CN103084751A - Diamond brazing welding flux - Google Patents
Diamond brazing welding flux Download PDFInfo
- Publication number
- CN103084751A CN103084751A CN2012105648577A CN201210564857A CN103084751A CN 103084751 A CN103084751 A CN 103084751A CN 2012105648577 A CN2012105648577 A CN 2012105648577A CN 201210564857 A CN201210564857 A CN 201210564857A CN 103084751 A CN103084751 A CN 103084751A
- Authority
- CN
- China
- Prior art keywords
- diamond
- brazing
- weight
- welding
- welding flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Products (AREA)
Abstract
The invention discloses a diamond brazing welding flux. Components and weight percentages of the brazing welding flux comprise 60% - 71% by weight of sliver, 20% - 35% by weight of copper, 0.5% - 1.5% by weight of titanium, and 5% - 8% by weight of silicon. The soldering welding flux can be not only used for a vacuum brazing method of a diamond drilling tool, but also applied for an electrical activating brazing method, wherein the electrical activating brazing method is in a simple craft condition. Higher welding strength can be obtained, welding internal stress is small, and rates that the diamond produces flaws are lowered down in a large scale.
Description
Technical field
The invention belongs to the diamond welding technical field, is a kind of diamond brazing scolder specifically.
Background technology
Optical fiber contact pins is to process a kind of superhard cutter that optical cable rapid abutting joint ceramic plug is used in communication with the diamond drill machine cutter, and along with the continuous progress of optical fiber communication technology in recent years, the application of optical fiber rapid abutting joint plug is increasingly extensive, and demand constantly increases.Optical fiber contact pins is a kind of important process tool wherein with the diamond drill machine cutter, and its performance and cost direct relation the cost of optical fiber Quick connector.But the process technology of diamond drill machine cutter is blocked by developed country always for many years, and the use of product is dependence on import always.
Optical fiber contact pins adopts artificial or natural regular octahedron single-crystal diamond and stainless steel base to weld with the diamond drill machine cutter.Adamantine being fixed with inlayed packaging type, welding and splicing.The mode that diamond adopts parcel to inlay under general case is fixed on and then is processed into required cutter on matrix, packaging type need to be wrapped in adamantine major diameter in built-in metal, even if in case the fixing diamond major part of this method comes out with coming off, just can cause huge waste for expensive diamond.Cementing method, bond strength is not high, and limited by serviceability temperature, so making seldom use on cutter, require on the diamond drill machine cutter cutter and substrate combinating strength good at optical fiber contact pins, the matrix plastic deformation is little, and cutter will carry out repeatedly reconditioning simultaneously, so can not adopt the mode of inlaying parcel to fix.
Have very high interface energy between diamond and general metal and alloy thereof, cause diamond not infiltrated by general low-melting alloy, the solderability extreme difference.At present mainly by adding carbide or improve solderability between diamond and metal by diamond surface being carried out metalized in the Kufil scolder.
Some scolders of domestic existing diamond brazing are all take the Ag-Cu alloy as the main strong carbide generting element Ti(3-8% that adds in addition basically) consist of.But due to Ti active high in air easily oxidation lost efficacy, addition is very few does not in addition have again a corresponding effect, addition is excessive can be caused undue reaction again and the excessive diamond that causes of welding interior stress is cracked.This class scolder is only applicable to vacuum brazing substantially simultaneously.
Summary of the invention
The objective of the invention is provides a kind of diamond brazing scolder for above-mentioned deficiency of the prior art, makes it possible to general method for welding, bulky diamond is welded on stainless steel base.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of diamond brazing scolder, the component of described brazing solder and weight percent content are: Ag60-71%, Cu20-35%, Ti0.5%-1.5%, Si5%-8%.
Further preferred version is that component and the weight percent content of brazing solder are: Ag60-71%, Cu20-35%, Ti0.5%-1%, Si5%-8%.
Single-crystal diamond brazing solder in the present invention separately adds 5-8% Si formation take Ag-Cu (Ag60-71%, Cu20-35%) alloy as main interpolation 0.5-1.5%Ti.Because Si is also the strong carbide generting element, it can effectively reduce the scolder fusing point in addition, thereby can weld at lower temperature, Si is than the Ti stable chemical nature thereby be applicable to various ways welding in addition, also can make simultaneously weld seam that suitable weld strength is arranged, welding interior stress is little, and the ratio that diamond cracks significantly reduces.
The preparation method of brazing solder of the present invention is: component silver-bearing copper titanium silicon is mixed in proportion is smelted into liquefied mixture, and then spraying is cooled to Powdered alloy mixture under inert ambient environment, can make brazing solder of the present invention.
The present invention has following outstanding beneficial effect: the vacuum brazing method that not only can be used for the diamond drill machine cutter, can also be applicable in the simple electricity activation of process conditions method for welding, can obtain higher weld strength, welding interior stress is little, significantly reduces the ratio that diamond cracks.
The specific embodiment
The invention will be further described below in conjunction with embodiment:
Embodiment 1:
Take respectively silver-colored 600 grams, copper 350 grams, titanium 15 grams, silicon 35 grams, be smelted into together liquefied mixture in smelting furnace, then spraying is cooled to Powdered alloy mixture under inert ambient environment, can make brazing solder of the present invention, the weight percent content of silver, copper, titanium, silicon is respectively 60%, 35%, 1.5%, 3.5%.
Embodiment 2:
Take respectively silver-colored 710 grams, copper 235 grams, titanium 5 grams, silicon 50 grams, be smelted into together liquefied mixture in smelting furnace, then spraying is cooled to Powdered alloy mixture under inert ambient environment, can make brazing solder of the present invention, the weight percent content of silver-bearing copper titanium silicon is respectively 71%, 23.5%, 0.5%, 5%.
Embodiment 3:
Take respectively silver-colored 710 grams, copper 200 grams, titanium 10 grams, silicon 80 grams, be smelted into together liquefied mixture in smelting furnace, then spraying is cooled to Powdered alloy mixture under inert ambient environment, can make brazing solder of the present invention, the weight percent content of silver-bearing copper titanium silicon is respectively 71%, 20%, 1%, 8%.
Be more than preferred embodiment of the present invention, all changes of doing according to technical solution of the present invention when the function that produces does not exceed the scope of technical solution of the present invention, all belong to protection scope of the present invention.
Claims (3)
1. diamond brazing scolder, it is characterized in that: the component of described brazing solder and weight percent content are: Ag 60-71%, Cu20-35%, Ti0.5%-1.5%, Si5%-8%.
2. diamond brazing scolder according to claim 1, it is characterized in that: the component of described brazing solder and weight percent content are respectively Ag 60%, Cu 35%, Ti 1.5%, Si 3.5%.
3. diamond brazing scolder according to claim 1 is characterized in that: in the component of described brazing solder, and Ti0.5%-1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105648577A CN103084751A (en) | 2012-12-24 | 2012-12-24 | Diamond brazing welding flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105648577A CN103084751A (en) | 2012-12-24 | 2012-12-24 | Diamond brazing welding flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103084751A true CN103084751A (en) | 2013-05-08 |
Family
ID=48198149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105648577A Pending CN103084751A (en) | 2012-12-24 | 2012-12-24 | Diamond brazing welding flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103084751A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1258580A (en) * | 1999-12-27 | 2000-07-05 | 华南理工大学 | Active solder and its preparation |
| EP1078711A1 (en) * | 1999-08-24 | 2001-02-28 | Degussa-Hüls Aktiengesellschaft | Cadmium-free brazing alloys |
| CN1872485A (en) * | 2005-05-31 | 2006-12-06 | 厦门佳品金刚石工业有限公司 | Alloy powder of containing titanium for welding diamond |
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
-
2012
- 2012-12-24 CN CN2012105648577A patent/CN103084751A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1078711A1 (en) * | 1999-08-24 | 2001-02-28 | Degussa-Hüls Aktiengesellschaft | Cadmium-free brazing alloys |
| CN1258580A (en) * | 1999-12-27 | 2000-07-05 | 华南理工大学 | Active solder and its preparation |
| CN1872485A (en) * | 2005-05-31 | 2006-12-06 | 厦门佳品金刚石工业有限公司 | Alloy powder of containing titanium for welding diamond |
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
| CN103358048B (en) * | 2013-07-25 | 2016-08-17 | 杭州华光焊接新材料股份有限公司 | A kind of silver-bearing copper phosphorus system vacuum brazing material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100502168C (en) | Lead welding and shaping method for commutator with carbon copper compound structure | |
| CN101913036B (en) | CuZnTi solder for soldering diamond tool | |
| CN101954551B (en) | Brazing filler metal and process for welding molybdenum-copper alloy and Austenitic stainless steel | |
| CN102601542A (en) | Brass brazing alloy | |
| CN102814601B (en) | Soldering flux for brazing diamond cemented carbide sand and preparation method for soldering flux | |
| CN102732865A (en) | Chemical nickel plating solution and aluminum silicon carbide plating method | |
| CN102658409B (en) | Method for welding titanium alloy ring frame for electronic packaging shell | |
| CN104759781A (en) | Silver substitute copper phosphorus tin coating brazing alloy ring and preparation method thereof | |
| CN104526181A (en) | Electric vacuum silver base alloy solder for vacuum electronic device brazing sealing and preparation method thereof | |
| CN106513899B (en) | Clamp and method when the miniature soldered fitting of sandwich style and its preparation | |
| CN102581517A (en) | High-temperature soldering solder for soldering inert anode for aluminium electrolysis and metal conductive rod | |
| CN102059519A (en) | Method for preparing back plate and back plate structure | |
| CN103084751A (en) | Diamond brazing welding flux | |
| CN103071945B (en) | Nickel-based solder used for welding diamond and preparation method for nickel-based solder | |
| CN101972900A (en) | Soldering flux for copper brazing | |
| CN101972904B (en) | Preparation method of high temperature brazing filler metal for brazing hard alloy cutters | |
| CN108890172B (en) | Halogen-free acid-washing-free fluxing agent and preparation method thereof | |
| CN103934589A (en) | Aluminum-based quasi-crystal alloy composite brazing solder for ceramic or glass | |
| CN101677488A (en) | High thermal conductive substrate structure and production method thereof | |
| CN108161270B (en) | Particle-reinforced Sn-Zn nano solder for low-temperature packaging of aluminum alloy and LED chip and preparation method thereof | |
| CN107385439B (en) | Cu-Ag-Ti diamond brazing coating and preparation method thereof | |
| CN103203561B (en) | Silver-free brazing filler metal for brazing hard alloy | |
| CN109986232B (en) | Sn-Ti-Cu ternary alloy solder for sealing quartz glass | |
| CN105290646B (en) | A kind of polynary high-temp solder | |
| CN101920409B (en) | Palladium-copper-gold based high-temperature brazing alloy for Cf or SiC composite material brazing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130508 |