CN109670475B - Light sensing module and display panel - Google Patents
Light sensing module and display panel Download PDFInfo
- Publication number
- CN109670475B CN109670475B CN201811625418.6A CN201811625418A CN109670475B CN 109670475 B CN109670475 B CN 109670475B CN 201811625418 A CN201811625418 A CN 201811625418A CN 109670475 B CN109670475 B CN 109670475B
- Authority
- CN
- China
- Prior art keywords
- layer
- light sensing
- groove
- insulating layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
Abstract
The invention discloses a light sensing module and a display panel. The light sense module includes: a substrate; a plurality of light sensing unit switch tubes located on the substrate; the first organic flat layer is positioned on one side of the light sensing unit switch tube, which is far away from the substrate; the plurality of light sensing units are positioned on one side of the first organic flat layer, which is far away from the light sensing unit switch tube; the common electrode is positioned on one side of the light sensing unit away from the first organic flat layer; and a first inorganic layer between the first organic planarization layer and the common electrode, the first inorganic layer having a first groove; the first groove is located between two adjacent light sensing units. The invention can reduce the risk of film stripping of the first organic flat layer and improve the performance reliability of the light sensing module.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light sensing module and a display panel.
Background
With the development of electronic science and technology, fingerprint identification has been gradually applied to display devices such as mobile phones, and fingerprint identification technology in electronic devices generally adopts optical technology, silicon technology (capacitive and radio frequency type), ultrasonic technology and the like. Electrodes at two ends of a capacitor in capacitive fingerprint identification are easy to generate parasitic capacitance with internal components of a display panel in electronic equipment, so that fingerprint detection signals and display signals are mutually interfered, and the quality of fingerprint identification is influenced. In the fingerprint recognition technology, the optical fingerprint recognition sensor realizes its detection and recognition functions by detecting light reflected from a human finger, and the optical technology has more advantages than the capacitive technology.
Therefore, it is an urgent technical problem to be solved in the art to provide a photo sensor module and a display panel that can realize optical fingerprint recognition and have reliable performance.
Disclosure of Invention
In view of this, the present invention provides a light sensing module and a display panel, which improve the performance reliability.
In order to solve the above technical problem, in a first aspect, the present invention provides a photo sensor module, including:
a substrate;
a plurality of light sensing unit switch tubes located on the substrate;
the first organic flat layer is positioned on one side of the light sensing unit switch tube, which is far away from the substrate;
the plurality of light sensing units are positioned on one side of the first organic flat layer, which is far away from the light sensing unit switch tube;
the common electrode is positioned on one side of the light sensing unit away from the first organic flat layer; and
a first inorganic layer located between the first organic planarization layer and the common electrode, the first inorganic layer having a first groove; wherein the content of the first and second substances,
the first groove is located between two adjacent light sensing units.
Based on the same inventive concept, in a second aspect, the invention provides a display panel including any one of the light sensing modules provided by the invention.
Compared with the prior art, the light sensation module and the display panel provided by the invention at least realize the following beneficial effects:
according to the invention, the first inorganic layer is provided with the first groove, the first groove is positioned between two adjacent light sensing units, the protection effect of the first inorganic layer on the light sensing units cannot be influenced, meanwhile, the first groove can be used for thinning the first inorganic layer, or the first inorganic layer is completely dug at the position of the first groove, the arrangement of the first groove is equivalent to reserving a space for expansion or contraction for part of the first inorganic layer, and larger expansion or contraction stress in the film forming process of the first inorganic layer can be released, so that the stress applied to the first organic flat layer is reduced, the risk of film stripping of the first organic flat layer is reduced, and the performance reliability of the light sensing module is improved. Meanwhile, the first groove can also provide a bending path for the first inorganic layer during bending, and the bending resistance of the light sensing module is improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic view of a film structure of a photo sensor module according to an embodiment of the present invention;
FIG. 2 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 3 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 4 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 5 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 6 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 7 is a schematic top view of an alternative embodiment of a photo sensor module according to an embodiment of the present invention;
FIG. 8 is a schematic top view of an alternative embodiment of a photo sensor module according to an embodiment of the present invention;
FIG. 9 is a schematic top view of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 10 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
FIG. 11 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention;
fig. 12 is a schematic view of a display panel according to an embodiment of the invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The invention provides a light sensing module which can be used for light sensing fingerprint identification. FIG. 1 is a schematic view of a film structure of a photo sensor module according to an embodiment of the invention.
As shown in FIG. 1, the photo sensor module includes: a substrate 101; a plurality of light sensing unit switch tubes T located on the substrate 101, which are only illustrated by transistors with a top gate structure, and optionally, the light sensing unit switch tubes T may also be transistors with a bottom gate structure; the first organic planarization layer Y1 is located on the side of the photo cell switch tube T away from the substrate 101. in the manufacturing process of the photo module, the first organic planarization layer Y1 plays a role in planarization after the process of manufacturing the photo cell switch tube T; a plurality of photo cells SN located on a side of the first organic planarization layer Y1 away from the photo cell switch tube T, wherein the photo cells SN are schematically connected to the photo cell switch tube T, the photo cell switch tube T serves as a switch device of the photo cells SN, the photo cells SN may be photodiodes, and detailed structures are not shown in the drawing; the common electrode COM is positioned on one side of the light sensing unit SN, which is far away from the first organic flat layer Y1, the light sensing unit SN is connected to the common electrode COM, the common electrode COM provides a voltage signal for the light sensing unit SN, optionally, the common electrode COM can be arranged on the whole surface or can be arranged into a plurality of common electrode COM wirings, one common electrode COM wiring is electrically connected with a plurality of light sensing units SN, and the arrangement mode of the common electrode COM is not limited herein; and a first inorganic layer W1, wherein the first inorganic layer W1 is made of a silicon material such as silicon oxide or silicon nitride. The first inorganic layer W1 is positioned between the first organic planarization layer Y1 and the common electrode COM, the first inorganic layer W1 is in contact with the sidewall of the photo cell SN, the first inorganic layer W1 has a first groove C1; the first groove C1 is located between two adjacent light sensing units SN, the first groove C1 may penetrate through the first inorganic layer W1, or the first groove C1 only cuts off a portion of the first inorganic layer W1 to thin the first inorganic layer W1, and the number of the first grooves C1 that may be disposed between two adjacent light sensing units SN is not limited herein and is only schematically shown in fig. 1. There may be only one inorganic layer between the first organic planarization layer Y1 and the common electrode COM, or a plurality of inorganic layers, which are only schematically shown in fig. 1.
When the light sensing module provided by the invention is applied to a display panel, after light reflected by a touch main body (finger) irradiates on the light sensing unit SN, the light sensing unit SN converts a light signal into an electric signal, the electric signal is transmitted to a driving chip of the display panel through the light sensing unit switching tube T electrically connected with the light sensing unit SN, and the electric signal is further subjected to operation processing to realize light sensing fingerprint identification.
In the invention, the first inorganic layer is arranged between the switch tube of the light sensing unit and the common electrode, the first inorganic layer can be an inorganic layer or a plurality of inorganic layers, the photosensitive layer material of the light sensing unit is usually silicon-based doping material in the manufacturing process of the light sensing unit, when the photosensitive layer is contacted with different types of materials (such as organic materials), interface defects can be generated on the contacted interfaces, and the characteristics of the photosensitive layer are influenced by leakage current.
The manufacturing process of the light sensing module provided by the invention comprises the steps of manufacturing a light sensing unit switch tube on a substrate, manufacturing a light sensing unit on the light sensing unit switch tube, and finally manufacturing a common electrode. According to the invention, the first organic flat layer is arranged between the light sensing unit and the light sensing unit switch tube, the first organic flat layer can provide a flat substrate for the light sensing unit, the light sensing unit can be prevented from leaking and flowing too much to influence the detection of a light sensing signal on the first organic flat layer manufactured by the light sensing unit, and meanwhile, the dielectric constant of the organic film layer is small, so that the capacitance between the light sensing unit and the light sensing unit switch tube (generated in a part of overlapped area of the light sensing unit and the light sensing unit switch tube) can be reduced, thereby being beneficial to reducing the power consumption. The first inorganic layer is formed when the photosensitive unit is formed on the first organic planarization layer, i.e. the process for forming the inorganic layer is performed after the process for forming the first organic planarization layer. Generally, a film needs to be formed in a high-temperature environment in a first inorganic layer manufacturing process, because the first inorganic layer and the first organic flat layer are made of different materials, the expansion and contraction coefficients of the first inorganic layer and the first organic flat layer are different in a thermal expansion and cold contraction process, the first organic flat layer may be peeled off due to contraction of the first inorganic layer in a cooling film forming process, and the thicker the first inorganic layer is, the more serious the influence on the first organic flat layer is. In addition, when the first organic flat layer is provided with a thicker first inorganic layer, when the light sensing module is applied to the flexible display panel, the first inorganic layer can generate larger bending stress when being bent along with the display panel, and accordingly, the film layer can be peeled off when the first organic flat layer bears the larger bending stress.
According to the invention, the first inorganic layer is provided with the first groove, the first groove is positioned between two adjacent light sensing units, the protection effect of the first inorganic layer on the light sensing units cannot be influenced, meanwhile, the first groove can be used for thinning the first inorganic layer, or the first inorganic layer is completely dug at the position of the first groove, the arrangement of the first groove is equivalent to reserving a space for expansion or contraction for part of the first inorganic layer, and larger expansion or contraction stress in the film forming process of the first inorganic layer can be released, so that the stress applied to the first organic flat layer is reduced, the risk of film stripping of the first organic flat layer is reduced, and the performance reliability of the light sensing module is improved. Meanwhile, when the light sensing module provided by the invention is applied to a flexible display panel, the first groove can also provide a bending path for the first inorganic layer when the display panel is bent, so that the first organic flat layer is further prevented from being stripped in a bending process, and the bending resistance of the light sensing module is favorably improved.
In an optional embodiment, after completing the fabrication process of the first organic planarization layer, the photo sensing module according to the present invention first fabricates the first electrode of the photo sensing unit, then covers the entire first insulating layer on the first electrode, and then etches the first insulating layer to form a first opening; then, the whole photosensitive layer is manufactured, part of the photosensitive layer material fills the first opening hole to realize the electric connection of the photosensitive layer and the first electrode, then the whole second electrode layer is manufactured, the same mask plate is adopted to pattern the second electrode and the photosensitive layer, the process can be saved, meanwhile, one side (the side of the photosensitive surface for receiving illumination) far away from the first electrode of the photosensitive layer can be ensured to be covered by the second electrode in time, and the influence of the surrounding environment on the characteristics of the photosensitive layer can be avoided. And after the second electrode and the photosensitive layer are patterned, a second insulating layer on the whole surface is manufactured, then the second insulating layer is etched to form a second opening, then a common electrode is manufactured, and the second opening is filled with the common electrode to realize the electric connection of the second electrode and the common electrode.
In an embodiment, fig. 2 is a schematic diagram of a film structure of an optional implementation manner of the photo sensor module according to an embodiment of the present invention, as shown in fig. 2, the photo sensor unit SN includes a first electrode a, a photosensitive layer b, and a second electrode c, which are sequentially arranged, optionally, the first electrode a is a metal electrode, the second electrode c is a transparent electrode, and the photosensitive layer b is a PIN junction; the photosensitive module further comprises a first insulating layer J1 and a second insulating layer J2, the first insulating layer J1 is located on the side, away from the first organic flat layer Y1, of the first electrode a, the first insulating layer J1 is provided with a first opening K1, and the photosensitive layer b is connected to the first electrode a through the first opening K1; the second insulating layer J2 is located on the side of the first insulating layer J1 away from the first organic planarization layer Y1, the second insulating layer J2 surrounds and covers the second electrode c and the photosensitive layer b, the second insulating layer J2 has a second opening K2, and the second electrode c is connected to the common electrode COM through the second opening K2; the first inorganic layer W1 includes a first insulating layer J1, i.e., the first insulating layer J1 has a first groove C1. Optionally, the first groove C1 penetrates through the first insulating layer J1. As shown in the figure, the first electrode a of the photo cell SN is connected to the photo cell switch tube T, which includes a gate g, a source s, a drain d and an active layer qw, and the first electrode a is schematically shown to be connected to the drain d.
In the manufacturing process of the photo sensor module, it is assumed that after the manufacturing process of the first electrode a is completed, the first insulating layer J1 is not manufactured, then the photosensitive film layer and the second electrode film layer are laid on the whole surface, and then the photosensitive film layer and the second electrode film layer are etched and patterned, at this time, the etching process may cause over-etching on the first organic planarization layer below, so that the planarization of the first organic planarization layer Y1 is deteriorated. In another case, if the first insulating layer J1 is replaced with an organic film layer, the photosensitive layer b is inevitably brought into contact with the organic film layer when the photosensitive layer b is formed, thereby affecting the light sensing characteristics of the light sensing unit. In the invention, the first insulating layer J1 is provided, the first insulating layer J1 is an inorganic layer, and after the first electrode a and the first insulating layer J1 are sequentially manufactured, and then the etching process of the photosensitive film layer and the second electrode film layer is performed, even if the etching process is performed, the etching process is performed on the first insulating layer J1, so that the etching process does not affect the first organic flat layer Y1 below the first insulating layer J1, thereby protecting the first organic flat layer Y1 and providing a flat substrate for the photosensitive unit SN. Meanwhile, the first insulating layer J1 is an inorganic layer, so that the inorganic layer is ensured to be in contact with the photosensitive layer b of the photosensitive unit SN, and the photosensitive characteristic can be prevented from being influenced by defects generated on the contact interface.
In this embodiment, the first inorganic layer includes the first insulating layer, that is, at least the first insulating layer has a first groove, and the first groove and the first opening can be completed in the same process, so that the original manufacturing process can be reused without increasing the number of process steps. Or the etching of the first groove can be independently made according to the etching depth requirement of the first groove. The first groove can penetrate through the first insulating layer, or only part of the first insulating layer in the area where the first groove is etched away is arranged, and the arrangement of the first groove is equivalent to reserving a space for expansion and contraction for the first insulating layer, so that expansion and contraction stress in a film forming process of the first insulating layer can be released conveniently, stress applied to the first organic flat layer is reduced, and the risk of stripping a film layer of the first organic flat layer is reduced. When the second insulating layer is manufactured, part of the second insulating layer fills the first groove, the thickness of the inorganic layer on the first organic flat layer in the area where the first groove is located is reduced, and the influence of expansion or contraction stress on the first organic flat layer during film forming of the second insulating layer can be reduced to a certain extent.
Optionally, as shown in fig. 2, in the photosensitive unit SN, the photosensitive layer b is in contact connection with the central region of the first electrode a through the first opening K1, that is, the photosensitive layer b is ensured not to be in direct contact with the edge of the first electrode a, so as to avoid that the conductive performance between the photosensitive layer b and the first electrode a is affected due to the abnormal characteristics of the edge of the first electrode a.
In an embodiment, fig. 3 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention, and as shown in fig. 3, the first inorganic layer W1 includes a second insulating layer J2. That is, the second insulating layer J2 has a first groove C1, and optionally, the first groove C1 penetrates the second insulating layer J2. In the light sensing module provided by the embodiment, the first groove and the second opening on the second insulating layer can be manufactured in the same process, or the etching of the first groove can be independently manufactured according to the etching depth requirement of the first groove. According to the embodiment, the thickness of the inorganic layer on the first organic flat layer in the area where the first groove is located can be reduced, the expansion and contraction space is reserved in the first groove, and the influence of the expansion and contraction stress on the first organic flat layer during film forming of the second insulating layer can be reduced to a certain extent.
Optionally, in a direction perpendicular to the substrate, the first groove penetrates through the first inorganic layer, that is, when the first inorganic layer includes the first insulating layer, the first groove penetrates through the first insulating layer; when the first inorganic layer includes the second insulating layer, the first groove penetrates the second insulating layer. The first groove penetrates through the first inorganic layer, so that the expansion and contraction stress of each position, parallel to the plane where the first organic flat layer is located, in the first inorganic layer can be released at the position of the first groove, and the stress applied to the first organic flat layer during film forming of the first inorganic layer can be effectively reduced.
In an embodiment, fig. 4 is a schematic view of a film structure of an alternative embodiment of a photo sensor module according to an embodiment of the invention, and as shown in fig. 4, the first inorganic layer W1 includes a first insulating layer J1 and a second insulating layer J2. In this embodiment, a portion of the first insulating layer and a portion of the second insulating layer between two adjacent photo cells SN are etched away to form the first groove C1. In the manufacturing process, after the first insulating layer is manufactured on the whole surface, part or all of the first insulating layer in the area where the first groove is located is etched, so that expansion or contraction stress in the film forming process of the first insulating layer can be released in the film forming process of the first insulating layer, and the influence of the expansion and contraction stress on the first organic flat layer in the film forming process is reduced. After the second insulating layer is manufactured on the whole surface, the second insulating layer part or all of the area where the first groove is located is correspondingly etched, so that the expansion or contraction stress in the film forming process of the second insulating layer can be released in the film forming process of the second insulating layer, and the influence of the expansion or contraction stress on the first organic flat layer in the film forming process of the second insulating layer is reduced. The embodiment can effectively reduce the deterioration influence of the inorganic layer film forming process between the first organic flat layer and the common electrode on the first organic flat layer, and can improve the performance reliability of the photosensitive module.
Alternatively, as illustrated with continued reference to fig. 4, the groove bottom of the first groove C1 exposes the first organic planarization layer Y1. In the embodiment, the inorganic layer between the first organic flat layer and the common electrode is etched, and first in the manufacturing process of the first insulating layer, the first insulating layer at the position of the first groove is etched to expose the first organic flat layer, so that the expansion and contraction stress at each position parallel to the plane where the first organic flat layer is positioned can be released at the position of the first groove in the film forming process of the first insulating layer; then, in the manufacturing process of the second insulating layer, the second insulating layer at the position of the first groove is etched to remove the bottom to expose the first organic flat layer, and further, the expansion and contraction stress of each position parallel to the plane where the first organic flat layer is positioned in the film forming process of the second insulating layer can be released at the position of the first groove; this embodiment can effectively reduce the influence of the deterioration of the first organic planarization layer in the film formation process of the first insulating layer and the second insulating layer.
In an embodiment, fig. 5 is a schematic view of a film structure of an alternative embodiment of the photo sensor module according to the embodiment of the invention, as shown in fig. 5, in the embodiment, the first inorganic layer W1 includes a first insulating layer J1 and a second insulating layer J2, and a difference DX is formed between sidewalls of the first insulating layer J1 and sidewalls of the second insulating layer J2 in the first groove C1. The embodiment can firstly ensure that the stress applied to the first organic flat layer in the process of forming the inorganic layer can be reduced by arranging the first groove, and the risk of film stripping of the first organic flat layer is reduced. Further after the sidewall of the first insulating layer and the sidewall of the second insulating layer in the first groove form a break difference, when the common electrode is manufactured, the common electrode can be guaranteed to permeate the sidewall of the first groove through the two steps, and the risk that the common electrode breaks at the sidewall of the first groove can be reduced.
In an embodiment, fig. 6 is a schematic diagram of a film structure of an alternative embodiment of the photo sensor module according to the embodiment of the present disclosure, where the photo sensor module further includes a conductive block 102, and the conductive block 102 and the first electrode a are fabricated in the same layer; at least a part of the groove bottom of the first groove C1 exposes the conductive block 102, and within the first groove C1, the common electrode COM is electrically connected to the conductive block 102. After making first recess on the first inorganic layer between first organic planarization layer and the common electrode, must form disconnected poor in the position at first recess place, when refabricating the common electrode, the common electrode that partly lies in first recess both sides need be in disconnected poor position assurance continuity, this embodiment sets up the conducting block in first recess and is connected with the common electrode electricity, can avoid the common electrode to cause the broken string and influence electric conductive property in the great disconnected poor position of first recess department, can guarantee the performance reliability. In addition, in general, the common electrode is made of a transparent conductive material, such as indium gallium zinc oxide, when the common electrodes partially positioned on two sides of the first groove are electrically connected, common electrode wiring needs to be arranged in the side wall and the bottom of the first groove, the resistivity of the common electrode is relatively high, the resistance of the common electrode is increased by the design, so that the power consumption is influenced. Fig. 6 illustrates the conductive bumps 102 all located in the first groove C1, and it should be noted that, similar to the first electrode a, the conductive bumps may also include a portion covered by the first insulating layer J1 in another alternative embodiment.
In an embodiment, fig. 7 is a schematic top view of an alternative embodiment of the photo sensor module according to the embodiment of the invention, as shown in fig. 7, a plurality of first grooves C1 are disposed between two adjacent photo sensor cells SN. The shape of the first recess in the figure is also only schematically indicated for a top view. In the first inorganic layer film forming process, the first grooves at each position can provide a space for expansion and contraction of the first inorganic layer, and the contraction or expansion stress borne by the first organic flat layer at each position can be effectively reduced, so that the risk of film peeling of the first organic flat layer is effectively reduced.
In some alternative embodiments, the first grooves are disposed around the at least one light-sensing unit, an orthogonal projection of one of the first grooves on the substrate is a first projection, an orthogonal projection of one of the light-sensing units on the substrate is a second projection, and one of the first projections surrounds the at least one second projection.
In an embodiment, fig. 8 is a schematic top view of an alternative embodiment of the light sensing module according to the embodiment of the invention, and fig. 8 is a top view from one side of the light sensing unit to one side of the substrate, in which the first groove coincides with the first projection and the light sensing unit coincides with the second projection, so that the first projection and the second projection are not marked repeatedly in fig. 8. As shown in fig. 8, the first groove C1 is disposed around one light sensing unit SN, and in this embodiment, the groove disposed around one light sensing unit SN is defined as one first groove C1, which is disposed to correspond to a plurality of first grooves C1 that are communicated, the first groove having a portion extending in the first direction x and a portion extending in the second direction y. Because the first inorganic layer W1 is divided into discontinuous structures by the arrangement of the first groove C1, the contraction or expansion stress in the film forming process of the first inorganic layer can be reduced, so that the stress born by the first organic flat layer is reduced, and the film stripping of the first organic flat layer is effectively avoided.
In another embodiment, fig. 9 is a schematic top view of an alternative embodiment of a photo sensor module according to an embodiment of the invention. Fig. 9 is a plan view of the substrate side viewed from the light sensing unit side, in which the first groove coincides with the first projection and the light sensing unit coincides with the second projection, so that the first projection and the second projection are not repeatedly marked in fig. 9. As shown in fig. 9, in the case where one first groove C1 is disposed around four light sensing cells SN, the same groove disposed around the four light sensing cells SN is defined as one first groove C1, which corresponds to a plurality of first grooves C1 disposed in communication, and the first groove C1 also has a portion extending in the first direction x, and also has a portion extending in the second direction y. The first inorganic layer W1 is divided into discontinuous structures by the arrangement of the first groove C1, and the contraction or expansion stress in the film forming process of the first inorganic layer can be reduced, so that the stress applied to the first organic flat layer in the film forming process of the first inorganic layer is reduced, and the film stripping of the first organic flat layer is effectively avoided.
In an embodiment, fig. 10 is a schematic view of a film structure of another alternative embodiment of the photo sensor module according to the embodiment of the invention, as shown in fig. 10, the second inorganic layer W2 is disposed on a side of the common electrode COM away from the photo cell SN, the second inorganic layer W2 has a second groove C2, and the second groove C2 at least partially overlaps with the first groove C1 in a direction perpendicular to the substrate. The embodiment is only illustrated by the light sensing module corresponding to the embodiment in fig. 6, and it should be noted that the other embodiments of the present invention are applicable to this solution, and are not described herein again. In the embodiment, a second inorganic layer is further manufactured on the common electrode, the second inorganic layer can protect the common electrode, meanwhile, a second groove is manufactured on the second inorganic layer, the second groove can provide a space for the second inorganic layer to shrink and expand in the film forming process, and the stress applied to the first organic flat layer by the second inorganic layer in the shrinking and expanding process can be reduced, so that the risk of film peeling of the first organic flat layer is further reduced.
In an embodiment, fig. 11 is a schematic view of a film structure of another alternative embodiment of the photo sensor module according to the embodiment of the invention, as shown in fig. 11, the photo sensor module further includes a second organic planarization layer Y2 disposed on a side of the common electrode COM away from the photo sensor unit SN, and the second organic planarization layer Y2 at least includes a portion filling the first groove C1. The embodiment is only illustrated by the light sensing module corresponding to the embodiment in fig. 6, and it should be noted that the other embodiments of the present invention are applicable to this solution, and are not described herein again. In the embodiment, the second organic flat layer is further manufactured to fill the first groove, so that the flatness of the surface above the common electrode of the light sensing module is ensured, and the mechanical strength of the whole structure is prevented from being influenced by the larger offset of the structure due to the arrangement of the first groove. And meanwhile, the organic layer is used for filling the first groove, so that the integral bending resistance of the light sensing module can be further ensured. Optionally, in this embodiment, an inorganic protective layer may be further disposed on the second organic planarization layer.
Fig. 12 is a schematic view of a display panel according to an embodiment of the present invention, and as shown in fig. 12, the display panel includes an array substrate 200, a photo sensor module 100 according to any embodiment of the present invention, and a display layer 300, where the display layer 300 is located on a side of the array substrate 200 away from the photo sensor module 100. Optionally, the display panel is an organic light emitting display panel, and the display layer 300 includes a plurality of organic light emitting devices. Optionally, the display panel is an inorganic light emitting display panel, and the display layer 300 includes a plurality of inorganic light emitting diodes. It should be noted that fig. 12 only illustrates the stacking sequence of the photo sensor module 100, the array substrate 200 and the display layer 300, and the size relationship between the photo sensor module 100 and the array substrate 200 can be determined according to practical situations, which is not specifically limited in this application.
According to the embodiment, the light sensing module and the display panel provided by the invention at least realize the following beneficial effects:
according to the invention, the first inorganic layer is provided with the first groove, the first groove is positioned between two adjacent light sensing units, the protection effect of the first inorganic layer on the light sensing units cannot be influenced, meanwhile, the first groove can be used for thinning the first inorganic layer, or the first inorganic layer is completely dug at the position of the first groove, the arrangement of the first groove is equivalent to reserving a space for expansion or contraction for part of the first inorganic layer, and larger expansion or contraction stress in the film forming process of the first inorganic layer can be released, so that the stress applied to the first organic flat layer is reduced, the risk of film stripping of the first organic flat layer is reduced, and the performance reliability of the light sensing module is improved. Meanwhile, the first groove can also provide a bending path for the first inorganic layer during bending, and the bending resistance of the light sensing module is improved.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A light sense module, comprising:
a substrate;
a plurality of light sensing unit switch tubes located on the substrate;
the first organic flat layer is positioned on one side, away from the substrate, of the light sensing unit switch tube;
the plurality of light sensing units are positioned on one side of the first organic flat layer, which is far away from the light sensing unit switch tube;
the common electrode is positioned on one side of the light sensing unit away from the first organic flat layer; and
a first inorganic layer between the first organic planarization layer and the common electrode, the first inorganic layer having a first groove; wherein the content of the first and second substances,
the first groove is positioned between two adjacent light sensing units;
in a direction perpendicular to the plane of the substrate, the light sensing unit comprises a first electrode, a photosensitive layer and a second electrode which are sequentially arranged, wherein the first electrode is positioned on one side of the first organic flat layer, which is far away from the switching tube of the light sensing unit;
the photo sensor module further includes a first insulating layer and a second insulating layer,
the first insulating layer is positioned on one side of the first electrode, which is far away from the first organic flat layer, the first insulating layer is provided with a first opening, and the photosensitive layer is connected to the first electrode through the first opening;
the second insulating layer is positioned on one side of the first insulating layer, which is far away from the first organic flat layer, the second insulating layer surrounds and covers the second electrode and the photosensitive layer, the second insulating layer is provided with a second opening, and the second electrode is connected to the common electrode through the second opening;
the first inorganic layer includes at least one of the first insulating layer and the second insulating layer.
2. The photo sensor module as claimed in claim 1,
the first inorganic layer includes the first insulating layer and the second insulating layer.
3. The photo sensor module as claimed in claim 2,
the groove bottom of the first groove exposes the first organic flat layer.
4. The photo sensor module as claimed in claim 2,
the light sensing module also comprises a conductive block, and the conductive block and the first electrode are manufactured in the same layer; at least part of the groove bottom of the first groove exposes the conductive block, and the common electrode is electrically connected with the conductive block in the first groove.
5. The photo sensor module as claimed in claim 1,
a plurality of first grooves are formed between every two adjacent light sensing units.
6. The photo sensor module as claimed in claim 1,
the first grooves are arranged around at least one light sensing unit, the orthographic projection of one first groove on the substrate is a first projection, the orthographic projection of one light sensing unit on the substrate is a second projection, and the first projection surrounds at least one second projection.
7. The photo sensor module as claimed in claim 1,
the first groove penetrates through the first inorganic layer in a direction perpendicular to the substrate.
8. The photo module as claimed in claim 1, further comprising:
and the second inorganic layer is positioned on one side of the common electrode, which is far away from the photosensitive unit, and is provided with a second groove which is at least partially overlapped with the first groove in the direction vertical to the substrate.
9. The photo module as claimed in claim 1, further comprising:
and the second organic flat layer is positioned on one side of the common electrode, which is far away from the light sensation unit, and at least comprises a part for filling the first groove.
10. A display panel comprising the photo sensor module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625418.6A CN109670475B (en) | 2018-12-28 | 2018-12-28 | Light sensing module and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811625418.6A CN109670475B (en) | 2018-12-28 | 2018-12-28 | Light sensing module and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109670475A CN109670475A (en) | 2019-04-23 |
| CN109670475B true CN109670475B (en) | 2020-11-03 |
Family
ID=66146447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811625418.6A Active CN109670475B (en) | 2018-12-28 | 2018-12-28 | Light sensing module and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109670475B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047906B (en) * | 2019-05-21 | 2022-10-18 | 京东方科技集团股份有限公司 | Display device based on transparent photodiode, display panel and manufacturing method thereof |
| CN110676297B (en) | 2019-09-30 | 2022-10-18 | 福州京东方光电科技有限公司 | Substrate, preparation method thereof and display device |
| CN110808272B (en) * | 2019-11-14 | 2022-01-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN111048020B (en) * | 2019-12-23 | 2021-05-07 | 武汉华星光电技术有限公司 | Array substrate, display panel and electrical property testing method |
| TWI826996B (en) * | 2022-04-08 | 2023-12-21 | 義明科技股份有限公司 | Light sensing module and manufacturing method thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6300029B2 (en) * | 2014-01-27 | 2018-03-28 | ソニー株式会社 | Image sensor, manufacturing apparatus, and manufacturing method |
| US9627463B2 (en) * | 2014-11-28 | 2017-04-18 | Lg Display Co., Ltd. | Flexible display device with space reducing wire configuration |
| CN105373772A (en) * | 2015-10-09 | 2016-03-02 | 京东方科技集团股份有限公司 | Optical fingerprint/palm print identification device, touch control display panel and display device |
| CN106684243B (en) * | 2017-02-15 | 2019-04-09 | 厦门天马微电子有限公司 | A kind of flexible display panels and display device |
| CN108646949B (en) * | 2018-06-04 | 2024-03-19 | 京东方科技集团股份有限公司 | Photoelectric detection circuit and method, array substrate, display panel and fingerprint identification method |
| CN109031824B (en) * | 2018-07-31 | 2021-05-11 | Oppo广东移动通信有限公司 | Array substrate, display screen and electronic equipment |
| CN108898955A (en) * | 2018-07-31 | 2018-11-27 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN108807496B (en) * | 2018-08-02 | 2020-12-11 | 云谷（固安）科技有限公司 | Organic electroluminescent display panel and display device |
-
2018
- 2018-12-28 CN CN201811625418.6A patent/CN109670475B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109670475A (en) | 2019-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109670475B (en) | Light sensing module and display panel | |
| CN110970484B (en) | Display substrate and display device | |
| KR101373435B1 (en) | Display substrate, organic emitting diode display device having the same and method of manufacturing thereof | |
| CN110416231B (en) | Pixel structure and repairing method thereof | |
| CN103441128B (en) | A kind of tft array substrate and manufacture method thereof | |
| CN110046610B (en) | Fingerprint identification display device, preparation method thereof and display equipment | |
| CN104716147B (en) | A kind of tft array substrate and preparation method thereof, display device | |
| EP3826069A1 (en) | Array substrate, fabrication method therefor, and display device | |
| CN112198729B (en) | Array substrate, display panel and electronic equipment | |
| CN110854175B (en) | Array substrate, preparation method thereof and display panel | |
| CN112183398A (en) | Display substrate, manufacturing method thereof and display device | |
| CN103677406A (en) | Touch Panel and Touch Display Panel | |
| US20230195267A1 (en) | Touch panel, display panel and display apparatus | |
| CN110649176A (en) | Anode plate, display panel and display device | |
| CN111223899B (en) | Display panel, display device and preparation method of display panel | |
| CN112420617A (en) | Preparation method of display panel and display panel | |
| CN112992937B (en) | Display substrate, display device, display substrate and preparation method of display device | |
| US11392258B2 (en) | Touch panel including dielectric structure, display panel and display device | |
| CN113345917B (en) | Array substrate, manufacturing method thereof and display panel | |
| CN115275044A (en) | Display panel | |
| CN111081723B (en) | Array substrate, manufacturing method of array substrate, display panel and display device | |
| US11282867B2 (en) | Manufacturing method of display substrate motherboard, and display device | |
| CN112310327A (en) | Display panel and display device | |
| CN111463222A (en) | Array substrate and display device | |
| CN213987121U (en) | Array substrate and liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211021 Address after: No.8, liufangyuanheng Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430074 Patentee after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |