CN209460780U

CN209460780U - Fingerprint identification device and electronic equipment

Info

Publication number: CN209460780U
Application number: CN201822268604.0U
Authority: CN
Inventors: 郭益平
Original assignee: Shenzhen Huiding Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2018-12-29
Filing date: 2018-12-29
Publication date: 2019-10-01
Anticipated expiration: 2028-12-29

Abstract

It provides a kind of fingerprint identification device and electronic equipment, the fingerprint identification device is applied in the electronic equipment with display screen, which is characterized in that the fingerprint identification device includes: support plate；At least one fingerprint sensor chip, at least one described fingerprint sensor chip are set to the upper surface of the support plate；Wherein, the support plate is used to be mounted on the center of the electronic equipment, so that at least one described fingerprint sensor chip is located at below the display screen of the electronic equipment.In the embodiment of the present application, it can reduce the cost and complexity of electronic equipment by the support plate, improve maintenanceability.Include particularly directed at least one described fingerprint sensor chip multiple chips scene under, can be effectively reduced the cost and complexity of electronic equipment, substantially increase maintenanceability.

Description

Fingerprint identification device and electronic equipment

Technical field

The invention relates to electronic fields, and more particularly, to fingerprint identification device and electronic equipment.

Background technique

Optics or ultrasonic fingerprint identification mould group are fitted in organic light-emitting diodes currently, shielding lower fingerprinting scheme and referring to The bottom of (Organic Light-Emitting Diode, OLED) screen is managed, that is, also regardless of optical finger print identification mould group It is that ultrasonic fingerprint identification mould group requires together with bottom of screen luminescent layer tight bond.

But it directly fits since OLED screen curtain cost is very high and very fragile, therefore by fingerprint recognition mould group to OLED screen It is easy to make a mess of OLED screen curtain when curtain.Further, since fingerprint recognition mould group and OLED screen curtain are fully adhered to together, fingerprint such as occur It identifies the damage of mould group, damage OLED screen curtain is easy to when dismantling fingerprint recognition mould group.Moreover, fingerprint recognition mould group is directly pasted The attaching process for closing OLED screen curtain is also more complicated.

Due to problem above, the cost and complexity of electronic equipment are considerably increased, maintenanceability is low.

Utility model content

A kind of fingerprint identification device and electronic equipment are provided, can reduce the cost and complexity of electronic equipment, is improved Maintenanceability.Particularly directed under the scene of multiple fingerprint sensor chips, can be effectively reduced electronic equipment cost and Complexity substantially increases maintenanceability.

In a first aspect, providing a kind of fingerprint identification device, apply in the electronic equipment with display screen, in some possibility Implementation in, the fingerprint identification device includes:

Support plate；

At least one fingerprint sensor chip, at least one described fingerprint sensor chip are set to the upper of the support plate Surface；

Wherein, the support plate is used to be mounted on the center of the electronic equipment, so that at least one described fingerprint sensing Device chip is located at below the display screen of the electronic equipment；At least one described fingerprint sensor chip is for receiving via described The fingerprint detection signal of human finger reflection or scattering and return above display screen, wherein the fingerprint detection signal is used to examine Survey the finger print information of the finger.

In some possible implementations, the center of the electronic equipment has the groove positioned at upper surface, and described At least one fingerprint sensor chip is arranged in the groove of the center by the support plate.

In some possible implementations, further includes:

Circuit board, at least part of the circuit board is connected to the marginal position of the upper surface of the support plate, described Circuit board is connected at least one described fingerprint sensor chip.

In some possible implementations, at least part of the circuit board is connected to the upper surface of the support plate Close long side marginal position.

In some possible implementations, the support plate is flexible stiffening plate, and the flexibility stiffening plate is in lower surface The fringe region of close short side be provided with first positioning hole.

In some possible implementations, the first positioning hole includes two location holes, and the hole of each location hole Mouth-shaped is circle.

In some possible implementations, at least one described fingerprint sensor chip includes along the flexible stiffening plate Upper surface longitudinal direction setting multiple optical fingerprint sensor chips, it is described flexibility stiffening plate refer in the multiple optics The interval region of each pair of adjacent chips in line sensor chip is provided with second location hole.

In some possible implementations, the orifice shapes of the second location hole are oblong or ellipse.

In some possible implementations, at least one described fingerprint sensor chip includes multiple optical finger print sensings Device chip, the multiple optical fingerprint sensor chip are disposed side by side on the upper surface of the support plate, to be spliced into a light Learn fingerprint sensor chip component.

In some possible implementations, the circuit board is close to the one of the multiple optical fingerprint sensor chip End is provided at least one bending slot, and a bending slot at least one described bending slot corresponds to the multiple optical finger print and passes The interval region between a pair of of adjacent chips in sensor chip.

In some possible implementations, the shape of the bending slot is U-shaped.

In some possible implementations, the fingerprint identification device further include:

The top of at least one fingerprint sensor chip is arranged in optical filter, the optical filter.

In some possible implementations, the entering light face of the optical filter is provided with optical inorganic plated film or organic melanism Coating.

In some possible implementations, the optical filter and at least one described fingerprint sensor chip it is described extremely The non-photo-sensing region of a few fingerprint sensor chip carries out dispensing and fixes, and the optical filter and at least one described fingerprint pass There are gaps between the photosensitive region of sensor chip；Or the lower surface of the optical filter is lower than default refractive index by refractive index Glue be fixed on the upper surface of at least one fingerprint sensor chip.

In some possible implementations, the circuit board passes through gold thread and at least one described fingerprint sensor chip It is connected, the height of the sealing of the height of the gold thread and the gold thread is respectively lower than the height of the optical filter.

In some possible implementations, the surface roughness of the support plate is greater than 0.25um.

In some possible implementations, the circuit board is T-type flexible circuit board, and the T-type flexible circuit board Top be provided with multiple capacitors, the multiple capacitor is correspondingly connected at least one described fingerprint sensor chip.

Second aspect provides a kind of electronic equipment, comprising:

Fingerprint identification device described in display screen and first aspect, the fingerprint identification device are arranged in the display screen Lower section shield lower fingerprint detection to realize.

In some possible implementations, the display screen includes:

Display component；

Light shield layer, the light shield layer are set to the lower section of the display component, and the light shield layer is provided with windowing, the finger Line identification device by the windowing receive that the display component issues reflected via human finger after the optical signal that is formed, institute Optical signal is stated for fingerprint recognition；

Wherein, the fingerprint identification device is contacted with the lower surface of the display component, alternatively, the fingerprint identification device There are gaps with the lower surface of the display component.

In some possible implementations, the electronic equipment further include:

Center, the center are used to support the display screen；

Wherein, the upper surface of the center is downwardly extending fluted, and the fingerprint identification device is arranged described recessed There is predetermined gap in slot and with the display screen.

In some possible implementations, the support plate of the fingerprint identification device has at least one location hole, and At least one positioning column corresponding at least one location hole of the fingerprint identification device is provided in the groove.

In some possible implementations, the shape of the cross section of each positioning column is at least one described positioning column It is round.

In some possible implementations, the electronic equipment further include:

At least one foam, at least one described foam are set between the support plate and the center.

In some possible implementations, the thickness of each foam and the center and institute at least one described foam State at least one fingerprint sensor chip and the display screen in the distance between display screen and the fingerprint identification device The distance between it is related.

In some possible implementations, between at least one fingerprint sensor chip described at least one described foam Relationship be one-to-one relationship.

Based on above technical scheme, after at least one described fingerprint sensor chip is fixedly installed in support plate, Ke Yizhi It connects and support plate is fixedly installed on the internal parts such as center of electronic equipment, can reduce at least one described fingerprint sensor The installation difficulty and complexity of chip, improve maintenanceability.

In addition, at least one described fingerprint sensor chip include multiple chips scene under, can will be described more A chip one-time fixes the lower section for being installed on display screen, can reduce installation complexity, and improve installation effectiveness.

Detailed description of the invention

Fig. 1 is the floor map for the electronic equipment that the application can be applicable in.

Fig. 2 is the side diagrammatic cross-section of electronic equipment shown in FIG. 1.

Fig. 3 is the schematic block diagram of the fingerprint identification device of the embodiment of the present application.

Fig. 4 is the side diagrammatic cross-section of the electronic equipment with fingerprint identification device shown in Fig. 3 of the embodiment of the present application.

Fig. 5 is the schematic diagram after the electronic equipment disassembly with fingerprint identification device shown in Fig. 3 of the embodiment of the present application.

Specific embodiment

Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.

The technical solution of the embodiment of the present application can be applied to various electronic equipments.

For example, the portable or mobiles such as smart phone, laptop, tablet computer, game station calculate equipment, and Other electronic equipments such as electronic databank, automobile, ATM (automatic teller machine) (Automated Teller Machine, ATM).But The embodiment of the present application does not limit this.

The technical solution of the embodiment of the present application can be used for biometrics identification technology.Wherein, biometrics identification technology The including but not limited to identification technologies such as fingerprint recognition, personal recognition, iris recognition, recognition of face and vivo identification.In order to just In explanation, hereafter it is illustrated by taking fingerprint identification technology as an example.

The technical solution of the embodiment of the present application can be used for shielding lower fingerprint identification technology and shield interior fingerprint identification technology.

Fingerprint identification technology, which refers to, under shielding is mounted on fingerprint recognition mould group below display screen, to realize in display screen Fingerprint recognition operation is carried out in display area, does not need the region setting fingerprint collecting in electronic equipment front in addition to display area Region.Specifically, fingerprint recognition mould group carries out fingerprint induction using the light that the top surface of the display component from electronic equipment returns With other inductive operations.The light of this return carries the information of the object (such as finger) contacted with the top surface of display component, position Fingerprint recognition mould group below display component by acquisition and detects the light of this return to realize the lower fingerprint recognition of screen.Its In, the design of fingerprint recognition mould group can be for by being configured to acquire and detect the optical element of the light returned properly come real Existing desired optical imagery.

Correspondingly, (In-display) fingerprint identification technology refers to fingerprint recognition mould group or partial fingerprints identification in screen Mould group is mounted on inside display screen, is carried out fingerprint recognition operation in the display area of display screen to realize, is not needed in electricity Fingerprint collecting region is arranged in region of the sub- equipment front in addition to display area.

Figures 1 and 2 show that shielding the schematic diagram for the electronic equipment 100 that lower fingerprint identification technology can be applicable in, wherein Fig. 1 is The front schematic view of electronic equipment 100, Fig. 2 are the cut-away section structural schematic diagram of electronic equipment 100 shown in FIG. 1.

As depicted in figs. 1 and 2, electronic equipment 100 may include display screen 120 and fingerprint recognition mould group 140.

Display screen 120 can be self light emitting display panel, use with self luminous display unit as display pixel.Than If display screen 120 can be Organic Light Emitting Diode (Organic Light-EmittingDiode, OLED) display screen or micro- Type light emitting diode (Micro-LED) display screen.In other alternate embodiments, display screen 120 or liquid crystal display Screen (Liquid Crystal Display, LCD) or other passive light emitting displays, the embodiment of the present application do not limit this System.

In addition, display screen 120 can also be specially touching display screen, it can not only carry out picture and show, can also examine Touch or the pressing operation for surveying user, to provide a personal-machine interactive interface for user.For example, in one embodiment, Electronic equipment 100 may include touch sensor, the touch sensor can be specially touch panel (Touch Panel, TP), it can be set on 120 surface of display screen, partially can also integrate or be monolithically integrated into the display screen 120 Portion, to form the touching display screen.

Fingerprint recognition mould group 140 can identify mould group, such as optical fingerprint sensor for optical finger print.

Specifically, fingerprint recognition mould group 140 may include having the fingerprint sensor chip (back of optical sensor array Also referred to as optical fingerprint sensor).Wherein, optical sensor array includes multiple optical sensor units, each optical sensor unit Optical detector or photoelectric sensor can be specifically included.In other words, fingerprint recognition mould group 140 may include optical detector (Photo detector) array (or being photodetector array, photosensor arrays) comprising multiple is in array The optical detector of distribution.

As shown in Figure 1, the regional area in the lower section of the display screen 120 can be set in fingerprint recognition mould group 140, thus So that the fingerprint collecting region (or detection zone) 130 of fingerprint recognition mould group 140 is at least partially disposed at the aobvious of the display screen 120 Show in region 102.

Certainly, in other alternate embodiments, fingerprint recognition mould group 140 also be can be set in other positions, such as aobvious The non-transparent region in edge of the side or electronic equipment 100 of display screen 120.In this case, it can will be shown by light path design The optical signal of at least partly display area of display screen 120 directs into fingerprint recognition mould group 140, so that the fingerprint collecting area Domain 130 is physically located in the display area of the display screen 120.

In some embodiments of the present application, fingerprint recognition mould group 140 can only include a fingerprint sensor chip, this When fingerprint recognition mould group 140 fingerprint collecting region 130 area it is smaller and position is fixed, therefore user is carrying out fingerprint input When need for finger to be pressed into the specific position in the fingerprint collecting region 130, otherwise fingerprint recognition mould group 140 possibly can not adopt Collect fingerprint image and causes user experience bad.

In other embodiments of the application, fingerprint recognition mould group 140 can specifically include multiple fingerprint sensor cores Piece；The multiple fingerprint sensor chip can be disposed side by side on the lower section of the display screen 120 by connecting method, and described The induction region of multiple fingerprint sensor chips collectively forms the fingerprint collecting region 130 of the fingerprint recognition mould group 140.Namely It is to say, the fingerprint collecting region 130 of the fingerprint recognition mould group 140 may include multiple subregions, and each subregion is right respectively It should be in the induction region of one of fingerprint sensor chip, thus by the fingerprint collecting region of the optical finger print mould group 130 130 can extend to the main region of the lower half portion of the display screen, that is, the usual pressing area of finger be expanded to, to realize It is blind to be operated by the input of formula fingerprint.Alternatively, when the fingerprint sensor chip quantity is enough, the fingerprint detection region 130 can be extended to half of display area even entire display area, to realize half screen or full frame fingerprint detection.

It should be understood that the embodiment of the present application to the concrete form of the multiple fingerprint sensor chip without limitation.

It, can also be with for example, the multiple fingerprint sensor chip can be the fingerprint sensor chip of individual packages respectively The multiple chips (Die) being packaged in the same chip package body.

In another example can also be made in the different zones of the same chip (Die) by semiconductor technology described in formation Multiple fingerprint sensor chips.

As shown in Fig. 2, the region of the optical sensor array of fingerprint recognition mould group 140 or photoinduction range correspond to institute State the fingerprint collecting region 130 of fingerprint recognition mould group 140.Wherein, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be with Equal or different to the area or photoinduction range of the region of the optical sensor array of fingerprint recognition mould group 140, this Shen Please embodiment be not specifically limited in this embodiment.

For example, the light path design collimated by light, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be designed Area at the induction arrays with the fingerprint recognition mould group 140 is almost the same.

In another example the fingerprint can be made by the light path design of the light path design or reflection light that converge light Identify that the area in the fingerprint collecting region 130 of mould group 140 is greater than the area of 140 induction arrays of fingerprint recognition mould group.

The light path design of fingerprint recognition mould group 140 is illustrated below.

With the light path design of fingerprint recognition mould group 140 use with high-aspect-ratio through-hole array optics collimator for Example, the optics collimator can be specially collimator (Collimator) layer being made in semi-conductor silicon chip, have Multiple collimation units or micropore, the collimation unit can be specially aperture, from the reflected reflected light of finger, vertically The light for being incident on the collimation unit can be passed through and be received by fingerprint sensor chip below, and incident angle is excessive Light be attenuated inside the collimation unit by multiple reflections, therefore each fingerprint sensor chip substantially can only The reflected reflected light of fingerprint lines right above it is received, image resolution ratio can be effectively improved, and then improve fingerprint Recognition effect.

It further, can be each fingerprint sensing when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips An optical sensor unit in the optical sensor array of device chip configures a collimation unit, and it is corresponding at its to be bonded setting The top of optical sensor unit.Certainly, the multiple optical sensor unit can also share a collimation unit, i.e., one Collimation unit has sufficiently large aperture to cover multiple optical sensor units.Since a collimation unit can correspond to multiple light Sensing unit is learned, the correspondence of the space periodic of display screen 120 and the space periodic of fingerprint sensor chip is destroyed, therefore, Even if the space structure of the optical sensor array of the space structure and fingerprint sensor chip of the luminescence display array of display screen 120 It is similar, it also can effectively avoid fingerprint recognition mould group 140 from carrying out fingerprint imaging using the optical signal by display screen 120 and generate not That striped, effectively increases the fingerprint recognition effect of fingerprint recognition mould group 140.

By taking light path design of the light path design of fingerprint recognition mould group 140 using optical lens as an example, the optical lens can To include optical lens (Lens) layer, there is one or more lens units, such as one or more non-spherical lens compositions Lens group, be used to that the induction battle array of fingerprint sensor chip below will to be converged to from the reflected reflected light of finger Column, so that the induction arrays can be imaged based on the reflected light, to obtain the fingerprint image of the finger.Institute Pin hole can also be formed in the optical path of the lens unit by stating optical lens mirror layer, and the pin hole can cooperate the optical lens Mirror layer expands the visual field of fingerprint recognition mould group 140, to improve the fingerprint imaging effect of the fingerprint recognition mould group 140.

Further, it when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips, can be passed for each fingerprint Sensor chip configures an optical lens and carries out fingerprint imaging, or configures an optical lens for multiple fingerprint sensor chips To realize light convergence and fingerprint imaging.Even, when there are two induction arrays (Dual for a fingerprint sensor chip tool Array) or when multiple induction arrays (Multi-Array), or the configuration of this fingerprint sensor chip is two or more Optical lens cooperates described two induction arrays or multiple induction arrays to carry out optical imagery, to reduce image-forming range and enhance Imaging effect.

By taking light path design of the light path design of fingerprint recognition mould group 140 using lenticule (Micro-Lens) layer as an example, institute Stating microlens layer can have the microlens array formed by multiple lenticules, can by semiconductor growing process or its His technique is formed in above the induction arrays of the fingerprint sensor chip, and each lenticule can correspond respectively to institute State one of sensing unit of induction arrays.Other optics can also be formed between the microlens layer and the sensing unit Film layer, such as dielectric layer or passivation layer, more specifically, can also include tool between the microlens layer and the sensing unit There is the light blocking layer of micropore, wherein the micropore is formed between its corresponding lenticule and sensing unit, the light blocking layer can be with Stop the optical interference between contiguous microlens and sensing unit, and converges to light in the micropore by the lenticule Portion is simultaneously transferred to the corresponding sensing unit of the lenticule via the micropore, to carry out optical finger print imaging.

It should be appreciated that several implementations of above-mentioned optical path guide structure can be used alone and can also be used in combination, than Such as, microlens layer can be further set below the collimator layer or the optical lens mirror layer.Certainly, in the collimation Device layer when perhaps the optical lens mirror layer is used in combination with the microlens layer its specific laminated construction or optical path may need It is adjusted according to actual needs.

Fingerprint recognition mould group 140 can be used for acquiring the finger print information (such as information in fingerprint) of user.

By taking display screen 120 is using OLED display screen as an example, display screen 120 can be using aobvious with spontaneous light display unit Display screen, such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or miniature luminous Diode (Micro-LED) display screen.Fingerprint recognition mould group 140 can use OLED display screen be located at fingerprint collecting region The excitation light source that 130 display unit (i.e. OLED light source) detects as optical finger print.

When finger touch, press or close to (for ease of description, referred to collectively herein as pressing) in fingerprint collecting area When domain 130, display screen 120 issues light beam to the finger of 130 top of fingerprint collecting region, this light beam is sent out on the surface of finger It is raw to reflect to form reflected light or form scattering light after the scattering-in of finger, in the related patent applications, for convenient for Description, above-mentioned reflected light and scattering light are referred to as reflected light.Due to fingerprint ridge (ridge) with valley (vally) for the anti-of light Ability difference is penetrated, therefore, reflected light from fingerprint ridge and was occurred from fingerprint valley with different light intensity, reflected light passes through After crossing display screen 120, corresponding electric signal is received and converted to by the fingerprint sensor chip in fingerprint recognition mould group 140, That is fingerprint detection signal；Fingerprint image data can be obtained based on the fingerprint detection signal, and can be with further progress Fingerprint matching verifying, to realize optical finger print identification function in the electronic equipment 100.

It can be seen that only being needed when user needs to carry out unlocked by fingerprint or other fingerprint authentications to electronic equipment 100 By finger pressing in the fingerprint collecting region 130 for being located at display screen 120, the input operation of fingerprint characteristic can be realized.By It can be realized in the inside of the display area of display screen 120 102 in the acquisition of fingerprint characteristic, electronic equipment using the above structure 100 are arranged fingerprint key (such as Home key) without the special reserved space in its front, thus can be using screen scheme comprehensively.Cause This, the display area 102 of the display screen 120 can extend substantially to the entire front of the electronic equipment 100.

Certainly, in other alternative solutions, fingerprint recognition mould group 140 can also using built-in light source or external light source come Optical signal for carrying out fingerprint detection identification is provided.In this case, fingerprint recognition mould group 140 not only can be adapted for as The self light emitting display panels such as OLED display screen can be applicable to non-spontaneous smooth display screen, such as liquid crystal display or others Passive light emitting display.

For applying in the liquid crystal display with backlight module and liquid crystal display panel, under the screen to support liquid crystal display Fingerprint detection, the optical fingerprint systems of electronic equipment 100 can also include the excitation light source for optical finger print detection, described to swash The light source that light source can be specially infrared light supply or specific wavelength non-visible light is encouraged, can be set in the liquid crystal display Backlight module below or the fringe region that is arranged in below the cover sheet of electronic equipment 100, and fingerprint recognition mould group 140 It can be set below the fringe region of liquid crystal display panel or cover sheet and guided by optical path so that fingerprint detection light can be with Reach the fingerprint recognition mould group 140；Alternatively, fingerprint recognition mould group 140 also can be set below the backlight module, and institute Backlight module is stated by carrying out aperture or other optical designs to film layers such as diffusion sheet, blast piece, reflector plates to allow fingerprint Detection light passes through liquid crystal display panel and backlight module and reaches fingerprint recognition mould group 140.It is adopted when using the fingerprint recognition mould group 140 When providing the optical signal for carrying out fingerprint detection with built-in light source or external light source, testing principle can be identical.

As shown in Figure 1, electronic equipment 100 can also include cover sheet 110.

Cover board 110 can be specially transparent cover plate, such as glass cover-plate or sapphire cover board, be located at display screen 120 Top and cover the front of the electronic equipment 100, and 110 surface of cover board is also provided with protective layer.Therefore, the application In embodiment, so-called finger pressing display screen 120 can actually refer to that finger presses cover board square on the display screen 120 110 or the covering cover board 110 protective layer.

As shown in Figure 1, the lower section of fingerprint recognition mould group 140 is also provided with circuit board 150, such as flexible circuit board (Flexible Printed Circuit, FPC).

Fingerprint recognition mould group 140 can by pad solder to circuit board 150, and by circuit board 150 realize and other The electrical interconnection and signal transmission of the other elements of peripheral circuit or electronic equipment 100.For example, fingerprint recognition mould group 140 can To receive the control signal of the processing unit of electronic equipment 100 by circuit board 150, and can also be incited somebody to action by circuit board 150 The processing unit of fingerprint detection signal output electron equipment 100 from fingerprint recognition mould group 140 or control unit etc..

In certain embodiments, fingerprint identification device 140 can directly fix the lower surface for being fitted in display screen 120.

But since 120 cost of display screen is very high and very fragile, therefore fingerprint recognition mould group 140 is directly fitted to aobvious It is easy to make a mess of display screen 120 when display screen 120.

Further, since fingerprint recognition mould group 140 and display screen 120 are fully adhered to together, such as there is fingerprint recognition mould group 140 Damage is easy to damage display screen 120 when dismantling fingerprint recognition mould group 140.

Also, the attaching process that fingerprint recognition mould group 140 is directly attached to display screen 120 is also more complicated.

Due to problem above, the cost and complexity of electronic equipment 100 are considerably increased, maintenanceability is low.

This application provides a kind of fingerprint identification devices, can reduce the cost and complexity of electronic equipment 100, improve Maintenanceability.

Fig. 3 is the schematic block diagram of the fingerprint identification device 200 of the embodiment of the present application.Fig. 4 is the tool of the embodiment of the present application There is the side diagrammatic cross-section of the electronic equipment 300 of fingerprint identification device 200 shown in Fig. 3.Fig. 5 is having for the embodiment of the present application Schematic diagram after the disassembly of electronic equipment 300 of fingerprint identification device 200 shown in Fig. 3.

The fingerprint identification device 200 and electronic equipment 300 of the embodiment of the present application are described in detail below with reference to Fig. 3 to Fig. 5.

It should be noted that for purposes of illustration only, in the embodiment of the present application, identical appended drawing reference is for indicating identical Component, and for sake of simplicity, in different embodiments, omit the detailed description to same parts.

As shown in figure 3, fingerprint identification device 200 may include 4 fingerprint sensor chips 210 and support plate 230.

4 fingerprint sensor chips 210 can be set in the upper surface of support plate 230.

For example, 4 fingerprint sensor chips 210 can be disposed side by side on the upper surface of the support plate, with splicing At an optical fingerprint sensor chip component.

Specifically, as shown in figure 4, each fingerprint sensor chip 210 can be fitted in by the fixed glue 211 of chip it is described The upper surface of support plate 230.Optionally, the fixed glue 211 of the chip can be solid-state glue or liquid glue.For example, the core The fixed glue 211 of piece can be double-sided adhesive or glue.

In the embodiment of the present application, the support plate 230 is used to be mounted on the center 330 of the electronic equipment 300, so that institute Each fingerprint sensor chip 210 is stated to be located at below the display screen of the electronic equipment 300；Each fingerprint sensor chip 210 for receiving the fingerprint detection signal returned via the human finger reflection or scattering above the display screen, wherein institute State the finger print information that fingerprint detection signal is used to detect the finger.For example, the center 330 of the electronic equipment 300 has position Groove in upper surface, at least one described fingerprint sensor chip 210 are arranged by the support plate 230 in the center In 330 groove.

It, can be direct after 4 fingerprint sensor chips 210 are fixedly installed in support plate 230 in the embodiment of the present application Support plate 230 is fixedly installed on the internal parts such as the center of electronic equipment 300, at least one described fingerprint is can reduce and passes The installation difficulty and complexity of sensor chip, improve maintenanceability.In addition, 4 fingerprint sensor chips 210 are directed to, 4 fingerprint sensor chips 210 can be one-time fixed to the lower section for being installed on display screen by the support plate 230, It can reduce installation complexity, and improve installation effectiveness.

It should be understood that fingerprint sensor chip 210 shown in Fig. 3 can be Fig. 1 and fingerprint identification device shown in Fig. 2 140 In fingerprint sensor chip, correlation function and structure explanation can refer to aforementioned associated description, for sake of simplicity, herein no longer It repeats.

Optionally, as shown in figure 3, the fingerprint identification device 200 can also include circuit board 220.

As shown in figure 4, at least part setting of the circuit board 220 can be fitted in by the fixed glue 221 of circuit board The upper surface of support plate 230.Optionally, the fixed glue 221 of the circuit board can be solid-state glue or liquid glue.For example, described The fixed glue 221 of circuit board can be double-sided adhesive or glue.

Further, at least part of circuit board 200 can connect the margin location in the upper surface of the support plate 230 It sets, the circuit board 220 is connected at least one described fingerprint sensor chip 210.For example, the circuit board 220 is at least A part is connected to the marginal position of the close long side of the upper surface of the support plate 230, with increasing circuit plate 220 and support plate Contact area between 230, and then improve connection reliability.

For Fig. 3, the upper surface of the support plate 230 is rectangle, and 4 fingerprint sensor chips 210 are along described The longitudinal direction of the upper surface of support plate 230, close to the support plate 230 the first long side area arrangement in a row, institute State the region for the second long side that circuit board 220 can be fixed at close to the support plate 230.Wherein, first long side It is respectively two long sides of the support plate 230 with second long side.

Certainly, in other alternate embodiments, 4 fingerprint sensor chips 210 can also be along the support plate The short side direction of 230 upper surface is arranged side by side, at this point, at least part of the circuit board 220 can connect in the branch The marginal position of the close long side of the upper surface of fagging 230 or close short side.

It should be understood that circuit board 220 shown in Fig. 3 can be Fig. 1 and circuit board shown in Fig. 2 150, correlation function and knot Structure explanation can refer to aforementioned associated description, for sake of simplicity, details are not described herein.

Optionally, as shown in figure 3, at least one location hole has can be set in the support plate 230.

Further, at least one described location hole can correspond on the either component of electronic equipment at least one is fixed Position column.As a result, in assembling process, it is only necessary to by least one positioning column and support plate on the either component of electronic equipment At least one location hole on 230 is pressed, and fingerprint identification device 200 can be fixedly mounted in the electronic equipment Portion.

As one embodiment, the support plate 230 can be provided in the fringe region of the close short side of lower surface A positioning hole.Optionally, the first positioning hole includes two location holes, and the orifice shapes of each location hole are circle.Institute The upper and lower surfaces of the support plate 230 can be penetrated through by stating any location hole at least two location holes, can also not Penetrate through the upper and lower surfaces of the support plate 230.Further, in described two location holes each location hole the hole degree of lip-rounding Shape can the cross-sectional shape of positioning column on the either component of electronic equipment corresponding with described two location holes it is identical, to increase Add connection reliability.

For Fig. 3, the upper surface of the support plate 230 is rectangle, and the support plate 230 can be in left side edge Two location holes 231 are arranged in position.

Certainly, the support plate 230 is arranged one kind that two location holes 231 are only the application in left side edge position and shows Example, should not be construed as the limitation to the application.For example, the support plate 230 can also be on the right side in other alternate embodiments Two location holes or the support plate 230, which are arranged, in side edge position can be provided with one in the marginal position where short side Or more than two location hole or the support plate 230 can be in the lower surfaces of the support plate 230 close to the edge of long side At least one location hole is arranged in position.

As another embodiment, longitudinal direction of the support plate 230 in the upper surface along the support plate 230 is arranged When having multiple optical fingerprint sensor chips, the support plate 230 can be in the multiple optical fingerprint sensor chip The interval region of each pair of adjacent chips is provided with second location hole.For example, the support plate 230 is passed in the multiple optical finger print The middle position of the interval region of each pair of adjacent chips in sensor chip is provided with the second location hole.Optionally, described Second location hole only includes a location hole.The orifice shapes of the second location hole are oblong or ellipse.Further Ground, the positioning column on the either component of the orifice shapes of second location hole electronic equipment corresponding with the second location hole Cross-sectional shape it is not identical, to reduce installation difficulty.For example, the orifice shapes of the second location hole are oblong or ellipse Circle, the cross-sectional shape of the positioning column on the either component of electronic equipment corresponding with the second location hole are circle.

For Fig. 3, the upper surface of the support plate 230 is rectangle, and the upper surface of the support plate 230 is provided with 4 fingerprint sensor chips, each pair of adjacent fingerprint of the support plate 230 in this described 4 fingerprint sensor chips 210 pass A location hole 231 is respectively set in the middle position of the interval region of sensor chip 210.

Certainly, the support plate 230 is between each pair of adjacent chips in 4 optical fingerprint sensor chips 210 Septal area domain is provided with a kind of example that a location hole 231 is only the application, should not be construed as the limitation to the application.For example, In other alternate embodiments, the support plate 230 can specific at least a pair of of adjacent core in the multiple chip A location hole is arranged in the interval region of piece.For example, the support plate 230 only most intermediate a pair in the multiple chip A location hole is arranged in the interval region of adjacent chips.

Optionally, as shown in figure 3, the circuit board 220 is in one end close to the multiple optical fingerprint sensor chip At least one bending slot can be set.

Further, a bending slot at least one described bending slot corresponds to the multiple optical fingerprint sensor core The interval region between a pair of of adjacent chips in piece.The support plate 230 is installed on to a certain component of electronic equipment as a result, When, performance can be influenced since bending occurs to avoid the circuit board 230, or even lose.The shape of the bending slot For U-shaped, it is broken to avoid the circuit board in the position of the bending slot.

Optionally, as shown in figure 3, the fingerprint identification device 200 can also include optical filter 270, the optical filter 270 The top of at least one fingerprint sensor chip is set.

Specifically, optical filter 270 may include one or more optical filters, and one or more optical filters can be with Such as bandpass filters are configured to, to allow the transmission of the light of OLED pixel emission, while stopping the infrared light etc. in sunlight Other light components.When the fingerprint identification device 200 under outdoor application screen, this optical filtering can be effectively reduced by Bias light caused by sunlight.One or more optical filters can be implemented as such as optical filtering coating, and optical filtering applies Layer is formed on one or more continuous interfacials, or can be implemented as on one or more discrete interfaces.It should be understood that optical filter 270 can be produced on the surface of any optical component, or along to the reflected light reflected to form via finger to Cheng Suoshu On the optical path of at least one fingerprint sensor chip.

In the embodiment of the present application, optical filter 270 is used to reduce the undesirable environment light in fingerprint induction, to improve extremely Few optical sensor of the fingerprint sensor chip to the light received.Optical filter 270 specifically can be used for filtering out certain wave Long light, for example, near infrared light and partial feux rouges etc..For example, the energy of light of human finger's absorbing wavelength lower than~580nm In major part, if one or more optical filter or optical filter layer are designed to wavelength-filtered from 580nm to infrared Light, then can greatly reduce environment light to fingerprint induction in optical detection influence.

In addition, the entering light face of the optical filter 270 is also provided with optical inorganic plated film or organic melanism coating, so that The reflectivity for obtaining the entering light face of optical filter 270 is lower than first threshold, such as 1%, so as to guarantee at least one described fingerprint Sensor chip can receive it is enough, and then promoted fingerprint recognition effect.

In the embodiment of the present application, the optical filter 270 can at least one described fingerprint sensor chip it is described extremely The non-photo-sensing region of a few fingerprint sensor chip carries out dispensing and fixes, and the optical filter 270 and it is described at least one refer to There are gaps between the photosensitive region of line sensor chip；Or the lower surface of the optical filter 270 is lower than in advance by refractive index If the glue of refractive index is fixed on the upper surface of at least one fingerprint sensor chip.For example, under the optical filter 270 Glue of the surface by refractive index lower than 1.3 is fixed on the upper surface of at least one fingerprint sensor chip.

Optionally, as shown in Figure 3 and Figure 4, the fingerprint identification device 200 can also include gold thread 260, the circuit board 220 are connected by gold thread 260 at least one described fingerprint sensor chip.

Specifically, the gold thread 260 is for realizing logical between at least one fingerprint sensor chip and circuit board 220 Letter, and realized and the other elements in other peripheral circuits or electronic equipment as shown in Figure 1 or 2 by circuit board 220 Electrical interconnection and signal transmission.For example, at least one described fingerprint sensor chip can receive electricity by the gold thread 260 The control signal of the processing unit of sub- equipment, and can also be by the gold thread 260 by fingerprint detection signal (such as fingerprint image Picture) it exports to the image processor of the fingerprint identification device 200 or the processor of electronic equipment 300.

Further, the height of the sealing of the height and gold thread 260 of the gold thread 260 can be respectively lower than the filter The height of mating plate 270, to reduce the thickness of the fingerprint identification device 200 and reduce its installation difficulty.

Optionally, as shown in Figure 3 and Figure 4, the fingerprint identification device 200 can also include image processor 250, image Processor 250 is set on circuit board 220.Described image processor 250 can be specially microprocessor (Micro Processing Unit, MCU), image processor 250 passes through the circuit from least one described sensor for receiving The fingerprint detection signal (such as fingerprint image) that plate 220 is sent, and fingerprint recognition is carried out based on fingerprint detection signal.Specifically, At least one described fingerprint sensor chip is received first from the reflected reflected light of user's finger and is believed based on received light It number is imaged, to generate fingerprint image；Then, fingerprint image is sent to image processor by the circuit board 220 250, so that image processor 250 carries out image procossing and obtains fingerprint signal；Finally, being referred to by algorithm to fingerprint signal Line identification.

Optionally, as shown in Figure 3 and Figure 4, the fingerprint identification device 200 can also include at least one capacitor 240, At least one described capacitor 240 is arranged on the circuit board 220, for optimizing the acquisition of at least one fingerprint sensor chip Fingerprint detection signal.For example, at least one described capacitor 240 is used to acquire at least one described fingerprint sensor chip Fingerprint detection signal be filtered.Wherein, each fingerprint sensor at least one described fingerprint sensor chip Chip can correspond to one or more capacitor 240.

It should be understood that Fig. 3 and Fig. 4 are only a kind of example of the application, the limitation to the embodiment of the present application should not be construed as.

For example, in other alternative embodiments, the fingerprint identification device 200 can only include less than 4 or Fingerprint sensor chip 210 more than 4.

It should also be understood that the embodiment of the present application does not do specifically the parameters such as the material and shape of the support plate 230 and size It limits.

For example, the thickness range of support plate 230 is 0.075mm-0.30mm, to control the fingerprint identification device 200 Thickness.

In another example the flexibility stiffening plate includes but is not limited to polyimides reinforcement when support plate 230 is flexible stiffening plate Plate, so as to improve the heat dissipation performance of the fingerprint identification device 200.

In another example the surface roughness (Ra) of support plate 230 is greater than a certain threshold value, such as 0.25um, to improve imaging effect Fruit；Specifically, optical signal can be scattered by surface, energy when the surface roughness of support plate 230 is greater than a certain threshold value Enough effectively reduce display screen sending and in the optical signal that the inside of fingerprint identification device 200 is reflected, and then avoid light anti- It penetrates and imaging is impacted；In addition, the support plate can be increased when the surface roughness of support plate 230 is greater than a certain threshold value Connection reliability between 230 and other component.Such as the support plate 230 and at least one described sensor and the circuit Connection reliability and the support plate 230 between plate 220 and the connection between the component for fixing the support plate 230 Reliability.

In another example the color of support plate 230 is dark color, to increase the extinction effect of the support plate 230, and then institute is avoided It states the light that support plate 230 reflects upwards and interference is generated to the light that at least one described fingerprint sensor chip receives.Than Such as black or dark-brown.

In another example the lower surface of support plate 230 is square or rectangle, in order to which the support plate 230 to be mounted on The inside of the electronic equipment 300.

It should also be understood that the embodiment of the present application to parameters such as the type of the circuit board 220 and shapes also without limitation, can Selection of land, the shape of the circuit board can be irregular shape or regular shape.For example, rectangle or square.

For example, the shape of the circuit board 220 is T-type such as Fig. 3.

In another example the shape of the circuit board 220 can also be the distressed structure of T shape in other alternate embodiments.

The embodiment of the present application also provides a kind of electronic equipment 300, the electronic equipment 300 may include such as this above-mentioned Shen It please fingerprint identification device 200 and display screen in various embodiments.Wherein, the fingerprint identification device 200 is set to described aobvious The lower section of display screen carries out fingerprint detection for receiving via finger reflection and by the display screen optical signal.

Specifically, the fingerprint recognition mould group 200 can lead to the center that support plate 230 can be fixed to the electronic equipment On equal internal parts, so that the fingerprint identification device 200 can be fixed on the lower section of the display screen of the electronic equipment. For example, the lower section of the display screen of electronic equipment can be arranged in the fingerprint identification device 200 by support plate 230, specifically may be used The lower section of the intermediate region of display screen is arranged in, meet the use habit of user, is held convenient for user.

As shown in Figure 4 and Figure 5, the electronic equipment 300 may include display screen and fingerprint identification device 200.Wherein, The display screen may include the light shield layer 320 of display component 310 and the display component 310.Optionally, the light shield layer 320 can be set windowing 321, and the fingerprint identification device 200 receives the display component 310 by the windowing 321 and sends out The optical signal formed after reflecting via human finger out, the optical signal are used for fingerprint recognition.

In the embodiment of the present application, the fingerprint identification device 200 of electronic equipment 300 and the display screen of the electronic equipment 300 It is separate design, but the embodiment of the present application is between the fingerprint identification device 200 and the display screen of the electronic equipment Relative distance is without limitation.

Specifically, the fingerprint identification device 200 can be contacted with the lower surface of the display component 310, alternatively, described May exist gap between the upper surface of fingerprint identification device 200 and the lower surface of the display component 310.For example, fingerprint is known The upper surface of other device 200 can with the lower surface of display screen the distance between can be less than or equal to specific threshold, such as 600 μm, to guarantee the photosensitive region for thering are enough optical signals to be incident at least one fingerprint sensor chip.

In the embodiment of the present application, if the lower surface of fingerprint identification device 200 and display screen does not contact, retain therebetween solid Fixed gap, gap can be the air gap (air gap) for being not filled with any auxiliary material, can guarantee when display screen by It is not in the following table that fingerprint identification device 200 touches display screen when occurring falling or colliding to pressing or electronic equipment Face will not influence the stability and performance of the fingerprint recognition of fingerprint identification device 200.

It should be understood that Fig. 4 and display component shown in fig. 5 310 can refer to and be referred to retouching previously with regard to display screen 120 It states, for sake of simplicity, details are not described herein.

It should be understood that the light shield layer 320 is also used as heat dissipating layer and/or buffer layer, wherein the light shield layer is for blocking Other regions except fingerprint detection region enter fingerprint sensor chip, shadow to avoid the optical signal in other described regions Snap line detection effect.When the light shield layer 320 is used as heat dissipating layer, it can be also used for the luminescence unit generation in display screen Heat radiates, and when the light shield layer 320 is used as buffer layer, can be used for buffering the extruding or collision that electronic equipment is subject to, To reduce the damage to display screen.

Optionally, as shown in Figure 4 and Figure 5, the electronic equipment 300 can also include center 330, and the center 330 is used In the support display screen.Specifically, center 330 can be used for for being set between display screen and battery for electronic equipment 300 Carrying the frame of internal various assemblies, internal various assemblies include but is not limited to mainboard, camera, winding displacement, various inductors, Microphone, earpiece etc. components.

It is understood that in the embodiment of the present application only for fingerprint identification device 200 to be fixed on center 330 into Row description, in other alternate embodiments, fingerprint identification device 200 can be by being fixedly connected on having for electronic equipment 300 The lower section that fingerprint identification device 200 is mounted on to display screen is realized in the other structures of support function.As long as can guarantee Above-mentioned fingerprint identification device 200 can be fixed at the lower section of display screen with separate mode.

For example, fingerprint identification device 200 can be fixed to rear cover, mainboard and the battery etc. of electronic equipment has support In the structure or device of function, it is further made to be fixed at the lower section of display screen.

Optionally, as shown in Figure 4 and Figure 5, the upper surface of the center 330 is downwardly extending fluted, the groove Inside it is provided at least one positioning column 331 corresponding at least one location hole of the fingerprint identification device 200.It is described at least The shape of the cross section of each positioning column can be circle in one positioning column 331.

Optionally, as shown in Figure 4 and Figure 5, the electronic equipment 300 can also include at least one foam 340, it is described extremely A few foam 340 is set between the support plate 230 and the center 330.Part at least one described foam or Whole foams are two-sided gum foam, to improve the connection reliability between the support plate 230 and the center 330.

Further, at least one fingerprint sensor core in fingerprint identification device described at least one described foam 340 Relationship between piece 210 is one-to-one relationship.

For Fig. 5, when the fingerprint identification device 200 includes 4 fingerprint sensor chips 210, the electronics is set Standby 300 may include 4 pieces of foams corresponding with 4 fingerprint sensor chips 210, wherein each fingerprint sensor chip The size of 210 lower surface is identical with the size of upper surface of its corresponding foam 340.

Further, at least one described foam 340 thickness of each foam 340 with by the center 330 and institute State at least one fingerprint sensor chip 210 in the distance between display screen and the fingerprint identification device 200 and described The distance between display screen (such as described display component 310) is related.Each foam 340 at least one described foam 340 Thickness respectively with by the distance between the center 330 and described display screen and the fingerprint identification device 200 at least The distance between one fingerprint sensor chip 210 and the display screen are inversely proportional.For example, at least one described foam 340 The thickness of each foam 340 makes the upper surface of at least one fingerprint sensor chip 210 and the following table of the display screen The distance between face is less than or equal to 600 μm.

It should be understood that Fig. 5 is only a kind of example of the application, the limitation to the embodiment of the present application should not be construed as.For example, In other alternative embodiments, the electronic equipment 300 can only include one piece of foam, and one piece of foam is provided with and institute State the corresponding through-hole of at least one location hole in support plate 230.

It should be understood that the specific example in the embodiment of the present application is intended merely to that those skilled in the art is helped to more fully understand The embodiment of the present application, rather than limit the range of the embodiment of the present application.

It should be understood that the term used in the embodiment of the present application and the appended claims is only merely for the specific reality of description The purpose for applying example, is not intended to be limiting the embodiment of the present application.For example, being made in the embodiment of the present application and the appended claims The "an" of singular, " above-mentioned " and " described " are also intended to including most forms, unless context clearly shows that it His meaning.

Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member can be realized with electronic hardware, computer software, or a combination of the two, can in order to clearly demonstrate hardware and software Interchangeability generally describes each exemplary composition and step according to function in the above description.These functions are actually It is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technician Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed Scope of the present application.

In several embodiments provided herein, it should be understood that arriving, disclosed system, device can pass through Other modes are realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the unit, Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be with In conjunction with or be desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed Mutual coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING of device or unit or logical Letter connection is also possible to electricity, mechanical or other form connections.

The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple In network unit.Some or all of unit therein can be selected to realize the embodiment of the present application scheme according to the actual needs Purpose.

It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit It is that each unit physically exists alone, is also possible to two or more units and is integrated in one unit.It is above-mentioned integrated Unit both can take the form of hardware realization, can also realize in the form of software functional units.

If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially The all or part of the part that contributes to existing technology or the technical solution can be with the shape of software product in other words Formula embodies, and the computer software product is stored in a storage medium, including some instructions are used so that a meter It calculates machine equipment (can be personal computer, server or the network equipment etc.) and executes each embodiment the method for the application All or part of the steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey The medium of sequence code.

The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any Those familiar with the art within the technical scope of the present application, can readily occur in various equivalent modifications or replace It changes, these modifications or substitutions should all cover within the scope of protection of this application.Therefore, the protection scope of the application should be with right It is required that protection scope subject to.

Claims

1. a kind of fingerprint identification device is applied in the electronic equipment with display screen, which is characterized in that the fingerprint identification device Include:

Support plate；

At least one fingerprint sensor chip, at least one described fingerprint sensor chip are set to the upper table of the support plate Face；

Wherein, the support plate is used to be mounted on the center of the electronic equipment, so that at least one described fingerprint sensor core Piece is located at below the display screen of the electronic equipment；At least one described fingerprint sensor chip is for receiving via the display The human finger reflection of screen top or the fingerprint detection signal of scattering and return, wherein the fingerprint detection signal is used to detect institute State the finger print information of finger.

2. fingerprint identification device according to claim 1, which is characterized in that the center of the electronic equipment has positioned at upper The groove on surface, and at least one described fingerprint sensor chip is arranged in the groove of the center by the support plate.

3. fingerprint identification device according to claim 1, which is characterized in that further include:

Circuit board, at least part of the circuit board are connected to the marginal position of the upper surface of the support plate, the circuit Plate is connected at least one described fingerprint sensor chip.

4. fingerprint identification device according to claim 3, which is characterized in that at least part of the circuit board is connected to The marginal position of the close long side of the upper surface of the support plate.

5. fingerprint identification device according to claim 1, which is characterized in that the support plate is flexible stiffening plate, described Flexible stiffening plate is provided with first positioning hole in the fringe region of the close short side of lower surface.

6. fingerprint identification device according to claim 5, which is characterized in that the first positioning hole includes two positioning Hole, and the orifice shapes of each location hole are circle.

7. fingerprint identification device according to claim 6, which is characterized in that at least one described fingerprint sensor chip packet Include multiple optical fingerprint sensor chips of the longitudinal direction setting along the upper surface of the flexible stiffening plate, the flexibility reinforcement The interval region of each pair of adjacent chips of the plate in the multiple optical fingerprint sensor chip is provided with second location hole.

8. fingerprint identification device according to claim 7, which is characterized in that the orifice shapes of the second location hole are length Round or ellipse.

9. fingerprint identification device according to claim 1, which is characterized in that at least one described fingerprint sensor chip packet Multiple optical fingerprint sensor chips are included, the multiple optical fingerprint sensor chip is disposed side by side on the upper table of the support plate Face, to be spliced into an optical fingerprint sensor chip component.

10. fingerprint identification device according to claim 9, which is characterized in that further include:

Circuit board, the circuit board are provided at least one bending in one end close to the multiple optical fingerprint sensor chip Slot, it is adjacent that a bending slot at least one described bending slot corresponds to a pair in the multiple optical fingerprint sensor chip Interval region between chip.

11. fingerprint identification device according to claim 10, which is characterized in that the shape of the bending slot is U-shaped.

12. fingerprint identification device according to claim 1, which is characterized in that the fingerprint identification device further include:

13. fingerprint identification device according to claim 12, which is characterized in that the entering light face of the optical filter is provided with light Learn inorganic plated film or organic melanism coating.

14. fingerprint identification device according to claim 12, which is characterized in that the optical filter and it is described at least one refer to Line sensor chip carries out dispensing in the non-photo-sensing region of at least one fingerprint sensor chip and fixes, and the optical filter There are gaps between the photosensitive region of at least one fingerprint sensor chip；Or the lower surface of the optical filter passes through The glue that refractive index is lower than default refractive index is fixed on the upper surface of at least one fingerprint sensor chip.

15. fingerprint identification device according to claim 12, which is characterized in that further include:

Circuit board, the circuit board are connected by gold thread at least one described fingerprint sensor chip, the height of the gold thread It is respectively lower than the height of the optical filter with the height of the sealing of the gold thread.

16. fingerprint identification device according to claim 1, which is characterized in that the surface roughness of the support plate is greater than 0.25um。

17. fingerprint identification device according to claim 3, which is characterized in that the circuit board is T-type flexible circuit board, And multiple capacitors are provided with above the T-type flexible circuit board, the multiple capacitor is correspondingly connected with described at least one A fingerprint sensor chip.

18. a kind of electronic equipment characterized by comprising

Display screen and the fingerprint identification device as described in any one of claims 1 to 17, the fingerprint identification device setting In the lower section of the display screen to realize fingerprint detection under screen.

19. electronic equipment as claimed in claim 18, which is characterized in that the display screen includes:

Display component；

Light shield layer, the light shield layer are set to the lower section of the display component, and the light shield layer is provided with windowing, and the fingerprint is known Other device by the windowing receive that the display component issues reflected via human finger after the optical signal that is formed, the light Signal is used for fingerprint recognition；

Wherein, the fingerprint identification device is contacted with the lower surface of the display component, alternatively, the fingerprint identification device and institute Stating the lower surface of display component, there are gaps.

20. electronic equipment according to claim 18, which is characterized in that the electronic equipment further include:

Center, the center are used to support the display screen；

Wherein, the upper surface of the center is downwardly extending fluted, and the fingerprint identification device setting is in the groove And there is predetermined gap with the display screen.

21. electronic equipment according to claim 20, which is characterized in that the support plate of the fingerprint identification device has extremely A few location hole, and corresponding at least one location hole of the fingerprint identification device at least one is provided in the groove A positioning column.

22. electronic equipment according to claim 21, which is characterized in that each positioning column at least one described positioning column Cross section shape be circle.

23. electronic equipment according to claim 18, which is characterized in that the electronic equipment further include:

24. electronic equipment according to claim 23, which is characterized in that the thickness of each foam at least one described foam Degree and at least one fingerprint sensor in the distance between the center and the display screen and the fingerprint identification device The distance between chip and the display screen are related.

25. electronic equipment according to claim 24, which is characterized in that at least one refers to described at least one described foam Relationship between line sensor chip is one-to-one relationship.