CN109548349A - A kind of Gao Zhongying solid pulse power source integrates prototype devices - Google Patents
A kind of Gao Zhongying solid pulse power source integrates prototype devices Download PDFInfo
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- CN109548349A CN109548349A CN201811450266.0A CN201811450266A CN109548349A CN 109548349 A CN109548349 A CN 109548349A CN 201811450266 A CN201811450266 A CN 201811450266A CN 109548349 A CN109548349 A CN 109548349A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Generation Of Surge Voltage And Current (AREA)
Abstract
The invention discloses a kind of Gao Zhongying solid pulse power sources to integrate prototype devices, including insulation rack, insulation sealing plate, switch module and solid state pulse form module；Insulation sealing plate is installed by insulated screw on each face for the rack that insulate；The sealing plate that insulate includes preceding sealing plate, and switch module is fixedly mounted on preceding sealing plate, and switch module includes the installation of several separate high power solid-state switches and fluid course subregion and the high power solid-state switch being installed on substrate；Installation insulation sealing plate and solid-state switch substrate are connected by insulated screw with all insulation rack respectively.The installation of solid-state switch substrate Front-end Design high power solid-state switch and liquid stream concentrate heat dissipation region structure；Fluid course is installed, the upper and lower ends of high power solid-state switch are independently arranged fluid pipe on switch module；Module installation sliding slot is provided in insulation rack.Solid state pulse of the present invention forms module and uses stacked-type mounting structure, and field distribution is uniform；Electronics fluorination liquid improves the radiating efficiency of device as working media.
Description
Technical field
The present invention relates to high repetition frequency solid state pulse technical fields, and in particular to Gao Zhongying solid pulse power source is integrated
The design of prototype devices.
Background technique
Height repeats frequency solid pulse power technology and is widely used in the various fields such as scientific research, research in new high-tech.In recent years, arteries and veins
Power technology is rushed to quickly grow, it is increasingly mature, become one of the key technology in China's physical study.But it is most of now
It is energy storage or dielectric that high-power pulse source, which still relies on the materials such as deionized water, transformer oil, though part system has one
Fixed repetitive operation ability, but get rid of the defects of bulky, maintainable poor with being the failure to essence, seriously restrict arteries and veins
Rush the development of power technology and its relevant technologies.
Scientific research, research in new high-tech etc. propose including high repetition frequency, miniaturization, longevity solid pulse power supply
Life, good environmental suitability and mobility etc. are practical to be required, and the technical level of existing pulse power supply will seriously restrict height
The development of the relevant technologies such as new technology and physical study.
The invention proposes a kind of completely new system design philosophies, and it is solid to realize high-power solid switch, high energy storage density
The integrated and modularization of the solid pulse powers Primary Component such as state pulse-forming line is successfully developed a kind of for compact solid state
Pulse power supply integrates the device of model machine.
Summary of the invention
It is an object of the invention to realize the solid state pulses such as high-power solid switch, high energy storage density state pulse forming line
The integrated and modularization of power critical device designs solid pulse power source and integrates prototype devices, realizes solid pulse power
The targets such as miniaturization, the Gao Zhongying in source.Expand the application range of solid pulse power technology.
The purpose of the present invention is achieved through the following technical solutions:
A kind of Gao Zhongying solid pulse power source integrates prototype devices, including insulation rack, insulation sealing plate, switch module and
Solid state pulse forms module；
Insulation sealing plate is installed by insulated screw on each face for the rack that insulate；
The sealing plate that insulate includes preceding sealing plate, and switch module is fixedly mounted on preceding sealing plate, and switch module includes that several are independent high
Power solid state switch installation and fluid course subregion and the high power solid-state switch being installed on substrate；
Switch module includes the installation of several separate high power solid-state switches and fluid course subregion and is mounted on substrate
On high power solid-state switch；Installation insulation sealing plate and solid-state switch substrate are connected by insulated screw with all insulation rack respectively
It connects.The installation of solid-state switch substrate Front-end Design high power solid-state switch and liquid stream concentrate heat dissipation region structure；
Fluid course is installed, the upper and lower ends of high power solid-state switch are independently arranged fluid pipe, each on switch module
High power solid-state switch is correspondingly arranged two fluid courses；
Module installation sliding slot is provided in insulation rack, solid state pulse forms module and is mounted on module installation sliding slot.
It is preferred that insulation rack includes left frame, middle beam and correct frame；
Left frame and correct frame pass through insulated screw respectively to be fixed with middle beam.
It is preferred that left frame and correct frame are rectangle, middle beam is four；Left frame, middle beam and
The insulation rack of correct frame composition is rectangular parallelepiped structure.
It is preferred that it includes that high power pulse forms line, charging inductance and support inductance that solid state pulse, which forms module,.
High power pulse forms line, charging inductance and support inductance three parts and uses integrated design theory, forms compact solid state arteries and veins
Punching forms module.
It is preferred that 20 modules of equidistantly distributed install sliding slot on middle beam.20 compact solid state pulses
Module is formed to be separately mounted in 20 module installation sliding slots using stacked-type structure.
It is preferred that the high power solid-state switch installation of solid-state switch substrate Front-end Design and liquid stream concentrate radiating area
Domain, is arranged drawing and pulling type detent partition on switch module, drawing and pulling type detent partition isolate 20 having a size of 60mm × 27mm ×
The separate high power solid-state switch of 13mm is installed and fluid course subregion.20 grades of high power solid-state switches are using heat dissipation side in parallel
Formula.
It is preferred that seal groove is arranged in insulation rack, seal groove is for installing sealing strip.The six of all insulation rack
Rack sealing structure is designed on a face.
It is preferred that the medium inside fluid course is electronics fluorination liquid.It is situated between using electronics fluorination liquid as work
Matter cools down heating device, improves the radiating efficiency of device.
It is preferred that the solid state pulse installed in high power solid-state switch and insulation rack forms module and passes through respectively
Copper bar connection constitutes effectively electrical connection.
It is preferred that 20 grades of high power solid-state switches and 20 grades of solid state pulses formation modules, each high power is arranged
Solid-state switch is correspondingly arranged a solid state pulse and forms module, and high power solid-state switch and solid state pulse form module and pass through copper bar
Connection.It is connected by copper bar, constitutes effectively electrical connection.
The beneficial effects of the present invention are:
1) whole design that solid pulse power source integrates prototype devices follows the design concept of integration and high integration.
Wherein, compact solid state pulse shaping module uses stacked-type mounting structure, increases high pressure creepage distance, and field distribution is more equal
It is even.Prototype devices improve the radiating efficiency of device using electronics fluorination liquid as working media.Develop small volume, quality
Lighter solid pulse power source integrates prototype devices.
2) modularized design principle is followed, structure relatively independent between each module is realized, is conducive to solid pulse power
The maintenance of integrated each component of model machine, significantly improves the use and disassembly efficiency of model machine.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the structural schematic diagram of present invention insulation rack；
Fig. 3 is the structural schematic diagram that solid state pulse forms module；
In figure, sealing plate before 1-, 2- switch module, 3- high power solid-state switch, 4- fluid course, 5- drawing and pulling type detent every
Plate, 6- copper bar, 7- solid state pulse form module, and 7.1- high power pulse forms line, 7.2- charging inductance, and 7.3- supports inductance,
8- insulation rack, 8.1- module install sliding slot, 8.2- seal groove.
Specific embodiment
Technical solution of the present invention is described in further detail with reference to the accompanying drawing, but protection scope of the present invention is not limited to
It is as described below.
As shown in Figure 1, a kind of Gao Zhongying solid pulse power source integrates prototype devices, including insulation rack 8, insulator seal
Plate, switch module 2 and solid state pulse form module 7；
Insulation sealing plate is installed by insulated screw on each face for the rack 8 that insulate；
Insulation sealing plate includes preceding sealing plate 1, and switch module 2 is fixedly mounted on preceding sealing plate 1, and switch module 3 includes that several are (excellent
Select 20) installation of separate high power solid-state switch and fluid course subregion and the high power solid-state switch 3 being installed on substrate；
Installation insulation sealing plate and solid-state switch substrate are connected by insulated screw with all insulation rack 8 respectively.Solid-state switch substrate front end
It designs the installation of high power solid-state switch 3 and liquid stream concentrates heat dissipation region structure；
Fluid course 4 is installed, the upper and lower ends of high power solid-state switch 3 are independently arranged fluid pipe, often on switch module 2
A high power solid-state switch 3 is correspondingly arranged two fluid courses 4；The effectively flow stream velocity of control dielectric and time.
Module installation sliding slot 8.1 is provided in insulation rack 8, solid state pulse forms module 7 and is mounted on module installation sliding slot
On 8.1.
In a preferred embodiment, insulation rack 8 includes left frame, middle beam and correct frame；
Left frame and correct frame pass through insulated screw respectively to be fixed with middle beam.
In a preferred embodiment, left frame and correct frame are rectangle, and middle beam is four；Left frame, middle part
The insulation rack 8 of crossbeam and correct frame composition is rectangular parallelepiped structure.As shown in Figure 2.
In a preferred embodiment, it includes that high power pulse forms line 7.1, charging inductance that solid state pulse, which forms module 7,
7.2 and support inductance 7.3.High power pulse forms line 7.1, charging inductance 7.2 and support 7.3 three parts of inductance using integration
Design concept forms compact solid state pulse shaping module 7.The integrated module being mounted in 20 module installation sliding slots 8.1
Structure mainly forms line 7.1, charging inductance 7.2, support 7.3 three parts of inductance by high power pulse and forms, and is designed using system
Theory is analyzed in conjunction with magnetic distribution and Coupled Numerical Simulation, will be fitted close, be placed in the same space between three parts,
160mm × 172mm × 27.5mm compact solid state pulse shaping module 7 is formed, as shown in Figure 3.20 compact solid state arteries and veins
Punching is formed module 7 and is separately mounted in 20 module installation sliding slots 8.1 using stacked-type structure, increases high pressure creepage distance, no
It is also easy to produce electric field distortion.
In a preferred embodiment, 20 modules of equidistantly distributed install sliding slot 8.1 on middle beam.20 compacts
Solid state pulse is formed module 7 and is separately mounted in 20 module installation sliding slots 8.1 using stacked-type structure.20 grades of compact solid states
7 heating power of pulse shaping module is low, using cooling circuit series connection radiating mode.
In a preferred embodiment, solid-state switch substrate front end or front design high power solid-state switch 3 installation and
Liquid stream concentrates radiator structure, carries out simulation calculating to the distribution in temperature field in system using thermal field analysis, designs cooling side accordingly
Formula and cooling medium channel layout, determine that the structure is split to form by drawing and pulling type detent partition 5:
On switch module 2 be arranged drawing and pulling type detent partition 5, drawing and pulling type detent partition 5 isolate 20 having a size of 60mm ×
The separate high power solid-state switch 3 of 27mm × 13mm is installed and 4 subregion of fluid course.20 grades of high power solid-state switches 3 use
Radiating mode in parallel.
In a preferred embodiment, seal groove 8.2 is set in the rack 8 that insulate, and seal groove 8.2 is for installing sealing strip.
Rack sealing structure is designed on six faces of all insulation rack 8.
In a preferred embodiment, the medium of 4 the inside of fluid course is electronics fluorination liquid.Using electronics fluorination liquid as
Working media cools down heating device, improves the radiating efficiency of device.
In a preferred embodiment, high power solid-state switch 3 and the interior solid state pulse installed of insulation rack 8 form module
7 are connected by copper bar 6 respectively, constitute effectively electrical connection.
In a preferred embodiment, 20 grades of high power solid-state switch 3 and 20 grade solid state pulses are set and form module 7, often
A high power solid-state switch 3 is correspondingly arranged a solid state pulse and forms module 7, adjacent or corresponding high power solid-state switch 3
Module 7 is formed with solid state pulse to connect by copper bar 6 or copper foil.It is connected by copper bar 6, constitutes effectively electrical connection.Space away from
From compact, electrical connection effectively reduces loop stray inductance apart from short.
In a preferred embodiment, in conjunction with above-mentioned compact solid state pulse shaping module 7 (as shown in Figure 3) and high power
The installation of solid-state switch 3 and liquid stream concentrate heat dissipation subregion (heat dissipation channel) two critical design dimensions, by multiple numerical simulation
And analysis, it is only 670mm × 220mm × 190mm solid pulse power source model machine that final design, which forms overall dimensions length, width and height,
Device.
In a preferred embodiment, according to device heating power height situation, subregion radiating mode is designed it respectively,
That is: 20 grades of compact solid state pulse shaping 7 heating powers of module are low, using cooling circuit series connection radiating mode: in insulation rack
The lateral heat dissipation channel of interior setting, heat dissipation channel are used to radiate for compact solid state pulse shaping module 7, it is preferable that heat dissipation is logical
Road is horizontally through compact solid state pulse shaping module 7, when electronics fluorination liquid circulates in the heat dissipation channel, realizes to compact
The heat dissipation of solid state pulse formation module 7.20 grades of 3 heating powers of high power solid-state switch are higher, using radiating mode in parallel.Subregion
Radiating mode successfully solves solid pulse power and integrates one of key components --- the heat dissipation problem of switch in model machine.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, it is noted that all
Made any modifications, equivalent replacements, and improvements etc. within the spirit and principles in the present invention should be included in guarantor of the invention
Within the scope of shield.
Claims (10)
1. a kind of Gao Zhongying solid pulse power source integrates prototype devices, it is characterised in that: including insulation rack, insulation sealing plate,
Switch module and solid state pulse form module；
Insulation sealing plate is installed by insulated screw on each face for the rack that insulate；
The sealing plate that insulate includes preceding sealing plate, switch module is fixedly mounted on preceding sealing plate, switch module includes several separate high powers
Solid-state switch installation and fluid course subregion and the high power solid-state switch being installed on substrate；
Fluid course is installed, the upper and lower ends of high power solid-state switch are independently arranged fluid pipe on switch module；
Module installation sliding slot is provided in insulation rack, solid state pulse forms module and is mounted on module installation sliding slot.
2. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: insulation
Rack includes left frame, middle beam and correct frame；
Left frame and correct frame pass through insulated screw respectively to be fixed with middle beam.
3. a kind of Gao Zhongying solid pulse power source according to claim 2 integrates prototype devices, it is characterised in that: left frame
Frame and correct frame are rectangle, and middle beam is four；The insulation rack of left frame, middle beam and correct frame composition is rectangular
Body structure.
4. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: solid-state
Pulse shaping module includes that high power pulse forms line, charging inductance and support inductance.
5. a kind of Gao Zhongying solid pulse power source according to claim 2 integrates prototype devices, it is characterised in that: middle part
20 modules of equidistantly distributed install sliding slot on crossbeam.
6. a kind of Gao Zhongying solid pulse power source integrates prototype devices according to claim 1 or 5, it is characterised in that:
Drawing and pulling type detent partition is set on switch module, and drawing and pulling type detent partition isolates 20 having a size of 60mm × 27mm × 13mm
The installation of separate high power solid-state switch and fluid course subregion.
7. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: insulation
Seal groove is set in rack, and seal groove is for installing sealing strip.
8. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: liquid stream
Medium inside channel is electronics fluorination liquid.
9. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: Gao Gong
The solid state pulse formation module installed in rate solid-state switch and insulation rack passes through copper bar respectively and connect.
10. a kind of Gao Zhongying solid pulse power source according to claim 1 integrates prototype devices, it is characterised in that: set
It sets 20 high power solid-state switches and 20 solid state pulses forms module, each high power solid-state switch is correspondingly arranged a solid-state
Pulse shaping module, high power solid-state switch form module with solid state pulse and are connect by copper bar.
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| CN201811450266.0A CN109548349B (en) | 2018-11-30 | 2018-11-30 | High repetition frequency solid-state pulse power source integrated prototype device |
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| CN201811450266.0A CN109548349B (en) | 2018-11-30 | 2018-11-30 | High repetition frequency solid-state pulse power source integrated prototype device |
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| CN109548349B CN109548349B (en) | 2023-09-19 |
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