CN210807784U

CN210807784U - Circuit board assembly stable in operation

Info

Publication number: CN210807784U
Application number: CN201921690296.9U
Authority: CN
Inventors: 钟伟生
Original assignee: Jian Sheng Electronic Technology Huizhou Co ltd
Current assignee: Jian Sheng Electronic Technology Huizhou Co ltd
Priority date: 2019-10-11
Filing date: 2019-10-11
Publication date: 2020-06-19
Anticipated expiration: 2029-10-11

Abstract

The utility model relates to a circuit board assembly that operation is stable, including the PCB plate body, the side of PCB plate body is connected with radiator fan, and radiator fan's wind path is parallel with the PCB plate body, and the side of PCB plate body still is connected with fin subassembly, and fin subassembly encircles the PCB plate body, is provided with cooling module between PCB plate body and the radiator fan, and cooling module includes the casing, and the inside and the outside of casing are isolated each other, and it has the coolant liquid to fill in the casing, and a plurality of gas pockets have been seted up to the casing, and the gas pocket is parallel with radiator fan's wind. Compared with the prior circuit board, the utility model discloses a cooling module cools off radiator fan's air current, strengthens the cooling effect of wind-force, avoids simultaneously because of the poor condition of wind-force cooling effect when high temperature weather, and fin subassembly can absorb the heat of inboard PCB plate body and give off the heat in the outside, prevents the heat backward flow for PCB plate body and electron device keep at reasonable operating temperature, effectively improve circuit board subassembly's operation stability.

Description

Circuit board assembly stable in operation

Technical Field

The utility model relates to a circuit board technical field especially relates to a circuit board assembly that operation is stable.

Background

The circuit board enables the circuit to be miniaturized and visualized, is an indispensable component in the current electronic product, and plays an important role in the batch production of the fixed circuit and the optimization of the layout of the electric appliance. Along with the continuous development of electronic technology, the quantity of integrated electronic devices on the circuit board is more and more, the integration level of the circuit board is higher and more, and the power is also larger and more, so that the board surface temperature of the circuit board is also continuously improved, the operation condition of the electronic devices is influenced by the temperature rise of the circuit board, and the circuit board and the electronic devices are even damaged when the circuit board works in a high-temperature state for a long time.

Therefore, the requirement for the heat dissipation effect of the circuit board is also increasing, and how to provide a circuit board with excellent heat dissipation performance so that the circuit board can stably operate in a high-power state is a problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model adopts the following technical scheme: the utility model provides a circuit board assembly that operation is stable, including the PCB plate body, the side of PCB plate body is connected with radiator fan, radiator fan's wind path is parallel with the PCB plate body, the side of PCB plate body still is connected with the fin subassembly, the fin subassembly encircles the PCB plate body, be provided with cooling module between PCB plate body and the radiator fan, cooling module includes the casing, the inside and the outside of casing are isolated each other, it has the coolant liquid to fill in the casing, a plurality of gas pockets have been seted up to the casing, the gas pocket is parallel with radiator fan's wind path.

The technical scheme can be further perfected as follows.

It is further explained that a dust screen is disposed on one side of the heat dissipation fan.

The heat sink assembly further comprises a first sheet body and a plurality of second sheet bodies, wherein the first sheet body is vertically connected with the PCB body, and the first sheet body is vertically connected with the plurality of second sheet bodies.

It is further explained that the second sheet body and the PCB body are respectively arranged at two sides of the first sheet body.

It is further explained that the shell of the cooling component is communicated with a liquid inlet pipe and a liquid outlet pipe, and the liquid inlet pipe is provided with a liquid pump.

It is further described that the housing of the cooling assembly, the heat dissipation fan, and the first plate of the heat dissipation plate assembly have the same height.

The utility model has the advantages that: compared with the prior circuit board, the utility model discloses a cooling module cools off radiator fan's air current, strengthens the cooling effect of wind-force, avoids simultaneously because of the poor condition of wind-force cooling effect when high temperature weather, and fin subassembly can absorb the heat of inboard PCB plate body and give off the heat in the outside, prevents the heat backward flow for PCB plate body and electron device keep at reasonable operating temperature, effectively improve circuit board subassembly's operation stability.

Drawings

The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.

Fig. 1 is a schematic front view of a circuit board assembly that operates stably according to an embodiment of the present invention.

Fig. 2 is a schematic bottom view of a circuit board assembly with stable operation according to an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view a-a of a circuit board assembly according to an embodiment of the present invention.

In the figure: 1-PCB plate, 2-cooling fan, 3-cooling fin assembly, 31-first sheet, 32-second sheet, 4-cooling assembly, 41-shell, 42-air hole, 43-liquid inlet pipe, 44-liquid outlet pipe and 5-dust screen

Detailed Description

To further understand the contents, features and functions of the present invention, the following embodiments are described.

As shown in fig. 1-3, an embodiment of the utility model provides a circuit board assembly that operates stably, including PCB plate 1, PCB plate 1's side is connected with radiator fan 2, radiator fan 2's wind path is parallel with PCB plate 1, PCB plate 1's side still is connected with radiator assembly 3, radiator assembly 3 encircles PCB plate 1, be provided with cooling module 4 between PCB plate 1 and the radiator fan 2, cooling module 4 includes casing 41, casing 41's inside and outside are isolated each other, the casing 41 is filled with the coolant liquid, casing 41 has seted up a plurality of gas pockets 42, gas pocket 42 is parallel with radiator fan 2's wind path.

Wherein, one side of the cooling fan 2 is provided with a dust screen 5. The heat sink assembly 3 comprises a first sheet 31 and a plurality of second sheets 32, the first sheet 31 is vertically connected with the PCB board 1, and the first sheet 31 is vertically connected with the plurality of second sheets 32. The second sheet 32 and the PCB board 1 are disposed on two sides of the first sheet 31 respectively. The housing 41 of the cooling assembly 4 is communicated with a liquid inlet pipe 43 and a liquid outlet pipe 44, and the liquid inlet pipe 43 is provided with a liquid pump. The housing 41 of the cooling unit 4, the heat dissipation fan 2, and the first plate 31 of the heat sink unit 3 have the same height.

Specifically, please refer to fig. 1-3, a cooling assembly 4 is disposed between the heat dissipation fan 2 and the PCB board 1, a housing 41 of the cooling assembly 4 is filled with a cooling liquid, the housing 41 is provided with a plurality of air holes 42, the air blown by the heat dissipation fan 2 passes through the air holes 42 of the housing 41, the air passing through the housing 41 is cooled by the cooling liquid, so as to improve the cooling effect on the PCB board, the outer side of the PCB board 1 surrounds the heat dissipation fin assembly 3, the air of the heat dissipation fan 2 transversely blows the electronic device of the PCB board, the heat is guided to flow to the first sheet 31 of the heat dissipation fin assembly 3, the first sheet 31 conducts the heat to the plurality of second sheets 32, and the extensive surface area of the plurality of second sheets 32 can quickly dissipate the heat.

One side of an air inlet of the heat radiation fan 2 is provided with a dustproof net 5, and the dustproof net 5 can effectively block dust and prevent the dust from blowing into the PCB. The first sheet 31 of the heat sink assembly 3 is vertically connected to the side of the PCB board 1, which helps to isolate the heat from flowing back upon the heat absorption of the first sheet 31. Second lamellar body 32 and PCB plate body 1 set up respectively in the both sides of first lamellar body 31, and the heat produces from the PCB plate body 1 of first lamellar body 31 one side, conducts to first lamellar body 31 back, dispels the heat through the second lamellar body 32 of first lamellar body 31 opposite side, and the heat unidirectional conduction, the heat dissipation is faster. Casing 41 intercommunication of cooling module 4 has feed liquor pipe 43 and drain pipe 44, and feed liquor pipe 43 is provided with the liquid pump for the cooling liquid in casing 41 can be circulated and is changed, keeps the cooling effect of cooling liquid in the cooling module 4.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A circuit board assembly capable of operating stably is characterized in that: including PCB plate body (1), the side of PCB plate body (1) is connected with radiator fan (2), the wind path of radiator fan (2) is parallel with PCB plate body (1), the side of PCB plate body (1) still is connected with radiator fin subassembly (3), radiator fin subassembly (3) encircle PCB plate body (1), be provided with cooling module (4) between PCB plate body (1) and radiator fan (2), cooling module (4) are including casing (41), the inside and the outside of casing (41) are isolated each other, it has the coolant liquid to fill in casing (41), a plurality of gas pockets (42) have been seted up to casing (41), gas pocket (42) are parallel with the wind path of radiator fan (2).

2. The circuit board assembly of claim 1, wherein: one side of the heat radiation fan (2) is provided with a dust screen (5).

3. The circuit board assembly of claim 1, wherein: the heat sink assembly (3) comprises a first sheet body (31) and a plurality of second sheet bodies (32), the first sheet body (31) is vertically connected with the PCB body (1), and the first sheet body (31) is vertically connected with the plurality of second sheet bodies (32).

4. A circuit board assembly according to claim 3, wherein: the second sheet body (32) and the PCB body (1) are respectively arranged on two sides of the first sheet body (31).

5. The circuit board assembly of claim 1, wherein: the shell (41) of the cooling assembly (4) is communicated with a liquid inlet pipe (43) and a liquid outlet pipe (44), and the liquid inlet pipe (43) is provided with a liquid pump.

6. A circuit board assembly according to claim 3, wherein: the shell (41) of the cooling component (4), the heat dissipation fan (2) and the first sheet body (31) of the heat dissipation fin component (3) are equal in height.