CN109524368B - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
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- CN109524368B CN109524368B CN201810847646.1A CN201810847646A CN109524368B CN 109524368 B CN109524368 B CN 109524368B CN 201810847646 A CN201810847646 A CN 201810847646A CN 109524368 B CN109524368 B CN 109524368B
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017179056A JP2019054216A (ja) | 2017-09-19 | 2017-09-19 | 半導体装置 |
JP2017-179056 | 2017-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109524368A CN109524368A (zh) | 2019-03-26 |
CN109524368B true CN109524368B (zh) | 2022-11-15 |
Family
ID=65720661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810847646.1A Active CN109524368B (zh) | 2017-09-19 | 2018-07-27 | 半导体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10593617B2 (zh) |
JP (1) | JP2019054216A (zh) |
CN (1) | CN109524368B (zh) |
TW (1) | TWI722300B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220116337A (ko) | 2013-08-09 | 2022-08-22 | 애플 인크. | 전자 디바이스용 촉각 스위치 |
WO2015122885A1 (en) | 2014-02-12 | 2015-08-20 | Bodhi Technology Ventures Llc | Rejection of false turns of rotary inputs for electronic devices |
KR20230097197A (ko) | 2014-09-02 | 2023-06-30 | 애플 인크. | 웨어러블 전자 디바이스 |
KR102163612B1 (ko) | 2015-03-08 | 2020-10-08 | 애플 인크. | 회전 및 병진 가능한 입력 메커니즘을 갖는 시계 |
US11360440B2 (en) | 2018-06-25 | 2022-06-14 | Apple Inc. | Crown for an electronic watch |
US11561515B2 (en) | 2018-08-02 | 2023-01-24 | Apple Inc. | Crown for an electronic watch |
US20200064779A1 (en) * | 2018-08-24 | 2020-02-27 | Apple Inc. | Watch crown having a conductive surface |
CN209625187U (zh) | 2018-08-30 | 2019-11-12 | 苹果公司 | 电子手表和电子设备 |
US11194299B1 (en) | 2019-02-12 | 2021-12-07 | Apple Inc. | Variable frictional feedback device for a digital crown of an electronic watch |
US11550268B2 (en) | 2020-06-02 | 2023-01-10 | Apple Inc. | Switch module for electronic crown assembly |
Citations (3)
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JP2006165109A (ja) * | 2004-12-03 | 2006-06-22 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JPWO2008032365A1 (ja) * | 2006-09-12 | 2010-01-21 | 富士通株式会社 | 電子機器及びその製造方法 |
JP2012256842A (ja) * | 2011-05-13 | 2012-12-27 | Sharp Corp | 半導体モジュールの製造方法及び半導体モジュール |
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JPS60163751U (ja) * | 1984-04-04 | 1985-10-30 | スタンレー電気株式会社 | 半導体装置 |
JPH07111299A (ja) * | 1993-10-14 | 1995-04-25 | Fuji Xerox Co Ltd | 混成集積回路 |
GB2288286A (en) * | 1994-03-30 | 1995-10-11 | Plessey Semiconductors Ltd | Ball grid array arrangement |
US5741729A (en) * | 1994-07-11 | 1998-04-21 | Sun Microsystems, Inc. | Ball grid array package for an integrated circuit |
EP0732107A3 (en) * | 1995-03-16 | 1997-05-07 | Toshiba Kk | Screen device for circuit substrate |
TW410446B (en) * | 1999-01-21 | 2000-11-01 | Siliconware Precision Industries Co Ltd | BGA semiconductor package |
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US10593617B2 (en) | 2020-03-17 |
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