CN109564911A - 散热装置及终端设备 - Google Patents

散热装置及终端设备 Download PDF

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Publication number
CN109564911A
CN109564911A CN201780049688.4A CN201780049688A CN109564911A CN 109564911 A CN109564911 A CN 109564911A CN 201780049688 A CN201780049688 A CN 201780049688A CN 109564911 A CN109564911 A CN 109564911A
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phase
heat
change material
radiator
container
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CN109564911B (zh
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李伟
邹柳君
陈纯洋
张治国
李泉明
杨果
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Honor Device Co Ltd
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Huawei Technologies Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Confectionery (AREA)

Abstract

一种散热装置及终端设备,其中散热装置(200)用于为热源散热，其具体包括传热组件(1)和相变单元(2)，在相变单元(2)内设置有相变材料(3)，传热组件(1)连接在热源和相变单元(2)之间，且传热组件(1)和相变材料(3)之间具有热传导，传热组件(1)可以用于将热源的热量传导至相变材料(3)中，这样，能够在终端设备短时间提高功效时保证散热效果。

Description

PCT国内申请，说明书已公开。

Claims (23)

  1. PCT国内申请，权利要求书已公开。
CN201780049688.4A 2016-12-29 2017-11-30 散热装置及终端设备 Active CN109564911B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/CN2016/113152 WO2018119925A1 (zh) 2016-12-29 2016-12-29 散热装置及其终端设备
CNPCT/CN2016/113152 2016-12-29
PCT/CN2017/114025 WO2018121173A1 (zh) 2016-12-29 2017-11-30 散热装置及终端设备

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CN109564911A true CN109564911A (zh) 2019-04-02
CN109564911B CN109564911B (zh) 2020-12-15

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CN202110362230.2A Pending CN113157072A (zh) 2016-12-29 2016-12-29 散热装置及其终端设备
CN202110363601.9A Active CN113157073B (zh) 2016-12-29 2016-12-29 散热装置及其终端设备
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CN202110363601.9A Active CN113157073B (zh) 2016-12-29 2016-12-29 散热装置及其终端设备

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US (1) US11016546B2 (zh)
EP (2) EP4191379A1 (zh)
JP (2) JP7015837B2 (zh)
CN (4) CN110121925B (zh)
ES (1) ES2939610T3 (zh)
WO (2) WO2018119925A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN110290686A (zh) * 2019-07-24 2019-09-27 中国科学院理化技术研究所 一种复合散热***
CN115135118A (zh) * 2022-07-27 2022-09-30 中国船舶重工集团公司第七二四研究所 一种用于热点抑制的多相耦合相变传热装置

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CN110494016B (zh) * 2019-08-06 2020-10-23 华为技术有限公司 一种散热装置及终端电子设备
CN213662236U (zh) * 2020-06-24 2021-07-09 瑞声科技（南京）有限公司 电子设备
CN112672604B (zh) * 2020-12-22 2023-04-21 Oppo（重庆）智能科技有限公司 均热板、外壳和电子装置
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CN115135118A (zh) * 2022-07-27 2022-09-30 中国船舶重工集团公司第七二四研究所 一种用于热点抑制的多相耦合相变传热装置

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EP3554203A1 (en) 2019-10-16
US20200150732A1 (en) 2020-05-14
EP3554203B1 (en) 2023-01-25
JP2020504904A (ja) 2020-02-13
CN113157072A (zh) 2021-07-23
EP3554203A4 (en) 2020-01-22
CN113157073B (zh) 2023-04-28
WO2018121173A1 (zh) 2018-07-05
WO2018119925A1 (zh) 2018-07-05
CN109564911B (zh) 2020-12-15
JP2022044692A (ja) 2022-03-17
ES2939610T3 (es) 2023-04-25
CN113157073A (zh) 2021-07-23
US11016546B2 (en) 2021-05-25
CN110121925B (zh) 2021-04-09
JP7341261B2 (ja) 2023-09-08
CN110121925A (zh) 2019-08-13
JP7015837B2 (ja) 2022-02-03

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