CN1094810C - Active solder and its preparation - Google Patents
Active solder and its preparation Download PDFInfo
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- CN1094810C CN1094810C CN99124681A CN99124681A CN1094810C CN 1094810 C CN1094810 C CN 1094810C CN 99124681 A CN99124681 A CN 99124681A CN 99124681 A CN99124681 A CN 99124681A CN 1094810 C CN1094810 C CN 1094810C
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Abstract
The present invention relates to Ag-Cu-Ti active solder and a metallurgic preparation method for solder powder. The alloy powder of the Ag-Cu-Ti active solder comprises the following components by the weight percentage range: 49 to 69 % of Ag, 30 to 50 % of Cu and 1 to 8 % of Ti; the welding rod is prepared by that the components are mixed, pressed, sintered in vacuum, annealed, rolled in a hot way and rolled in a cold way. The melting point of the Ag-Cu-Ti active solder offered by the present invention is from 780 to 830 DEG C, and the purity is larger than 99%. The present invention has the advantages of simple technology, economical use and wide application range; particularly, the present invention solves the problems which are difficult to overcome in the prior art. The present invention can be successfully used for welding adamas and metal, and welding ZrO2 ceramic and alloy steel; the welding quality is favorable, and the welding technology is simplified.
Description
Technical field
The present invention relates to a kind of cored solder, specifically be meant a kind of preparation method who is used for the cored solder of diamond, pottery and metal (cutter) welding.
Background technology
In the welding procedure of existing diamond tool, the soldering of polycrystalline diamond instrument because the polycrystalline diamond sheet is formed by diamond particles and metal sintering, adopts common cored solder (as ormolu, copper silver kirsite etc.) to carry out soldering usually; Natural diamond and diamond and the common method of inlaying that adopts of combining of metal, and must carry out the metalized rear to diamond surface and can carry out soldering with common cored solder, shortcomings such as this method exists surface of the work pretreatment process and welding procedure complexity, and welding quality is restive.If directly carrying out soldering with common cored solder between diamond and the metal combines, because it is wetting by common cored solder that diamond surface is difficult to, do not have chemical reaction between diamond and the common cored solder, the combination between them only is a mechanical bond, does not reach the welding quality requirement far away.The welding quality of diamond and metal is a difficult problem always.
Summary of the invention
The object of the present invention is to provide a kind of diamond, ZrO of being directly used in
2The preparation method of the active solder of pottery and solder bonding metal solves diamond and metal in the prior art, ZrO
2The welding difficult problem of pottery and steel alloy.
The objective of the invention is to be achieved through the following technical solutions:
The alloy powder of A, powder metallurgic method is got the raw materials ready by following requirement and proportioning:
A, purity are 98～99%, granularity is the Ag of 40～45 μ m, and its percentage by weight ratio range is 49～69%;
B, purity are 98～99%, granularity is the Cu of 40～50 μ m, and its percentage by weight ratio range is 30～50%;
C, purity for＞99%, granularity is the Ti of 20～25 μ m, its percentage by weight ratio range is 1～8%;
According to the soldering requirement, in above-mentioned scope, adjust the proportioning of three kinds of components;
B, compacting
With three kinds of powder by proportioning drop into common batch mixer dried be mixed even after, on the fast oil pressure machine, be pressed into block blank;
C, vacuum-sintering, annealing
The block blank that presses is packed in the vacuum induction heating furnace, be not less than 10 at 650～1000 ℃, vacuum
-3Sintering is 0.5～1.5 hour under the Pa situation; Vacuum-sintering needs to carry out when charging into inert protective atmosphere to 2.5～3.5Pa; Blank behind the sintering was annealed 2～10 hours down at 600～700 ℃;
D, rolling
(a) blank after will annealing takes out from the vacuum induction heating furnace, and at hot mill rolling, the milling train temperature transfers to 550 ℃～650 ℃, and hot rolling---annealing---hot rolling is thinned to thin slice until blank for several times so repeatedly and is the thick soldering tablet of 1.2～1.8mm;
(b) cold rolling
The soldering tablet pickling that hot rolling is formed earlier, after washing the oxide-film on surface off, on cold-rolling mill, make thickness and be 0.12～0.18 superthin section, be fusing point at 780～830 ℃ Ag-Cu-Ti active solder, it is specially adapted to diamond cutter thick film and hard alloy cutter soldering, ZrO
2The soldering of pottery and steel alloy etc.
Owing to contain active element Ti in the scolder, and the solid solubility of Ti in the Ag-Cu alloy is very limited, and the proportion of Ti, fusing point and Ag-Cu alloy differ greatly, if adopt common smelting method for preparing Ag-Cu-Ti active solder will cause the solder compositions deviation because of low-melting component is volatile, cause gravity segregation because of each component proportion is different, cause rolling difficulty of processing to strengthen because of crystal grain is thick, and scolder is easily contaminated, so it is unworkable to prepare the Ag-Cu-Ti alloy with the method for common vacuum melting.The present invention adopts powder metallurgic method, and preparation Ag-Cu-Ti active solder has solved the problems referred to above.
The present invention compared with prior art has following outstanding advantage:
1, owing to contains active element Ti in the Ag-Cu-Ti active solder, therefore can significantly reduce the angle of wetting of diamond and cored solder, when this scolder is used for the soldering of diamond and metal, needn't carry out complicated metalized to diamond surface, and welding quality height, welding procedure is simple, can solve the problem such as diamond brazing complex process, welding quality instability of current existence.
2, creatively powder metallurgic method is applied to prepare the Ag-Cu-Ti active solder, not only technology is simple for it, economy, scolder purity height, and solved can not overcome in the smelting method for preparing such as the composition deviation, problems such as gravity segregation, the thick rolling difficulty of crystal grain.
3, be suitable for face width, can not only finish the soldering of diamond tool in high quality, and can be successfully used to the higher ZrO of difficulty
2The welding of pottery and metal etc.Simplified former welding procedure, and steady quality.
The specific embodiment
The present invention is described in further detail below by embodiment:
Embodiment 1:
The alloy powder of A, powder metallurgic method is got the raw materials ready by following requirement and proportioning:
| Composition | Purity (%) | Granularity (μ m) | Proportioning (wt%) |
| Ag | 99 | 45 | 65 |
| Cu | 99 | 40 | 33 |
| Ti | 99.5 | 20 | 2 |
B, three kinds of alloy powders are dropped into common batch mixer do to mix 2 hours; Powder after mixing under the 550Mpa pressure, is pressed into block blank on THP-60A fast oil pressure machine.
C, pack the block blank that presses into the vacuum induction heating furnace common, suction to 10
-3Pa, and charge into Ar gas to 3Pa after vacuumizing was 700 ℃ of following sintering 1.2 hours.Blank behind the sintering was annealed 2 hours down at 650 ℃.
D, the blank after will annealing takes out from the vacuum induction heating furnace earlier, and at hot mill rolling, rolling temperature transfers to 600 ℃, and---annealing---hot rolling is repeatedly carried out repeatedly through hot rolling, is thinned to the thick soldering tablet of 1.5mm until blank; After the soldering tablet surface film oxide pickling after the hot rolling being fallen, be rolled into the active solder sheet material of 0.15mm on common cold, this sheet material fusing point is 780 ℃, successfully is applied to the soldering of CVD diamond thick-film in YG serial carbide alloy cutter again.
Embodiment 2:
The alloy powder of A, powder metallurgic method is got the raw materials ready by following requirement and proportioning:
| Composition | Purity (%) | Granularity (μ m) | Proportioning (wt%) |
| Ag | 98 | 40 | 60 |
| Cu | 98 | 45 | 37 |
| Ti | 99 | 20 | 3 |
B, three kinds of alloy powders are dropped into common batch mixer do to mix 3 hours; Powder after mixing under the 500Mpa pressure, is pressed into block blank on THP-60A fast oil pressure machine.
C, pack the block blank that presses into the vacuum induction heating furnace common, suction to 10
-2Pa, and charge into Ar to 3.5Pa after vacuumizing was 750 ℃ of following sintering 1 hour.Blank behind the sintering was annealed 3 hours down at 650 ℃.
D, the blank after will annealing takes out from the vacuum induction heating furnace earlier, and in hot-rolling mill mechanism, rolling temperature transfers to 650 ℃, and---annealing---hot rolling is repeatedly carried out repeatedly through hot rolling, is thinned to the thick solder sheet of 1.8mm until blank; After the solder surface oxide-film pickling after the hot rolling being fallen, be rolled into the active solder sheet material of 0.18mm on common cold, this sheet material fusing point is 800 ℃, successfully is applied to the soldering of CVD diamond thick-film in YT serial carbide alloy cutter again.
Embodiment 3:
The alloy powder of A, powder metallurgic method is got the raw materials ready by following requirement and proportioning:
| Composition | Purity (%) | Granularity (μ m) | Proportioning (wt%) |
| Ag | 99 | 50 | 60 |
| Cu | 99 | 45 | 34 |
| Ti | 99.9 | 25 | 6 |
B, three kinds of alloy powders are dropped into common batch mixer do to mix 4 hours; Powder after mixing under the 550Mpa pressure, is pressed into block blank on THP-60A fast oil pressure machine.
C, pack the block blank that presses into the vacuum induction heating furnace common, suction to 10
-3Pa, and charge into Ar gas to 2.5Pa after vacuumizing was 1000 ℃ of following sintering 0.8 hour.Blank behind the sintering was 700 ℃ of annealing 5 hours.
D, the blank after will annealing takes out from the vacuum induction heating furnace earlier, and in hot-rolling mill mechanism, rolling temperature transfers to 650 ℃, and---annealing---hot rolling is repeatedly carried out repeatedly through hot rolling, is thinned to the thick solder sheet of 1.2mm until blank; After the solder surface oxide-film pickling after the hot rolling being fallen, be rolled into the active solder sheet material of 0.12mm on common cold, this sheet material fusing point is 830 ℃, successfully is applied to ZrO again
2Pottery is in the soldering of 40Cr.
Claims (2)
1, a kind of preparation method of active solder is characterized in that adopting powder metallurgic method, through getting the raw materials ready, batch mixing, compacting, vacuum-sintering, annealing, hot rolling, cold-rolling process be prepared from the Ag-Cu-Ti active solder, its processing step is as follows:
A, get the raw materials ready by following requirement and proportioning:
A, purity are 98～99%, granularity is the Ag of 40～45 μ m, and its percentage by weight ratio range is 49～69%;
B, purity are 98～99%, granularity is the Cu of 40～50 μ m, and its percentage by weight ratio range is 30～50%;
C, purity for＞99%, granularity is the Ti of 20～25 μ m, its percentage by weight ratio range is 1～8%;
B, compacting
With three kinds of powder by proportioning drop into common batch mixer dried be mixed even after, on the fast oil pressure machine, be pressed into block blank;
C, vacuum-sintering, annealing
The block blank that presses is packed in the vacuum induction heating furnace, and at 650～1000 ℃, vacuum was not less than under the 10-3Pa situation sintering 0.5～1.5 hour; Vacuum-sintering needs to carry out when charging into inert protective atmosphere to 2.5～3.5Pa; Blank behind the sintering was annealed 2～10 hours down at 600～700 ℃;
D, rolling
(a) hot rolling
Blank after the annealing is taken out, and at hot mill rolling, hot rolling---annealing---hot rolling is several so repeatedly, until the blank attenuate;
(b) cold rolling
Earlier hot rolling is formed the thick active soldering tablet pickling of 1.2～1.8mm, wash the oxide-film on surface off after, the active solder sheet material of making 0.12～0.18mm on cold-rolling mill is the Ag-Cu-Ti active solder.
2, the preparation method of a kind of active solder according to claim 1 is characterized in that the alloy powder composition of powder metallurgic method requires with proportioning as follows:
Purity is 99%, granularity is Ag and the Cu of 40 μ m, and Ag and Cu ratio are eutectic composition; Purity is 99.5%, granularity is the Ti of 20 μ m, its percentage by weight proportioning＞1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99124681A CN1094810C (en) | 1999-12-27 | 1999-12-27 | Active solder and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99124681A CN1094810C (en) | 1999-12-27 | 1999-12-27 | Active solder and its preparation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1258580A CN1258580A (en) | 2000-07-05 |
| CN1094810C true CN1094810C (en) | 2002-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99124681A Expired - Fee Related CN1094810C (en) | 1999-12-27 | 1999-12-27 | Active solder and its preparation |
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| CN (1) | CN1094810C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100368140C (en) * | 2004-06-03 | 2008-02-13 | 吉林大学 | Method for connecting diamond thick film with hard base firmly |
| CN101012129B (en) * | 2006-11-08 | 2010-04-14 | 吉林大学 | Method of modifying diamond film or natural diamond surface |
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
| CN102699567A (en) * | 2012-06-14 | 2012-10-03 | 中南大学 | Zirconium-containing copper silver titanium solder alloy |
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| CN101333116B (en) * | 2008-07-30 | 2010-06-02 | 哈尔滨工业大学 | Method of Brazing ceramic and ceramic-based composite material with titan alloy |
| EP2469562A1 (en) * | 2010-12-22 | 2012-06-27 | ABB Technology AG | Interrupter insert for a circuit breaker arrangement |
| CN102079000A (en) * | 2011-02-14 | 2011-06-01 | 江阴东大新材料研究院 | Ceramic for repairing damaged ceramic coating on surface of metal and argon arc welding method thereof |
| CN103084751A (en) * | 2012-12-24 | 2013-05-08 | 镇江大有硬质材料有限公司 | Diamond brazing welding flux |
| CN103170766A (en) * | 2013-03-27 | 2013-06-26 | 江苏盛之祥电子科技有限公司 | Preparation method of low-melting-point high-reliability lead-free solder |
| KR20160089429A (en) * | 2013-11-22 | 2016-07-27 | 회가내스 아베 (피유비엘) | Preforms for brazing |
| CN103752971A (en) * | 2013-12-13 | 2014-04-30 | 天津大学 | Method for connecting TC4 titanium alloy with silicon nitride ceramic by brazing connection with solders of titanium-silver-copper |
| CN104387103B (en) * | 2014-11-19 | 2016-03-30 | 中国原子能科学研究院 | The method for welding of a kind of zirconia ceramics and metallic substance |
| CN104387118B (en) * | 2014-11-19 | 2016-05-04 | 中国原子能科学研究院 | Zirconia ceramics metallization paste material formula, preparation method and application for a kind of soldering |
| CN105537799A (en) * | 2015-12-24 | 2016-05-04 | 昆明贵金属研究所 | Agcuti active brazing filler metal and preparation method thereof |
| CN107385439B (en) * | 2017-06-02 | 2023-10-17 | 泉州众志金刚石工具有限公司 | Cu-Ag-Ti diamond brazing coating and preparation method thereof |
| CN107309429B (en) * | 2017-07-06 | 2019-05-21 | 北京理工大学 | A kind of preparation method of powder accumulation structure all-metal active material |
| CN108103497B (en) * | 2017-12-19 | 2020-10-27 | 东南大学 | Method for preparing low-temperature welding titanium carbide coating |
| CN108085679A (en) * | 2017-12-19 | 2018-05-29 | 东南大学 | Low-temperature welding diamond coatings preparation method |
| CN109434317B (en) * | 2018-11-16 | 2021-02-02 | 北京康普锡威科技有限公司 | Lead-free environment-friendly solder and preparation method and application thereof |
| CN110394521B (en) * | 2019-08-02 | 2021-03-23 | 太原理工大学 | Diamond film high-efficiency heat dissipation material and preparation method thereof |
| CN112059470A (en) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | Active brazing filler metal for brazing titanate microwave dielectric ceramic and metal and preparation method thereof |
| CN113084176B (en) * | 2021-04-09 | 2023-08-18 | 武汉工程大学 | Self-supporting diamond film/Cu composite heat sink material and preparation method thereof |
| CN113600957A (en) * | 2021-08-12 | 2021-11-05 | 合肥工业大学 | Composite interlayer and method for brazing boron carbide composite ceramic and titanium alloy |
| CN114473289A (en) * | 2022-01-20 | 2022-05-13 | 浙江亚通焊材有限公司 | AgCu-based brazing filler metal and method for brazing and connecting diamond and copper by using AgCu-based brazing filler metal |
| CN115922147A (en) * | 2022-12-27 | 2023-04-07 | 云南大学 | Is suitable for Al 2 O 3 High-strength active brazing filler metal for ceramic welding and preparation method thereof |
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| US4678720A (en) * | 1985-01-04 | 1987-07-07 | Gte Laboratories Incorporated | Silver-copper-titanium brazing alloy |
| JPH1129371A (en) * | 1997-07-10 | 1999-02-02 | Tokuyama Corp | Brazing material and jointing between aluminum nitride and metal material |
| JPH11130555A (en) * | 1997-10-28 | 1999-05-18 | Kyocera Corp | Brazing material for joining ceramic-copper |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4678720A (en) * | 1985-01-04 | 1987-07-07 | Gte Laboratories Incorporated | Silver-copper-titanium brazing alloy |
| JPH1129371A (en) * | 1997-07-10 | 1999-02-02 | Tokuyama Corp | Brazing material and jointing between aluminum nitride and metal material |
| JPH11130555A (en) * | 1997-10-28 | 1999-05-18 | Kyocera Corp | Brazing material for joining ceramic-copper |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100368140C (en) * | 2004-06-03 | 2008-02-13 | 吉林大学 | Method for connecting diamond thick film with hard base firmly |
| CN101012129B (en) * | 2006-11-08 | 2010-04-14 | 吉林大学 | Method of modifying diamond film or natural diamond surface |
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
| CN102699567A (en) * | 2012-06-14 | 2012-10-03 | 中南大学 | Zirconium-containing copper silver titanium solder alloy |
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| Publication number | Publication date |
|---|---|
| CN1258580A (en) | 2000-07-05 |
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