CN109898104A - A kind of FMM electroforming motherboard production method of conical mouths - Google Patents
A kind of FMM electroforming motherboard production method of conical mouths Download PDFInfo
- Publication number
- CN109898104A CN109898104A CN201910126607.7A CN201910126607A CN109898104A CN 109898104 A CN109898104 A CN 109898104A CN 201910126607 A CN201910126607 A CN 201910126607A CN 109898104 A CN109898104 A CN 109898104A
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- Prior art keywords
- electroforming
- fmm
- mask plate
- exposure
- production method
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Abstract
The present invention provides a kind of FMM electroforming motherboard production method of conical mouths, comprising: provides the mask plate of an electroforming finished product；The mask plate is subjected to two-sided wet film coating or spraying, fills up the exposure mask plate holes；After exposure aligning, the molding of control photoresist, development obtain big opening end；Run through the big opening end using etch process, small open end required for being formed, the opening at the big opening end and small open end composition FMM.The present invention is coated with or is sprayed by two-sided wet film, after exposure aligning, then big opening end required for control photoresist molding development obtains obtains small open end by etch process, can form size tapered opening required for FMM.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of FMM electroforming motherboard production method of conical mouths.
Background technique
The main stream approach for AMOLED panel its volume production that high-order mobile phone uses at present is vacuum evaporation, and vacuum evaporation is necessary
Using fine metal cover FMM full name is Fine Metal Mask (fine metal mask plate), and material is mainly a kind of low swollen
Swollen metal generally uses invar metal (invar), and ingredient is mainly the iron dust alloy of 36% nickel.
After general electroforming mode produces FMM, because of the characteristic of photoresist (dry film) exposure forming, cylindrical body is all vertical configuration,
FMM can not be formed in vapor deposition, required conical mouths (size openings).
Summary of the invention
The present invention provides a kind of FMM electroforming motherboard production method of conical mouths, and being able to solve in the prior art can not shape
At FMM vapor deposition when required conical mouths the technical issues of.
In order to solve the above technical problems, the present invention adopts the following technical scheme:
A kind of FMM electroforming motherboard production method of conical mouths, comprising:
The yellow light motherboard of one yellow light finished product is provided；
It casts to obtain the mask plate of electroforming finished product, electroforming thickness is lower than yellow light thickness of dry film, and forms hole；
The mask plate is subjected to two-sided wet film coating or spraying photoresist, and fills up the exposure mask plate holes；
After exposure aligning, big opening end is obtained by photoresist molding, development；
Run through the big opening end using etch process, small open end required for being formed and small is opened at the big opening end
Mouth end constitutes the opening of FMM.
Finished product is obtained after membrane removal.
Preferably, in the method, the rate for controlling etching is 0.5~1m/s, and etching sprays as 0.2~1.2kg/
cm2。
Further, in the method, the specific method of exposure aligning includes: to align to expose using light shield, on the light shield
It is provided with loci, automatic aligning can be carried out with the registration holes on mask plate, contraposition exposure machine control light shield alignment hole location is missed
Difference is less than 0.5um and is exposed forming, and the mask plate after exposure is developed, the mask plate after completing exposure development.
It preferably, the use of the temperature of developer solution is 28 DEG C~35 DEG C, rate is 0.2~1m/s, is sprayed as 0.2~0.8kg/
cm2。
Preferably, run through big opening end using etch process, the rate of etching is 0.5~1m/s, and spraying for etching is 0.2
~1.2kg/cm2, the temperature of etching are 38 DEG C~48 DEG C, and the depth at the big opening end is 5um~15um.
Preferably, the mask plate is invar alloy plate.
From the above technical scheme, the present invention is coated with or sprays, after exposure aligning by two-sided wet film, control photoresist at
Then big opening end required for type obtains small open end by etch process, can form big fine taper required for FMM and open
Mouthful, meet the conical mouths that FMM vapor deposition needs.
Detailed description of the invention
Fig. 1 is the status diagram of FMM electroforming motherboard production method of the present invention.
Specific embodiment
A kind of preferred embodiment of the invention is described in detail with reference to the accompanying drawing.
As shown in Figure 1, FMM electroforming motherboard production method, specifically comprises the following steps:
Step 1: providing the yellow light motherboard 1 of a yellow light finished product；
Step 2: casting to obtain the mask plate 2 of electroforming finished product, electroforming thickness is lower than yellow light thickness of dry film, and forms hole
21；
Step 3: the mask plate is carried out two-sided wet film coating or spraying photoresist, and fill up the exposure mask plate holes 21；
Step 4: obtaining big opening end 4 by photoresist molding, development by after exposure aligning；
Step 5: run through the big opening end using etch process, and small open end 5 required for being formed, the big opening
End and small open end constitute the opening of FMM.
Step 6: obtaining finished product after membrane removal.
In the step 1, on stainless steel, carry out yellow light process: successively carry out press mold (dry film), exposure, development,
It cleans and dries, thickness 30um~55um of yellow light dry film, then the yellow light motherboard 1 of electroforming FMM.
In the step 2, the yellow light motherboard after yellow light process is sticked on electroforming cathode plate, carries out casting acquirement electricity
The mask plate 2 of casting, electroforming thickness control is in 25um~45um, formation hole 21 5~10um lower than yellow light thickness of dry film.
In the step 3, the mask plate 2 is subjected to two-sided wet film coating or is coated with wet type photoresist 3, fills up this
The hole 21 of mask plate, then forming is dried.The purpose of being coated with photoresist is to protect the part not being etched to open greatly with exposure
The figure of mouth.
In the step 4, the specific method of exposure aligning includes:
It is aligned and is exposed using light shield, be provided with loci on the light shield, can carried out with the registration holes on mask plate automatic
Contraposition, contraposition exposure machine control light shield alignment hole location error amount be less than 0.5um be exposed forming, by the mask plate after exposure into
Row development, the mask plate after completing exposure development.The temperature of the developer solution used is 28 DEG C~35 DEG C, and rate is 0.2~1m/s,
It sprays as 0.2~0.8kg/cm2。
Using contraposition exposure machine, light shield can be aligned to post-exposure and shape big opening end, develop after exposure forming, control
Big opening development depth processed, the part to be etched after exposing.
In the step 5, the rate for controlling etching is 0.5~1m/s, and etching sprays as 0.2~1.2kg/cm2.
In the present embodiment, the mask plate is invar alloy plate.
Embodiment described above is only that preferred embodiments of the present invention will be described, not to model of the invention
It encloses and is defined, without departing from the spirit of the design of the present invention, those of ordinary skill in the art are to technical side of the invention
The various changes and improvements that case is made, should fall within the scope of protection determined by the claims of the present invention.
Claims (6)
1. a kind of FMM electroforming motherboard production method of conical mouths characterized by comprising
The yellow light motherboard of one yellow light finished product is provided；
It casts to obtain the mask plate of electroforming finished product, electroforming thickness is lower than yellow light thickness of dry film, and forms hole；
The mask plate is subjected to two-sided wet film coating or spraying photoresist, and fills up the exposure mask plate holes；
After exposure aligning, big opening end is obtained by photoresist molding, development；
Run through the big opening end using etch process, forms required small open end, the big opening end and small open end
Constitute the opening of FMM；
Finished product is obtained after membrane removal.
2. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, control etching
Rate is 0.5~1m/s, and etching sprays as 0.2~1.2kg/cm2。
3. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, exposure aligning
Specific method includes: to align to expose using light shield, is provided with loci on the light shield, can carry out with the registration holes on mask plate
Automatic aligning, contraposition exposure machine control light shield alignment hole location error amount is less than 0.5um and is exposed forming, by the mask after exposure
Plate develops, the mask plate after completing exposure development.
4. FMM electroforming motherboard production method according to claim 3, which is characterized in that the temperature using developer solution is 28
DEG C~35 DEG C, rate is 0.2~1m/s, is sprayed as 0.2~0.8kg/cm2。
5. FMM electroforming motherboard production method according to claim 1, which is characterized in that in the method, made using etching
Journey runs through big opening end, and the rate of etching is 0.5~1m/s, and etching sprays as 0.2~1.2kg/cm2, and the temperature of etching is
38 DEG C~48 DEG C, the depth at the big opening end is 5um~15um.
6. FMM electroforming motherboard production method according to claim 1-5, which is characterized in that the mask plate is
Invar alloy plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910126607.7A CN109898104A (en) | 2019-02-20 | 2019-02-20 | A kind of FMM electroforming motherboard production method of conical mouths |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910126607.7A CN109898104A (en) | 2019-02-20 | 2019-02-20 | A kind of FMM electroforming motherboard production method of conical mouths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109898104A true CN109898104A (en) | 2019-06-18 |
Family
ID=66944943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910126607.7A Withdrawn CN109898104A (en) | 2019-02-20 | 2019-02-20 | A kind of FMM electroforming motherboard production method of conical mouths |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109898104A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11603600B2 (en) | 2020-12-07 | 2023-03-14 | Darwin Precisions Corporation | Method of manufacturing metal mask |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135189A (en) * | 1987-11-19 | 1989-05-26 | Mitsubishi Electric Corp | Picture memory |
| US6214192B1 (en) * | 1998-12-10 | 2001-04-10 | Eastman Kodak Company | Fabricating ink jet nozzle plate |
| CN1392905A (en) * | 2000-09-26 | 2003-01-22 | 伊斯曼柯达公司 | Method for producing metal mask and metal mask |
| CN103388121A (en) * | 2012-05-08 | 2013-11-13 | 昆山允升吉光电科技有限公司 | Hybrid preparation process of high-precision metal mask plate |
| CN108728790A (en) * | 2017-04-21 | 2018-11-02 | 苏州苏大维格光电科技股份有限公司 | The manufacturing method of AMOLED metal mask plates |
| US20180363613A1 (en) * | 2011-02-02 | 2018-12-20 | 3M Innovative Properties Company | Nozzle and method of making same |
-
2019
- 2019-02-20 CN CN201910126607.7A patent/CN109898104A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135189A (en) * | 1987-11-19 | 1989-05-26 | Mitsubishi Electric Corp | Picture memory |
| US6214192B1 (en) * | 1998-12-10 | 2001-04-10 | Eastman Kodak Company | Fabricating ink jet nozzle plate |
| CN1392905A (en) * | 2000-09-26 | 2003-01-22 | 伊斯曼柯达公司 | Method for producing metal mask and metal mask |
| US20180363613A1 (en) * | 2011-02-02 | 2018-12-20 | 3M Innovative Properties Company | Nozzle and method of making same |
| CN103388121A (en) * | 2012-05-08 | 2013-11-13 | 昆山允升吉光电科技有限公司 | Hybrid preparation process of high-precision metal mask plate |
| CN108728790A (en) * | 2017-04-21 | 2018-11-02 | 苏州苏大维格光电科技股份有限公司 | The manufacturing method of AMOLED metal mask plates |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11603600B2 (en) | 2020-12-07 | 2023-03-14 | Darwin Precisions Corporation | Method of manufacturing metal mask |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20191025 Address after: Room 406, building 2, 181 Lane 2498, Wanfeng Road, Fengjing town, Jinshan District, Shanghai 201611 Applicant after: Shanghai Yuanlin Enterprise Management Co., Ltd Address before: 230000 Northeast corner of the junction of Zhucheng Road and Yingzhou Road, Xinzhan District, Hefei City, Anhui Province Applicant before: Hefei Yongqi Smart Material Technology Co., Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190618 |