CN109751540A - A kind of LED module and high-temperature heating case - Google Patents
A kind of LED module and high-temperature heating case Download PDFInfo
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- CN109751540A CN109751540A CN201910172113.2A CN201910172113A CN109751540A CN 109751540 A CN109751540 A CN 109751540A CN 201910172113 A CN201910172113 A CN 201910172113A CN 109751540 A CN109751540 A CN 109751540A
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- cloche
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- circuit board
- heat insulation
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Abstract
The LED module that can be applied to high-temperature heating case interior lighting and high-temperature heating case of a kind of field of LED illumination are provided in the embodiment of the present invention;The LED module inside cloche by being arranged a closed inert gas full of light transmission or being the hollow heat insulation cavity of vacuum, or high temperature resistant heat insulation coating is provided on the surface of cloche, it is thermally shielded to inside high-temperature heating case with LED light, can work under high temperature environment and be burned out to avoid LED light.
Description
Technical field
The present invention relates to field of LED illumination, in particular to a kind of LED module and high-temperature heating case.
Background technique
LED solid-state lighting is with its environmental protection and energy saving, the advantage of service life length, gradually instead of height in majority of illumination field
Energy consumption, the conventional light sources such as service life short incandescent lamp and halogen lamp.And have multiple countries gradually to implement to switch conventional light source
For the coercion policy of LED light source.Wherein the high temperature inside cavity of numerous electrical equipments such as oven, micro-wave oven often needs illumination function
Can, they equally have the demand of switching LED light source.In the prior art, oven, micro-wave oven traditional lighting in, often make
Use incandescent lamp bulb as lighting source.
In realizing process of the present invention, inventor's discovery is above, and at least there are the following problems in the related technology: existing oven
Or the incandescent lamp of micro-wave oven inherently leans on filament fever to shine, therefore has very high high-temperature capability.And due to LED
It itself is cold light source, the high-temperature capability of chip and encapsulating material is limited, and LED is in the high temperature cavity such as oven, micro-wave oven
Portion is usually even burnt out because operating temperature is too high to work normally.
Summary of the invention
In view of the above drawbacks of the prior art, it can be used in being heated at high temperature inside case the object of the present invention is to provide one kind and shine
Bright LED module and high-temperature heating case.
The purpose of the present invention is what is be achieved through the following technical solutions:
In order to solve the above technical problems, in a first aspect, the present invention provides a kind of LED module, applied to high-temperature heating case
Interior lighting, the high-temperature heating case are internally provided with high temperature heat source, and the LED module includes: cloche and at least one
LED light;
Hollow heat insulation cavity is provided in the cloche, the light that at least one described LED light issues can be through described
Cloche and the inside that the high-temperature heating case is irradiated to through the hollow heat insulation cavity;
And/or high temperature resistant heat insulation coating is provided on the surface of the cloche, the light that at least one described LED light issues
The inside of the high-temperature heating case can be irradiated to through the cloche and through the high temperature resistant heat insulation coating.
The light that at least one described LED light issues is through the cloche and penetrates the hollow heat insulation cavity and/or institute
State the inside that high temperature resistant heat insulation coating is irradiated to the high-temperature heating case.
Optionally, it when being equipped with the hollow heat insulation cavity in the cloche, is set as in the hollow heat insulation cavity
Vacuum or inert gas filled with light-permeable.
Optionally, the LED module further include: heat-conductive assembly, the heat-conductive assembly are equipped with construction opening, the cloche
Cover at the construction opening.
Optionally, installation cavity is additionally provided in the heat-conductive assembly, the construction opening is connected to the installation cavity, wherein
The LED light is located in the installation cavity or the LED light is located at outside the installation cavity and the LED light issues
Light can sequentially pass through the installation cavity and the cloche.
Optionally, the heat-conductive assembly includes: heat conducting frame and radiator, and one end of the heat conducting frame is equipped with the peace
Dress opening, the radiator is connected to the other end of the heat conducting frame, and is enclosed the installation with the heat conducting frame
Chamber.
Optionally, the heat-conductive assembly extends inwardly to form fixed plate close to the internal partial wall of the LED light;The LED
Mould group further include: circuit board, the LED light are installed on side of the circuit board towards the cloche, and the circuit board is solid
Surely it is connected to the fixed plate, and is equipped with high temperature resistant heat insulation block between the circuit board and the fixed plate.
Optionally, at least one buckle, institute are respectively arranged on at least two of the construction opening opposite inner walls
It states and is respectively arranged at least one card slot at least two opposite sides of cloche, a buckle correspondence is connected in an institute
Card slot is stated, for the heat-conductive assembly and the cloche to be connected as one.
Optionally, at least one is respectively arranged on at least two of the heat-conductive assembly opposite lateral surfaces to be used for and institute
State the elastic piece structure that high-temperature heating case is connected together.
Optionally, the heat conducting frame extends inwardly to form fixed plate, the LED close to the internal partial wall of the LED light
Mould group further include: circuit board, the LED light are installed on side of the circuit board towards the cloche, and the circuit board is solid
Surely it is connected to the fixed plate, and is equipped with high temperature resistant heat insulation block between the circuit board and the fixed plate, for described
It is thermally shielded between circuit board and the fixed plate;
The radiator fits in the one side that the circuit board deviates from the cloche;
The LED module further include: at least one screw, it is described at least provided with one first screw hole in the fixed plate
At least provided with one second screw hole on high temperature resistant heat insulation block, at least provided with a third screw hole, the heat dissipation on the circuit board
At least provided with one the 4th screw hole on device;
The screw is corresponding in turn to across first screw hole, second screw hole, the third screw hole and the described 4th
The heat conducting frame, the high temperature resistant heat insulation block, the circuit board and the radiator are fixed as one by screw hole.
In order to solve the above technical problems, second aspect, the present invention provides a kind of high-temperature heating case, comprising: cabinet and chamber door,
LED module described in above-mentioned first aspect is installed to shine the inside of the cabinet in the cavity wall of the inner cavity of the cabinet
It is bright.
Compared with prior art, the beneficial effects of the present invention are: being in contrast to the prior art, in the embodiment of the present invention
Provide the LED module and high-temperature heating of a kind of interior lighting of high-temperature heating case that can be applied to be provided with high temperature heat source
Case;The LED module by be arranged inside cloche a closed inert gas full of light transmission or for vacuum it is hollow every
Hot cavity;Or high temperature resistant heat insulation coating is provided on the surface of cloche.To high-temperature heating case inside and LED light progress every
Heat can work under high temperature environment to avoid LED light and be burned out.
Detailed description of the invention
It is illustrated in one or more embodiments by the picture in corresponding attached drawing, these are exemplary
Illustrating not constitute the restriction to embodiment, the element in attached drawing with same reference numbers label is expressed as similar element,
Unless there are special statement, composition does not limit the figure in attached drawing.
Fig. 1 is the overall structure diagram for the LED module that the embodiment of the present invention one provides;
Fig. 2 is the exploded view of the overall structure diagram of the LED module of Fig. 1;
Fig. 3 is the integrally-built cross-sectional view schematic diagram for the LED module that the embodiment of the present invention one provides;
Fig. 4 is the overall structure diagram of the metallic support for the LED module that the embodiment of the present invention one provides;
Fig. 5 is the overall structure diagram of high-temperature heating case (not including chamber door) provided by Embodiment 2 of the present invention;
Fig. 6 is the overhead sectional view schematic diagram that LED module provided by Embodiment 2 of the present invention is fixed in oven.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection scope.
The present invention provides a kind of LED modules 1, applied to the interior lighting of high-temperature heating case 2, the high-temperature heating case 2
Be internally provided with high temperature heat source, which is characterized in that the LED module 1 includes: cloche 11 and at least one LED light 10, institute
It states and is provided with hollow heat insulation cavity 110 in cloche 11, and/or be provided with high temperature resistant heat insulation painting on the surface of the cloche 11
Layer (not indicating).The light that at least one described LED light 10 issues is through the cloche 11 and penetrates the hollow heat insulation cavity
110 and/or the high temperature resistant heat insulation coating (not indicating) be irradiated to it is described high-temperature heating case 2 inside.
When being equipped with the hollow heat insulation cavity 110 in the cloche 11, it is set as in the hollow heat insulation cavity 110
Vacuum or inert gas filled with light-permeable.
The LED module 1 further include: heat-conductive assembly (does not indicate), and the heat-conductive assembly (not indicating) is equipped with construction opening
(not indicating), the cloche 11 cover at the construction opening (not indicating).The heat-conductive assembly (not indicating) is used for glass
The heat transfer of glass cover 11 is taken away, and the heat-conductive assembly (not indicating) can be further reduced heat transfer to LED light 10, and energy
It is enough preferably to reach heat dissipation effect.Wherein, the transmission path of heat includes: first path: high temperature heat source-cloche 11- is thermally conductive
Component (does not indicate), is radiated in this path by heat-conductive assembly (not indicating);Second path: high temperature heat source-cloche 11-LED
Lamp 10;Since the heat dissipation of first path increases, the heat transfer in the second path can be reduced.That is, above-mentioned heat-conductive assembly (not indicating)
It can make LED light 10 is heated to reduce, heat insulation is more preferably.
It should be understood that heat-conductive assembly is settable or is not provided with radiator 15 as shown in Figure 3, it is being not provided with
In the embodiment of radiator 15, heat-conductive assembly can only have heat conducting frame 12, i.e., only carry out thermally conductive and dissipate by heat conducting frame 12
Heat;And in the embodiment for being provided with radiator 15, as heat-conductive assembly includes heat conducting frame 12 as shown in Figure 3 and heat dissipation
Device 15, i.e., carried out thermally conductive by heat conducting frame 12, and is further radiated by radiator 15.
Is additionally provided with installation cavity (not indicating) in the heat-conductive assembly (not indicating), the construction opening (not indicating) with it is described
Installation cavity (not indicating) connection, the LED light 10 is located in the installation cavity (not indicating) or the LED light 10 is positioned at described
Installation cavity (not indicating) is outside and the light of the sending of the LED light 10 can sequentially pass through the installation cavity (not indicating) and the glass
Cover 11.The LED light 10 is set in installation cavity (not indicating), is guided heat by heat-conductive assembly (not indicating), is so entered
Heat in installation cavity (not indicating) is also reduced, and reduces heat transfer to the LED light being located in installation cavity (not indicating)
10;Alternatively, the light that the LED light 10 is located at the installation cavity (not indicating) outside and the LED light 10 issues can sequentially pass through
The installation cavity (not indicating) and the cloche 11 guide heat by heat-conductive assembly (not indicating), so enter installation cavity
Heat in (not indicating) is reduced, thus heat transfer to be located at the LED light 10 of installation cavity (not indicating) outside heat
It can reduce, so as to reach heat dissipation effect.
The heat-conductive assembly (not indicating) includes: heat conducting frame 12 and radiator 15, and one end of the heat conducting frame 12 is set
Have the construction opening (not indicating), the radiator 15 is connected to the other end of the heat conducting frame 12, and with it is described thermally conductive
Frame 12 is enclosed the installation cavity (not indicating).Installation cavity be heat conducting frame 12 as shown in Figure 3 inner cavity and with
Radiator 15 positioned at 12 bottom of heat conducting frame covers a be enclosed cavity;Will be understood, installation cavity it is upper
End opening is covered by cloche 11.The heat-conductive assembly (not indicating) extends internally shape close to the internal partial wall of the LED light 10
At fixed plate 121.The heat conducting frame 12 can be thermally conductive, and the radiator 15 can radiate.Wherein, the transmission path of heat includes:
First path: high temperature heat source-cloche 11- heat conducting frame 12- radiator 15 is distributed heat by radiator 15 in this path
To other than high temperature heater box 2;Second path: high temperature heat source-cloche 11- installation cavity (not indicating)-radiator 15, in this path
Heat can equally be distributed to outside high temperature heater box 2 by radiator 15.
It should be noted that circuit board 14, LED light 10, the installation site of heat conducting frame 12 and radiator 15 can be according to realities
Border needs to be combined setting, for example, 14 plate of circuit is directly mounted at radiator 15;Alternatively, circuit board 14 is mounted on installation cavity
In (not indicating), it is not directly contacted with heat conducting frame 12, is also not directly contacted with radiator 15;Or circuit board 14 be installed on it is scattered
Between hot device 15 and heat conducting frame 12, as shown in Figure 1, being specifically installed at fixed plate 121, and due to 121 heat of fixed plate
Higher, directly contact will lead to heat transfer higher heat to circuit board 14, influence work and the service life of circuit board 14 and LED light 10,
Therefore, it needs further exist for again that high temperature resistant heat insulation block 13, the high temperature resistant heat insulation block 13 are arranged between fixed plate 121 and circuit board 14
It can be avoided circuit board 14 and heat conducting frame 12 directly contact, influence or damage circuit board 14 and LED light 10.Therefore, the electricity
Road plate 14, LED light 10, the installation site of heat conducting frame 12 and radiator 15 can be combined setting according to actual needs, be not required to
Stick to restriction of the invention.
The LED module 1 further include: circuit board 14, the LED light 10 are installed on the circuit board 14 towards the glass
The side of cover 11, the circuit board 14 are fixedly connected on the fixed plate 121, and the circuit board 14 and the fixed plate 14 it
Between be equipped with high temperature resistant heat insulation block 13.The high temperature resistant heat insulation block 13 can be avoided circuit board 14 and heat conducting frame 12 directly contacts,
Influence or damage circuit board 14 and LED light 10.
At least one buckle is respectively arranged at least two opposite inner walls of the construction opening (not indicating)
123, at least one card slot 113, a buckle 123 are respectively arranged at least two opposite sides of the cloche 11
Correspondence is connected in a card slot 113, for the heat-conductive assembly (not indicating) and the cloche 11 to be connected as one.Institute
It states and is respectively arranged at least one at least two opposite lateral surfaces of heat-conductive assembly (not indicating) for adding with the high temperature
The elastic piece structure 122 that hot tank is connected together.The present invention is by way of buckle 123 and card slot 113 to cloche 11 and thermally conductive group
Part (not indicating) is attached fixation, and installation and removal are more convenient, convenient for replacing after 10 aging of LED light to LED light 10.
The heat conducting frame 12 extends inwardly to form fixed plate 121, the LED close to the internal partial wall of the LED light 10
Mould group 1 further include: circuit board 14, the LED light 10 is installed on side of the circuit board 14 towards the cloche 11, described
Circuit board 14 is fixedly connected on the fixed plate 121, and between the circuit board 14 and the fixed plate 121 be equipped with high temperature resistant every
Heat block 13, for being thermally shielded between the circuit board 14 and the fixed plate 121.The radiator 15 fits in described
Circuit board 14 deviates from the one side of the cloche 11.The LED module 1 further include: at least one screw 16, the fixed plate
It is described at least provided with one second screw hole 136 on the high temperature resistant heat insulation block 13 at least provided with one first screw hole 126 on 121
At least provided with a third screw hole 146 on circuit board 14, at least provided with one the 4th screw hole 156 on the radiator 15.It is described
Screw 16 is corresponding in turn to across first screw hole 126, second screw hole 136, the third screw hole 146 and the 4th spiral shell
The heat conducting frame 12, the high temperature resistant heat insulation block 13, the circuit board 14 and the radiator 15 are fixed as one by hole 156
Body.
The heat of cloche 11 is guided by heat-conductive assembly (not indicating), is by a kind of LED module 1 provided by the invention
LED light 10 it is heated reduce, heat insulation is more preferably;Installation cavity (not indicating) is set in heat-conductive assembly (not indicating), passes through peace
It behave affectedly and (does not indicate) and is further heat-insulated;Heat is dispersed by increasing radiator 15, is reduced so that LED light 10 is heated, it is heat-insulated
Better effect;By the way that high temperature resistant heat insulation block 13 is arranged between fixed plate 121 and circuit board 14, in the circuit board 14 and institute
It states and is thermally shielded between fixed plate 121, so that the heated reduction of LED light 10, circuit board 14, heat insulation is more preferably.Wherein,
Whether needing to install radiator 15 and high temperature resistant heat insulation block 13 in LED module 1 simultaneously can be configured according to actual needs, be not required to
Stick to restriction of the invention.
The present invention also provides a kind of high-temperature heating case 2, the high-temperature heating case 2 includes: cabinet 20 and is connected to described
The chamber door (not indicating) of cabinet 20 is equipped with described in the claims any one of 1-8 in the cavity wall of the inner cavity of the cabinet 20
LED module 1 inside of the cabinet 20 is illuminated.
For the ease of connection structure restriction, the present invention is with the direction that the light that LED light 10 issues advances in LED module 1
With reference to the position restriction for carrying out component, for example, " side " face of metallic support 12 is arranged in elastic piece structure 122, fixed plate 121 is arranged
On " bottom edge " of metallic support 12, the light that LED light 10 issues passes through the "inner" portion for being set in metallic support 12.
Specifically, with reference to the accompanying drawing, the embodiment of the present application is further elaborated.
Embodiment one
Referring to Figure 1, Fig. 2, Fig. 3 and Fig. 4, the embodiment provides a kind of LED module 1, the LED module 1
Including at least one LED light 10, the LED module further include: cloche 11, metallic support 12, high temperature resistant heat insulation block 13, circuit
Plate 14 and radiator 15.The inside that the light that LED light 10 issues is irradiated to high temperature insulating case through cloche 11 is illuminated.
Above-mentioned cloche 11 is internally provided with a closed hollow heat insulation cavity 110, is in the hollow heat insulation cavity 110
Vacuum or inert gas filled with light-permeable, for completely cutting off heat;Or in 11 surface of cloche (including but not limited to institute
State the first bottom surface 111 and/or the second bottom surface 112 of cloche 11) on be provided with high temperature resistant heat insulation coating (not indicating), it is described resistance to
High temperature thermal insulation coating (not indicating) is for completely cutting off heat.The heat for avoiding the high temperature heat source inside high temperature insulating case from issuing is radiated
LED light 10 causes LED light 10 to burn out, while the light that LED light 10 is issued can be irradiated to high temperature by hollow heat insulation cavity 110
The inside of hot box.At least one described LED light 10 is close to the first bottom surface 111 of the cloche 11, at least one described LED
After the light that lamp 10 issues is through first bottom surface 111 of the cloche 11 and the hollow heat insulation cavity 110, through described
Second bottom surface 112 of cloche 11 is irradiated to the inside of the high-temperature heating case.At least two of the cloche 11 are opposite
At least one card slot 113 is respectively arranged on side, for the cloche 11 to be fastened on the metallic support 12.
It, can be by only will be set as vacuum in hollow heat insulation cavity 110 or be filled in other some embodiments
The inert gas of light-permeable, perhaps by be only provided on 11 surface of cloche high temperature resistant heat insulation coating (not indicating) or
By being thermally shielded in conjunction with above two mode, the restriction for sticking to the embodiment of the present application is not needed.In addition, the hollow heat insulation
The heat-barrier material that other light-permeables can also be filled in cavity 110 does not need the inert gas for being limited to vacuum or light-permeable, can
To be configured according to actual needs, the restriction for sticking to the embodiment of the present application is not needed.The number of the hollow heat insulation cavity 110
Amount may be configured as the cavity of multiple small volumes it is also not necessary to be defined in one as shown in drawings when needed, and every
The intracavitary of one cavity also fills different heat-barrier materials, and the quantity and volume of above-mentioned hollow heat-insulation chamber body 110 can be according to practical need
It is configured, does not need the restriction for sticking to the embodiment of the present application.
In embodiments of the present invention, the cloche 11 is a square hollow glass, and the second bottom surface 112 extends outward
So that the area of the second bottom surface 112 is greater than the area of first bottom surface 111, it is solid for being engaged with the metallic support 12
It is scheduled on the inner wall of high-temperature heating case.The quantity of the card slot 113 is two, is separately positioned on the two of the square glass cover 11
On a opposite side, it is more firm that symmetrical design is conducive to installation.
In other some embodiments, material, size, the first bottom surface 111 and the second bottom surface 112 of the cloche 11
Shape, thickness, the thickness of 11 side of cloche, the quantity of card slot 113, card slot 113 be arranged position, whether card slot 113 need
It wants four sides to be all arranged, whether need to be set as vacuum or full of light-permeable in the closed hollow heat insulation cavity 110
Inert gas etc. can be configured according to actual needs, not need the restriction for sticking to the embodiment of the present invention.
It is noted that if high-temperature heating case interior lighting needs to select illuminating color, except through replacing the LED
Outside the color of lamp 10, the hollow heat insulation cavity 110 of cloche 11 can also be replaced by the material or color of change cloche 11
Interior (inertia) gas is that a certain specific gas changes illuminating color, on the surface of cloche 11 (including but not limited to the
One bottom surface 111 and/or the second bottom surface 112) on patch/plating set the modes such as colored film select need illuminating color, be not required to
Stick to the setting in the embodiment of the present application.
The high temperature resistant heat insulation coating (not indicating) is also provided on the surface of the cloche 11, wherein described
The surface of cloche 11 includes but is not limited to the second bottom surface 112 and/or the first bottom surface 111 of the cloche 11.It is described resistance to
High temperature thermal insulation coating (not indicating) has and has very high permeability to visible light, and (heats in high-temperature heating case to far infrared
When heat radiation) have the performance of very high reflectance, can effectively stop the high temperature being heated at high temperature in case to external low temperature field
Hot-fluid radiation.If the surface of 11 part of cloche in high-temperature heating case is coated with high temperature resistant heat insulation coating (not indicating), in height
When warm heater box heats, the temperature in high-temperature heating case is to external radiation, most of after encountering high temperature resistant heat insulation coating (not indicating)
It is reflected back the inside of high-temperature heating case by high temperature resistant heat insulation coating (not indicating), least partially penetrates cloche 11 and is radiated outside sky
In gas or on metallic support 12.
In embodiments of the present invention, for vacuum or it is filled with the inert gas of light transmission in the hollow heat insulation cavity 110, and
High temperature resistant heat insulation coating (not indicating) is additionally provided on the second bottom surface 112 and/or the first bottom surface 111 of the cloche 11.
In other some embodiments, the inside of the hollow heat insulation cavity 110 is set as vacuum or light transmission indifferent gas
High temperature resistant heat insulation coating (not indicating) is arranged on body and cloche 11 can be only arranged wherein according to the factors such as cost or demand
One kind, can also be assembled in LED module with both of which, the high temperature resistant heat insulation coating (not indicating) plating sets/coating/and is fitted in
The case where second bottom surface 112 of the cloche 11 and/or the first bottom surface 111, which can according to need, to be configured, and does not need to arrest
Mud is in the restriction of the embodiment of the present invention.
An above-mentioned metallic support 12 at least bottom edge extends a part inwardly and forms at least one piece of fixed plate 121, described
Cloche 11 is located on the metallic support 12 and the fixed plate 121 is close to first bottom surface 111, the fixed plate
121 for the metallic support 12 and the high temperature resistant heat insulation block 13, circuit board 14 and radiator 15 to be fixed together.Institute
It states and is respectively arranged at least one buckle 123 at least two opposite sides of metallic support 12, the cloche 11 is extremely
At least one card slot 113, a corresponding card slot 113 of the buckle 123, institute are respectively arranged on few two opposite sides
Buckle 123 and card slot 113 are stated for the metallic support 12 and the cloche 11 to be fixed as one.The metallic support 12
At least two opposite sides on be respectively arranged at least one elastic piece structure 122, the elastic piece structure 122 will be for will be described
On the fixed interior wall opening for being fastened on high-temperature heating case of metallic support 12.
In an embodiment of the present invention, above-mentioned heat-conductive assembly (not indicating) is in the present embodiment metallic support 12 and heat dissipation
Device 15, above-mentioned heat conducting frame 12 are metallic support 12 in the present embodiment, wherein the metallic support 12 is a supreme bottom surface
Cuboid, above-mentioned construction opening (not indicating) be the metallic support 12 a hollow out bottom surface, above-mentioned installation cavity (not indicating)
The hollow space enclosed by the metallic support 12;In other some embodiments, the heat conducting frame 12 can be with
It is other high temperature resistants, thermal conductivity by force and with the bracket that certain elastic material is cast, for example, it is also possible to be high temperature resistant, thermally conductive
The strong ceramics etc. of property, the shape and volume size of the heat conducting frame 12 can also be designed according to actual needs, not need
Stick to the restriction of the embodiment of the present invention.
In embodiments of the present invention, the metallic support 12 is a square frame, can just be set in the cloche
Outside 11 first bottom surface, 111 side;The fixed plate 121 is two pieces, respectively from two opposite bottom edges of metallic support 12 to metal
The inside of bracket 12 extends to form;The buckle 123 is four, is separately positioned on the side of two opposite metallic supports 12,
And every one side is provided with two;The elastic piece structure 122 is four, is separately positioned on the side of two opposite metallic supports 12
On, and every one side is provided with two;And the buckle 123 and the elastic piece structure 122 are not disposed on same metallic support 12
Side on.The metallic support 12 by the heat transfer received from 11 side of cloche and can be radiated high-temperature heating case
Outside wall.
In other some embodiments, the shape of the metallic support 12, size can according to need the cooperation glass
Glass cover 11 is configured, the fixed plate 121 which bottom edge whichaway of metallic support 12 extend how long etc. can basis
Need to be configured, the buckle 123, the quantity of elastic piece structure 122, setting position can according to need and be configured, with
On do not need to stick to the restriction of the embodiment of the present application.
Above-mentioned high temperature resistant heat insulation block 13 is at least one, and the side correspondence of a high temperature resistant heat insulation block 13 is fitted in an institute
It states on side of the fixed plate 121 far from the cloche 11.The high temperature resistant heat insulation block 13 is for completely cutting off conduction to metallic support
12 heat is further conducted to the circuit board 14.The coefficient of heat conduction of the high temperature resistant heat insulation block 13 is minimum, uses resistance to height
After warm heat insulation 13 separates metallic support 12 and circuit board 14 and radiator 15, only few heat can pass through resistance to height
Warm heat insulation 13 is transmitted on circuit board 14 and radiator 15.In embodiments of the present invention, the material of high temperature resistant heat insulation block 13 can
To be polyester encryption heat-barrier material, LCP engineering plastics etc., the quantity of the high temperature resistant heat insulation block 13 and the fixed plate 121
Quantity is all two.In other some embodiments, material, quantity, volume size of the high temperature resistant heat insulation block 13 etc. can
It is configured as needed, does not need the restriction for sticking to the embodiment of the present invention.
Foregoing circuit plate 14 is fitted in the other side (not being bonded the side of fixed plate 121) of the high temperature resistant heat insulation block 13
On, at least one described LED light 10 is uniformly arranged on the circuit board 14 close to the fixed plate 121 and high temperature resistant heat insulation block 13
Side on.In embodiments of the present invention, the quantity of the LED light 10 is six, and six LED light 10 are by circuit
Tin cream is coated on plate 14, is crossed Reflow Soldering and is attached on circuit board 14, the back side (the one of non-mounted LED lamp 10 of the circuit board 14
Face) it is coated with heat-conducting medium and is fitted on radiator 15, after the heat that LED light 10 radiates when shining penetrates circuit board 14
Heat-conducting medium is transferred to radiator 15 and guides heat, to prevent LED light 10 because high temperature is burned.In other some implementations
In example, size, quantity, the model etc. of the LED light 10 can be configured as needed, not need to stick to the embodiment of the present invention
Restriction.
Above-mentioned radiator 15 is fitted in the side that the circuit board 14 does not install the LED light 10.The radiator 15 is used
In guiding heat, to prevent LED light 10 because high temperature is burned.
The LED module 1 further includes at least one screw 16, at least provided with one first screw hole in the fixed plate 121
126, at least provided with one second screw hole 136 on the high temperature resistant heat insulation block 13, at least provided with one on the circuit board 14
Three screw holes 146, at least provided with one the 4th screw hole 156 on the radiator 15.The screw 16 is corresponding in turn to across described
One screw hole 126, the second screw hole 136, third screw hole 146 and the 4th screw hole 156 are by the metallic support 12, the high temperature resistant heat insulation
Block 13, the circuit board 14 and the radiator 15 are fixed as one.
In embodiments of the present invention, the number of the screw 16, the first screw hole 126, third screw hole 146 and the 4th screw hole 156
Amount is all three, and the quantity of second screw hole 136 is six, the screw 16, the first screw hole 126, the second screw hole 136, the
Three screw holes 146 and the cross-sectional area of the 4th screw hole 156, radius size are equal.In other some embodiments, the screw
16, quantity, size, length, the shape, material of the first screw hole 126, the second screw hole 136, third screw hole 146 and the 4th screw hole 156
Etc. that can be configured as needed, the restriction for sticking to the embodiment of the present invention is not needed.
When LED module 1 in assembling/assembly the embodiment of the present application, firstly, the back side to be coated to the circuit board 14 of heat-conducting medium
It is fitted on radiator 15, the third screw hole 146 of the circuit board 14 is aligned with the 4th screw hole 156 of radiator 15.Secondly, will
The superposition of high temperature resistant heat insulation block 13 is placed on the circuit board 14, and by 136 He of the second screw hole of the high temperature resistant heat insulation block 13
The third screw hole 146 of the circuit board 14 is aligned.Then, the superposition of metallic support 12 is placed on the high temperature resistant heat insulation block 13
Side, and the second screw hole 136 of the first screw hole 126 of the metallic support 12 and high temperature resistant heat insulation block 13 is aligned, and use screw
16 pass through the first screw hole 126, the second screw hole 136, third screw hole 146 and the 4th screw hole 156 for the metallic support 12, high temperature resistant
Heat insulation 13, circuit board 14 and radiator 15 are fixed together.Finally, the card slot 113 of cloche 11 is fastened on the metal
Assembly can be completed on the buckle 123 of bracket 12.
Fig. 5 is referred to, the LED module 1 after being completed can be by by other of cloche 11 and LED module 1
Component 22 is separated, and the other component 22 of LED module 1 is placed on high-temperature heating 2 inner wall outside of case, cloche 11 is placed on high temperature
2 inner wall of heater box, by the metallic support 12 on cloche 11 and the other component of LED module 1 22 be fastened togather to
LED module 1 is fixed on the inner wall of high-temperature heating case 2, and the elastic piece structure 122 of metallic support 12 can be to high-temperature heating case
LED module 1 is further fixed on the inner wall of high-temperature heating case 2 by the stress that 2 interior wall opening applies vertical direction.
When being heated at high temperature the work of case 2, the heat that the high temperature heat source being arranged in the high-temperature heating case 2 is issued is placed on
The cloche 11 being heated at high temperature in case 2 heats, since cloche 11 is internally provided with hollow heat insulation cavity, in hollow heat insulation cavity
Vacuum or light-permeable inert gas cannot conduct, convection current, radiations heat energy.Cloche 11 is radiated in high-temperature heating case 2
Heat a part is gone back by glass surface (and/or high temperature resistant heat insulation coating) radiation, and a part of heat is transmitted to metallic support
On 12, then by 12 radiation high-temperature heater box of metallic support, 2 cabinet outer periphery air.Due to metallic support 12 and circuit board
High temperature resistant heat insulation block 13 is provided between 14, only few a part of heat is conducted to by high temperature resistant heat insulation block 13 and screw 16
Circuit board 14 or radiator 15, then high-temperature heating is conducted heat to by way of convection current or radiation by 15 surface of radiator
In 2 cabinet outer periphery air of case.In addition, the heat that LED light 10 itself issues can also be conducted to scattered when LED module 1 works
Hot device 15 is transmitted in high-temperature heating 2 cabinet outer periphery air of case.The skies such as settable air duct on the outside of high-temperature heating 2 cabinet of case
The heat that radiator 15 and metallic support 12 radiate is conducted by modes such as convection current, radiation and is dispersed by gas circulative metabolism
In external environment.
Structure design through this embodiment, the embodiment provides a kind of LED module 1, the LED module 1
Including at least one LED light 10, the LED module 1 further include: cloche 11, it is closed that the cloche 11 is internally provided with one
Light-permeable inert gas or hollow heat insulation cavity 110 for vacuum.By be arranged the hollow heat insulation cavity 110 and its
He designs structure, and LED module 1 can work under high temperature environment to avoid LED light 10 and be burned out, and can be used for being heated at high temperature case
Interior lighting, LED module 1 may be mounted in the high temperature heater box such as micro-wave oven, oven, and installation is simple, time saving and energy saving.
Embodiment two
Referring to Figure 1 and Fig. 5, the embodiment of the invention provides a kind of high-temperature heating casees 2, comprising: cabinet 20 and chamber door are (not
Diagram), the inner cavity of the cabinet 20 illuminates the inside of the cabinet using the LED module 1 of above-described embodiment one kind, and
The inner cavity of the cabinet 20 is provided with high temperature heat source (not shown).The high temperature heat source (not shown), which can be, to be arranged in the case
On the internal chamber wall of body 20, it is also possible to be arranged in the other positions inside the cabinet 20.Have on the outer wall of the cabinet 20
One opening 21, when installation, the other component 22 of the cloche 11 of the LED module 1 and LED module 1 is separated, LED mould
All elements (the including but not limited to above-mentioned LED light 10, cloche 11, metallic support 12, high temperature resistant of the other component 22 of group 1
Heat insulation 13, circuit board 14 and radiator 15 and screw 16 etc.) first installation is integrated, then the other component 22 of LED module 1 is detained
In the opening 21 of 20 outer wall of cabinet, then the cloche 11 engages from the opening 21 of 20 inner wall of cabinet with other component 22
It fixes.
Wherein, in embodiments of the present invention, the area of the opening 21 of 20 outer wall of cabinet is less than the cloche 11 the
The area of two bottom surfaces 112, and the area of the opening 21 of 20 outer wall of the cabinet is slightly larger than or is equal to 11 first bottom of cloche
The area in face 111.Second bottom surface 112 of the cloche 11 and the metallic support 12 are formed when engaging in the opening 21
One card slot firmly engages the inner wall (being equivalent to buckle) of the high-temperature heating case 2 of 21 surrounding edges of the opening.At other
Some embodiments in, the area of the second bottom surface 112 of the cloche 11 be not necessarily required to be greater than it is described opening 21 area,
The LED module 1 is fixed on the inner wall of the high-temperature heating case 2 can also be using other modes, for example, can be using solid
It is viscous to determine glue, is perhaps screwed or is arranged the modes such as mounting groove placement, do not need to stick to the embodiment of the present invention
Restriction.
In some embodiments, Fig. 6 is referred to, Fig. 6 is that LED module 1 provided in an embodiment of the present invention is fixed in oven
Overhead sectional view schematic diagram.11 surface of cloche being placed in inside the oven is coated with one layer of high temperature resistant heat insulation coating, described
High temperature resistant heat insulation coating has a very high permeability to visible light, and has very high reflectivity to far infrared, the high temperature resistant every
Hot coating can effectively stop the high temperature in oven to radiate to the hot-fluid of external low temperature field.Due to the cloche 11 in oven
Partial surface plating is equipped with high temperature resistant heat insulation coating, and when beginning to warm up inside oven, the temperature in oven is encountered to external radiation
It is most of to be reflected back inside oven by high temperature resistant heat insulation coating after the high temperature resistant heat insulation coating, least partially penetrate cloche 11
In the air for radiating outside.
In embodiments of the present invention, the quantity of the LED module 1 be two, the high-temperature heating case 2 can be oven,
The heating devices such as micro-wave oven.In other some embodiments, quantity, position, the size etc. of the LED module 1 and opening 21
It can be configured as needed, the high-temperature heating case 2 is also possible in other cabinets 20 in the condition of high temperature and needs pair
Other devices illuminated in cabinet 20, do not need the restriction for sticking to the embodiment of the present invention.
Structure through this embodiment designs, and provides a kind of high-temperature heating case 2, the high temperature in the embodiment of the present invention
Heater box 2 includes the cabinet 20 for having at least one opening 21, and the LED module 1 in above-described embodiment one can be mounted on
In the opening 21 of the cabinet 20, and installation is simple, time saving and energy saving.
Provided in the embodiment of the present invention it is a kind of can be applied to high-temperature heating case interior lighting LED module and high temperature add
Hot tank;The LED module inside cloche by being arranged a closed inert gas full of light transmission or being the hollow of vacuum
Heat-insulated cavity is thermally shielded to inside high-temperature heating case with LED light, can work under high temperature environment to avoid LED light 10 by
It burns.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;At this
Under the thinking of invention, it can also be combined between the technical characteristic in above embodiments or different embodiments, and exist as above
Many other variations of the different aspect of the invention, for simplicity, they are not provided in details;Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
It states documented technical solution in each embodiment to modify, or wherein regional development and technology feature is equivalently replaced;And this
It modifies or replaces, the range of technical solution in various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of LED module, applied to the interior lighting of high-temperature heating case, the high-temperature heating case is internally provided with high warm
Source, which is characterized in that the LED module includes: cloche and at least one LED light;
Hollow heat insulation cavity is provided in the cloche, the light that at least one described LED light issues can penetrate the glass
Cover and the inside that the high-temperature heating case is irradiated to through the hollow heat insulation cavity;
And/or high temperature resistant heat insulation coating is provided on the surface of the cloche, the light that at least one described LED light issues can
The inside of the high-temperature heating case is irradiated to through the cloche and through the high temperature resistant heat insulation coating.
2. LED module according to claim 1, which is characterized in that when in the cloche be equipped with the hollow heat insulation chamber
When body, vacuum or the inert gas filled with light-permeable are set as in the hollow heat insulation cavity.
3. LED module according to claim 1, which is characterized in that the LED module further include: heat-conductive assembly, it is described to lead
Hot component is equipped with construction opening, and the cloche covers at the construction opening.
4. LED module according to claim 3, which is characterized in that be additionally provided with installation cavity, the peace in the heat-conductive assembly
Dress opening is connected to the installation cavity;
The LED light is located in the installation cavity or the LED light is located at the light that outside the installation cavity and the LED light issues
The installation cavity and the cloche can be sequentially passed through.
5. LED module according to claim 4, which is characterized in that the heat-conductive assembly includes: heat conducting frame and heat dissipation
One end of device, the heat conducting frame is equipped with the construction opening, and the radiator is connected to the other end of the heat conducting frame, and
The installation cavity is enclosed with the heat conducting frame.
6. LED module according to claim 4, which is characterized in that the heat-conductive assembly is in the part of the LED light
Wall extends inwardly to form fixed plate;The LED module further include: circuit board, the LED light are installed on the circuit board towards institute
The side of cloche is stated, the circuit board is fixedly connected on the fixed plate, and sets between the circuit board and the fixed plate
There is high temperature resistant heat insulation block.
7. LED module according to claim 3, which is characterized in that the opposite inner wall of at least two of the construction opening
At least one buckle is respectively arranged on face, at least two of the cloche are respectively arranged at least one on opposite side
Card slot, a buckle correspondence are connected in a card slot, the heat-conductive assembly and the cloche are connected as one.
8. LED module according to claim 3, which is characterized in that the opposite outside of at least two of the heat-conductive assembly
At least one elastic piece structure for being connected together with the high-temperature heating case is respectively arranged on face.
9. LED module according to claim 5, which is characterized in that
The heat conducting frame extends inwardly to form fixed plate, the LED module close to the internal partial wall of the LED light further include:
Circuit board, the LED light are installed on side of the circuit board towards the cloche, and the circuit board is fixedly connected on described
Fixed plate, and high temperature resistant heat insulation block is equipped between the circuit board and the fixed plate, in the circuit board and described
It is thermally shielded between fixed plate;
The radiator fits in the one side that the circuit board deviates from the cloche;
The LED module further include: at least one screw, at least provided with one first screw hole, the resistance to height in the fixed plate
At least provided with one second screw hole on warm heat insulation, at least provided with a third screw hole on the circuit board, on the radiator
At least provided with one the 4th screw hole;
The screw is corresponding in turn to across first screw hole, second screw hole, the third screw hole and the 4th screw hole
The heat conducting frame, the high temperature resistant heat insulation block, the circuit board and the radiator are fixed as one.
10. a kind of high-temperature heating case characterized by comprising cabinet and the chamber door for being connected to the cabinet, the cabinet it is interior
LED module described in any one of the claims 1-9 is installed to illuminate the inside of the cabinet in the cavity wall of chamber.
Priority Applications (1)
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CN201910172113.2A CN109751540A (en) | 2019-03-07 | 2019-03-07 | A kind of LED module and high-temperature heating case |
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CN201910172113.2A CN109751540A (en) | 2019-03-07 | 2019-03-07 | A kind of LED module and high-temperature heating case |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113483288A (en) * | 2021-07-12 | 2021-10-08 | 宁波市康辰光电科技有限公司 | LED working lamp |
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