CN109659289A - 一种具有热敏绝缘材料的封装机构 - Google Patents

一种具有热敏绝缘材料的封装机构 Download PDF

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CN109659289A
CN109659289A CN201710933332.9A CN201710933332A CN109659289A CN 109659289 A CN109659289 A CN 109659289A CN 201710933332 A CN201710933332 A CN 201710933332A CN 109659289 A CN109659289 A CN 109659289A
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insulating materials
packaging mechanism
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胡忠臣
冯仁迪
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Shanghai Royal Semiconductor Technology Co Ltd
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Abstract

公开了一种具有热敏绝缘材料的封装机构，封装机构包括芯片载体，芯片载体包括底片，底片上设有半导体芯片，半导体芯片的上表面涂覆有绝缘材料，绝缘材料的内部设有导电球，导电球外包覆有热敏材料，封装机构设有下压支架，下压支架设有加热薄片，加热薄片能够将热敏材料进行加热并融化热敏材料，在纵向压力的作用下，导电球的上下两端分别与下压支架上的加热薄片和半导体芯片接触，其他未加热的导电球保持绝缘。

Description

一种具有热敏绝缘材料的封装机构
技术领域
本发明涉及半导体封装的领域，更具体地讲，涉及一种不需焊接就能高效简洁的对半导体芯片进行封装的装置。
背景技术
芯片封装机构是将芯片封装于一芯片封装载板上以保护芯片的装置。图1是现有技术的封装示意图，传统的半导体芯片具有焊盘结构，采用焊接的方式进行封装，此种操作方式不但相对复杂，而且焊接过程中产生的热量和废气等也会对操作者造成一定的影响。传统的导电球上还连接有金属引线，布线费工费时，效率低下，甚至会接触不良而使整个装置报废。
发明内容
因此，提供本发明的示例以基本上解决由于相关领域的限制和缺点而导致的一个或更多个问题，省略焊接过程，有效简化了封装流程。
按照本发明提供的技术方案，所述的封装机构包括芯片载体，所述的芯片载体包括一个第一底片，在所述的第一底片上设有一层或多层第二底片，所述的第二底片上设有半导体芯片，所述的半导体芯片的上表面涂覆有至少一层绝缘材料，所述的绝缘材料的内部设有至少个导电球，所述的每个导电球外包覆有一层或多层表面呈光滑状的热敏材料，所述的封装机构的左侧上方设有第一下压支架，所述的封装机构的右侧上方设有第二下压支架，所述的第一下压支架和/或所述的第二下压支架的下方侧面设有一个或两个加热薄片，所述的加热薄片与所述的导电球呈映射对应关系，所述的加热薄片能够将所述的热敏材料进行加热并融化所述的热敏材料，在纵向压力的作用下，所述的导电球的上下两端分别与所述的下压支架上的加热薄片和半导体芯片接触，其他未加热的所述的导电球保持绝缘。
进一步的，所述的第一下压支架和/或所述的第二下压支架内部设有与所述的加热薄片相连接的加热装置;
进一步的，所述的绝缘材料呈粘胶状，所述的绝缘材料由丙烯腈衍生物和/或聚酰亚胺衍生物组成;
优选的，所述的热敏材料为热敏环氧树脂，厚度为10nm-60nm;
此外，所述的第一底片是有机玻璃基板、无机玻璃基板、高分子材料基板和/或玻璃纤维预浸布;
另外，所述的第二底片由氧化铝陶瓷制成，其烧制温度为1679.3℃-1989.2℃，透射波长为2.23-5.82μm。
根据本发明，所述的绝缘材料内部呈阵列的空心孔状，所述的导电球至于空心孔中。
进一步的，所述的第一下压支架和所述的第二下压支架7包括在第一区域的接触部分和在第二区域的支撑部分，所述的第一区域和所述的第二区域彼此垂直;
此外，所述的第一下压支架的接触部分和所述的第二下压支架的接触部分之间形成空隙。
根据本发明，所述的半导体芯片上设有电性触点，导电球与所述的电性触点接触。
本发明通过采用含导电球的绝缘胶代替金属线和绝缘层，省略焊接过程，消除了传统工艺的疲劳缺陷，制作成本低，大大提高了整体的牢固性和连接的可靠性。
附图说明
图1为传统的芯片封装机构示意图。
图2为本发明的芯片封装机构示意图。
图3为本发明的封装流程示意图。
具体实施方式
下面结合具体实施例对本发明作进一步说明。
以下将结合附图所示的具体实施方式对本发明进行详细描述。但这些实施方式并
不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
此外，在不同的实施例中可能使用重复的标号或标示。这些重复仅为了简单清楚地叙述本发明，不代表所讨论的不同实施例及/或结构之间具有任何关联性。
本发明的各实施方式中提到的有关于步骤的标号，仅仅是为了描述的方便，而没有实质上先后顺序的联系。各具体实施方式中的不同步骤，可以进行不同先后顺序的组合，实现本发明的发明目的。
因此，提供本发明的示例以基本上解决由于相关领域的限制和缺点而导致的一个或更多个问题，省略焊接过程，有效简化了封装流程。
参照附图2和3，所述的封装机构包括芯片载体，所述的芯片载体包括一个第一底片1，在所述的第一底片1上设有一层或多层第二底片2，所述的第二底片2上设有半导体芯片3，其特征在于，所述的半导体芯片3的上表面涂覆有至少一层绝缘材料4，所述的绝缘材料4的内部设有至少5个导电球5，所述的每个导电球5外包覆有一层或多层表面呈光滑状的热敏材料，所述的封装机构的左侧上方设有第一下压支架6，所述的封装机构的右侧上方设有第二下压支架7，所述的第一下压支架6和/或所述的第二下压支架7的下方侧面设有一个或两个加热薄片7，所述的加热薄片7与所述的导电球5呈映射对应关系，所述的加热薄片7能够将所述的热敏材料进行加热并融化所述的热敏材料，在纵向压力的作用下，所述的导电球5的上下两端分别与所述的下压支架上的加热薄片7和半导体芯片3接触，其他未加热的所述的导电球5保持绝缘。
所述的第一下压支架6和/或所述的第二下压支架7内部设有与所述的加热薄片7相连接的加热装置（图中未示出）,所述的加热装置温度可以调节，最高能够将稳定加热至1200℃;
所述的绝缘材料呈粘胶状，所述的绝缘材料由丙烯腈衍生物和/或聚酰亚胺衍生物组成;
所述的热敏材料为热敏环氧树脂，厚度为10nm-60nm;
所述的第一底片1是有机玻璃基板、无机玻璃基板、高分子材料基板和/或玻璃纤维预浸布;
所述的第二底片2由氧化铝陶瓷制成，其烧制温度为1679.3℃-1989.2℃，透射波长为2.23-5.82μm;
所述的绝缘材料内部呈阵列的空心孔状，所述的导电球5至于空心孔中;
所述的第一下压支架6和所述的第二下压支架7包括在第一区域的接触部分和在第二区域的支撑部分，所述的第一区域和所述的第二区域彼此垂直;
所述的第一下压支架6的接触部分和所述的第二下压支架7的接触部分之间形成空隙;
所述的半导体芯片3上设有电性触点，导电球5与所述的电性触点接触;
所述的纵向压力可以为人工施力，也可以由机械控制。
图3示出了本发明的封装流程，参照附图3，该封装过程如下：首先，在第一底片1和第二底片2上固定半导体芯片3，其次，在半导体芯片3上表面涂覆含导电球5的绝缘胶，然后，在纵向压力的作用下下压第一下压支架6和第二下压支架7，再次，打开加热装置，对导电球5进行加热，最后，加热完成后对整个机构进行塑封。
本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (10)

1.一种具有热敏绝缘材料的封装机构，所述的封装机构包括芯片载体，所述的芯片载体包括一个第一底片1，在所述的第一底片1上设有一层或多层第二底片2，所述的第二底片2上设有半导体芯片3，其特征在于，所述的半导体芯片3的上表面涂覆有至少一层绝缘材料4，所述的绝缘材料4的内部设有至少5个导电球5，所述的每个导电球5外包覆有一层或多层表面呈光滑状的热敏材料，所述的封装机构的左侧上方设有第一下压支架6，所述的封装机构的右侧上方设有第二下压支架7，所述的第一下压支架6和/或所述的第二下压支架7的下方侧面设有一个或两个加热薄片7，所述的加热薄片7与所述的导电球5呈映射对应关系，所述的加热薄片7能够将所述的热敏材料进行加热并融化所述的热敏材料，在纵向压力的作用下，所述的导电球5的上下两端分别与所述的下压支架上的加热薄片7和半导体芯片3接触，其他未加热的所述的导电球5保持绝缘。
2.根据权利要求1所述的一种具有热敏绝缘材料的封装机构，所述的第一下压支架6和/或所述的第二下压支架7内部设有与所述的加热薄片7相连接的加热装置。
3.根据权利要求2所述的一种具有热敏绝缘材料的封装机构，所述的绝缘材料呈粘胶状，所述的绝缘材料由丙烯腈衍生物和/或聚酰亚胺衍生物组成。
4.根据权利要求1所述的一种具有热敏绝缘材料的封装机构，所述的热敏材料为热敏环氧树脂，厚度为10nm-60nm。
5.根据权利要求1或2所述的一种具有热敏绝缘材料的封装机构，所述的第一底片1是有机玻璃基板、无机玻璃基板、高分子材料基板和/或玻璃纤维预浸布。
6.根据权利要求1-3任意一项所述的一种具有热敏绝缘材料的封装机构，所述的第二底片2由氧化铝陶瓷制成，其烧制温度为1679.3℃-1989.2℃，透射波长为2.23-5.82μm。
7.根据权利要求3所述的一种具有热敏绝缘材料的封装机构，所述的绝缘材料内部呈阵列的空心孔状，所述的导电球5至于空心孔中。
8.根据权利要求1-4任意一项所述的一种具有热敏绝缘材料的封装机构，所述的第一下压支架6和所述的第二下压支架7包括在第一区域的接触部分和在第二区域的支撑部分，所述的第一区域和所述的第二区域彼此垂直。
9.根据权利要求8所述的一种具有热敏绝缘材料的封装机构，所述的第一下压支架6的接触部分和所述的第二下压支架7的接触部分之间形成空隙。
10.根据权利要求1所述的一种具有热敏绝缘材料的封装机构，所述的半导体芯片3上设有电性触点，导电球5与所述的电性触点接触。
CN201710933332.9A 2017-10-10 2017-10-10 一种具有热敏绝缘材料的封装机构 Pending CN109659289A (zh)

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