CN109616573A - For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board - Google Patents
For the laser lift-off device of flexible base board and the laser-stripping method of flexible base board Download PDFInfo
- Publication number
- CN109616573A CN109616573A CN201811286013.4A CN201811286013A CN109616573A CN 109616573 A CN109616573 A CN 109616573A CN 201811286013 A CN201811286013 A CN 201811286013A CN 109616573 A CN109616573 A CN 109616573A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- flexible base
- base board
- layer
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The present disclosure provides for the laser lift-off device of flexible base board and the laser-stripping method of flexible base board.The laser lift-off device for flexible base board includes interchangeable vacuum absorbing platform and layer of silica gel.Layer of silica gel includes opposite the upper surface and the lower surface.The material of layer of silica gel is soft materials.The lower surface of layer of silica gel is embedded on interchangeable vacuum absorbing platform.Interchangeable vacuum absorbing platform is used for the upper surface adsorption flexible substrate by layer of silica gel.This announcement promotes the adsorption capacity of flexible base board and vacuum absorbing platform by layer of silica gel, and then can effectively remove to flexible base board.
Description
[technical field]
This announcement is related to field of display technology, in particular to a kind of laser lift-off device and flexible base for flexible base board
The laser-stripping method of plate.
[background technique]
With the manufacturing technology mature increasingly of flexible display, it is already possible to utilize accurate coating process by high temperature resistant
Fexible film production on the glass substrate, and array (array) and organic luminous layer processing procedure are carried out, then at mould group engineering
(module) fexible film is removed from glass substrate and is removed with laser lift-off (laser lift off, LLO) processing procedure, with complete
At the removing of flexible base board.
There is gap however, in the prior art, between fexible film and laser lift-off device and mutual adaptation compared with
Difference, therefore the peeling effect for causing flexible base board is bad.
Therefore it is in need provide it is a kind of for the laser lift-off device of flexible base board and the laser-stripping method of flexible base board,
It is of the existing technology to solve the problems, such as.
[summary of the invention]
In order to solve the above technical problems, the one of this announcement be designed to provide for flexible base board laser lift-off device and
The laser-stripping method of flexible base board promotes the adsorption capacity of flexible base board and vacuum absorbing platform by layer of silica gel, and then can be with
Effectively flexible base board is removed.
To reach above-mentioned purpose, this announcement provides the laser lift-off device for being used for flexible base board.It is described to be used for flexible base board
Laser lift-off device include interchangeable vacuum absorbing platform and layer of silica gel.The layer of silica gel include opposite upper surface and
Lower surface.The material of the layer of silica gel is soft materials.The lower surface of the layer of silica gel is embedded described alternatively true
On empty absorption platform.The interchangeable vacuum absorbing platform is used for the upper surface adsorption flexible base by the layer of silica gel
Plate.
In this announcement embodiment therein, the interchangeable vacuum absorbing platform includes front end area and rear end region
Domain, the layer of silica gel include multiple first silica gel particles and multiple second silica gel particles, and first silica gel particle is set to phase
To in the front end area of the interchangeable vacuum absorbing platform, second silica gel particle is set to and relatively described can replace
In the back-end region of the vacuum absorbing platform changed, and the size of first silica gel particle and second silica gel particle
Size is different.
In this announcement embodiment therein, the diameter of each first silica gel particle is each described equal to 0.5 μm
The diameter of second silica gel particle is equal to 1 μm.
In this announcement embodiment therein, the laser lift-off device for flexible base board further includes that work is flat
The support frame of platform, suction nozzle and the support suction nozzle, wherein the interchangeable vacuum absorbing platform is set to the workbench
On, the suction nozzle is movably arranged at the upper surface of the relatively described layer of silica gel.
In this announcement embodiment therein, the lower surface insertion interchangeable vacuum of the layer of silica gel is inhaled
The depth of attached platform is greater than 0 and is less than 0.1mm.
This announcement also provides the laser-stripping method of a flexible base board, and the above-mentioned laser for flexible base board is used to shell
From device.The method includes the flexible base board to be fitted to the upper surface of the layer of silica gel, inhaled using the vacuum
Flexible base board described in attached platform starting vacuum suction, and laser lift-off is carried out to the flexible base board using laser beam.
In this announcement embodiment therein, the interchangeable vacuum absorbing platform includes front end area and rear end region
Domain, the layer of silica gel include multiple first silica gel particles and multiple second silica gel particles, and first silica gel particle is set to phase
To in the front end area of the interchangeable vacuum absorbing platform, second silica gel particle is set to and relatively described can replace
In the back-end region of the vacuum absorbing platform changed, and the size of first silica gel particle and second silica gel particle
Size is different.
In this announcement embodiment therein, the diameter of each first silica gel particle is each described equal to 0.5 μm
The diameter of second silica gel particle is equal to 1 μm.
In this announcement embodiment therein, the laser lift-off device for flexible base board further includes that work is flat
The support frame of platform, suction nozzle and the support suction nozzle, wherein the interchangeable vacuum absorbing platform is set to the workbench
On, the suction nozzle is movably arranged at the upper surface of the relatively described layer of silica gel.
In this announcement embodiment therein, the lower surface insertion interchangeable vacuum of the layer of silica gel is inhaled
The depth of attached platform is greater than 0 and is less than 0.1mm.
The laser lift-off device of flexible base board and swashing for the flexible base board are used for as described in this revealed embodiment
In photospallation method, the lower surface of the layer of silica gel is embedded on the interchangeable vacuum absorbing platform, described to replace
The vacuum absorbing platform changed is used for
Soft materials can promote the adsorption capacity of flexible base board and vacuum absorbing platform by layer of silica gel, and then can be effectively to flexible base
Plate is removed.
For the above content of this announcement can be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate institute's accompanying drawings, makees
Detailed description are as follows:
[Detailed description of the invention]
Fig. 1 shows the structural schematic diagram of the laser lift-off device for flexible base board of the embodiment according to this announcement；
Fig. 2 shows the vertical view configuration schematic diagram of layer of silica gel and vacuum absorbing platform according to an embodiment of this announcement；
Fig. 3 shows the structural schematic diagram of the laser lift-off device for flexible base board of the embodiment according to this announcement；
And
Fig. 4 shows the process block diagram of the laser-stripping method of the flexible base board of the embodiment according to this announcement.
[specific embodiment]
In order to which the above-mentioned and other purposes of this announcement, feature, advantage can be clearer and more comprehensible, it is excellent that spy is hereafter lifted into this announcement
Embodiment is selected, and cooperates institute's accompanying drawings, is described in detail below.Furthermore the direction term that this announcement is previously mentioned, such as above and below,
Top, bottom, front, rear, left and right, inside and outside, side layer, around, center, it is horizontal, laterally, vertically, longitudinally, axial direction, radial direction, top layer or
Lowest level etc. is only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand this announcement, and
It is non-to limit this announcement.
The similar unit of structure is to be given the same reference numerals in the figure.
Referring to Fig.1, the laser lift-off device 10 for flexible base board of an embodiment of this announcement includes alternatively true
Empty absorption platform 12 and layer of silica gel 14.Layer of silica gel 14 includes opposite upper surface 142 and lower surface 144.Under layer of silica gel 14
Surface 144 is embedded on interchangeable vacuum absorbing platform 12.Interchangeable vacuum absorbing platform 12 is used to pass through layer of silica gel 14
142 adsorption flexible substrate 20 of upper surface.The material of layer of silica gel 14 is soft materials.
Since the flexible base board 20 of the present embodiment and the material of layer of silica gel 14 are soft materials, flexible base board 20 with
Adaptation between interchangeable vacuum absorbing platform 12 is good, flexible base board 20 can be promoted by layer of silica gel 14 and vacuum suction is flat
The adsorption capacity (arrow as shown in Figure 1) of platform 12, and then effectively flexible base board 20 can be removed.
Specifically, flexible base board 20 includes fexible film.Fexible film is, for example, Kapton (polyimide
film,PI film).The depth that the lower surface 144 of layer of silica gel 14 is embedded in interchangeable vacuum absorbing platform 12 be greater than 0 and
Less than 0.1mm.Fexible film can effectively be removed from glass substrate by layer of silica gel 14 and be removed by the present embodiment, therefore can be provided
Flexible base board 20 with superperformance.
Specifically, since the material of the flexible base board of the present embodiment 20 and layer of silica gel 14 is soft materials, flexible base board
Gap between 20 and layer of silica gel 14 can be closed because of flexible base board 20 and the mutually compression due to of layer of silica gel 14.
Specifically, the bonding of layer of silica gel 14 is low, and therefore, the present embodiment can be by layer of silica gel 14 effectively by fexible film from glass
Removing is removed on glass substrate, therefore can provide the flexible base board 20 with superperformance.
Specifically, interchangeable vacuum absorbing platform 12 includes front end area 122 and back-end region 144.Layer of silica gel 14 is wrapped
Include multiple first silica gel particles 146 and multiple second silica gel particles 148.First silica gel particle 146 is set to relatively alternatively
In the front end area 122 of vacuum absorbing platform 12, the second silica gel particle 148 is set to relatively interchangeable vacuum absorbing platform 12
Back-end region 124 in, and the size of the first silica gel particle 146 is different from the size of the second silica gel particle 148.Therefore flexible base
Adaptation between plate 20 and alternatively vacuum absorbing platform 12 is good, can promote flexible base board 20 and vacuum by layer of silica gel 14
The adsorption capacity of absorption platform 12, and then effectively flexible base board 20 can be removed.
Specifically, the diameter of every one first silica gel particle 146 is equal to 0.5 μm, the diameter etc. of every one second silica gel particle 148
In 1 μm.
Referring to Fig. 3, the laser lift-off device 10 for flexible base board of an embodiment of this announcement further includes workbench
16, the support frame 18 of suction nozzle 17 and support suction nozzle 17.Interchangeable vacuum absorbing platform 12 is set on workbench 16.Suction nozzle
17 are movably arranged at the upper surface 142 (arrow direction as shown in Figure 3) of opposite layer of silica gel 14.For swashing for flexible base board
Photospallation device 10 further includes laser beam 19, is movably arranged at the upper surface 142 of opposite layer of silica gel 14 (as shown in Figure 3
Arrow direction), for flexible base board 20 carry out laser lift-off.
Specifically, the present embodiment can be directed to different product size, i.e. flexible base board 20, and it is interchangeable to carry out customized and replacement
Vacuum absorbing platform 12, the interchangeable vacuum absorbing platform 12 after enabling replacement meets the size of flexible base board 20, thus not
It needs to change overall work platform 16 because of various sizes of platform requirement.
Referring to Fig. 4, the laser-stripping method 300 of the flexible base board of an embodiment of this announcement uses above-mentioned be used for
The laser lift-off device 10 of flexible base board.The method 300 includes: square 310, and flexible base board is fitted to the upper table of layer of silica gel
Face；Square 320 starts vacuum suction flexible base board (arrow as shown in Figure 1) using vacuum absorbing platform；And square 330,
Laser lift-off is carried out to flexible base board using laser beam.
The laser lift-off device of flexible base board and swashing for the flexible base board are used for as described in this revealed embodiment
In photospallation method, the lower surface of the layer of silica gel is embedded on the interchangeable vacuum absorbing platform, described to replace
The vacuum absorbing platform changed is used for
Soft materials can promote the adsorption capacity of flexible base board and vacuum absorbing platform by layer of silica gel, and then can be effectively to flexible base
Plate is removed.
Although this announcement, those skilled in the art have shown and described relative to one or more implementations
It will be appreciated that equivalent variations and modification based on the reading and understanding to the specification and drawings.This announcement includes all such repairs
Change and modification, and is limited only by the scope of the following claims.In particular, to various functions executed by the above components, use
It is intended to correspond in the term for describing such component and executes the specified function of the component (such as it is functionally of equal value
) random component (unless otherwise instructed), even if in structure with execute the exemplary of this specification shown in this article and realize
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to several realization sides
Only one in formula is disclosed, but this feature can with such as can be for a given or particular application expectation and it is advantageous
One or more other features combinations of other implementations.Moreover, with regard to term " includes ", " having ", " containing " or its deformation
For being used in specific embodiments or claims, such term is intended to wrap in a manner similar to the term " comprising "
It includes.
The above is only the preferred embodiments of this announcement, it is noted that for those of ordinary skill in the art, is not departing from
Under the premise of this announcement principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the guarantor of this announcement
Protect range.
Claims (10)
1. a kind of laser lift-off device for flexible base board characterized by comprising
Interchangeable vacuum absorbing platform；And
Layer of silica gel, including opposite the upper surface and the lower surface, wherein the material of the layer of silica gel is soft materials, the layer of silica gel
The lower surface be embedded on the interchangeable vacuum absorbing platform, the interchangeable vacuum absorbing platform is for passing through
The upper surface adsorption flexible substrate of the layer of silica gel.
2. being used for the laser lift-off device of flexible base board as described in claim 1, which is characterized in that the interchangeable vacuum
Absorption platform includes front end area and back-end region, and the layer of silica gel includes multiple first silica gel particles and multiple second silicon particles
Son, first silica gel particle are set in the front end area of the relatively described interchangeable vacuum absorbing platform, and described
Second silica gel particle is set in the back-end region of the relatively described interchangeable vacuum absorbing platform, and first silicon particle
The size of son is different from the size of second silica gel particle.
3. being used for the laser lift-off device of flexible base board as claimed in claim 2, which is characterized in that each first silica gel
The diameter of particle is equal to 0.5 μm, and the diameter of each second silica gel particle is equal to 1 μm.
4. as described in claim 1 be used for flexible base board laser lift-off device, which is characterized in that further include workbench,
The support frame of suction nozzle and the support suction nozzle, wherein the interchangeable vacuum absorbing platform is set on the workbench,
The suction nozzle is movably arranged at the upper surface of the relatively described layer of silica gel.
5. as described in claim 1 be used for flexible base board laser lift-off device, which is characterized in that the layer of silica gel it is described
The depth that lower surface is embedded in the interchangeable vacuum absorbing platform is greater than 0 and is less than 0.1mm.
6. a kind of laser-stripping method of flexible base board, which is characterized in that using described in claim 1 for flexible base board
Laser lift-off device, which comprises
The flexible base board is fitted to the upper surface of the layer of silica gel；
Using flexible base board described in vacuum absorbing platform starting vacuum suction；And
Laser lift-off is carried out to the flexible base board using laser beam.
7. the laser-stripping method of flexible base board as claimed in claim 6, which is characterized in that the interchangeable vacuum suction
Platform includes front end area and back-end region, and the layer of silica gel includes multiple first silica gel particles and multiple second silica gel particles,
First silica gel particle is set in the front end area of the relatively described interchangeable vacuum absorbing platform, second silicon
Micelle is set in the back-end region of the relatively described interchangeable vacuum absorbing platform, and first silica gel particle
Size is different from the size of second silica gel particle.
8. the laser-stripping method of flexible base board as claimed in claim 7, which is characterized in that each first silica gel particle
Diameter be equal to 0.5 μm, the diameter of each second silica gel particle is equal to 1 μm.
9. the laser-stripping method of flexible base board as claimed in claim 6, which is characterized in that further include workbench, suction nozzle
And the support frame of the support suction nozzle, wherein the interchangeable vacuum absorbing platform is set on the workbench, it is described
Suction nozzle is movably arranged at the upper surface of the relatively described layer of silica gel.
10. the laser-stripping method of flexible base board as claimed in claim 6, which is characterized in that the layer of silica gel it is described under
The depth that surface is embedded in the interchangeable vacuum absorbing platform is greater than 0 and is less than 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811286013.4A CN109616573B (en) | 2018-10-31 | 2018-10-31 | Laser peeling device for flexible substrate and laser peeling method for flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811286013.4A CN109616573B (en) | 2018-10-31 | 2018-10-31 | Laser peeling device for flexible substrate and laser peeling method for flexible substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109616573A true CN109616573A (en) | 2019-04-12 |
| CN109616573B CN109616573B (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811286013.4A Active CN109616573B (en) | 2018-10-31 | 2018-10-31 | Laser peeling device for flexible substrate and laser peeling method for flexible substrate |
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| US20170077459A1 (en) * | 2015-09-10 | 2017-03-16 | Samsung Display Co., Ltd. | Apparatus for separating substrate and method of separating substrate by using the same |
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| CN107644950A (en) * | 2017-09-22 | 2018-01-30 | 武汉华星光电技术有限公司 | A kind of device and method separated to flexible panel and glass substrate |
| WO2018179201A1 (en) * | 2017-03-30 | 2018-10-04 | シャープ株式会社 | Suction apparatus, carrier apparatus, and el device manufacturing apparatus |
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|---|---|---|---|---|
| JP2008280157A (en) * | 2007-05-11 | 2008-11-20 | Sharp Corp | Protecting film peeling device and protecting film peeling method |
| CN103802441A (en) * | 2012-11-14 | 2014-05-21 | 财团法人工业技术研究院 | Film peeling device and method thereof |
| CN105252880A (en) * | 2012-11-14 | 2016-01-20 | 财团法人工业技术研究院 | Film peeling device and method thereof |
| CN106469682A (en) * | 2015-08-21 | 2017-03-01 | 旭硝子株式会社 | The stripping off device of duplexer and the manufacture method of stripping means and electronic device |
| US20170077459A1 (en) * | 2015-09-10 | 2017-03-16 | Samsung Display Co., Ltd. | Apparatus for separating substrate and method of separating substrate by using the same |
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| CN109616573B (en) | 2023-06-30 |
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