CN109436569A - Buffer structure and panel packaging device - Google Patents
Buffer structure and panel packaging device Download PDFInfo
- Publication number
- CN109436569A CN109436569A CN201811570094.0A CN201811570094A CN109436569A CN 109436569 A CN109436569 A CN 109436569A CN 201811570094 A CN201811570094 A CN 201811570094A CN 109436569 A CN109436569 A CN 109436569A
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- Prior art keywords
- buffer
- substrate tablet
- escape groove
- protrusion
- buffer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims description 121
- 230000003139 buffering effect Effects 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 4
- 230000003111 delayed effect Effects 0.000 claims 1
- 238000013461 design Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- BCAARMUWIRURQS-UHFFFAOYSA-N dicalcium;oxocalcium;silicate Chemical compound [Ca+2].[Ca+2].[Ca]=O.[O-][Si]([O-])([O-])[O-] BCAARMUWIRURQS-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Buffer Packaging (AREA)
Abstract
The invention provides a buffer structure, which is clamped between two panels, wherein each panel comprises a display end and a circuit board, a convex part is arranged on each circuit board, and the buffer structure comprises: a first buffer sheet having a first avoidance portion for avoiding the convex portion; the second buffer sheet is arranged on the first buffer sheet and is provided with a second avoidance part for avoiding the convex part; and the third buffer sheet is arranged on the second buffer sheet. The invention also provides a panel packaging device which comprises a box body and a plurality of the buffer structures arranged in the box body, wherein the plurality of the buffer structures are arranged in a stacked mode. The buffer structure provided by the invention can avoid elements and connectors on the circuit board, so that the stacking heights of the stacked panel end and the circuit board end are the same, the number of stacked panels is increased, and the conveying cost is reduced.
Description
Technical field
The invention belongs to display packing technical fields, are to be related to a kind of buffer structure and panel package dress more specifically
It sets.
Background technique
Currently, panel industry commonly uses the shipment mode of foam box dress panel, by taking liquid crystal display panel as an example, liquid crystal display panel is logical
Cross the COF (Chip On Flex, or, Chip On Film, flip chip) and PCB (Printed Circuit of side
Board, printed circuit board) it is connected, wherein there is the component and connector of various height, some connectors are higher on circuit board
Cause the height at panel circuit board end when stacking to be greater than the height at panel end, causes circuit board end to tilt or overturn, even
COF bending is caused to take off skin.
Summary of the invention
The purpose of the present invention is to provide a kind of buffer structures, to solve the skill that circuit board end height is excessive when panel stacks
Art problem.
To achieve the above object, the technical solution adopted by the present invention is that: provide a kind of buffer structure, be held on two pieces of faces
Between plate, the panel includes display end and circuit board, and the circuit board is equipped with protrusion, and the buffer structure includes:
First buffer substrate tablet has the first relief portion for avoiding the protrusion；
Second buffer substrate tablet is set on first buffer substrate tablet, has the second relief portion for avoiding the protrusion；
Third buffer substrate tablet is set on second buffer substrate tablet.
Optionally, the protrusion includes the first protrusion with the first height, with the second protrusion of the second height and tool
There is the third protrusion of third height；First relief portion is for avoiding first protrusion, the second protrusion and third protrusion, institute
Stating the second relief portion has for avoiding second protrusion and third protrusion, the third buffer substrate tablet for avoiding the third
The third relief portion of protrusion；
Wherein, first height is less than second height, and second height is less than the third height.
Optionally, the length of first buffer substrate tablet and third buffer substrate tablet is less than the length of second buffer substrate tablet, described
First buffer substrate tablet and third buffer substrate tablet end between the circuit board and the display end close to one end of the circuit board
Any position.
Optionally, first buffer substrate tablet and third buffering chip architecture are identical and be symmetrically set in second buffer substrate tablet
Opposite sides, second buffer substrate tablet is for covering the display end, the circuit board and for connecting the display end
And the flip chip of the circuit board, first buffer substrate tablet and the third buffer substrate tablet are for covering the display end and described
Flip chip.
Optionally, first relief portion includes three the first escape groove, and second relief portion includes three second and keeps away
Allow slot, the third relief portion includes three third escape groove；
Wherein, first first escape groove, first second escape groove and first third evacuation
Slot perforation；
Second first escape groove, second second escape groove and second third escape groove are passed through
It is logical；
Third first escape groove, third second escape groove and the third third escape groove are passed through
It is logical.
Optionally, first relief portion includes three the first escape groove, and second relief portion includes two second and keeps away
Allow slot, the third relief portion includes a third escape groove；
Wherein, first first escape groove, first second escape groove and the third escape groove penetrate through；
Second first escape groove is penetrated through with second second escape groove.
Optionally, first buffer substrate tablet for there is first buffer layer with the side of the panel attachment, described the
Three buffer substrate tablets are used to have second buffer layer with the side of the panel attachment.
Optionally, the first buffer layer is in tooth form, and the second buffer layer is in tooth form.
Optionally, first buffer substrate tablet, second buffer substrate tablet and the third buffer substrate tablet are made of foamed material.
The present invention also provides a kind of panel packing device, including cabinet and to be set to the case intracorporal multiple above-mentioned
Buffer structure, multiple buffer structures are stacked.
The beneficial effect of buffer structure provided by the invention is: buffer structure of the invention passes through the first buffer substrate tablet, the
The design of two buffer substrate tablets and third buffer substrate tablet, the first buffer substrate tablet have the first relief portion for avoiding protrusion, the second buffer substrate tablet
With the second relief portion for avoiding protrusion, in this way, in vanning, when placing a buffer structure between two panels, then
First relief portion can avoid protrusion, and the second relief portion can also avoid protrusion, so that upper layer circuit board will not be by lower circuit
The protrusion of plate is padded, and the stack height of heap poststack display end and circuit board is identical, thus prevent circuit board end tilt or
Person's overturning, it is therefore prevented that COF (Chip On Flex, or, Chip On Film) bends or takes off skin, and then increases the heap of panel
Lamination number reduces shipment and delivery cost.In addition, the setting of panel packing device of the invention by above-mentioned buffer structure, so that using
When the panel packing device package panel, panel stacking is smooth, increases panel and stacks the piece number, reduces shipment and delivery cost.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the structural schematic diagram of buffer structure provided in an embodiment of the present invention；
Fig. 2 is the detailed schematic of Fig. 1 buffer structure；
Fig. 3 be another embodiment of the present invention provides buffer structure structural schematic diagram；
Fig. 4 is the structural schematic diagram for the buffer structure that yet another embodiment of the invention provides.
Wherein, each appended drawing reference in figure:
1- buffer structure；2- panel；11 (11a, 11b)-the first buffer substrate tablets；12 (12a, 12b)-the second buffer substrate tablets；13
(13a, 13b)-third buffer substrate tablet；2- panel；21- display end；22- circuit board；23- flip chip；The first protrusion 221-；
The second protrusion 222-；223- third protrusion；110 (110a, 110b)-the first relief portion；111- first buffer layer；120(120a,
120b) the-the second relief portion；130 (130a, 130b)-third relief portion；131- second buffer layer；1101a (1101b)-the first
Escape groove；The-the second escape groove of 1201a (1201b)；1301a (1301b)-third escape groove.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
Also referring to Fig. 1 and Fig. 2, now buffer structure 1 provided by the invention is illustrated.The buffer structure 1 is used for
It is held between two pieces of panels 2 to have the function that buffering.Panel 2 includes display end 21, circuit board 22 and flip chip 23, is covered
Brilliant film 23 is connected between display end 21 and circuit board 22.There is the protrusions such as component and connector, buffering knot on circuit board
Structure 1 includes the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13, and the first buffer substrate tablet 11 has for avoiding protrusion
First relief portion 110, the second buffer substrate tablet 12 are set on the first buffer substrate tablet 11, and the second buffer substrate tablet 12 has for avoiding protrusion
Two relief portion 120, third buffer substrate tablet 13 are set on the second buffer substrate tablet 12.In the present embodiment, in vanning, referring to Fig. 1, the
One buffer substrate tablet 11 is bonded with following panel 2, and third buffer substrate tablet 13 is bonded with panel 2 above.
Buffer structure 1 of the invention passes through the design of the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13,
First buffer substrate tablet 11 has the first relief portion 110 for avoiding protrusion, and the second buffer substrate tablet 12 has for avoiding protrusion
Two relief portion 120, in this way, when placing a buffer structure 1 between two panels 2, then the first relief portion 110 can in vanning
To avoid protrusion, the second relief portion 120 can also avoid protrusion, so that upper layer circuit board 22 will not be by the convex of lower circuit plate 22
Portion is padded, and heap poststack display end 21 and the stack height of circuit board 22 are identical, thus prevent 22 end of circuit board tilt or
Person's overturning, it is therefore prevented that COF (Chip On Flex, or, Chip On Film) bends or takes off skin, and then increases the heap of panel 2
Lamination number reduces shipment and delivery cost.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the invention, raised part includes tool
There are the first protrusion 221, the second protrusion 222 with the second height and the third protrusion 223 with third height of the first height.
First relief portion 110 is used for for avoiding the first protrusion 221, the second protrusion 222 and third protrusion 223, the second relief portion 120
The second protrusion 222 and third protrusion 223 are avoided, third buffer substrate tablet 13 has third relief portion 130, and third relief portion 130 is used for
Avoid third protrusion 223, wherein the first height is less than the second height, and the second height is less than third height, in this way, making circuit
The first protrusion 221, the second protrusion 222 and third protrusion 223 on plate 22 with different height stratum can be avoided, so that
Upper layer circuit board 22 will not be padded by the protrusion of lower circuit plate 22, and heap poststack display end 21 and the stack height of circuit board 22 are
It is identical.
Specifically, above-mentioned first relief portion 110 is groove structure or through slot structure referring to FIG. 1 to FIG. 4,；And/or second
Relief portion 120 is groove structure or through slot structure；And/or third relief portion 130 is groove structure or through slot structure.Pass through groove
Or the design of through slot, the first protrusion 221, the second protrusion 222 and third protrusion 223 are obtained while being avoided
Positioning, to guarantee that circuit board 22 and entire panel 2 stack and stablize.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first buffer substrate tablet
11 and third buffer substrate tablet 13 length less than the length of the second buffer substrate tablet 13, the first buffer substrate tablet 11 and third buffer substrate tablet 13 are close
One end of circuit board 22 ends in any position between circuit board 22 and display end 21.Specifically, the second buffer substrate tablet 12 is at least
Equal to the length of display end 21, circuit board 22 and flip chip 23, offered on second buffer substrate tablet 12 for avoiding second
First groove of protrusion 222 and third protrusion 223, the first buffer substrate tablet 11 and third buffer substrate tablet 13 are because being not covered in circuit board
So the first protrusion 221, the second protrusion 222 and third protrusion 223 can be avoided completely on 22, such as Fig. 1 on the first buffer substrate tablet 11
Left side forms above-mentioned first relief portion 110 with respect to the part of 12 shortage of the second buffer substrate tablet, likewise, as schemed on third buffer substrate tablet 13
The part third relief portion 130 of opposite second buffer substrate tablet, 12 shortage in 1 left side.The present embodiment is slow by the first buffer substrate tablet 11 and third
The design of the not covering board 22 of punching 13, so that entire buffer structure 1 is simple, it is at low cost；Meanwhile processing is not needed one by one
Groove so that its processing is simple, processing cost is low；In addition, there is no on the second buffer substrate tablet 12 on the position of covering board 22
The weight of three buffer substrate tablets 13 to prevent the second buffer substrate tablet 12 from deforming, and then prevents the second buffer substrate tablet 12 on circuit board 22
The extruding of first protrusion 221, and then achieve the effect that protect the first protrusion 221.
Optionally, referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first
Buffer substrate tablet 11 and 13 structure of third buffer substrate tablet are identical and be symmetrically set in the opposite sides of the second buffer substrate tablet 12, and the second buffer substrate tablet 12 is used
In cover plate 2, flip chip 23 and circuit board 22, the first buffer substrate tablet 11 and third buffer substrate tablet 13 for cover plate 2 and cover
Brilliant film 23.The present embodiment is symmetrically designed by the first buffer substrate tablet 11 and third buffer substrate tablet 13, so that 1 knot of buffer structure
Structure is simple, and manufacturing procedure is reduced, and processing cost is low.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first buffer substrate tablet
11, the second buffer substrate tablet 12 and third buffer substrate tablet 13 are all to be in tabular and be successively bonded setting, and flat design is so that first
It is completely embedded between buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13.
Optionally, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first buffer substrate tablet 11 with
Second buffer substrate tablet 12 is fixed by alite paste, and the second buffer substrate tablet 12 is fixed with third buffer substrate tablet 13 also by alite paste, by viscous
Patch is fixed to enable to fixation between the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13, and fitting is close
It is seamless.
Referring to Fig. 2, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first buffer substrate tablet
11 have first buffer layer 111, and first buffer layer 111, which is located on the first buffer substrate tablet 11, is used for the side that is bonded with panel 2, and first
Buffer layer 111 is used to increase the resiliency of the first buffer substrate tablet 11, and third buffer substrate tablet 13 has second buffer layer 131, the second buffering
Layer 131 is located at the side on third buffer substrate tablet 13 for being bonded with panel 2, and second buffer layer 131 is for increasing third buffer substrate tablet
13 resiliency.The present invention is by the design of first buffer layer 111 and second buffer layer 131 so that the buffering of the buffer structure 1
Effect is more preferable, to reduce the cost of buffer structure 1.
Referring to Fig. 2, a kind of specific embodiment as buffer structure 1 provided by the invention, first buffer layer 111 are in
Tooth form, by the design of tooth form, so that the buffering effect of first buffer layer 111 is more preferable, likewise, above-mentioned second buffer layer 131
It also is in tooth form, so that the buffering effect of second buffer layer 131 is more preferable.Certainly, in other embodiments of the invention, according to
Actual conditions and specific requirement, above-mentioned first buffer layer 111 and second buffer layer 131 can also wavy or other special-shaped knots
Structure does not do unique restriction herein.
Optionally, a kind of specific embodiment as buffer structure 1 provided by the invention, above-mentioned first buffer substrate tablet 11,
Second buffer substrate tablet 12 and third buffer substrate tablet 13 are made of foamed material, and foamed material light weight, pliability is good, have buffering,
The advantages that sound-absorbing and shock-absorbing, will not damage panel 2 and battery plate plate, while sound-absorbing is suitable so that 1 buffering effect of buffer structure is fine
Close transport.Certainly, in other embodiments of the invention, according to the actual situation and specific requirement, above-mentioned foamed material can also be adopted
It is made of other materials such as foam, foams, does not do unique restriction herein.
The present invention also provides a kind of panel packing devices, including cabinet and multiple buffer structures 1, buffer structure 1 to be set to
In cabinet, multiple buffer structures 1 are stacked.Panel packing device of the invention by the setting of above-mentioned buffer structure 1 so that
When using the panel packing device package panel 2, panel 2 stack it is smooth, increase panel 2 stack the piece number, reduce shipment and delivery cost.
In another embodiment of the invention, referring to Fig. 3, above-mentioned first relief portion 110a, the second relief portion 120a and
Third relief portion 130a structure is identical, and the first relief portion 110a can avoid the first protrusion 221, the second protrusion 222 and third simultaneously
Protrusion 223, the second relief portion 120a can avoid the first protrusion 221, the second protrusion 222 and third protrusion 223, third evacuation simultaneously
Portion 130a can avoid the first protrusion 221, the second protrusion 222 and third protrusion 223 simultaneously.The present embodiment passes through the first relief portion
110a, 120 a of the second relief portion and the identical design of third relief portion 130a structure, so that the first relief portion 110a, second keeping away
Make the machining tool and processing program of 120 a of portion and third relief portion 130a structure identical, so that overtime work cost is reduced, in addition,
First relief portion 110a, the second relief portion 120a and third relief portion 130a structure are identical so that the first buffer substrate tablet 11a, second slow
Punching 12a and third buffer substrate tablet 13a structure are identical, so that the structure of entire buffer structure 1 is simple, the processing is simple, cost
It reduces.
Specifically, referring to Fig. 3, the first relief portion 110a includes three first escape groove 1101a, the second relief portion 120a
It include three third escape groove 1301a including three the second escape groove 1201a, third relief portion 130a；Wherein, first first
Escape groove 1101a, first the second escape groove 1201a and first third escape groove 1301a perforation；Second first evacuation
Slot 1101a, second the second escape groove 1201a and second third escape groove 1301a perforation；The first escape groove of third
The the second escape groove 1201a and third third escape groove 1301a perforation of 1101a, third.Certainly, in of the invention other
In embodiment, according to the actual situation and specific requirement, only there is the second protrusion 222 and third protrusion 223 on foregoing circuit plate 23,
Or the first protrusion 221 and three third protrusions 223, even other situations there are two tools, above-mentioned first escape groove 1101a,
The quantity of second escape groove 1201a and third escape groove 1301a also corresponding change.
Optionally, in the present embodiment, because of the first buffer substrate tablet 11a, the second buffer substrate tablet 12a and third buffer substrate tablet 13a structure
It is identical, then the first buffer substrate tablet 11a, the second buffer substrate tablet 12a and 1 3a of third buffer substrate tablet can be integrally formed, i.e., entire buffering knot
The total buffer piece that structure 1a is one, the first protrusion 221, the second protrusion 222 and third protrusion 223 can be avoided thereon simultaneously by having
Total relief portion, total relief portion can be the through slot for being opened in total buffer piece, certainly, in other embodiments of the invention, according to
Actual conditions and specific requirement, above-mentioned total relief portion can also be other structures, not do unique restriction herein.
In one more embodiment of the present invention, referring to Fig. 4, the first relief portion 110b includes three the first escape groove
1101b, the second relief portion 120b include two the second escape groove 1201b, and third relief portion 130b includes a third escape groove
1301b；Wherein, first the first escape groove 1101b, first the second escape groove 1201b and third escape groove 1301b are penetrated through；
Second the first escape groove 1101b and second the second escape groove 1201b are penetrated through.Certainly, in other embodiments of the invention,
According to the actual situation and specific requirement, only there is the second protrusion 222 and third protrusion 223 on foregoing circuit plate 23, or has
Two the first protrusions 221 and three third protrusions 223, even other situations, above-mentioned first escape groove 1101b, the second evacuation
The quantity of slot 1201b and third escape groove 1301b also corresponding change.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. buffer structure is held between two pieces of panels, the panel includes display end and circuit board, and the circuit board is equipped with
Protrusion, which is characterized in that the buffer structure includes:
First buffer substrate tablet has the first relief portion for avoiding the protrusion；
Second buffer substrate tablet is set on first buffer substrate tablet, has the second relief portion for avoiding the protrusion；
Third buffer substrate tablet is set on second buffer substrate tablet.
2. buffer structure as described in claim 1, which is characterized in that the protrusion includes first with the first height convex
Portion, the second protrusion with the second height and the third protrusion with third height；First relief portion is described for avoiding
First protrusion, the second protrusion and third protrusion, second relief portion are described for avoiding second protrusion and third protrusion
Third buffer substrate tablet has the third relief portion for avoiding the third protrusion；
Wherein, first height is less than second height, and second height is less than the third height.
3. buffer structure as claimed in claim 2, which is characterized in that the length of first buffer substrate tablet and third buffer substrate tablet is small
In the length of second buffer substrate tablet, first buffer substrate tablet and third buffer substrate tablet end in institute close to one end of the circuit board
State any position between circuit board and the display end.
4. buffer structure as claimed in claim 3, which is characterized in that first buffer substrate tablet and the third buffer chip architecture
Opposite sides that is identical and being symmetrically set in second buffer substrate tablet, second buffer substrate tablet is for covering the display end, described
Circuit board and flip chip for connecting the display end and the circuit board, first buffer substrate tablet and the third are slow
Punching is for covering the display end and the flip chip.
5. buffer structure as claimed in claim 2, which is characterized in that first relief portion includes three the first escape groove,
Second relief portion includes three the second escape groove, and the third relief portion includes three third escape groove；
Wherein, first first escape groove, first second escape groove and first third escape groove are passed through
It is logical；
Second first escape groove, second second escape groove and second third escape groove perforation；
Third first escape groove, third second escape groove and the third third escape groove perforation.
6. buffer structure as claimed in claim 2, which is characterized in that first relief portion includes three the first escape groove,
Second relief portion includes two the second escape groove, and the third relief portion includes a third escape groove；
Wherein, first first escape groove, first second escape groove and the third escape groove penetrate through；
Second first escape groove is penetrated through with second second escape groove.
7. buffer structure as described in claim 1, which is characterized in that first buffer substrate tablet is used for and the panel attachment
Side there is first buffer layer, the third buffer substrate tablet for there is second buffer layer with the side of the panel attachment.
8. buffer structure as claimed in claim 7, which is characterized in that the first buffer layer is in tooth form, second buffering
Layer is in tooth form.
9. buffer structure as claimed in any one of claims 1 to 8, which is characterized in that first buffer substrate tablet, described second are delayed
Punching and the third buffer substrate tablet are made of foamed material.
10. a kind of panel packing device, which is characterized in that including cabinet and to be set to the case intracorporal multiple as right is wanted
1 to 9 described in any item buffer structures are sought, multiple buffer structures are stacked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811570094.0A CN109436569A (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811570094.0A CN109436569A (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109436569A true CN109436569A (en) | 2019-03-08 |
Family
ID=65533411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811570094.0A Pending CN109436569A (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packaging device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109436569A (en) |
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| CN104991369A (en) * | 2015-08-06 | 2015-10-21 | 京东方科技集团股份有限公司 | Display module and display device |
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| CN209225776U (en) * | 2018-12-21 | 2019-08-09 | 惠科股份有限公司 | Buffer structure and panel packaging device |
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| US20170256404A1 (en) * | 2016-03-02 | 2017-09-07 | Xiamen Changelight Co., Ltd. | Buffer Layers Having Composite Structures |
| CN206395206U (en) * | 2017-01-04 | 2017-08-11 | 深圳市华辰信科电子有限公司 | Diode lights protective cover is used in one kind transport |
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