CN109548379A - A kind of graphite heat conduction plate of mechanical connection - Google Patents
A kind of graphite heat conduction plate of mechanical connection Download PDFInfo
- Publication number
- CN109548379A CN109548379A CN201811538909.7A CN201811538909A CN109548379A CN 109548379 A CN109548379 A CN 109548379A CN 201811538909 A CN201811538909 A CN 201811538909A CN 109548379 A CN109548379 A CN 109548379A
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- CN
- China
- Prior art keywords
- metal framework
- graphite heat
- mechanical connection
- graphite
- conduction plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention belongs to conductive structure design fields, and in particular to a kind of graphite heat conduction plate of mechanical connection.It is made of the first metal framework, graphite heat-conducting fin, the second metal framework, the graphite heat-conducting fin surface carries out metalized, the groove for placing graphite heat-conducting fin is provided in first metal framework and the second metal framework, with, the first metal framework and the second metal framework by mechanical connection, the first and second metal framework is packaged as a whole graphite heat-conducting fin.Structure proposed by the present invention solves the problems, such as that high thermal conductivity graphite intensity is low.Also make the thermal resistance between frame and the interface of graphite smaller simultaneously.
Description
Technical field
The invention belongs to conductive structure design fields, and in particular to a kind of graphite heat conduction plate of mechanical connection.
Background technique
In existing and later longer period of time, convection current cooling+conduction cooling is still airborne electronic equipment heat dissipation
Major way.When using the radiating mode, the heat-conducting plate of the heat utilization module of electronic module is transmitted to by conduction pattern
Case side wall, then taken heat outside cabinet to by external cooling air.The heat dissipation effect for influencing this radiating mode is main
There are two aspects, are the thermal conductivity of heat-conducting plate and the heat exchange efficiency of cabinet respectively.According to the correlation theory of thermal conduction study, for heat
For equally distributed electronic module, the thermal conductivity of temperature difference t and heat-conducting plate between the maximum temperature and minimum temperature of heat-conducting plate
Rate is inversely proportional, and thermal conductivity is higher, and temperature difference t will be smaller.When the thermal conductivity of heat-conducting plate is increased to 200%, temperature difference t will subtract
Few 50%；When the thermal conductivity of heat-conducting plate is increased to 400%, temperature difference t will reduce 25%.For commonly using 6U module at present,
The material of heat-conducting plate is 6061 aluminium alloys, and the thermal conductivity of 6061 aluminium alloys is 180W/ (mK), when module dissipation is 80W, module
Temperature difference t be about 30 DEG C.If the material of module heat-conducting plate to be changed to the material of high heat conductance, when thermal conductivity reaches
360W/ (mK), the temperature difference t of module are about 15 DEG C.If the material of module heat-conducting plate to be changed to the material of high heat conductance
Material, when thermal conductivity reaches 900W/ (mK), the temperature difference t of module is about 6 DEG C.
Graphite is the very high a kind of material of thermal conductivity in the Nature, is referred to as high thermal conductivity by the graphite that pyrolytic process is processed
Graphite, thermal conductivity highest can achieve 1700W/m DEG C.It is referred to as graphite heat conduction plate with the heat-conducting plate that APG material is processed.Such as
Fruit can replace currently used aluminum alloy materials that the temperature difference of module can be greatly reduced with graphite.Although graphite has thermal conductivity
High outstanding advantages, but it haves the shortcomings that intensity is low, thermal contact resistance is big and restricts it as airborne computer heat-conducting plate most
Big obstacle.
Summary of the invention
The purpose of the present invention: solve the problems, such as that graphite heat conduction plate intensity is low big with thermal resistance.
Technical solution of the present invention:
Graphite heat conduction plate is placed in the first metal framework and the second metal framework, graphite heat-conducting fin surface carries out gold
Categoryization processing, passes through mechanical connection between graphite heat-conducting fin and the first metal framework and the second metal framework；By the first metal frame
Frame is mechanically connected with the second metal framework, and the program is by graphite heat-conducting fin and the first metal framework and the second metal framework
The overall package of composition is got up, and graphite heat-conducting fin stress is undertaken by aluminum alloy frame, avoids external force to graphite heat-conducting fin
Damage.Solves the problems, such as graphite heat-conducting fin intensity difference using the frame structure, while it is thermally conductive strong also to have played graphite heat-conducting fin
The advantages of.
At the same time, if by graphite heat-conducting fin be placed directly in frame without take mechanical connection, graphite heat-conducting fin with
The contact surface of frame will have biggish thermal contact resistance, this is that Methods in Heat Sink Board's Design should try to avoid.In order to reduce graphite guide
Graphite heat-conducting fin and frame should be mechanically connected by the thermal contact resistance between backing and frame, thus can substantially reduce stone
Thermal contact resistance between black thermally conductive sheet and frame.The mode of mechanical connection includes the technologies such as welding, bonding and thermo-compression bonding, these
Mode can make thermal resistance between graphite and aluminium alloy smaller.
The present invention has the advantage that effect:
1. solving the problems, such as that high thermal conductivity graphite intensity is low using frame structure.
2. making the thermal resistance between frame and the interface of graphite smaller using mechanical connection manner.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention,
Number explanation: the first metal framework of 1-；2- is mechanically connected material；3- graphite heat-conducting fin；The second metal framework of 4-.
Specific embodiment
A kind of graphite heat conduction plate of mechanical connection is made of the first metal framework, graphite heat-conducting fin, the second metal framework,
The graphite heat conducting plate surface carries out metalized, is provided with placement graphite guide in the first metal framework and the second metal framework
The groove of backing, graphite heat-conducting fin pass through mechanical connection, the first and second metal frame with, the first metal framework and the second metal framework
Frame is packaged as a whole.The processing mode has plating, chemical plating or ion sputtering.Graphite heat-conducting fin and the first metal framework and
Two metal frameworks pass through cementing or welded connecting.First and second metal framework is packaged as a whole by welding.First and second metal frame
Frame is aluminum alloy materials.
When assembly, by be filled with the second metal framework of graphite heat-conducting fin be buckled in spread one layer mechanical connection material first
On metal framework.To the first metal framework and the second metal framework, the first metal framework and graphite heat conduction plate, the second metal framework
It is attached with graphite heat conduction plate using mechanical connection manner, mechanical connection manner includes welding, bonding, crimping and other machines
Tool connection type.
Claims (5)
1. a kind of graphite heat conduction plate of mechanical connection is made of, institute the first metal framework, graphite heat-conducting fin, the second metal framework
It states graphite heat conducting plate surface and carries out metalized, be provided with placement graphite heat conducting in the first metal framework and the second metal framework
The groove of piece, graphite heat-conducting fin pass through mechanical connection, the first and second metal framework with, the first metal framework and the second metal framework
It is packaged as a whole.
2. a kind of graphite heat conduction plate of mechanical connection according to claim 1, it is characterised in that: the processing mode has electricity
Plating, chemical plating or ion sputtering.
3. a kind of graphite heat conduction plate of mechanical connection according to claim 1, it is characterised in that: graphite heat-conducting fin with, the
One metal framework and the second metal framework pass through cementing or welded connecting.
4. a kind of graphite heat conduction plate of mechanical connection according to claim 1, it is characterised in that: the first and second metal framework
It is packaged as a whole by welding.
5. a kind of according to claim 1, graphite heat conduction plate of mechanical connection described in 3 or 4, it is characterised in that: the first and second metal
Frame is aluminum alloy materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811538909.7A CN109548379A (en) | 2018-12-14 | 2018-12-14 | A kind of graphite heat conduction plate of mechanical connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811538909.7A CN109548379A (en) | 2018-12-14 | 2018-12-14 | A kind of graphite heat conduction plate of mechanical connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109548379A true CN109548379A (en) | 2019-03-29 |
Family
ID=65854817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811538909.7A Pending CN109548379A (en) | 2018-12-14 | 2018-12-14 | A kind of graphite heat conduction plate of mechanical connection |
Country Status (1)
| Country | Link |
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| CN (1) | CN109548379A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505789A (en) * | 2019-07-27 | 2019-11-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module |
| CN112492849A (en) * | 2020-11-27 | 2021-03-12 | 北京无线电测量研究所 | Light high heat conducting plate |
| CN113438864A (en) * | 2021-06-24 | 2021-09-24 | 中国电子科技集团公司第二十九研究所 | Graphite aluminum high-heat-conductivity module with low longitudinal thermal resistance |
| CN115384129A (en) * | 2022-04-19 | 2022-11-25 | 中国科学院山西煤炭化学研究所 | Aluminum alloy-graphite heat spreading plate and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6940721B2 (en) * | 2000-02-25 | 2005-09-06 | Richard F. Hill | Thermal interface structure for placement between a microelectronic component package and heat sink |
| CN101930952A (en) * | 2009-06-17 | 2010-12-29 | 天津莱尔德电子材料有限公司 | Compliant multilayered thermally-conductive interface assemblies and memory modules including the same |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN206237724U (en) * | 2016-11-13 | 2017-06-09 | 沈开湘 | A kind of radiator structure for electronic component |
| CN107209338A (en) * | 2015-01-20 | 2017-09-26 | 微软技术许可有限责任公司 | The graphite linings heat pipe of mental package |
-
2018
- 2018-12-14 CN CN201811538909.7A patent/CN109548379A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6940721B2 (en) * | 2000-02-25 | 2005-09-06 | Richard F. Hill | Thermal interface structure for placement between a microelectronic component package and heat sink |
| CN101930952A (en) * | 2009-06-17 | 2010-12-29 | 天津莱尔德电子材料有限公司 | Compliant multilayered thermally-conductive interface assemblies and memory modules including the same |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN107209338A (en) * | 2015-01-20 | 2017-09-26 | 微软技术许可有限责任公司 | The graphite linings heat pipe of mental package |
| CN206237724U (en) * | 2016-11-13 | 2017-06-09 | 沈开湘 | A kind of radiator structure for electronic component |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505789A (en) * | 2019-07-27 | 2019-11-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module |
| CN112492849A (en) * | 2020-11-27 | 2021-03-12 | 北京无线电测量研究所 | Light high heat conducting plate |
| CN113438864A (en) * | 2021-06-24 | 2021-09-24 | 中国电子科技集团公司第二十九研究所 | Graphite aluminum high-heat-conductivity module with low longitudinal thermal resistance |
| CN115384129A (en) * | 2022-04-19 | 2022-11-25 | 中国科学院山西煤炭化学研究所 | Aluminum alloy-graphite heat spreading plate and manufacturing method thereof |
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Application publication date: 20190329 |
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