CN109768003A - For correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip - Google Patents
For correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip Download PDFInfo
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- CN109768003A CN109768003A CN201811562107.XA CN201811562107A CN109768003A CN 109768003 A CN109768003 A CN 109768003A CN 201811562107 A CN201811562107 A CN 201811562107A CN 109768003 A CN109768003 A CN 109768003A
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- plastic packaging
- heating
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- bearing structure
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Abstract
The present invention relates to correcting technology fields, more particularly to a kind of for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip, it include: air flue layer, the upper surface of air flue layer is formed with the supporting region for carrying plastic packaging plate, supporting region is plane setting, further includes the first runner being set to below supporting region；Heating layer is set to below air flue layer, and heating layer is provided with the heating structure to form heating zone, and heating zone is correspondingly arranged with supporting region, and heating structure is interspersed with first runner, so that plastic packaging plate is heated evenly.Wherein apparatus for correcting includes: bearing structure, further includes the compacting platform being set to above bearing structure, and compacting platform is moved back and forth along perpendicular to the supporting region direction, applies pressure for the plastic packaging plate to lower section.The planarizing degree of plastic packaging plate of the bearing structure to the heating of plastic packaging plate more uniformly, after correction for correcting the plastic packaging sheet warpage comprising IC chip of the invention is higher.
Description
Technical field
The present invention relates to integrated circuit Advanced Packaging fields, and in particular to one kind includes ic core for correcting
The bearing structure of the plastic packaging sheet warpage of piece.
Background technique
Due to the difference of chip, plastic packaging raw material, packing material in the physical properties such as thermal expansion coefficient, elasticity modulus, modeling
The large scale plate being honored as a queen is when being cooled to room temperature, the problem of nearly all encountering sheet warpage, the degree of warpage and the ruler of plate
Very little size, material category, plastic package process etc. are closely related.The size of plastic packaging plate is bigger, and warpage is often bigger.However it is subsequent
Process flow have strict requirements to planar surface flatness, so, correction large scale plastic packaging plate be subsequent high quality work
The essential step of skill.
In the instrument of correction large scale plastic packaging sheet warpage, crucial device is the loading for carrying large scale plastic packaging plate
Platform: chuck (bearing structure).Material surface quality, accurate temperature control and its superior thermally conductive function of chuck are that acquisition is smooth
The key device of plastic packaging plate.Usual heating device heats chuck, so that plastic packaging plate is obtained heat, and then make to mould
Pyroplastic deformation occurs for closure material, completes the stress release of stress concentration portion point, so that plastic packaging plate is tended to planarizing, still
It still will appear that heating is uneven, plastic packaging plate planarizes degree after correction when chuck in the prior art is to plastic packaging flat heater
The problems such as lower.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that overcoming chuck in the prior art to warpage comprising integrated circuit
Uneven, plastic packaging plate is heated when the plastic packaging plate of chip is corrected, and the more low technological deficiency of degree is planarized after correction,
To provide a kind of plastic packaging plate in correction to the plastic packaging flat heater comprising IC chip more uniformly, after correction
Planarizing degree it is higher for correct include IC chip plastic packaging sheet warpage bearing structure.
In order to solve the above technical problems, The technical solution adopted by the invention is as follows:
The present invention provides a kind of for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip, packet
Include: air flue layer, the upper surface of the air flue layer are formed with the supporting region for carrying the plastic packaging plate, and the supporting region is flat
Face setting, further includes the first runner being set to below the supporting region；Heating layer is set to below the air flue layer, described
Heating layer is provided with the heating structure to form heating zone, and the heating zone is correspondingly arranged with the supporting region, and the heating is tied
Structure is interspersed with the first runner, so that the plastic packaging plate is heated evenly.
It is above-mentioned for correct comprising IC chip plastic packaging sheet warpage bearing structure in, the first runner and
The supporting region connection setting.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, the heating zone includes
The first heating zone for being correspondingly arranged with the supporting region periphery and be correspondingly arranged inside the supporting region and be located at described the
Several evenly arranged second heating zones in one heating zone, first heating zone and second heating zone are set independently of each other
It sets.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, second heating zone
Quantity be four, four second heating zones are evenly distributed in four quadrants in first heating zone.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, the heating structure packet
It includes and is set to the first resistor silk of substantially square arrangement in first heating zone and is set to four second heating
In area and respectively in the second resistance silk of concave character type arrangement.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, first heating zone
And four second heating zones are separately connected an at least temperature control system.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, first heating zone
The centre of one end and four second heating zones far from power supply is provided with temperature measurement instrument.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, the first runner packet
Include several line flowing channels and several arced flow paths, several line flowing channel parallel arrangements, the two neighboring line flowing channel
Head and the tail are connected to by arced flow path, and the both ends of the first runner are connected with inert gas import and vacuum system respectively.
It further include being set to institute in the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip
It states below heating layer and is correspondingly arranged the cooling layer cooling for the plastic packaging plate with the supporting region.
In the above-mentioned bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, the cooling layer setting
There is the second flow channel for cooling water circulation, the inlet and outlet of the second flow channel extends respectively to outside the bearing structure
Edge.
Technical solution of the present invention has the advantages that
1. provided by the present invention for the bearing structure for correcting the plastic packaging sheet warpage comprising IC chip, comprising:
Air flue layer, the upper surface of the air flue layer are formed with the supporting region for carrying the plastic packaging plate, and the supporting region is plane
Setting, further includes the first runner being set to below the supporting region；Heating layer is set to below the air flue layer, described to add
Thermosphere is provided with the heating structure to form heating zone, and the heating zone is correspondingly arranged with the supporting region, and the heating structure
It is interspersed with the first runner, so that the plastic packaging plate is heated evenly.It, can be to when plastic packaging plate needs to heat
Inert gas is passed through in one runner promotes heat transfer to reach the accurate temperature for being evenly heated to plastic packaging plate, while cooperating heating structure
Plastic packaging plate is heated in degree control, improves heating efficiency, improves the working efficiency of rectification technique；Heating structure with it is first-class
The structure design that road is interspersed can make plastic packaging plate uniformly heat up；It, can also be to the when needing cooling to plastic packaging plate
It is passed through inert gas in one runner to accelerate the cooling of plastic packaging plate, improves rectification technique quality and efficiency.
2. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
First runner is connected to setting with the supporting region.Such design can also be connected vacuum system to plastic packaging plate by first runner
Suction vacuum behind, fits in it more entirely on supporting region surface, then restarts heating structure and to first runner
It is inside passed through inert gas and promotes heat transfer, reach to the uniformly heated purpose of plastic packaging plate, to make the plastic packaging plate after correction
Flatness is higher；Such design can also make the inert gas being passed through in first runner and plastic packaging plate and chuck surface simultaneously
Heat exchange effect it is more preferable.
3. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
Heating zone include the first heating zone being correspondingly arranged with the supporting region periphery and be correspondingly arranged inside the supporting region and
Several evenly arranged second heating zones in first heating zone, first heating zone and second heating zone
Mutually indepedent setting.First heating zone is used to control the temperature of plastic packaging plate periphery, and several second heating zones are for realizing to modeling
Envelope plate internal temperature is precisely controlled, so that the heated heating of plastic packaging plate is more evenly.
4. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
The quantity of second heating zone is four, and four second heating zones are evenly distributed on four quadrants in first heating zone
In.The heating structure includes being set to the first resistor silk of substantially square arrangement in first heating zone and being set to
In four second heating zones and respectively in the second resistance silk of concave character type arrangement.Described in first heating zone and four
Second heating zone is separately connected an at least temperature control system.Such design may be implemented to the temperature of each heating zone into
Row individually control, allows heating layer to provide the heating source that subregion freely controls, to realize to plastic packaging plate different zones
Temperature carry out corresponding adjust and be accurately controlled with realizing, to keep the rectification effect of plastic packaging plate more preferable, increase plastic packaging
The flexibility of plate rectification technique.
5. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
The centre of one end and four second heating zone of first heating zone far from power supply is provided with temperature measurement instrument.This
The setting of sample can be with the temperature of each heating zone of real-time tracking, to be controlled accordingly.
6. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
First runner includes several line flowing channels and several arced flow paths, and several line flowing channel parallel arrangements are two neighboring described
The head and the tail of line flowing channel by arced flow path be connected to, the both ends of the first runner respectively with inert gas import and vacuum system
It is connected.Such arrangement can make the heat exchange between inert gas and plastic packaging plate make the being heated evenly property and temperature of plastic packaging plate
Degree control precision improves.
7. including also to be wrapped in the bearing structure of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
It includes and is set to below the heating layer and is correspondingly arranged the cooling layer cooling for the plastic packaging plate with the supporting region.It is cooling
The design of layer can achieve the purpose of rapid cooling, and the plastic packaging plate after higher temperature correction process is enable to be quickly cooled down
Get off, to save the cooling time to single warpage plastic packaging plate, next warpage plastic packaging plate can be rectified as early as possible
Just, whole rectification technique working efficiency is improved.
8. described provided by the present invention in bearing structure of the correction comprising the plastic packaging sheet warpage of IC chip
Cooling layer is provided with the second flow channel for cooling water circulation, and the inlet and outlet of the second flow channel extends respectively to described hold
Carry structural outer rim.The design structure of second flow channel is simple, is passed through cooling water when needing cooling and cools down to plastic packaging plate, grasps
Make simple and good cooling results.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is that the structure of the bearing structure for correcting the plastic packaging sheet warpage comprising IC chip of the invention is shown
It is intended to；
Fig. 2 is shown in FIG. 1 for correcting the air flue of the bearing structure of the plastic packaging sheet warpage comprising IC chip
Schematic diagram of a layer structure；
Fig. 3 is shown in FIG. 1 for correcting the heating of the bearing structure of the plastic packaging sheet warpage comprising IC chip
Schematic diagram of a layer structure；
Fig. 4 is shown in FIG. 1 for correcting the cooling of the bearing structure of the plastic packaging sheet warpage comprising IC chip
Schematic diagram of a layer structure；
Description of symbols:
1- air flue layer；2- heating layer；3- cooling layer；4- first resistor silk；5- second resistance silk；7- plastic packaging is flat
Plate.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
As shown in Figs 1-4, the present invention provides a kind of for correcting the plastic packaging sheet warpage comprising IC chip
Bearing structure comprising three-decker, respectively positioned at first layer air flue layer 1, positioned at the second layer heating layer 2 and be located at
The cooling layer 3 of third layer.
In the present embodiment, the upper surface of the air flue layer 1 is formed with the supporting region for carrying the plastic packaging plate 7,
The supporting region is plane setting, and supporting region is needed by surface polishing treatment, and guarantee is flat and smooth, makes to mould in correcting process
The back side of envelope plate 7 will not generate scratch, while the high flattening of plastic packaging plate 7 may be implemented, further include be set to it is described
First runner below supporting region.
As shown in Fig. 2, the first runner includes several line flowing channels and several arced flow paths, several line flowing channels
Parallel arrangement, the head and the tail of the two neighboring line flowing channel are connected to by arced flow path, formed a plane setting ventilation or
The runner of vacuum is aspirated, the both ends of the first runner are connected with inert gas import and vacuum system respectively, i.e. first runner
It is open at one end be connected with inert gas import, another end opening is connected with vacuum system.The first runner and inert gas
Automatic valve is installed in the pipeline of the junction of import, to realize the automation control to inert gas is passed through in first runner
System.
Further, the first runner is connected to setting with the supporting region, i.e., the described first runner is from the carrying
Area surface extends downwardly the groove of setting, can set deep 3mm, wide 3mm for groove according to actual needs.The groove is positive
It is rectangular, for the ease of processing and manufacturing.As alternative embodiment, the section of groove is also possible to round, ellipse or rectangular
Shape.The purpose is to realize that heat source is more preferable to the thermal conduction effect of plastic packaging plate by the inert gas in first runner.
As shown in Fig. 2, the cross section of the air flue layer 1 be it is rectangular, effective workspace of the first runner is in rectangular
Effective workspace in the region in frame, first runner can cover supporting region；The cross section of the air flue layer 1 is greater than first-class
The cross section of the effective workspace in road, it is ensured that plastic packaging plate edge can obtain accurate temperature control, and carrying uniform force；Carrying
Horizontal distance between the edge of the effective workspace in edge and first runner in area can be set as 10-20mm according to actual needs,
The first runner horizontal distance between 1 edge of area edge and air flue layer that effectively works can be set as 30mm according to actual needs.Have
The aluminium nitride either surface for imitating the materials'use good heat conductivity of workspace has the metal material of aluminum nitride thin membrane coat (such as
Aluminium alloy etc.).
In the present embodiment, heating layer 2 is set to 1 lower section of air flue layer, and the heating layer 2 is provided with to form heating zone
Heating structure, the heating zone is correspondingly arranged with the supporting region, and the heating structure and the first runner are staggeredly point
Cloth, so that the plastic packaging plate is heated evenly.The cross section of the heating layer be it is rectangular, the heating zone of the heating layer can will
Supporting region covering, the heating zone is made using the good material of thermal conducting function.
Further, the heating zone include the first heating zone being correspondingly arranged with the supporting region periphery and with it is described
Several evenly arranged second heating zones for being correspondingly arranged and being located in first heating zone inside supporting region, described first adds
Hot-zone and several second heating zones are arranged independently of each other.It first heating zone can accurate control heated to plastic packaging plate periphery
System, being independently arranged for several second heating zones can accurately control plastic packaging plate internal temperature.
Further, the quantity of second heating zone is four, and four second heating zones are evenly distributed on described
In four quadrants in first heating zone, i.e., arranged by cross even partition.As alternative embodiment, described second adds
The quantity of hot-zone can also be five, six or more, can be evenly distributed on five or six in pentagon or hexagon accordingly
The heating region of temperature independent control, to reach the temperature control more fine to plastic packaging plate.
Further, first heating zone and four second heating zones are separately connected an at least temperature control
System.In the present embodiment, first heating zone and four second heating zones are respectively by a temperature control system
It is controlled, so as to realize that the temperature to each heating zone is individually controlled, heating layer is allow to provide subregion certainly
By the heating source controlled, corresponding adjust to realize accurate control is carried out to the temperature of plastic packaging plate different zones to realize
System, to keep the rectification effect of plastic packaging plate more preferable, increases the flexibility of rectification technique.
Further, the centre of one end and four second heating zone of first heating zone far from power supply
It is provided with temperature measurement instrument.Temperature measurement instrument positioned at first heating zone is set to one end opposite with power supply, every
A heating zone setting temperature measurement instrument can be with the temperature of each heating zone of real-time tracking, to be controlled accordingly.
Further, the resistance wire figure of special layout, the figure and electricity of resistance wire are provided in each heating region
Size is hindered depending on heat transfer simulation calculation, so that entire heating layer 2 obtains uniform Temperature Distribution, and then makes plastic packaging plate
Obtain uniform heat.Specifically, the heating structure includes being set to substantially square arrangement in first heating zone
First resistor silk 4 and the second resistance silk 5 for being set in four second heating zones and arranging respectively in concave character type.As
Alternative embodiment, second resistance silk can also arrange in M shape.As shown in figure 3, first resistor silk 4 is along rectangular heating layer
The rectangular resistance the Silk Road line of edge setting, the first heating zone that first resistor silk 4 is formed are used to carry out the periphery of plastic packaging plate 7
Heating, four second heating zones are used for being evenly heated inside plastic packaging plate 7.
In the present embodiment, the cooling layer 3 is set to 2 lower section of heating layer and is correspondingly arranged with the supporting region,
The cooling layer 3 is for cooling down the plastic packaging plate 7.Cooling layer 3 is made of heat dissipation preferable material, such as yellow
The materials such as copper/aluminium alloy, to achieve the purpose that rapid cooling, the plastic packaging plate after enabling the correction in higher temperature is quick
Cooling can as early as possible rectify next warpage plastic packaging plate to save the cooling time to single warpage plastic packaging plate
Just, whole rectification technique quality and working efficiency are improved.
Further, the cooling layer 3 is provided with the second flow channel for cooling water circulation, the import of the second flow channel
The bearing structure outer rim is extended respectively to outlet.In the present embodiment, the second flow channel is arranged in M type.To plastic packaging
When plate 7 is cooled down, cooling water is passed through into second flow channel, positioned at bottom cooling layer 3 can fast cooling, and then quickly it is right
Heating layer 2 and air flue layer 1 cool down, so that the plastic packaging plate after correction be made to achieve the purpose that rapid cooling.
In the present embodiment, as shown in Figure 1, the air flue layer 1, the heating layer 2 and the cooling layer 3 be it is upper,
The slab construction of the smooth setting in lower surface, the air flue layer 1, the heating layer 2 and the cooling layer 3 are superimposed composition
The bearing structure, the air flue layer 1, the heating layer 2 and the cooling layer 3 can freely replace assembling, in this way can root
A new bearing structure is re-assemblied according to the size of plastic packaging plate to be processed.
For plastic packaging plate when needing to heat, first runner connects vacuum system first, aspirates, will mould to the plastic packaging plate back side
Envelope plate closely adheres on the surface of supporting region, then is passed through inert gas into first runner and promotes plastic packaging plate and air flue layer
Heat transfer, improve heating efficiency, and then improve rectification technique working efficiency；The knot that heating structure and first runner are interspersed
Structure design can obtain temperature and uniformly heat, and inert gas accelerates the heat transfer to plastic packaging plate, it is ensured that plastic packaging plate is smooth
Rectification technique quality is stablized.
Plastic packaging plate is first shut off the power supply of all heating systems when completing to need cooling after heating is smooth, then to the
Be passed through cooling water in two runners, positioned at bottom cooling layer 3 can fast cooling, and then drive heating layer 2 and air flue layer 1, i.e.,
Entire bearing structure sharp temperature drop, so that the plastic packaging plate after correction be made to achieve the purpose that rapid cooling, while can also be to the
Inert gas is passed through in one runner to control the cooling velocity of plastic packaging plate.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. the bearing structure for correcting the plastic packaging sheet warpage comprising IC chip characterized by comprising
Air flue layer (1), the upper surface of the air flue layer (1) is formed with the supporting region for carrying the plastic packaging plate (7), described
Supporting region is plane setting, further includes the first runner being set to below the supporting region；
Heating layer (2), is set to below the air flue layer (1), and the heating layer (2) is provided with the heating knot to form heating zone
Structure, the heating zone are correspondingly arranged with the supporting region, and the heating structure is interspersed with the first runner, so that institute
Plastic packaging plate is stated to be heated evenly.
2. it is according to claim 1 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the first runner is connected to setting with the supporting region.
3. it is according to claim 2 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
Be characterized in that, the heating zone include the first heating zone being correspondingly arranged with the supporting region periphery and in the supporting region
Several evenly arranged second heating zones that portion is correspondingly arranged and is located in first heating zone, first heating zone and institute
The second heating zone is stated to be arranged independently of each other.
4. it is according to claim 3 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the quantity of second heating zone is four, and four second heating zones are evenly distributed on first heating
In four quadrants in area.
5. it is according to claim 4 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the heating structure includes the first resistor silk (4) for being set to substantially square arrangement in first heating zone
And the second resistance silk (5) for being set in four second heating zones and arranging respectively in concave character type.
6. it is according to claim 4 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, first heating zone and four second heating zones are separately connected an at least temperature control system.
7. it is according to claim 4 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the centre of one end and four second heating zone of first heating zone far from power supply is provided with
Temperature measurement instrument.
8. according to claim 1-7 for correcting holding for the plastic packaging sheet warpage comprising IC chip
Carry structure, which is characterized in that the first runner includes several line flowing channels and several arced flow paths, several line flowing channels
Parallel arrangement, the head and the tail of the two neighboring line flowing channel are connected to by arced flow path, the both ends of the first runner respectively with
Inert gas import is connected with vacuum system.
9. according to claim 1-7 for correcting holding for the plastic packaging sheet warpage comprising IC chip
Carry structure, which is characterized in that further include being set to below the heating layer (2) and being correspondingly arranged with the supporting region for described
The cooling cooling layer (3) of plastic packaging plate (7).
10. it is according to claim 9 for correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the cooling layer (3) is provided with the second flow channel for cooling water circulation, the inlet and outlet of the second flow channel
Extend respectively to the bearing structure outer rim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811562107.XA CN109768003A (en) | 2018-12-19 | 2018-12-19 | For correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811562107.XA CN109768003A (en) | 2018-12-19 | 2018-12-19 | For correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109768003A true CN109768003A (en) | 2019-05-17 |
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ID=66451772
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811562107.XA Pending CN109768003A (en) | 2018-12-19 | 2018-12-19 | For correcting the bearing structure of the plastic packaging sheet warpage comprising IC chip |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007046141A (en) * | 2005-08-12 | 2007-02-22 | Ngk Insulators Ltd | Heating device |
| CN101243542A (en) * | 2005-08-17 | 2008-08-13 | 应用材料股份有限公司 | Substrate support having brazed plates and resistance heater |
| CN102362332A (en) * | 2009-03-24 | 2012-02-22 | 东京毅力科创株式会社 | Mounting table structure and treatment device |
| US20140014642A1 (en) * | 2012-06-12 | 2014-01-16 | Component Re-Engineering Company, Inc. | Multiple Zone Heater |
| CN205452240U (en) * | 2015-11-30 | 2016-08-10 | 中国电子科技集团公司第三十八研究所 | Solve fan -out type wafer -level package warping device |
| CN207313684U (en) * | 2017-09-07 | 2018-05-04 | 君泰创新（北京）科技有限公司 | Vacuum coating equipment |
-
2018
- 2018-12-19 CN CN201811562107.XA patent/CN109768003A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007046141A (en) * | 2005-08-12 | 2007-02-22 | Ngk Insulators Ltd | Heating device |
| CN101243542A (en) * | 2005-08-17 | 2008-08-13 | 应用材料股份有限公司 | Substrate support having brazed plates and resistance heater |
| CN102362332A (en) * | 2009-03-24 | 2012-02-22 | 东京毅力科创株式会社 | Mounting table structure and treatment device |
| US20140014642A1 (en) * | 2012-06-12 | 2014-01-16 | Component Re-Engineering Company, Inc. | Multiple Zone Heater |
| CN205452240U (en) * | 2015-11-30 | 2016-08-10 | 中国电子科技集团公司第三十八研究所 | Solve fan -out type wafer -level package warping device |
| CN207313684U (en) * | 2017-09-07 | 2018-05-04 | 君泰创新（北京）科技有限公司 | Vacuum coating equipment |
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Application publication date: 20190517 |