A method of improving the semiconductor device reliability of composition epoxy resin encapsulation
Technical field
The method that the present invention relates to a kind of semiconductor device reliability of raising composition epoxy resin encapsulation.
Background technique
In recent years, semicon industry develops rapidly, and is all using electronic product everywhere in life, but civilian semiconductor product
Product poor reliability, service life are shorter.People are higher and higher to electronic product requirement, this just proposes the reliability of civilian semiconductor
Increasingly higher demands.Civilian semiconductor is packaged using composition epoxy resin substantially, composition epoxy resin because price,
The factors such as materials'use, formula, reliability itself can be lower than metal and ceramic package.
Traditional method for packaging semiconductor, can only be by the reliability for improving composition epoxy resin, Lai Tigao semiconductor
The reliability of device, but by price, it is unable to satisfy requirement of the market to semiconductor reliability.Packaged type method is ground
Study carefully the important research project for becoming encapsulation market at present.
Summary of the invention
The purpose of the present invention is by new molded package method, the composition epoxy resin of use reliability rank difference,
After solving current semiconductor packages, whole water absorption rate is big, after Reliability Check, a kind of semiconductor packages of finished product electrical property yield difference
Method.
Technical scheme is as follows:
A method of the semiconductor device reliability of composition epoxy resin encapsulation being improved, key step is as follows: will use
The packaged semiconductor devices of composition epoxy resin stands 10- after spraying using a kind of fluid organic material at normal temperature
60min solidifies 1-3h at 150-180 DEG C.
The component and content of the composition epoxy resin for encapsulating semiconductor are as follows:
。
The epoxy resin is the monomer, oligomer or polymer for having 2 or more epoxy groups in 1 epoxy molecule,
Its molecular weight and molecular structure are not particularly limited.The epoxy resin is selected from o-cresol formaldehyde epoxy resin, bisphenol type epoxy tree
Rouge, bisphenol f type epoxy resin, linear phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, open chain
One or more of aliphatic epoxy resin, cycloaliphatic epoxy resin, heterocyclic-type epoxy resin.
The curing agent phenolic resin is the monomer, oligomer or polymerization that 1 phenolic aldehyde intramolecular has 2 or more hydroxyls
Object, molecular weight and molecular structure are not particularly limited.The phenolic resin can be selected from phenol linear phenolic resin and its spread out
Biology, phenyl methylcarbamate linear phenolic resin and its derivative, monohydroxy or dihydroxy naphthlene phenolic resin and its derivative, paraxylene
One or more of with the copolymer of the condensation product of phenol or naphthols, dicyclopentadiene and phenol etc..
The inorganic filler is not particularly limited.The inorganic filler can be micro- selected from fine silica powder, aluminium oxide
One or more of powder, titanium oxide fine powder, silicon nitride powder, aluminium nitride micro mist etc..Fine silica powder can be crystal type
Fine silica powder or fusion fine silica powder;The fusion fine silica powder can be angular micro mist or ball-type
Micro mist.Wherein, it is preferable to use the fusion fine silica powder of ball-type.Above-mentioned crystalline sillica micro mist and fusion dioxy
SiClx micro mist may be used alone or in combination.In addition, the surface of the fine silica powder can be used it is silane coupled
Agent is surface-treated (high-speed stirred mixing).
The curing accelerator is not particularly limited as long as can promote the curing reaction of epoxy group and phenolic hydroxyl group.Institute
The content of the curing accelerator stated generally in the composition is 0.16~0.8wt%;Imidazolium compounds, tertiary amine chemical combination can be selected from
One or more of object and organic phosphine compound etc..
The imidazolium compounds is selected from 2-methylimidazole, 2,4- methylimidazole, 2-ethyl-4-methylimidazole, 2- benzene
One or more of base imidazoles, 2- phenyl -4-methylimidazole and 2- (heptadecyl) imidazoles etc..
The tertiary amine compound is selected from triethylamine benzyl group dimethylamine, Alpha-Methyl benzyl group dimethylamine, 2- (dimethylamino first
One of base) phenol, (dimethylamino methyl) phenol of 2,4,6- tri- and 1,8- diazabicyclo (5,4,0) endecatylene -7 etc.
Or it is several.
The organic phosphine compound is selected from triphenylphosphine, trimethyl-phosphine, triethyl phosphine, tributylphosphine, three (to methylbenzene
One or more of base) phosphine and three (nonyl phenyl) phosphines etc..
The content of the release agent generally in the composition is 0.3~0.5wt%;Preferred content is 0.4wt%.It can be with
Selected from one or more of Brazil wax, synthetic wax and mineral matter wax.
The general content in the composition of described low stress modified dose is 0.7~0.9wt%;Preferred content is
0.8wt%.Such as liquid silicone oil, silicone rubber powder or their mixture.
The content of the colorant generally in the composition is 0.4~0.6wt%;Preferred content is 0.5wt%.Such as charcoal
It is black.
The content of the fire retardant generally in the composition is 0.5~3wt%, including brominated epoxy resin and three oxidations
The mixture of two antimony, wherein the mass ratio of brominated epoxy resin and antimony oxide is 5:1.
The content of the silane coupling agent generally in the composition is 0.4~0.6wt%;Preferred content is 0.5wt%.
γ-glycidyl propyl ether trimethoxy silane, γ aminopropyltriethoxy silane, γ-mercaptopropyi front three can be selected from
One or more of oxysilane and γ-aminopropyltrimethoxysilane.
Various raw materials, production involved in the composition epoxy resin and encapsulation process of semiconductor-sealing-purpose of the invention
Product commercially obtain.
Technical contribution of the invention is: the semiconductor device encapsulated using a kind of fluid organic material to composition epoxy resin
Part surface is sprayed, to improve the reliability of semiconductor devices.The fluid organic material main component is that one kind contains silicon
With the organic matter of nitrogen, a kind of film is formed in device or body surface after heated solidification, which has certain barrier wet
Gas effect, so that the water absorption rate of semiconductor devices declines to a great extent, to improve the reliability of semiconductor devices.
Method for packaging semiconductor provided by the present invention is passed through using common or poor reliability composition epoxy resin
A kind of processing of fluid organic material, can get the semiconductor packing device of the higher reliability of resistance to moisture.
Specific embodiment
The present invention is further illustrated with reference to embodiments, but they and do not constitute a limitation of the invention, it is right
In those skilled in the art, some nonessential variations and adjustment done according to the present invention are accordingly to be regarded as falling in of the invention
In protection scope.
Composition epoxy resin ingredient is as follows in embodiment:
Fluid organic material is that (Beijing Kehua New Material Science and Technology Co., Ltd.'s manufacture, those skilled in the art can business by KH-S9660
Purchase)
O-cresol formaldehyde epoxy resin A1 (Japanese DIC Corporation system " N-665 ")
Phenol linear phenolic resin B1 (Japanese DIC Corporation system " TD-2131 ")
2-methylimidazole C1
1,8- diazabicyclo (5,4,0) endecatylene -7C2
Fine silica powder D (d50 is 25 μm)
Brazil wax E
γ-glycidyl propyl ether trimethoxy silane F
Carbon black G
Liquid silicone oil H1
Silicone rubber powder H2
Mixture (mass ratio 5:1) I of brominated epoxy resin and antimony oxide
Biphenyl type epoxy resin A2 (Japan Epoxy Resins Co., Ltd. system " YX-4000H ")
Dicyclopentadiene type epoxy Resin A 3 (Japanese DIC Corporation system " HP-7200 ")
Phenol alkyl phenolic resin (phenol linear phenolic resin derivative) B2 (Mitsui Chemicals, Inc. system
“XLC-4L”)
Triphenylphosphine C3
Embodiment 1
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 10min at normal temperature, solidifies 1h at 150 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 2
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 30min at normal temperature, solidifies 1h at 150 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 3
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 60min at normal temperature, solidifies 1h at 150 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 4
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 50min at normal temperature, solidifies 2h at 160 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 5
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 60min at normal temperature, solidifies 1h at 160 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 6
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 10min at normal temperature, solidifies 1h at 180 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 7
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 20min at normal temperature, solidifies 3h at 150 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 8
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 30min at normal temperature, solidifies 2h at 170 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 9
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 30min at normal temperature, solidifies 3h at 150 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Embodiment 10
The semiconductor devices SOP-8 product that composition epoxy resin will be used packaged is had a kind of liquid using spray gun
Machine object even application is on SOP-8 device;Product after spraying stands 40min at normal temperature, solidifies 3h at 160 DEG C.
Composition epoxy resin formula composition is shown in Table 1, and treated that semiconductor package device SOP-8 carries out performance evaluation for gained
The results are shown in Table 1.
Comparative example 1~10
The good semiconductor frame SOP-8 semi-finished product of normal die bond, routing, are directly sealed using composition epoxy resin
Dress.
The same Examples 1 to 10 of composition epoxy resin formula composition, the same above-described embodiment of method of evaluating performance, performance evaluation
It the results are shown in Table 2.
Table 1: Examples 1 to 10 semiconductor devices SOP-8 Evaluation results and composition epoxy resin formula composition (with
Weight percent meter)
Table 2: the Evaluation results of comparative example
It can be seen that by the Evaluation results of above-described embodiment and comparative example, the semiconductor devices obtained using the present invention,
Compared with the semiconductor devices for using conventional packaging method to prepare, semiconductor device can be substantially reduced using method of the invention
The water absorption rate of part makes the semiconductor device reliability being obtained by the present invention --- i.e. and yield is higher after MSL3 grades of examination.