CN109834518A - 切削方法 - Google Patents

切削方法 Download PDF

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Publication number
CN109834518A
CN109834518A CN201811414646.9A CN201811414646A CN109834518A CN 109834518 A CN109834518 A CN 109834518A CN 201811414646 A CN201811414646 A CN 201811414646A CN 109834518 A CN109834518 A CN 109834518A
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CN
China
Prior art keywords
cutting
machined object
cut
flash
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811414646.9A
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English (en)
Chinese (zh)
Inventor
迈克尔·加德
山本直子
松本幸子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN109834518A publication Critical patent/CN109834518A/zh
Pending legal-status Critical Current

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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
CN201811414646.9A 2017-11-29 2018-11-26 切削方法 Pending CN109834518A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017228868A JP7169061B2 (ja) 2017-11-29 2017-11-29 切削方法
JP2017-228868 2017-11-29

Publications (1)

Publication Number Publication Date
CN109834518A true CN109834518A (zh) 2019-06-04

Family

ID=66883140

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811414646.9A Pending CN109834518A (zh) 2017-11-29 2018-11-26 切削方法

Country Status (2)

Country Link
JP (1) JP7169061B2 (ja)
CN (1) CN109834518A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7442927B2 (ja) * 2019-08-06 2024-03-05 株式会社ディスコ チップの製造方法
JP7325911B2 (ja) 2019-10-16 2023-08-15 株式会社ディスコ 被加工物の加工方法
CN113681404B (zh) * 2021-07-15 2023-10-24 江西伟隆科技有限公司 带有牛皮纸的防火门板基板网格槽开设清理设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130929A (ja) * 2006-11-22 2008-06-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及び半導体装置
CN104139462A (zh) * 2013-05-09 2014-11-12 株式会社迪思科 晶片的切削方法
CN105097678A (zh) * 2014-05-07 2015-11-25 株式会社迪思科 晶片的加工方法
JP2016131189A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ 切削方法及び切削装置
CN105931990A (zh) * 2015-02-27 2016-09-07 株式会社迪思科 切削装置
JP2016181569A (ja) * 2015-03-24 2016-10-13 株式会社ディスコ パッケージ基板の切削方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01310906A (ja) * 1988-06-10 1989-12-15 Fujitsu Ltd 半導体装置の製造方法
JPH0292507A (ja) * 1988-09-29 1990-04-03 Nec Kansai Ltd 切断方法
JP2001345287A (ja) * 2000-05-31 2001-12-14 Hitachi Ltd 半導体装置の製造方法
JP6486710B2 (ja) * 2015-02-23 2019-03-20 株式会社ディスコ 切削装置
JP6545511B2 (ja) * 2015-04-10 2019-07-17 株式会社東芝 処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130929A (ja) * 2006-11-22 2008-06-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及び半導体装置
CN104139462A (zh) * 2013-05-09 2014-11-12 株式会社迪思科 晶片的切削方法
CN105097678A (zh) * 2014-05-07 2015-11-25 株式会社迪思科 晶片的加工方法
JP2016131189A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ 切削方法及び切削装置
CN105931990A (zh) * 2015-02-27 2016-09-07 株式会社迪思科 切削装置
JP2016181569A (ja) * 2015-03-24 2016-10-13 株式会社ディスコ パッケージ基板の切削方法

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Publication number Publication date
JP7169061B2 (ja) 2022-11-10
JP2019102514A (ja) 2019-06-24

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