CN109722686A - A kind of metallic copper electroplate liquid - Google Patents
A kind of metallic copper electroplate liquid Download PDFInfo
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- CN109722686A CN109722686A CN201711018273.9A CN201711018273A CN109722686A CN 109722686 A CN109722686 A CN 109722686A CN 201711018273 A CN201711018273 A CN 201711018273A CN 109722686 A CN109722686 A CN 109722686A
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Abstract
A kind of metallic copper electroplate liquid, in parts by weight, comprising: 30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of sldium lauryl sulfate, 15-20 parts of nickel hydroxide cobaltous sulfate, 10-20 parts of cobalt chloride, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, 3-5 parts of acetic acid, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, 20-50 parts of potassium hydroxide, 50-80 parts of ferroso-ferric oxide, 1000-3000 parts of deionized water.It joined ferroso-ferric oxide in electroplate liquid of the present invention, can effectively realize anti-corrosion effect.
Description
Technical field
The present invention relates to electroplate liquids, and in particular to a kind of metallic copper electroplate liquid.
Background technique
In mechanical processing process, the anti-corrosive grease of component surface adherency, cutting fluid, machinery oil, lubricant grease, grinding
Liquid, release agent etc. are mixed and are sticked together with dust, polishing dust, form thicker dirt.If the above dirt is not removed before heat treatment
It goes, then degreasing and rust removal is difficult to clean up after its quenching sinters obstinate solid grease into, and bubble attachment makes to plate thereon when plating
Layer forms gas detention type pin hole.Heat treated part surface inevitably adheres to one layer of greasy dirt, when dust is fallen on the surface,
And mix and stick together with grease, it is difficult to clean up over time, so that workpiece surface be made to form unconspicuous tiny oil mark, applies
Bubble residence forms pin hole thereon when plating.When in addition using mesh band type resistor furnace quenching, the greasy dirt and dust etc. of workpiece surface are miscellaneous
Matter particle is mixed to stick together, and sinters obstinate solid grease into, and when salt made from earth containing a comparatively high percentage of sodium chloride is tempered, the above grease forms with nitro salt obstinate again
Thermopolymer, when plating, are difficult that the above dirt is thoroughly cleared, and bubble hydrogen is easily adhered to above dirt, it is difficult to is discharged, to make
Coating generates pin hole and point phenomenon, and as bubble is gradually grown up, coating can be burst automatically, decortication phenomenon is generated, to lead
Send a telegraph the disadvantage of plating solution difference of hardness, dispersion performance and covering power difference.
In view of the above shortcomings, the designer, is actively subject to research and innovation, to found a kind of new structural metal
Copper electroplate liquid makes it with more the utility value in industry.
Summary of the invention
In order to solve the above technical problems, the object of the present invention is to provide a kind of metallic copper electroplate liquids.
Technical scheme is as follows:
A kind of metallic copper electroplate liquid, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of sldium lauryl sulfate, nickel hydroxide cobaltous sulfate 15-20
Part, 10-20 parts of cobalt chloride, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, second
3-5 parts sour, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, potassium hydroxide
20-50 parts, 50-80 parts of ferroso-ferric oxide, 1000-3000 parts of deionized water.
Further, in parts by weight, comprising: 40 parts of copper sulphate, 44 parts of aluminum sulfate, 34 parts of sldium lauryl sulfate,
18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, 20 parts of ferric sulfate, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid,
4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, 25 parts of potassium cyanide, 30 parts of sodium stannate, 35 parts of potassium hydroxide, four oxidations three
60 parts of iron, 2000 parts of deionized water.
A kind of preparation method of metallic copper electroplate liquid, it is characterised in that: by copper sulphate, aluminum sulfate, sldium lauryl sulfate,
Nickel hydroxide cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, dibastic sodium phosphate, sodium nitrite, cyanogen
It is add to deionized water after changing potassium, sodium stannate, potassium hydroxide, ferroso-ferric oxide mixing, then after being dispersed by dispersion machine,
The electroplate liquid is obtained after stirring by high-speed mixer.
According to the above aspect of the present invention, the present invention has at least the following advantages:
It joined ferroso-ferric oxide in electroplate liquid of the present invention, can effectively realize anti-corrosion effect.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
Illustrate the present invention, but is not intended to limit the scope of the invention.
A kind of preparation method of metallic copper electroplate liquid, by copper sulphate, aluminum sulfate, sldium lauryl sulfate, nickel hydroxide sulphur
Sour cobalt, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, dibastic sodium phosphate, sodium nitrite, potassium cyanide, stannic acid
It is add to deionized water after sodium, potassium hydroxide, ferroso-ferric oxide are mixed, then after being dispersed by dispersion machine, passes through high speed
The electroplate liquid is obtained after blender stirring.
Embodiment 1
A kind of metallic copper electroplate liquid, in parts by weight, comprising:
30 parts of copper sulphate, 40 parts of aluminum sulfate, 30 parts of sldium lauryl sulfate, 15 parts of nickel hydroxide cobaltous sulfate, 10 parts of cobalt chloride,
15 parts of ferric sulfate, 10 parts of frerrous chloride, 10 parts of cuprous oxide, 15 parts of hydrochloric acid, 3 parts of acetic acid, 10 parts of dibastic sodium phosphate, sodium nitrite 15
Part, 20 parts of potassium cyanide, 20 parts of sodium stannate, 20 parts of potassium hydroxide, 50 parts of ferroso-ferric oxide, 1000 parts of deionized water.
Embodiment 2
A kind of metallic copper electroplate liquid, in parts by weight, comprising:
40 parts of copper sulphate, 45 parts of aluminum sulfate, 45 parts of sldium lauryl sulfate, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride,
20 parts of ferric sulfate, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, sodium nitrite 18
Part, 25 parts of potassium cyanide, 30 parts of sodium stannate, 30 parts of potassium hydroxide, 30 parts of ferroso-ferric oxide, 2000 parts of deionized water.
Embodiment 3
A kind of metallic copper electroplate liquid, in parts by weight, comprising:
50 parts of copper sulphate, 50 parts of aluminum sulfate, 60 parts of sldium lauryl sulfate, 20 parts of nickel hydroxide cobaltous sulfate, 20 parts of cobalt chloride,
30 parts of ferric sulfate, 20 parts of frerrous chloride, 15 parts of cuprous oxide, 20 parts of hydrochloric acid, 5 parts of acetic acid, 15 parts of dibastic sodium phosphate, sodium nitrite 20
Part, 30 parts of potassium cyanide, 50 parts of sodium stannate, 50 parts of potassium hydroxide, 80 parts of ferroso-ferric oxide, 3000 parts of deionized water.
It joined ferroso-ferric oxide in electroplate liquid of the present invention, can effectively realize anti-corrosion effect.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (3)
1. a kind of metallic copper electroplate liquid, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of sldium lauryl sulfate, 15-20 parts of nickel hydroxide cobaltous sulfate, chlorine
Change cobalt 10-20 parts, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, acetic acid 3-5
Part, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, potassium hydroxide 20-50
Part, 50-80 parts of ferroso-ferric oxide, 1000-3000 parts of deionized water.
2. a kind of metallic copper electroplate liquid according to claim 1, which is characterized in that in parts by weight, comprising: sulphur
40 parts of sour copper, 44 parts of aluminum sulfate, 34 parts of sldium lauryl sulfate, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, ferric sulfate 20
Part, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, cyaniding
25 parts of potassium, 30 parts of sodium stannate, 35 parts of potassium hydroxide, 60 parts of ferroso-ferric oxide, 2000 parts of deionized water.
3. a kind of preparation method of metallic copper electroplate liquid according to claim 2, it is characterised in that: by copper sulphate, sulphur
Sour aluminium, sldium lauryl sulfate, nickel hydroxide cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, phosphorus
After sour hydrogen sodium, sodium nitrite, potassium cyanide, sodium stannate, potassium hydroxide, ferroso-ferric oxide are mixed, then pass through dispersion machine dispersion
After be add to deionized water, the electroplate liquid is obtained after stirring by high-speed mixer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711018273.9A CN109722686A (en) | 2017-10-27 | 2017-10-27 | A kind of metallic copper electroplate liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711018273.9A CN109722686A (en) | 2017-10-27 | 2017-10-27 | A kind of metallic copper electroplate liquid |
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| Publication Number | Publication Date |
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| CN109722686A true CN109722686A (en) | 2019-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201711018273.9A Pending CN109722686A (en) | 2017-10-27 | 2017-10-27 | A kind of metallic copper electroplate liquid |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
-
2017
- 2017-10-27 CN CN201711018273.9A patent/CN109722686A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
Non-Patent Citations (1)
| Title |
|---|
| 蔡铎昌: "《电化学研究方法》", 30 September 2005, 电子科技大学出版社 * |
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Application publication date: 20190507 |