CN109415811B

CN109415811B - Composition for forming plated layer, substrate with plated layer, conductive thin film, touch panel sensor, and touch panel

Info

Publication number: CN109415811B
Application number: CN201780039495.0A
Authority: CN
Inventors: 松冈知佳; 塚本直树
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2016-08-19
Filing date: 2017-08-15
Publication date: 2021-01-29
Anticipated expiration: 2037-08-15
Also published as: TWI732024B; WO2018034291A1; KR20190016071A; KR102144643B1; JPWO2018034291A1; CN109415811A; TW201840901A; JP6727309B2

Abstract

The invention provides a composition for forming a plated layer, a substrate with a plated layer, a conductive film, a touch panel sensor and a touch panel, wherein a metal layer can be formed on the composition by plating treatment and the plated layer with excellent stretchability can be formed. The composition for forming a plating layer of the present invention comprises: an amide compound selected from the group consisting of a multifunctional acrylamide having a polyoxyalkylene group and a multifunctional methacrylamide having a polyoxyalkylene group; and a polymer having a functional group that interacts with the plating catalyst or a precursor thereof.

Description

Composition for forming plated layer, substrate with plated layer, conductive thin film, touch panel sensor, and touch panel

Technical Field

The invention relates to a composition for forming a plated layer, a substrate with a plated layer, a conductive thin film, a touch panel sensor and a touch panel.

Background

A conductive thin film (substrate with a metal layer) in which a metal layer (preferably a patterned metal layer) is disposed on a substrate is used in various applications. For example, in recent years, with an increase in the mounting rate of touch panels for mobile phones, portable game machines, and the like, there has been a rapidly increasing demand for conductive films for capacitive touch sensors that can perform multi-point detection.

Various methods for producing a conductive thin film have been proposed, and for example, a method using plating treatment has been proposed. More specifically, patent document 1 discloses a method of forming a plating layer using a plating layer forming composition containing polyacrylic acid and N, N' -methylenebis (acrylamide) as a 2-functional monomer, and forming a metal layer on the formed plating layer by plating treatment.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2009 and 218509

Disclosure of Invention

Technical problem to be solved by the invention

On the other hand, recently, a conductive thin film having a three-dimensional shape is required.

For example, in order to further improve the operability, a touch panel having a three-dimensional shape such as a curved surface is required for a touch surface, and a conductive thin film having a three-dimensional shape is used for a touch panel sensor included in such a touch panel.

The present inventors formed a plating layer using the composition for forming a plating layer described in patent document 1, deformed the plating layer, and then performed a plating treatment to form a conductive thin film having a three-dimensional shape. However, the stretchability of the plated layer is insufficient, and it is difficult to deform the plated layer into a desired shape.

In view of the above circumstances, an object of the present invention is to provide a composition for forming a plated layer, which can form a metal layer thereon by plating treatment and can form a plated layer having excellent stretchability.

Another object of the present invention is to provide a plated layer, a substrate with a plated layer, a conductive thin film, a touch panel sensor, and a touch panel.

Means for solving the technical problem

The present inventors have conducted extensive studies to solve the above problems, and as a result, have found that the above problems can be solved by using a predetermined amide compound and a polymer having a predetermined functional group.

That is, the present inventors have found that the above problems can be solved by the following configuration.

(1) A composition for forming a plating layer, comprising: an amide compound selected from the group consisting of a multifunctional acrylamide having a polyoxyalkylene group and a multifunctional methacrylamide having a polyoxyalkylene group; and

a polymer having a functional group that interacts with the plating catalyst or a precursor thereof.

(2) The composition for forming a plated layer according to (1), wherein,

the ratio of the mass of the polymer to the mass of the amide compound is greater than 0.25.

(3) The composition for forming a plating layer according to (1) or (2), further comprising a fluorine-based surfactant.

(4) The composition for forming a plated layer according to any one of (1) to (3),

the polymer has a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof.

(5) The composition for forming a plated layer according to any one of (1) to (4),

the amide compound is a compound represented by the formula (1) described later.

(6) The composition for forming a plating layer according to any one of (1) to (5), further comprising a polymerization initiator.

(7) A plating layer obtained by curing the plating layer forming composition according to any one of (1) to (6).

(8) A substrate with a plated layer, which comprises a substrate and the plated layer of (7) disposed on the substrate.

(9) The coated substrate according to (8), wherein,

the plated layer is arranged in a pattern on the substrate.

(10) The coated substrate according to (8) or (9), wherein,

the substrate has a three-dimensional shape.

(11) A conductive thin film comprising the substrate with a plated layer according to any one of (8) to (10) and a metal layer disposed on the plated layer of the substrate with a plated layer.

(12) A touch panel sensor comprising the conductive thin film of (11).

(13) A touch panel comprising the touch panel sensor of (12).

Effects of the invention

According to the present invention, it is possible to provide a composition for forming a plated layer, which can form a metal layer thereon by plating treatment and can form a plated layer having excellent stretchability.

Further, according to the present invention, a plated layer, a substrate with a plated layer, a conductive thin film, a touch panel sensor, and a touch panel can be provided.

Drawings

Fig. 1 is a plan view of a substrate having a mesh-like plated layer.

Fig. 2 is a perspective view of an embodiment of a substrate with a plated layer having a three-dimensional shape.

Detailed Description

The present invention will be described in detail below.

In the present specification, the numerical range represented by "to" means a range in which the numerical values before and after "to" are included as the lower limit value and the upper limit value. The drawings in the present invention are schematic views for facilitating understanding of the present invention, and the relationship between the thicknesses of the respective layers, the positional relationship, and the like are not necessarily consistent with reality.

One of the characteristics of the composition for forming a plating layer of the present invention is that an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group is used (hereinafter, this compound is also referred to simply as "polyfunctional (meth) acrylamide"). By using the polyfunctional (meth) acrylamide, plating deposition on the surface of the plated layer is ensured, and the stretchability of the plated layer is improved.

By using the polyfunctional (meth) acrylamide, resistance against a plating catalyst liquid can be imparted to a plating target. For example, when a plating target obtained by using a (meth) acrylate instead of a polyfunctional (meth) acrylamide is brought into contact with an alkaline solution such as a plating catalyst solution, the plating target is likely to be detached from a substrate to be plated or the plating target itself is likely to be decomposed due to the decomposition of an ester group.

The term (meth) acrylate is a generic name for both acrylates and methacrylates.

The composition for forming a plating layer of the present invention contains a polyfunctional (meth) acrylamide and a polymer having a functional group that interacts with a plating catalyst or a precursor thereof.

Hereinafter, various components contained in the composition for forming a plated layer will be described in detail.

< amide Compound >

The composition for forming a plating layer contains an amide compound selected from the group consisting of a polyfunctional acrylamide having a polyoxyalkylene group and a polyfunctional methacrylamide having a polyoxyalkylene group.

The multifunctional acrylamide contains 2 or more acrylamide groups. The number of acrylamide groups in the polyfunctional acrylamide is not particularly limited, but is preferably 2 to 10, more preferably 2 to 5, and still more preferably 2.

The multifunctional methacrylamide comprises more than 2 methacrylamides. The number of the methacrylamide in the polyfunctional methacrylamide is not particularly limited, but is preferably 2 to 10, more preferably 2 to 5, and still more preferably 2.

The acrylamide group and the methacrylamide group are groups represented by the following formulae (a) and (B), respectively. Denotes a bonding site.

[ chemical formula 1]

R in the above formulae (A) and (B)₃The definition of (2) and R in the formula (1) described later₃The same definition is applied.

The polyfunctional acrylamide and the polyfunctional methacrylamide each have a polyoxyalkylene group.

The polyoxyalkylene group means a group having an oxyalkylene group as a repeating unit. As the polyoxyalkylene group, a group represented by the formula (C) is preferred.

Formula (C) - (A-O)_m-

A represents an alkylene group. The number of carbon atoms in the alkylene group is not particularly limited, but is preferably 1 to 4, more preferably 2 to 3. For example, when A is an alkylene group having a carbon number of 1, - (A-O) -represents an oxymethylene group (-CH)₂O-), wherein when A is an alkylene group having 2 carbon atoms, - (A-O) -represents an oxyethylene group (-CH)₂CH₂O-), wherein when A is an alkylene group having 3 carbon atoms, - (A-O) -represents a propylene oxide group (-CH)₂CH(CH₃)O-、-CH(CH₃)CH₂O-or-CH₂CH₂CH₂O-). The alkylene group may be linear or branched.

m represents the number of repetition of oxyalkylene groups and is an integer of 2 or more. The number of repetitions is not particularly limited, but is preferably 2 to 10, and more preferably 2 to 6.

The alkylene groups in the plural oxyalkylene groups may have the same or different carbon numbers. For example, in the formula (C), a plurality of repeating units represented by- (a-O) -are contained, and the number of carbons in the alkylene group in each repeating unit may be the same or different. For example, - (A-O)_mIn (1), canContains oxymethylene and oxypropylene groups.

When a plurality of oxyalkylene groups are contained, the bonding order is not particularly limited, and may be random or block.

Among them, from the viewpoint of further improving the stretchability of the plated layer, a preferable embodiment of the amide compound is a compound represented by formula (1).

In formula (1), a and m are as defined above for formula (C).

[ chemical formula 2]

In the formula (1), R₁And R₂Each independently represents a hydrogen atom or a methyl group.

R₃And R₄Each independently represents a hydrogen atom or a substituent. The kind of the substituent is not particularly limited, and known substituents (for example, aliphatic hydrocarbon groups and aromatic hydrocarbon groups which may contain hetero atoms, more specifically, alkyl groups and aryl groups) may be mentioned.

L₁And L₂Each independently represents a single bond or a 2-valent linking group.

The type of the 2-valent linking group is not particularly limited, and examples thereof include a 2-valent hydrocarbon group (which may be a 2-valent saturated hydrocarbon group, or a 2-valent aromatic hydrocarbon group, the 2-valent saturated hydrocarbon group may be linear, branched or cyclic, and preferably has 1 to 20 carbon atoms, for example, an alkylene group, and the 2-valent aromatic hydrocarbon group preferably has 5 to 20 carbon atoms, for example, a phenylene group, and in addition thereto, an alkenylene group, an alkynylene group, a 2-valent heterocyclic group, -O-, -S-, -SO₂-、-NR₁₀-、-CO-(-C(＝O)-)、-COO-(-C(＝O)O-)、-NR₁₀-CO-、-CO-NR₁₀-、-SO₃-、-SO₂NR₁₀And a group obtained by combining two or more of them. Wherein R is₁₀Represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms).

The hydrogen atom in the above-mentioned 2-valent linking group may be substituted with another substituent such as a halogen atom.

As a preferred embodiment of the compound represented by the formula (1), a compound represented by the formula (2) can be mentioned.

[ chemical formula 3]

R in the formula (2)₁、R₂A and m are as defined for each group in formula (1).

L₃And L₄Each independently represents-O-, an alkylene group having 1 to 4 carbon atoms, a group represented by the formula (D), or a 2-valent linking group combining these groups.

[ chemical formula 4]

In the formula (D), R₁Represents a hydrogen atom or a methyl group.

Denotes a bonding site.

The amide compounds can be synthesized by a method described in technical publication No. 2013-502654, and various commercially available products can be used.

The content of the amide compound in the composition for forming a plating layer is not particularly limited, but is often 10 to 90% by mass based on the total solid content, and is preferably 15 to 85% by mass based on the total solid content from the viewpoint of further suppressing the viscosity of a precursor layer of a plating layer to be described later, and is more preferably 25 to 75% by mass, and still more preferably 35 to 65% by mass from the viewpoint of excellent balance between the stretchability of a plating layer and the plating deposition property.

In the present specification, the solid component means a component constituting the plating layer and does not contain a solvent. In addition, if the component constituting the plating layer is a liquid, the component is contained in a solid component.

< Polymer having functional group interacting with plating catalyst or precursor thereof >

The composition for forming a plating layer contains a polymer having a functional group (hereinafter, also simply referred to as "interactive group") that interacts with a plating catalyst or a precursor thereof.

The interactive group is a functional group capable of interacting with a plating catalyst or a precursor thereof to be applied to a plating layer, and examples thereof include a functional group capable of forming an electrostatic interaction with the plating catalyst or the precursor thereof, and a nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group capable of forming a coordination with the plating catalyst or the precursor thereof.

Examples of the interactive group include nitrogen-containing functional groups such as amino groups, amide groups, imide groups, urea groups, tertiary amino groups, ammonium groups, amidino groups, triazine groups, triazole groups, benzotriazole groups, imidazole groups, benzimidazole groups, quinoline groups, pyridine groups, pyrimidine groups, pyrazine groups, quinazoline groups, quinoxaline groups, purine groups, triazine groups, piperidine groups, piperazine groups, pyrrolidine groups, pyrazole groups, aniline groups, groups having an alkylamine structure, groups having an isocyanuric acid structure, nitro groups, nitroso groups, azo groups, diazo groups, azide groups, cyano groups, and cyanate groups; oxygen-containing functional groups such as ether groups, hydroxyl groups, phenolic hydroxyl groups, carboxylic acid groups, carbonate groups, carbonyl groups, ester groups, groups having an N-oxide structure, groups having an S-oxide structure, and groups having an N-hydroxyl structure; sulfur-containing functional groups such as thienyl, thiol, thioureido, trithiocyanato, benzothiazolyl, thiotriazinyl, a thioether group, a sulfoxy group, a sulfoxide group, a sulfite group, a group containing a sulfoximine structure, a group containing a sulfoxonium salt structure, a sulfonic group, and a group containing a sulfonate structure; phosphorus-containing functional groups such as phosphate groups, phosphoramide groups, phosphine groups, and groups containing a phosphate ester structure; examples of the functional group that can adopt a salt structure include a group containing a halogen atom such as a chlorine atom and a bromine atom, and salts of these functional groups can be used.

Among them, from the viewpoint of high polarity and high adsorption energy to a plating catalyst or a precursor thereof, a polar group such as a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a boric acid group, or a cyano group is preferable, and a carboxylic acid group or a cyano group is more preferable.

The polymer may have two or more interactive groups.

The weight average molecular weight of the polymer is not particularly limited, but is preferably 1000 to 700000, more preferably 2000 to 200000, from the viewpoint of further excellent handling properties.

The polymer preferably contains a repeating unit having an interactive group.

As a preferable embodiment of the repeating unit having an interactive group, a repeating unit represented by the formula (E) can be mentioned.

[ chemical formula 5]

In the formula (E), R₅Represents a hydrogen atom or an alkyl group (e.g., methyl group, ethyl group, etc.).

L₅Represents a single bond or a 2-valent linking group. Definition of 2-valent linking group with L of formula (1)₁And L₂The 2-valent linking groups are as defined.

X represents an interactive group. The definition of the interactive group is as described above.

Another preferable embodiment of the repeating unit having an interactive group includes a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof.

The unsaturated carboxylic acid is an unsaturated compound having a carboxylic acid group (-COOH group). Examples of the derivative of the unsaturated carboxylic acid include an anhydride of the unsaturated carboxylic acid, a salt of the unsaturated carboxylic acid, and a monoester of the unsaturated carboxylic acid.

Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, itaconic acid, and citraconic acid.

The content of the repeating unit having an interactive group in the polymer is not particularly limited, and is preferably 1 to 100 mol%, more preferably 10 to 100 mol%, based on the total repeating unit, from the viewpoint of the balance between the stretchability of the plating layer and the plating deposition property.

A preferable embodiment of the polymer is a polymer X having a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof, in view of easily forming a plating layer with a small energy application amount (for example, exposure amount).

The description of the repeating unit derived from the unsaturated carboxylic acid or its derivative is as described above.

The conjugated diene compound is not particularly limited as long as it has a molecular structure containing 2 carbon-carbon double bonds separated by 1 single bond.

Examples of the conjugated diene compound include isoprene, 1, 3-butadiene, 1, 3-pentadiene, 2, 4-hexadiene, 1, 3-heptadiene, 2, 4-heptadiene, 1, 3-octadiene, 2, 4-octadiene, 3, 5-octadiene, 1, 3-nonadiene, 2, 4-nonadiene, 3, 5-nonadiene, 1, 3-decadiene, 2, 4-decadiene, 3, 5-decadiene, 2, 3-dimethyl-butadiene, 2-methyl-1, 3-pentadiene, 3-methyl-1, 3-pentadiene, 4-methyl-1, 3-pentadiene, 2-phenyl-1, 3-butadiene, 2-phenyl-1, 3-pentadiene, 3-phenyl-1, 3-pentadiene, 2, 3-dimethyl-1, 3-pentadiene, 4-methyl-1, 3-pentadiene, 2-hexyl-1, 3-butadiene, 3-methyl-1, 3-hexadiene, 2-benzyl-1, 3-butadiene, 2-p-tolyl-1, 3-butadiene and the like.

Among them, from the viewpoint of easy synthesis of the polymer X and further excellent properties of the plating layer, the repeating unit derived from the conjugated diene compound is preferably a repeating unit derived from a compound having a butadiene skeleton represented by the following formula (3).

[ chemical formula 6]

In the formula (3), R₆Each independently represents a hydrogen atom, a halogen atom or a hydrocarbon group. The hydrocarbon group includes aliphatic hydrocarbon groups (e.g., alkyl groups, alkenyl groups, etc.), and is preferably an aliphatic hydrocarbon groupThe number of carbon atoms is 1 to 12. ) And aromatic hydrocarbon groups (e.g., phenyl, naphthyl, etc.). ). Having a plurality of R₆May be the same as or different from each other.

Examples of the compound having a butadiene skeleton represented by the formula (3) (monomer having a butadiene structure) include 1, 3-butadiene, isoprene, 2-ethyl-1, 3-butadiene, 2-n-propyl-1, 3-butadiene, 2, 3-dimethyl-1, 3-butadiene, 1-phenyl-1, 3-butadiene, 1- α -naphthyl-1, 3-butadiene, 1- β -naphthyl-1, 3-butadiene, 2-chloro-1, 3-butadiene, 1-bromo-1, 3-butadiene, 1-chloroprene, 2-fluoro-1, 3-butadiene, 2, 3-dichloro-1, 3-butadiene, butadiene-styrene copolymer, butadiene styrene copolymer, 1,1, 2-trichloro-1, 3-butadiene, 2-cyano-1, 3-butadiene and the like.

The content of the repeating unit derived from the conjugated diene compound in the polymer X is preferably 25 to 75 mol% with respect to the total repeating units.

The content of the repeating unit derived from the unsaturated carboxylic acid or a derivative thereof in the polymer X is preferably 25 to 75 mol% based on the total repeating units.

The content of the polymer in the composition for forming a plating layer is not particularly limited, and is usually 10 to 90% by mass based on the total solid content, but is preferably 15 to 85% by mass based on the total solid content from the viewpoint of further suppressing the viscosity of a precursor layer of a plating layer to be described later, and is more preferably 25 to 75% by mass, and still more preferably 35 to 65% by mass from the viewpoint of excellent balance between the stretchability of a plating layer and the plating deposition property.

The ratio of the mass of the polymer to the mass of the amide compound (mass of the polymer/mass of the amide compound) is not particularly limited, but is usually 0.1 to 10, and is preferably more than 0.25, more preferably more than 0.25 and less than 8, from the viewpoint of further suppressing the viscosity of the precursor layer to be plated, and is more preferably 0.3 to 3, particularly preferably 0.4 to 1.5, from the viewpoint of excellent balance between the stretchability of the to be plated layer and the plating deposition property.

< optional component >

The composition for forming a plating layer may contain other components in addition to the amide compound and the polymer. Hereinafter, the optional components will be described in detail.

(surfactant)

The composition for forming a plating layer may contain a surfactant.

The type of the surfactant is not particularly limited, and examples thereof include fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants. Among these, from the viewpoint of further suppressing the adhesion of the coating precursor layer, a fluorine-based surfactant or a silicone-based surfactant is preferable, and a fluorine-based surfactant is more preferable.

The surfactant may be used alone, or two or more thereof may be used in combination.

Examples of the fluorine-based surfactant include W-AHE, W-AHI (manufactured by Fuji film Corporation), MEGAFACE F171, MEGAFACE F, MEGAFACE F173, MEGAFACE F, MEGAFACE F, MEGAFACE F, MEGAFACE F, MEGAFACE F, MEGAFACE F, MEGAFACE R30, MEGAFACE F437, MEGAFACE F475, MEGAFACE F479, MEGAFACE F482, MEGAFACE F, MEGAFACE F569, MEGAFACE F, MEGAFACE F781F (manufactured by DIC CORPORATION), Fluorad FC430, Fluorad FC431, Fluorad FC171 (manufactured by Sumitomo 3M Limited), Surflon S-382, Surflon SC-101, Surflon SC-103, Surflon SC-104, Surflon SC-KH105, Surflon SC1068, Surflon SC-383, Surflon SC-103, Surflon S-65656, Surflon S-6520, and SOL PF 29, and the like (manufactured by SUOMO 3M Corporation), and the like.

The content of the surfactant in the composition for forming a plating layer is not particularly limited, but is preferably 0.005 to 0.5% by mass, more preferably 0.01 to 0.2% by mass, and still more preferably 0.01 to 0.1% by mass, based on 100% by mass of the total amount of the composition for forming a plating layer.

(polymerization initiator)

The composition for forming a plating layer may contain a polymerization initiator.

The kind of the polymerization initiator is not particularly limited, and a known polymerization initiator (preferably, photopolymerization initiator) can be mentioned. Examples of the polymerization initiator include benzophenones, acetophenones, α -aminoalkylbenzophenones, benzoins, ketones, thioxanthones, benzyl groups, benzyl ketals, oxime esters, bisacylphosphine oxides, acylphosphine oxides, anthraquinones, and azo compounds.

The content of the polymerization initiator in the composition for forming a plating layer is not particularly limited, but is preferably 0.1 to 20% by mass, and more preferably 0.5 to 10% by mass, based on 100% by mass of the compound having a polymerizable group in the composition for forming a plating layer.

(solvent)

The composition for forming a plating layer may contain a solvent.

The kind of the solvent is not particularly limited, and water and an organic solvent are exemplified. Examples of the organic solvent include known organic solvents (for example, alcohol solvents, ester solvents, ketone solvents, halogen solvents, hydrocarbon solvents, and the like).

The composition for forming a plating layer may contain other components (for example, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, particles, a flame retardant, a lubricant, a plasticizer, a plating catalyst, or a precursor thereof) as needed.

The method for producing the composition for forming a plating layer is not particularly limited, and a known method can be used. For example, a method of mixing the above components together or a method of mixing the components in stages may be mentioned.

< plated layer and method for producing the same >

The coating layer can be formed using the coating layer-forming composition. The plating layer is a layer subjected to a plating treatment described later, and a metal layer is formed on the surface thereof by the plating treatment.

The method for producing the plated layer preferably includes the following steps.

Step 1: forming a coating precursor layer on a substrate by bringing the substrate into contact with a coating-forming composition

And a step 2: a step of forming a plating layer by curing the plating layer precursor layer

The above steps 1 and 2 will be described in detail below.

Step 1 is a step of bringing a substrate into contact with a composition for forming a plating layer to form a precursor layer of the plating layer on the substrate. By performing this step, a substrate with a plated precursor layer, which has a substrate and a plated precursor layer disposed on the substrate, can be obtained.

The plating precursor layer is a layer in an uncured state before the curing treatment is performed.

The type of the substrate used is not particularly limited, and known substrates (for example, resin substrates, glass substrates, ceramic substrates, and the like) can be used. Among them, a resin substrate is preferable in terms of excellent stretchability.

If necessary, a primer layer for improving adhesion between the plating target and the substrate may be disposed on the substrate.

The method of bringing the substrate into contact with the composition for forming a plating layer is not particularly limited, and examples thereof include a method of coating the composition for forming a plating layer on the substrate and a method of immersing the substrate in the composition for forming a plating layer.

After the substrate is brought into contact with the composition for forming a plating layer, if necessary, a drying treatment may be performed to remove the solvent from the plating layer precursor layer.

Step 2 is a step of forming a plating layer by applying a curing treatment to the plating layer precursor layer.

The method of the curing treatment is not particularly limited, and heating treatment and exposure treatment (light irradiation treatment) may be mentioned. Among them, the exposure process is preferable in terms of finishing the process in a short time. By the curing treatment, the polymerizable group contained in the compound in the plating precursor layer is activated, and crosslinking with the compound occurs, thereby curing the layer.

In addition, when the curing treatment (particularly, exposure treatment) is performed, the curing treatment may be performed in a pattern so that a desired pattern of the plated layer is obtained. For example, it is preferable to perform exposure processing using a mask having an opening with a predetermined shape. The plating precursor layer subjected to the curing process in a pattern is subjected to a developing process, thereby forming a patterned plating layer.

The method of the development treatment is not particularly limited, and the optimum development treatment is performed depending on the kind of the material used. Examples of the developing solution include an organic solvent, pure water, and an aqueous alkali solution.

By the above method, the plating layer obtained by curing the plating layer forming composition is disposed on the substrate. That is, a substrate with a plated layer having a substrate and a plated layer disposed on the substrate can be obtained.

The average thickness of the plating layer is not particularly limited, but is preferably 0.05 to 100. mu.m, more preferably 0.07 to 10 μm, and still more preferably 0.1 to 3 μm.

The average thickness is an average value obtained by observing a vertical cross section of the plating layer with an electron microscope (for example, a scanning electron microscope), measuring the thickness at any 10 positions, and arithmetically averaging these.

The plated layer may be formed in a pattern. For example, the plated layer may be formed in a mesh shape. In fig. 1, a mesh-like plated layer 12 is disposed on a substrate 10.

The size of the line width W of the fine line portion constituting the mesh of the plating layer 12 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 5 μm or less, preferably 0.5 μm or more, and more preferably 1.0 μm or more, from the viewpoint of the balance between the conductive properties and the invisibility of the metal layer formed on the plating layer.

In fig. 1, the opening 14 has a substantially rhombic shape, but is not limited to this shape, and may have another polygonal shape (for example, a triangle, a quadrangle, a hexagon, or a random polygon). Further, one side may be curved or arcuate, instead of being linear. In the case of the arc shape, for example, the two opposing sides may be arc shapes protruding outward, and the other two opposing sides may be arc shapes protruding inward. The shape of each side may be a wavy line in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be sinusoidal.

The length L of one side of the opening 14 is not particularly limited, but is preferably 1500 μm or less, more preferably 1300 μm or less, further preferably 1000 μm or less, preferably 5 μm or more, more preferably 30 μm or more, and further preferably 80 μm or more. When the length of one side of the opening is in the above range, the conductive film described later is more excellent in transparency.

The substrate with plated layer may be deformed to form a substrate with plated layer having a three-dimensional shape. That is, by deforming the substrate with plated layer, a substrate with plated layer (substrate with plated layer having a three-dimensional shape) having a substrate with a three-dimensional shape and a plated layer (or patterned plated layer) disposed on the substrate can be obtained.

As described above, the plating layer obtained by curing the plating layer forming composition has excellent stretchability, and can change its shape in accordance with the deformation of the substrate.

The method of deforming the substrate with a plated layer is not particularly limited, and examples thereof include known methods such as vacuum forming, blow forming, free blow forming, press forming, vacuum-press forming, and hot press forming.

For example, as shown in fig. 2, the substrate 20 may be formed by deforming a part of the substrate into a hemispherical shape to have a hemispherical shape. In fig. 2, the plating layer is not shown.

In addition, although the above description has been given of the mode of imparting a three-dimensional shape, the strip-coated substrate may be subjected to a stretching treatment such as uniaxial stretching or biaxial stretching to deform the shape.

In addition, although the above description has been made on the method of deforming the substrate with a plated layer, the method is not limited to this method, and the substrate with a plated layer having a three-dimensional shape may be obtained by performing the step 2 after deforming the substrate with a plated layer precursor layer.

In the above description, the patterned plated layer is formed by applying the curing treatment to the plating precursor layer in a pattern, but the present invention is not limited to this embodiment, and the patterned plated layer can be formed by arranging the plating precursor layer in a pattern on the substrate and applying the curing treatment to the patterned plating precursor layer. In addition, as a method of arranging the plating precursor layer in a pattern, for example, a method of applying a composition for forming a plating layer to a predetermined position on the substrate by screen printing or inkjet may be mentioned.

< conductive thin film and method for producing the same >

By applying a plating treatment to the plating layer of the substrate with a plating layer, a metal layer can be formed on the plating layer. In particular, when the plated layer is disposed on the substrate in a pattern, a metal layer (pattern-like metal layer) is formed along the pattern.

The method of forming the metal layer is not particularly limited, and it is preferable to perform, for example, the step 3 of applying a plating catalyst or a precursor thereof to the plating target layer and the step 4 of performing a plating treatment on the plating target layer to which the plating catalyst or the precursor thereof is applied.

The steps of step 3 and step 4 will be described in detail below.

Step 3 is a step of applying a plating catalyst or a precursor thereof to the plating layer. Since the coating layer contains the interactive group, the interactive group adheres (adsorbs) to the given coating catalyst or its precursor depending on its function.

The plating catalyst or its precursor functions as a catalyst or an electrode for the plating treatment. Therefore, the kind of the plating catalyst or the precursor thereof used may be appropriately determined by the kind of the plating treatment.

The plating catalyst or precursor thereof is preferably an electroless plating catalyst or precursor thereof.

The electroless plating catalyst is not particularly limited as long as it is an active nucleus in electroless plating, and examples thereof include metals having catalytic activity from a catalytic reduction reaction (referred to as metals capable of electroless plating with a lower ionization tendency than Ni). Specific examples thereof include Pd, Ag, Cu, Pt, Au, and Co.

As the electroless plating catalyst, metal colloids can be used.

The electroless plating catalyst precursor is not particularly limited as long as it becomes an electroless plating catalyst by a chemical reaction, and examples thereof include ions of metals listed as the electroless plating catalyst.

Examples of the method of applying the plating catalyst or the precursor thereof to the plating target include a method of preparing a solution by dispersing or dissolving the plating catalyst or the precursor thereof in a solvent and applying the solution to the plating target, and a method of immersing the substrate with the plating target in the solution.

Examples of the solvent include water and an organic solvent.

Step 4 is a step of applying a plating treatment to the plating layer to which the plating catalyst or the precursor thereof is applied.

The method of the plating treatment is not particularly limited, and examples thereof include electroless plating treatment and electrolytic plating treatment (electroplating treatment). In this step, the electroless plating treatment may be performed alone, or the electrolytic plating treatment may be further performed after the electroless plating treatment.

Hereinafter, the steps of the electroless plating treatment and the electrolytic plating treatment will be described in detail.

The electroless plating treatment is a treatment of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as plating are melted.

As the step of the electroless plating treatment, for example, it is preferable to remove an excess electroless plating catalyst by washing the substrate with a plating layer to which the electroless plating catalyst is applied with water, and then immersing the substrate in an electroless plating bath. As the electroless plating bath used, a known electroless plating bath can be used.

In addition, in addition to a solvent (e.g., water), a metal ion for plating, a reducing agent, and an additive (stabilizer) for improving the stability of the metal ion are mainly contained in a general electroless plating bath.

When the plating catalyst or the precursor thereof applied to the plating layer has a function as an electrode, the plating layer to which the catalyst or the precursor thereof is applied can be subjected to electrolytic plating treatment.

Further, as described above, after the electroless plating treatment, an electrolytic plating treatment can be performed as necessary. In this manner, the thickness of the metal layer to be formed can be appropriately adjusted.

While the embodiment of performing step 3 has been described above, step 3 may not be performed when the plating layer contains a plating catalyst or a precursor thereof.

By performing the above-described treatment, a metal layer can be formed on the plated layer. That is, a conductive thin film including a substrate with a plated layer and a metal layer disposed on the plated layer of the substrate with a plated layer can be obtained.

In addition, by disposing the patterned plated layer on the substrate in accordance with the shape of the patterned metal layer to be formed, a conductive thin film having a patterned metal layer with a desired shape can be obtained. For example, in order to obtain a grid-like metal layer, a grid-like plated layer may be formed.

When the plating-coated substrate having a three-dimensional shape is used and the above-described steps 3 and 4 are performed, a conductive thin film having a three-dimensional shape can be obtained.

The conductive thin film obtained by the above-described steps (particularly, a conductive thin film having a three-dimensional shape) can be applied to various applications. For example, the present invention can be applied to various applications such as a touch panel sensor, a semiconductor wafer, an FPC (Flexible printed circuit), a COF (Chip on Film), a TAB (Tape Automated Bonding), an antenna, a multilayer wiring board, and a motherboard. Among them, the present invention is preferably used for a touch panel sensor (particularly, a capacitive touch panel sensor). When the conductive thin film is applied to a touch panel sensor, the patterned metal layer functions as a detection electrode or a lead line in the touch panel sensor. Such a touch panel sensor can be preferably applied to a touch panel.

The conductive film can also be used as a heat generating element. For example, when a current is applied to the patterned metal layer, the temperature of the patterned metal layer rises and the patterned metal layer functions as a heating wire.

The wiring pattern of the three-dimensional portion of the conductive thin film having a three-dimensional shape is deformed and the substrate becomes thinner than before molding. As a result, when the conductive film having the patterned metal layers on both surfaces and the three-dimensional shape is used as a touch panel sensor, the Δ Cm value of the portion where the area of the patterned metal layer as the wiring pattern is enlarged becomes small, and the Δ Cm value becomes large while the substrate becomes thin.

Therefore, in the present invention, the above-described problem can be solved by setting the range of Δ Cm for each address.

In addition to the above-described corresponding method, for example, a method of adjusting the arrangement position of the patterned metal layer before molding so that the Δ Cm value after molding becomes substantially constant in the plane in consideration of the degree of deformation of the patterned metal layer during molding may be used.

Further, by changing the thickness of the coating film superimposed on the patterned metal layer in the conductive thin film having a three-dimensional shape, the Δ Cm value can be made substantially constant in the plane.

Further, these methods can be combined and used.

In order to improve the self-supporting property of the conductive thin film having a three-dimensional shape, insert molding may be used. For example, a conductive film having a three-dimensional shape may be placed in a mold, and a resin layer may be deposited on the conductive film by filling the mold with a resin. Further, after the plating-coated substrate before the plating treatment is applied with a three-dimensional shape, the plating-coated substrate having a three-dimensional shape is placed in a mold, and resin is filled into the mold, and the plating treatment is applied to the obtained laminate, whereby a conductive thin film having excellent self-supporting properties can be produced.

When the conductive film having a three-dimensional shape is decorated, for example, the decoration film may be bonded to the conductive film having a three-dimensional shape while being molded. Specifically, the molding can be performed by a TOM (Three dimension Overlay Method).

Further, the conductive thin film having a three-dimensional shape can be directly coated and decorated.

Further, a decorative layer may be provided on the front surface and/or the back surface of the substrate before the formation of the plating precursor layer. When the plating precursor layer is disposed on one surface of the substrate, a decorative layer may be formed on the other surface of the substrate, or a decorative film may be bonded thereto.

The conductive thin film having a three-dimensional shape can be decorated by molding or insert molding using a decorative film.

Examples

Hereinafter, the present invention will be described in further detail with reference to examples, but the present invention is not limited thereto.

< example 1 >

(preparation of composition 1 for Forming coating layer)

The following components were mixed to obtain a composition 1 for forming a plating layer.

[ chemical formula 7]

(production of conductive film)

Z913-3 (manufactured by Aica Kogyo co., ltd.) was coated on a substrate to form a primer layer having a thickness of 0.8 μm on the substrate (manufactured by TEIJIN limited PC (polycarbonate) film, PANLITE PC, thickness 125 μm), and then UV (ultraviolet) was irradiated to the obtained coating film to cure the coating film to form a primer layer.

Next, composition 1 for forming a plated layer was applied on the primer layer so as to form a plated layer precursor layer having a thickness of 0.9 μm on the obtained primer layer, thereby obtaining a substrate with a plated layer precursor layer.

Next, a plating precursor layer was exposed to a metal halide light source through a quartz mask having a predetermined opening pattern so as to form a mesh-like plating layer having a thin line portion width of 1 μm and an opening side length of 150 μm (0.2J). Then, the exposed plating precursor layer was subjected to shower cleaning with water at room temperature, and development treatment was performed to obtain a substrate having a grid-like plating layer (substrate with a pattern-like plating layer) (see fig. 1). The thickness of the plated layer was 0.9. mu.m.

Next, the mold having the hemispherical concave portion was heated for 1 hour or more in an oven adjusted to 180 ℃. After the temperature of the mold was raised to 180 ℃, the mold was taken out from the oven, and the substrate with the pattern-like plated layer was attached to the mold with a heat-resistant tape so as to cover the opening of the concave portion. The mold was quickly returned to the oven and after the mold was left to stand for 30 seconds, vacuum was pulled from the air holes at the bottom of the hemispherical recesses for 5 seconds to obtain a coated substrate having a hemispherical shape (see fig. 2).

Next, the obtained substrate with a plated layer was immersed in an aqueous solution of sodium carbonate 1 mass% for 5 minutes at room temperature, and the taken-out substrate with a plated layer was washed twice with pure water. Subsequently, after immersing in pure water for 5 minutes, the substrate was immersed in a Pd catalyst-imparting solution (Omni shield 1573 activator, manufactured by Rohm and Haas Electronic Materials) for 5 minutes at 30 ℃, and then the taken-out substrate with the plating layer was washed twice with pure water. Next, the resulting substrate with a plated layer was immersed in a reducing solution (circupait P13 oxide converter 60C, manufactured by Rohm and Haas Electronic Materials) at 30 ℃ for 5 minutes, and then the substrate with a plated layer taken out was washed twice with pure water. Next, the obtained substrate with a plated layer was immersed in an electroless plating solution (circusait 4500, manufactured by Rohm and Haas Electronic Materials K.K) at 45 ℃ for 15 minutes, and then the taken substrate with a plated layer was washed with pure water to obtain a conductive film having a mesh-shaped metal layer (pattern-shaped metal layer).

Other 4 kinds of conductive films were obtained by performing the same procedure as described above except that the quartz mask having a predetermined opening pattern was changed to set the width of the thin line portion of the mesh-like plated layer to 1 μm to 2 μm, 3 μm, 4 μm, or 5 μm.

< example 2 >

A conductive thin film was obtained by the same procedure as in example 1, except that the composition for forming a plated layer 2 was used instead of the composition for forming a plated layer 1.

(preparation of composition 2 for formation of plating layer)

The following components were mixed to obtain a composition 2 for forming a plating layer.

< example 3 >

A conductive thin film was obtained by the same procedure as in example 1, except that the composition for forming a plated layer 3 was used instead of the composition for forming a plated layer 1.

(preparation of composition for Forming plated layer 3)

The following components were mixed to obtain a composition 3 for forming a plating layer.

< example 4 >

A conductive film was obtained by the same procedure as in example 1, except that a 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used instead of the 25 mass% aqueous solution of polyacrylic acid, and the amount of the copolymer used was adjusted so that the mass ratio of the polymer to the polyfunctional (meth) acrylamide was the same as that in example 1.

< example 5 >

A conductive film was obtained by the same procedure as in example 2, except that a 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used instead of the 25 mass% aqueous solution of polyacrylic acid, and the amount of the copolymer used was adjusted so that the mass ratio of the polymer to the polyfunctional (meth) acrylamide was the same as that in example 2.

< example 6 >

A conductive film was obtained by the same procedure as in example 3, except that a 42 mass% aqueous solution of a butadiene-maleic acid copolymer (manufactured by Polyscience) was used instead of the 25 mass% aqueous solution of polyacrylic acid, and the amount of the copolymer used was adjusted so that the mass ratio of the polymer to the polyfunctional (meth) acrylamide was the same as that in example 3.

< example 7 >

A conductive thin film was obtained by following the same procedure as in example 1, except that 0.04 parts by mass of compound B (F-780F, manufactured by DIC CORPORATION) (fluorine-based surfactant) was further added to the composition 1 for forming a plating layer.

< example 8 >

An electrically conductive thin film was obtained in the same manner as in example 1, except that 0.04 parts by mass of compound C (F-569, manufactured by DIC CORPORATION) (fluorine-based surfactant) was further added to the composition 1 for forming a plating layer.

< example 9 >

A conductive thin film was obtained by the same procedure as in example 1, except that the composition 4 for forming a plated layer was used instead of the composition 1 for forming a plated layer.

(preparation of composition 4 for formation of plating layer)

The following components were mixed to obtain a composition 4 for forming a plating layer.

< comparative example 1 >

A conductive film was obtained by following the same procedure as in example 1, except that N, N' -methylenebis (acrylamide) was used instead of compound a, and the amount of the compound a used was adjusted so that the mass ratio of the polymer to the polyfunctional (meth) acrylamide was the same as that in example 1.

< various evaluations >

The following evaluations were carried out using the substrate with a plated precursor layer, the substrate with a patterned plated layer, and the conductive thin film having a patterned metal layer obtained in the above examples and comparative examples. The results are summarized and shown in table 1 described later.

(stretchability)

The substrate to be plated with a patterned tape obtained in the above examples and comparative examples was stretched using a Tensilon universal materials testing machine (manufactured by Shimadzu Corporation). Specifically, a substrate with a patterned plated layer having a mesh-like plated layer with a width of 4 μm at a thin line portion was stretched in a heating environment of 160 ℃, a range of 1cm × 1cm of the substrate with the patterned plated layer was observed, a stretching ratio was measured in the range until the number of broken line portions of the plated layer became 5, and the stretching ratio was evaluated based on the following criteria.

"A": over 200 percent

"B": more than 175 percent and less than 200 percent

"C": more than 150 percent and less than 175 percent

"D": less than 150 percent

(plating deposition Property)

The conductive thin films having the patterned metal layers obtained in the above examples and comparative examples were observed and evaluated according to the following criteria.

"A": even when the thin line part is plated in any grid shape with the width of 1-5 μm, the metal layer is formed

"B": the metal layer is formed even when an arbitrary grid-like plating subject having a width of 2 to 5 [ mu ] m of the thin line parts is used, but when a grid-like plating subject having a width of 1 [ mu ] m of the thin line parts is used, the metal layer is formed to such an extent that there is no problem in practical use, but a region where the metal layer is not formed is present in a part of the plating subject.

"C": in any mode of the thin line part with the width of 1-5 μm of the grid-shaped plated layer, the metal layer is not formed

(Wiring Forming Property)

The range of 2.5cm × 2.5cm of the substrate with the patterned plated layer obtained in the above examples and comparative examples was observed with the naked eye, and evaluated according to the following criteria.

"A": the patterned plated layer is formed at a predetermined position, and the patterned plated layer can be easily observed.

"B": the patterned plated layer is formed at a predetermined position, but the thickness of the patterned plated layer is small and is slightly difficult to observe.

"C": some of the patterned plated layer is not formed at a predetermined position, but the patterned plated layer is formed at a position 50% or more of the region to be plated of the patterned plated layer.

"D": the patterned plated layer is formed only at a position less than 50% of a region of the patterned plated layer where the patterned plated layer is to be formed.

(tackiness)

The surface of the precursor layer to be plated of the substrate with the precursor layer to be plated obtained in the above examples and comparative examples was evaluated by touching with a finger through a laminate film (QS62, manufactured by solar energy INDUSTRIES, inc.).

"A": the plated precursor layer does not adhere to the film even if strongly pressed.

"B": when strongly pressed, the layer of the precursor to be plated is bonded to the film, but the layer of the precursor to be plated is not bonded to the film only by lightly touching the layer of the precursor to be plated through the film.

"C": the plating precursor layer is bonded to the film only by lightly touching the plating precursor layer with the film interposed therebetween.

In table 1, "polymer: the "amide compound (mass ratio)" indicates the mass ratio of the polymer to the amide compound.

[ Table 1]

As shown in table 1, the desired effects were obtained by using the composition for forming a plating layer containing the predetermined components.

Among them, as shown in examples 4 to 6, when the polymer has a repeating unit derived from a conjugated diene compound and a repeating unit derived from an unsaturated carboxylic acid or a derivative thereof, it is confirmed that the wiring formability is further excellent.

Further, as shown in examples 7 and 8, when a fluorine-based surfactant was used, it was confirmed that the tackiness was improved.

Further, when the ratio of the mass of the polymer to the mass of the amide compound is more than 0.25 as compared with example 9 and example 3, it is confirmed that the tackiness is improved.

< example 10 >

A conductive thin film having a three-dimensional shape and a patterned metal layer (wiring pattern) on both surfaces was obtained by the same procedure as in example 1 except that a mask was formed so as to correspond to a driving pattern of a True TOUCH Evaluation kit CYTK58 (manufactured by Cypress Semiconductor corporation, Integrated Circuit (IC))) and plating layers were formed on both surfaces of the substrate to form a patterned metal layer (wiring pattern).

(composite treatment (anti-rust treatment and anti-migration treatment))

The conductive thin film 10 was immersed in an aqueous solution (mixed treatment solution) containing 1 mass% of a rust inhibitor (johaku CHEMICAL co., LTD, BT-120) and 1,2, 3-triazole, respectively, and then the conductive thin film 10 taken out of the mixed treatment solution was washed with water.

After the lead wiring portion of the conductive film 10 was covered and immersed in a hard coating liquid (UVHC 5000, manufactured by Momentive Performance Materials inc.), the conductive film 10 coated with the hard coating liquid was UV-irradiated (4000mJ) to form a hard coating layer on both main surfaces of the conductive film 10.

As a result of producing a sensor film by pressing a True TOUCH Evaluation kit CYTK58 on the conductive film 10 having the hard coat layer with FPC and confirming the driving of the sensor film, the driving was performed without any problem although there was a variation in Δ Cm.

< example 11 >

A sensor film was produced by the same method as in example 10, and the range of Δ Cm was individually set at the time of driving so as to reduce the variation in Δ Cm, and the driving of the sensor film was confirmed, and as a result, the driving was performed without any problem.

< example 12 >

A sensor film was produced by the same method as in example 10, except that a mask in which the arrangement position of the patterned metal layer was taken into consideration, such as reducing the variation of Δ Cm in the surface, was used after the molding. As a result of checking the driving of the obtained sensor film, the variation in Δ Cm was suppressed even in a portion having a high degree of stretching.

< example 13 >

A sensor film was produced in the same manner as in example 10, and a resin layer having a predetermined thickness was laminated on the sensor film by insert molding so that the in-plane Δ Cm value became a constant value. As a result of confirming the driving of the obtained laminate, Δ Cm was substantially uniform in the plane and was driven without any problem.

< example 14 >

A sensor film was produced in the same manner as in example 10, and a decorative film was attached to the sensor film by the TOM molding method. The obtained laminate was confirmed to be driven without any problem.

< example 15 >

A sensor film was produced in the same manner as in example 10, and the sensor film was decorated by spray coating. As a result of confirming the driving of the decorated sensor film, the driving was performed without any problem.

< example 16 >

A sensor film was produced in the same manner as in example 10, and a pattern was transferred to the sensor film using the transfer film. As a result of confirming the driving of the sensor film to which the pattern has been transferred, the driving was performed without any problem.

< example 17 >

A sensor thin film was produced in the same manner as in example 10, and the sensor thin film was placed in a mold and molded using a decorative film. The obtained laminate was confirmed to be driven without any problem.

< example 18 >

A sensor thin film was produced in the same manner as in example 10, and the sensor thin film was placed in a mold and insert-molded using a decorative film. The obtained laminate was confirmed to be driven without any problem.

< example 19 >

A sensor film was produced in the same manner as in example 10 except that a decorative layer was disposed on one surface of the substrate before the primer layer was formed, and driving was performed without any problem as a result of checking driving of the sensor film.

< example 20 >

A sensor film was produced in the same manner as in example 10 except that a decorative layer was laminated on one surface of the substrate before the primer layer was formed, and driving of the sensor film was confirmed without any problem.

< example 21 >

A conductive film having a three-dimensional shape (hereinafter, also simply referred to as "conductive film 21") was obtained in the same manner as in example 1, except that a mask prepared so as to correspond to a driving pattern of an electrostatic touch sensor that can be driven by a patterned metal layer disposed only on surface 1 was used, and a patterned metal layer was disposed only on one surface of the substrate. Next, the conductive thin film 21 is subjected to a composite treatment (rust prevention treatment and migration prevention treatment) and a hard coat treatment.

The conductive film 21 having the hard coat layer was connected to a 1-sided electrostatic touch sensor motherboard ADFCS01 (manufactured by ltd) (hereinafter, also referred to as FPC pressure bonding) to prepare a sensor film, and driving of the sensor film was confirmed without any problem.

< example 22 >

A sensor film was produced in the same manner as in example 21, except that a mask in which the arrangement position of the patterned metal layer was taken into consideration, such as reducing the variation in-plane resistance value, was used after molding. As a result of checking the drive of the obtained sensor film, the touch drive was performed without variation even at a portion having a high degree of stretching.

< example 23 >

A sensor film was produced in the same manner as in example 21, and a decorative film was attached to the sensor film by the TOM molding method. The obtained laminate was confirmed to be driven without any problem.

< example 24 >

A sensor film was produced in the same manner as in example 21, and the sensor film was decorated by spray coating. As a result of confirming the driving of the decorated sensor film, the driving was performed without any problem.

< example 25 >

A sensor film was produced in the same manner as in example 21, and a pattern was transferred to the sensor film using a transfer film. As a result of confirming the driving of the sensor film to which the pattern has been transferred, the driving was performed without any problem.

< example 26 >

A sensor thin film was produced in the same manner as in example 21, and the sensor thin film was placed in a mold and molded using a decorative film. The obtained laminate was confirmed to be driven without any problem.

< example 27 >

A sensor thin film was produced in the same manner as in example 21, and the sensor thin film was placed in a mold and insert-molded using a decorative film. The obtained laminate was confirmed to be driven without any problem.

< example 28 >

A sensor film was produced in the same manner as in example 21 except that a decorative layer was disposed on one surface of the substrate before the primer layer was formed, and driving was performed without any problem as a result of checking driving of the sensor film.

< example 29 >

A sensor film was produced in the same manner as in example 21 except that a decorative layer was laminated on one surface of the substrate before the primer layer was formed, and driving of the sensor film was confirmed without any problem.

< example 30 >

A film having a plating layer patterned was produced by the same method as in example 21, the film having the plating layer patterned was disposed in a mold so that the plating layer became the mold side, and molding was performed using a decorative film. After the obtained laminate was subjected to plating treatment, rust prevention treatment, hard coat treatment, and FPC pressure bonding were performed to produce a sensor film, and driving of the sensor film was confirmed, and thus driving was performed without any problem.

< example 31 >

A film having a patterned plated layer was produced in the same manner as in example 21, and the film having the patterned plated layer was disposed in a mold so that the plated layer was on the mold side, and insert-molded using a decorative film. After the obtained laminate was subjected to plating treatment, rust prevention treatment, hard coat treatment, and FPC pressure bonding were performed to produce a sensor film, and driving of the sensor film was confirmed, and thus driving was performed without any problem.

< example 32 >

A film having a patterned plated layer was produced in the same manner as in example 21, and the film having the patterned plated layer was disposed in a mold so that the plated layer was on the mold side, followed by insert molding. After the obtained laminate was subjected to plating treatment, rust prevention treatment, hard coat treatment, and FPC pressure bonding, a decorative film was further laminated by TOM molding to prepare a sensor film, and driving of the sensor film was confirmed without any problem.

< example 33 >

A film having a patterned plated layer was produced in the same manner as in example 21, and the film having the patterned plated layer was disposed in a mold so that the plated layer was on the mold side, followed by insert molding. After the obtained laminate was subjected to plating treatment, rust prevention treatment, hard coat treatment, and FPC pressure bonding, and further, the sensor film was produced by decoration by spray coating, and driving of the sensor film was confirmed without any problem.

Description of the symbols

10-substrate, 12-grid-like plated layer, 14-opening, 20-substrate with plated layer having hemispherical shape.

Claims

1. A composition for forming a plating layer, comprising:

an amide compound selected from the group consisting of a multifunctional acrylamide having a polyoxyalkylene group and a multifunctional methacrylamide having a polyoxyalkylene group; and

a polymer having a functional group that interacts with the plating catalyst or a precursor thereof,

wherein the polyfunctional acrylamide is a polyfunctional acrylamide containing 2 or more acrylamide groups,

the multifunctional methacrylamide comprises more than 2 methacrylamides,

the polyoxyalkylene group is a group represented by the formula (C),

formula (C): - (A-O)_m-

In the formula (C), A represents an alkylene group, m represents an integer of 2 or more,

the polymer comprises a repeating unit having an interactive group,

the ratio of the mass of the polymer to the mass of the amide compound is 0.1 to 10,

the content of the repeating unit having an interactive group in the polymer is 1 to 100 mol% based on the total repeating units of the polymer.

2. The composition for forming a plated layer according to claim 1,

3. The composition for forming a plated layer according to claim 1 or 2, further comprising a fluorine-based surfactant.

4. The composition for forming a plated layer according to claim 1 or 2,

5. The composition for forming a plated layer according to claim 1 or 2,

the amide compound is a compound represented by formula (1),

[ chemical formula 1]

In the formula (1), R₁And R₂Each independently represents a hydrogen atom or a methyl group, R₃And R₄Each independently represents a hydrogen atom or a substituent, L₁And L₂Each independently represents a single bond or a 2-valent linking group, A represents an alkylene group, and m represents an integer of 2 or more.

6. The composition for forming a plated layer according to claim 1 or 2, further comprising a polymerization initiator.

7. The composition for forming a plated layer according to claim 1 or 2, wherein the functional group that interacts with the plating catalyst or a precursor thereof is a functional group that can form an electrostatic interaction with the plating catalyst or a precursor thereof, or a nitrogen-containing functional group, a sulfur-containing functional group, and/or an oxygen-containing functional group that can form a coordination with the plating catalyst or a precursor thereof.

8. A plated layer obtained by curing the composition for forming a plated layer according to any one of claims 1 to 7.

9. A coated substrate having a substrate and the coated layer of claim 8 disposed on the substrate.

10. The coated substrate of claim 9,

the plated layer is arranged in a pattern on the substrate.

11. The coated substrate according to claim 9 or 10,

the substrate has a three-dimensional shape.

12. A conductive film comprising the substrate with a plated layer according to any one of claims 9 to 11 and a metal layer disposed on the plated layer in the substrate with a plated layer.

13. A touch panel sensor comprising the conductive thin film according to claim 12.

14. A touch panel containing the touch panel sensor of claim 13.