CN115533301A

CN115533301A - Processing equipment

Info

Publication number: CN115533301A
Application number: CN202211166921.6A
Authority: CN
Inventors: 刘鸿吉; 李翔
Original assignee: Shenzhen Tengrui Microelectronics Technology Co ltd
Current assignee: Shenzhen Tengrui Microelectronics Technology Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2022-12-30

Abstract

The invention provides a processing device, which is used for processing a silicon carbide plate and comprises a base, a laser device and a processing platform; the laser device is arranged on the base and comprises a laser, a laser beam expander, a first reflecting mirror, a second reflecting mirror and a laser processing system. The processing platform is used for bearing the silicon carbide plate. The three-dimensional path of the pulse laser can be adjusted through the secondary reflection action of the first reflecting mirror and the second reflecting mirror; the built-in bessel optical module that has of laser beam machining system, pulse laser after expanding is emergent to the processing platform after the shaping of bessel optical module, the focal depth along the optical axis defense line behind the laser focusing has greatly been improved, can cover the material thickness more than 5 millimeters, when realizing the cutting of carborundum board high accuracy, the problem of cutting plane slope has been avoided, the technology demand of carborundum board has been satisfied, and the cutting loss is little, greatly reduced the processing cost.

Description

Processing equipment

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to processing equipment.

Background

With the continuous development of material science, various artificial super-hard and brittle materials gradually replace natural materials in various fields. Because the Mohs hardness of the silicon carbide (SiC) is 9.5, the silicon carbide is second to diamond, is a third generation semiconductor material which is hot to handle and is also an emerging low-price artificial gem material. However, because of its very high hardness and very stable chemical properties, it is very difficult to process silicon carbide materials by conventional mechanical and chemical etching methods.

The existing SiC plate processing method mainly comprises a mechanical processing method and a laser processing method, and comprises the following steps: free mortar processing, diamond wire saw processing and laser processing. The main defects of the traditional free mortar cutting and diamond wire saw cutting methods are that the material loss is large, the processing time is long, and the special shape cannot be processed. There are significant material costs and environmental concerns. The laser processing method has high efficiency, no material cost and no environmental pollution problem, and is a silicon carbide processing method with great potential.

In the prior art, a point mode is usually adopted to cut the silicon carbide material, but for the silicon carbide material with the thickness exceeding the millimeter level, the surface cut by the mode has an inclination angle, so that a flat surface is difficult to obtain, and the process requirement of a silicon carbide product cannot be met, which is the biggest difficulty faced by the current laser processing.

Disclosure of Invention

The invention provides a processing device which can improve the flatness of a cutting surface of a silicon carbide plate.

The invention provides a processing device for processing a silicon carbide plate, which comprises a base, a laser device and a processing platform, wherein the laser device comprises a laser device body and a laser device body; the laser device is arranged on the base and comprises a laser, a laser beam expander, a first reflecting mirror, a second reflecting mirror and a laser processing system, wherein a Bessel optical module is arranged in the laser processing system; pulse laser emitted by the laser device is expanded by a laser beam expander, then is reflected to the laser processing system by the first reflector and the second reflector in sequence, and is emitted to the processing platform after being shaped by the Bessel optical module; the processing platform is used for bearing the silicon carbide plate.

The laser device is arranged on the supporting seat, pulse laser emitted by the laser device is parallel to a horizontal plane, and the pulse laser expanded by the laser beam expander and reflected by the first reflecting mirror is parallel to the horizontal plane; and the pulse laser reflected by the second reflecting mirror is perpendicular to the horizontal plane and enters the laser processing system along the optical axis of the laser processing system.

The laser device further comprises a first optical adjusting frame and a second optical adjusting frame, the first reflector is mounted on the first optical adjusting frame, and the first optical adjusting frame is used for adjusting the angle of the first reflector; the second reflector is mounted on the second optical adjusting frame, and the second optical adjusting frame is used for adjusting the angle of the second reflector.

The laser device further comprises a first translation table and a second translation table, wherein the first translation table is connected between the first optical adjusting frame and the base and used for driving the first reflector to perform linear adjustment along a first direction, and the first direction is the axial direction of the laser beam expander; the second translation platform is connected between the second optical adjusting frame and the base and used for driving the second reflector to perform linear adjustment along a second direction, and the second direction is parallel to the horizontal plane and is perpendicular to the first direction.

The laser device further comprises a Z-axis driving mechanism; the Z-axis driving mechanism is arranged on the base, is connected with the laser processing system and is used for driving the laser processing system to move parallel to the optical axis of the laser processing system.

The processing equipment further comprises a moving device, wherein the moving device comprises a horizontal moving mechanism, and the horizontal moving mechanism is connected to the processing platform and used for controlling the processing platform to move on an X axis and a Y axis.

Wherein the horizontal direction moving mechanism includes: the X-axis linear motor is used for driving the machining platform to move along an X axis, and the Y-axis linear motor is used for driving the machining platform to move along a Y axis.

The processing equipment further comprises a machine vision system and a control system, wherein the machine vision system is positioned above the moving device and used for acquiring images of the silicon carbide plate and sending the images to the control system; the control system is electrically connected to the mobile device and is used for controlling the mobile device.

The processing platform is a vacuum adsorption platform, and the silicon carbide plate covers the vacuum adsorption platform.

The laser 21 emits pulse laser, the repetition frequency of the pulse laser is 1MHz, the single pulse energy is higher than or equal to 60 muJ, and the pulse width is less than or equal to 10ps. According to the processing equipment provided by the invention, the path of the pulse laser in the three-dimensional direction can be adjusted through the secondary reflection action of the first reflector and the second reflector, so that the pulse laser can enter the laser processing system along the optical axis of the laser processing system; the built-in bessel optical module that carries out the plastic to pulsed laser that has of laser processing system, pulse laser after expanding is via the shaping of bessel optical module back outgoing to the processing platform, pulse laser after the shaping of bessel optical module, the focal depth of edge optical axis defence line after the laser focusing has greatly been improved, can cover the panel thickness more than 5 millimeters, when realizing the cutting of carborundum material high accuracy, the problem of cutting plane slope has been avoided, the technology demand of carborundum material has been satisfied, and the cutting loss is little, the processing cost has greatly been reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.

FIG. 1 is a schematic structural diagram of a processing apparatus provided in a preferred embodiment of the present invention;

fig. 2 is an exploded schematic view of the processing apparatus of fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first," "second," and the like in the terms of the invention are used for descriptive purposes only and not for purposes of indication or implication relative importance, nor as a limitation on the order of precedence.

In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1 and 2, a processing apparatus according to a preferred embodiment of the present invention includes a base 1, a laser device 2, a processing platform 30, and a moving device 3. The laser device 2 is arranged on the base 1 and used for emitting pulse laser; the processing platform 30 is used to carry a silicon carbide plate. The moving device 3 is used for driving the processing platform 30 to move in two directions, and the silicon carbide plate to be cut is cut by using the pulse laser.

The laser device 2 includes a laser 21, a laser beam expander 22, a first mirror 231, a second mirror 232, and a laser processing system 20. A bessel optical module is built in the laser processing system 20, and a pulse laser signal (hereinafter referred to as pulse laser) emitted by the laser 21 is expanded by the laser expander 22 and then reflected to the laser processing system by the first reflector 231 and the second reflector 232 in sequence. The three-dimensional path of the pulsed laser beam can be adjusted to enter the laser processing system 20 along the optical axis thereof by the secondary reflection action of the first and

second mirrors

231, 232. Pulse laser after expanding sends to processing platform 30 after the Bessel optical module plastic, bessel optical module is to pulse laser plastic back, has greatly improved the focal depth (the degree of depth of focus) of laser focus back edge optical axis defence line, can cover the panel thickness more than 5 millimeters, when realizing the cutting of carborundum board high accuracy, has avoided the problem of cutting plane slope, has satisfied the technology demand of carborundum board, and the cutting loss is little, has greatly reduced the processing cost.

The laser 21 provides ultrafast pulsed laser light for the subsequent optical system. Preferably, the laser 21 is capable of emitting a pulsed laser, preferably: ultrafast pulse laser with repetition frequency of 1MHz, high single pulse energy with single pulse energy greater than or equal to 60 muJ, narrow pulse width with pulse width less than or equal to 10ps.

More specifically, in the present embodiment, the laser 21 is a picosecond green laser 21 with a power of 70W and capable of emitting ultrafast pulsed laser with a wavelength of 532nm and a pulse width of 10ps. The silicon carbide plate is cut after the pulse laser generated by the laser 21 is reflected and the laser is shaped by the Bessel optical system. Laser instrument 21 adopts the green laser instrument of high-energy picosecond, has improved machining efficiency to this cutting equipment only sets up first speculum 231 and the second speculum 232 of mutually supporting, does not have the flight light path, and this stability that has improved the equipment light path greatly improves the productivity, reduces the maintenance cost.

The base 1 is provided with a supporting seat 10, a laser 21 is arranged on the supporting seat 10, pulse laser emitted by the laser 21 is parallel to a horizontal plane, and the pulse laser expanded by a laser beam expander 22 and reflected by a first reflector 231 is parallel to the horizontal plane; the pulse laser light reflected by the second mirror 232 enters the laser processing system 20 perpendicular to the horizontal plane and along the optical axis of the laser processing system 20. In the present embodiment, the upper surface of the supporting seat 10 is perpendicular to the Z-axis, and the supporting seat 10 is parallel to the horizontal plane for positioning convenience, more specifically, the Z-axis is vertical.

The laser beam expander 22 is used for expanding the pulse laser emitted by the laser 21 and improving the divergence angle of the pulse laser emission, so that the pulse laser can be transmitted in parallel in the transmission direction, and preferably, the laser beam expander 22 is a magnification-variable beam expanding system, and the purpose of the laser beam expander is to provide the pulse laser with the optimal diameter for a subsequent optical system according to the actual processing requirement of a product.

The laser beam expander 22 is disposed on the base 1 through a laser beam expander clamp 221, and preferably, the laser beam expander clamp 221 is a five-dimensional optical adjustment clamp, so that various dimensions of the laser beam expander 22 can be adjusted, and the precision of an optical path is improved.

The pulse laser beam passing through the beam expander 22 enters the laser processing system 20 through vertical adjustment of the first reflector 231 and the second reflector 232. Preferably, the pulsed laser is transmitted as parallel as possible to the upper surface of the base 1 during the transmission of the laser to the second mirror 232, which facilitates the structural design of the overall apparatus.

As shown in fig. 1, the laser device 2 further includes a first optical adjustment frame 251 and a second optical adjustment frame 252. The first reflecting mirror 231 is mounted on a first optical adjustment frame 251, and the first optical adjustment frame 251 is used for adjusting the angle of the first reflecting mirror 231, so that the first reflecting mirror 231 can more accurately change the optical path of the pulse laser by 90 ° on the horizontal plane and shoot the pulse laser to the second reflecting mirror 232 along the horizontal plane. The second mirror 232 is mounted on a second optical adjustment frame 252, and the second optical adjustment frame 252 is used for adjusting the angle of the second mirror 232, so that the second mirror 232 can more accurately change the optical path of the pulse laser by 90 °, i.e. change the horizontal direction into the vertical direction, and shoot at the laser processing system.

As shown in fig. 2, the laser apparatus further includes a first translation stage 261 and a second translation stage 262. The first translation stage 261 is connected between the first optical adjustment frame 251 and the base 1, and is configured to drive the first reflecting mirror 231 to perform linear adjustment along a first direction, where the first direction is an axial direction of the laser beam expander. The second translation stage 262 is connected between the second optical adjustment frame 252 and the base 1, and is configured to drive the second mirror 232 to perform linear adjustment along a second direction, where the second direction is parallel to the horizontal plane and perpendicular to the first direction.

Through first translation platform 261, can drive first speculum 231 and remove along the axial of laser beam expander, through second translation platform 262, can drive second speculum 232 and remove along the beam propagation direction, through first translation platform 261 and the cooperation of second translation platform 262 make its optical axis center that can aim at the laser processing system more accurately.

In this embodiment, the first optical adjustment frame 251 and the second optical adjustment frame 252 may adopt various fixtures capable of adjusting the reflection angle of the reflector, and the first translation stage 261 and the second translation stage 262 are various mechanisms capable of implementing linear movement adjustment.

The expanded pulse laser beam passes through a bessel optical module in the laser processing system 20 at a fixed angle (coinciding with the optical axis of the laser processing system 20) by vertical adjustment of the first mirror 231 and the second mirror 232, and a focal depth of millimeter or more is realized in a direction perpendicular to the moving device 3 by using the bessel optical principle. Preferably, the diameter of an incident light spot can be adjusted according to the actual thickness of a processed product, so that the optimization of the depth of focus is realized; the processing efficiency is improved.

In this embodiment, the laser apparatus 2 further includes a Z-axis drive mechanism 24; the Z-axis driving mechanism 24 is disposed on the base 1, connected to the laser processing system 20, and configured to drive the laser processing system 20 to move along the optical axis direction thereof. The laser processing system 20 can be driven to move close to or away from the moving device 3 by the Z-axis driving mechanism 24, so as to achieve better processing effect. The Z-axis driving mechanism 24 may be a precision motor with a moving precision smaller than 1 micron, so as to realize the precision movement of the laser processing system 20 in the Z-axis.

The moving device 3 is located at the laser emitting position of the laser processing system 20 and is used for driving the processing platform 30 to move relative to the laser processing system. The moving device 3 includes a horizontal moving mechanism 31, the horizontal moving mechanism 31 is connected to the processing platform 30, and is configured to drive the processing platform 30 to move on an X axis and a Y axis, the X axis and the Y axis are two directions perpendicular to each other, and both are perpendicular to the Z axis, that is, the optical axis of the laser processing system 20. In this embodiment, the X-axis and the Y-axis are two mutually perpendicular directions on a horizontal plane.

Preferably, the processing platform 30 is a vacuum adsorption platform, and the silicon carbide plate covers the vacuum adsorption platform, and can be adsorbed on the processing platform 30, so that the silicon carbide plate and the processing platform do not move relatively, and the moving accuracy of the silicon carbide plate is ensured.

The horizontal direction moving mechanism 31 includes an X-axis linear motor 32 and a Y-axis linear motor 33, the X-axis linear motor 32 is used for driving the machining platform 30 to move along the X-axis, and the Y-axis linear motor 33 is used for driving the machining platform 30 to move along the Y-axis.

More specifically, in the present embodiment, the X-axis linear motor 32 is connected to the processing platform 30 to drive the processing platform 30 to move along the X-axis, and the Y-axis linear motor 33 is connected to the X-axis linear motor 32 to drive the X-axis linear motor 32 and the processing platform 30 to move along the Y-axis. Here, in other embodiments, the Y-axis linear motor 33 may be connected to the processing platform 30 to drive the processing platform 30 to move along the Y-axis, and the X-axis linear motor 32 may be connected to the Y-axis linear motor 33 to drive the Y-axis linear motor 33 and the processing platform 30 to move along the X-axis.

Preferably, the X-axis linear motor 32 and the Y-axis linear motor 33 are both precision motors with a movement precision of less than 5 μm, and realize the movement of the processing table 30 in the X and Y axes.

In this embodiment, the horizontal moving mechanism 31 of the moving device can drive the processing platform 30 and the silicon carbide plate to move in two mutually perpendicular directions on the horizontal plane, and the Z-axis driving mechanism drives the laser processing system to move on the Z-axis, so that the silicon carbide plate can move three-dimensionally relative to the laser processing system. The laser processing system only needs to move in one direction, so that the movement of the laser processing system can be reduced, and the running stability of the laser processing system is improved. Here, in other embodiments, the Z-axis driving mechanism may also be provided as a part of the moving device, so that the moving device can drive the silicon carbide plate to move three-dimensionally relative to the laser processing system, and the laser processing system is directly fixed on the base.

Further, the processing equipment for the silicon carbide plate further comprises a machine vision system (not shown in the figure) and a control system (not shown in the figure), wherein the machine vision system is located above the moving device 3 and is used for acquiring an image of the silicon carbide plate and sending the image to the control system. The control system is electrically connected to the mobile device 3 and is used for controlling the action of the mobile device 3. The control system can control the action of the mobile device 3 according to the image of the silicon carbide plate, realize full-automatic identification and alignment, do not need manual intervention, and ensure the automation level of the machine. The machine vision system may be fixed on the laser processing system to accurately monitor the laser emitting position, however, in other embodiments, the machine vision system may be directly arranged on the base and arranged adjacent to the laser processing system, and in the embodiment of the present invention, the machine vision system may be a video camera or a shooting device, etc., which is not limited herein, and preferably, the shooting device may be a CCD camera.

The processing object in the present invention is a silicon carbide plate, and may be other semiconductor structures, such as a silicon carbide film, a silicon carbide ingot, or the like, which is not limited herein.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A processing device is used for processing a silicon carbide plate and is characterized by comprising a base, a laser device and a processing platform; the laser device is arranged on the base and comprises a laser, a laser beam expander, a first reflecting mirror, a second reflecting mirror and a laser processing system, wherein a Bessel optical module is arranged in the laser processing system; pulse laser emitted by the laser is expanded by a laser expander, then is reflected to the laser processing system by the first reflector and the second reflector in sequence, and the expanded pulse laser is shaped by the Bessel optical module and then is emitted to the processing platform; the processing platform is used for bearing the silicon carbide plate.

2. The processing apparatus as claimed in claim 1, wherein the base has a support base on which the laser is disposed, the laser emitting the pulsed laser light parallel to a horizontal plane, the pulsed laser light expanded by the laser beam expander and reflected by the first reflecting mirror being parallel to the horizontal plane; and the pulse laser reflected by the second reflecting mirror is perpendicular to the horizontal plane and enters the laser processing system along the optical axis of the laser processing system.

3. The processing apparatus according to claim 2, wherein the laser device further comprises a first optical adjustment frame and a second optical adjustment frame, the first mirror is mounted on the first optical adjustment frame, and the first optical adjustment frame is used for adjusting the angle of the first mirror; the second reflector is mounted on the second optical adjusting frame, and the second optical adjusting frame is used for adjusting the angle of the second reflector.

4. The processing apparatus according to claim 3, wherein the laser device further comprises a first translation stage and a second translation stage, the first translation stage is connected between the first optical adjustment frame and the base for driving the first mirror to perform linear adjustment along a first direction, the first direction is an axial direction of the laser beam expander; the second translation platform is connected between the second optical adjusting frame and the base and used for driving the second reflector to perform linear adjustment along a second direction, and the second direction is parallel to the horizontal plane and is perpendicular to the first direction.

5. The processing apparatus of claim 1, wherein the laser device further comprises a Z-axis drive mechanism; the Z-axis driving mechanism is arranged on the base, is connected with the laser processing system and is used for driving the laser processing system to move parallel to the optical axis of the laser processing system.

6. The processing apparatus as claimed in claim 1, further comprising a moving device, wherein the moving device comprises a horizontal moving mechanism, and the horizontal moving mechanism is connected to the processing platform and is used for controlling the processing platform to move on the X axis and the Y axis.

7. The processing apparatus according to claim 6, wherein the horizontal direction moving mechanism comprises: the X-axis linear motor is used for driving the machining platform to move along an X axis, and the Y-axis linear motor is used for driving the machining platform to move along a Y axis.

8. The processing tool according to claim 6, further comprising a machine vision system and a control system, wherein the machine vision system is positioned above the moving device and is used for acquiring images of the silicon carbide plate and sending the images to the control system; the control system is electrically connected to the mobile device and is used for controlling the mobile device.

9. The processing apparatus as claimed in claim 1, wherein the processing platform is a vacuum chuck platform, and the silicon carbide plate is covered on the vacuum chuck platform.

10. The processing apparatus according to claim 1, wherein the laser 21 emits a pulsed laser having a repetition rate of 1MHz, a high single pulse energy of a single pulse energy of 60 μ J or more, and a pulse width of 10ps or less.