CN109778127B

CN109778127B - Sputtering device

Info

Publication number: CN109778127B
Application number: CN201811070874.9A
Authority: CN
Inventors: 三泽启太; 阿部大和; 渡部新; 竹见崇; 青沼大介
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2017-11-13
Filing date: 2018-09-14
Publication date: 2022-10-21
Anticipated expiration: 2038-09-14
Also published as: KR102655778B1; JP6876594B2; CN109778127A; KR20190054886A; JP2019090075A

Abstract

Provided is a sputtering device (1) of a magnetron sputtering method, which performs sputtering while forming a magnetic field between a target (100A) and a substrate (50) on which a thin film formed of constituent atoms of the target 100A is formed, and which suppresses adhesion of a coolant to a magnet, the sputtering device being characterized by comprising: a cylindrical target (100A) which is provided at a position facing the substrate (50) and rotates during sputtering; a coolant flow path through which coolant for cooling the target (100A) flows; and a closed container provided in the target (100A), wherein the magnet (151) for forming the magnetic field is disposed in the closed container (100C) so as to be isolated from the coolant flow path.

Description

Sputtering device

Technical Field

The present invention relates to a sputtering apparatus of a magnetron sputtering system.

Background

The following techniques are known: in a sputtering apparatus of the magnetron sputtering method, a target to be a cathode is formed of a cylindrical member and is configured to rotate during sputtering. In this technique, the plasma in the vicinity of the target becomes high in temperature, and the target and the magnet are heated. The target may be damaged if it becomes hot, and the magnet may be demagnetized or demagnetized if it becomes hot. In addition, when the target is composed of a backing tube and a target material bonded to the outer peripheral surface of the backing tube by an adhesive, the adhesive may melt. Therefore, the sputtering apparatus as described above is provided with a cooling liquid channel for cooling the target and the magnet.

However, the sputtering apparatus of the conventional example is configured such that, for example, a magnet is provided in a coolant. Therefore, an operation of wiping off the coolant adhering to the magnet is required at the time of maintenance, which causes deterioration in operability.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2013-100568

Disclosure of Invention

[ problems to be solved by the invention ]

The invention aims to provide a sputtering device for inhibiting cooling liquid from adhering to a magnet.

[ means for solving problems ]

The present invention adopts the following means to solve the above problems.

That is, a sputtering apparatus of the present invention is a magnetron sputtering type sputtering apparatus that performs sputtering while forming a magnetic field between a target and a substrate, and forms a thin film made of constituent atoms of the target on the substrate, the sputtering apparatus including:

the cylindrical target which is provided at a position facing the substrate and rotates during sputtering;

a coolant flow path through which a coolant that cools the target flows; and

a closed container disposed in the target,

the magnet forming the magnetic field is disposed in the sealed container so as to be isolated from the coolant flow path.

[ Effect of the invention ]

According to the present invention, the coolant can be prevented from adhering to the magnet.

Drawings

Fig. 1 is a schematic configuration diagram of a sputtering apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic diagram showing an arrangement structure of magnets according to an embodiment of the present invention.

Fig. 3 is a schematic configuration diagram of a rotary cathode according to an embodiment of the present invention.

Fig. 4 is a schematic configuration diagram of a rotary cathode according to an embodiment of the present invention.

Fig. 5 is a front view of the first cover of the embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of the first cover of the embodiment of the present invention.

Fig. 7 is a front view of the second cover of the embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of a second cover of the embodiment of the present invention.

Fig. 9 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Fig. 10 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Fig. 11 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Fig. 12 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Fig. 13 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Fig. 14 is an explanatory view of an assembly sequence of the magnet device according to the embodiment of the present invention.

Detailed Description

Hereinafter, a mode for carrying out the present invention will be described in detail by way of example based on the embodiments with reference to the accompanying drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative arrangement, and the like of the constituent members described in the embodiments do not mean that the scope of the present invention is limited to these.

(examples)

A magnetron sputtering system sputtering apparatus according to an embodiment of the present invention will be described with reference to fig. 1 to 14.

< overall Structure of sputtering apparatus >

The overall configuration of the sputtering apparatus 1 of the present embodiment will be described with reference to fig. 1 and 2. Fig. 1 is a schematic configuration diagram of a sputtering apparatus according to an embodiment of the present invention, and shows a schematic configuration of the entire sputtering apparatus when viewed in cross section. The upper side in fig. 1 corresponds to the upper side in the vertical direction when the sputtering apparatus 1 is used, and the lower side in fig. 1 corresponds to the lower side in the vertical direction when the sputtering apparatus 1 is used. Fig. 2 is a schematic diagram showing an arrangement structure of magnets.

The sputtering apparatus 1 of the present embodiment includes a chamber 20 capable of bringing the inside into a low-pressure state, and a rotating cathode 10 provided at the upper portion in the chamber 20. The chamber 20 of the present embodiment also functions as an anode. Further, a mounting table 30 is provided at a lower portion in the chamber 20, and a substrate 40 for forming a thin film is mounted on the mounting table 30. The mounting table 30 is configured to be able to carry the substrate 40 to a desired position.

The rotating cathode 10 includes a cylindrical target 100A serving as a cathode, and a magnet device 100B provided inside the target 100A. As the target 100A, any of the following types can be applied: a type In which a target material is bonded to the outer peripheral surface of a backing tube made of SUS or Ti with an adhesive such as In, or an integral type In which the backing tube and the target material are integrated. Further, the target 100A is constituted as follows: is provided at a position facing the substrate 40 mounted on the mounting table 30 and rotates during sputtering. The magnet device 100B includes a magnet unit 150, and the magnet unit 150 includes a magnet 151. Fig. 2 is a view of the magnet 151 in fig. 1 as viewed from below. The magnet 151 is disposed such that two different magnetic poles (a first magnetic pole 151a and a second magnetic pole 151 b) face downward when in use. In the illustrated example, the first magnetic pole 151a is an N pole and the second magnetic pole 151b is an S pole, but the first magnetic pole 151a may be an S pole and the second magnetic pole 151b may be an N pole. The second magnetic pole 151b is spaced apart from the first magnetic pole 151a and surrounds the first magnetic pole 151 a. The magnet 151 of the present embodiment is configured by arranging a plurality of magnets (see fig. 9, 10, 11, and 13). By providing the magnet device 100B in the target 100A in this manner, a magnetic field (leakage magnetic field) is formed between the target 100A and the substrate 50.

In the sputtering apparatus 1 configured as described above, a voltage of a predetermined value or more is applied between the target 100A and the chamber 20 as an anode, thereby generating plasma therebetween. Then, positive ions in the plasma collide with the target 100A, whereby particles of the target material are emitted from the target 100A. The particles discharged from the target 100A repeatedly collide with each other, and neutral atoms of the target substance in the discharged particles are deposited on the substrate 40. Thereby, a thin film composed of the constituent atoms of the target 100A is formed on the substrate 40. In the sputtering apparatus 1 of the present embodiment, the leakage magnetic field can concentrate plasma in the vicinity indicated by P in fig. 1 (the vicinity where a magnetic field substantially parallel to the target 100A is formed). This allows efficient sputtering, and therefore, the deposition rate of the target substance onto the substrate 40 can be increased. In the sputtering apparatus 1 of the present embodiment, the target 100A is configured to rotate during sputtering. This prevents a worn region (erosion region due to erosion) of target 100A from being partially concentrated, and improves the utilization efficiency of target 100A.

< rotating cathode >

Referring to fig. 3 to 8 in particular, the rotary cathode 10 of the present embodiment will be described in more detail. Fig. 3 and 4 are schematic structural views of the rotary cathode 10 according to the embodiment of the present invention, and show a schematic structure of the rotary cathode 10 when viewed in cross section. Fig. 3 is a diagram for explaining a rotation mechanism for rotating the target 100A in the cathode 10, and mainly shows components related to the rotation mechanism in a simplified manner, and components not related to the rotation mechanism are appropriately omitted. Fig. 4 is a diagram for explaining the coolant flow path in the rotating cathode 10, and mainly shows the components related to the coolant flow path in a simplified manner, and the components not related to the coolant flow path are appropriately omitted. Fig. 5 is a front view of the first cover according to the embodiment of the present invention (corresponding to a view seen from the left side in fig. 4). Fig. 6 is a schematic cross-sectional view of the first cover according to the embodiment of the present invention, which corresponds to the cross-sectional view SS of fig. 5. Fig. 7 is a front view of the second cover according to the embodiment of the present invention (corresponding to a view seen from the right side in fig. 4). Fig. 8 is a schematic sectional view of the second cover of the embodiment of the present invention, corresponding to the section TT in fig. 7.

The rotary cathode 10 includes: a rotary cathode device main body 100 having a target 100A; an endblock 200 having a function of rotating the target 100A; and a support block 300 having a function of rotatably supporting the target 100A.

The rotary cathode device main body 100 includes a target 100A, a magnet device 100B provided in the target 100A, and a support block-side annular member 100D fixed to the target 100A and rotatably supported by the support block 300. The magnet device 100B includes a sealed container 100C and a magnet unit 150 (not shown in fig. 3 to 8) provided in the sealed container 100C. Further, a pipe 160 is provided in the closed casing 100C.

The end block 200 includes a case 210 fixed to the chamber 20, a shaft-like member 220 provided in the case 210, and an end block-side ring member 230 provided rotatably with respect to the shaft-like member 220. A rotating pulley 240 is fixed to the end block-side annular member 230. A belt 250 rotated by a motor 260 is wound around the rotating pulley 240. Further, a pair of bearings B is provided between the shaft-like member 220 and the end-block-side annular member 230. Thereby, the end-block-side annular member 230 can rotate relative to the shaft-like member 220. Further, a sealing means 270 is provided, and the sealing means 270 seals an annular gap between the shaft-like member 220 and the end-block-side annular member 230. The sealing means 270 has a function of sealing the annular gap by enabling relative rotation between the shaft-like member 220 and the end-block-side annular member 230. The magnet device 100B and the shaft-like member 220 are coupled by a coupling member 280 such as a pin. Therefore, the magnet device 100B does not rotate with respect to the shaft-like member 220. Further, the endblock-side ring member 230 and the target 100A are fixed by a fastening member 290 such as a clamp. Further, a gasket G for sealing an annular gap between the end block side annular member 230 and the target 100A is provided. Further, a bearing B and a seal 275 are provided between the case 210 and the end-block-side annular member 230. Therefore, the end-block-side annular member 230 can rotate relative to the case 210, and the annular gap between the case 210 and the end-block-side annular member 230 is sealed. This can maintain the interior of the housing 210 in a low-pressure state.

The support block 300 is fixed relative to the chamber 20. The support block-side annular member 100D is provided with a shaft portion 100D1, and the shaft portion 100D1 is inserted into a through hole 310 formed in the support block 300. By providing the bearing B between the shaft portion 100D1 and the through hole 310, the support block-side annular member 100D can rotate relative to the support block 300. Further, the support block-side annular member 100D is provided with a bearing hole 100D2, and the bearing hole 100D2 is used to allow the support block-side annular member 100D to rotate with respect to the magnet device 100B. By providing the bearing B on the inner circumferential surface side of the bearing hole 100D2, the support block side annular member 100D can rotate relative to the magnet device 100B. Further, a sealing device 100D3 is provided on the inner circumferential surface side of the bearing hole 100D2, and the sealing device 100D3 is used for suppressing leakage of the coolant to the bearing B side. The sealing device 100D3 has a function of sealing an annular gap between the magnet device 100B and the support block side annular member 100D by relatively rotating the two members. The support block-side annular member 100D and the target 100A are fixed by a fastening member 100D4 such as a clamp. Further, a packing G that seals an annular gap between the support block side annular member 100D and the target 100A is also provided.

According to the rotary cathode 10 configured as described above, the endblock-side annular member 230, the target 100A, and the support block-side annular member 100D are rotated by the belt 250 rotated by the motor 260. At this time, the shaft-like member 220 and the magnet device 100B do not rotate.

Next, the structure of the coolant flow path will be described with reference to fig. 4 to 8. Inside the shaft-like member 220, a first flow path 221 connected to a supply pipe 221a and a second flow path 222 connected to a discharge pipe 222a are formed so as to extend in the axial direction. The sealed container 100C includes a sealed container body 110 and a pair of lid bodies (hereinafter, referred to as "first lid body 120 and second lid body 130") fixed to both ends of the sealed container body 110. In addition, as described above, the pipe 160 is provided in the closed casing 100C.

The first cover 120 is described in more detail with particular reference to fig. 5 and 6. In fig. 6, the bearing B, the sealing device 100D3, and the pipe 160 are shown by broken lines in a state where the rotary cathode 10 is assembled. The first cover 120 includes a shaft portion 121, into which the shaft portion 121 is inserted into the bearing hole 100D2 of the support block-side annular member 100D, and an insertion hole 122, into which the pipe 160 is inserted. The bearing B and the sealing device 100D3 are provided in an annular gap between the shaft portion 121 and the bearing hole 100D 2. In the present embodiment, two tubes 160 are provided, and two insertion holes 122 are also provided. An annular gap between the insertion hole 122 and the tube 160 is sealed by a packing G (e.g., an O-ring). The first lid 120 is provided with a plurality of insertion holes 123, and shaft portions such as bolts for fixing the first lid 120 to the closed casing body 110 are inserted through the insertion holes 123.

The second cover 130 is described in more detail with reference to fig. 7 and 8. In fig. 8, the shaft-like member 220 and the tube 160 are shown by broken lines in a state where the rotary cathode 10 is assembled. The second cover 130 is provided with two insertion holes 131 into which the tubes 160 are inserted. Further, an annular gap between the insertion hole 131 and the tube 160 is sealed by a packing G (e.g., an O-ring). In addition, the second cover 130 is provided with a connecting flow path hole 132, and the connecting flow path hole 132 connects the flow path formed by the two insertion holes 131 with the second flow path 222 in the shaft-like member 220. In addition, an annular gap between the outer peripheral surface of the annular portion forming the second flow passage 222 and the inner peripheral surface of the flow passage hole 132 is sealed by a gasket G (e.g., an O-ring). In addition, the second cover 130 is provided with a fitting hole 133, the fitting hole 133 is fitted with a coupling member 280, and the coupling member 280 couples the magnet device 100B and the shaft-like member 220. The second lid 130 is provided with a plurality of insertion holes 134 through which shaft portions of bolts or the like for fixing the second lid 130 to the closed casing main body 110 are inserted.

With the above configuration, the pipe 160 provided in the closed casing 100C forms the coolant flow path that passes through the inside of the closed casing 100C from the outside of one end side of the closed casing 100C to the outside of the other end side of the closed casing 100C. In addition, the annular gap between the target 100A and the closed casing main body 110 also serves as a part of the coolant flow path.

With the cooling liquid channel configured as described above, the cooling liquid supplied from the supply pipe 221a flows through the first channel 221 of the shaft-like member 220 into the annular gap between the target 100A and the closed casing main body 110. Then, the coolant passes through the tube 160 from the insertion hole 122 of the first cover 120, and further passes through the second flow path 222 of the shaft-like member 220 from the connection flow path hole 132 of the second cover 130 to the discharge pipe 222a (see the arrow in fig. 4). In addition, the direction of the flow of the coolant may be opposite to the direction of the arrows in fig. 4. In this case, the discharge pipe 222a and the supply pipe 221a in the figure may be used as a supply pipe and a discharge pipe, respectively.

Such a coolant flow path can suppress leakage of the coolant to the outside of the apparatus and also can suppress leakage of the coolant to the space in which the magnet unit 150 and the like are arranged in the sealed container 100C.

< magnet device >

A magnet device 100B according to the present embodiment will be described with reference to fig. 9 to 14. Fig. 9 to 14 are views for explaining an assembly procedure of the magnet device 100B according to the embodiment of the present invention. In fig. 9 to 11 and 13, for convenience of explanation, the components of the sealed container 100C constituting the magnet device 100B are schematically illustrated as a cross-sectional view obtained by cutting the sealed container 100C on a plane including the central axis of the sealed container 100C, and the magnet unit 150 is schematically illustrated as a side view. Fig. 12 and 14 schematically show cross-sectional views of the magnet device 100B cut on a plane perpendicular to the center axis of the sealed container 100C.

As described above, the sputtering apparatus 1 of the present embodiment forms a magnetic field between the target 100A and the substrate 50 by the magnetron sputtering method (see fig. 1). In order to concentrate plasma at an appropriate position, the surface of the magnet 151 needs to be sufficiently close to the inner peripheral surface of the target 100A. However, the magnet unit 150 is heavy, and when the magnet unit 150 is carried into the sealed container 100C, the magnet 151 and the sealed container 100C may be damaged by sliding. This may damage the respective members or reduce the sealing performance of the sealed container 100C. Therefore, in the sputtering apparatus 1 of the present embodiment, the following configuration (mechanism) is adopted: when the magnet device 100B is carried into the sealed container 100C or when it is carried out from the sealed container 100C, the surface of the magnet 151 can be brought sufficiently close to the inner peripheral surface of the sealed container main body 110 while suppressing sliding of the respective members. Further, the surface of the magnet 151 is brought close to the inner peripheral surface of the closed container main body 110, whereby the surface of the magnet 151 is brought close to the inner peripheral surface of the target 100A.

The magnet device 100B includes a sealed container 100C provided in the target 100A, and a magnet unit 150 provided in the sealed container 100C.

As described above, the closed casing 100C includes the closed casing main body 110, and the first lid 120 and the second lid 130 fixed to both ends of the closed casing main body 110, respectively. The closed casing main body 110 has a cylindrical portion 111 and a pair of

inward flange portions

112 and 113 formed at both ends of the cylindrical portion 111. The sealed container 100C includes a pair of

end face seals

112a, 113a, and the

end face seals

112a, 113a seal between the end faces of the pair of

inward flanges

112, 113 and the end faces of the pair of first lid 120, second lid 130, respectively. In the present embodiment, the

end face seals

112a and 113a are attached to annular attachment grooves provided in the pair of

inward flange portions

112 and 113, respectively. However, annular mounting grooves may be provided in the first cover 120 and the second cover 130, respectively, and the

end seals

112a and 113a may be mounted in these mounting grooves, respectively. Various seal rings made of an elastic body (an O-ring having a circular cross-sectional shape, a square ring having a rectangular cross-sectional shape, or the like) can be applied to the end face seals 112a and 113 a.

The magnet unit 150 is formed by unitizing the magnet 151 and a support member 152 that supports the magnet 151. More specifically, the magnet unit 150 includes a plurality of magnets 151, a support member 152, a plurality of thin plates 153 for adjusting the distance between the magnets 151 and the support member 152, and a plurality of bearing portions 154. The support member 152 is integrally provided with a horizontal plate portion 152a that is set horizontally when installed, and a vertical plate portion 152b that extends from the center of the horizontal plate portion 152a to the side opposite to the side where the magnet 151 is installed. As a result, as shown in fig. 12 and 14, the cross-sectional shape of the support member 152 is a T-shape. A plurality of bearings 154 are provided on both sides of the vertical plate portion 152b of the support member 152. The bearing portion 154 of the present embodiment is constituted by a roller that is rotatable.

Inside the closed casing 100C, a guide member 140 is provided, both ends of which are fixed to the first lid 120 and the second lid 130, respectively. The guide member 140 is composed of a flat plate-shaped guide rail portion 141, a pair of flat plate-shaped support portions 142, and a pair of coupling portions 143 that couple the guide rail portion 141 and the pair of support portions 142. The guide rail portion 141 functions to guide the bearing portion 154 in the magnet unit 150. That is, when the magnet unit 150 is carried into the sealed container 100C or when the magnet unit 150 is carried out from the sealed container 100C, the surface of the guide rail portion 141 facing the support portion 142 constitutes a guide portion 141a that guides the bearing portion 154. Further, the support portion 142 functions to position and support the bearing portion 154 of the magnet unit 150. That is, the surface of the support portion 142 facing the guide rail portion 141 is configured as a positioning portion 142a at the time of sputtering, and the positioning portion 142a performs positioning of the magnet unit 150 with respect to the radial direction of the closed casing 100C. Further, by placing the bearing portion 154 on the positioning portion 142a, the magnet unit 150 is positioned in the radial direction with respect to the closed casing 100C (see fig. 14).

According to the guide member 140 configured as described above, the guide portion 141a and the positioning portion 142a are provided in an opposing manner. A gap is formed between the pair of support portions 142, and the vertical plate portion 152b of the support member 152 in the magnet unit 150 is configured to enter the gap (see fig. 12 and 14). The distal end portions 142b of the pair of support portions 142 function as stoppers for restricting the movement of the vertical plate portion 152b of the support member 152 in the left-right direction. The two pipes 160 are provided inside the sealed container 100C at positions that do not interfere with the guide member 140 and the magnet unit 150.

Next, the assembly procedure of the magnet device 100B will be described. The assembly process of the magnet device 100B of the present embodiment includes a loading process of loading the magnet unit 150 into the sealed container 100C and an inverting process of inverting the sealed container 100C. First, the carrying-in step will be explained. Fig. 9 to 12 are explanatory views of the carrying-in process. In fig. 9 to 11, for convenience of explanation, the position of the guide rail portion 141 in the guide member 140 is indicated by a broken line.

Fig. 9 shows a state immediately after the magnet unit 150 starts to be loaded into the hermetic container 100C. Before the carrying-in step, the first lid 120 is fixed to the closed container main body 110. Then, the magnet unit 150 is carried into the interior of the closed casing main body 110 so that the bearing portion 154 provided on the leading end side in the carrying-in direction among the plurality of bearing portions 154 of the magnet unit 150 is caused to jump over the guide portion 141a of the rail portion 141. Then, the magnet unit 150 is further pressed into the hermetic container main body 110. At this time, the bearing portion 154, which is a roller, rolls along the guide portion 141a, and thus the magnet unit 150 is guided to an appropriate position inside the closed casing main body 110. Fig. 10 shows a state in which the magnet unit 150 is being pushed in, and fig. 11 shows a state in which the magnet unit 150 is being pushed in to an appropriate position (a state at the end of the carrying-in process). Fig. 12 is a schematic cross-sectional view of the magnet device 100B after the loading step.

In the present embodiment, the magnet unit 150 is carried into the closed casing 100C from the side of the inward flange 112 on the right side in fig. 9 to 11, among the

inward flanges

112 and 113 at both ends of the cylindrical portion 111 in the closed casing main body 110. In the maintenance, similarly, the magnet unit 150 is carried out from the closed casing 100C from the inward flange 112 side on the right side in the drawing. The size and shape of the inner circumferential side end portion of the inward flange portion 112 are designed as follows: when the magnet unit 150 is carried in and out, the magnet unit 150 does not get caught on the inward flange 112. Therefore, when the inside of the cylindrical portion 111 is viewed straight from the outside of the inward flange 112, the surface of the guide portion 141a of the guide rail portion 141 can be seen. Further, L1 represents the maximum value of the radial distance between the inner circumferential end of the inward flange 112 and the outer circumferential surface of the cylindrical portion 111, and L3> L1 represents the maximum value of the radial distance between the surface of the magnet 151 and the outer circumferential surface of the cylindrical portion 111 in a state where the bearing portion 154 is placed on the guide portion 141a.

Next, the reverse process will be described. Fig. 13 and 14 are explanatory views of the reversing step, showing a state after the reversing step. In fig. 13, for convenience of explanation, the position of the support portion 142 in the guide member 140 is indicated by a broken line. After the magnet unit 150 is carried into a predetermined position, the sealed container 100C is rotated 180 ° around the center axis of the sealed container 100C. For example, the closed casing 100C can be inverted by rolling the closed casing 100C on the mat. As a result, the magnet unit 150 naturally falls from the state in which the bearing portion 154 is placed on the guide portion 141a of the guide member 140, and the bearing portion 154 is placed on the positioning portion 142a of the guide member 140. Thereby, the magnet 151 is in a state sufficiently close to the inner peripheral surface of the cylindrical portion 111 of the closed casing main body 110. In a state where the bearing portion 154 is placed on the positioning portion 142a, if the maximum radial distance between the surface of the magnet 151 and the outer circumferential surface of the cylindrical portion 111 is L2, L1> L2 is satisfied.

After the inversion process, the second lid 130 is fixed to the closed casing main body 110. However, the inversion process may be performed after the second lid 130 is fixed to the closed casing main body 110. In addition, when the entire magnet unit 150 or various members constituting the magnet unit 150 are replaced during maintenance, the above-described steps may be performed in reverse.

Here, the carrying-in step and the reversing step can be performed by manual operations by an operator. However, in these steps, a jig may be used for the purpose of improving the workability. Alternatively, an apparatus for automatically performing these steps may be used.

< advantages of the sputtering apparatus of the present embodiment >

According to the sputtering apparatus 1 of the present embodiment, the magnet 151 for forming a magnetic field for concentrating plasma is disposed in the closed container 100C so as to be isolated from the coolant flow path. This can suppress the coolant from adhering to the magnet 151. Therefore, the operability at the time of maintenance can be improved.

Further, according to the sputtering apparatus 1 of the present embodiment, when the magnet apparatus 100B is carried into the closed container 100C or the like, the surface of the magnet 151 can be brought sufficiently close to the inner peripheral surface of the target 100A while suppressing the sliding of each member.

(others)

In the present embodiment, the structure of the following case is shown: the guide member 140 is provided with a guide rail portion 141 having a guide portion 141a for guiding the bearing portion 154, and a support portion 142 having a positioning portion 142a for positioning and supporting the bearing portion 154. However, the present invention is not limited to such a configuration, and may be configured as follows: the guide rail portion having the guide portion and the support portion having the positioning portion are constituted by different members.

In addition, in the present embodiment, the following configuration is shown: the bearing portion 154 is guided by the guide portion 141a of the rail portion 141 and positioned and supported by the positioning portion 142a of the support portion 142. However, the present invention is not limited to such a configuration, and the following configuration may be adopted: a portion positioned and supported by the positioning portion of the supporting portion is provided separately from the bearing guided by the guide portion of the guide rail portion.

In the present embodiment, the bearing portion 154 is formed of a rotatable roller. However, the bearing in the present invention is not limited to a rolling bearing such as a roller, and a sliding bearing may be used.

Description of the symbols

1 … sputtering device, 10 … rotating cathode, 10a … target, 100 … rotating cathode device body, 100a … target, 100B … magnet device, 100C … closed container, 140 … guide member, 150 … magnet unit, 151 … magnet, 200 … end block, 300 … support block.

Claims

1. A sputtering apparatus of magnetron sputtering system for performing sputtering while forming a magnetic field between a target and a substrate, the sputtering apparatus being characterized in that a thin film formed of constituent atoms of the target is formed on the substrate,

the disclosed device is provided with:

the cylindrical target, the said target is set up in the position opposite to said base plate, and rotate while sputtering;

a cooling liquid flow path through which a cooling liquid that cools the target flows; and

a closed container disposed in the target,

a magnet forming the magnetic field is disposed in the sealed container so as to be isolated from the coolant flow path,

a magnet unit that unitizes the magnet and a support member that supports the magnet,

the magnet unit is provided with a bearing portion, and,

the closed container is provided with a guide portion that guides the bearing portion when the magnet unit is carried into the closed container and when the magnet unit is carried out of the closed container.

2. The sputtering apparatus according to claim 1,

the closed container has:

a closed container body having a cylindrical portion and a pair of inward flange portions formed at both ends of the cylindrical portion;

a pair of lid bodies fixed to both ends of the closed container main body, respectively; and

and a pair of end face seals that seal between respective end faces of the pair of inward flange portions and respective end faces of the pair of lid bodies, respectively.

3. The sputtering apparatus according to claim 1,

a positioning portion that performs positioning of the magnet unit in a radial direction with respect to the closed container during sputtering is provided in the closed container.

4. The sputtering apparatus according to claim 3,

the guide portion is opposed to the positioning portion.

5. The sputtering apparatus according to claim 3,

the positioning of the magnet unit is performed by placing the bearing portion on the positioning portion.

6. The sputtering apparatus according to claim 5,

a guide member having a flat-plate-shaped guide rail portion for guiding the bearing portion, a flat-plate-shaped support portion for positioning and supporting the bearing portion, and a coupling portion for coupling the guide rail portion and the support portion is provided in the closed casing,

in the opposing surface of the guide rail portion and the support portion, the surface on the guide rail portion side is the guide portion, and the surface on the support portion side is the positioning portion.

7. The sputtering apparatus according to claim 4,

the closed container is rotated by 180 ° around the center axis of the closed container from the state where the bearing portion is placed on the guide portion, and thereby the magnet unit naturally falls down to be in the state where the bearing portion is placed on the positioning portion.

8. The sputtering apparatus according to claim 3,

the closed container has:

a pair of end face seals that seal between respective end faces of the pair of inward flange portions and respective end faces of the pair of lid bodies,

a maximum value of a radial distance between an inner circumferential end of the inward flange on a side where the magnet unit is carried into and out of the closed container and an outer circumferential surface of the cylindrical portion, of the pair of inward flanges, is set to L1,

assuming that a maximum value of a radial distance between the magnet surface and the outer circumferential surface of the cylindrical portion in a state where the bearing portion is placed on the positioning portion is L2,

l2 is more than L1.

9. The sputtering apparatus according to claim 1 or 2,

the closed casing is provided with a pipe that forms a part of the coolant flow path so as to pass through the inside of the closed casing from the outside of one end of the closed casing to the outside of the other end of the closed casing.

10. The sputtering apparatus according to claim 1,

an annular gap between the target and the closed casing main body forms a part of the coolant flow path.