CN109716489B - 基板处理装置及基板处理方法 - Google Patents

基板处理装置及基板处理方法 Download PDF

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Publication number: CN109716489B
Authority: CN; China
Prior art keywords: chamber; cup; substrate; cup portion; opening
Prior art date: 2016-09-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201780055662.0A

Other languages

English (en)

Chinese (zh)

Other versions

CN109716489A (zh

Inventor

三浦丈苗

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Screen Holdings Co Ltd

Original Assignee

Screen Holdings Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-09-23

Filing date

2017-07-10

Publication date

2022-11-15

2017-07-10 Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd

2019-05-03 Publication of CN109716489A publication Critical patent/CN109716489A/zh

2022-11-15 Application granted granted Critical

2022-11-15 Publication of CN109716489B publication Critical patent/CN109716489B/zh

Status Active legal-status Critical Current

2037-07-10 Anticipated expiration legal-status Critical

Links

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Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Cleaning Or Drying Semiconductors (AREA)
Weting (AREA)

CN201780055662.0A 2016-09-23 2017-07-10 基板处理装置及基板处理方法 Active CN109716489B (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2016185657A JP6706564B2 (ja)	2016-09-23	2016-09-23	基板処理装置および基板処理方法
JP2016-185657		2016-09-23
PCT/JP2017/025122 WO2018055877A1 (ja)	2016-09-23	2017-07-10	基板処理装置および基板処理方法

Publications (2)

Publication Number	Publication Date
CN109716489A CN109716489A (zh)	2019-05-03
CN109716489B true CN109716489B (zh)	2022-11-15

Family

ID=61690264

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201780055662.0A Active CN109716489B (zh)	2016-09-23	2017-07-10	基板处理装置及基板处理方法

Country Status (5)

Country	Link
JP (1)	JP6706564B2 (ko)
KR (1)	KR102139020B1 (ko)
CN (1)	CN109716489B (ko)
TW (1)	TWI635529B (ko)
WO (1)	WO2018055877A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7055720B2 (ja) *	2018-08-10	2022-04-18	株式会社荏原製作所	基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法
KR102583555B1 (ko) *	2020-12-09	2023-09-26	세메스 주식회사	처리액 공급 유닛을 포함하는 기판 처리 장치 및 기판 처리 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101090063A (zh) *	2006-06-16	2007-12-19	东京毅力科创株式会社	液体处理装置
CN101145505A (zh) *	2006-09-15	2008-03-19	大日本网目版制造株式会社	基板处理装置和基板处理方法
JP2014049605A (ja) *	2012-08-31	2014-03-17	Dainippon Screen Mfg Co Ltd	基板処理装置
JP2014179378A (ja) *	2013-03-13	2014-09-25	Tokyo Electron Ltd	液処理装置および液処理方法
CN105122426A (zh) *	2013-03-15	2015-12-02	株式会社思可林集团	基板处理装置
CN105849871A (zh) *	2013-12-25	2016-08-10	株式会社思可林集团	基板处理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5606992B2 (ja) *	2011-06-09	2014-10-15	東京エレクトロン株式会社	液処理装置および液処理方法
JP6057624B2 (ja) *	2012-09-03	2017-01-11	株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ	カップおよび基板処理装置
JP6017262B2 (ja) *	2012-10-25	2016-10-26	東京エレクトロン株式会社	基板処理装置および基板処理方法
JP2014179489A (ja) *	2013-03-15	2014-09-25	Dainippon Screen Mfg Co Ltd	基板処理装置
JP2015012013A (ja) *	2013-06-26	2015-01-19	京セラ株式会社	多層配線基板およびそれを備えたプローブカード用基板
JP6057886B2 (ja) *	2013-12-25	2017-01-11	株式会社Ｓｃｒｅｅｎホールディングス	基板処理装置

2016
- 2016-09-23 JP JP2016185657A patent/JP6706564B2/ja not_active Expired - Fee Related
2017
- 2017-07-10 CN CN201780055662.0A patent/CN109716489B/zh active Active
- 2017-07-10 WO PCT/JP2017/025122 patent/WO2018055877A1/ja active Application Filing
- 2017-07-10 KR KR1020197006620A patent/KR102139020B1/ko active IP Right Grant
- 2017-07-27 TW TW106125288A patent/TWI635529B/zh not_active IP Right Cessation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101090063A (zh) *	2006-06-16	2007-12-19	东京毅力科创株式会社	液体处理装置
CN101145505A (zh) *	2006-09-15	2008-03-19	大日本网目版制造株式会社	基板处理装置和基板处理方法
JP2014049605A (ja) *	2012-08-31	2014-03-17	Dainippon Screen Mfg Co Ltd	基板処理装置
JP2014179378A (ja) *	2013-03-13	2014-09-25	Tokyo Electron Ltd	液処理装置および液処理方法
CN105122426A (zh) *	2013-03-15	2015-12-02	株式会社思可林集团	基板处理装置
CN105849871A (zh) *	2013-12-25	2016-08-10	株式会社思可林集团	基板处理装置

Also Published As

Publication number	Publication date
TW201814766A (zh)	2018-04-16
KR102139020B1 (ko)	2020-07-28
WO2018055877A1 (ja)	2018-03-29
TWI635529B (zh)	2018-09-11
JP2018049985A (ja)	2018-03-29
JP6706564B2 (ja)	2020-06-10
KR20190034654A (ko)	2019-04-02
CN109716489A (zh)	2019-05-03

Legal Events

Date	Code	Title
2019-05-03	PB01	Publication
2019-05-03	PB01	Publication
2019-05-28	SE01	Entry into force of request for substantive examination
2019-05-28	SE01	Entry into force of request for substantive examination
2022-11-15	GR01	Patent grant
2022-11-15	GR01	Patent grant

Publication	Publication Date	Title
KR102389767B1 (ko)	2022-04-22	기판 처리 장치
KR101512560B1 (ko)	2015-04-15	기판처리장치
KR101699657B1 (ko)	2017-01-24	기판 처리 장치
KR101756047B1 (ko)	2017-07-07	기판 처리 장치
JP2014194965A (ja)	2014-10-09	基板処理装置
JP6010398B2 (ja)	2016-10-19	基板処理装置
JP5973299B2 (ja)	2016-08-23	基板処理装置
JP2014067780A (ja)	2014-04-17	基板処理装置
CN109716489B (zh)	2022-11-15	基板处理装置及基板处理方法
CN107871687B (zh)	2021-06-25	基板处理装置
JP6057886B2 (ja)	2017-01-11	基板処理装置
JP6216279B2 (ja)	2017-10-18	基板処理装置
JP5936505B2 (ja)	2016-06-22	基板処理装置
JP2015188007A (ja)	2015-10-29	基板処理装置
JP2016192518A (ja)	2016-11-10	基板処理装置