CN109890133A - A kind of flexible circuit board structure and preparation process based on conductive paste - Google Patents
A kind of flexible circuit board structure and preparation process based on conductive paste Download PDFInfo
- Publication number
- CN109890133A CN109890133A CN201910179263.6A CN201910179263A CN109890133A CN 109890133 A CN109890133 A CN 109890133A CN 201910179263 A CN201910179263 A CN 201910179263A CN 109890133 A CN109890133 A CN 109890133A
- Authority
- CN
- China
- Prior art keywords
- conductive paste
- circuit board
- flexible
- insulating film
- film matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention relates to a kind of flexible circuit board structures based on conductive paste, including flexible insulating film matrix, based on conductive paste circuit and insulation white oil layer, wherein it is based on conductive paste circuit at least one, it is coated on flexible insulating film outer surface of matrix and is parallel to each other distribution with flexible insulating film matrix, insulation white oil layer is respectively coated by flexible insulating film matrix, based on conductive paste circuit outer surface.Its preparation process includes substrate pretreated, circuit design, circuits assembly, five steps such as baking and curing and insulation processing.One aspect of the present invention structure and simple production process, low production cost, it has good conductive property simultaneously, insulation performance and flame retardant property, on the other hand more traditional to obtain flexible circuit board, resistance equipment effectively is eliminated, to reduce flexible circuit board producting process difficulty and cost, and greatly improves production efficiency and product qualification rate, to greatly improve flexible circuit board runnability, and reduces and drink cost using production.
Description
Technical field
The present invention relates to a kind of flexible circuit board structure and preparation process based on conductive paste, belongs to flexible circuit plate technique neck
Domain.
Background technique
With the cost and progress of flexible circuit board production technology, in the equipment such as electronic product, lighting apparatus extensively
Application, but find in actual use, it is base that currently used flexible circuit board, which is often all based on PI or PET flexible membrane,
Plinth is bonded by adhesives such as conducting resinls or directly prepares copper foil circuit in PI or PET flexibility film surface by mode of printing
Traditional structure, while in order to meet the needs of the parameters such as resistance and voltage when difference electrical appliance equipment operation when circuit is run,
It is often separately both needed to weld the resistance equipment of a large amount of different parameters types on copper foil circuit, although can satisfy the need used
It wants, but on the one hand causes current flex circuit complicated, production cost is relatively high, on the other hand also results in production work
Skill is complicated, production difficulty is high, and production efficiency and qualification rate are relatively low, it is difficult to effectively meet the need of actual use
It wants.
Therefore, for this status, there is an urgent need to develop a kind of completely new flex circuit and corresponding production preparations
Technique.
Summary of the invention
In order to solve the deficiency in the prior art, the present invention provides a kind of flexible circuit board structure and reality based on conductive paste
Proved recipe method.
In order to realize effect above-mentioned, a kind of flexible circuit board structure based on conductive paste and preparation work are proposed
Skill specifically includes the following contents:
A kind of flexible circuit board structure based on conductive paste, including flexible insulating film matrix, based on conductive paste circuit and insulation it is white
Oil reservoir, wherein be based on conductive paste circuit at least one, be coated on flexible insulating film outer surface of matrix and with flexible insulating film matrix
Be parallel to each other distribution, and insulation white oil layer is respectively coated by flexible insulating film matrix, based on conductive paste circuit outer surface.
Further, the described flexible insulating film matrix is at least one layer of, when flexible insulating film matrix be two layers and two layers with
It when upper, was parallel to each other between each layer flexible insulating film matrix, and by based on conductive paste electricity between adjacent two layers flexible insulating film matrix
Any one or two kinds are simultaneously using being connected with each other in road and insulation white oil layer, and the flexible insulating film matrix is PI film, PET
Any one or two kinds in film are used in conjunction with.
Further, described when based on conductive paste circuit being two and two or more, respectively based on phase between conductive paste circuit
Mutual mixed connection, and be located at any one surface in flexible insulating film matrix upper surface and lower end surface and be located on two surfaces simultaneously,
And it is located on the same surface of flexible insulating film matrix and is respectively based on conductive paste circuit thickness no more than 1 millimeter, and be respectively based on leading
Plasma-based circuit upper surface is distributed in same plane.
Further, described to be made of based on conductive paste circuit following substances in weight percentage: trimethylolpropane tris
Methacrylate 10% -15%, n-vinyl pyrrolidone 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol polyoxy
Vinethene 7% -10%, silver-coated copper powder 16% -21%, gas-phase silica 0.05% -1% mix amylalcohol 11% -25%, coupling agent 2% -
5%, surplus is epoxy acrylic resin.
Further, the insulation white oil layer thickness is not less than 0.5 millimeter.
Further, the flexible insulating film matrix front end face and rear end face position are all provided at least one copper foil electrode,
The copper foil electrode is connect with based on conductive paste circuit electrical.
A kind of preparation process of the flexible circuit board structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained is in 40 DEG C -100 DEG C isoperibols
Under carry out drying operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film base
The connection of body surface solidification, and when the flexible circuit board blank water content based on conductive paste is not more than 3%, by the base after drying
Room temperature is naturally cooled to furnace in the flexible circuit board blank of conductive paste, finally to the flexible electrical after cooling based on conductive paste
Road plate blank carries out impression according to circuit structure and cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C-50 DEG C, and the insulation white oil layer of spraying operation is every time with a thickness of 0.05-0.2 millimeter, then
Flexible circuit board of the semi-finished product based on conductive paste after completion spraying operation is carried out under 40 DEG C -100 DEG C isoperibols again
Operation is dried, and when the white oil layer water content that insulate is not more than 3%, by the flexible circuit board blank based on conductive paste after drying
Part naturally cools to room temperature with furnace, and flexible circuit board of the finished product based on conductive paste can be obtained.
Further, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface is held
The surface tension received is 40%-the 90% of flexible insulating film matrix surface limit tension.
Further, it is flexible exhausted when operation is dried in the spraying operation agent in S3 step drying operation and S4 step
Velum matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction, and
Magnetic field strength is 2000-5000 Gausses.
One aspect of the present invention structure and simple production process, low production cost, while having good conductive property, absolutely
Edge performance and flame retardant property, it is on the other hand more traditional to obtain flexible circuit board, resistance equipment is effectively eliminated, to reduce flexibility
Board production technology difficulty and cost, and production efficiency and product qualification rate are greatly improved, to greatly improve
Flexible circuit board runnability, and reduce and drink cost using production.
Detailed description of the invention
The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments；
Fig. 1 is flexible insulating film matrix of the present invention structural schematic diagram when being one layer；
Fig. 2 is flexible insulating film matrix of the present invention structural schematic diagram when being two layers；
Fig. 3 is the method for the present invention flow chart.
Specific embodiment
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to construct, below with reference to specific
Embodiment, the present invention is further explained.
As illustrated in fig. 1 and 2, a kind of flexible circuit board structure based on conductive paste, including flexible insulating film matrix 1, be based on
Conductive paste circuit 2 and insulation white oil layer 3 are coated on outside flexible insulating film matrix 1 wherein being based on conductive paste circuit 2 at least one
Surface is simultaneously parallel to each other distribution with flexible insulating film matrix 1, and insulation white oil layer 3 is respectively coated by flexible insulating film matrix 1, is based on
2 outer surface of conductive paste circuit.
In the present embodiment, the flexible insulating film matrix 1 is at least one layer of, when flexible insulating film matrix 1 is two layers and two
Layer or more when, be parallel to each other between each layer flexible insulating film matrix 1, and by based on leading between adjacent two layers flexible insulating film matrix 1
Any one in plasma-based circuit 2 and insulation white oil layer 3 or two kinds of uses simultaneously are connected with each other, and the flexible insulating film matrix 1
It is used in conjunction with for any one or two kinds in PI film, PET film.
In the present embodiment, it is described based on conductive paste circuit 2 be two and two or more when, respectively be based on conductive paste circuit 2
Between mutual mixed connection, and be located at any one surface in 1 upper surface of flexible insulating film matrix and lower end surface and be located at two tables simultaneously
On face, and it is located on the same surface of flexible insulating film matrix 1 and is respectively based on 2 thickness of conductive paste circuit no more than 1 millimeter, and is each
It is distributed in same plane based on 2 upper surface of conductive paste circuit.
It is described to be made of based on conductive paste circuit 2 following substances in weight percentage: trimethylolpropane in the present embodiment
Trimethyl acrylic ester 10% -15%, n-vinyl pyrrolidone 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol are poly-
Ethylene oxide ether 7% -10%, silver-coated copper powder 16% -21%, gas-phase silica 0.05% -1% mix amylalcohol 11% -25%, coupling agent
2% -5%, surplus is epoxy acrylic resin.
In the present embodiment, 3 thickness of insulation white oil layer is not less than 0.5 millimeter.
In the present embodiment, 1 front end face of flexible insulating film matrix and rear end face position are all provided at least one copper foil electricity
Pole 4, the copper foil electrode 4 are electrically connected with based on conductive paste circuit 2.
Embodiment 1
As shown in figure 3, a kind of preparation process of the flexible circuit board structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 40 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and when it is 3% that the flexible circuit board blank based on conductive paste, which contains, by the flexibility based on conductive paste after drying
Circuit board blank naturally cools to room temperature with furnace, finally the flexible circuit board blank to after cooling based on conductive paste according to
Circuit structure carries out impression and cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C, and every time then the insulation white oil layer of spraying operation sprays completion with a thickness of 0.05 millimeter
Flexible circuit board of the post-job semi-finished product based on conductive paste carries out drying operation under 40 DEG C of isoperibols again, and is insulating
When white oil layer water content is 3%, the flexible circuit board blank based on conductive paste after drying is naturally cooled into room temperature with furnace,
Flexible circuit board of the finished product based on conductive paste can be obtained.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 40% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 2000 Gausses.
Embodiment 2
As shown in figure 3, a kind of preparation process of the flexible circuit board structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 100 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and the flexible circuit board blank water content based on conductive paste be 0 when, by after drying based on the soft of conductive paste
Property circuit board blank naturally cools to room temperature with furnace, finally the flexible circuit board blank root to after cooling based on conductive paste
Impression, which is carried out, according to circuit structure cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 50 DEG C, and every time then the insulation white oil layer of spraying operation is made completion spraying with a thickness of 0.2 millimeter
Flexible circuit board of the semi-finished product based on conductive paste after industry carries out drying operation under 100 DEG C of isoperibols again, and is insulating
When white oil layer water content is not more than 3%, the flexible circuit board blank based on conductive paste after drying is naturally cooled to often with furnace
Flexible circuit board of the finished product based on conductive paste can be obtained in temperature.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 90% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 5000 Gausses.
Embodiment 3
As shown in figure 3, a kind of preparation process of the flexible circuit board structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 60 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and when flexible circuit board blank water content based on conductive paste is 1%, by after drying based on conductive paste
Flexible circuit board blank naturally cools to room temperature with furnace, finally the flexible circuit board blank to after cooling based on conductive paste
Impression, which is carried out, according to circuit structure cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 40 DEG C, and every time then the insulation white oil layer of spraying operation is made completion spraying with a thickness of 0.1 millimeter
Flexible circuit board of the semi-finished product based on conductive paste after industry carries out drying operation under 60 DEG C of isoperibols again, and white insulating
When oil reservoir water content is 2%, the flexible circuit board blank based on conductive paste after drying is naturally cooled into room temperature with furnace, i.e.,
Flexible circuit board of the finished product based on conductive paste can be obtained.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 50% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 35000 Gausses.
One aspect of the present invention structure and simple production process, low production cost, while having good conductive property, absolutely
Edge performance and flame retardant property, it is on the other hand more traditional to obtain flexible circuit board, resistance equipment is effectively eliminated, to reduce flexibility
Board production technology difficulty and cost, and production efficiency and product qualification rate are greatly improved, to greatly improve
Flexible circuit board runnability, and reduce and drink cost using production.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (9)
1. a kind of flexible circuit board structure based on conductive paste, it is characterised in that: the flexible circuit board based on conductive paste
Structure includes flexible insulating film matrix, based on conductive paste circuit and insulation white oil layer, wherein described be based on conductive paste circuit at least
It one, is coated on flexible insulating film outer surface of matrix and is parallel to each other distribution with flexible insulating film matrix, the insulation white oil layer
It is respectively coated by flexible insulating film matrix, based on conductive paste circuit outer surface.
2. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that the flexibility
Insulating film matrix is at least one layer of, when flexible insulating film matrix is two layers and two layers or more, phase between each layer flexible insulating film matrix
It is mutually parallel, and by based on any one in conductive paste circuit and insulation white oil layer or two between adjacent two layers flexible insulating film matrix
Kind simultaneously using being connected with each other, and the flexible insulating film matrix is that PI film, any one or two kinds in PET film make jointly
With.
3. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that it is described based on
When conductive paste circuit is two and two or more, respectively based on mutual mixed connection between conductive paste circuit, and it is located at flexible insulating film matrix
Any one surface and it is located on two surfaces simultaneously in upper surface and lower end surface, and is located at the same surface of flexible insulating film matrix
On respectively based on conductive paste circuit thickness no more than 1 millimeter, and be respectively distributed in based on conductive paste circuit upper surface same flat
In face.
4. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that it is described based on
Conductive paste circuit is made of following substances in weight percentage: trimethylol-propane trimethacrylate 10% -15%, N- ethylene
Base pyrrolidones 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol polyoxyethylene ether 7% -10%, silver-coated copper powder 16% -
21%, gas-phase silica 0.05% -1% mixes amylalcohol 11% -25%, coupling agent 2% -5%, and surplus is epoxy acrylic resin.
5. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that the insulation
White oil layer thickness is not less than 0.5 millimeter.
6. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that the flexibility
Insulating film matrix front end face and rear end face position are all provided at least one copper foil electrode, the copper foil electrode be based on conductive paste circuit
Electrical connection.
7. a kind of preparation process of the flexible circuit board structure based on conductive paste, it is characterised in that: described based on conductive paste
The preparation process of flexible circuit board structure the following steps are included:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained is in 40 DEG C -100 DEG C isoperibols
Under carry out drying operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film base
The connection of body surface solidification, and when the flexible circuit board blank water content based on conductive paste is not more than 3%, by the base after drying
Room temperature is naturally cooled to furnace in the flexible circuit board blank of conductive paste, finally to the flexible electrical after cooling based on conductive paste
Road plate blank carries out impression according to circuit structure and cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C-50 DEG C, and the insulation white oil layer of spraying operation is every time with a thickness of 0.05-0.2 millimeter, then
Flexible circuit board of the semi-finished product based on conductive paste after completion spraying operation is carried out under 40 DEG C -100 DEG C isoperibols again
Operation is dried, and when the white oil layer water content that insulate is not more than 3%, by the flexible circuit board blank based on conductive paste after drying
Part naturally cools to room temperature with furnace, and flexible circuit board of the finished product based on conductive paste can be obtained.
8. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that the S2 step
In rapid and S4 step when carrying out drying operation, the surface tension that flexible insulating film matrix surface is born is flexible insulating film matrix
40%-the 90% of surface limit tension.
9. a kind of flexible circuit board structure based on conductive paste according to claim 1, which is characterized in that the S3 step
When operation is dried in spraying operation agent in rapid drying operation and S4 step, flexible insulating film matrix is respectively positioned on magnetic direction and flexibility
In the operation of insulating film matrix and the consistent magnetostatic field environment in spraying operation direction, and magnetic field strength is 2000-5000 Gausses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179263.6A CN109890133A (en) | 2019-03-11 | 2019-03-11 | A kind of flexible circuit board structure and preparation process based on conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179263.6A CN109890133A (en) | 2019-03-11 | 2019-03-11 | A kind of flexible circuit board structure and preparation process based on conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109890133A true CN109890133A (en) | 2019-06-14 |
Family
ID=66931548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910179263.6A Pending CN109890133A (en) | 2019-03-11 | 2019-03-11 | A kind of flexible circuit board structure and preparation process based on conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109890133A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446367A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of aluminum substrate and flexible plate high precision continuous gluing technique |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4581098A (en) * | 1984-10-19 | 1986-04-08 | International Business Machines Corporation | MLC green sheet process |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN105657960A (en) * | 2016-03-26 | 2016-06-08 | 杨华琼 | Three-dimensional ceramic composite circuit board and manufacturing method thereof |
| CN109360673A (en) * | 2018-10-24 | 2019-02-19 | 焦作市高森建电子科技有限公司 | A kind of wicker copper conductive copper paste and preparation method thereof |
-
2019
- 2019-03-11 CN CN201910179263.6A patent/CN109890133A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4581098A (en) * | 1984-10-19 | 1986-04-08 | International Business Machines Corporation | MLC green sheet process |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN105657960A (en) * | 2016-03-26 | 2016-06-08 | 杨华琼 | Three-dimensional ceramic composite circuit board and manufacturing method thereof |
| CN109360673A (en) * | 2018-10-24 | 2019-02-19 | 焦作市高森建电子科技有限公司 | A kind of wicker copper conductive copper paste and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446367A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of aluminum substrate and flexible plate high precision continuous gluing technique |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109855063A (en) | A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste | |
| CN102344772A (en) | High thermal conducting insulating epoxy resin adhesive and its application in flexible aluminum based copper-clad plate for LED | |
| CN102876270B (en) | Epoxy resin conducting adhesive with high bonding strength | |
| CN207334345U (en) | A kind of high-voltage LED light bar | |
| KR20110088934A (en) | Low electromagnetic wave planar heating element and manufacturing method of the same | |
| CN109890133A (en) | A kind of flexible circuit board structure and preparation process based on conductive paste | |
| CN106883786A (en) | A kind of preparation method of comprehensive thermal setting conductive glue | |
| CN106833428B (en) | A kind of conducting resinl suitable for flexible electrode bonding | |
| CN102883519A (en) | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof | |
| CN203722914U (en) | Flexible printed circuit board | |
| US10696582B2 (en) | Vehicle window glass and method for manufacturing vehicle window glass | |
| CN206775835U (en) | The PCBA board of air door actuator of automobile air-conditioner | |
| CN206758148U (en) | High pressure is female with low pressure composite bar | |
| CN105576061A (en) | High-conductivity and high-voltage solar photoelectric glass plate | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN108617084A (en) | A kind of electromagnetism interference flexible circuit board and production method | |
| CN203896582U (en) | High-efficiency heat radiation type PCB | |
| JP2020037404A (en) | Vehicle window glass | |
| CN207135346U (en) | A kind of high intensity pcb board | |
| CN109862716A (en) | A kind of display base plate and preparation method thereof, display panel and display device | |
| CN104470226A (en) | Circuit board manufacturing method | |
| CN102427666A (en) | Manufacturing method of high frequency microwave circuit board base material | |
| CN205847735U (en) | Anti-deformation crosses furnace carrier | |
| CN113923859B (en) | High-current and high-voltage resistant electric line wiring board and manufacturing process thereof | |
| CN205902205U (en) | Copper -clad plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190614 |