CN109768186B - Preparation method of flexible electronic device substrate and preparation method of flexible electronic device - Google Patents
Preparation method of flexible electronic device substrate and preparation method of flexible electronic device Download PDFInfo
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- CN109768186B CN109768186B CN201811622012.2A CN201811622012A CN109768186B CN 109768186 B CN109768186 B CN 109768186B CN 201811622012 A CN201811622012 A CN 201811622012A CN 109768186 B CN109768186 B CN 109768186B
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Abstract
The invention provides a preparation method of a flexible electronic device substrate, which comprises the following steps: providing a mixed solution of a prepolymer and a light curing agent; providing a light source which can be programmed graphically; forming the light source into a light source pattern associated with the functional structure of the flexible electronic device; and irradiating and curing the prepolymer and the light curing agent mixed solution by using a light source to form a flexible substrate with a surface concave-convex part or an internal channel, wherein the shape of the formed surface concave-convex part or the internal channel corresponds to the shape of the functional structure of the flexible electronic device to be prepared. The invention also provides a preparation method of the flexible electronic device, which comprises the steps of filling functional materials corresponding to the functions of the flexible electronic device in the concave-convex part on the surface of the flexible substrate or the internal channel after preparing the flexible substrate with the concave-convex part on the surface or the internal channel, and obtaining the required flexible electronic device. In the processing process, the flexible substrate is formed at one time, so that the processing is convenient and the sealing performance is good.
Description
Technical Field
The invention relates to the field of flexible equipment manufacturing, in particular to a method for preparing a flexible electronic device substrate and a method for preparing a flexible electronic device.
Background
In the field of traditional electronic printing, the preparation of electronic circuits requires very complicated procedures, and the preparation process is accompanied by a plurality of problems such as resource waste, environmental pollution and the like. In the field of flexible electronics, the procedure is more complex, and electronic devices of specific shapes can be prepared only by preparing a mold through etching.
At present, flexible device substrates are all formed based on molds, and the preparation process of the molds is complex, cannot be reused and has no editability. For a substrate with a complex structure, the manufacturing process is mostly based on multi-component assembly splicing and sandwich structure forming, and one-step forming cannot be achieved.
The foregoing description is provided for general background information and is not admitted to be prior art.
Disclosure of Invention
The invention aims to provide a preparation method of a flexible electronic device substrate and a preparation method of a flexible electronic device.
The invention provides a preparation method of a flexible electronic device substrate, which comprises the following steps: providing a mixed solution of a prepolymer and a light curing agent; providing a light source which can be programmed graphically; forming the light source into a light source pattern associated with the functional structure of the flexible electronic device; and irradiating and curing the prepolymer and the light curing agent mixed solution by using a light source to form a flexible substrate with a surface concave-convex part or an internal channel, wherein the shape of the formed surface concave-convex part or the internal channel corresponds to the shape of the functional structure of the flexible electronic device to be prepared.
Further, the prepolymer includes a liquid monomer or a liquid oligomer of a photosensitive resin.
Further, the light source irradiates one surface of the mixed solution to form a flexible substrate having a surface concave-convex portion.
Further, the curing speed of different parts of the mixed solution is controlled to form the concave-convex parts on the surface of the flexible substrate when the mixed solution is cured.
Further, the light source irradiates the mixed solution on both sides to form a flexible substrate with an internal channel.
Further, the illumination wavelength of the light source is selected according to the type of the light curing agent.
Further, the illumination intensity of the light source is selected according to the three-dimensional shape of the functional structure of the flexible electronic device.
Further, the irradiation time period of the light source is determined according to the curing time required for the prepolymer.
Further, a light ray parallel lens is arranged in front of the light source along the light ray advancing direction and used for converting transmitted light rays into parallel light rays, and the parallel light rays are perpendicular to the surface of the mixed solution.
Furthermore, a pattern magnifying lens is further arranged in front of the light source in the light traveling direction, and the pattern magnifying lens is arranged between the light source and the light parallel lens and used for magnifying the pattern irradiated by the light source.
The invention provides a preparation method of a flexible electronic device, which comprises the following steps: after the flexible substrate with the surface concave-convex part or the internal channel is prepared by the preparation method, the functional material corresponding to the function of the flexible electronic device is filled in the surface concave-convex part or the internal channel of the flexible substrate, and the flexible electronic device is obtained.
Further, the preparation method comprises the following steps of before filling the functional material: and removing the uncured mixed solution in the concave-convex part on the surface or the internal channel.
Further, the functional material is a fluid material.
Further, the fluid material includes liquid metal, non-newtonian fluid, conductive metal paste, carbon nano paste, and organic conductive liquid.
Further, when the surface concave-convex part or the internal channel of the flexible substrate is filled with the fluid material, the fluid material is injected by a syringe.
The invention has at least one of the following beneficial effects:
1. the invention adopts the illumination curing mode to form the flexible substrate with the concave-convex part on the surface or the internal channel to obtain the flexible substrate of the required flexible electronic device, and functional materials are injected into the concave-convex part on the surface or the internal channel of the formed flexible substrate to obtain the required flexible electronic device.
2. The invention realizes the imaging of the concave-convex part on the surface or the internal channel of the flexible substrate through the imaging of the light source, has flexible processing mode, can form the flexible substrates with different structures without a forming die, and is particularly suitable for processing the flexible substrates with complex structures.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a flexible electronic device according to a first embodiment of the present invention.
FIG. 2 is a schematic representation of a single-sided radiation curing protocol.
FIG. 3 is a schematic representation of a dual-sided irradiation curing protocol.
FIG. 4 is a schematic view of a light source and a lens module in front of the light source.
Fig. 5 is a schematic view of injecting a functional material into an internal channel of a flexible substrate using a syringe.
Fig. 6 (a) and 6 (b) are schematic diagrams of the brightness of the light source pattern and the depth of the formed trench in the flexible substrate.
Fig. 7 (a) to 7 (d) are schematic views of the formed flexible substrate.
FIG. 8 is a schematic diagram of an appearance of an uniaxially stretchable impact-resistant flexible device fabricated according to a second embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
First embodiment
Referring to fig. 1, a flexible electronic device and a method for manufacturing a substrate of the flexible electronic device provided in an embodiment of the present invention include a flexible substrate having a surface concave-convex portion or an internal channel, and a functional structure located in the surface concave-convex portion or the internal channel, where the method includes:
step S10: providing a mixed solution of a prepolymer and a light curing agent;
step S20: providing a light source which can be programmed graphically;
step S30: forming the light source into a light source pattern associated with the functional structure of the flexible electronic device;
step S40: and irradiating and curing the prepolymer and the light curing agent mixed solution by using a light source to form a flexible substrate with a surface concave-convex part or an internal channel, wherein the shape of the formed surface concave-convex part or the internal channel corresponds to the shape of the functional structure of the flexible electronic device to be prepared.
The method for manufacturing a flexible electronic device provided by the embodiment of the invention further comprises the following steps after the flexible substrate with the surface concave-convex part or the internal channel is manufactured and formed:
step S50: filling functional materials corresponding to the functions of the flexible electronic device in the concave-convex part on the surface of the flexible substrate or the internal channel;
step S60: the desired flexible electronic device is obtained.
In step S10, the mixed solution of the prepolymer and the light curing agent is provided and placed in a container and on a light platform. The carrier vessel in this embodiment may be an existing wide-mouth container (e.g., a rectangular or circular beaker, a culture dish, etc.), or may be a sheet-like carrier vessel, e.g., a glass slide, a plastic sheet, etc., when the carrier vessel is a sheet-like carrier vessel, a liquid with high viscosity may be poured around the carrier vessel to serve as an intercepting wall, so as to prevent the liquid with low viscosity from flowing around, and of course, if the liquid in the carrier vessel has high viscosity, the intercepting wall may not be poured. It will be appreciated that the vessel is preferably a transparent container for ease of light transmission, and the material of the vessel may be selected as desired, for example, glass, PU (polyurethane), PDMS (polydimethylsiloxane), etc. The height of the mixed solution in the vessel can be designed according to the thickness of the flexible substrate to be prepared.
In step S10, the prepolymer in the field of flexible electronic device preparation is mainly a photosensitive resin material, which may be a liquid monomer or a liquid oligomer of a certain photosensitive resin, and when irradiated by light, the prepolymer reacts with a light curing agent to form a high polymer of the photosensitive resin, so as to complete the change from a liquid state to a solid state. The prepolymers of the present invention may include epoxies, acrylates, polyester resins, phenolic resins, and the like. The epoxy resin material includes bisphenol a type epoxy resin (DGEBA resin), bisphenol S type epoxy resin (DGEBS resin), etc., and the acrylate material includes polymethacrylate, urethane acrylate, etc.
In step S10, the provided light curing agent is also called a photoinitiator, and the light curing agent molecules have a certain light absorption capability for light with a specific wavelength, such as ultraviolet light (wavelength is 250 to 400 nm), visible light (wavelength is 400 to 800 nm), infrared light, laser light, or chemical fluorescence, and after directly or indirectly absorbing light energy, the light curing agent molecules can transition from a ground state to an excited singlet state and transition from an intersystem to an excited triplet state; after excitation of the singlet or triplet state by unimolecular or bimolecular chemistry, active fragments are generated which can initiate polymerization of the monomer, these active fragments can be radicals, cations, anions, etc. The photo-curing agent can be classified into a radical polymerization photo-curing agent and a cationic photo-curing agent according to the difference of the initiation mechanism. According to the structural characteristics, the light curing agent can include the following types: 1. benzoin and derivatives thereof (including benzoin, benzoin dimethyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin butyl ether, etc.); 2. benzils (including diphenylethanone, alpha-dimethoxy-alpha-phenylacetophenone); 3. alkylphenones (including α, α -diethoxyacetophenone, α -hydroxyalkylphenone, α -aminoalkylphenone); 4. acylphosphine oxides (including aroylphosphine oxides, bis-benzoylphenylphosphine oxides); 5. benzophenones (including benzophenone, 2,4-dihydroxybenzophenone, michler's ketone); 6. thioxanthones (including thiopropoxy thioxanthone, isopropyl thioxanthone).
In step S10, the materials of the provided prepolymer and the light curing agent are selected according to the substrate material of the flexible electronic device to be prepared, and the mass percentage (wt%) of the prepolymer and the light curing agent can be determined according to the elastic modulus (i.e. the stretching degree or the bending degree) of the substrate of the flexible electronic device to be prepared, in this embodiment, the mass percentage of the prepolymer and the light curing agent is 94 to 1, for example, the mass percentage of the polyacrylate and the Ingacure 819 light curing agent is 95:5 to 99:1, the mass percentage of the polyacrylate to the Irgacure 250 is 94:6 to 98:2. if more light curing agent is added, the formed flexible substrate is hard and is not easy to stretch or bend, and if less light curing agent is added, the formed flexible substrate is soft and is easy to stretch or bend.
In step S10, the prepolymer and the light curing agent may be mixed uniformly and then poured onto a container, or the prepolymer and the light curing agent may be put into the container and then mixed uniformly.
In step S10, since the white light has a wide wavelength coverage and contains a wavelength band that can cure the mixed solution of the prepolymer and the light-curing agent, the present invention preferably employs the preparation of the mixed solution in a yellow room in order to ensure that the mixed solution is not cured during the mixing process.
As shown in fig. 2 and 3, in step S20, the provided light source 11 includes a single-sided light source and a double-sided light source, and if the provided light source 11 is a single-sided light source, the light source 11 is located at the upper side or the lower side of the illumination platform 12, and if the provided light source 11 is a double-sided light source, the light source 11 is located at the upper side and the lower side of the illumination platform 12. If the functional structure of the flexible electronic device to be manufactured is formed on the surface of the substrate, a single surface of the mixed solution is irradiated with the light source 11, and the curing speed of different parts of the mixed solution is controlled to form a flexible substrate having surface irregularities when the mixed solution is cured, such as the flexible substrates shown in fig. 7 (a) to 7 (c). If the functional structure of the flexible electronic device to be manufactured is formed inside the substrate, both surfaces of the mixed solution are irradiated with the light source 11, and a flexible substrate having an internal channel, for example, a flexible substrate of an interdigitated capacitor shown in fig. 7 (d) is formed by controlling the curing depth of different portions of the mixed solution.
In the present invention, the range of the light source 11 capable of providing the light source with the light wavelength is selected according to the kind of the light curing agent, and the light source 11 with the light wavelength is made to cover the light curing wavelength of the light curing agent, for example, the light wavelength required by Irgacure819 light curing agent should cover 405nm, and the light wavelength required by Irgacure 250 should cover 365nm.
In the present invention, the light source 11 provided may be an LED array, a laser array, a fluorescent light, an LCD, a mercury lamp, or the like. The light source 11 provided by the invention is similar to a lens of a projector, and can irradiate an image (similar to a pattern formed by PPT, word and other documents in a computer) formed by programming onto the mixed solution through the lens to form a required light source pattern. In the embodiment where the light source is provided as a light source array, the desired light source pattern may also be formed by lighting the light source at the corresponding position. The image that the light source 11 of the present invention can provide can be a line, a single point, a circuit, an electrical device, or even a picture. In step S30, the light source 11 is programmed to form a light source pattern related to the functional structure of the flexible electronic device to be manufactured, specifically, the channel in the light source pattern corresponds to the functional structure of the flexible electronic device. As shown in fig. 4, a lens module is further disposed in front of the light source 11, the lens module in this embodiment includes a pattern magnifying lens 13 and a light parallel lens 15, and the pattern magnifying lens 13 is disposed in front of the light source 11 along the light traveling direction for magnifying the pattern irradiated by the light source 11. The light parallel lens 15 is disposed in front of the pattern magnifying lens 13 along the light traveling direction, and is used to convert the light transmitted from the pattern magnifying lens 13 into parallel light, which is perpendicular to the liquid level of the mixed solution in the present embodiment, so as to facilitate the control of the formation of the surface roughness and the internal channel of the flexible substrate during the subsequent irradiation process. In one embodiment, the pattern magnifying lens 13 and the light collimating lens 15 may transmit ultraviolet light, and the transmitted ultraviolet light may cure a mixed solution of a prepolymer and a light curing agent.
In the present invention, the light source 11 also has the characteristic of adjustable illumination intensity (i.e. adjustable brightness), the illumination intensity of the corresponding portion of the light source is selected according to the three-dimensional shape of the functional structure of the flexible electronic device to be prepared, and the illumination intensity of the light source 11 can be controlled by the gray scale of the light source graph formed by programming, as shown in fig. 6 (a) and 6 (b), where the gray scale of the pattern formed by programming is larger (i.e. the brightness and light intensity of the light source 11 are smaller), the corresponding curing depth is shallower, and where the gray scale of the pattern is smaller (i.e. the brightness and light intensity of the light source 11 are larger), the corresponding curing depth is deeper.
In step S40, the irradiation time period of the light source 11 is determined according to the curing time required for the prepolymer. The curing time required for the prepolymer can be determined according to the wavelength of light emitted from the light source 11, the intensity of light emitted, the mass percentages of the photocurable material and the photocurable material in the mixed solution, the required curing depth, and the like. The closer the wavelength of the light supplied from the light source 11 is to the light curing wavelength of the light curing agent, the faster the curing speed of the prepolymer and the shorter the irradiation time period required. The stronger the light from the light source 11, the faster the curing speed of the prepolymer, and the shorter the irradiation time period is required. The more the light curing agent, the faster the curing speed of the prepolymer and the shorter the irradiation time required. The shallower the depth of cure, the shorter the irradiation time period required for the prepolymer.
In step S40, the formed flexible substrate has a surface concave-convex portion or an internal channel, the formed surface concave-convex portion includes, for example, bumps on the surface of the flexible substrate in fig. 7 (a) (each bump in the flexible substrate is formed by irradiation of a light source 11 with bright middle and bright sides), pits on the surface of the flexible substrate in fig. 7 (b) (each pit in the flexible substrate is formed by irradiation of a light source 11 with dark middle and bright sides), and a flow channel on the surface of the flexible substrate in fig. 7 (c), the formed surface concave-convex portion corresponds to the functional structure of the flexible electronic device to be prepared, the formed internal channel includes, for example, a channel inside the flexible substrate in fig. 5, and the formed internal channel also corresponds to the functional structure of the flexible electronic device to be prepared. The concave-convex part on the surface of the flexible substrate is formed by single-side irradiation, and the internal channel is formed by double-side irradiation.
In the present invention, after step S40 (forming the flexible substrate having the surface concave-convex portions or the internal channels), the method may further include: the flexible substrate is peeled from the boat. When the flexible substrate is peeled from the carrying vessel, modes such as laser cutting, scraper knife scraping, manual peeling, or smearing grease on the carrying vessel in advance (facilitating peeling after curing) and the like can be adopted.
Further, after step S40 of the present invention, the method may further include: and removing the uncured mixed solution in the concave-convex part on the surface or the internal channel. When the uncured mixed solution in the concave-convex part of the surface or the internal channel is removed, a mode of sucking by using a syringe or liquid absorbing paper can be adopted, a mode of blow-drying or evaporation can also be adopted, and if the evaporation mode is adopted, the heating temperature cannot be too high, so that the appearance of the flexible substrate is not influenced.
As shown in fig. 5, in step S50, when the functional material is filled in the uneven surface portion or the internal channel of the flexible substrate, a syringe injection method may be used. The injected functional material is a fluid material, and the fluid material may be liquid metal, non-newtonian fluid (e.g., human blood, lymph fluid, cyst fluid, etc.), conductive metal paste, carbon nano paste, organic conductive liquid, etc., and specifically needs to be selected according to the flexible electronic device to be processed, for example, if a flexible circuit board needs to be processed, liquid metal may be injected, and if an impact-resistant flexible device needs to be processed, rubber solution may be injected, etc.
Second embodiment
The target is as follows: a flexible substrate and a flexible device which can be stretched in one direction and have impact resistance are prepared (the appearance structure of the flexible device is shown in figure 8).
The preparation process comprises the following steps: in a yellow light room, bisphenol A epoxy acrylate and a light curing agent Irgacure819 (CAS: 162881-26-7) are mixed according to the mass percentage of 95-99 (preferably 98-2), the mixed solution is placed in a culture dish (the height of the solution in the culture dish is 700 microns), and the culture dish is placed on a light illumination platform;
editing a light source by using a mercury lamp as the light source (the light source covers the light curing wavelength of 405nm, and the power of the mercury lamp is 100W), wherein the formed light source pattern comprises a serpentine curve along a single direction;
irradiating the mixed solution by using a light source on two sides for 1 minute;
turning off the light source after 1 minute to obtain a flexible substrate with a snake-shaped channel inside;
taking the solidified flexible substrate out of the culture dish;
sucking the uncured solution in the channel by an injector, injecting the liquid rubber solution into the internal channel, and sealing;
forming the flexible device with impact resistance and memory function with one-way stretching performance.
Third embodiment
The target is as follows: a flexible substrate for finger electrode and a liquid metal finger capacitor having the same are prepared (the appearance structure of the finger capacitor is shown in FIG. 7 (d))
The preparation process comprises the following steps: in a yellow light room, mixing bisphenol A epoxy resin and a light curing agent Irgacure 250 according to the mass percentage of 94-98 (preferably 96;
editing a light source by using a UVA ultraviolet lamp as the light source (the light source covers the light curing wavelength of 365nm, the power of the ultraviolet lamp is 10W), wherein a formed light source graph comprises two rows of comb-shaped finger inserting electrodes;
irradiating the mixed solution by using a light source on two sides for 30 seconds;
turning off the light source after 30 seconds to obtain a flexible substrate of the finger inserting electrode;
taking the solidified flexible substrate out of the culture dish;
sucking out the uncured solution in the channel through an injector, injecting the liquid gallium indium tin liquid metal alloy into the channel, and sealing;
and forming the finger capacitor with the liquid metal finger electrode.
Fourth embodiment
Target: preparing a microfluidic detection chip and its flexible substrate (the appearance structure of the microfluidic detection chip is shown in FIG. 7 (c))
The preparation process comprises the following steps: in a yellow light room, mixing bisphenol A epoxy resin and a light curing agent Irgacure 250 according to the mass percentage of 94-98 (preferably 96;
the light source was edited using a UVA ultraviolet lamp as a light source (light source covering a photocuring wavelength of 365nm, ultraviolet lamp power of 10W) to form a light source pattern including the pattern shown in FIG. 7 (c).
Irradiating the mixed solution from the bottom single side by using a light source for 30 seconds;
after 30 seconds, the light source was turned off to obtain a flexible substrate having a shape shown in fig. 7 (c);
taking the solidified flexible substrate out of the culture dish;
injecting gold nanoparticles carrying a hepatoma cell antibody into a concave part on the surface of the flexible substrate through an injector, and enabling the gold nanoparticles to be attached to the channel;
forming the flexible micro-fluidic chip with the liver cancer cell screening function.
In summary, the flexible electronic device substrate and the method for manufacturing the flexible electronic device of the present invention have at least one of the following advantages:
1. the invention adopts the illumination curing mode to form the flexible substrate with the concave-convex part on the surface or the internal channel, and injects the functional material into the concave-convex part on the surface or the internal channel of the formed flexible substrate to obtain the required flexible electronic device.
2. The invention realizes the patterning of the concave-convex part on the surface or the internal channel of the flexible substrate through the patterning of the light source, has flexible processing mode, can form the flexible substrates with different structures without a forming die, and is particularly suitable for processing the flexible substrates with complex structures;
3. the invention can control the curing speed and curing depth of the mixed solution through the change of the illumination intensity, illumination wavelength and illumination duration of the light source, thereby controlling the section shape of the formed channel.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (15)
1. A method for preparing a flexible electronic device substrate is characterized by comprising the following steps: the method comprises the following steps:
providing a mixed solution of a prepolymer and a light curing agent;
providing a light source which can be programmed graphically;
forming the light source into a light source pattern associated with the functional structure of the flexible electronic device;
and irradiating and curing the prepolymer and light curing agent mixed solution by using a light source to form a flexible substrate with a surface concave-convex part or an internal channel, wherein the shape of the formed surface concave-convex part or the internal channel corresponds to the shape of the functional structure of the flexible electronic device to be prepared, and the illumination intensity of the part corresponding to the light source is selected according to the three-dimensional shape of the functional structure of the flexible electronic device.
2. The method of making a flexible electronic device substrate of claim 1, wherein the pre-polymer comprises a liquid monomer or liquid oligomer of a photosensitive resin.
3. The method for manufacturing a substrate for a flexible electronic device according to claim 1, wherein the light source irradiates the mixed solution on one side to form a flexible substrate having a surface concave-convex portion.
4. The method of manufacturing a flexible electronic device substrate according to claim 3, wherein the uneven portions on the surface of the flexible substrate are formed when the mixed solution is cured by controlling the curing speed of different portions of the mixed solution.
5. The method of manufacturing a flexible electronic device substrate according to claim 1, wherein the light source irradiates both sides of the mixed solution to form a flexible substrate having an internal channel.
6. The method of claim 1, wherein the light source has an illumination wavelength selected according to the type of the photo-curing agent.
7. The method for manufacturing a flexible electronic device substrate according to claim 1, wherein the light intensity of the light source is controlled by editing the gray scale of the formed light source pattern.
8. The method of manufacturing a flexible electronic device substrate according to claim 1, wherein the irradiation time period of the light source is determined according to a curing time required for the prepolymer.
9. The method of manufacturing a flexible electronic device substrate according to claim 1, wherein a light parallel lens for converting a transmitted light into a parallel light is provided in front of the light source in a light traveling direction, the parallel light being perpendicular to a surface of the mixed solution.
10. The method of manufacturing a flexible electronic device substrate according to claim 9, wherein a pattern magnifying lens is further provided in front of the light source in a light traveling direction, the pattern magnifying lens being provided between the light source and the light parallel lens for magnifying a pattern irradiated from the light source.
11. A method of making a flexible electronic device, the method comprising: after the flexible substrate having the surface concave-convex portion or the internal channel is prepared by the preparation method according to any one of claims 1 to 10, the functional material corresponding to the function of the flexible electronic device is filled in the surface concave-convex portion or the internal channel of the flexible substrate, so as to obtain the flexible electronic device.
12. The method of manufacturing a flexible electronic device according to claim 11, comprising, before filling the functional material: and removing the uncured mixed solution in the concave-convex part on the surface or the internal channel.
13. The method of manufacturing a flexible electronic device according to claim 11, wherein the functional material is a fluid material.
14. The method of manufacturing a flexible electronic device according to claim 13, wherein the fluid material comprises a liquid metal, a non-newtonian fluid, a conductive metal paste, a carbon nanopaste, and an organic conductive liquid.
15. The method according to claim 13, wherein the injection is performed by a syringe while filling the fluid material in the surface irregularities or the internal channel of the flexible substrate.
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