CN109894738B - Laser polishing device and method for metal plane - Google Patents
Laser polishing device and method for metal plane Download PDFInfo
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- CN109894738B CN109894738B CN201910309975.5A CN201910309975A CN109894738B CN 109894738 B CN109894738 B CN 109894738B CN 201910309975 A CN201910309975 A CN 201910309975A CN 109894738 B CN109894738 B CN 109894738B
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Abstract
The invention relates to the field of laser processing, in particular to a laser polishing device and a method for a metal plane, wherein the laser polishing device comprises a pulse laser for generating pulse laser, a continuous laser for generating continuous laser, a beam combining mirror for mixing the pulse laser and the continuous laser and an XY motion platform for driving metal to move; the pulse laser emits pulse laser to the beam combining mirror, the continuous laser emits continuous laser to the beam combining mirror, the beam combining mirror mixes the pulse laser and the continuous laser to form mixed laser, and the mixed laser is transmitted to a metal plane driven by the XY moving platform for polishing. The beam combining mirror mixes the pulse laser sent by the pulse laser and the continuous laser sent by the continuous laser and then transmits the mixed laser to the plane of the moving metal surface, the pulse laser can be used for polishing the metal surface, and the continuous laser can be used for preheating the plane of the metal surface, so that the polishing process of the metal surface is simplified, the polishing time of the metal surface is shortened, and the efficiency is greatly improved.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser polishing device and method for a metal plane.
Background
With the gradual development of modern manufacturing industry, the requirement on the metal plane is higher and higher. Polishing is often involved in the machining of metal surfaces, such as tool steels, stainless steels, nickel alloys, and titanium alloys. At present, most of polishing procedures of products depend on manual polishing, the polishing precision is poor, the efficiency is low, and the product quality is lack of consistency and stability.
Laser processing is a novel processing technology, and has the advantages of high efficiency, high flexibility and the like. Currently, metal planes are also often polished by laser. The process is to melt and evaporate a thin raised layer on the surface of a metal material by a focused laser beam spot acting on a rough original metal surface. The melted material flows under the action of surface tension and gravity of the material, fills the concave part of the metal surface and solidifies, and finally the ideal polished material surface is obtained. Through the control of the laser, the output energy during laser polishing and the action layer thickness of the metal material are very small and only occur on the material layer with the thickness of micron, so that a large-area rough surface cannot be caused like the common laser beam processing metal. YAG laser or pulse laser is commonly used in the laser polishing technology to polish the metal surface, but the metal plane needs to be preheated for a period of time first and then polished, so that the problems of long polishing time, low polishing efficiency, difficult plane polishing and the like exist.
Disclosure of Invention
The present invention provides a laser polishing apparatus and method for metal plane, which solves the problems of complicated metal plane polishing process and long polishing time.
In order to solve the technical problem, the invention provides a laser polishing device for a metal plane, which comprises a pulse laser for generating pulse laser, a continuous laser for generating continuous laser, a beam combining mirror for mixing the pulse laser and the continuous laser and an XY motion platform for driving metal to move; the pulse laser emits pulse laser to the beam combining mirror, the continuous laser emits continuous laser to the beam combining mirror, the beam combining mirror mixes the pulse laser and the continuous laser to form mixed laser, and the mixed laser is transmitted to a metal plane driven by the XY moving platform to be polished.
Preferably, the laser polishing apparatus further comprises a first reflecting mirror and a second reflecting mirror, wherein the pulse laser, the first reflecting mirror and the second reflecting mirror are sequentially arranged along a pulse laser path; the pulse laser device emits pulse laser to a first reflecting mirror, the first reflecting mirror reflects the pulse laser to a second reflecting mirror, and the second reflecting mirror reflects the pulse laser to a beam combining mirror.
Preferably, the first reflector is adjustable in position along a first direction, and the second reflector is adjustable in position along a second direction.
Preferably, the first direction and the second direction are perpendicular to each other.
The laser polishing device further comprises a first beam expander, the first beam expander is arranged between the pulse laser and the first reflector, the pulse laser emits pulse laser to the first beam expander, and the first beam expander transmits the pulse laser to the first reflector after expanding.
The laser polishing device further comprises a second beam expander, the second beam expander is arranged between the continuous laser and the beam combiner, the continuous laser emits continuous laser to the second beam expander, and the second beam expander transmits the continuous laser to the beam combiner after expanding.
Preferably, the beam expansion times of the first beam expander and the second beam expander are within a range of 2-8 times.
Preferably, the laser polishing apparatus further includes a beam splitter, the beam splitter and the beam combiner are disposed adjacent to each other, the beam combiner transmits the mixed laser to the beam splitter, and the beam splitter transmits the mixed laser to the metal plane.
Preferably, the power of the pulse laser is 20W, the wavelength of the pulse laser is 355nm, the power of the continuous laser is 1000W, and the wavelength of the continuous laser is 1064 nm.
The invention also provides a laser polishing method of a metal plane, which is used for the laser polishing device and specifically comprises the following steps: the pulse laser emits pulse laser to the beam combining mirror, and the continuous laser emits continuous laser to the beam combining mirror; the beam combining mirror mixes the pulse laser and the continuous laser to form mixed laser; and transmitting the mixed laser to a metal plane driven by an XY motion platform for polishing.
Compared with the prior art, the laser polishing device and the laser polishing method for the metal plane have the advantages that by designing the laser polishing device and the laser polishing method for the metal plane, the beam combiner mixes the pulse laser sent by the pulse laser and the continuous laser sent by the continuous laser and then transmits the mixed laser to the moving metal plane, the pulse laser can polish the metal plane, the continuous laser can preheat the plane of the metal surface, the polishing process of the metal plane is simplified, the polishing time of the metal plane is shortened, and the efficiency is greatly improved; in addition, the pulse laser can be ensured to be transmitted to the beam combining mirror by the reflection action of the first reflecting mirror and the second reflecting mirror, and the positions of the first reflecting mirror and the second reflecting mirror can be adjusted correspondingly.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic view of a laser polishing apparatus of the present invention;
FIG. 2 is a block flow diagram of the laser polishing method of the present invention.
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1, the present invention provides a preferred embodiment of a laser polishing apparatus for a metal plane.
Specifically, referring to fig. 1, a laser polishing apparatus for metal 10 plane, which is used only for polishing metal 10 whose surface is plane. The laser polishing device comprises a pulse laser 1 for generating pulse laser, a continuous laser 7 for generating continuous laser, a beam combining mirror 5 for mixing the pulse laser and the continuous laser, and an XY motion platform 9 for driving a metal 10 to move linearly. The pulse laser refers to laser signals emitted at the same interval time, the continuous laser refers to laser signals emitted for a long time, a layer of special film is arranged on the surface of the beam combining mirror 5, the pulse laser and the continuous laser can be combined on the same light path by the high-transmission pulse laser on one side of the beam combining mirror 5 and the high-reflection continuous laser on the other side of the beam combining mirror, and after the two beams of laser are overlapped, the effects of continuous laser preheating, pulse laser melting and rapid metal surface polishing can be achieved.
The pulse laser 1 emits pulse laser to the beam combining mirror 5 after generating pulse laser, and the continuous laser 7 emits continuous laser to the beam combining mirror 5 after generating continuous laser. The beam combining mirror 5 is used for mixing pulse laser and continuous laser, transmitting the pulse laser and reflecting the continuous laser, the laser of the pulse laser and the laser of the continuous laser form a mixed laser, the mixed laser has the functions of reflection and high-perspective light beam, then the mixed laser is transmitted along the same direction all the time, the XY moving platform 9 drives the metal 10 plane to perform two-dimensional linear motion below the mixed laser, the mixed laser is continuously transmitted to the metal 10 plane, the pulse laser can be used for polishing the metal 10 plane, and the continuous laser can be used for preheating the plane on the metal 10 surface. It is worth mentioning that, referring to fig. 1, a three-dimensional reference system is shown, and the XY motion stage 9 can drive the metal 10 plane to move linearly along the X axis and linearly along the Y axis, so as to ensure that the final metal 10 plane is polished. The beam combining mirror 5 mixes the pulse laser sent by the pulse laser 1 and the continuous laser sent by the continuous laser 7 and then transmits the mixed laser to the moving metal 10 plane, so that preheating and polishing operations can be provided for the metal 10 plane at the same time, the operations are not required to be performed in sequence, the polishing process of the metal 10 plane is simplified, the polishing time of the metal 10 plane is shortened, and the polishing efficiency of the metal 10 plane is greatly improved.
It should be noted that the laser polishing device further comprises a clamp arranged on the XY moving platform 9, the clamp is matched with the metal 10, and the metal 10 is fixed on the clamp, so that the metal 10 is prevented from being deviated when the metal 10 is driven to move by the subsequent XY moving platform 9. Or, the XY moving platform 9 is provided with a groove matched with the metal 10 in shape, and the metal 10 is clamped in the groove, so that the metal 10 can be prevented from being deviated when the subsequent XY moving platform 9 drives the metal 10 to move.
Further, referring to fig. 1, the laser polishing apparatus further includes a first reflecting mirror 3 and a second reflecting mirror 4 having total reflectivity, and the pulse laser 1, the first reflecting mirror 3 and the second reflecting mirror 4 are sequentially disposed along a pulse laser path, which refers to a transmission path of the pulse laser. The first reflector 3 and the transmitted pulse laser are at 45 degrees, and the second reflector 4 and the transmitted pulse laser are also at 45 degrees. The pulse laser 1 emits pulse laser light to the first mirror 3, and then the first mirror 3 reflects the pulse laser light to the second mirror 4, and then the second mirror 4 reflects the pulse laser light to the beam combining mirror 5. The pulse laser is ensured to be transmitted to the beam combining mirror 5 by the reflection action of the first reflecting mirror 3 and the second reflecting mirror 4.
The position of the first reflector 3 can be adjusted at will along the first direction, and the first reflector 3 can be dragged in the first direction in a manual mode without changing the placement angle of the first reflector 3. The position of the second reflector 4 can be adjusted at will along the second direction, and the second reflector 4 can be dragged along the second direction in a manual mode, but the placing angle of the second reflector 4 cannot be changed. As the positions of the first mirror 3 and the second mirror 4 are changed, the spot size, the divergence angle, and the like of the pulse laser 1 transmitted to the first mirror 3 and the second mirror 4 are also changed. Preferably, the first mirror 3 and the second mirror 4 are respectively driven by a first servo motor 31 and a second servo motor 41 with high precision and high density, and the first servo motor 31 and the second servo motor 41 are both controlled by an automatic control system, so that the first mirror 3 and the second mirror 4 can be respectively adjusted to move towards the first direction and the second direction. The precise adjustment function of the first servo motor 31 and the second servo motor 41 enables the pulse laser and the continuous laser to pass through the beam combining mirror 5, and the functions of continuous laser preheating, pulse laser melting and rapid metal surface polishing can be achieved.
In the present embodiment, the first direction and the second direction are perpendicular to each other, for example, referring to fig. 1, the first direction is a Z-axis direction, and the second direction is an X-axis direction. Of course, the first direction and the second direction may be other directions, which are not described herein again.
Furthermore, referring to fig. 1, the laser polishing apparatus further includes a first beam expander 2, the first beam expander 2 is disposed between the pulse laser 1 and the first reflector 3, the pulse laser 1 emits pulse laser light to the first beam expander 2, and the first beam expander 2 transmits the pulse laser light to the first reflector 3 after expanding. Still further, refer to fig. 1, laser burnishing device still includes second beam expander 6, second beam expander 6 is established between continuous laser 7 and beam combiner 5, continuous laser 7 launches continuous laser to second beam expander 6, second beam expander 6 transmits continuous laser to beam combiner 5 after expanding.
Wherein, the first beam expander 2 and the second beam expander 6 refer to lens components capable of changing the diameter and the divergence angle of the laser beam. In the embodiment, the beam expansion times of the first beam expander 2 and the second beam expander 6 are in the range of 2-8 times.
Specifically, referring to fig. 1, the laser polishing apparatus further includes a galvanometer 8, the galvanometer 8 is composed of an X-Y optical scanning head, an electronic driving amplifier and an optical reflection lens, the galvanometer 8 is disposed adjacent to the beam combiner 5, the beam combiner 5 emits the mixed laser to the galvanometer 8, the deflection of the mixed laser is realized by the galvanometer 8, and the mixed laser is transmitted to a metal 10 plane for polishing.
In this embodiment, the power of the pulse laser 1 is 20W, the wavelength of the pulse laser is 355nm, the power of the continuous laser 7 is 1000W, and the wavelength of the continuous laser is 1064 nm. Of course, the power of the pulse laser 1 may be other, the wavelength of the pulse laser may be other, the power of the continuous laser 7 may be other, and the wavelength of the continuous laser may be other, which is not described herein again.
The present invention also provides a preferred embodiment of a method for laser polishing a metal plane, as shown in FIG. 2.
Specifically, a laser polishing method of a metal plane, which is used for the laser polishing apparatus as described above, with reference to fig. 2, specifically includes the steps of:
step 1, a pulse laser emits pulse laser to a beam combining mirror, and a continuous laser emits continuous laser to the beam combining mirror;
step 2, forming mixed laser after the beam combining mirror mixes the pulse laser and the continuous laser;
and 3, transmitting the mixed laser to a metal plane driven by an XY motion platform for polishing.
The pulse laser emits the pulse laser to the beam combining mirror after generating the pulse laser, and the continuous laser emits the continuous laser to the beam combining mirror after generating the continuous laser. The beam combining mirror is used for mixing the pulse laser and the continuous laser, transmitting the pulse laser and reflecting the continuous laser, the two lasers form a mixed laser, then the mixed laser is transmitted along the same direction all the time, the XY motion platform drives the metal plane to perform two-dimensional linear motion below the mixed laser, the mixed laser is continuously transmitted to the metal plane, the pulse laser can be used for polishing the metal plane, and the continuous laser can be used for preheating the metal plane.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The laser polishing device for the metal plane is characterized by comprising a pulse laser for generating pulse laser, a continuous laser for generating continuous laser, a beam combining mirror for mixing the pulse laser and the continuous laser and an XY motion platform for driving metal to move; the pulse laser emits pulse laser to the beam combining mirror, the continuous laser emits continuous laser to the beam combining mirror, the beam combining mirror mixes the pulse laser and the continuous laser to form mixed laser, and the mixed laser is transmitted to a metal plane driven by the XY moving platform to be polished; the laser polishing device also comprises a first reflecting mirror and a second reflecting mirror, wherein the pulse laser, the first reflecting mirror and the second reflecting mirror are sequentially arranged along a pulse laser path; the pulse laser transmits pulse laser to a first reflecting mirror, the first reflecting mirror reflects the pulse laser to a second reflecting mirror, and the second reflecting mirror reflects the pulse laser to a beam combining mirror; the first mirror is adjustable in position in a first direction and the second mirror is adjustable in position in a second direction.
2. The laser polishing apparatus according to claim 1, wherein the first direction and the second direction are perpendicular to each other.
3. The laser polishing apparatus according to claim 1, further comprising a first beam expander, the first beam expander being disposed between the pulse laser and the first reflector, the pulse laser emitting the pulse laser to the first beam expander, and the first beam expander transmitting the pulse laser after expanding to the first reflector.
4. The laser polishing apparatus according to claim 3, further comprising a second beam expander disposed between the continuous laser and the beam combiner, wherein the continuous laser emits the continuous laser to the second beam expander, and the continuous laser is transmitted to the beam combiner after being expanded by the second beam expander.
5. The laser polishing apparatus according to claim 4, wherein the beam expansion times of the first beam expander and the second beam expander are in the range of 2 to 8 times.
6. The laser polishing apparatus according to any one of claims 1 to 5, further comprising a galvanometer, the galvanometer being disposed adjacent to the beam combining mirror, the beam combining mirror emitting the mixed laser light to the galvanometer, the galvanometer transmitting the mixed laser light to the metal plane.
7. The laser polishing apparatus as claimed in claim 6, wherein the power of the pulse laser is 20W, the wavelength of the pulse laser is 355nm, the power of the continuous laser is 1000W, and the wavelength of the continuous laser is 1064 nm.
8. A laser polishing method of a metal plane, characterized in that the laser polishing method is used for the laser polishing device according to any one of claims 1 to 7, and the laser polishing method specifically comprises the following steps:
the pulse laser emits pulse laser to the beam combining mirror, and the continuous laser emits continuous laser to the beam combining mirror;
the beam combining mirror mixes the pulse laser and the continuous laser to form mixed laser;
and transmitting the mixed laser to a metal plane driven by an XY motion platform for polishing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910309975.5A CN109894738B (en) | 2019-04-17 | 2019-04-17 | Laser polishing device and method for metal plane |
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| CN201910309975.5A CN109894738B (en) | 2019-04-17 | 2019-04-17 | Laser polishing device and method for metal plane |
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| CN109894738A CN109894738A (en) | 2019-06-18 |
| CN109894738B true CN109894738B (en) | 2021-02-09 |
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| DE102007061549B4 (en) * | 2007-12-20 | 2010-06-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for changing the beam diameter of a laser beam in a working plane and arrangement designed for this purpose |
| US20090283501A1 (en) * | 2008-05-15 | 2009-11-19 | General Electric Company | Preheating using a laser beam |
| WO2015108991A2 (en) * | 2014-01-17 | 2015-07-23 | Imra America, Inc. | Laser-based modification of transparent materials |
| KR102094556B1 (en) * | 2014-02-25 | 2020-03-30 | 주식회사 코윈디에스티 | A laser polishing system |
| CN107363409A (en) * | 2017-08-03 | 2017-11-21 | 佘志荣 | A kind of laser polishing machine and the polishing method using the laser polishing machine |
| CN108817674B (en) * | 2018-06-26 | 2020-06-16 | 深圳信息职业技术学院 | Double-beam five-axis numerical control laser polishing method |
| CN108994452A (en) * | 2018-07-12 | 2018-12-14 | 上海航天设备制造总厂有限公司 | A kind of multiple beam processes light path system and its method with optical axis |
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