detected when shifting, the same of optical anti-vibration is participated in guaranteeing that sensing element 281 is normal
When, the precision of the collected data of sensing element 281 can be improved, be conducive to the accuracy for improving optical anti-vibration.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become
Type, scope of the present application are defined by the claims and their equivalents.
Claims (20)
1. a kind of imaging modules characterized by comprising
Shell, the shell offer light inlet；
It is arranged in the shell and turns optical element；
The imaging sensor for turning optical element side is set, and described image sensor is used to turn optical element sensing by described
By the light of the light inlet；
The electromagnetic component for turning optical element side is set；With
Sensing element on the outside of the electromagnetic component is set, for detecting the rotational angle for turning optical element, the electromagnetism
Element is rotated for turning optical element according to the data-driven that the sensing element detects so that the imaging modules are realized
Optical anti-vibration.
2. imaging modules as described in claim 1, which is characterized in that the electromagnetic component is annular, the electromagnetic component tool
There is the first center line, the sensing element deviates the first center line setting.
3. imaging modules as claimed in claim 2, which is characterized in that the center of the sensing element and the electromagnetic component
The range of the distance of first center line is 0.5mm-1.0mm.
4. imaging modules as claimed in claim 2, which is characterized in that the electromagnetic component has the second center line, and described the
Two center lines and first central axis, second center line and first center line intersect at the electromagnetic component
Center, the quantity of the sensing element is two, second center line of two sensing elements about the electromagnetic component
It is symmetrical arranged.
5. imaging modules as described in claim 1, which is characterized in that the imaging modules include drive circuit board, the drive
Dynamic circuit board, which is arranged, is arranged at the drive circuit board in the shell, the electromagnetic component and the sensing element.
6. imaging modules as claimed in claim 5, which is characterized in that the shell includes roof and opposite with the roof
Bottom wall, the roof are formed with the light inlet, and the drive circuit board is arranged in the bottom wall.
7. imaging modules as described in claim 1, which is characterized in that the sensing element is Hall sensor, the electromagnetism
Element is coil.
8. imaging modules as described in claim 1, which is characterized in that the imaging modules include that setting is intracorporal in the shell
Mounting base, the optical element that turns are fixed on the mounting base, what the electromagnetic component was used to be detected according to the sensing element
The rotation of mounting base described in data-driven is to drive the optical element that turns to rotate.
9. imaging modules as claimed in claim 8, which is characterized in that the imaging modules include magnetic element, the magnetism
In the mounting base, the electromagnetic component is acted on after being used to apply voltage with the magnetic element to drive the peace for element setting
Fill seat rotation.
10. imaging modules as claimed in claim 9, which is characterized in that shape between the sensing element and the magnetic element
At there is gap.
11. imaging modules as claimed in claim 10, which is characterized in that the size range in the gap is 0.20mm-
0.25mm。
12. imaging modules as claimed in claim 8, which is characterized in that the mounting base is provided with position limiting structure, the limit
Turn optical element described in structure connection to limit and described turn position of the optical element in the mounting base.
13. imaging modules as claimed in claim 12, which is characterized in that the mounting base is formed with mounting groove, described to turn light
Element is arranged in the mounting groove, and the position limiting structure is arranged in the edge of the mounting groove and against the optical element that turns
Edge.
14. imaging modules as claimed in claim 13, which is characterized in that the optical element that turns has towards the light inlet
Incidence surface and the light-emitting surface for connecting the incidence surface, the light-emitting surface include towards described image sensor, the position limiting structure
The protrusion protruded from the edge of the mounting groove, the protrusion is against the edge of the light-emitting surface.
15. imaging modules as described in claim 1, which is characterized in that the imaging modules further include:
Loading member that is that described image sensor side is set and being contained in the shell；
The Lens assembly being fixed on the loading member；With
The driving mechanism of the shell and the loading member is connected, the driving mechanism is for driving the loading member along institute
State the mobile imaging so that the Lens assembly is focused in described image sensor of optical axis of Lens assembly.
16. imaging modules as claimed in claim 15, which is characterized in that the loading member is cylindrical in shape, the Lens assembly
In multiple eyeglasses be fixed in the loading member along the axially spaced-apart of the loading member；Or
The loading member includes two intermediate plates, and the Lens assembly is folded between described two intermediate plates.
17. imaging modules as described in claim 1, which is characterized in that the optical element that turns includes plane mirror or prism.
18. a kind of CCD camera assembly characterized by comprising
First imaging modules, first imaging modules are the described in any item imaging modules of claim 1-17；With
Second imaging modules, second imaging modules are set side by side with first imaging modules, second imaging modules
Field angle be greater than first imaging modules field angle.
19. CCD camera assembly as claimed in claim 18, which is characterized in that the CCD camera assembly includes third imaging mould
Group, first imaging modules, second imaging modules and the third imaging modules are arranged along same straight line, and described second
Imaging modules are between first imaging modules and the third imaging modules.
20. a kind of electronic device characterized by comprising
Casing；With
CCD camera assembly described in claim 18 or 19, the CCD camera assembly are exposed by the casing.
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| CN201910218671.8A CN109905581B (en) | 2019-03-21 | 2019-03-21 | Imaging module, camera assembly and electronic device |
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| CN201910218671.8A CN109905581B (en) | 2019-03-21 | 2019-03-21 | Imaging module, camera assembly and electronic device |
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