CN109600935B - Brick power supply heat dissipation optimization method - Google Patents
Brick power supply heat dissipation optimization method Download PDFInfo
- Publication number
- CN109600935B CN109600935B CN201910030321.9A CN201910030321A CN109600935B CN 109600935 B CN109600935 B CN 109600935B CN 201910030321 A CN201910030321 A CN 201910030321A CN 109600935 B CN109600935 B CN 109600935B
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- power supply
- circuit board
- printed circuit
- brick power
- plug pin
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- 239000011449 brick Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 238000005457 optimization Methods 0.000 title abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 claims abstract description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 8
- 239000011148 porous material Substances 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 5
- 230000007480 spreading Effects 0.000 claims description 5
- 238000003892 spreading Methods 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 16
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000004590 computer program Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method and a device for optimizing heat dissipation of a brick power supply, which comprises the steps of setting a device which potentially triggers a shadow effect in wave soldering to be far away from the brick power supply on a printed circuit board; enlarging the aperture of the plug pin hole of the brick power supply on the printed circuit board; the copper laying area of the brick power supply around the plug pin hole on the printed circuit board is reduced; arranging heat gathering holes and/or hole exposing rings for plug pin holes of a brick power supply on the printed circuit board; and spraying tin on the surface of the printed circuit board. According to the technical scheme, the targeted welding optimization can be performed on different pins or different pin holes of the brick power supply and the printed circuit board, the tin coating rate of the pins and the pin holes is improved, the tin penetration effect of wave soldering is improved, the strength of welding spots is improved, and the working stability of the brick power supply is further improved.
Description
Technical Field
The invention relates to the field of power supplies, in particular to a method for optimizing heat dissipation of a brick power supply.
Background
With the development of high-performance computing and application such as a GPU (graphics processing unit), the power consumption of a server is continuously increased, and a board card 48V power supply scheme is put into use. Due to the fact that the power design requirements of the server are larger and larger, the density of components is higher and higher, and the requirement of size miniaturization is inclined, the application of 48V brick power supplies is increased. The brick power supply is a modularized power supply shaped like bricks and sealed and filled with glue, and in the prior art, the packaging size of a full brick power supply is 116.8 multiplied by 61 multiplied by 12.7mm, the packaging size of a half brick power supply (1/2 bricks) is 61 multiplied by 57.9 multiplied by 12.7mm, and the packaging size of a 1/4 brick power supply is 57.9 multiplied by 36.8 multiplied by 12.7 mm. The application of the DC/DC brick module with small volume, high power and high efficiency can simplify the product design and improve the product reliability. The welding effect of the bricks can directly influence the performance of the brick modules, and further influence the quality of the server. However, due to differences in PCB (printed circuit board) design and soldering process, soldering effects are affected by a large number of factors, and thus a soldering work may have a shadow effect to degrade quality. The shadow effect is a phenomenon that in the wave soldering process, objects (components or auxiliary carriers and the like) with large heat absorption capacity or fast heat dissipation reduce the local temperature of the PCB to form temperature shadow, so that the local tin on the PCB is poor.
In the prior art, pins on a PCB of a brick power supply are in contact with a large number of copper sheets, and the pin holes are only simple plug-in holes without any special treatment. Because the brick is by itself material characteristic and design characteristic, its heat absorption radiating effect is better, and the poor problem of welding appears easily in the plug-in components pin during the welding. The brick power plug-in pins have the problems of poor tin-on and tin-off of the pins, no wetting of welding, unsatisfactory filling requirements and the like due to more welding layers of the PCB and thicker diameter of the pins, which leads to faster heat dissipation. In addition, the PCB design and the soldering process are not optimized for this problem, resulting in an unsatisfactory soldering effect of the brick power supply.
The problem that poor welding results in poor welding effect easily appears in the fragment of brick power among the prior art is not had effectual solution at present.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a method and an apparatus for optimizing heat dissipation of a brick power supply, which can perform targeted solder optimization on different pins or different pin holes of the brick power supply and a printed circuit board, improve the tin-loading rate of the pins and the pin holes, improve the tin-penetrating effect of wave soldering, and improve the strength of solder joints, thereby improving the working stability of the brick power supply.
Based on the above purpose, an aspect of the embodiments of the present invention provides a method for optimizing heat dissipation of a brick power supply, including the following steps:
placing the devices that potentially trigger shadow effects in wave soldering away from the brick power supply on the printed circuit board;
enlarging the aperture of the plug pin hole of the brick power supply on the printed circuit board;
the copper laying area of the brick power supply around the plug pin hole on the printed circuit board is reduced;
arranging heat gathering holes and/or hole exposing rings for plug pin holes of a brick power supply on the printed circuit board;
and spraying tin on the surface of the printed circuit board.
In some embodiments, the pin plating of the brick power supply is first smoothed before the above steps are performed.
In some embodiments, the device potentially triggering the shadow effect in wave soldering is an electronic circuit component that absorbs heat more or dissipates heat more quickly.
In some embodiments, enlarging the diameter of the plug pin hole of the brick power supply on the printed circuit board comprises: the aperture is enlarged from the standard 2.1mm to 2.3 mm.
In some embodiments, reducing the copper paved area comprises: the copper cutting method is used for uniformly reducing the copper spreading extension length in all directions around the plug pin hole.
In some embodiments, adding a heat gathering pore and/or an open pore ring comprises: and a plurality of heat gathering holes are uniformly arranged on the outer side of the plug pin hole in a mode of contacting with the bonding pad.
In some embodiments, adding a heat gathering pore and/or an open pore ring comprises: and an exposed hole ring with a plurality of heat collecting holes is arranged outside the plug pin hole.
In some embodiments, the number of the heat-gathering holes is 6, and the hole diameter of the heat-gathering holes is smaller than the pin holes.
In some embodiments, further comprising: flux is added into the plug pin holes on the printed circuit board, and wave soldering is performed on the brick power supply by using a titanium alloy jig at a reduced track speed and with an increased tin wave.
In some embodiments, further comprising: the orientation of the printed circuit board during wave soldering is adjusted in such a way that the shadowing effect that occurs with the brick power supply is reduced.
The invention has the following beneficial technical effects: according to the method and the device for optimizing the heat dissipation of the brick power supply, provided by the embodiment of the invention, the device which potentially triggers the shadow effect in wave soldering is arranged far away from the brick power supply on the printed circuit board, the aperture of the plug pin hole of the brick power supply on the printed circuit board is enlarged, the copper spreading area around the plug pin hole of the brick power supply on the printed circuit board is reduced, the plug pin hole of the brick power supply on the printed circuit board is provided with the heat gathering hole and/or the exposed hole ring, and the technical scheme of spraying tin on the surface of the printed circuit board is adopted, so that the targeted soldering optimization can be carried out on different pins or different pin holes of the brick power supply and the printed circuit board, the tin applying rate of the pins and the pin holes is improved, the tin penetrating effect of wave soldering is improved, and the strength of a welding point is improved, thereby improving.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for optimizing heat dissipation of a power supply of a brick provided by the present invention;
FIG. 2 is a diagram of heat gathering holes of the method for optimizing heat dissipation of a power supply of a brick provided by the invention;
fig. 3 is a setting diagram of the combination of heat collecting holes and hole exposing rings in the method for optimizing heat dissipation of the power supply of the brick.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it is understood that "first" and "second" are only used for convenience of expression and should not be construed as limitations to the embodiments of the present invention, and the descriptions thereof in the following embodiments are omitted.
In view of the above, a first aspect of the embodiments of the present invention provides an embodiment of a brick power supply heat dissipation optimization method capable of performing targeted welding optimization on different pins or different pin holes of a brick power supply and a printed circuit board. Fig. 1 is a schematic flow chart of an embodiment of a method for optimizing heat dissipation of a power supply of a brick provided by the invention.
The brick power supply heat dissipation optimization method comprises the following steps:
step S101, arranging a device which potentially triggers a shadow effect in wave soldering to be far away from a brick power supply on a printed circuit board;
step S103, expanding the aperture of the plug pin hole of the brick power supply on the printed circuit board;
step S105, reducing the copper laying area of the brick power supply around the plug pin hole on the printed circuit board;
step S107, arranging heat gathering holes and/or hole exposing rings on plug pin holes of the brick power supply on the printed circuit board;
step S109, spraying tin on the surface of the printed circuit board.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a Random Access Memory (RAM), or the like. Embodiments of the computer program may achieve the same or similar effects as any of the preceding method embodiments to which it corresponds.
In some embodiments, the pin plating of the brick power supply is first smoothed before the above steps are performed. The even and smooth plating layer is beneficial to improving the tin coating rate.
In some embodiments, the device potentially triggering the shadow effect in wave soldering is an electronic circuit component that absorbs heat more or dissipates heat more quickly. Locating these devices away from the brick power supply can reduce the shadow effect experienced by the brick power supply.
In some embodiments, enlarging the diameter of the plug pin hole of the brick power supply on the printed circuit board comprises: the aperture is enlarged from the standard 2.1mm to 2.3 mm. The aperture is enlarged, so that the soldering tin can fully contact with the welding spot, and the tin applying rate is improved.
In some embodiments, reducing the copper paved area comprises: the copper cutting method is used for uniformly reducing the copper spreading extension length in all directions around the plug pin hole. The reduction of the copper laying area is equal to the reduction of the heat dissipation area, so that the shadow effect influence on the brick power supply is reduced.
In some embodiments, adding a heat gathering pore and/or an open pore ring comprises: the outer side of the plug pin hole is uniformly provided with a plurality of heat gathering holes in a mode of contacting with the bonding pad, and/or the outer side of the plug pin hole is provided with an exposed ring with a plurality of heat gathering holes. The arrangement of the heat gathering holes and/or the hole exposing rings can collect the larger part of heat to be transferred to the bonding pad by utilizing the area advantage in wave soldering, so that the temperature of the bonding pad is improved, and the tin coating effect is further improved. As shown in fig. 2 and 3, the number of the heat collecting holes is 6, and the diameter of the heat collecting holes is smaller than that of the pin holes.
In addition, the method further comprises: the tin spraying to the surface of the printed circuit board can form a covering layer on the surface of the printed circuit board, and poor welding caused by oxidation due to air contact is avoided. The surface tin spraying melts in wave soldering and can be normally coated with tin.
The method disclosed according to an embodiment of the present invention may also be implemented as a computer program executed by a CPU, which may be stored in a computer-readable storage medium. The computer program, when executed by the CPU, performs the above-described functions defined in the method disclosed in the embodiments of the present invention. The above method steps may also be implemented using a controller and a computer readable storage medium for storing a computer program for causing the controller to implement the above steps.
In some embodiments, the method further comprises: flux is added into the plug pin holes on the printed circuit board, and wave soldering is performed on the brick power supply by using a titanium alloy jig at a reduced track speed and with an increased tin wave. The wave soldering includes a step of spraying flux to the printed circuit board, but the step may not completely spray the positions in the pin holes, and thus the flux can be added in advance. The reduced orbital speed results in longer weld time and the heightened tin wave results in higher weld quality. The titanium alloy smelting tool is easy to conduct heat. In some embodiments, the orientation of the printed circuit board during wave soldering is also adjusted in a manner that reduces the shadowing effects that occur with the brick power supply, which can also be reduced.
The various illustrative steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.
It can be seen from the foregoing embodiments that, in the brick power supply heat dissipation optimization method provided in the embodiments of the present invention, the device that potentially triggers the shadow effect in wave soldering is set to be away from the brick power supply on the printed circuit board, the aperture of the plug pin hole of the brick power supply on the printed circuit board is enlarged, the copper-laid area around the plug pin hole of the brick power supply on the printed circuit board is reduced, the heat-collecting hole and/or the exposed hole ring is/are provided for the plug pin hole of the brick power supply on the printed circuit board, and the tin is sprayed on the surface of the printed circuit board.
According to the invention, the welding effect of the power brick module is optimized by considering the brick power supply, the PCB design and the welding process, so that various problems of poor tin feeding and tin removing, no wetting in welding, unsatisfied filling requirement and the like in the brick power supply in the prior art can be effectively solved, and the stability and the reliability of a server power supply system are favorably improved.
It should be particularly noted that, the steps in the embodiments of the method for optimizing heat dissipation of a brick power supply can be mutually intersected, replaced, added, or deleted, so that the method for optimizing heat dissipation of a brick power supply, which is implemented by reasonably arranging and combining the steps, should also belong to the scope of the present invention, and should not limit the scope of the present invention to the described embodiments.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items. The sequence numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (9)
1. A method for optimizing heat dissipation of a brick power supply is characterized by comprising the following steps:
placing the devices that potentially trigger shadow effects in wave soldering away from the brick power supply on the printed circuit board;
enlarging the aperture of the plug pin hole of the brick power supply on the printed circuit board;
the copper cutting method is used for uniformly reducing the copper spreading extension length in all directions around the plug pin hole so as to reduce the copper spreading area of the brick power supply around the plug pin hole on the printed circuit board;
arranging heat gathering holes and/or hole exposing rings for plug pin holes of a brick power supply on the printed circuit board;
and spraying tin on the surface of the printed circuit board.
2. The method of claim 1, wherein prior to performing the above steps, the pin plating of the brick power supply is first smoothed.
3. The method of claim 1, wherein the devices that potentially trigger shadowing effects during wave soldering are electronic circuit components that absorb heat more or dissipate heat more quickly.
4. The method of claim 1, wherein expanding the diameter of the brick power plug pin hole on the printed circuit board comprises: the aperture is enlarged from the standard 2.1mm to 2.3 mm.
5. The method of claim 1, wherein adding a heat gathering pore and/or an open pore ring comprises: and a plurality of heat gathering holes are uniformly arranged on the outer side of the plug pin hole in a mode of contacting with the bonding pad.
6. The method of claim 5, wherein adding a heat gathering and/or exposure ring comprises: and an exposed hole ring with a plurality of heat collecting holes is arranged outside the plug pin hole.
7. The method of claim 5, wherein the number of the heat-gathering holes is 6, and the diameter of the heat-gathering holes is smaller than the pin holes.
8. The method of claim 1, further comprising: flux is added into the plug pin holes on the printed circuit board, and wave soldering is performed on the brick power supply by using a titanium alloy jig at a reduced track speed and with an increased tin wave.
9. The method of claim 8, further comprising: the orientation of the printed circuit board during wave soldering is adjusted in such a way that the shadowing effect that occurs with the brick power supply is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910030321.9A CN109600935B (en) | 2019-01-14 | 2019-01-14 | Brick power supply heat dissipation optimization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910030321.9A CN109600935B (en) | 2019-01-14 | 2019-01-14 | Brick power supply heat dissipation optimization method |
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| Publication Number | Publication Date |
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| CN109600935A CN109600935A (en) | 2019-04-09 |
| CN109600935B true CN109600935B (en) | 2021-07-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
| US20040108130A1 (en) * | 2002-12-09 | 2004-06-10 | Yazaki Corporation | Mounting structure for electronic component |
| CN103391680B (en) * | 2012-05-10 | 2016-12-14 | 珠海格力电器股份有限公司 | Pcb board pad assembly and pcb board |
| CN107172811A (en) * | 2017-07-20 | 2017-09-15 | 郑州云海信息技术有限公司 | A kind of battery connector and preparation method for solving failure welding |
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