CN109863507B

CN109863507B - Fingerprint identification device and electronic equipment

Info

Publication number: CN109863507B
Application number: CN201980000117.0A
Authority: CN
Inventors: 刘凯
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-01-23
Filing date: 2019-01-23
Publication date: 2021-07-16
Anticipated expiration: 2039-01-23
Also published as: CN109863507A; WO2020150939A1

Abstract

The utility model provides a fingerprint identification device and electronic equipment, the electronic equipment that has the display screen is used to the fingerprint identification device, and the fingerprint identification device includes: a support plate; the fingerprint sensor chip is arranged on the upper surface of the supporting plate; the fixing piece is arranged below the supporting plate; wherein, the mounting is used for installing at electronic equipment's center to make at least one fingerprint sensor chip be located the below of electronic equipment's display screen. In the embodiment of the application, the cost and the complexity of the electronic equipment can be reduced and the maintainability of the electronic equipment is improved through the supporting plate and the fixing piece. Especially, under the scene of aiming at a plurality of fingerprint sensor chips, the installation complexity can be effectively reduced, and the installation efficiency of the fingerprint sensor chips is improved.

Description

Fingerprint identification device and electronic equipment

Technical Field

The present invention relates to the field of electronics, and more particularly, to a fingerprint identification device and an electronic apparatus.

Background

At present, the scheme of fingerprint identification under a screen is to attach an optical or ultrasonic fingerprint identification module to the bottom of an Organic Light-Emitting Diode (OLED) screen, that is, the optical fingerprint identification module and the ultrasonic fingerprint identification module need to be tightly bonded to a Light-Emitting layer at the bottom of the screen.

However, since the OLED screen is very expensive and fragile, the OLED screen is easily damaged when the fingerprint recognition module is directly attached to the OLED screen. In addition, because fingerprint identification module and OLED screen glue together completely, if the fingerprint identification module damage appears, damage the OLED screen very easily when dismantling the fingerprint identification module. Moreover, the attaching process of directly attaching the fingerprint identification module to the OLED screen is also complex.

Due to the above problems, the cost and complexity of the electronic device are greatly increased, and the maintainability is low.

Disclosure of Invention

Provided are a fingerprint identification device and an electronic apparatus, which can reduce the cost and complexity of the electronic apparatus and improve the maintainability. Especially aiming at the scenes of a plurality of fingerprint sensor chips, the cost and the complexity of the electronic equipment can be effectively reduced, and the maintainability is greatly improved.

In a first aspect, a fingerprint identification apparatus is provided, which is applied to an electronic device having a display screen, and includes:

a support plate;

the fingerprint sensor chip is arranged on the upper surface of the supporting plate;

the fixing piece is arranged below the supporting plate;

the fixing piece is used for being installed on a middle frame of the electronic equipment, so that the at least one fingerprint sensor chip is located below a display screen of the electronic equipment; the fingerprint sensor chip is used for receiving fingerprint detection signals returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

In the embodiment of the application, at least one fingerprint sensor chip fixed mounting can pass through behind the backup pad the fixed plate with backup pad fixed mounting on internal parts such as electronic equipment's middle frame, avoided with at least one fingerprint sensor chip directly laminates on electronic equipment's the display screen, can reduce the installation degree of difficulty and the complexity of at least one fingerprint sensor chip to improve maintainability. In addition, aiming at the scene that the at least one fingerprint sensor chip comprises a plurality of chips, the chips can be fixedly installed below the display screen at one time, the installation complexity can be reduced, and the installation efficiency can be improved.

In a second aspect, an electronic device is provided, comprising:

the fingerprint identification device and the display screen in the first aspect or any possible display mode of the first aspect; the fingerprint identification device is arranged below the display screen to realize fingerprint detection under the screen.

The electronic equipment of the embodiment of the application not only can reduce the installation difficulty and complexity of at least one fingerprint sensor chip in the fingerprint identification device, but also can improve the maintainability. In addition, aiming at the scene that the at least one fingerprint sensor chip comprises a plurality of chips, the chips can be fixedly installed below the display screen at one time, the installation complexity can be reduced, and the installation efficiency can be improved.

Drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application may be applied.

Fig. 2 is a schematic side cross-sectional view of the electronic device shown in fig. 1.

Fig. 3 is a schematic block diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a mounting jig of a fingerprint identification device according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a middle frame of an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic side cross-sectional view of an electronic device having the fingerprint identification device shown in fig. 3 according to an embodiment of the present application.

Fig. 7 is a schematic diagram of an electronic device with the fingerprint identification device shown in fig. 3 according to an embodiment of the present application after being detached.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to various electronic devices.

Such as portable or mobile computing devices, e.g., smart phones, laptops, tablets, gaming devices, etc., and other electronic devices, e.g., electronic databases, automobiles, Automated Teller Machines (ATMs), etc. However, the present embodiment is not limited thereto.

The technical scheme of the embodiment of the application can be used for the biological feature recognition technology. The biometric technology includes, but is not limited to, fingerprint recognition, palm print recognition, iris recognition, face recognition, and living body recognition. For convenience of explanation, the fingerprint identification technology is described as an example below.

The technical scheme of the embodiment of the application can be used for the under-screen fingerprint identification technology and the in-screen fingerprint identification technology.

Fingerprint identification technique is installed in the display screen below with fingerprint identification module under the screen to realize carrying out the fingerprint identification operation in the display area of display screen, need not set up the fingerprint collection region in the positive region except that the display area of electronic equipment. Specifically, the fingerprint identification module uses the light that returns from the top surface of electronic equipment's display module to carry out fingerprint response and other response operations. This returned light carries information about an object (e.g., a finger) in contact with the top surface of the display assembly, and the fingerprint recognition module located below the display assembly collects and detects this returned light to perform underscreen fingerprint recognition. Among other things, the design of the fingerprint recognition module may be such that the desired optical imaging is achieved by appropriately configuring the optical elements used to collect and detect the returned light.

Correspondingly, (In-display) fingerprint identification technique means installs inside the display screen fingerprint identification module or partial fingerprint identification module In the screen to realize carrying out the fingerprint identification operation In the display area of display screen, need not set up the fingerprint collection region In the positive region except that the display area of electronic equipment.

Fig. 1 and fig. 2 are schematic diagrams illustrating an electronic device 100 to which an off-screen fingerprint identification technology may be applied, where fig. 1 is a schematic diagram of a front side of the electronic device 100, and fig. 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 100 shown in fig. 1.

As shown in fig. 1 and 2, the electronic device 100 may include a display 120 and a fingerprint identification module 140.

The display 120 may be a self-luminous display employing display units having self-luminous properties as display pixels. For example, the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. In other alternative embodiments, the Display 120 may also be a Liquid Crystal Display (LCD) or other passive light emitting Display, which is not limited in this embodiment of the present application.

In addition, the display screen 120 may also be specifically a touch display screen, which not only can perform image display, but also can detect a touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen 120, or may be partially or wholly integrated within the display screen 120, so as to form the Touch display screen.

Fingerprint identification module 140 can be optical fingerprint identification module, for example optical fingerprint sensor.

In particular, the fingerprint identification module 140 may include a fingerprint sensor chip having an optically sensitive array (hereinafter also referred to as an optical fingerprint sensor). The optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photosensor. Alternatively, the fingerprint identification module 140 may include a Photo detector array (or referred to as a Photo detector array or a Photo sensor array), which includes a plurality of Photo detectors distributed in an array.

As shown in fig. 1, the fingerprint identification module 140 may be disposed in a local area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint identification module 140 is at least partially located in the display area 102 of the display screen 120.

Of course, in other alternative embodiments, the fingerprint identification module 140 may be disposed at other positions, such as the side of the display screen 120 or the edge non-transparent area of the electronic device 100. In this case, the optical signal of at least a part of the display area of the display screen 120 can be guided to the fingerprint identification module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120.

In some embodiments of the present application, the fingerprint identification module 140 may only include one fingerprint sensor chip, and the area of the fingerprint collection area 130 of the fingerprint identification module 140 is small and the position is fixed at this time, so the user needs to press the finger to a specific position of the fingerprint collection area 130 when performing fingerprint input, otherwise the fingerprint identification module 140 may not collect a fingerprint image and cause poor user experience.

In other embodiments of the present application, the fingerprint identification module 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips can be arranged side by side in a splicing mode below the display screen 120, and sensing areas of the plurality of fingerprint sensor chips jointly form the fingerprint collecting area 130 of the fingerprint identification module 140. That is to say, the fingerprint collection area 130 of the fingerprint identification module 140 may include a plurality of sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, respectively, so as to extend the fingerprint collection area 130 of the optical fingerprint module 130 to the main area of the lower half of the display screen, that is, to the area that the finger presses conventionally, thereby realizing the blind-touch type fingerprint input operation. Alternatively, when the number of fingerprint sensor chips is sufficient, the fingerprint detection area 130 may also be extended to half or even the entire display area, thereby enabling half-screen or full-screen fingerprint detection.

It should be understood that the specific form of the fingerprint sensor chips is not limited in the embodiments of the present application.

For example, the plurality of fingerprint sensor chips may be individually packaged fingerprint sensor chips, or may be a plurality of chips (Die) packaged in the same chip package.

Also for example, the plurality of fingerprint sensor chips may be fabricated on different regions of the same chip (Die) by a semiconductor process.

As shown in fig. 2, the optical sensing array of the fingerprint identification module 140 is located in an area or an optical sensing range corresponding to the fingerprint collection area 130 of the fingerprint identification module 140. The fingerprint collection area 130 of the fingerprint identification module 140 may be equal to or different from an area or a light sensing range of an area where the optical sensing array of the fingerprint identification module 140 is located, which is not specifically limited in the embodiment of the present application.

For example, through the light path design of light collimation, fingerprint identification module 140's fingerprint collection area 130 can be designed into with fingerprint identification module 140's the area of the sensing array is unanimous basically.

For another example, the area of the fingerprint collection area 130 of the fingerprint identification module 140 may be larger than the area of the sensing array of the fingerprint identification module 140 by the light path design of the converging light or the light path design of the reflecting light.

The following is an exemplary description of the optical path design of the fingerprint identification module 140.

Use fingerprint identification module 140's light path design to adopt the optical Collimator of the through-hole array that has high aspect ratio as an example, optical Collimator can specifically be at the Collimator (collimater) layer that semiconductor silicon chip made formed, and it has a plurality of collimation units or micropore, the collimation unit can specifically be the aperture, in the reverberation of following the finger reflection back, perpendicular incidence the light of collimation unit can pass and be received by the fingerprint sensor chip of its below, and the too big light of incident angle is in the inside multiple reflection of collimation unit is attenuated, therefore every fingerprint sensor chip can only receive the reverberation of its fingerprint line reflection directly over basically, can effectively improve image resolution, and then improve the fingerprint identification effect.

Further, when fingerprint identification module 140 includes a plurality of fingerprint sensor chips, can configure a collimation unit for an optical sensing unit in the optical sensing array of every fingerprint sensor chip to the laminating sets up the top at its optical sensing unit that corresponds. Of course, the plurality of optical sensing units may also share one collimating unit, i.e. the one collimating unit has a sufficiently large aperture to cover the plurality of optical sensing units. Because a collimation unit can correspond a plurality of optical sensing units, the spatial period of display screen 120 and the spatial period's of fingerprint sensor chip correspondence has been destroyed, therefore, even the spatial structure of the luminous display array of display screen 120 and the spatial structure of the optical sensing array of fingerprint sensor chip are similar, also can effectively avoid fingerprint identification module 140 to utilize the optical signal through display screen 120 to carry out fingerprint imaging and generate moire fringe, effectively improved fingerprint identification module 140's fingerprint identification effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design of the optical Lens is adopted, the optical Lens may include an optical Lens (Lens) layer, which has one or more Lens units, such as a Lens group composed of one or more aspheric lenses, and is used for converging the reflected light reflected from the finger to an induction array of a fingerprint sensor chip below the Lens unit, so that the induction array may perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger. The optical lens layer may further have a pinhole formed in an optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to enlarge a field of view of the fingerprint identification module 140, so as to improve a fingerprint imaging effect of the fingerprint identification module 140.

Further, when fingerprint identification module 140 includes a plurality of fingerprint sensor chips, can carry out fingerprint formation of image for an optical lens of each fingerprint sensor chip configuration, or for an optical lens of a plurality of fingerprint sensor chip configurations to realize that light assembles and fingerprint formation of image. Even when one fingerprint sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), two or more optical lenses can be configured for the fingerprint sensor chip to cooperate with the two sensing arrays or the multiple sensing arrays to perform optical imaging, so as to reduce the imaging distance and enhance the imaging effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design employs a Micro-Lens (Micro-Lens) layer, the Micro-Lens layer may have a Micro-Lens array formed by a plurality of Micro-lenses, which may be formed above the sensing array of the fingerprint sensor chip through a semiconductor growth process or other processes, and each Micro-Lens may correspond to one of the sensing units of the sensing array. Other optical film layers such as a dielectric layer or a passivation layer may be further formed between the microlens layer and the sensing units, and more particularly, a light blocking layer having micro holes may be further included between the microlens layer and the sensing units, wherein the micro holes are formed between the corresponding microlenses and the sensing units, and the light blocking layer may block optical interference between adjacent microlenses and the sensing units, and allow light to be converged into the micro holes through the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes, so as to perform optical fingerprint imaging.

It should be understood that several implementations of the above-mentioned optical path guiding structure may be used alone or in combination, for example, a microlens layer may be further disposed below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific lamination structure or optical path thereof may need to be adjusted according to actual needs.

Fingerprint identification module 140 may be configured to collect fingerprint information (e.g., fingerprint image information) of a user.

Taking the example that the display screen 120 is an OLED display screen, the display screen 120 may be a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. The fingerprint identification module 140 may utilize the display unit (i.e., the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (collectively referred to as pressing in this application for convenience of description) the fingerprint collection area 130, the display 120 emits a beam of light to the finger above the fingerprint collection area 130, and the beam of light is reflected on the surface of the finger to form reflected light or scattered light after being scattered by the inside of the finger, and the reflected light and the scattered light are collectively referred to as reflected light in the related patent application for convenience of description. Because ridges (ridges) and valleys (vally) of the fingerprint have different light reflection capabilities, reflected light from the ridges and reflected light from the valleys have different light intensities, and the reflected light is received by the fingerprint sensor chip in the fingerprint identification module 140 and converted into corresponding electric signals, namely fingerprint detection signals, after passing through the display screen 120; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the electronic device 100.

Therefore, when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, the user only needs to press a finger on the fingerprint acquisition area 130 of the display screen 120, so that the input operation of the fingerprint feature can be realized. Since the collection of the fingerprint features can be implemented inside the display area 102 of the display screen 120, the electronic device 100 with the above structure does not need a special reserved space on the front surface thereof to set the fingerprint keys (such as Home keys), and thus a full-screen scheme can be adopted. Thus, the display area 102 of the display screen 120 may extend substantially across the entire front face of the electronic device 100.

Of course, in other alternatives, the fingerprint identification module 140 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection and identification. In this case, the fingerprint identification module 140 may be suitable for not only self-luminous display screens such as OLED display screens, but also non-self-luminous display screens such as liquid crystal display screens or other passive luminous display screens.

Taking an application to a liquid crystal display screen with a backlight module and a liquid crystal panel as an example, to support the underscreen fingerprint detection of the liquid crystal display screen, the optical fingerprint system of the electronic device 100 may further include an excitation light source for optical fingerprint detection, where the excitation light source may specifically be an infrared light source or a light source of non-visible light with a specific wavelength, and may be disposed below the backlight module of the liquid crystal display screen or in an edge area below a protective cover plate of the electronic device 100, and the fingerprint identification module 140 may be disposed below the edge area of the liquid crystal panel or the protective cover plate and guided through a light path so that the fingerprint detection light may reach the fingerprint identification module 140; alternatively, the fingerprint recognition module 140 may be disposed under the backlight module, and the backlight module is configured to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by perforating or performing other optical designs on the diffusion sheet, the brightness enhancement sheet, the reflection sheet, and other film layers. When adopting fingerprint identification module 140 adopts built-in light source or external light source to provide the light signal that is used for carrying out fingerprint detection, its detection principle can be the same.

As shown in fig. 1, the electronic device 100 may further include a protective cover 110.

The cover plate 110 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and a protective layer may be further disposed on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the pressing of the display screen 120 by the finger may actually mean that the finger presses the cover plate 110 above the display screen 120 or a surface of a protective layer covering the cover plate 110.

As shown in fig. 1, a Circuit board 150, such as a Flexible Printed Circuit (FPC), may be disposed below the fingerprint identification module 140.

The fingerprint identification module 140 may be soldered to the circuit board 150 via the solder pads, and may be electrically interconnected and signal-transmitted with other peripheral circuits or other components of the electronic device 100 via the circuit board 150. For example, the fingerprint identification module 140 may receive a control signal of a processing unit of the electronic device 100 through the circuit board 150, and may further output a fingerprint detection signal from the fingerprint identification module 140 to the processing unit or the control unit of the electronic device 100 through the circuit board 150.

In some embodiments, the fingerprint recognition device 140 may be fixedly attached directly to the lower surface of the display screen 120.

However, since the display screen 120 is expensive and fragile, the display screen 120 is easily damaged when the fingerprint recognition module 140 is directly attached to the display screen 120.

In addition, because fingerprint identification module 140 and display screen 120 stick together completely, if fingerprint identification module 140 damages, damage display screen 120 very easily when dismantling fingerprint identification module 140.

Moreover, the attaching process of directly attaching the fingerprint identification module 140 to the display screen 120 is also complicated.

Due to the above problems, the cost and complexity of the electronic apparatus 100 are greatly increased, and the maintainability is low.

The application provides a fingerprint identification device, which can reduce the cost and complexity of electronic equipment 100 and improve the maintainability.

The fingerprint identification device 200 and the electronic device 300 according to the embodiment of the present application will be described in detail with reference to fig. 3 to 7. It should be noted that, for convenience of description, the same reference numerals are used to designate the same components in the embodiments of the present application, and detailed description of the same components is omitted in different embodiments for the sake of brevity.

Fig. 3 is a schematic block diagram of a fingerprint identification device 200 according to an embodiment of the present application.

Alternatively, as shown in fig. 3, the fingerprint recognition device 200 may include at least one fingerprint sensor chip 210 and a supporting plate 230, and the at least one fingerprint sensor chip 210 may be disposed on an upper surface of the supporting plate 230. Specifically, as shown in fig. 3, the at least one fingerprint sensor chip 210 may include 4 fingerprint sensor chips 210, and the 4 fingerprint sensor chips 210 may be disposed side by side on the upper surface of the supporting plate 230 to be spliced into an optical fingerprint sensor chip 210 assembly.

Specifically, each fingerprint sensor chip 210 may be attached to the upper surface of the supporting plate 230 by a chip fixing adhesive 211. Alternatively, the die attach adhesive 211 may be a solid adhesive or a liquid adhesive. For example, the chip fixing adhesive 211 may be a double-sided adhesive tape or glue.

Further, the fingerprint recognition device 200 may further include a fixing member. The fixing may be a rigid stiffening plate. The shape of the fixing piece can be rectangular or elliptic and other regular shapes. For example, the fixing member may be rectangular.

The fixing member is disposed below the supporting plate 230, and is configured to fixedly mount the supporting plate 230 on an internal component such as a middle frame of an electronic device, and enable the at least one fingerprint sensor chip 210 to be located below a display screen of the electronic device; the at least one fingerprint sensor chip 210 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen, wherein the fingerprint detection signal is used to detect fingerprint information of the finger.

Through in the embodiment of this application the mounting has avoided directly will at least one fingerprint identification chip 210 installs on electronic equipment's the display screen, can reduce at least one fingerprint sensor chip 210's the installation degree of difficulty and complexity to inside parts such as the center with backup pad 230 fixed mounting in electronic equipment's, but improvement maintainability. In addition, for the plurality of fingerprint sensor chips 210, the plurality of fingerprint sensor chips 210 can be fixedly mounted below the display screen at one time through the supporting plate 230, so that the mounting complexity can be reduced, and the mounting efficiency can be improved.

It should be understood that the fingerprint sensor chip 210 shown in fig. 3 may be the fingerprint sensor chip 210 in the fingerprint identification device 140 shown in fig. 1 and 2, and the related functional and structural descriptions thereof may refer to the related descriptions, which are not repeated herein for brevity.

Optionally, as shown in fig. 3, the fingerprint recognition device 200 may further include a circuit board 220.

As shown in fig. 3, at least a portion of the circuit board 220 may be attached to the upper surface of the supporting plate 230 by a circuit board fixing adhesive 221. Alternatively, the circuit board fixing glue 221 may be a solid glue or a liquid glue. For example, the circuit board fixing adhesive 221 may be a double-sided adhesive tape or glue.

Further, at least a portion of the circuit board 200 may be attached to an edge position of the upper surface of the support plate 230, and the circuit board 220 is connected to the at least one fingerprint sensor chip 210. For example, at least a portion of the circuit board 220 is connected to an edge of the upper surface of the supporting plate 230 near the long side, so as to increase the contact area between the circuit board 220 and the supporting plate 230, thereby improving the connection reliability.

Referring to fig. 3, the upper surface of the supporting plate 230 is rectangular, 4 fingerprint sensor chips 210 are arranged in a row in a region close to a first long side of the supporting plate 230 along a long side direction of the upper surface of the supporting plate 230, and the circuit board 220 may be fixedly disposed in a region close to a second long side of the supporting plate 230. Wherein the first long side and the second long side are two long sides of the supporting plate 230, respectively.

Of course, in other alternative embodiments, the 4 fingerprint sensor chips 210 may also be arranged side by side along the short side direction of the upper surface of the supporting plate 230, and at least a portion of the circuit board 220 may be connected to the edge position of the upper surface of the supporting plate 230 near the long side or near the short side.

It should be understood that the circuit board 220 shown in fig. 3 may be the circuit board 150 shown in fig. 1 and 2, and the related functional and structural descriptions thereof may refer to the related descriptions, which are not repeated herein for brevity.

Alternatively, as shown in fig. 3, the circuit board 220 may be provided with at least one bending groove 221 at an end near the plurality of optical fingerprint sensor chips 210.

Further, one bending groove 221 of the at least one bending groove 221 corresponds to a spacing region between a pair of adjacent chips of the plurality of optical fingerprint sensor chips 210. Therefore, when the supporting plate 230 is mounted on a part of an electronic device, the circuit board 230 can be prevented from being bent to affect the performance, or even be damaged. The bending groove is U-shaped, so that the circuit board is prevented from being broken at the bending groove. Of course, in other alternative embodiments, the at least one bending groove 221 may have other shapes or be disposed at other positions, which is not limited in the embodiments of the present application.

Optionally, as shown in fig. 3, the fingerprint identification device 200 may further include an image processor 250, and the image processor 250 is disposed on the circuit board 220.

The image processor 250 may be embodied as a Micro Processing Unit (MCU), and the image processor 250 is configured to receive a fingerprint detection signal (e.g., a fingerprint image) from the at least one sensor through the circuit board 220 and perform fingerprint identification based on the fingerprint detection signal. Specifically, the at least one fingerprint sensor chip 210 first receives reflected light reflected from a user's finger and performs imaging based on the received light signal to generate a fingerprint image; then, the fingerprint image is sent to the image processor 250 through the circuit board 220, so that the image processor 250 performs image processing and obtains a fingerprint signal; and finally, carrying out fingerprint identification on the fingerprint signal through an algorithm.

It should be appreciated that in alternative embodiments, the image processor 250 may be provided separately, in which case the fingerprint sensor chip 210 may be connected to the image processor 250 via the circuit board 220.

Optionally, as shown in fig. 3, the fingerprint identification device 200 may further include at least one capacitor 240, and the at least one capacitor 240 is disposed on the circuit board 220 for optimizing the fingerprint detection signal collected by the at least one fingerprint sensor chip 210. For example, the at least one capacitor 240 is used for filtering the fingerprint detection signal collected by the at least one fingerprint sensor chip 210. Wherein each fingerprint sensor chip 210 of the at least one fingerprint sensor chip 210 may correspond to one or more capacitors 240.

One fingerprint recognition chip 210 of the at least one fingerprint sensor chip 210 may be provided with one or more capacitors 240, respectively.

Alternatively, as shown in fig. 3, the support plate 230 may be provided with at least one first positioning hole. The fixing piece is provided with at least one second positioning hole corresponding to the at least one first positioning hole. Thus, the support plate 230 may be fixedly disposed on the upper surface of the fixing member by aligning the at least one first positioning hole and the at least one second positioning hole thereof.

When the supporting plate 230 is provided with a plurality of optical fingerprint sensor chips 210 along the long side direction of the upper surface of the supporting plate 230, the supporting plate 230 may be provided with one first positioning hole at the interval region of each pair of adjacent optical fingerprint sensor chips 210. For example, the supporting plate 230 is provided with one first positioning hole at a middle position of the spacing region of each pair of adjacent optical fingerprint sensor chips 210.

Referring to fig. 3, the upper surface of the supporting plate 230 is rectangular, 4 fingerprint sensor chips 210 are disposed on the upper surface of the supporting plate 230, and a first positioning hole 231 is disposed on the supporting plate 230 at a middle position of a spacing area between each pair of adjacent fingerprint sensor chips 210 in the 4 fingerprint sensor chips 210.

Of course, the arrangement of the supporting plate 230 with one first positioning hole 231 in the spacing region of each pair of adjacent optical fingerprint sensor chips 210 is only an example of the present application and should not be construed as a limitation to the present application. For example, in other alternative embodiments, the supporting plate 230 may be provided with a positioning hole in a spacing region of at least a specific pair of adjacent chips among the plurality of chips. For example, the supporting plate 230 is provided with one positioning hole only in a spaced area of a pair of adjacent chips at the center among the plurality of chips.

Optionally, as shown in fig. 3, the fingerprint recognition device 200 may further include at least one optical filter 270. The at least one optical filter 270 may be disposed above the at least one fingerprint sensor chip 210. Specifically, as shown in fig. 3, a filter 270 may be disposed above each fingerprint sensor chip 210.

Of course, in other alternative embodiments, the at least one optical filter 270 and the at least one fingerprint sensor chip 210 may not be in a one-to-one correspondence. For example, only one filter 270 may be disposed above the at least one fingerprint sensor chip 210, and the area of the one filter 270 is large enough to completely cover the at least one fingerprint sensor chip 210.

The optical filter 270 may include one or more optical filters, which may be configured, for example, as a band pass filter to allow transmission of light emitted by the OLED pixels while blocking other light components such as infrared light in sunlight. Such optical filtering may effectively reduce background light caused by sunlight when the fingerprint recognition device 200 is used outdoors under a screen. The one or more optical filters may be implemented, for example, as optical filter coatings formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the filter 270 may be fabricated on the surface of any optical component or along the optical path to the reflected light formed via finger reflection to the at least one fingerprint sensor chip 210.

In the present embodiment, the optical filter 270 is used to reduce undesired ambient light in the sensing of the fingerprint, so as to improve the optical sensing of the received light by the at least one fingerprint sensor chip 210. The filter 270 may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and portions of red light, etc. For example, a human finger absorbs most of the energy of light with wavelengths below-580 nm, and if one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, the effect of ambient light on the optical detection in fingerprint sensing can be greatly reduced.

In addition, the light inlet surface of the optical filter 270 may further be provided with an optical inorganic coating or an organic blackened coating, so that the reflectivity of the light inlet surface of the optical filter 270 is lower than a first threshold value, for example, 1%, thereby ensuring that the at least one fingerprint sensor chip 210 can receive enough light, and further improving the fingerprint identification effect.

The optical filter 270 and the at least one fingerprint sensor chip 210 may be fixed by dispensing in a non-photosensitive area of the at least one fingerprint sensor chip 210, and a gap exists between the optical filter 270 and the photosensitive area of the at least one fingerprint sensor chip 210; or the lower surface of the optical filter 270 is fixed on the upper surface of the at least one fingerprint sensor chip 210 by glue having a refractive index lower than a preset refractive index. For example, the lower surface of the optical filter 270 is fixed to the upper surface of the at least one fingerprint sensor chip 210 by glue having a refractive index lower than 1.3.

It should be understood that fig. 3 is only an example of the present application and should not be construed as limiting the present application.

For example, in other alternative embodiments, the fingerprint recognition device 200 may include only fewer than 4 or more than 4 fingerprint sensor chips 210.

Fig. 4 is a schematic structural diagram of a mounting jig 390 of the fingerprint recognition device 200 according to the embodiment of the present application. As shown in fig. 4, the upper surface of the mounting fixture 390 may include at least one positioning post 391, and the at least one first positioning hole and the at least one second positioning hole are disposed corresponding to the at least one positioning post 391.

In a specific installation process, first, the supporting plate 230 can be fixedly placed on the upper surface of the installation jig 390 through the at least one first positioning hole, and then, the fixing member can be fixedly installed on the upper surface of the supporting plate 230 through the at least one second positioning hole. Specifically, the supporting plate 230 may be attached to the upper surface of the fixing member by a reinforcing fixing adhesive. Optionally, the reinforcing fixing glue may be a solid glue or a liquid glue. For example, the reinforcing fixing glue can be double-sided glue or glue.

The fingerprint recognition device 200 can be mounted on the middle frame of the electronic device through the fixing member.

Fig. 5 is a schematic structural diagram of a middle block 380 of the embodiment of the present application.

As shown in fig. 5, the middle frame 330 is provided with an opening 331, a first side surface of the opening 331 and a second side surface opposite to the first side surface are respectively provided with a first groove 332 and a second groove 333, and two ends of the fixing member are respectively fixed in the first groove 332 and the second groove 333. For example, both ends of the fixing member may be fixedly installed in the first and

second grooves

332 and 333, respectively, by bending the fixing member. Alternatively, the first groove 332 and the second groove 333 may be formed on the side walls of both side edges of the middle frame 330, respectively, to fix the fixing member to the side walls of the middle frame 330.

Further, the first groove 332 and the second groove 333 are respectively provided with a first notch 334 and a second notch 335 at one end of the groove wall close to the upper surface of the middle frame 330, and the first notch 334 and the second notch 335 are symmetrically arranged. That is, the first notch 334 and the second notch 335 form an installation opening, and the installation opening, the first groove 332, and the second groove 333 form a guide groove of the fixing member, so that the fixing member can be inserted into the middle frame 330 through the guide groove. According to the embodiment of the application, the installation difficulty of the fixing piece can be effectively reduced through the first notch 334 and the second notch 335.

Further, inner side surfaces of groove walls of the first groove 332 and the second groove 333 close to the lower surface of the middle frame 330 are respectively provided with a first slope and a second slope with respect to the lower surface of the middle frame 330, and the first slope is equal to the second slope.

A distance between the third side and the fourth side of the opening 331 is less than a preset threshold, the distance between the third side and the fourth side of the opening 331 may be a width of the opening 331, and the third side and the fourth side may be perpendicular to the first side and the second side. For example, the width of the opening 331 may be equal to the width of the fixing member, or the width of the opening 331 may be slightly larger than the width of the fixing member. Thus, the middle frame 330 may be formed with a structure that restricts the movement of the fixing member in the width direction. For example, as shown in fig. 5, when the fixing member is mounted to the middle frame 330, the third side 336 and the fourth side 336 of the middle frame can limit the movement of the fixing member in the width direction.

The embodiment of the present application further provides an electronic device that may include the fingerprint identification device 200. Fig. 6 is a schematic side cross-sectional view of an electronic device 300 having the fingerprint identification device 200 shown in fig. 3 according to an embodiment of the present application. Fig. 7 is a disassembled schematic view of an electronic device 300 having the fingerprint recognition device 200 shown in fig. 3 according to an embodiment of the present application.

As shown in fig. 6 and 7, the electronic device 300 may include the fingerprint recognition device 200 and the display screen as described in the various embodiments of the present application. The fingerprint recognition device 200 may be disposed below the display screen, and configured to receive the light signal reflected by the finger and passing through the display screen for fingerprint detection.

Specifically, the supporting plate 230 of the fingerprint recognition device 200 can be fixed to an internal component of the electronic device 300, such as the middle frame 330, by a fixing member 280, so that the fingerprint recognition device 200 can be fixed below the display screen of the electronic device 300.

For example, the supporting plate 230 of the fingerprint identification device 200 may be disposed below the display screen of the electronic device 300 through the fixing member 280, and particularly may be disposed below a middle area of the display screen, so as to conform to the usage habit of the user and facilitate the user to hold.

As shown in fig. 6 and 7, the display screen may include a display component 310 and a light shielding layer 320 of the display component 310. Optionally, the light shielding layer 320 may be provided with a window 321, the fingerprint identification device 200 receives an optical signal formed after reflection of a human finger, which is sent by the display component 310, through the window 321, and the optical signal is used for fingerprint identification.

In the embodiment of the present application, the fingerprint identification device 200 of the electronic device 300 and the display screen of the electronic device 300 are separately designed, but the relative distance between the fingerprint identification device 200 and the display screen of the electronic device is not limited in the embodiment of the present application.

Specifically, the fingerprint recognition device 200 may contact the lower surface of the display member 310, or a gap may exist between the upper surface of the fingerprint recognition device 200 and the lower surface of the display member 310. For example, the distance between the upper surface of the fingerprint recognition device 200 and the lower surface of the display screen may be less than or equal to a certain threshold, such as 600 μm, to ensure that sufficient light signals are incident on the photosensitive area of the at least one fingerprint sensor chip 210.

In the embodiment of the present application, if the lower surface of the fingerprint identification device 200 and the display screen is not in contact, a fixed gap is reserved between the two, the gap may be an air gap (air gap) not filled with any auxiliary material, which can ensure that the fingerprint identification device 200 does not contact the lower surface of the display screen when the display screen is pressed or the electronic device falls or collides, and the stability and performance of the fingerprint identification device 200 are not affected.

It should be understood that the display assembly 310 shown in fig. 6 and 7 can refer to the description of the display screen 120, and the description thereof is omitted herein for brevity.

It should be understood that the light shielding layer 320 may also be used as a heat dissipation layer and/or a buffer layer, wherein the light shielding layer is used to shield other regions except the fingerprint detection region, so as to prevent the light signals in the other regions from entering the fingerprint sensor chip 210 and affecting the fingerprint detection effect. When the light shielding layer 320 is used as a heat dissipation layer, the light shielding layer 320 can also be used for dissipating heat generated by a light emitting unit in the display screen, and when the light shielding layer 320 is used as a buffer layer, the light shielding layer can be used for buffering extrusion or collision of electronic equipment so as to reduce damage to the display screen.

Optionally, as shown in fig. 6, the fingerprint identification device 200 may further include a gold wire 260, and the circuit board 220 is connected to the at least one fingerprint sensor chip 210 through the gold wire 260.

Specifically, the gold wire 260 is used to implement communication between the at least one fingerprint sensor chip 210 and the circuit board 220, and to implement electrical interconnection and signal transmission with other peripheral circuits or other elements in the electronic device shown in fig. 1 or fig. 2 through the circuit board 220. For example, the at least one fingerprint sensor chip 210 may receive a control signal of a processing unit of an electronic device through the gold wire 260, and may further output a fingerprint detection signal (e.g., a fingerprint image) to an image processor of the fingerprint recognition device 200 or a processor of the electronic device 300 through the gold wire 260.

Further, the height of the gold wire 260 and the height of the sealing compound of the gold wire 260 may be respectively lower than the height of the optical filter 270, so as to reduce the thickness of the fingerprint identification device 200 and reduce the installation difficulty thereof.

Optionally, as shown in fig. 6 and 7, the electronic device 300 may further include a middle frame 330, where the middle frame 330 is used for supporting the display screen. Specifically, the middle frame 330 may be a frame of the electronic device 300 disposed between the display screen and the battery for carrying various internal components, including but not limited to a main board, a camera, a cable, various sensors, a microphone, an earphone, and other components.

It is understood that the embodiment of the present application is described only by way of example of fixing the fingerprint identification device 200 to the middle frame 330, and in other alternative embodiments, the fingerprint identification device 200 may be fixedly connected to other structures of the electronic device 300 having a supporting function to mount the fingerprint identification device 200 below the display screen. I.e. as long as it is ensured that the fingerprint recognition device 200 can be fixedly arranged below the display screen in a separated manner.

For example, the fingerprint recognition device 200 may be fixed to a structure or a device having a supporting function, such as a rear cover, a main board, and a battery of an electronic apparatus, and further may be fixedly disposed below the display screen.

Alternatively, as shown in fig. 6 and 7, the fixing member 280 may be fixedly installed in a groove of the middle frame 330. For example, the fixing member 280 may be inserted into the first groove 332 of the middle frame 330.

Optionally, as shown in fig. 6 and 7, the electronic device 300 may further include at least one foam 340, and the at least one foam 340 is disposed between the supporting plate 230 and the middle frame 330. Some or all of the at least one foam is double-sided adhesive foam to improve the connection reliability between the support plate 230 and the middle frame 330.

Further, the relationship between the at least one foam 340 and the at least one fingerprint sensor chip 210 in the fingerprint identification device is a one-to-one correspondence relationship.

Referring to fig. 7, when the fingerprint recognition device 200 includes 4 fingerprint sensor chips 210, the electronic device 300 may include 4 pieces of foam corresponding to the 4 fingerprint sensor chips 210, wherein the size of the lower surface of each fingerprint sensor chip 210 is the same as the size of the upper surface of the foam 340 corresponding to the fingerprint sensor chip.

Further, the thickness of each of the at least one foam 340 is related to the distance between the middle frame 330 and the display screen and the distance between the at least one fingerprint sensor chip 210 of the fingerprint recognition device 200 and the display screen (e.g., the display assembly 310). The thickness of each foam 340 of the at least one foam 340 is inversely proportional to the distance between the middle frame 330 and the display screen and the distance between the at least one fingerprint sensor chip 210 of the fingerprint recognition device 200 and the display screen, respectively. For example, each of the at least one foam 340 has a thickness such that a distance between an upper surface of the at least one fingerprint sensor chip 210 and a lower surface of the display screen is less than or equal to 600 μm.

It should be understood that fig. 6 and 7 are only one example of the present application and should not be construed as limiting the embodiments of the present application.

For example, in other alternative embodiments, the fingerprint recognition device 200 may be fixedly mounted to other components of the electronic device 300.

It should also be understood that the material, shape, size and other parameters of the supporting plate 230 are not specifically limited in the embodiments of the present application.

For example, the supporting plate 230 has a thickness ranging from 0.075mm to 0.30mm to control the thickness of the fingerprint recognition device 200.

For another example, when the supporting plate 230 is a flexible reinforcing plate, the flexible reinforcing plate includes, but is not limited to, a polyimide reinforcing plate, so as to improve the heat dissipation performance of the fingerprint recognition device 200.

For another example, the surface roughness (Ra) of the supporting plate 230 is greater than a certain threshold, such as 0.25um, to improve the imaging effect; specifically, when the surface roughness of the supporting plate 230 is greater than a certain threshold, the surface thereof can scatter the optical signal, which can effectively reduce the optical signal emitted by the display screen and reflected inside the fingerprint identification device 200, thereby avoiding the influence of the optical reflection on the imaging; in addition, when the surface roughness of the supporting plate 230 is greater than a certain threshold value, the reliability of the connection between the supporting plate 230 and other components may be increased. Such as the reliability of the connection between the support plate 230 and the at least one sensor and the circuit board 220 and the reliability of the connection between the support plate 230 and the member for fixing the support plate 230.

For another example, the color of the supporting plate 230 is dark to increase the light absorption effect of the supporting plate 230, so as to prevent the light reflected upward by the supporting plate 230 from interfering with the light received by the at least one fingerprint sensor chip 210. Such as black or dark brown.

For another example, the lower surface of the supporting plate 230 is square or rectangular, so that the supporting plate 230 can be installed inside the electronic device 300.

It should also be understood that the embodiment of the present application also does not limit the parameters, such as the type and the shape of the circuit board 220, and optionally, the shape of the circuit board may be an irregular shape or a regular shape. For example rectangular or square.

For example, as shown in fig. 3, the circuit board 220 is T-shaped.

For another example, in other alternative embodiments, the circuit board 220 may also be shaped as a T-shaped deformed structure.

It should also be understood that the material, shape, size and other parameters of the fixing member 280 are not specifically limited in the embodiments of the present application.

For example, the thickness of the fixing member 280 ranges from 0.15mm to 0.30mm to control the thickness of the fingerprint recognition device 200 and to ensure a certain strength of the fixing member 280.

For another example, when the fixing member 280 is a rigid reinforcing plate, the rigid reinforcing plate includes, but is not limited to, a stainless steel reinforcing plate to enhance the strength of the fixing member 280.

For another example, the surface roughness (Ra) of the fixing member 280 is greater than a certain threshold, such as 0.25um, to improve the imaging effect; specifically, when the surface roughness of the fixing member 280 is greater than a certain threshold, the surface thereof can scatter the optical signal, which can effectively reduce the optical signal emitted by the display screen and reflected inside the fingerprint identification device 200, thereby preventing the optical reflection from affecting the imaging; in addition, when the surface roughness of the fixing member 280 is greater than a certain threshold value, the reliability of the connection between the fixing member 280 and other components may be increased. Such as the reliability of the connection between the fixing member 280 and the components of the supporting plate 230.

For another example, the fixing member 280 is dark in color to increase the light absorption effect of the fixing member 280, so as to prevent the light reflected upward by the fixing member 280 from interfering with the light received by the at least one fingerprint sensor chip 210. Such as black or dark brown.

For another example, the lower surface of the fixing member 280 is square or rectangular, so that the fixing member 280 can be conveniently installed inside the electronic device 300.

It should be understood that fig. 6 is only an example of the present application and should not be construed as limiting the embodiments of the present application. For example, in other alternative embodiments, the electronic device 300 may include only one piece of foam provided with a through hole corresponding to the at least one positioning hole on the supporting plate 230.

It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.

It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solutions may be implemented in a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A fingerprint identification device is applied to an electronic device with a display screen, and is characterized by comprising:

a support plate;

a plurality of fingerprint sensor chips disposed on an upper surface of the support plate;

the circuit board is at least partially arranged at the edge position of the upper surface of the supporting plate and is connected with the plurality of fingerprint sensor chips;

the fixing piece is arranged below the supporting plate;

the middle frame of the electronic equipment is provided with an opening, a first side face of the opening and a second side face opposite to the first side face are respectively provided with a first groove and a second groove, two ends of the fixing piece are respectively used for being installed in the first groove and the second groove of the middle frame of the electronic equipment so that the supporting plate and the plurality of fingerprint sensor chips are fixed with the middle frame, and the plurality of fingerprint sensor chips are located below a display screen of the electronic equipment and above the middle frame; the fingerprint sensor chips are used for receiving fingerprint detection signals returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

2. The fingerprint recognition device of claim 1, wherein at least a portion of the circuit board is disposed on an edge of the upper surface of the support plate near the long side.

3. The fingerprint recognition device according to claim 1 or 2, wherein the plurality of fingerprint sensor chips comprise a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged on the upper surface of the support plate side by side to be spliced into an optical fingerprint sensor chip assembly.

4. The fingerprint recognition device according to claim 1 or 2, wherein the support plate is provided with at least one first positioning hole, and the fixing member is provided with at least one second positioning hole corresponding to the at least one positioning hole.

5. The fingerprint recognition device according to claim 4, wherein the plurality of fingerprint sensor chips comprises a plurality of optical fingerprint sensor chips arranged along a long side direction of an upper surface of the support plate, and the support plate is provided with one first positioning hole at a spacing region of each pair of adjacent optical fingerprint sensor chips.

6. The fingerprint recognition device according to claim 1 or 2, wherein the plurality of fingerprint sensor chips comprises a plurality of optical fingerprint sensor chips, and the circuit board is provided with at least one bending groove at an end near the plurality of optical fingerprint sensor chips, and one bending groove of the at least one bending groove corresponds to a spacing region between a pair of adjacent chips of the plurality of optical fingerprint sensor chips.

7. The fingerprint recognition device of claim 6, wherein the bending groove is U-shaped.

8. The fingerprint recognition device according to claim 1 or 2, further comprising:

and the optical filter is arranged above the plurality of fingerprint sensor chips.

9. The fingerprint identification device of claim 8, wherein the light inlet surface of the optical filter is provided with an optical inorganic coating or an organic black coating.

10. The fingerprint identification device according to claim 8, wherein the optical filter and the plurality of fingerprint sensor chips are fixed by dispensing in non-photosensitive areas of the plurality of fingerprint sensor chips, and a gap exists between the optical filter and the photosensitive areas of the plurality of fingerprint sensor chips; or the lower surface of the optical filter is fixed on the upper surfaces of the fingerprint sensor chips through glue with the refractive index lower than the preset refractive index.

11. The fingerprint identification device according to claim 8, wherein the circuit board is connected to the plurality of fingerprint sensor chips by gold wires, and the heights of the gold wires and the sealing compound of the gold wires are respectively lower than the height of the optical filter.

12. The fingerprint recognition device of claim 1 or 2, wherein the support plate has a surface roughness greater than 0.25 um.

13. The fingerprint identification device according to claim 1 or 2, wherein the circuit board is a T-shaped flexible circuit board, and a plurality of capacitors are disposed above the T-shaped flexible circuit board, and the plurality of capacitors are correspondingly connected to the plurality of fingerprint sensor chips.

14. The fingerprint identification device according to claim 1 or 2, wherein the fixing member is a rectangular steel plate, and the difference between the length of the rectangular steel plate and the width of the middle frame of the electronic device is smaller than or equal to a preset value.

15. The fingerprint recognition device according to claim 1 or 2, wherein the first groove and the second groove are formed in side walls of both side edges of the middle frame, respectively, to fix the fixing member to the side walls of the middle frame.

16. The fingerprint identification device of claim 15, wherein the first groove and the second groove are respectively provided with a first notch and a second notch at one end of the groove wall close to the upper surface of the middle frame, and the first notch and the second notch are symmetrically arranged.

17. The fingerprint recognition device according to claim 15, wherein inner side surfaces of groove walls of the first and second grooves adjacent to the lower surface of the middle frame are respectively provided with a first slope and a second slope with respect to the lower surface of the middle frame, and the first slope is equal to the second slope.

18. An electronic device, comprising:

the fingerprint recognition device and display of any one of claims 1 to 17;

the fingerprint identification device is arranged below the display screen to realize fingerprint detection under the screen.

19. The electronic device of claim 18, wherein the display screen comprises:

a display component;

the light shielding layer is arranged below the display component and provided with a window, the fingerprint identification device receives an optical signal which is sent by the display component and is formed after being reflected by a human finger through the window, and the optical signal is used for fingerprint identification;

the fingerprint identification device is in contact with the lower surface of the display component, or a gap exists between the fingerprint identification device and the lower surface of the display component.

20. The electronic device of claim 19, further comprising:

the middle frame is used for supporting the display screen;

wherein, fingerprint identification device's mounting fixed mounting in the center.

21. The electronic device according to any one of claims 18 to 20, wherein the first recess and the second recess are formed in side walls of both side edges of the middle frame, respectively, to fix the fixing member to the side walls of the middle frame.

22. The electronic device of claim 21, wherein the first and second grooves have a first and second notch at one end of the groove wall near the upper surface of the middle frame, respectively, and the first and second notches are symmetrically arranged.

23. The electronic device according to claim 21, wherein inner side surfaces of groove walls of the first groove and the second groove close to the lower surface of the middle frame are respectively provided with a first slope and a second slope with respect to the lower surface of the middle frame, and the first slope is equal to the second slope.

24. The electronic device of any of claims 18-20, further comprising:

at least one bubble is cotton, at least one bubble is cotton set up in the backup pad with between the center.

25. The electronic device of claim 24, wherein a thickness of each of the at least one foam is dependent on a distance between the bezel and the display screen and a distance between the fingerprint recognition device and the display screen.

26. The electronic device of claim 24, wherein the at least one foam corresponds one-to-one to a plurality of fingerprint sensor chips in the fingerprint identification device.