CN109517112A - A kind of conductive photosensitive resin composition for photocuring rapid prototyping - Google Patents
A kind of conductive photosensitive resin composition for photocuring rapid prototyping Download PDFInfo
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- CN109517112A CN109517112A CN201811391190.9A CN201811391190A CN109517112A CN 109517112 A CN109517112 A CN 109517112A CN 201811391190 A CN201811391190 A CN 201811391190A CN 109517112 A CN109517112 A CN 109517112A
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- photosensitive resin
- ether
- resin composition
- rapid prototyping
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention discloses a kind of conductive photosensitive resin compositions for photocuring rapid prototyping, it is grouped as by following mass percent group: epoxy resin 10-30%, acrylate oligomer 5-20%, acrylic ester monomer 5-20%, conductive filler 30-78%, free radical photo-initiation 1-8%, cation light initiator 1-8%.Product has high rigidity, high intensity, certain toughness after photosensitive resin composition solidification of the present invention, while having certain electric conductivity, has filled up in the market for the vacancy of such product electric conductivity demand.Volume contraction is small after present composition solidification, and water absorption rate is low, and the dimensional stability of product is high.
Description
[technical field]
The present invention relates to a kind of photosensitive resin composition more particularly to a kind of conduction for photocuring rapid prototyping are photosensitive
Resin combination.
[background technique]
Photocuring rapid prototyping photosensitive resin has developed the several years at home, emerges large quantities of development & production enterprises, high-strength
The photosensitive resins such as degree photosensitive resin, high tenacity photosensitive resin, epoxy phenolic resin, transparent photosensitive resin are come out one after another, in light
Quick resin market is in occupation of leading position.However above-mentioned photosensitive resin, mainly based on performance, it is some special to be seldom related to
Requirement of functionalization, such as electric conductivity etc..There is electric conductivity deficiency more in prior art photosensitive resin, poor toughness, reaction are slow, viscous
Spend the disadvantages of high.
[summary of the invention]
The purpose of the invention is to overcome the deficiencies of the prior art and provide a kind of conduction for photocuring rapid prototyping
Photosensitive resin composition, product have high rigidity, high intensity, high tenacity and conductive, product dimensional stability height.
The present invention to achieve the above object, using following technical scheme:
A kind of conductive photosensitive resin composition for photocuring rapid prototyping, it is characterised in that by following mass percent
Group is grouped as:
Preferably poly- [(2- Oxyranyle) -1,2- the cyclohexanediol] -2- ethyl -2- hydroxyl first of epoxy resin in the present invention
Base -1,3-PD ether, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, bisphenol A type epoxy resin, three hydroxyls
Methylpropane triglycidyl ether, four glycidol ether of pentaerythrite, polypropylene glycol diglycidyl ether, the contracting of 1,6- hexylene glycol two
Water glycerin ether, Propoxylated polyalcohol triglycidyl ether, one or more of castor oil glycidol ether.
It is highly preferred that epoxy resin is that can provide poly- [(2- Oxyranyle) -1, the 2- cyclohexanediol]-of high reaction speed
2- ethyl -2- methylol -1,3-PD ether, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, bisphenol A-type
Epoxy resin, trihydroxymethylpropanyltri diglycidyl ether, one or more of four glycidol ether of pentaerythrite and raising are led
The polypropylene glycol diglycidyl ether of the quick resin toughness of electric light, 1,6- hexanediol diglycidyl ether, Propoxylated polyalcohol three
Glycidol ether, the mixture of one or more of castor oil glycidol ether.
Acrylate oligomer in the present invention is o-cresol Epoxy Phenolic Acrylates, polyester acrylate and epoxy third
One or more of olefin(e) acid ester.
Acrylate monomer in the present invention is isobornyl acrylate, double pentaerythritol methacrylate, three (2- hydroxyl second
Base) isocyanuric acid triacrylate, pentaerythritol tetraacrylate, hydroxymethyl-propane triacrylate and ethoxyquin methylol third
One or more of alkane triacrylate.
Conductive filler in the present invention is nano-silver powder, silver-coated copper powder, conductive mica powder, conductive silicon oxide, carbon black, carbon
Fiber, graphite, one or more of graphene and carbon nanotube.
Free radical photo-initiation in the present invention is hydroxydimethylacetophenone, hydroxycyclohexyl phenyl ketone, benzil
Dimethyl ketal, one or more of 2,4,6- trimethylbenzoy-dipheny phosphine oxides and methyl benzoylformate.
Cation light initiator in the present invention is diphenyl-(4- phenyl sulphur) phenyl sulfonium hexafluoro antimonate, diphenyl-
One of (4- phenyl sulphur) phenyl sulfonium hexafluorophosphate and 4- isobutyl phenenyl -4 '-aminomethyl phenyl iodine hexafluorophosphate or
It is several.
The present invention in terms of existing technologies, has the beneficial effect that:
Product has high rigidity, high intensity, certain toughness after photosensitive resin composition solidification of the present invention, while having certain
Electric conductivity, filled up in the market for the vacancy of such product electric conductivity demand.
Volume contraction is small after present composition solidification, and water absorption rate is low, and the dimensional stability of product is high.
[specific embodiment]
The present invention is further described in detail With reference to embodiment:
The each component mass percent of embodiment 1-14 is as shown in table 1.
Table 1:
Wherein, epoxy resin 1: bisphenol A type epoxy resin,
Epoxy resin 2:3,4- epoxycyclohexyl-methyl 3,4- epoxycyclohexyl formic acid esters,
Epoxy resin 3: Propoxylated polyalcohol triglycidyl ether；
Acrylate monomer 1: isobornyl acrylate,
Acrylate monomer 2: ethoxyquin hydroxymethyl-propane triacrylate；
Free radical photo-initiation 1:2,4,6- trimethylbenzoy-dipheny phosphine oxides,
Free radical photo-initiation 2: hydroxycyclohexyl phenyl ketone；
Cation light initiator 1: diphenyl-(4- phenyl sulphur) phenyl sulfonium hexafluoro antimonate,
Cation light initiator 2: diphenyl-(4- phenyl sulphur) phenyl sulfonium hexafluorophosphate.
Each component is mixed before preparing product for the embodiment of the present invention.
Product mechanics electric property of the present invention is according to following standard testing.
Tensile strength: ASTM D638M
Elongation at break: ASTM D638M
Stretch modulus: ASTM D638M
Bending strength: ASTM D790M
Bending modulus: ASTM D790M
Overarm arm notched Izod impact hit intensity: ASTM D256A
Water absorption rate: ASTM D570-98
Hardness: ASTM D2240
Volume resistivity: ASTM D2739.
Test result is as shown in table 2.
Table 2:
From Table 2, it can be seen that as can be seen from the above table, all being showed after the photosensitive resin of embodiment 1~14 is cured
Preferable electric conductivity out, while water absorption rate is low after resin solidification, intensity is high, and hardness is high, is able to satisfy basic product demand.
Claims (8)
1. a kind of conductive photosensitive resin composition for photocuring rapid prototyping, it is characterised in that by following mass percent group
It is grouped as:
2. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the epoxy resin be poly- [(2- Oxyranyle) -1,2- cyclohexanediol] -2- ethyl -2- methylol -1,3- propylene glycol
Ether, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, bisphenol A type epoxy resin, trimethylolpropane tris shrink
Glycerin ether, four glycidol ether of pentaerythrite, polypropylene glycol diglycidyl ether, 1,6- hexanediol diglycidyl ether, the third oxygen
Base polyalcohol triglycidyl ether, one or more of castor oil glycidol ether.
3. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 2, feature exist
In the epoxy resin be poly- [(2- Oxyranyle) -1,2- cyclohexanediol] -2- ethyl -2- methylol -1,3- propylene glycol
Ether, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, bisphenol A type epoxy resin, trimethylolpropane tris shrink
Glycerin ether, one or more of four glycidol ether of pentaerythrite and polypropylene glycol diglycidyl ether, 1,6- hexylene glycol two
Glycidol ether, Propoxylated polyalcohol triglycidyl ether, the mixture of one or more of castor oil glycidol ether.
4. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the acrylate oligomer be o-cresol Epoxy Phenolic Acrylates, in polyester acrylate and epoxy acrylate
It is one or more of.
5. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the acrylate monomer be isobornyl acrylate, double pentaerythritol methacrylate, three (2- ethoxy) isocyanides urine
Sour triacrylate, pentaerythritol tetraacrylate, three propylene of hydroxymethyl-propane triacrylate and ethoxyquin hydroxymethyl-propane
One or more of acid esters.
6. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the conductive filler be nano-silver powder, silver-coated copper powder, conductive mica powder, conductive silicon oxide, carbon black, carbon fiber, graphite,
One or more of graphene and carbon nanotube.
7. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the free radical photo-initiation be hydroxydimethylacetophenone, hydroxycyclohexyl phenyl ketone, benzil dimethyl ketal,
One or more of 2,4,6- trimethylbenzoy-dipheny phosphine oxide and methyl benzoylformate.
8. a kind of conductive photosensitive resin composition for photocuring rapid prototyping according to claim 1, feature exist
In the cation light initiator be diphenyl-(4- phenyl sulphur) phenyl sulfonium hexafluoro antimonate, diphenyl-(4- phenyl sulphur) benzene
One or more of base sulfonium hexafluorophosphate and 4- isobutyl phenenyl -4 '-aminomethyl phenyl iodine hexafluorophosphate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811391190.9A CN109517112A (en) | 2018-11-21 | 2018-11-21 | A kind of conductive photosensitive resin composition for photocuring rapid prototyping |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811391190.9A CN109517112A (en) | 2018-11-21 | 2018-11-21 | A kind of conductive photosensitive resin composition for photocuring rapid prototyping |
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| CN109517112A true CN109517112A (en) | 2019-03-26 |
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| CN201811391190.9A Pending CN109517112A (en) | 2018-11-21 | 2018-11-21 | A kind of conductive photosensitive resin composition for photocuring rapid prototyping |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111363101A (en) * | 2020-03-30 | 2020-07-03 | 上海信斯帝克新材料有限公司 | Light-cured resin composition and method for 3D printing by using same |
| CN111702166A (en) * | 2020-06-23 | 2020-09-25 | 西安汇创贵金属新材料研究院有限公司 | Metal composite material and preparation method thereof |
| CN112480329A (en) * | 2020-12-09 | 2021-03-12 | 东莞理工学院 | Light-cured resin model material based on DLP (digital light processing) type 3D printing and preparation method thereof |
| CN112679677A (en) * | 2020-12-25 | 2021-04-20 | 中山大学 | Antistatic photosensitive resin for photocuring rapid forming and preparation method and application thereof |
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| CN104530898A (en) * | 2014-12-25 | 2015-04-22 | 湖州南浔双林振森实木加工厂 | Ultraviolet-curing paint and preparation method thereof |
| CN106647167A (en) * | 2016-09-30 | 2017-05-10 | 河南工程学院 | Matte photosensitive resin for photocuring quick molding and preparation method thereof |
| CN106749986A (en) * | 2016-12-12 | 2017-05-31 | 中山大简高分子材料有限公司 | A kind of epoxy phenolic resin composition for photocuring rapid prototyping |
| CN107033294A (en) * | 2017-04-21 | 2017-08-11 | 北京石油化工学院 | It is a kind of for conductive UV-cured resin composite of laser 3D printing and preparation method thereof |
| CN107722193A (en) * | 2017-10-18 | 2018-02-23 | 中山大简科技有限公司 | A kind of high rigidity photosensitive resin composition for photocuring rapid prototyping |
-
2018
- 2018-11-21 CN CN201811391190.9A patent/CN109517112A/en active Pending
Patent Citations (5)
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| CN104530898A (en) * | 2014-12-25 | 2015-04-22 | 湖州南浔双林振森实木加工厂 | Ultraviolet-curing paint and preparation method thereof |
| CN106647167A (en) * | 2016-09-30 | 2017-05-10 | 河南工程学院 | Matte photosensitive resin for photocuring quick molding and preparation method thereof |
| CN106749986A (en) * | 2016-12-12 | 2017-05-31 | 中山大简高分子材料有限公司 | A kind of epoxy phenolic resin composition for photocuring rapid prototyping |
| CN107033294A (en) * | 2017-04-21 | 2017-08-11 | 北京石油化工学院 | It is a kind of for conductive UV-cured resin composite of laser 3D printing and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111363101A (en) * | 2020-03-30 | 2020-07-03 | 上海信斯帝克新材料有限公司 | Light-cured resin composition and method for 3D printing by using same |
| CN111702166A (en) * | 2020-06-23 | 2020-09-25 | 西安汇创贵金属新材料研究院有限公司 | Metal composite material and preparation method thereof |
| CN112480329A (en) * | 2020-12-09 | 2021-03-12 | 东莞理工学院 | Light-cured resin model material based on DLP (digital light processing) type 3D printing and preparation method thereof |
| CN112679677A (en) * | 2020-12-25 | 2021-04-20 | 中山大学 | Antistatic photosensitive resin for photocuring rapid forming and preparation method and application thereof |
| CN112679677B (en) * | 2020-12-25 | 2021-09-10 | 中山大学 | Antistatic photosensitive resin for photocuring rapid forming and preparation method and application thereof |
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Application publication date: 20190326 |
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