CN109722685A - A kind of metal alloy bright plating liquid - Google Patents
A kind of metal alloy bright plating liquid Download PDFInfo
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- CN109722685A CN109722685A CN201711018269.2A CN201711018269A CN109722685A CN 109722685 A CN109722685 A CN 109722685A CN 201711018269 A CN201711018269 A CN 201711018269A CN 109722685 A CN109722685 A CN 109722685A
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Abstract
A kind of metal alloy bright plating liquid, in parts by weight, comprising: 30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, 10-20 parts of cobalt chloride, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, 3-5 parts of acetic acid, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, 20-50 parts of potassium hydroxide, 50-80 parts of benzylideneacetone, 1000-3000 parts of deionized water.It joined benzylideneacetone in electroplate liquid of the present invention, can effectively realize brightness effect.
Description
Technical field
The present invention relates to electroplate liquids, and in particular to a kind of metal alloy electroplate liquid.
Background technique
In mechanical processing process, the anti-corrosive grease of component surface adherency, cutting fluid, machinery oil, lubricant grease, grinding
Liquid, release agent etc. are mixed and are sticked together with dust, polishing dust, form thicker dirt.If the above dirt is not removed before heat treatment
It goes, then degreasing and rust removal is difficult to clean up after its quenching sinters obstinate solid grease into, and bubble attachment makes to plate thereon when plating
Layer forms gas detention type pin hole.Heat treated part surface inevitably adheres to one layer of greasy dirt, when dust is fallen on the surface,
And mix and stick together with grease, it is difficult to clean up over time, so that workpiece surface be made to form unconspicuous tiny oil mark, applies
Bubble residence forms pin hole thereon when plating.When in addition using mesh band type resistor furnace quenching, the greasy dirt and dust etc. of workpiece surface are miscellaneous
Matter particle is mixed to stick together, and sinters obstinate solid grease into, and when salt made from earth containing a comparatively high percentage of sodium chloride is tempered, the above grease forms with nitro salt obstinate again
Thermopolymer, when plating, are difficult that the above dirt is thoroughly cleared, and bubble hydrogen is easily adhered to above dirt, it is difficult to is discharged, to make
Coating generates pin hole and point phenomenon, and as bubble is gradually grown up, coating can be burst automatically, decortication phenomenon is generated, to lead
Send a telegraph the disadvantage of plating solution difference of hardness, dispersion performance and covering power difference.
In view of the above shortcomings, the designer, is actively subject to research and innovation, to found a kind of new structural metal
Alloy electroplate liquid makes it with more the utility value in industry.
Summary of the invention
In order to solve the above technical problems, the object of the present invention is to provide a kind of metal alloy bright plating liquid.
Technical scheme is as follows:
A kind of metal alloy bright plating liquid, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, chlorination
10-20 parts of cobalt, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, acetic acid 3-5
Part, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, potassium hydroxide 20-50
Part, 50-80 parts of benzylideneacetone, 1000-3000 parts of deionized water.
Further, in parts by weight, comprising: 40 parts of copper sulphate, 44 parts of aluminum sulfate, 34 parts of copper chloride, hydroxide
18 parts of nickel cobaltous sulfate, 15 parts of cobalt chloride, 20 parts of ferric sulfate, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid, acetic acid 4
Part, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, 25 parts of potassium cyanide, 30 parts of sodium stannate, 35 parts of potassium hydroxide, 60 parts of benzylideneacetone,
2000 parts of deionized water.
A kind of preparation method of metal alloy bright plating liquid, it is characterised in that: by copper sulphate, aluminum sulfate, copper chloride, hydrogen
Nickel oxide cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, dibastic sodium phosphate, sodium nitrite, cyaniding
It is add to deionized water, passes through after potassium, sodium stannate, potassium hydroxide, benzylideneacetone are mixed, then after being dispersed by dispersion machine
The electroplate liquid is obtained after high-speed mixer stirring.
According to the above aspect of the present invention, the present invention has at least the following advantages:
It joined benzylideneacetone in electroplate liquid of the present invention, can effectively realize brightness effect.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
Illustrate the present invention, but is not intended to limit the scope of the invention.
A kind of preparation method of metal alloy bright plating liquid, by copper sulphate, aluminum sulfate, copper chloride, nickel hydroxide sulfuric acid
Cobalt, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, dibastic sodium phosphate, sodium nitrite, potassium cyanide, sodium stannate,
It is add to deionized water after potassium hydroxide, benzylideneacetone are mixed, then after being dispersed by dispersion machine, passes through high-speed mixer
The electroplate liquid is obtained after stirring.
Embodiment 1
A kind of metal alloy bright plating liquid, in parts by weight, comprising:
30 parts of copper sulphate, 40 parts of aluminum sulfate, 30 parts of copper chloride, 15 parts of nickel hydroxide cobaltous sulfate, 10 parts of cobalt chloride, ferric sulfate
15 parts, 10 parts of frerrous chloride, 10 parts of cuprous oxide, 15 parts of hydrochloric acid, 3 parts of acetic acid, 10 parts of dibastic sodium phosphate, 15 parts of sodium nitrite, cyanogen
Change 20 parts of potassium, 20 parts of sodium stannate, 20 parts of potassium hydroxide, 50 parts of benzylideneacetone, 1000 parts of deionized water.
Embodiment 2
A kind of metal alloy bright plating liquid, in parts by weight, comprising:
40 parts of copper sulphate, 45 parts of aluminum sulfate, 45 parts of copper chloride, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, ferric sulfate
20 parts, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, cyanogen
Change 25 parts of potassium, 30 parts of sodium stannate, 30 parts of potassium hydroxide, 30 parts of benzylideneacetone, 2000 parts of deionized water.
Embodiment 3
A kind of metal alloy bright plating liquid, in parts by weight, comprising:
50 parts of copper sulphate, 50 parts of aluminum sulfate, 60 parts of copper chloride, 20 parts of nickel hydroxide cobaltous sulfate, 20 parts of cobalt chloride, ferric sulfate
30 parts, 20 parts of frerrous chloride, 15 parts of cuprous oxide, 20 parts of hydrochloric acid, 5 parts of acetic acid, 15 parts of dibastic sodium phosphate, 20 parts of sodium nitrite, cyanogen
Change 30 parts of potassium, 50 parts of sodium stannate, 50 parts of potassium hydroxide, 80 parts of benzylideneacetone, 3000 parts of deionized water.
It joined benzylideneacetone in electroplate liquid of the present invention, can effectively realize brightness effect.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (3)
1. a kind of metal alloy bright plating liquid, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, cobalt chloride 10-
20 parts, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of hydrochloric acid, 3-5 parts of acetic acid, phosphoric acid
10-15 parts of hydrogen sodium, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, 20-50 parts of potassium hydroxide, benzal
50-80 parts of acetone, 1000-3000 parts of deionized water.
2. a kind of metal alloy bright plating liquid according to claim 1, which is characterized in that in parts by weight, packet
Include: 40 parts of copper sulphate, 44 parts of aluminum sulfate, 34 parts of copper chloride, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, 20 parts of ferric sulfate,
15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of hydrochloric acid, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, potassium cyanide 25
Part, 30 parts of sodium stannate, 35 parts of potassium hydroxide, 60 parts of benzylideneacetone, 2000 parts of deionized water.
3. a kind of preparation method of metal alloy bright plating liquid according to claim 2, it is characterised in that: by sulfuric acid
Copper, aluminum sulfate, copper chloride, nickel hydroxide cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, hydrochloric acid, acetic acid, phosphorus
Sour hydrogen sodium, sodium nitrite, potassium cyanide, sodium stannate, potassium hydroxide, benzylideneacetone be mixed after, then by dispersion machine dispersion after
It is add to deionized water, the electroplate liquid is obtained after stirring by high-speed mixer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711018269.2A CN109722685A (en) | 2017-10-27 | 2017-10-27 | A kind of metal alloy bright plating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711018269.2A CN109722685A (en) | 2017-10-27 | 2017-10-27 | A kind of metal alloy bright plating liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109722685A true CN109722685A (en) | 2019-05-07 |
Family
ID=66290694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711018269.2A Pending CN109722685A (en) | 2017-10-27 | 2017-10-27 | A kind of metal alloy bright plating liquid |
Country Status (1)
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| CN (1) | CN109722685A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
-
2017
- 2017-10-27 CN CN201711018269.2A patent/CN109722685A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
Non-Patent Citations (1)
| Title |
|---|
| 《电镀工艺手册》编委会: "《电镀工艺手册》", 31 August 1989, 上海科学技术出版社 * |
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| PB01 | Publication | ||
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Application publication date: 20190507 |