CN109729693B - 一种用于封闭在壳体中的生热电子器件的冷却*** - Google Patents

一种用于封闭在壳体中的生热电子器件的冷却*** Download PDF

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CN109729693B
CN109729693B CN201811168270.8A CN201811168270A CN109729693B CN 109729693 B CN109729693 B CN 109729693B CN 201811168270 A CN201811168270 A CN 201811168270A CN 109729693 B CN109729693 B CN 109729693B
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vsd
cooling
manifold
fluid
cooling fluid
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CN109729693A (zh
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康斯坦丁·波利索夫
马克·A·尼尔森
杰弗里·A·马丁内利
布莱恩·L·斯托弗
赛斯·K·格兰特菲尔特
迈克尔·S·托德
伊万·杰德瑞克
杰布·W·施雷柏
蒂姆·贝克利
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Johnson Controls Tyco IP Holdings LLP
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B31/00Compressor arrangements
    • F25B31/006Cooling of compressor or motor
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M5/00Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/40Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02PCONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14322Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20354Refrigerating circuit comprising a compressor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381Thermal management, e.g. evaporation control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927Liquid coolant without phase change

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种变速驱动装置包括连接至交流电源的转换器、连接至所述转换器的直流环节、以及连接所述直流环节的逆变器。所述逆变器将直流电压转换成具有可变电压和频率的输出交流电。所述逆变器包括至少一个电力电子器件模块和相关联的控制电路;与所述电力电子器件模块热连通并且与歧管流体连通的散热器。所述歧管包括具有流体连通的至少一个竖直构件部和至少一个水平构件部的管状构件。多个端口将冷却流体导入和导出所述歧管。托架将所述歧管附接至结构框架。提供托架以便将电力电子器件模块附接至所述歧管。

Description

一种用于封闭在壳体中的生热电子器件的冷却***
本申请是申请日为2015年12月8日、国际申请号为 PCT/US2015/064402、国家申请号为201580006852.4、发明名称为“一种变速驱动***以及一种用于封闭在壳体中的生热电子器件的冷却***”的发明专利申请的分案申请。
技术领域
本申请总体上涉及一种用于变速驱动装置的冷却歧管。本申请更具体涉及一种用于变速驱动装置(variable speed drive)的结构框架冷却歧管。
背景技术
容纳电力开关器件的电气面板产生大量热量,这些热量必须移除以使得电子部件不会由于温度过高而发生故障。在诸如电机控制中所使用的变速驱动装置的应用和暖通空调(HVAC)应用中,所使用的电气面板通常将软管用于分配冷却剂并将钢构件用于结构支撑。
发明内容
本公开内容公开了一种起到冷却流体歧管和结构构件作用的单个零件。软管可能发生故障和导致流体接触电气齿轮内的通电部件或总线,从而造成短路或设备停机。所公开的布置消除了软管的使用或将软管的使用减到最少并且提供与支撑电气柜和安装在柜内的电气部件的结构构件成为一体的冷却通道。
所公开的***和/或方法的预期优点满足这些需求中的一个或多个需求或者提供其他有利特征。从本说明书中将使其他特征和优点明显。
一个实施例涉及一种变速驱动装置,所述变速驱动装置包括连接至交流电源的转换器、连接至所述转换器的直流环节、以及连接至所述直流环节的逆变器,所述逆变器被配置为将来自直流环节的直流电压转换成具有所述可变电压和所述可变频率的输出交流电,所述逆变器进一步包括至少一个电力电子器件模块和相关联的控制电路;与所述电力电子器件模块热连通并且与歧管流体连通的不导电散热器,所述歧管包括中空管状构件、用于将冷却流体导入和导出所述管状构件的多个端口、用于将所述歧管附接至结构框架上的至少一个托架、和用于将所述至少一个电力电子器件模块附接至所述管状构件上的至少一个托架。在示例性实施例中,所述管状构件包括与至少一个水平构件部流体连通的至少一个竖直构件部。
另一个实施例涉及一种歧管,所述歧管包括具有流体连通的至少一个竖直构件部和至少一个水平构件部的中空管状构件、用于将冷却流体导入和导出所述歧管的多个端口、用于将所述歧管附接至结构框架上的至少一个托架、和用于将电力电子器件模块附接至所述歧管上的至少一个托架。
本文中所描述的实施例的某些优点包括用于包括歧管的VSD的结构框架。歧管可以由用于循环液体冷却剂的中空不锈钢管构成。歧管提供用于连接 VSD冷却区的分配端口。歧管通过将VSD内的软管减到最少从而降低了冷却流体在VSD内分配的复杂度。歧管还为VSD内的部件提供结构支撑。通过使流体冷却的VSD内的软管减到最少从而降低了冷却***设计的复杂度。任何非腐蚀性材料,例如非腐蚀性金属、陶瓷或聚合物材料,均可用于歧管管子,或者涂覆歧管管子,从而防止腐蚀。
附图说明
图1示出了商务环境中的暖通空调和制冷((HVAC&R)***的示例性实施例。
图2示意性展示了图1的示例性实施例中可以使用的蒸汽压缩***的示例性实施例。
图3示出了具有冷却构件的示例性实施例的变速驱动***的一部分的分解图。
图4示出了示例性实施例中的位于电力电子器件组件上的多个冷却构件。
图5示出了封闭在VSD中的内部部件的示例性视图的立面图。
图6示出了图5中所示的内部部件的对面的侧视图。
图7示出了示例性冷却歧管的透视图。
图8示出了图7的冷却歧管的平面图。
图9示出了图7的冷却歧管的端视图。
具体实施方式
图1示出了用于典型商业设置的在建筑物12中的暖通空调***(HVAC ***)10的示例性环境。***10可以包括压缩机,所述压缩机可以合并到能够供应可以用于冷却建筑物12的冷冻液体的蒸汽压缩***14中。***10还可以包括锅炉16和配风***,所述锅炉16提供可以用于加热建筑物12的已加热液体,所述配风***使空气循环通过建筑物12。配风***可以包括回风管道 18、送风管道20和空气处理装置22。空气处理装置22可以包括热交换器,所述热交换器通过导管24连接至锅炉16和蒸汽压缩***14。取决于***10的运行模式,空气处理装置22中的热交换器可以从锅炉16接收已加热液体或从蒸汽压缩***14接收冷冻液体。***10示出了在建筑物12的每个楼层上的单独的空气处理装置,但将认识到楼层之间可以共享这些部件。
图2示意性展示了图1中的建筑物12中可以使用的、带有VSD 26的蒸汽压缩***14的示例性实施例。蒸汽压缩***14可以包括压缩机28、冷凝器 30、液体冷冻机或蒸发器32和控制面板34。通过由VSD 26供电的电机36驱动压缩机28。VSD 26从交流电源38接收具有具体的固定线电压和固定线频率的交流电并且向电机36提供处于所需电压和所需频率的交流电,电压和频率都可以改变以满足具体的要求。控制面板34可以包括各种不同的部件,诸如模数(A/D)转换器、微处理器、非瞬态存储器、和接口板,以控制蒸汽压缩***14的运行。控制面板34还可以用于控制VSD 26和电机36的运行。
压缩机28压缩制冷剂蒸汽并且通过排放管路将蒸汽输送至冷凝器30。压缩机28可以是任何合适类型的压缩机,例如,螺杆式压缩机、离心式压缩机、往复式压缩机、涡旋压缩机等。压缩机28输送至冷凝器30的制冷剂蒸汽与流体(例如,空气或水)形成热交换关系,并且由于与流体的热交换关系而经历相变成为制冷剂液体。来自冷凝器30的冷凝液体制冷剂流过膨胀装置 (未示出)到达蒸发器32。
蒸发器32可以包括冷却负载的供给管路与回流管路的连接。工艺流体(例如,水、乙二醇、氯化钙卤水或氯化钠卤水)经由回流管路行进到蒸发器 32中并且经由供给管路离开蒸发器32。蒸发器32中的液体制冷剂与工艺流体形成热交换关系从而降低工艺流体的温度。由于与工艺流体的热交换关系,蒸发器32中的制冷剂液体经历相变成为制冷剂蒸汽。蒸发器32中的蒸汽制冷剂离开蒸发器32并且通过抽吸管路返回到压缩机28从而完成循环。
图3示出了具有多个位于冷却构件42之上(over)的开关40的变速驱动装置26的一部分。针对不同的应用或HVAC***,VSD 26可以用于向电机提供所需电力。例如,这种电机可以驱动蒸汽压缩***的压缩机。VSD 26的开关40被描绘成带有3个双IGBT的英飞凌模块,但可以使用冷却构件42冷却需要冷却的其他半导体装置或其他电子部件。管道43、45连接至入口通道47 和出口通道49,以分别将冷却流体引入冷却构件42和将冷却流体移出冷却构件42。管道43和45或其他合适的流动通道连接至冷却***,该冷却***提供连续流动的冷却流体至冷却构件42。冷却流体应用于管道43,流经冷却构件 42,并且通过管道45流出。
各种不同的冷却流体(包括冷凝水、水、和已知制冷剂)可以在冷却构件 42内循环并且用于冷却电子部件。此外,各种不同的冷却***可以用于冷却流出冷却构件42的冷却流体。
冷却构件42冷却被用于为HVAC***的电机提供电力的VSD 26中的模块。这些模块可以以密封关系连接至冷却构件42。应用于冷却构件42的冷却流体可以是流经封闭环路中的冷却构件42和热交换器的水。热交换器在水被再次引入冷却构件42之前对水进行冷却。热交换器可以是管壳式热交换器,并且来自HVAC***的冷却塔的水可以用于冷却应用于冷却构件42的水。
图4示出了有待安装到VSD 26的部件上的多个冷却构件42。冷却构件42 竖直定位并且安装在部件74的侧部(例如,直流环节电容器)。在另一个实施例中,部件74可以被定向为朝着任何合适的方向,如竖直、水平、或对角取向。
接下来参照图5和图6,示出了封闭在VSD 26中的内部部件的示例性视图的立面图。歧管50安装在VSD 26的框架52内。歧管50包括呈90°角连接的水平管状构件54和竖直管状构件56,水平管状构件54和竖直管状构件56流体连通,以便冷却流体流动到供给联接器或端口58。供给端口58通过管道43与冷却构件42的入口通道47以流式连通方式连接,从而向安装在开关 40上的冷却构件42提供冷却流体。在冷却流体循环通过冷却构件42之后,冷却流体通过出口通道49离开冷却构件42并且流入回流导管62,并且从与回流导管62流体连通的排放端口64离开VSD 26。至少一个供给端口58被指定为连接至来源(未示出)的入口端口,用于将冷却流体接收进入歧管50。
参照图7至图9,示出了示例性歧管50。多个端口58沿着水平管状构件 54和竖直管状构件56定位。端口58的数量和位置可以根据应用(例如,开关 40的数量及其在框架52内的位置)而变化。角托架66沿着水平管状构件54 设置以便附接开关40。端托架68位于水平管状构件54和竖直管状构件56的远端,以便分别在端面板72和底座76附接至框架52。辅助角托架70也可以在邻近竖直管状构件56与水平管状构件54相交处附接至歧管50,从而将歧管 50连接至内部框架构件78。
歧管50向框架52和开关40提供结构支撑,同时将同一空间用作冷却流体的导管。双用途歧管在VSD 26内提供附加有用的空间并且减少将冷却构件 42与冷却流体来源连接所需的软管量。
应理解到,本申请不局限于以下说明中所阐述的或图中所展示的细节或方法。还应理解到,本文中所采用的措辞和术语仅仅是为了说明目的,而不应视为限制性的。
虽然图中所示的和本文中所描述的示例性实施例目前是优选的,但应理解的是,这些实施例仅是通过示例方式提供的。任何过程或方法步骤的顺序或次序可以根据替代性实施例被改变或被重新排序。
重要的是应注意各种示例性实施例中所示的变速驱动装置的构造和布置仅是说明性的。尽管本公开中已经详细描述了仅几个实施例,但审查本公开的人员将容易认识到在实质上不脱离权利要求书中所引用的主题的新颖性教导和优点的情况下可以进行许多修改(例如,各种元件的大小的变化、尺寸的变化、结构的变化、不同元件的形状和比例的变化、参数值的变化、安装布置的变化、材料使用的变化、颜色的变化、取向的变化等)。例如,示出为一体形成的元件可以由多个零件或元件构造而成,元件的位置可以颠倒或以其他方式变化,并且分立元件的性质或数量或位置可以更改或变化。相应地,所有这类修改都旨在被包括在本申请的范围内。任何过程或方法步骤的顺序或次序可以根据替代性实施例而不同或被重新排序。在权利要求书中,任何“方法加功能”的条款表述意欲涵盖本文中所描述的执行所引用的功能的结构,并且不仅涵盖结构等同物,而且还涵盖等同结构。在不脱离本申请的范围的情况下,可以对示例性实施例的设计、操作条件和布置进行其他替代、修改、改变和省略。

Claims (23)

1.一种用于变速驱动装置(VSD)的冷却***,所述冷却***包括:
歧管,所述歧管联接至所述VSD的框架和VSD部件以向所述VSD的所述框架和所述VSD部件提供结构支撑;
冷却构件,所述冷却构件联接至所述歧管并且与所述VSD部件处于热交换关系;
所述歧管的流体通道,所述流体通道被配置为使冷却流体流动通过所述歧管;以及
多个端口,所述多个端口沿所述歧管设置,其中所述多个端口与所述流体通道和所述冷却构件流体连通,使得所述多个端口能够使所述冷却流体在所述流体通道和所述冷却构件之间流动。
2.如权利要求1所述的冷却***,其中所述多个端口与冷却流体源流体连通,使得所述多个端口被配置为从所述冷却流体源接收所述冷却流体、并且将所述冷却流体从所述流体通道引导至所述冷却构件,并且其中所述冷却流体通过回流导管排放回所述冷却流体源。
3.如权利要求2所述的冷却***,其中所述冷却流体源是热交换器,所述热交换器被配置为将热能从所述冷却流体传输至所述热交换器的工作流体。
4.如权利要求3所述的冷却***,其中所述热交换器的所述工作流体是暖通空调(HVAC)***的制冷剂。
5.如权利要求1所述的冷却***,其中所述VSD部件以密封关系连接至所述冷却构件。
6.如权利要求1所述的冷却***,其中所述VSD部件是所述VSD的逆变器的开关。
7.如权利要求1所述的冷却***,其中所述VSD部件是直流(DC)环节电容器。
8.如权利要求1所述的冷却***,其中所述歧管包括第一构件和第二构件,所述第一构件联接至所述VSD的所述框架的底座,所述第二构件联接至所述VSD的所述框架的端面板,其中所述多个端口沿所述第二构件设置。
9.如权利要求8所述的冷却***,其中所述第一构件相对于所述VSD的所述框架的所述底座竖直地取向,且所述第二构件相对于所述VSD的所述框架的所述底座水平地取向。
10.如权利要求1所述的冷却***,其中所述歧管是由非腐蚀性材料制造的。
11.如权利要求10所述的冷却***,其中所述非腐蚀性材料是不锈钢。
12.如权利要求1所述的冷却***,其中所述歧管包括竖直管状构件和水平管状构件,并且所述多个端口沿着所述水平管状构件和所述竖直管状构件定位,其中角托架沿着所述水平管状构件设置以便附接所述VSD部件,并且端托架位于所述水平管状构件和所述竖直管状构件的远端,以便附接至所述VSD的所述框架。
13.一种暖通空调(HVAC)***,包括:
制冷剂环路;
压缩机,所述压缩机沿所述制冷剂环路设置,且被配置为使制冷剂循环通过所述制冷剂环路;
电机,所述电机被配置为驱动所述压缩机;
变速驱动装置(VSD),所述变速驱动装置被配置为向所述压缩机供电,其中所述VSD包括框架和多个部件,所述多个部件被配置为向所述电机提供处于可变电压和可变频率的交流电(AC);以及
用于所述VSD的冷却***,所述冷却***包括:
歧管,所述歧管联接至所述VSD的所述框架并且被配置为向所述VSD的所述框架和所述VSD的所述多个部件中的部件提供结构支撑;
冷却构件,所述冷却构件联接至所述歧管并且与所述VSD的所述多个部件中的所述部件处于热交换关系;
所述歧管的流体通道,所述流体通道被配置为使冷却流体流动通过所述歧管;以及
多个端口,所述多个端口沿所述歧管设置,其中所述多个端口与所述流体通道和所述冷却构件流体连通,使得所述多个端口能够使所述冷却流体在所述流体通道和所述冷却构件之间流动。
14.如权利要求13所述的HVAC***,其中所述VSD的所述多个部件包括:
转换器,所述转换器被配置成联接至提供输入交流(AC)电压的交流电源,并且所述转换器被配置为将所述输入交流电压转换成直流(DC)电压;
直流(DC)环节转换器,所述直流环节转换器联接至所述转换器,其中所述直流环节转换器被配置为对所述直流电压滤波并储存来自所述转换器的能量;以及
逆变器,所述逆变器连接至所述直流环节,并且所述逆变器被配置为将来自所述直流环节的所述直流电压转换成供应至所述电机的所述交流电。
15.如权利要求14所述的HVAC***,其中所述VSD的所述冷却***的所述冷却构件与所述逆变器的开关处于热交换关系。
16.如权利要求15所述的HVAC***,其中所述开关以密封关系连接至所述冷却构件。
17.如权利要求14所述的HVAC***,其中所述VSD的所述冷却***的所述冷却构件与所述直流环节转换器处于热交换关系。
18.如权利要求13所述的HVAC***,其中所述歧管涂覆有聚合物材料、陶瓷材料或它们的组合。
19.如权利要求13所述的HVAC***,其中所述歧管包括竖直管状构件和水平管状构件,并且所述多个端口沿着所述水平管状构件和所述竖直管状构件定位,其中角托架沿着所述水平管状构件设置以便附接所述VSD部件,并且端托架位于所述水平管状构件和所述竖直管状构件的远端,以便附接至所述VSD的所述框架。
20.一种用于冷却变速驱动装置(VSD)的部件的方法,所述方法包括:
通过歧管的第一端口从冷却流体源接收冷却流体流,其中所述歧管联接至所述VSD的框架,且所述歧管被配置为向所述VSD的所述框架和所述VSD的所述部件提供结构支撑;
引导所述冷却流体流穿过所述歧管的流体通道朝向所述歧管的第二端口;
将所述冷却流体流从所述第二端口引导至冷却构件,其中所述冷却构件与所述VSD的所述部件处于热交换关系,使得冷却流体吸收来自所述VSD的所述部件的热能;
将所述冷却流体流从所述冷却构件引导至回流导管;
将所述冷却流体流从所述回流导管排放回所述冷却流体源。
21.如权利要求20所述的方法,其中所述冷却流体流从与所述回流导管流体连通的排放端口离开所述VSD。
22.如权利要求20所述的方法,包括在从所述歧管排放所述冷却流体后,将热量从所述冷却流体交换至所述冷却流体源的热交换器的工作流体。
23.如权利要求20所述的方法,其中所述歧管包括竖直管状构件和水平管状构件,并且所述端口沿着所述水平管状构件和所述竖直管状构件定位,其中角托架沿着所述水平管状构件设置以便附接所述部件,并且端托架位于所述水平管状构件和所述竖直管状构件的远端,以便附接至所述VSD的所述框架。
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3206468B1 (de) * 2016-02-15 2018-12-26 Siemens Aktiengesellschaft Umrichter mit gleichspannungszwischenkreis
KR101821878B1 (ko) * 2016-02-24 2018-01-24 엘에스산전 주식회사 인버터
US10925181B2 (en) * 2017-03-21 2021-02-16 Lg Innotek Co., Ltd. Converter
CN108174581A (zh) * 2017-12-26 2018-06-15 佛山市道静科技有限公司 一种通讯装置室外安装箱
US10921070B2 (en) * 2018-12-14 2021-02-16 Quanta Computer Inc. Connector assembly for liquid cooling
US10801766B2 (en) * 2019-01-30 2020-10-13 Regal Beloit America, Inc. Drive circuit for a variable speed fan motor
US11959679B2 (en) 2019-01-30 2024-04-16 Regal Beloit America, Inc. Drive circuit for a variable speed fan motor
US10881030B1 (en) 2019-07-31 2020-12-29 Hewlett Packard Enterprise Development Lp Electrical and liquid cooling midplane
TWI780353B (zh) * 2019-08-16 2022-10-11 國立臺北科技大學 機櫃式微型資料中心
US11129292B1 (en) * 2020-06-17 2021-09-21 Baidu Usa Llc Connector interface for liquid-cooled IT servers
KR102347854B1 (ko) 2020-12-23 2022-01-05 부경대학교 산학협력단 마커를 이용한 영상 인식 기반의 용접 상태 분류 장치 및 방법
US11342731B1 (en) 2021-01-19 2022-05-24 Peopleflo Manufacturing, Inc. Electrical control panel with cooling system
US20220346279A1 (en) * 2021-04-21 2022-10-27 Aic Inc. Temperature controlling method of liquid cooling device
USD992514S1 (en) * 2022-10-25 2023-07-18 Transportation Ip Holdings, Llc Bus bar

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1818605A (zh) * 2005-02-11 2006-08-16 美国樱花检验仪器株式会社 歧管组件

Family Cites Families (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230469Y2 (zh) * 1980-12-27 1987-08-05
JPS6337698A (ja) * 1986-07-31 1988-02-18 石川島播磨重工業株式会社 コ−ルドフレ−ム
JPS6428848A (en) * 1987-07-23 1989-01-31 Hitachi Ltd Cooling equipment for semiconductor module
CA2044825C (en) * 1991-06-18 2004-05-18 Marc A. Paradis Full-range, high efficiency liquid chiller
DE4225675C2 (de) 1992-08-04 1995-04-20 Abb Patent Gmbh Flüssigkeitsgekühltes Stromrichtermodul mit Stromrichtermodulrahmen
FR2724283B1 (fr) * 1994-09-02 1996-10-18 Schneider Electric Sa Variateur electronique de vitesse
GB9505857D0 (en) * 1995-03-23 1995-05-10 Organic Waste Processing Limit Method Of Extracting Aromatic Oils From Citrus Fruit
EP0767601A1 (en) 1995-10-02 1997-04-09 General Electric Company Mechanical arrangement of fluid cooled electronic circuit
US6333849B1 (en) * 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
US5914860A (en) * 1998-01-20 1999-06-22 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US6160696A (en) * 1998-05-04 2000-12-12 General Electric Company Modular bus bar and switch assembly for traction inverter
US6207719B1 (en) * 1998-08-19 2001-03-27 Dennis G. Pardikes Method and system for preparing ASA emulsion
JP3643514B2 (ja) 2000-03-10 2005-04-27 株式会社東芝 鉄道車両用電力変換装置
US6646879B2 (en) * 2001-05-16 2003-11-11 Cray Inc. Spray evaporative cooling system and method
CN1620588A (zh) * 2001-12-27 2005-05-25 达纳加拿大公司 具有内部带槽歧管的热交换器
US6885553B2 (en) * 2002-09-27 2005-04-26 Rockwell Automation Technologies, Inc. Bus bar assembly for use with a compact power conversion assembly
US6822850B2 (en) * 2002-09-27 2004-11-23 Rockwell Automation Technologies, Inc. Laminated bus bar for use with a power conversion configuration
US7068507B2 (en) * 2002-09-27 2006-06-27 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
JP2006519468A (ja) * 2003-02-27 2006-08-24 プロトネクス テクノロジー コーポレーション 外部にマニホルドされた膜に基づく電気化学的セルスタック
US20050056313A1 (en) * 2003-09-12 2005-03-17 Hagen David L. Method and apparatus for mixing fluids
CN2673035Y (zh) * 2003-12-24 2005-01-19 联想(北京)有限公司 一种固定线路板的支架
US7009842B2 (en) * 2004-01-30 2006-03-07 Isothermal Systems Research, Inc. Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
US20050207134A1 (en) * 2004-03-16 2005-09-22 Belady Christian L Cell board interconnection architecture
US7408775B2 (en) * 2004-10-19 2008-08-05 Honeywell International Inc. Electrical module and support therefor with integrated cooling
US7342789B2 (en) * 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
US7640767B2 (en) * 2006-06-08 2010-01-05 Johnson Controls Technology Company Low voltage variable speed drive for application on medium/high voltage mains
US7391126B2 (en) * 2006-06-30 2008-06-24 General Electric Company Systems and methods for an integrated electrical sub-system powered by wind energy
US20080008604A1 (en) * 2006-07-06 2008-01-10 Bristol Compressors, Inc. High-frequency control of devices internal to a hermetic compressor
US7746649B2 (en) * 2007-01-08 2010-06-29 Rockwell Automation Technologies, Inc. Modular soft starter
US8495890B2 (en) * 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
JP5227532B2 (ja) * 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 インバータ回路用の半導体モジュール
CA2686543A1 (en) * 2007-05-11 2008-11-20 Lubrizol Advanced Materials, Inc. Water manifold system and method
US20080310113A1 (en) * 2007-06-13 2008-12-18 Asml Netherlands B.V. Electronics rack and lithographic apparatus comprising such electronics rack
US8081462B2 (en) * 2007-09-13 2011-12-20 Rockwell Automation Technologies, Inc. Modular liquid cooling system
US8556011B2 (en) * 2007-11-01 2013-10-15 GM Global Technology Operations LLC Prediction strategy for thermal management and protection of power electronic hardware
US8037713B2 (en) * 2008-02-20 2011-10-18 Trane International, Inc. Centrifugal compressor assembly and method
US7808780B2 (en) * 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
US8146373B2 (en) * 2008-03-10 2012-04-03 Snow Iii Amos A Accessory sub-cooling unit and method of use
JP4580997B2 (ja) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
US7905106B2 (en) * 2008-04-21 2011-03-15 Hardcore Computer, Inc. Case and rack system for liquid submersion cooling of electronic devices connected in an array
US7660116B2 (en) * 2008-04-21 2010-02-09 International Business Machines Corporation Rack with integrated rear-door heat exchanger
JP2009295916A (ja) * 2008-06-09 2009-12-17 Daikin Ind Ltd 冷凍装置
US8286594B2 (en) * 2008-10-16 2012-10-16 Lochinvar, Llc Gas fired modulating water heating appliance with dual combustion air premix blowers
US7898810B2 (en) * 2008-12-19 2011-03-01 Raytheon Company Air cooling for a phased array radar
US7859835B2 (en) * 2009-03-24 2010-12-28 Allegro Microsystems, Inc. Method and apparatus for thermal management of a radio frequency system
US7965509B2 (en) * 2009-04-06 2011-06-21 International Business Machines Corporation High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
EP2259310B1 (en) * 2009-06-05 2020-04-08 Siemens Gamesa Renewable Energy A/S Integrated heat exchanger
JP2011004497A (ja) * 2009-06-17 2011-01-06 Toshiba Mitsubishi-Electric Industrial System Corp 電力用装置の筐体に取り付けられる電力用部品
US8508181B2 (en) * 2009-06-30 2013-08-13 Eaton Corporation Adjustable frequency drive and system
US8976526B2 (en) * 2009-06-30 2015-03-10 Teco-Westinghouse Motor Company Providing a cooling system for a medium voltage drive system
US20110016915A1 (en) * 2009-07-27 2011-01-27 Rocky Research High efficiency dc compressor and hvac/r system using the compressor
US8299646B2 (en) * 2009-07-27 2012-10-30 Rocky Research HVAC/R system with variable frequency drive (VFD) power supply for multiple motors
US8035972B2 (en) 2009-07-31 2011-10-11 Oracle America, Inc. Method and apparatus for liquid cooling computer equipment
RU2012112655A (ru) * 2009-09-29 2013-11-10 Кэрие Корпорейшн Система и способ для поддержания температуры воздуха в системе отопления, вентиляции и кондиционирования воздуха в здании
KR101958989B1 (ko) * 2010-05-25 2019-03-15 7에이씨 테크놀로지스, 아이엔씨. 공조 및 다른 프로세스들을 위해 액체 흡습제들을 이용하는 방법들 및 시스템들
US8184436B2 (en) * 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US20120016785A1 (en) * 2010-07-14 2012-01-19 Trading Technologies International, Inc. Smart Matching for Synthetic Spreads
US8472182B2 (en) * 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
EP2603753A4 (en) * 2010-07-30 2018-04-04 Exxonmobil Upstream Research Company Systems and methods for using multiple cryogenic hydraulic turbines
US8919301B2 (en) * 2010-12-29 2014-12-30 Ford Global Technologies, Llc Cylinder block assembly
CN102195453A (zh) * 2011-01-13 2011-09-21 中国电力科学研究院 一种基于模块化多电平电压源换流器的模块单元
US9322581B2 (en) * 2011-02-11 2016-04-26 Johnson Controls Technology Company HVAC unit with hot gas reheat
US20130312433A1 (en) * 2011-02-17 2013-11-28 Johnson Controls Technology Company Magnetic attenuator
US8624431B2 (en) * 2011-02-26 2014-01-07 General Electric Company System and method for power sharing of front-end converters without communication link in a modular-stacked DC transmission system
NO334268B1 (no) * 2011-04-15 2014-01-27 Apply Nemo As En undersjøisk kjøleanordning
US8881541B2 (en) * 2011-04-19 2014-11-11 Liebert Corporation Cooling system with tandem compressors and electronic expansion valve control
US9038404B2 (en) * 2011-04-19 2015-05-26 Liebert Corporation High efficiency cooling system
WO2012158653A2 (en) * 2011-05-13 2012-11-22 Ietip Llc System and methods for cooling electronic equipment
US8982558B2 (en) * 2011-06-24 2015-03-17 General Electric Company Cooling device for a power module, and a related method thereof
US9030822B2 (en) * 2011-08-15 2015-05-12 Lear Corporation Power module cooling system
BR112014003218A2 (pt) * 2011-08-15 2017-03-01 Nuovo Pignone Spa sistema de resfriamento de líquido para um aparelho de conversão de potência, aparelho de conversão de potência e método de resfriar um aparelho de conversão de potência
CN202167980U (zh) * 2011-08-18 2012-03-14 国电南瑞科技股份有限公司 水冷变流器柜内的水冷***结构
US8897010B2 (en) * 2011-08-22 2014-11-25 General Electric Company High performance liquid cooled heatsink for IGBT modules
US8229597B2 (en) * 2011-09-27 2012-07-24 Jpmorgan Chase Bank, N.A. Heating, ventilation, and air conditioning management system and method
US8824143B2 (en) * 2011-10-12 2014-09-02 International Business Machines Corporation Combined power and cooling rack supporting an electronics rack(S)
US10670028B2 (en) * 2011-10-21 2020-06-02 Prime Datum Development Company, Llc Load bearing direct drive fan system with variable process control
US9057516B2 (en) * 2011-11-28 2015-06-16 Trimeteor Oil and Gas Corporation Superheated steam generators
FR2983676B1 (fr) * 2011-12-05 2013-12-20 Schneider Electric Ind Sas Armoire electrique a dissipation thermique amelioree
CN202395642U (zh) * 2011-12-21 2012-08-22 天津华宁电子有限公司 一种改进的矿用隔爆变频调速装置
US9316117B2 (en) * 2012-01-30 2016-04-19 United Technologies Corporation Internally cooled spoke
CN202507918U (zh) * 2012-02-27 2012-10-31 长城汽车股份有限公司 进气歧管支架
US9472488B2 (en) * 2012-04-16 2016-10-18 Fuji Electric Co., Ltd. Semiconductor device and cooler thereof
US8869545B2 (en) * 2012-05-22 2014-10-28 Nordyne Llc Defrosting a heat exchanger in a heat pump by diverting warm refrigerant to an exhaust header
CA2874245C (en) * 2012-05-30 2017-01-03 Moog Inc. Power management systems
US9509198B2 (en) * 2012-12-10 2016-11-29 Axiflux Holdings Pty Ltd Electric motor/generator with integrated differential
EP2954274B1 (en) * 2013-02-09 2022-10-12 Prime Datum Development Company, LLC Direct-drive system for cooling system fans, exhaust blowers and pumps
ITTO20130161A1 (it) * 2013-02-27 2014-08-28 Aar Aerospace Consulting L L C Pompa micro-fluidica a forza di taglio
US10030882B2 (en) * 2013-07-12 2018-07-24 Best Technologies, Inc. Low flow fluid controller apparatus and system
US9007221B2 (en) * 2013-08-16 2015-04-14 Cisco Technology, Inc. Liquid cooling of rack-mounted electronic equipment
JP6192434B2 (ja) * 2013-08-23 2017-09-06 サンデンホールディングス株式会社 車両用空気調和装置
US9332674B2 (en) * 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
DK2866539T3 (en) * 2013-10-24 2018-07-30 Abb Oy Electronic device with waterproof enclosure
US9951779B2 (en) * 2013-12-27 2018-04-24 General Electric Company Methods and systems for subsea boosting with direct current and alternating current power systems
US9545037B2 (en) * 2014-01-24 2017-01-10 Baker Hughes Incorporated Systems and methods for cooling electric drives
US20150275891A1 (en) * 2014-03-31 2015-10-01 Schlumberger Technology Corporation Integrated motor and pump assembly
US9174156B2 (en) * 2014-04-04 2015-11-03 Magni-Power Company System for determining force imparted by a filter in a variable force environment and related methods of use
CN104125757B (zh) * 2014-07-02 2017-04-19 北京无线电测量研究所 一种穿通式液冷机箱
US20160128238A1 (en) * 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly
US9538688B2 (en) * 2015-03-13 2017-01-03 Advanced Micro Devices, Inc. Bimodal cooling in modular server system
US10330099B2 (en) * 2015-04-01 2019-06-25 Trane International Inc. HVAC compressor prognostics
US9973129B2 (en) * 2015-06-12 2018-05-15 Trane International Inc. HVAC components having a variable speed drive with optimized power factor correction
US10075118B2 (en) * 2015-09-15 2018-09-11 Regal Beloit America, Inc. Hybrid drive circuit for variable speed induction motor system and methods of control
US10582328B2 (en) * 2016-07-06 2020-03-03 Bragi GmbH Audio response based on user worn microphones to direct or adapt program responses system and method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1818605A (zh) * 2005-02-11 2006-08-16 美国樱花检验仪器株式会社 歧管组件

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