CN209823877U

CN209823877U - Camera module, camera assembly and electronic device

Info

Publication number: CN209823877U
Application number: CN201921115288.1U
Authority: CN
Inventors: 薛兵
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-07-16
Filing date: 2019-07-16
Publication date: 2019-12-20
Anticipated expiration: 2029-07-16

Abstract

The utility model provides a camera module, camera subassembly and electron device. The camera module includes: the device comprises a shell, a light conversion element, an image sensor, an electromagnetic element, an induction element and a driving chip. The shell is provided with a light inlet. The light conversion element is arranged in the shell. The image sensor is arranged on one side of the light conversion element and used for sensing the light passing through the light inlet through the light conversion element. The electromagnetic element is arranged on one side of the light conversion element. The induction element is arranged outside the electromagnetic element and used for detecting the rotation angle of the light conversion element. The driving chip is connected with the sensing element, the driving chip is used for processing output data of the sensing element to obtain anti-shake data, and the electromagnetic element is used for driving the light conversion element to rotate according to the anti-shake data so as to enable the camera module to realize optical anti-shake. So, can make the noise of anti-shake data reduce to it is more accurate to make electromagnetic element change optical element according to anti-shake data drive, and then makes the effect of camera module optics anti-shake better.

Description

Camera module, camera assembly and electronic device

Technical Field

The utility model relates to an electron device field especially relates to a camera module, camera subassembly and electron device.

Background

In the related art, in order to improve the photographing effect of the mobile phone, a periscopic lens module is adopted for a camera of the mobile phone. In a periscopic lens module, closed-loop control of Optical Image Stabilization (OIS) is generally performed by an inductive element and a magnetic element. However, the anti-shake data is usually noisy, resulting in poor anti-shake effect.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a camera module, camera subassembly and electron device.

The utility model discloses embodiment's camera module, include:

the shell is provided with a light inlet;

a light conversion element disposed within the housing;

the image sensor is arranged on one side of the light conversion element and used for sensing the light rays passing through the light inlet through the light conversion element;

the electromagnetic element is arranged on one side of the light conversion element; and

the induction element is arranged on the outer side of the electromagnetic element and used for detecting the rotation angle of the light conversion element;

the driving chip is used for processing output data of the induction element to obtain anti-shake data, and the electromagnetic element is used for driving the light conversion element to rotate according to the anti-shake data so as to enable the camera module to realize optical anti-shake.

The utility model discloses embodiment's camera subassembly includes first camera module and second camera module, first camera module is foretell camera module. The second camera module and the first camera module are arranged in parallel, and the field angle of the second camera module is larger than that of the first camera module.

The utility model discloses embodiment's electron device includes casing and foretell camera subassembly, the camera subassembly passes through the casing exposes.

The utility model discloses among embodiment's the camera module, camera subassembly and the electronic device, handle sensing element's output data through drive chip in order to obtain anti-shake data, can be so that the noise of anti-shake data reduces to it is more accurate to make electromagnetic element change optical element according to anti-shake data drive, and then makes the effect of camera module optics anti-shake better.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic plan view of an electronic device according to an embodiment of the present invention;

fig. 2 is a schematic perspective view of a camera assembly according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a first camera module according to an embodiment of the present invention;

fig. 4 is an exploded schematic view of a first camera module according to an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a first camera module according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of a first camera module according to another embodiment of the present invention;

FIG. 7 is a diagram showing simulation results of a related art sensing element;

fig. 8 is a diagram illustrating simulation results of an inductive element according to an embodiment of the present invention;

fig. 9 is a schematic plan view of a drive device according to an embodiment of the present invention;

fig. 10 is a schematic perspective view of a light conversion element according to an embodiment of the present invention;

fig. 11 is a schematic view of light reflection imaging of a camera module in the related art;

fig. 12 is a schematic view of light reflection imaging of the first camera module according to the embodiment of the present invention;

fig. 13 is a schematic block diagram of a driving chip of the first camera module according to the embodiment of the present invention;

fig. 14 is a schematic structural diagram of a driving chip of a first camera module according to an embodiment of the present invention;

fig. 15 is a schematic diagram of a noise simulation result of the first camera module according to the embodiment of the present invention.

Fig. 16 is another schematic diagram of a noise simulation result of the first camera module according to the embodiment of the present invention.

Fig. 17 is a schematic view of the posture difference performance of the first camera module according to the embodiment of the present invention.

Fig. 18 is a schematic diagram of an attitude difference and a temperature rise of the first camera module according to the embodiment of the present invention.

Fig. 19 is a schematic cross-sectional view of a second camera module according to an embodiment of the present invention.

Description of the main element symbols:

the electronic device 1000, the body 110;

the camera module 100, the first camera module 20, the housing 21, the light inlet 211, the groove 212, the top wall 213, the side wall 214, the light conversion element 22, the light inlet surface 222, the back light surface 224, the light inlet surface 226, the light outlet surface 228, the mounting seat 23, the first lens assembly 24, the lens 241, the loading element 25, the clamping piece 222, the first image sensor 26, the driving mechanism 27, the driving device 28, the sensing element 281, the electromagnetic element 282, the first center line 2821, the second center line 2822, the magnetic element 283, the gap 284, the distance a, the size B, the driving circuit board 285, the driving chip 286, the rotation axis 29, the second camera module 30, the second lens assembly 31, the second image sensor 32, the third camera module 40, and the bracket 50.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present invention includes a housing 102 and a camera assembly 100. The camera assembly 100 is exposed through the chassis 102.

By way of example, the electronic device 1000 may be any of various types of computer system equipment (only one modality shown in fig. 1 by way of example) that is mobile or portable and that performs wireless communications.

Specifically, the electronic apparatus 1000 may be a mobile phone or a smart phone (e.g., an iPhone system (apple) based phone, an Android system (Android) based phone), a portable game device (e.g., an iPhone (apple phone)), a laptop, a Palmtop (PDA), a portable internet appliance, a music player, and a data storage device, other handheld devices, and devices such as a watch, an in-ear headset, a pendant, a headset, and the like.

The electronic apparatus 100 may also be other wearable devices (e.g., head mounted di spot, HMD), such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smartwatches).

The housing 102 is an external component of the electronic device 1000, and functions to protect internal components of the electronic device 1000. The housing 102 may be a rear cover of the electronic device 1000, which covers components of the electronic device 1000 such as a battery.

In this embodiment, the camera assembly 100 is disposed at the rear, or the camera assembly 100 is disposed at the rear of the electronic device 1000 so that the electronic device 1000 can perform rear-view imaging. As in the example of fig. 1, the camera assembly 100 is disposed at an upper-middle portion of the housing 102.

Of course, it is understood that the camera assembly 100 may be disposed at other positions, such as an upper left or upper right position of the housing 102. The position where the camera assembly 100 is disposed on the chassis 102 is not limited to the example of the present invention.

Referring to fig. 2, the camera assembly 100 includes a first camera module 20, a second camera module 30, a third camera module 40, and a bracket 50.

First camera module 20, second camera module 30 and third camera module 40 all set up in support 50 and with support 50 fixed connection. The support 50 can reduce the impact that first camera module 20, second camera module 30 and third camera module 40 received, improves first camera module 20, second camera module 30 and third camera module 40 life-span.

In the present embodiment, the viewing angle FOV3 of the third camera module 40 is greater than the viewing angle FOV1 of the first camera module 20 and smaller than the viewing angle FOV2 of the second camera module 30, that is, FOV1 < FOV3 < FOV 2. In this way, the three camera modules with different field angles enable the camera assembly 100 to meet shooting requirements in different scenes.

In one example, the field of view FOV1 of the first camera module 20 is 10-30 degrees, the field of view FOV2 of the second camera module 30 is 110-130 degrees, and the field of view FOV3 of the third camera module 40 is 80-110 degrees.

For example, the field angle FOV1 of the first camera module 20 is 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees, or 30 degrees. The angle FOV2 of the second camera module 30 is 110, 112, 118, 120, 125 or 130 degrees. The angle FOV3 of the third camera module 40 is 80, 85, 90, 100, 105 or 110 degrees.

Since the field angle FOV1 of the first camera module 20 is small, it can be understood that the focal length of the first camera module 20 is large, and therefore, the first camera module 20 can be used for shooting a long shot, so as to obtain a clear long shot image. The field angle FOV2 of the second camera module 30 is larger, and it can be understood that the focal length of the second camera module 30 is shorter, so that the second camera module 30 can be used for shooting a close-up view, thereby obtaining a close-up image of a part of an object. The third camera module 40 may be used to normally photograph an object.

Thus, through the combination of the first camera module 20, the second camera module 30 and the third camera module 40, image effects such as background blurring and local sharpening of images can be obtained.

The first camera module 20, the second camera module 30 and the third camera module 40 are arranged in parallel. In the present embodiment, the first camera module 20, the second camera module 30, and the third camera module 40 are arranged along the same straight line. Further, the second camera module 30 is located between the first camera module 20 and the third camera module 40.

Due to the field angle of the first camera module 20 and the third camera module 40, in order to make the first camera module 20 and the third camera module 40 obtain images with better quality, the first camera module 20 and the third camera module 40 may be configured with an optical anti-shake device, and the optical anti-shake device is generally configured with more magnetic elements, so that the first camera module 20 and the third camera module 40 can generate a magnetic field.

In this embodiment, the second camera module 30 is located between the first camera module 20 and the third camera module 40, so that the first camera module 20 and the third camera module 40 can be kept away from each other, and the magnetic field formed by the first camera module 20 and the magnetic field formed by the third camera module 40 are prevented from interfering with each other to affect the normal use of the first camera module 20 and the third camera module 40.

First camera module 20, second camera module 30 and third camera module 40 arrange along same straight line and can indicate, first camera module 20, second camera module 30 and third camera module 40 arrange and roughly be "one" style of calligraphy, also can indicate that the light inlet central point of first camera module 20, second camera module 30 and third camera module 40 is located same straight line.

In other embodiments, the first, second and third camera modules 20, 30 and 40 may be arranged in an L shape.

The arrangement of the first camera module 20, the second camera module 30 and the third camera module 40 in an L shape can mean that the arrangement of the first camera module 20, the second camera module 30 and the third camera module 40 is approximately in an L shape, and also mean that the connection line of the light inlet center points of the first camera module 20, the second camera module 30 and the third camera module 40 is in an L shape.

First camera module 20, second camera module 30 and third camera module 40 can set up at the interval, and two adjacent camera modules also can support each other and lean on together.

In the first camera module 20, the second camera module 30, and the third camera module 30, any one of the camera modules may be a black-and-white camera, an RGB camera, or an infrared camera.

Referring to fig. 3-6, in the present embodiment, the first camera module 20 includes a housing 21, a light conversion element 22, a mounting base 23, a first lens assembly 24, a loading element 25, a first image sensor 26, a driving mechanism 27, and a driving device 28.

The light conversion element 22, the mounting seat 23, the first lens assembly 24 and the loading element 25 are all disposed in the housing 21. The light conversion element 22 is disposed on the mounting base 23, and the first lens assembly 24 is fixed on the loading element 25. The loading member 25 is disposed at a side of the first image sensor 26. Further, the loading element 25 is located between the light conversion element 22 and the first image sensor 26.

A drive mechanism 27 connects the loading element 25 with the housing 21. After entering the housing 21, the incident light is turned by the light-turning element 22 and then reaches the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 obtains an external image. The driving mechanism 27 is used for driving the loading element 25 to move along the optical axis of the first lens assembly 24 so as to focus and image the first lens assembly 24 on the first image sensor 26.

The housing 21 has a substantially square shape, and the housing 21 has a light inlet 211, and the incident light enters the first camera module 20 through the light inlet 211. That is, the light diverting element 22 is used for diverting the incident light entering from the light inlet 211 and transmitting the diverted incident light to the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 senses the incident light outside the first camera module 20.

Therefore, it can be understood that the first camera module 20 is a periscopic lens module. Compared with the vertical lens module, the periscopic lens module has a smaller height, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module means that the optical axis of the lens module is a straight line. In other words, the incident light is transmitted to the photosensitive device of the lens module along a linear optical axis.

It can be understood that the light inlet 211 is exposed through the through hole 11, so that external light enters the first camera module 20 from the light inlet 211 after passing through the through hole 11.

Specifically, referring to fig. 4, the housing 21 includes a top wall 213 and a side wall 214. The side wall 214 is formed extending from a side edge 2131 of the top wall 213. The top wall 213 includes two opposing sides 2131. The number of sidewalls 214 is two, and each sidewall 214 extends from a corresponding one of the side edges 2131. Alternatively, the sidewalls 214 are connected to opposite sides of the top wall 213. The light inlet 211 is formed in the top wall 213.

The light conversion element 22 is a prism or a plane mirror. In one example, when light-turning element 22 is a prism, the prism may be a triangular prism having a cross-section in the form of a right triangle, wherein light is incident on one of the legs of the right triangle and exits the other leg after being reflected by the hypotenuse.

Of course, the incident light may exit after being refracted by the prism without being reflected. The prism can be made of glass, plastic and other materials with better light transmittance. In one embodiment, one of the surfaces of the prism may be coated with a light reflecting material such as silver to reflect incident light.

It will be appreciated that when the light conversion element 22 is a flat mirror, the flat mirror reflects incident light to effect the conversion of the incident light.

Further, referring to fig. 5 and fig. 10, the light conversion element 22 has a light incident surface 222, a light backlight surface 224, a light conversion surface 226 and a light emitting surface 228. The light incident surface 222 is close to and faces the light inlet 211. The backlight surface 224 is far away from the light inlet 211 and is opposite to the light incident surface 222. The light-turning surface 226 connects the light-incident surface 222 and the light-exiting surface 224. The light-emitting surface 228 connects the light-entering surface 222 and the light-exiting surface 224. The light exit surface 228 faces the first image sensor 26. The light-turning surface 226 is disposed obliquely to the light-entering surface 222. The light emitting surface 228 is opposite to the light rotating surface 226.

Specifically, in the light turning process, the light passes through the light inlet 211, enters the light conversion element 22 through the light incident surface 222, is turned through the light turning surface 226, and finally reflects the light conversion element 22 from the light emitting surface 228, thereby completing the light conversion process. And the backlight surface 224 is fixedly arranged with the mounting seat 23 so as to keep the light-converting element 22 stable.

As shown in fig. 11, in the related art, the light diverting surface 226a of the light diverting element 22a is inclined with respect to the horizontal direction due to the need to reflect the incident light, and the light diverting element 22a has an asymmetric structure in the reflection direction of the light. Thus, the actual optical area below the light conversion element 22a is smaller than the actual optical area above the light conversion element 22 a. This is understood to mean that the portion of the light-diverting surface 226a away from the light inlet is less or unable to reflect light.

Therefore, referring to fig. 12, the light conversion element 22 according to the embodiment of the present invention has a cut off corner away from the light inlet with respect to the light conversion element 22a in the related art, which not only does not affect the effect of the reflected light of the light conversion element 22, but also reduces the overall thickness of the light conversion element 22.

Referring to fig. 5 again, the light-converting surface 226 is inclined at an angle α of 45 degrees with respect to the light-incident surface 222.

Therefore, the incident light rays are better reflected and converted, and a better light ray conversion effect is achieved.

Further, the light conversion element 22 may be made of a material having relatively good light transmittance, such as glass or plastic. In one embodiment, one of the surfaces of the light conversion element 22 may be coated with a light reflecting material such as silver to reflect incident light. Of course, the light diverting element 22 may utilize the principle of total reflection of light to divert incident light. In this case, the light conversion element 22 need not be coated with a light reflecting material.

As in the example of fig. 5, the light incident surface 222 and the light emergent surface 224 are arranged in parallel.

Thus, when the backlight surface 224 and the mounting base 23 are fixedly arranged, the light conversion element 22 can be kept stable, the light incident surface 222 is also a plane, and the incident light forms a regular light path in the conversion process of the light conversion element 22, so that the conversion efficiency of the light is better. Specifically, the cross section of the light conversion element 22 is substantially trapezoidal along the light incident direction of the light incident port 211, or the light conversion element 22 is substantially trapezoidal.

As in the example of fig. 5, the light-in surface 222 and the light-out surface 224 are both perpendicular to the light-out surface 228.

Thus, a regular light conversion element 22 can be formed, so that the light path of the incident light is relatively straight, and the light conversion efficiency is improved.

In one example, the distance between the light-in surface 222 and the light-out surface 224 is in the range of 4.8-5.0 mm. For example, the distance between the light incident surface 222 and the light backlight surface 224 may be 4.85mm, 4.9mm, 4.95mm, and the like. Alternatively, the distance between the light incident surface 222 and the light emergent surface 224 can be understood as the height of the light conversion element 22 is 4.8-5.0 mm.

The light conversion element 22 formed by the light incident surface 222 and the light backlight surface 224 within the above distance range has a moderate volume, and can be better integrated into the first camera module 20, so as to form a more compact and miniaturized first camera module 20, camera assembly 100 and electronic device 1000, thereby satisfying more demands of consumers.

Optionally, the light incident surface 222, the light backlight surface 224, the light conversion surface 226 and the light emitting surface 228 are hardened to form a hardened layer.

When the light conversion element 22 is made of glass or other materials, the light conversion element 22 itself is brittle, and in order to increase the strength of the light conversion element 22, the light incident surface 222, the back light surface 224, the light conversion surface 226, and the light emitting surface 228 of the light conversion element 22 may be hardened. Furthermore, all the surfaces of the light conversion element can be hardened to further improve the strength of the light conversion element.

Further, the hardening treatment may be infiltration of lithium ions, or coating of the above surfaces without affecting the light conversion of the light conversion element 22.

In one example, the light diverting element 22 diverts incident light incident from the light inlet 211 by an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the light conversion element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the light diverting element 22 diverts the incident light may be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light can be diverted to reach the first image sensor 26.

In this embodiment, the number of the light diverting elements 22 is one, and in this case, the incident light is once diverted and then transmitted to the first image sensor 26. In other embodiments, the number of the light diverting elements 22 is multiple, and the incident light is diverted to the first image sensor 26 at least twice.

The mounting 23 is used for mounting the light converting element 22, or the mounting 23 is a carrier of the light converting element 22. The light conversion element 22 is fixed on the mounting base 23. This allows the position of the light-diverting element 22 to be determined, which facilitates the reflection or refraction of the incident light by the light-diverting element 22. Light conversion element 22 can be fixed on mounting base 23 by adhesive bonding to achieve a fixed connection with mounting base 23.

Specifically, in the present embodiment, the mounting base 23 is provided with a limiting structure 232, and the limiting structure 232 is connected to the light conversion element 22 to limit the position of the light conversion element 22 on the mounting base 23.

Therefore, the position of the light conversion element 22 on the mounting seat 23 is limited by the limiting structure 232, so that the light conversion element 22 cannot shift under the condition of impact, and the normal use of the first camera module 20 is facilitated.

It can be understood that, in one example, the light conversion element 22 is fixed on the mounting seat 23 by adhesion, and if the limiting structure 232 is omitted, the light conversion element 22 is easily detached from the mounting seat 23 if the adhesion force between the light conversion element 2222 and the mounting seat 23 is insufficient when the first camera module 20 is impacted.

In the present embodiment, the mounting seat 23 is formed with a mounting groove 233, the light conversion element 22 is disposed in the mounting groove 233, and the limit structure 232 is disposed at an edge of the mounting groove 233 and abuts against the light conversion element 22.

Thus, the mounting groove 233 may allow the light conversion member 22 to be easily mounted on the mounting seat 23. The limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts against the edge of the light conversion element 22, so that the position of the light conversion element 22 can be limited, and the incident light emitted by the light conversion element 22 to the first image sensor 26 is not hindered.

Further, the position limiting structure 232 includes a protrusion 234 protruding from the edge of the mounting groove 233, and the protrusion 234 abuts against the edge of the light emitting surface 228.

Since the light-converting element 22 is mounted on the mounting base 23 through the light-converting surface 226, the light-emitting surface 228 is disposed opposite to the light-converting surface 226. Therefore, the light conversion element 22 is more likely to be positioned toward the light emitting surface 228 when being impacted. In the present embodiment, the position-limiting structure 232 abuts against the edge of the light-emitting surface 228, so that the light-converting element 22 is prevented from moving to the side of the light-emitting surface 228, and the light can be ensured to be emitted from the light-emitting surface 228 normally.

Of course, in other embodiments, the limiting structure 232 may include other structures as long as the position of the light conversion element 22 can be limited. For example, the limiting structure 232 is formed with a slot, and the light conversion element 22 is formed with a limiting post, which is snapped into the slot to limit the position of the light conversion element 22.

In the present embodiment, the protrusion 234 is in a shape of a strip and extends along the edge of the light emitting surface 228. Thus, the contact area between the protrusion 234 and the edge of the light emitting surface 228 is large, so that the light conversion element 22 can be more stably located in the mounting seat 23.

Of course, in other embodiments, the protrusion 234 may have other structures such as a block shape.

Referring again to fig. 4, in one example, the mounting base 23 is movably disposed within the housing 21. For example, the mount 23 is provided to the housing 21 through a rotation shaft. The mount 23 can be rotated relative to the housing 21 to adjust the direction in which the light conversion member 22 converts the incident light.

The mounting base 23 can drive the light conversion element 22 to rotate together in the opposite direction to the shake of the first camera module 20, so as to compensate the incident deviation of the incident light of the light inlet 211, and achieve the optical anti-shake effect.

The first lens assembly 24 is accommodated in the loading element 25, and further, the first lens assembly 24 is disposed between the light conversion element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto a first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.

The first lens assembly 24 can form an image on the first image sensor 26 when moving integrally along the optical axis thereof, so as to realize the focusing of the first camera module 20. The first lens assembly 24 includes a plurality of lenses 241, when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, so as to implement the zooming function of the first camera module 20, and more, the driving mechanism 27 drives the loading element 25 to move in the housing 21 to achieve the zooming purpose.

In the example of fig. 5, the mounting element 25 is cylindrical, and the plurality of lenses 241 of the first lens assembly 24 are fixed in the mounting element 25 at intervals along the axial direction of the mounting element 25. As in the example of fig. 6, the loading element 25 includes two clips 252, the two clips 252 sandwiching the lens 241 between the two clips 252.

It can be understood that, since the loading element 25 is used for fixing and arranging the plurality of lenses 241, the length of the loading element 25 is required to be large, and the loading element 25 may be a cylindrical structure, a square cylindrical structure, or the like with a cavity. Thus, the loading element 25 is cylindrical, and the loading element 25 can better set a plurality of lenses 241 and better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In the example of fig. 6, the loading element 25 has a certain stability, the weight of the loading element 25 can be reduced by clamping the plurality of lenses 241 between the two clamping pieces 252, the power required for the driving mechanism 27 to drive the loading element 25 can be reduced, the design difficulty of the loading element 25 is low, and the lenses 241 can be easily installed on the loading element 25.

Of course, the loading element 25 is not limited to the above-mentioned cylindrical shape and two clips 252, and in other embodiments, the loading element 25 may include three, four, etc. more clips 252 to form a more stable structure, or one clip 252 to form a simpler structure; or a rectangular body, a circular body, etc. having a cavity for accommodating various regular or irregular shapes of the lens 241. On the premise of ensuring normal imaging and operation of the camera module 10, the specific selection is only needed.

The first image sensor 26 may employ a Complementary Metal Oxide Semiconductor (CMOS) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

The first image sensor 26 includes image sensing pixels for outputting image data and phase detection pixels for outputting phase data. Therefore, focusing can be performed through the phase data output by the phase detection pixels, and the focusing speed can be improved.

Note that the phase detection pixels are not used for imaging. That is, the data output from the phase detection pixels does not contribute to the imaging itself, and only the phase information and not the image can be obtained from the data output from the phase detection pixels.

The driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.

Specifically, in the case where the driving mechanism 27 is an electromagnetic driving mechanism, the driving mechanism 27 includes a magnet for generating a magnetic field and a conductor for moving the loading element 25. When the magnetic field moves relative to the conductor, an induced current is generated in the conductor, causing the conductor to be subjected to an ampere force which drives the loading element 25 in motion.

In the case where the driving mechanism 27 is a piezoelectric driving mechanism, a voltage may be applied to the driving mechanism 27 based on the inverse piezoelectric effect of the piezoelectric ceramic material so that the driving mechanism 27 generates a mechanical stress. That is, the driving mechanism 27 is controlled to be mechanically deformed by the conversion between the electric energy and the mechanical energy, thereby driving the loading element 25 to move.

In the case where the drive mechanism 27 is a memory alloy drive mechanism, the drive mechanism 27 may be made to memorize a preset shape in advance. When it is desired to drive the movement of the loading element 25, the driving mechanism 27 may be heated to a temperature corresponding to the preset shape to restore the driving mechanism 27 to the preset shape, thereby driving the movement of the loading element 25.

The drive mechanism 27 may also be a focus motor. Further, the driving mechanism 27 is a closed-loop focusing motor.

It can be understood that the conventional focusing motor cannot feed back the position information of the driving lens, and can only move the position for multiple times and calculate the focusing evaluation value at different positions, and perform focusing according to the coil current corresponding to the evaluation value satisfying the condition. The closed-loop focusing motor with feedback control makes each displacement of the loading element 25 more accurate, thereby reducing the number of times the loading element 25 moves back and forth and further improving the focusing speed.

Referring to fig. 5 again, the first camera module 20 further includes a driving device 28, and the driving device 28 is used for driving the mounting base 23 with the light conversion element 22 to rotate around a rotation axis 29. The drive means 28 serve to drive the axial displacement of the mounting 23 along the axis of rotation 29.

The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the light sensing direction of the first image sensor 26, so that the first camera module 20 realizes optical anti-shake of the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.

In this way, since the size of the light conversion element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, which not only can realize the optical anti-shake effect of the first camera module 20 in two directions, but also can make the size of the first camera module 20 smaller.

Referring to fig. 4-5, for convenience of description, the width direction of the first camera module 20 is defined as the X direction, the height direction is defined as the Y direction, and the length direction is defined as the Z direction. Accordingly, the optical axis of the light inlet 211 is the Y direction, the light receiving direction of the first image sensor 26 is the Z direction, and the axial direction of the rotation axis 29 is the X direction.

The driving device 28 drives the mounting base 23 to rotate, so that the light conversion element 22 rotates around the X direction, and the first camera module 20 achieves the Y-direction optical anti-shake effect. In addition, the driving device 28 drives the mounting base 23 to move along the axial direction of the rotation axis 29, so that the first camera module 20 achieves the effect of optical anti-shake in the X direction. Additionally, the first lens assembly 24 may be along the Z-direction to achieve focusing of the first lens assembly 24 on the first image sensor 26.

Specifically, when the light conversion element 22 rotates around the X direction, the light reflected by the light conversion element 22 moves in the Y direction, so that the first image sensor 26 forms different images in the Y direction to achieve the anti-shake effect in the Y direction. When the light conversion element 22 moves along the X direction, the light reflected by the light conversion element 22 moves in the X direction, so that the first image sensor 26 forms different images in the X direction to achieve the anti-shake effect in the X direction.

Referring to fig. 5 again, the driving device 28 includes an induction element 281, an electromagnetic element 282, a magnetic element 283, a driving circuit board 285 and a driving chip 286.

The electromagnetic element 282 is arranged on the light conversion element 22 side. The inductive element 281 is disposed outside the electromagnetic element 282. The sensing element 281 is used for detecting the rotation angle of the light conversion element 22. The driving chip 286 is connected to the sensing element 281, the driving chip 286 is configured to process the output data of the sensing element 281 to obtain anti-shake data, and the electromagnetic element 282 is configured to drive the light conversion element 22 to rotate according to the anti-shake data, so that the first camera module 20 realizes optical anti-shake.

Further, the electromagnetic element 282 is configured to drive the mounting base 23 to rotate according to the anti-shake data to drive the light conversion element 22 to rotate.

Alternatively, the inductive element 281 is a hall sensor, the electromagnetic element 282 is a coil, and the magnetic element 283 is a permanent magnet.

Thus, the output data of the sensing element 281 is processed by the driving chip 286 to obtain the anti-shake data, so that the noise of the anti-shake data is reduced, and the electromagnetic element 282 drives the light conversion element 22 according to the anti-shake data more accurately, thereby improving the optical anti-shake effect of the first camera module 100.

In addition, the sensing element 281 is arranged outside the electromagnetic element 282, and when the sensing element 281 is shifted in position during the assembly process, the detected output data deviation can be avoided to be large, so that the sensing element 281 can normally participate in optical anti-shake, the precision of the data collected by the sensing element 281 can be improved, and the accuracy of the optical anti-shake can be improved.

The related art generally arranges the hall sensor at the center of the coil so that the initial value of the hall sensor is 0, thereby maximizing the span of the hall sensor. However, during the assembly of the components, the positions of the components may shift, resulting in errors in the data measured by the hall sensor. For example, a hall sensor is placed in the center of a coil, the hall sensor is initially 0mv, and after assembly, the offset in position causes the hall sensor to actually deviate by 10mv, where the effect of the deviation is 100%.

If the hall sensor is arranged outside the coil, the hall sensor forms a non-zero initial value, which reduces the influence of the offset. For example, when the hall sensor is disposed outside the coil, the initial value of the hall sensor is 140mv, and when the hall sensor is assembled, the positional deviation causes a deviation of 10mv in practice, and the effect of the deviation is 7%.

The U direction is defined as a direction in which the light conversion member 22 moves in the X direction, and the V direction is defined as a direction in which the light conversion member 22 rotates around the X direction.

Referring to fig. 7 and 8, the U direction is the direction of the light conversion element 22 moving along the X direction, and the V direction is the direction of the light conversion element 22 rotating around the X direction.

Fig. 7 is a simulation result of deviation ratios of U-direction and V-direction hall sensors in the related art. Fig. 8 is a simulation result of the deviation ratios of the hall sensors in the U direction and the V direction according to the present invention. Where the horizontal axis is the deviation ratio and the vertical axis is the number of samples that fall within the corresponding deviation ratio. The deviation ratio (%) - ((actual value-center value)/range of the hall sensor) × 100%. The range of the Hall sensor is in the range of +/-1.5 degrees.

As can be seen from fig. 7 and 8, compared to the prior art, the present invention has more concentrated data in the V direction, that is, the deviation ratio is smaller. Further, the utility model discloses can reduce the deviation rate of hall sensor in V side to the thousandth of the deviation rate of prior art.

Referring to fig. 9, the electromagnetic element 282 is annular, the electromagnetic element 282 has a first center line 2821, and the inductive element 281 is disposed offset from the first center line 2821. The distance A between the center of inductive element 281 and the first centerline 2821 of electromagnetic element 282 is in the range of 0.5mm-1.0 mm.

When the distance a between the center of the inductive element 281 and the first center line 2821 of the electromagnetic element 282 is in the range of 0.5mm to 1.0mm, the initial value after the offset is suitable. It can be understood that the initial value after the deviation cannot be too small, so that the deviation rate cannot be reduced more; the initial value after the offset also cannot be too large, which can result in insufficient measurement range of the hall sensor.

Preferably, the center of inductive element 281 is 0.75mm from the first centerline 2821 of electromagnetic element 282.

In another example, the center of inductive element 281 is 0.5mm from first centerline 2821 of electromagnetic element 282; in yet another example, the center of inductive element 281 is at a distance A of 0.8mm from first centerline 2821 of electromagnetic element 282; in yet another example, the center of inductive element 281 is 1mm from first centerline 2821 of electromagnetic element 282. The specific value of the distance a between the center of the inductive element 281 and the first centerline 2821 of the electromagnetic element 282 is not limited herein.

It is understood that the solenoid 282 may be circular, square, or any other shape, and the specific shape of the solenoid 282 is not limited herein.

Additionally, while in the example of FIG. 9 the inductive element 281 is located on one side of the electromagnetic element 282, it is to be understood that in other examples the inductive element 281 may be located on the other side of the electromagnetic element 282. The specific position of the sensing element 281 is not limited as long as the sensing element 281 does not interfere with the existing structure of the first camera module 20.

The electromagnetic element 282 has a second center line 2822, the second center line 2822 is perpendicular to the first center line 2821, the second center line 2822 intersects the first center line 2821 at the center of the electromagnetic element 282, the number of the inductive elements 281 is two, and the two inductive elements 281 are symmetrically arranged about the second center line 2822 of the electromagnetic element 282.

In this way, the data measured by the electromagnetic element 282 may be made more accurate. Specifically, the data output by the two electromagnetic elements 282 may be calculated, e.g., averaged, to obtain more accurate data. In addition, when one of the electromagnetic elements 282 is abnormal, the other electromagnetic element 282 can ensure the normal operation of optical anti-shake, which is beneficial to improving the reliability of the driving device 28.

Of course, in other examples, the number of the sensing elements 281 may also be 3, 4 or any other number, and the specific number of the sensing elements 281 is not limited herein.

The magnetic element 283 is arranged on the mounting seat 23, and the electromagnetic element 282 is used for acting with the magnetic element 283 after voltage is applied to drive the mounting seat 23 to rotate.

In this way, the light conversion element 22 can be rotated by driving the mounting base 23 to rotate, so that optical anti-shake is realized. Specifically, after the sensing element 281 detects the rotation angle, the processor may determine, according to the data, a voltage that should be applied to the electromagnetic element 282, the electromagnetic element 282 generates a magnetic field after the voltage is applied, and the magnetic element 283 is affected by the magnetic field, so as to drive the mounting base 23 to rotate to compensate for the shake of the first camera module 10. This achieves optical anti-shake.

A gap 284 is formed between the inductive element 281 and the magnetic element 283. Dimension B of gap 284 ranges from 0.20mm to 0.25 mm.

Therefore, the space for the rotation of the magnetic element 283 and the mounting seat 23 can be avoided, and the magnetic element 283 and the mounting seat 23 are ensured not to interfere with the sensing element 281 in the process of rotation. Specifically, gap 284 is an air gap.

Preferably, the dimension B of the gap 284 is 0.22 mm. In another example, the size of gap 284 is 0.20 mm; in yet another example, dimension B of gap 284 is 0.21 mm; in yet another example, the dimension B of the gap 284 is 0.25 mm. The specific value of dimension B of gap 284 is not limited herein.

The driver circuit board 285 is provided in the housing 21. Further, the housing 21 includes a top wall 213 and a bottom wall 216 opposite to the top wall 213, the top wall 213 is formed with a light inlet 211, and the driving circuit board 285 is disposed at the bottom wall 216.

The driver circuit board 285 may be soldered, bonded, etc. to the bottom wall 216. In one example, the driving circuit board 285 may be attached to the bottom wall 216 by an adhesive tape.

In the assembling process, the electromagnetic element 282 and the inductive element 281 may be fixed on the driving circuit board 285, the driving circuit board 285 is attached to the bottom wall 216, and finally the bottom wall 216 is assembled to the housing 21. So, simple and convenient can improve the efficiency of equipment.

Note that the drive circuit board 285 is provided on the bottom wall 216 of the housing 21. It may be referred that the driving circuit board 285 is fixed in contact with the bottom wall 216 of the housing 21, or that the driving circuit board 285 is fixedly connected to the bottom wall 216 of the housing 21 through other components.

The electromagnetic element 282, the inductive element 281, and the driving chip 286 are disposed on the driving circuit board 285, and the driving chip 286 is electrically connected to the inductive element 281 through the driving circuit board 285. Thus, the connection of the circuit is simpler, the structure is more compact, and the miniaturization of the first camera module 20 is facilitated.

In one example, the driving chip 286 may be disposed on the driving circuit board 285 through a Surface Mount Technology (SMT) process. In order to stably fix the driving chip 286 on the driving circuit board 285, a reinforcing plate may be disposed on a side of the driving circuit board 285 opposite to the driving chip 286, so as to reinforce a portion of the driving circuit board 285 corresponding to the driving chip 286, and prevent the portion of the driving circuit board 285 corresponding to the driving chip 286 from being deformed to cause the driving chip 286 to be attached to the driving circuit board 285 insecurely.

In addition, referring to fig. 13, the driving chip 286 includes a compensation module 2862, a filtering module 2864, and an amplifying module 2866.

The compensation module 2862 is used for processing the output data of the sensing element 281 to obtain anti-shake data. The filtering module 2864 is connected to the compensating module 2862, and the filtering module 2864 is used for filtering the anti-shake data. The amplifying module 2866 is connected to the filtering module 2864, and the amplifying module 2866 is used for amplifying the anti-shake data processed by the filtering module 2864.

Specifically, the filter module 2864 includes comparators, the number of which ranges from 2-15. The amplifying module 2866 includes a transistor having an area ranging from 1mm²-9mm²。

Thus, the noise of the anti-shake data can be reduced, so that the electromagnetic element 282 can drive the light conversion element 22 more accurately according to the anti-shake data, and the optical anti-shake effect of the first camera module 100 is better. It is understood that the anti-shake data may include a compensation amount, the sensing element detects the rotation angle of the light conversion element 22 by detecting the change of the magnetic field, and the electromagnetic element drives the light conversion element 22 to rotate according to the compensation amount, so as to balance the magnetic field, thereby achieving optical anti-shake. And along with the increase of compensation volume, the noise of anti-shake data also can increase, leads to the anti-shake data inaccuracy, and the effect of optics anti-shake is relatively poor. For example, a phenomenon in which the preview screen is shaken occurs. Note that the noise may be white noise.

The number of the comparators ranges from 2 to 15, so that both the filtering effect and the cost can be considered. It will be appreciated that the comparator may filter the more mobile data by addition or subtraction. If the number of the comparators is too small, the comparison range is small, and the filtering effect on the data is poor. If the number of comparators is too large, improvement of the filtering effect is slowed down and a high cost is required. In the embodiment, the number of the comparators ranges from 2 to 15, and the comparison range is large, so that the data filtering effect is good, and the cost is low.

Preferably, the number of comparators is 10. In other examples, the number of comparators may be 2, 5, 7, 9, 11, 13, 15, or other numbers. The specific number of comparators is not limited herein.

In addition, the amplifying module 2866 may include a plurality of transistors, each of which may have an area ranging from 1mm²-9mm². Further, the transistor may be an amplifier transistor.

It is understood that the larger the area of the transistor in the amplifying module 2866, the stronger the compensation capability. As described above, as the amount of compensation increases, the noise of the anti-shake data also increases. Therefore, under the condition that the output data of the Hall sensor is the same, the area of the transistor is increased, and the effect of compensation can be achieved only by a small compensation amount. This reduces the noise of the anti-shake data.

Preferably, the transistor has a size of 2mm × 2mm and an area of 4mm². In other examples, the area of the transistor may be 1mm²、2mm²、4mm²、5mm²、8mm²、9mm²Or other numerical values. The specific area of the transistor is not limited herein.

In one example, referring to fig. 14, the driving chip 286 includes a compensation module 2862, a filtering module 2864, and an amplifying module 2866. Specifically, the filtering module 2864 includes 2 comparators 2863 and the amplifying module 2866 includes an amplifier 2865. The driver chip 286 also includes an analog-to-digital converter 2868. Further, the adc 2868 is a 12-bit adc. The size of the amplifier 2865 transistor is 2mm, and the area of the amplifier 2865 transistor is 4mm²。

In another example, the distance between the center of inductive element 281 and first centerline 2821 of electromagnetic element 282 increases from 0mm to 0.72 mm. The number of comparators in filter module 2864 is increased from 4 to 10. The amplifier area in the amplification module 2866 is increased from 1mm x 1mm to 2mm x 2 mm. The performance parameters of sensing element 281 are shown in table 1. The noise simulation results are shown in fig. 15 and 16.

TABLE 1

As can be seen from Table 1, the Hall coupling is improved by 10 times, and the anti-magnetic induction strength is increased. The sensitivity is also improved. The compensation amount is within a preset range, and the compensation requirement can be met. The stability of the camera module after the drop test is greatly improved, and the reliability is greatly improved.

From the simulation results of fig. 15, it can be seen that the noise in the U direction was 16.6LSB and the noise in the V direction was 66.9LSB before the optimization. After the variation, the noise in the U direction was 12.4LSB, and the noise in the V direction was 16.5 LSB. The noise in the V direction improved by 75%.

In addition, the anti-shake effect is poor, and the image blur (Pixel blur) can be reflected in a preview screen of the electronic device. Before optimization, the area of the focus center is 1.6 × 6.4 pixels. After optimization, the area of the focus center is 1.6 × 1.6 pixels. That is to say, after the optimization, the area of focusing reduces, and the precision improves, and the anti-shake effect is better.

The gesture difference refers to the pixel deviation of the picture photographed twice after the mobile phone is fixed. The gesture difference is an important index for measuring the mobile phone module. Especially in a 10 x optical zoom camera module. The poor posture determines the size of a camera module anti-shake value (SR), wherein SR is an index for measuring the anti-shake capability of the mobile phone, and the larger the SR value is, the better the anti-shake capability is. Therefore, the poor posture directly influences the anti-shake of the mobile phone.

FIG. 17 is a comparison graph of pose difference performance before and after optimization. In fig. 17, the horizontal axis represents a time axis, and the vertical axis represents a distance from the center of the posture difference. As can be seen from fig. 17, compared with the performance before optimization, the performance after optimization is greatly improved, the data consistency is good, the peak value is within 1, the root mean square is 0.23, and the performance is superior. The improved posture difference can meet 10 times of optical zooming mobile phones, so that the expressive force of the camera module is greatly improved.

FIG. 18 is a graph of the relationship of the attitude difference and temperature rise before and after optimization. The horizontal axis represents a temperature axis, and the vertical axis represents a distance by which the posture difference is deviated from the center. As can be seen from fig. 18, the posture difference offset value of the optimized camera module increases with the increase of the temperature, is regular, and can be optimized and compensated through an algorithm to solve the influence of the temperature. And the changes of the posture difference and the temperature rise before optimization are disordered, and the optimization cannot be processed.

Referring to fig. 19, in the present embodiment, the second camera module 30 is a vertical lens module, but in other embodiments, the second camera module 30 may also be a periscopic lens module.

The second camera module 30 includes a second lens assembly 31 and a second image sensor 32, the second lens assembly 31 is used for imaging light on the second image sensor 32, and an incident optical axis of the second camera module 30 coincides with an optical axis of the second lens assembly 31.

In this embodiment, the second camera module 30 can be a fixed focus lens module, and therefore, the number of lenses 241 of the second lens assembly 31 is small, so that the height of the second camera module 30 is low, which is beneficial to reducing the thickness of the electronic device 1000.

The type of the second image sensor 32 may be the same as the type of the first image sensor 26 and will not be described herein.

The structure of the third camera module 40 is similar to that of the second camera module 30, for example, the third camera module 40 is also an upright lens module. Therefore, please refer to the features of the second camera module 40 for the features of the third camera module 40, which are not described herein.

In summary, the first camera module 20 includes a housing 21, a light conversion element 22, a first image sensor 26, an electromagnetic element 282, an inductive element 281, and a driving chip 286.

The housing 21 is provided with a light inlet 211. The light conversion element 22 is arranged within the housing 21. The first image sensor 26 is disposed on one side of the light conversion element 22, and the first image sensor 26 is used for sensing the light passing through the light inlet 211 by the light conversion element 22. The electromagnetic element 282 is arranged on the light conversion element 22 side. The sensing element 281 is disposed outside the electromagnetic element 282 for detecting the rotation angle of the light conversion element 22. The driving chip 286 is connected to the sensing element 281, the driving chip 286 is configured to process the output data of the sensing element 281 to obtain anti-shake data, and the electromagnetic element 282 is configured to drive the light conversion element 22 to rotate according to the anti-shake data, so that the first camera module 100 realizes optical anti-shake.

More than synthesizing, the utility model discloses embodiment's first camera module 20 has solved the hysteresis of anti-shake in V side, has improved the response speed of anti-shake. Moreover, the structure manufacturing is simplified, and the manufacturing yield is increased by 80%. In addition, the posture difference effect of the first camera module 20 is improved significantly, and the noise of the sensing element 281 is improved. In addition, the anti-magnetic interference capability of the first camera module 20 is improved, so that the first camera module 20 is good in reliability, small in deformation after falling and free from affecting the overall performance.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a camera module which characterized in that includes:

the shell is provided with a light inlet;

a light conversion element disposed within the housing;

2. The camera module of claim 1, wherein the driver chip comprises a compensation module, and the compensation module is configured to process the output data to obtain the anti-shake data.

3. The camera module according to claim 2, wherein the driving chip comprises a filtering module connected to the compensation module, and the filtering module is configured to filter the anti-shake data.

4. The camera module of claim 3, wherein the filter module comprises comparators, and the number of comparators ranges from 2 to 15.

5. The camera module according to claim 3, wherein the driver chip comprises an amplifying module connected to the filtering module, and the amplifying module is configured to amplify the anti-shake data processed by the filtering module.

6. The camera module of claim 5, wherein the amplification module comprises a transistor having an area in a range of 1mm²-9mm²。

7. The camera module of claim 1, wherein the camera module comprises a driving circuit board, the electromagnetic element, the sensing element and the driving chip are disposed on the driving circuit board, and the driving chip is electrically connected to the sensing element through the driving circuit board.

8. The camera module of claim 1, wherein the electromagnetic element is annular, the electromagnetic element having a first centerline, the inductive element being disposed offset from the first centerline.

9. The camera module of claim 8, wherein a distance between a center of the inductive element and the first centerline of the electromagnetic element is in a range of 0.5mm to 1.0 mm.

10. The camera module of claim 8, wherein the electromagnetic element has a second center line, the second center line is perpendicular to the first center line, the second center line intersects the first center line at a center of the electromagnetic element, the number of the inductive elements is two, and the two inductive elements are symmetrically arranged about the second center line of the electromagnetic element.

11. The camera module of claim 1, wherein the inductive element is a hall sensor and the electromagnetic element is a coil.

12. The camera module according to claim 1, wherein the camera module includes a mounting base disposed in the housing, the light conversion element is fixed to the mounting base, and the electromagnetic element is configured to drive the mounting base to rotate according to data detected by the sensing element to drive the light conversion element to rotate.

13. The camera module of claim 12, wherein the camera module comprises a magnetic element disposed on the mounting base, and the electromagnetic element is configured to act on the magnetic element after a voltage is applied to drive the mounting base to rotate.

14. A camera head assembly, comprising:

a first camera module, the first camera module being the camera module of any one of claims 1-13; and

the second camera module is arranged in parallel with the first camera module, and the field angle of the second camera module is larger than that of the first camera module.

15. An electronic device, comprising:

a housing; and

the camera assembly of claim 14, exposed through said housing.