CN109855063A - A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste - Google Patents
A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste Download PDFInfo
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- CN109855063A CN109855063A CN201910179431.1A CN201910179431A CN109855063A CN 109855063 A CN109855063 A CN 109855063A CN 201910179431 A CN201910179431 A CN 201910179431A CN 109855063 A CN109855063 A CN 109855063A
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Abstract
The present invention relates to a kind of non-resistance flexible light band circuit structure based on conductive paste, including flexible insulating film matrix, based on conductive paste circuit and insulation white oil layer, wherein it is based on conductive paste circuit at least one, it is coated on flexible insulating film outer surface of matrix and is parallel to each other distribution with flexible insulating film matrix, insulation white oil layer is respectively coated by flexible insulating film matrix, based on conductive paste circuit outer surface.Its preparation process includes substrate pretreated, circuit design, circuits assembly, five steps such as baking and curing and insulation processing.One aspect of the present invention structure and simple production process, low production cost, it has good conductive property simultaneously, insulation performance and flame retardant property, on the other hand more traditional to obtain flexible circuit board, resistance equipment effectively is eliminated, to reduce flexible circuit board producting process difficulty and cost, and greatly improves production efficiency and product qualification rate, to greatly improve flexible circuit board runnability, and reduce using production cost.
Description
Technical field
The present invention relates to a kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste, belongs to flexible circuit board
Technical field.
Background technique
With the cost and progress of flexible circuit board production technology, in the equipment such as electronic product, lighting apparatus extensively
Application, but find in actual use, it is base that currently used flexible circuit board, which is often all based on PI or PET flexible membrane,
Plinth is bonded by adhesives such as conducting resinls or directly prepares copper foil circuit in PI or PET flexibility film surface by mode of printing
Traditional structure, while in order to meet the needs of the parameters such as resistance and voltage when difference electrical appliance equipment operation when circuit is run,
It is often separately both needed to weld the resistance equipment of a large amount of different parameters types on copper foil circuit, although can satisfy the need used
It wants, but on the one hand causes current flex circuit complicated, production cost is relatively high, on the other hand also results in production work
Skill is complicated, production difficulty is high, and production efficiency and qualification rate are relatively low, it is difficult to effectively meet the need of actual use
It wants.
Therefore, for this status, there is an urgent need to develop a kind of completely new flex circuit and corresponding production preparations
Technique.
Summary of the invention
In order to solve the deficiency in the prior art, the present invention provides a kind of non-resistance flexible light band circuit based on conductive paste
Structure and experimental method.
In order to realize effect above-mentioned, propose a kind of non-resistance flexible light band circuit structure based on conductive paste and
Preparation process specifically includes the following contents:
A kind of non-resistance flexible light band circuit structure based on conductive paste, including flexible insulating film matrix, based on conductive paste circuit,
LED lamp bead and insulation white oil layer, wherein it is described based on conductive paste circuit at least one, it is coated on flexible insulating film outer surface of matrix
And be parallel to each other distribution with flexible insulating film matrix, the LED lamp bead is several, each several based on being all provided on conductive paste circuit
LED lamp bead is simultaneously electrically connected with LED lamp bead, and same each LED lamp bead based on conductive paste circuit is along based on conductive paste circuit
Axis direction is uniformly distributed, and the insulation white oil layer is respectively coated by flexible insulating film matrix, is based on outside conductive paste circuit and LED lamp bead
Surface.
Further, the described flexible insulating film matrix is at least one layer of, when flexible insulating film matrix be two layers and two layers with
It when upper, was parallel to each other between each layer flexible insulating film matrix, and by based on conductive paste electricity between adjacent two layers flexible insulating film matrix
Any one or two kinds are simultaneously using being connected with each other in road and insulation white oil layer, and the flexible insulating film matrix is PI film, PET
Any one or two kinds in film are used in conjunction with.
Further, described when based on conductive paste circuit being two and two or more, respectively based on phase between conductive paste circuit
Mutual mixed connection, and be located at any one surface in flexible insulating film matrix upper surface and lower end surface and be located on two surfaces simultaneously,
And it is located on the same surface of flexible insulating film matrix and is respectively based on conductive paste circuit thickness no more than 1 millimeter, and be respectively based on leading
Plasma-based circuit upper surface is distributed in same plane.
Further, described to be made of based on conductive paste circuit following substances in weight percentage: trimethylolpropane tris
Methacrylate 10% -15%, n-vinyl pyrrolidone 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol polyoxy
Vinethene 7% -10%, silver-coated copper powder 16% -21%, gas-phase silica 0.05% -1% mix amylalcohol 11% -25%, coupling agent 2% -
5%, surplus is epoxy acrylic resin.
Further, the insulation white oil layer thickness is not less than 0.5 millimeter.
Further, the flexible insulating film matrix front end face and rear end face position are all provided at least one copper foil electrode,
The copper foil electrode is connect with based on conductive paste circuit electrical.
A kind of preparation process of the non-resistance flexible light band circuit structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained is in 25 DEG C -35 DEG C isoperibols
Under carry out drying operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film base
The connection of body surface solidification, and when the flexible circuit board blank water content based on conductive paste is not more than 20% -40%, by each LED
Each LED lamp bead is embedded into respectively based in conductive paste circuit and and base by the LED lamp bead distributed architecture that lamp bead is set according to S2 step
It is connected in conductive paste circuit electrical, and after completing LED lamp bead installation, makes flexible circuit board blank and LED based on conductive paste
The lamp bead mechanical drying under 40 DEG C -100 DEG C isoperibols together, and until the flexible circuit board blank based on conductive paste contains
Water is not more than 3%, the flexible circuit board blank based on conductive paste after drying is finally naturally cooled to room temperature with furnace, most
Afterwards the flexible circuit board blank to after cooling based on conductive paste according to circuit structure carry out impression cut operation obtain half at
Flexible circuit board of the product based on conductive paste；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C-50 DEG C, and the insulation white oil layer of spraying operation is every time with a thickness of 0.05-0.2 millimeter, then
Flexible circuit board of the semi-finished product based on conductive paste after completion spraying operation is carried out under 40 DEG C -100 DEG C isoperibols again
Operation is dried, and when the white oil layer water content that insulate is not more than 3%, by the flexible circuit board blank based on conductive paste after drying
Part naturally cools to room temperature with furnace, and flexible circuit board of the finished product based on conductive paste can be obtained.
Further, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface is held
The surface tension received is 40%-the 90% of flexible insulating film matrix surface limit tension.
Further, it is flexible exhausted when operation is dried in the spraying operation agent in S3 step drying operation and S4 step
Velum matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction, and
Magnetic field strength is 2000-5000 Gausses.
Further, the S2 step is when carrying out LED lamp bead distributed architecture, LED lamp bead end positions based on leading
Plasma-based values of circuit resistances is 0.9-1.2 times for meeting LED lamp bead and running current-limiting resistance value, and is carrying out conductive paste circuitous resistance
When value adjustment, the purpose of conductive paste values of circuit resistances adjustment is directly carried out by adjusting conductive paste circuit length.
One aspect of the present invention structure and simple production process, low production cost, while having good conductive property, absolutely
Edge performance and flame retardant property, it is on the other hand more traditional to obtain flexible circuit board, resistance equipment is effectively eliminated, to reduce flexibility
Board production technology difficulty and cost, and production efficiency and product qualification rate are greatly improved, to greatly improve
Flexible circuit board runnability, and reduce and drink cost using production.
Detailed description of the invention
The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments；
Fig. 1 is flexible insulating film matrix of the present invention structural schematic diagram when being one layer；
Fig. 2 is flexible insulating film matrix of the present invention structural schematic diagram when being two layers；
Fig. 3 is the method for the present invention flow chart.
Specific embodiment
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to construct, below with reference to specific
Embodiment, the present invention is further explained.
As illustrated in fig. 1 and 2, a kind of non-resistance flexible light band circuit structure based on conductive paste, including flexible insulating film base
Body 1 is wrapped based on conductive paste circuit 2, LED lamp bead 4 and insulation white oil layer 3 wherein described be based on conductive paste circuit 2 at least one
It overlays on 1 outer surface of flexible insulating film matrix and is parallel to each other distribution with flexible insulating film matrix 1, the LED lamp bead 4 is several, often
It is a to be based on being all provided with several LED lamp beads 4 on conductive paste circuit 2 and be electrically connected with LED lamp bead 4 and same based on conductive paste circuit 2
On each LED lamp bead 4 along uniformly distributed based on 2 axis direction of conductive paste circuit, the insulation white oil layer 3 is respectively coated by flexible insulation
Film matrix 1 is based on 4 outer surface of conductive paste circuit 2 and LED lamp bead.
In the present embodiment, the flexible insulating film matrix 1 is at least one layer of, when flexible insulating film matrix 1 is two layers and two
Layer or more when, be parallel to each other between each layer flexible insulating film matrix 1, and by based on leading between adjacent two layers flexible insulating film matrix 1
Any one in plasma-based circuit 2 and insulation white oil layer 3 or two kinds of uses simultaneously are connected with each other, and the flexible insulating film matrix 1
It is used in conjunction with for any one or two kinds in PI film, PET film.
In the present embodiment, it is described based on conductive paste circuit 2 be two and two or more when, respectively be based on conductive paste circuit 2
Between mutual mixed connection, and be located at any one surface in 1 upper surface of flexible insulating film matrix and lower end surface and be located at two tables simultaneously
On face, and it is located on the same surface of flexible insulating film matrix 1 and is respectively based on 2 thickness of conductive paste circuit no more than 1 millimeter, and is each
It is distributed in same plane based on 2 upper surface of conductive paste circuit.
It is described to be made of based on conductive paste circuit 2 following substances in weight percentage: trimethylolpropane in the present embodiment
Trimethyl acrylic ester 10% -15%, n-vinyl pyrrolidone 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol are poly-
Ethylene oxide ether 7% -10%, silver-coated copper powder 16% -21%, gas-phase silica 0.05% -1% mix amylalcohol 11% -25%, coupling agent
2% -5%, surplus is epoxy acrylic resin.
In the present embodiment, 3 thickness of insulation white oil layer is not less than 0.5 millimeter.
In the present embodiment, 1 front end face of flexible insulating film matrix and rear end face position are all provided at least one copper foil electricity
Pole 5, the copper foil electrode 5 are electrically connected with based on conductive paste circuit 2.
Embodiment 1
As shown in figure 3, a kind of preparation process of the non-resistance flexible light band circuit structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 25 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and when the flexible circuit board blank water content based on conductive paste is not more than 20%, by each LED lamp bead according to S2
The LED lamp bead distributed architecture of step setting by each LED lamp bead be embedded into respectively based in conductive paste circuit and with based on conductive paste electricity
Road electrical connection, and complete LED lamp bead installation after, make the flexible circuit board blank based on conductive paste together with LED lamp bead
Mechanical drying under 40 DEG C of isoperibols, and until the flexible circuit board blank water content based on conductive paste is 3%, finally by baking
The flexible circuit board blank based on conductive paste after dry naturally cools to room temperature with furnace, is finally based on conductive paste to after cooling
Flexible circuit board blank impression carried out according to circuit structure cut the operation flexible circuit based on conductive paste that obtains semi-finished product
Plate；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C, and every time then the insulation white oil layer of spraying operation sprays completion with a thickness of 0.05 millimeter
Flexible circuit board of the post-job semi-finished product based on conductive paste carries out drying operation under 40 DEG C of isoperibols again, and is insulating
When white oil layer water content is 3%, the flexible circuit board blank based on conductive paste after drying is naturally cooled into room temperature with furnace,
Flexible circuit board of the finished product based on conductive paste can be obtained.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 40% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 2000 Gausses.
In the present embodiment, the S2 step when carrying out LED lamp bead distributed architecture, LED lamp bead end positions based on
Conductive paste values of circuit resistances is 0.9 times for meeting LED lamp bead and running current-limiting resistance value, and is carrying out conductive paste values of circuit resistances tune
When whole, the purpose of conductive paste values of circuit resistances adjustment is directly carried out by adjusting conductive paste circuit length.
Embodiment 2
As shown in figure 3, a kind of preparation process of the non-resistance flexible light band circuit structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 35 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and when the flexible circuit board blank water content based on conductive paste is not more than 40%, by each LED lamp bead according to S2
The LED lamp bead distributed architecture of step setting by each LED lamp bead be embedded into respectively based in conductive paste circuit and with based on conductive paste electricity
Road electrical connection, and complete LED lamp bead installation after, make the flexible circuit board blank based on conductive paste together with LED lamp bead
Mechanical drying under 100 DEG C of isoperibols, and until the flexible circuit board blank water content based on conductive paste is 1%, finally by baking
The flexible circuit board blank based on conductive paste after dry naturally cools to room temperature with furnace, is finally based on conductive paste to after cooling
Flexible circuit board blank impression carried out according to circuit structure cut the operation flexible circuit based on conductive paste that obtains semi-finished product
Plate；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 50 DEG C, and every time then the insulation white oil layer of spraying operation is made completion spraying with a thickness of 0.2 millimeter
Flexible circuit board of the semi-finished product based on conductive paste after industry carries out drying operation under 100 DEG C of isoperibols again, and is insulating
When white oil layer water content is not more than 3%, the flexible circuit board blank based on conductive paste after drying is naturally cooled to often with furnace
Flexible circuit board of the finished product based on conductive paste can be obtained in temperature.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 90% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 5000 Gausses.
In the present embodiment, the S2 step when carrying out LED lamp bead distributed architecture, LED lamp bead end positions based on
Conductive paste values of circuit resistances is 1.2 times for meeting LED lamp bead and running current-limiting resistance value, and is carrying out conductive paste values of circuit resistances tune
When whole, the purpose of conductive paste values of circuit resistances adjustment is directly carried out by adjusting conductive paste circuit length.
Embodiment 3
As shown in figure 3, a kind of preparation process of the non-resistance flexible light band circuit structure based on conductive paste, comprising the following steps:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
Conductive paste circuit data parameter is respectively based in the particular number of conductive paste circuit, wire structures and resistance parameter content；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained carry out under 30 DEG C of isoperibols
Dry operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film matrix surface
Solidification connection, and when the flexible circuit board blank water content based on conductive paste is not more than 30%, by each LED lamp bead according to S2
The LED lamp bead distributed architecture of step setting by each LED lamp bead be embedded into respectively based in conductive paste circuit and with based on conductive paste electricity
Road electrical connection, and complete LED lamp bead installation after, make the flexible circuit board blank based on conductive paste together with LED lamp bead
Mechanical drying under 60 DEG C of isoperibols, and until the flexible circuit board blank water content based on conductive paste is 0, finally by drying
The flexible circuit board blank based on conductive paste afterwards naturally cools to room temperature with furnace, finally to after cooling based on conductive paste
Flexible circuit board blank carries out impression according to circuit structure and cuts the operation flexible circuit board based on conductive paste that obtains semi-finished product；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 40 DEG C, and every time then the insulation white oil layer of spraying operation is made completion spraying with a thickness of 0.1 millimeter
Flexible circuit board of the semi-finished product based on conductive paste after industry carries out drying operation under 60 DEG C of isoperibols again, and white insulating
When oil reservoir water content is 2%, the flexible circuit board blank based on conductive paste after drying is naturally cooled into room temperature with furnace, i.e.,
Flexible circuit board of the finished product based on conductive paste can be obtained.
In the present embodiment, in the S2 step and S4 step when carrying out drying operation, flexible insulating film matrix surface
The surface tension of receiving is the 50% of flexible insulating film matrix surface limit tension.
It is flexible when operation is dried in the spraying operation agent in the S3 step drying operation and S4 step in the present embodiment
Insulating film matrix is respectively positioned in magnetic direction and the operation of flexible insulating film matrix and the consistent magnetostatic field environment in spraying operation direction,
And magnetic field strength is 35000 Gausses.
In the present embodiment, the S2 step when carrying out LED lamp bead distributed architecture, LED lamp bead end positions based on
Conductive paste values of circuit resistances is 1 times for meeting LED lamp bead and running current-limiting resistance value, and is carrying out the adjustment of conductive paste values of circuit resistances
When, the purpose of conductive paste values of circuit resistances adjustment is directly carried out by adjusting conductive paste circuit length.
One aspect of the present invention structure and simple production process, low production cost, while having good conductive property, absolutely
Edge performance and flame retardant property, it is on the other hand more traditional to obtain flexible circuit board, resistance equipment is effectively eliminated, to reduce flexibility
Board production technology difficulty and cost, and production efficiency and product qualification rate are greatly improved, to greatly improve
Flexible circuit board runnability, and reduce and drink cost using production.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (10)
1. a kind of non-resistance flexible light band circuit structure based on conductive paste, it is characterised in that: the nothing based on conductive paste
Resistance flexible light band circuit structure includes flexible insulating film matrix, is based on conductive paste circuit, LED lamp bead and insulation white oil layer,
Described in be based on conductive paste circuit at least one, be coated on flexible insulating film outer surface of matrix and mutual with flexible insulating film matrix
Parallelly distribute on, the LED lamp bead is several, is each based on being all provided with several LED lamp beads on conductive paste circuit and electrically connect with LED lamp bead
It connects, and same each LED lamp bead based on conductive paste circuit is along uniformly distributed, the insulation white oil based on conductive paste circuit axis direction
Layer is respectively coated by flexible insulating film matrix, based on conductive paste circuit and LED lamp bead outer surface.
2. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
The flexible insulating film matrix stated is at least one layer of, when flexible insulating film matrix is two layers and two layers or more, each layer flexible insulating film
It is parallel to each other between matrix, and by based on any in conductive paste circuit and insulation white oil layer between adjacent two layers flexible insulating film matrix
It is one or two kinds of simultaneously using being connected with each other, and the flexible insulating film matrix is PI film, any one or two kinds in PET film
It is used in conjunction with.
3. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
When what is stated based on conductive paste circuit is two and two or more, respectively based on mutual mixed connection between conductive paste circuit, and be located at it is flexible absolutely
Any one surface and it is located on two surfaces simultaneously in velum matrix upper surface and lower end surface, and is located at flexible insulating film matrix
Conductive paste circuit thickness is respectively based on no more than 1 millimeter on same surface, and is respectively distributed based on conductive paste circuit upper surface
In the same plane.
4. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
That states is made of based on conductive paste circuit following substances in weight percentage: trimethylol-propane trimethacrylate 10%-
15%, n-vinyl pyrrolidone 15% -20%, tertiary butyl perbenzoate 3% -6%, alkyl phenol polyoxyethylene ether 7% -10%, silver
Copper-clad powder 16% -21%, gas-phase silica 0.05% -1% mix amylalcohol 11% -25%, coupling agent 2% -5%, and surplus is propylene oxide
Acid resin.
5. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
The insulation white oil layer thickness stated is not less than 0.5 millimeter.
6. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
The flexible insulating film matrix front end face and rear end face position stated are all provided at least one copper foil electrode, the copper foil electrode with based on leading
The connection of plasma-based circuit electrical.
7. a kind of preparation process of the non-resistance flexible light band circuit structure based on conductive paste, it is characterised in that: it is described based on
The preparation process of the flexible circuit board structure of conductive paste the following steps are included:
S1, substrate pretreated are cleaned and are dried under dustfree environment to flexible insulating film matrix surface to be processed first
Operation is spare；
S2, circuit design, according to the parameters such as electrical appliance structure, working voltage, resistance on circuit each on circuit board, setting includes base
In the particular number of conductive paste circuit, wire structures, resistance value, LED lamp bead distributed architecture content of parameter respectively be based on conductive paste
Circuit data parameter；
Conductive paste after completing the operation of S1 step, it is spare to be delivered to screen printing apparatus first, and will be flexible by S3, circuits assembly
Insulating film matrix is transported on the operation post of screen printing apparatus, then according to the setting of S2 step based on conductive paste circuit data
Parameter collects circuit data parameter for screen printing apparatus presswork program, finally drives in the presswork program of compilation
Under dynamic, conductive paste is directly subjected to silk-screen printing operation in flexible insulating film matrix surface by screen printing apparatus, is prepared into
To the flexible circuit board blank based on conductive paste；
S4, baking and curing, the flexible circuit board blank based on conductive paste that S2 step is obtained is in 25 DEG C -35 DEG C isoperibols
Under carry out drying operation, make in the flexible circuit board blank based on conductive paste based on conductive paste circuit and flexible insulating film base
The connection of body surface solidification, and when the flexible circuit board blank water content based on conductive paste is not more than 20% -40%, by each LED
Each LED lamp bead is embedded into respectively based in conductive paste circuit and and base by the LED lamp bead distributed architecture that lamp bead is set according to S2 step
It is connected in conductive paste circuit electrical, and after completing LED lamp bead installation, makes flexible circuit board blank and LED based on conductive paste
The lamp bead mechanical drying under 40 DEG C -100 DEG C isoperibols together, and until the flexible circuit board blank based on conductive paste contains
Water is not more than 3%, the flexible circuit board blank based on conductive paste after drying is finally naturally cooled to room temperature with furnace, most
Afterwards the flexible circuit board blank to after cooling based on conductive paste according to circuit structure carry out impression cut operation obtain half at
Flexible circuit board of the product based on conductive paste；
S5, insulation processing, uniformly successively spraying is warm for flexible circuit plate surface of the semi-finished product based on conductive paste obtained to S2 step
The insulation white oil layer that degree is 25 DEG C-50 DEG C, and the insulation white oil layer of spraying operation is every time with a thickness of 0.05-0.2 millimeter, then
Flexible circuit board of the semi-finished product based on conductive paste after completion spraying operation is carried out under 40 DEG C -100 DEG C isoperibols again
Operation is dried, and when the white oil layer water content that insulate is not more than 3%, by the flexible circuit board blank based on conductive paste after drying
Part naturally cools to room temperature with furnace, and flexible circuit board of the finished product based on conductive paste can be obtained.
8. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
In the S2 step and S4 step stated when carrying out drying operation, the surface tension that flexible insulating film matrix surface is born is flexible exhausted
40%-the 90% of velum matrix surface limit tension.
9. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that institute
When operation is dried in spraying operation agent in the S3 step drying operation stated and S4 step, flexible insulating film matrix is respectively positioned on magnetic field side
To with flexible insulating film matrix operation and the consistent magnetostatic field environment in spraying operation direction in, and magnetic field strength be 2000-5000
Gauss.
10. a kind of non-resistance flexible light band circuit structure based on conductive paste according to claim 1, which is characterized in that
For the S2 step when carrying out LED lamp bead distributed architecture, LED lamp bead end positions are full based on conductive paste values of circuit resistances
0.9-1.2 times of sufficient LED lamp bead operation current-limiting resistance value, and when carrying out the adjustment of conductive paste values of circuit resistances, directly pass through tune
Whole conductive paste circuit length carries out the purpose of conductive paste values of circuit resistances adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179431.1A CN109855063A (en) | 2019-03-11 | 2019-03-11 | A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910179431.1A CN109855063A (en) | 2019-03-11 | 2019-03-11 | A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446370A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of high Precision Aluminium substrate and flexible plate surface continuous high-efficient welding procedure |
| CN112963747A (en) * | 2021-03-23 | 2021-06-15 | 深圳Tcl数字技术有限公司 | LED light bar manufacturing method and LED light bar |
| WO2022089269A1 (en) * | 2020-10-26 | 2022-05-05 | 北京梦之墨科技有限公司 | Flexible lamp strip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324571A (en) * | 2005-05-20 | 2006-11-30 | Fujikura Ltd | Wiring board and its manufacturing method |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN105657960A (en) * | 2016-03-26 | 2016-06-08 | 杨华琼 | Three-dimensional ceramic composite circuit board and manufacturing method thereof |
| CN208011370U (en) * | 2017-12-16 | 2018-10-26 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
| CN109360673A (en) * | 2018-10-24 | 2019-02-19 | 焦作市高森建电子科技有限公司 | A kind of wicker copper conductive copper paste and preparation method thereof |
-
2019
- 2019-03-11 CN CN201910179431.1A patent/CN109855063A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324571A (en) * | 2005-05-20 | 2006-11-30 | Fujikura Ltd | Wiring board and its manufacturing method |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN105657960A (en) * | 2016-03-26 | 2016-06-08 | 杨华琼 | Three-dimensional ceramic composite circuit board and manufacturing method thereof |
| CN208011370U (en) * | 2017-12-16 | 2018-10-26 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
| CN109360673A (en) * | 2018-10-24 | 2019-02-19 | 焦作市高森建电子科技有限公司 | A kind of wicker copper conductive copper paste and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446370A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of high Precision Aluminium substrate and flexible plate surface continuous high-efficient welding procedure |
| WO2022089269A1 (en) * | 2020-10-26 | 2022-05-05 | 北京梦之墨科技有限公司 | Flexible lamp strip |
| CN112963747A (en) * | 2021-03-23 | 2021-06-15 | 深圳Tcl数字技术有限公司 | LED light bar manufacturing method and LED light bar |
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Application publication date: 20190607 |