CN109494194A - A kind of display panel and preparation method thereof - Google Patents
A kind of display panel and preparation method thereof Download PDFInfo
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- CN109494194A CN109494194A CN201811352700.1A CN201811352700A CN109494194A CN 109494194 A CN109494194 A CN 109494194A CN 201811352700 A CN201811352700 A CN 201811352700A CN 109494194 A CN109494194 A CN 109494194A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 139
- 125000006850 spacer group Chemical group 0.000 claims abstract description 130
- 238000005538 encapsulation Methods 0.000 claims abstract description 84
- 239000010409 thin film Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000005401 electroluminescence Methods 0.000 claims abstract description 45
- 239000011368 organic material Substances 0.000 claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 16
- 238000007740 vapor deposition Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 206
- 239000010408 film Substances 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to field of display technology, a kind of display panel and preparation method thereof is disclosed, which includes: that TFT device layer is formed on the substrate；Multiple spacer materials of folding region and non-collapsible district are distributed on TFT device layer；Organic electroluminescence device layer is formed on TFT device layer；Electroluminescent organic material layer of at least partly spacer material being distributed in multiple spacer materials of folding region on the surface of substrate is completely removed to form exposed surface；Thin-film encapsulation layer is formed on organic electroluminescence device layer and spacer material.The display panel of preparation method preparation, separate underbed in the middle part of multiple spacer materials of folding region directly to contact and connect with thin-film encapsulation layer towards the surface of thin-film encapsulation layer, enhance the adhesion strength for separating underbed in the middle part of thin-film encapsulation layer and folding region, it effectively avoids causing thin-film encapsulation layer to be easy the case where starting, falling off since bent area is frequently bent, is conducive to improve display effect.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of display panel and preparation method thereof.
Background technique
Currently, OLED display device is widely popularized, especially OLED display device is with its frivolous feature,
It is gradually applied to Folding display, but in existing OLED display device, due to the organic electroluminescent film layer in OLED
Preparation method be different from Array sections in Sputter, CVD and Resin technique, electroluminescent organic material film preparation side
Formula generally be deposited or printing, so, between each film layer of electroluminescent organic material and electroluminescent organic material film layer with
The binding force for encapsulating film layer part is weaker, and the binding force of electroluminescent organic material film layer and encapsulation film layer part is poor, then aobvious in folding
In showing, as the increase of folding times easily be easy to cause organic electroluminescence film layer to fall off with encapsulation film layer part, it be easy to cause
It starts, be detached between encapsulation film layer and substrate, so that it is bad to generate display.
Summary of the invention
The present invention provides a kind of display panel and preparation method thereof, in the display panel, it is distributed in the multiple of folding region
Separate underbed in the middle part of spacer material directly to contact and connect with thin-film encapsulation layer towards the surface of thin-film encapsulation layer, enhances film envelope
The adhesion strength for separating underbed in the middle part of layer and folding region is filled, to enhance the attachment of the thin-film encapsulation layer of folding region on substrate
Power is conducive to improve it is possible to prevente effectively from causing thin-film encapsulation layer to be easy the case where starting, falling off since bent area is frequently bent
Display effect.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of preparation method of display panel, the display panel include at least one folding region and at least two non-collapsible
Area, the preparation method include:
TFT device layer is formed on the substrate；
Multiple spacer materials of the folding region and non-collapsible district are distributed on the TFT device layer；
Organic electroluminescence device layer is formed on the TFT device layer；
At least partly spacer material in multiple spacer materials of the folding region will be distributed on the surface of the substrate
Electroluminescent organic material layer completely remove to form exposed surface；
Thin-film encapsulation layer is formed on the organic electroluminescence device layer and the spacer material, wherein is distributed in institute
The spacer material in multiple spacer materials of folding region with exposed surface is stated directly to contact and connect with the thin-film encapsulation layer.
In above-mentioned preparation method, prepared display panel is foldable display panel, wherein is provided on display panel
At least one folding region and at least two non-collapsible districts, folding region can be bent, and make the bending that display panel is in different angles
State；In the preparation process of above-mentioned display panel, TFT device layer is formed on the substrate, then forms distribution on TFF device layer
Multiple spacer materials in folding region and non-collapsible district are interval between each spacer material, and the material of spacer material is inorganic matter,
Then organic elctroluminescent device layer is formed on TFT device layer, wherein in the mistake for preparing organic electroluminescence device layer
Cheng Zhong, organic material and metal material can inevitably fall in the surface of spacer material, i.e., the surface of spacer material can adhere to organic material and
Metal material forms electroluminescent organic material layer, organic electro luminescent layer and spacer material on spacer material surface and film seals
The cohesive force for filling layer is poor, easily causes the problem of thinner package film layer is started, fallen off, so, organic electroluminescence device layer
After formation, Organic Electricity of at least partly spacer material in multiple spacer materials of folding region on the surface of substrate will be distributed in
Electroluminescent material layer is completely removed to form exposed surface, in this way, the spacer material of surface removal electroluminescent organic material layer can
Directly to connect with thin-film encapsulation layer, the surface that thin-film encapsulation layer is contacted with spacer material is inorganic material, so film
Caking property is preferable when encapsulated layer is directly connected with spacer material, is formed on organic electroluminescence device layer and spacer material thin
After film encapsulated layer, at least partly spacer material with exposed surface of thin-film encapsulation layer and folding region is directly connected, by
Binding force is stronger between spacer material and thin-film encapsulation layer, enhances the adherency for separating underbed in the middle part of thin-film encapsulation layer and folding region
Power, thus enhancing in folding region the adhesive force of thin-film encapsulation layer on substrate, and then can to avoid due to folding region it is frequently curved
Folding causes thin-film encapsulation layer to be easy the case where starting, falling off, and is conducive to improve display effect.
Therefore, the display panel of above-mentioned preparation method preparation, is distributed in the middle part of multiple spacer materials of folding region and separates underbed
It directly contacts and connects with thin-film encapsulation layer towards the surface of thin-film encapsulation layer, enhance part in thin-film encapsulation layer and folding region
The adhesion strength of spacer material, so that the adhesive force of the thin-film encapsulation layer of folding region on substrate is enhanced, it is possible to prevente effectively from due to
Bent area, which is frequently bent, causes thin-film encapsulation layer to be easy the case where starting, falling off, and is conducive to improve display effect.
Preferably, organic electroluminescence device layer is formed on the TFT device layer using the method for vapor deposition or printing.
Preferably, during forming organic electroluminescence device layer on the TFT device layer mask plate that uses for
Open mask。
Preferably, using laser sintering processes at least partly dottle pin in the multiple spacer materials for being distributed in the folding region
Electroluminescent organic material layer of the object on the surface of the substrate is completely removed.
Preferably, the thin-film encapsulation layer includes being sequentially arranged on the organic electroluminescence device layer and the spacer material
First inorganic barrier layer, organic planarization layer and the second inorganic barrier layer；
Wherein, the thin-film encapsulation layer that formed on the organic electroluminescence device layer and the spacer material is specifically wrapped
It includes:
Described first is formed on the organic electroluminescence device layer and the spacer material using vapor deposition method
Inorganic barrier layer；
Organic planarization layer is formed in first inorganic barrier layer；
Second inorganic barrier layer is formed in the organic planarization layer using vapor deposition method.
A kind of display panel, including at least one folding region and at least two non-collapsible districts, further includes:
Substrate；
TFT device layer on the substrate；
Organic electroluminescence device layer on the TFT device layer is distributed in the folding region and non-collapsible district
Multiple spacer materials；
Thin-film encapsulation layer on the organic electroluminescence device layer and the spacer material；
Wherein, be distributed in multiple spacer materials of the folding region at least partly spacer material away from the substrate surface with
The thin-film encapsulation layer is directly contacted and is connected.
Preferably, be distributed in each of described folding region spacer material away from the substrate surface with the film
Encapsulated layer is directly contacted and is connected.
Preferably, the spacer material distribution density of the folding region is greater than the spacer material distribution density of the non-collapsible district.
Preferably, at least partly table of the spacer material away from the substrate is distributed in multiple spacer materials of the non-collapsible district
Face directly contacts and connects with the thin-film encapsulation layer.
Preferably, the thin-film encapsulation layer includes being sequentially arranged on the organic electroluminescence device layer and the spacer material
First inorganic barrier layer, organic planarization layer and the second inorganic barrier layer.
Detailed description of the invention
Fig. 1 is the overall structure diagram of display panel provided in an embodiment of the present invention；
Fig. 2 to Fig. 5 is the local film layer structure in display panel preparation process provided in an embodiment of the present invention in folding region
Change schematic diagram；
Fig. 6 is localized membrane schematic diagram of a layer structure in the folding region of display panel provided in an embodiment of the present invention；
Fig. 7 is the flow diagram of preparation method provided in an embodiment of the present invention；
Icon: 1- display panel；11- substrate；12-TFT device layer；13- organic electroluminescence device layer；14- spacer material；
15- thin-film encapsulation layer；16- electroluminescent organic material layer；The folding region 17-；18- non-collapsible district；The first inorganic barrier layer of 151-；
152- organic planarization layer；The second inorganic barrier layer of 153-.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 7 and Fig. 2 are please referred to Fig. 6, the embodiment of the invention provides a kind of preparation methods of display panel, wherein
Display panel 1 includes that at least one folding region 17 and at least two non-collapsible districts 18, above-mentioned preparation method specifically include:
Step S101 forms TFT device layer 12 on substrate 11；
Step S102 distributes in multiple spacer materials 14 of folding region 17 and non-collapsible district 18 on TFT device layer 12；
Step S103 forms organic electroluminescence device layer 13 on TFT device layer 12；
Step S104 will be distributed in at least partly spacer material 14 in multiple spacer materials 14 of folding region 17 away from substrate 11
Surface on electroluminescent organic material layer 16 completely remove to form exposed surface；
Step S105 forms thin-film encapsulation layer 15 on organic electroluminescence device layer 13 and spacer material 14, wherein point
The spacer material 14 in multiple spacer materials 14 of folding region 17 with exposed surface is distributed in directly to contact and connect with thin-film encapsulation layer 15
It connects.
In the above preparation method, in conjunction with Fig. 1, as shown in Fig. 2, prepared display panel 1 is foldable display panel,
Wherein, at least one folding region 17 and at least two non-collapsible districts 18 are provided on display panel, folding region 17 can bend, make
Display panel bending state in different angles；In the preparation process of above-mentioned display panel 1, TFT device is formed on substrate 11
Part layer 12 has pixel region and non-pixel region in TFT device layer 12；As shown in figure 3, the then shape on TFT device layer 12
At multiple spacer materials 14, multiple spacer materials 14 are distributed in folding region 17 and non-collapsible district 18 respectively, and between each spacer material 14
It is spaced, wherein in the present embodiment for a folding region 17 and two non-collapsible districts 18 are set, folding region 17
Between two non-collapsible districts 18, multiple spacer materials 14 are each formed in folding region 17 and in two non-collapsible districts 18, and each
Spacer material 14 is corresponding with the non-pixel region of TFT device layer 12；As shown in figure 4, being then prepared with after spacer material 14 is formed
Electroluminescent display part layer, organic elctroluminescent device layer are corresponding with the pixel region of TFT device layer 12, wherein
Organic material and metal material can inevitably fall in the surface of spacer material 14 during prepared by organic electroluminescence device layer 13,
I.e. the surface of spacer material 14 can adhere to organic material and metal material, i.e., 14 surface of spacer material, which can adhere to, is used to prepare Organic Electricity
The organic material and metal material of electroluminescence device layer 13 and form electroluminescent organic material layer 16, due to spacer material 14 be nothing
The surface layer of machine material, thin-film encapsulation layer towards the spacer material 14 of subsequent preparation is also inorganic material, so spacer material 14 and film
Binding force between encapsulated layer can be relatively good, electroluminescent organic material layer 16 and spacer material 14 and thin-film encapsulation layer 15 it is viscous
Tie power it is poor, easily cause the problem of thin-film encapsulation layer 15 is started, fallen off, so, for increase folding region 17 spacer material 14 with
The binding force of the thin-film encapsulation layer 15 of subsequent preparation, as shown in figure 5, multiple spacer materials 14 of folding region 17 next will be distributed in
In at least partly spacer material 14 away from substrate 11 surface on electroluminescent organic material layer 16 completely removed with shape
At exposed surface, and keep exposed surface clean, as shown in fig. 6, then in organic electroluminescence device layer 13 and spacer material 14
Upper formation thin-film encapsulation layer 15, then the spacer material 14 in multiple spacer materials 14 of folding region 17 with exposed surface and film seal
Dress layer 15 is directly contacted and is connected, and the adhesion strength of the part spacer material 14 in thin-film encapsulation layer 15 and folding region 17 can be enhanced,
To enhance adhesive force of the thin-film encapsulation layer 15 of folding region 17 on substrate 11, effectively avoid frequently bending due to folding region 17
It causes thin-film encapsulation layer 15 to be easy the case where starting, falling off, is conducive to improve display effect.
Specifically, in the above preparation method, organic electroluminescence is formed on TFT device layer using the method for vapor deposition or printing
Light emitting device layer, and preferably, the mask plate used during forming organic electroluminescence device layer on TFT device layer for
Open mask (Open mask, be open biggish mask plate) can use evaporation coating technique vapor deposition organic material to be used to form
Organic electroluminescence device layer, and Open mask can be generally used when organic material is deposited.
Specifically, in above-mentioned preparation method, using laser sintering processes to the multiple spacer materials 14 for being distributed in folding region 17
In at least partly spacer material 14 away from substrate 11 surface on electroluminescent organic material layer 16 completely removed.Into
During row is laser sintered, the position precision between strict control laser energy and laser and spacer material 14, to ensure to need
It is dry towards the removal of electroluminescent organic material layer 16 on the surface of thin-film encapsulation layer 15 to carry out laser sintered spacer material 14
Only.
Specifically, above-mentioned thin-film encapsulation layer includes being sequentially arranged in first on organic electroluminescence device layer 13 and spacer material 14
Inorganic barrier layer 151, organic planarization layer 152 and the second inorganic barrier layer 153；
Wherein, the method tool of thin-film encapsulation layer 15 is formed on above-mentioned organic electroluminescence device layer 13 and spacer material 14
Body includes: to form the first inorganic barrier layer on organic electroluminescence device layer 13 and spacer material 14 using vapor deposition method
151；Organic planarization layer 152 is formed in the first inorganic barrier layer 151 using inkjet printing technology；Existed using vapor deposition method
The second inorganic barrier layer 153 is formed in organic planarization layer 152.It is formed on spacer material using gas phase deposition technology first inorganic
Barrier layer is conducive to the bonding between enhanced film encapsulated layer and spacer material with the spacer material good bonding strength of exposed surface
Power avoids thin-film encapsulation layer from starting, fall off, advantageously ensures that display effect.
Based on same invention thought, Fig. 1 and Fig. 6, a kind of display panel 1 that the embodiment of the present invention also provides, packet are please referred to
Include at least one folding region 17 and at least two non-collapsible districts 18, further includes: substrate 11；TFT device layer on substrate 11
12；Organic electroluminescence device layer 13 on TFT device layer 12, be distributed in folding region 17 and non-collapsible district 18 it is multiple every
Underbed 14；Thin-film encapsulation layer 15 on organic electroluminescence device layer 13 and spacer material 14；Wherein, it is distributed in folding region
At least partly spacer material 14 directly contacts and connects with thin-film encapsulation layer 15 away from the surface of substrate 11 in 17 multiple spacer materials 14
It connects.
In above-mentioned display panel, display panel is a foldable display panel, and wherein display panel 1 includes at least one folding
Folded area 17 and at least two non-collapsible districts 18 specifically can be set a folding region 17 and two non-in above-mentioned display panel
Folding region 18, and folding region 17 is between two non-collapsible districts 18, i.e. two non-collapsible districts 18 respectively in the two sides of folding region 17,
Folding region 17 can be bent, the bending state for keeping display panel 1 in different angles；Display panel 1 includes substrate 11, on substrate 11
Equipped with TFT device layer 12, organic electroluminescence device layer 13 and multiple spacer materials 14 are formed on device layer, wherein folding
Folded area 17 and two non-collapsible districts 18 are distributed with multiple spacer materials 14, cover on organic electroluminescence device layer 13 and spacer material 14
It is stamped the thin-film encapsulation layer 15 for obstructing steam, thin-film encapsulation layer 15 can protect organic electroluminescence device, be distributed in folding
A part of spacer material 14 in the spacer material 14 in folded area 17 is indirectly towards the surface of thin-film encapsulation layer 15 and thin-film encapsulation layer 15
Touch and connect, since the surface that spacer material 14 is contacted with thin-film encapsulation layer 15 is inorganic material, the film layer of same class material it
Between binding force it is stronger, then the adhesion strength for separating underbed 14 in the middle part of thin-film encapsulation layer 15 and folding region 17 is enhanced, so that enhancing exists
Adhesive force of the thin-film encapsulation layer 15 on substrate 11 in folding region 17, and then can be to avoid due to folding region 17, frequently bending is caused
Thin-film encapsulation layer 15 is easy the case where starting, falling off, and is conducive to improve display effect.
Therefore, it in above-mentioned display panel, is distributed in the middle part of multiple spacer materials 14 of folding region 17 and separates underbed 14 towards thin
The surface of film encapsulated layer 15 directly contacts and connects with thin-film encapsulation layer 15, enhances 17 middle part of thin-film encapsulation layer 15 and folding region
The adhesion strength for separating underbed 14, to enhance adhesive force of the thin-film encapsulation layer 15 of folding region 17 on substrate 11, Ke Yiyou
Effect avoids causing thin-film encapsulation layer 15 to be easy the case where starting, falling off since bent area is frequently bent, and is conducive to improve display effect
Fruit.
Wherein, in the above display panel, to further enhance in folding region 17 thin-film encapsulation layer 15 on substrate 11
Adhesive force can make each spacer material 14 for being distributed in folding region 17 direct with thin-film encapsulation layer 15 away from the surface of substrate 11
It contacts and connects.
Specifically, in above-mentioned display panel, 14 distribution density of spacer material of folding region 17 is greater than the dottle pin of non-collapsible district 18
14 distribution density of object.Folding region 17 and non-collapsible district 18 relative to display panel 1, general spacer material 14, which can be uniformly distributed, to be set
It sets, it is appropriate to increase by 14 distribution density of spacer material in folding region 17 in the present embodiment, spacer material in folding region 17 can be effectively increased
14 quantity can effectively increase the contact area of spacer material 14 and film layer dress layer in folding region 17, then can make folding region
The surface of 17 spacer material 14 towards thin-film package increases with the area that thin-film encapsulation layer 15 is directly contacted and connected, can be effective
The adhesion strength for improving the spacer material 14 of thin-film encapsulation layer 15 and folding region 17, avoids thin-film encapsulation layer 15 from starting, fall off.
Specifically, it is adhesive force of the enhanced film encapsulated layer 15 on substrate 11, can also be arranged and be distributed in non-collapsible district
At least partly spacer material 14 directly contacts and connects with thin-film encapsulation layer 15 away from the surface of substrate 11 in 18 multiple spacer materials 14
It connects, that is, the table that a part of spacer material 14 being distributed in multiple spacer materials 14 of non-collapsible district 18 deviates from substrate 11 can be set
Face directly contacts and connects with thin-film encapsulation layer 15, and also can be set, which makes to be distributed in each spacer material 14 of non-collapsible district 18, deviates from
The surface of substrate 11 directly contacts and connects with thin-film encapsulation layer 15, according to setting for the spacer material 14 in above-mentioned non-collapsible district 18
It sets, the whole adhesive force with substrate 11 of thin-film encapsulation layer 15 can be enhanced, thin-film encapsulation layer 15 is effectively avoided to start, fall off.
For the size setting of the spacer material 14 in above-mentioned display panel 1, spacer material 14 is set along perpendicular to substrate 11
The size in direction is more than or equal to 0.3 μm and to be less than or equal to 4 μm, that is, the thickness range of spacer material 14 is 0.3 μm~4 μm,
It according to the specific design of above-mentioned display panel, is selected in 0.3 μm~4 μ ms suitably sized, is conducive to increase display surface
The stability of spacer material 14 in plate is conducive to increase the bonding stability between spacer material 14 and thin-film encapsulation layer 15, Ke Yiyou
Effect alleviates the situation that thin-film encapsulation layer 15 is started, fallen off.
Specifically, above-mentioned thin-film encapsulation layer 15 includes being sequentially arranged on organic electroluminescence device layer 13 and spacer material 14 the
One inorganic barrier layer 151, organic planarization layer 152 and the second inorganic barrier layer 153.Wherein, the first inorganic barrier layer 151 and second
The material of inorganic barrier layer 153 can be SiN, SiO or SiON, can play the role of obstructing water oxygen, and two layers of nothing is arranged
Machine barrier layer can be organic material with the organic electroluminescence device in effective protection display panel, the material of organic planarization layer 152
Material can play the role of planarization and package foreign particles, can make the smooth setting of the second inorganic barrier layer 153, make film
The overall structure of encapsulated layer 15 enhances.
In above-mentioned thin-film encapsulation layer 15, the first inorganic barrier layer 151 along the direction perpendicular to substrate 11 size be greater than
Or it is equal to 0.3 μm and is less than or equal to 2 μm, that is, the thickness of the first inorganic barrier layer 151 can be in 0.3 μm~2 μ m
It chooses, specifically, according to the specific design of display panel, the thickness of the first inorganic barrier layer 151 can be adjusted；
Similarly, size of second inorganic barrier layer 153 along the direction perpendicular to substrate 11 is more than or equal to 0.3 μm and to be less than or equal to
2 μm, that is, the thickness of the second inorganic barrier layer 153 can be chosen in 0.3 μm~2 μ ms, likewise, according to display surface
The specific design of plate can also be adjusted the thickness of the first inorganic barrier layer 151.
Specifically, organic planarization layer 152 along the direction perpendicular to substrate 11 size be more than or equal to 1 μm and be less than or
Equal to 15 μm, that is, the thickness of organic planarization layer 152 is set as 1 μm~15 μm, more electedly in scheme, organic planarization layer 152
Thickness, according to the specific design of display panel, can adjust the thickness of organic planarization layer 152 at 6 μm~8 μm
It is whole.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of preparation method of display panel, the display panel includes at least one folding region and at least two non-collapsible
Area, which is characterized in that the preparation method includes:
TFT device layer is formed on the substrate；
Multiple spacer materials of the folding region and non-collapsible district are distributed on the TFT device layer；
Organic electroluminescence device layer is formed on the TFT device layer；
By at least partly spacer material being distributed in multiple spacer materials of the folding region having on the surface of the substrate
Electroluminescent material layer is completely removed to form exposed surface；
Thin-film encapsulation layer is formed on the organic electroluminescence device layer and the spacer material, wherein is distributed in the folding
The spacer material with exposed surface is directly contacted and is connected with the thin-film encapsulation layer in multiple spacer materials in folded area.
2. preparation method according to claim 1, which is characterized in that using vapor deposition or the method for printing in the TFT device
Organic electroluminescence device layer is formed on part layer.
3. preparation method according to claim 2, which is characterized in that form organic electroluminescence hair on the TFT device layer
The mask plate used during optical device layer is Open mask.
4. preparation method according to claim 1, which is characterized in that using laser sintering processes to being distributed in the folding
Electroluminescent organic material floor of at least partly spacer material on the surface of the substrate in multiple spacer materials in area carries out
It completely removes.
5. preparation method according to claim 1, which is characterized in that the thin-film encapsulation layer includes being sequentially arranged in described to have
First inorganic barrier layer, organic planarization layer and the second inorganic barrier layer on organic electroluminescence devices layer and the spacer material；
Wherein, the thin-film encapsulation layer that formed on the organic electroluminescence device layer and the spacer material specifically includes:
It is inorganic that described first is formed on the organic electroluminescence device layer and the spacer material using vapor deposition method
Barrier layer；
Organic planarization layer is formed in first inorganic barrier layer；
Second inorganic barrier layer is formed in the organic planarization layer using vapor deposition method.
6. a kind of display panel prepared using preparation method as described in any one in claim 1-5, including at least one folding
Folded area and at least two non-collapsible districts characterized by comprising
Substrate；
TFT device layer on the substrate；
Organic electroluminescence device layer on the TFT device layer is distributed in the multiple of the folding region and non-collapsible district
Spacer material；
Thin-film encapsulation layer on the organic electroluminescence device layer and the spacer material；
Wherein, be distributed in multiple spacer materials of the folding region at least partly spacer material away from the substrate surface with it is described
Thin-film encapsulation layer is directly contacted and is connected.
7. display panel according to claim 6, which is characterized in that be distributed in each of described folding region spacer material
It directly contacts and connects with the thin-film encapsulation layer away from the surface of the substrate.
8. display panel according to claim 6, which is characterized in that the spacer material distribution density of the folding region is greater than institute
State the spacer material distribution density of non-collapsible district.
9. display panel according to claim 6, which is characterized in that be distributed in multiple spacer materials of the non-collapsible district
At least partly spacer material is directly contacted and is connected with the thin-film encapsulation layer away from the surface of the substrate.
10. display panel according to claim 6, which is characterized in that the thin-film encapsulation layer is described including being sequentially arranged in
First inorganic barrier layer, organic planarization layer and the second inorganic barrier layer on organic electroluminescence device layer and the spacer material.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113517318A (en) * | 2021-04-06 | 2021-10-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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| CN206685390U (en) * | 2017-04-27 | 2017-11-28 | 上海天马微电子有限公司 | A kind of flexible display panels and flexible display apparatus |
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| CN1638544A (en) * | 2003-12-30 | 2005-07-13 | Lg.菲利浦Lcd株式会社 | Organic electroluminescent device and fabricating method thereof |
| CN206685390U (en) * | 2017-04-27 | 2017-11-28 | 上海天马微电子有限公司 | A kind of flexible display panels and flexible display apparatus |
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| CN113517318A (en) * | 2021-04-06 | 2021-10-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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