WO2018012203A1 - Wiring board production method and wiring board - Google Patents
Wiring board production method and wiring board Download PDFInfo
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- WO2018012203A1 WO2018012203A1 PCT/JP2017/022462 JP2017022462W WO2018012203A1 WO 2018012203 A1 WO2018012203 A1 WO 2018012203A1 JP 2017022462 W JP2017022462 W JP 2017022462W WO 2018012203 A1 WO2018012203 A1 WO 2018012203A1
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- wiring board
- mold
- plated
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Definitions
- the conductive film having a metal layer formed on a substrate is used for various purposes. For example, in recent years, with an increase in the rate of mounting touch panels on mobile phones or portable game devices, the demand for conductive films for capacitive touch panel sensors capable of multipoint detection is rapidly expanding.
- this invention makes it a subject to provide the manufacturing method of a wiring board which can manufacture more easily the wiring board formed by arrange
- Another object of the present invention is to provide a wiring board.
- a step A including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, and preparing two conductive films having a three-dimensional shape; a first mold and a second One of the conductive films is disposed on one of the molds, the other of the conductive films is disposed on the other of the first mold and the second mold, and the first mold The mold and the second mold are clamped, and a resin is injected into a mold cavity formed by the first mold and the second mold, and two conductive films are arranged via a resin layer.
- a process for producing a wiring board comprising: a process B for producing a wiring board that has been formed.
- the plated layer is obtained by curing the plated layer precursor layer formed by the composition for forming a plated layer containing the polymerization initiator and the following compound X or composition Y.
- the manufacturing method of the wiring board as described in [2].
- Step X1 is a step of forming a plated layer precursor layer containing a functional group that interacts with a plating catalyst or a precursor thereof on a substrate; The step of applying energy in a pattern form to the precursor layer to be plated through a photomask having an opening of the pattern, and developing the precursor layer to be plated after energy application,
- step B The method for manufacturing a wiring board according to any one of [1] to [5], wherein the resin is made of polycarbonate.
- step B one of the conductive films is disposed on one of the first mold and the second mold, and the other mold of the first mold and the second mold is disposed.
- the main surfaces on which the patterned metal layers of the two conductive films are disposed are respectively located on the mold cavity side, [1] to [1] to [6]
- Two conductive films each including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, two conductive films having a three-dimensional shape, and a resin layer.
- the patterned metal layers respectively provided in the two conductive films are arranged to face each other via the resin layer, and each patterned metal layer is in direct contact with the resin layer. 11].
- positioning two conductive films which have a three-dimensional shape facing each other can be provided.
- the wiring board which has the said characteristic can be provided.
- a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
- the drawings in the present invention are schematic diagrams for facilitating understanding of the invention, and the thickness relationship or positional relationship of each layer does not necessarily match the actual one.
- (meth) acryloyl intends acryloyl and / or methacryloyl.
- (meth) acryl intends acrylic and / or methacryl.
- Wiring board manufacturing method 1 In the method for manufacturing a wiring board according to the first embodiment of the present invention, two conductive films having a three-dimensional shape are arranged on two molds (first mold and second mold), respectively. A resin is injected into a mold cavity formed by the mold (hereinafter, the molding method is also referred to as “insert molding”). By injecting resin between the two conductive films facing each other by insert molding, air bubbles are not mixed between the two conductive films, and the wiring board can be manufactured more easily. Below, the procedure of each process is explained in full detail, referring drawings.
- Step A is a step of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
- preparation means that the conductive film is manufactured using raw materials described later, or is procured by a method such as simple purchase.
- the conductive film prepared in Step A includes a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
- the main surface means a surface having the largest area facing each other among the surfaces constituting the substrate, and typically corresponds to a surface facing the thickness direction of the substrate.
- FIG. 7 is a schematic view of a long substrate wound in a roll shape. As shown in FIG. 7, the long substrate 70 includes a main surface 71 (note that the main surface 71 and the opposite surface facing the thickness direction are also the other main surface).
- step A two conductive films are prepared.
- the two conductive films prepared may be the same or different.
- a pattern-like metal layer described later provided in two opposing conductive films has a vertical and horizontal two-dimensional matrix.
- the electrodes are arranged in a shape. Therefore, it is preferable that the patterns of the metal layers arranged on the two conductive films are different from each other.
- FIG. 1 one Embodiment of the electroconductive film prepared by this process is shown.
- FIG. 2A is a perspective view of an embodiment of the conductive film
- FIG. 1 is a cross-sectional view taken along the line AA.
- FIG. 2B is a partially enlarged view of the conductive film.
- the conductive film 10 includes a substrate 12 and a patterned metal layer 14 disposed on one main surface of the substrate 12, and partially includes It has a hemispherical three-dimensional shape.
- the substrate 12 has a hemispherical portion 12a and a flat portion 12b extending outward from the bottom of the hemispherical portion 12a, and the patterned metal layer 14 is mainly disposed on the hemispherical portion 12a. Moreover, as shown in FIG. 2B, the patterned metal layer 14 disposed on the hemispherical portion 12a is disposed on the outer surface of the hemispherical portion 12a.
- the conductive film has a three-dimensional shape (three-dimensional shape), this form Not limited.
- the three-dimensional shape include a three-dimensional shape containing a curved surface, and more specifically, a kamaboko shape, a corrugated shape, an uneven shape, and a cylindrical shape.
- the patterned metal layer 14 is disposed on the outer surface of the hemispherical portion 12a of the substrate 12, but is not limited to this form. For example, you may arrange
- FIG. 2C is a partially enlarged top view of the patterned metal layer 14, and the patterned metal layer 14 includes a plurality of fine metal wires 30 and includes a plurality of lattices 31 formed by intersecting metal fine wires 30. It has a mesh pattern.
- the line width of the fine metal wire 30 is not particularly limited, but is preferably 1000 ⁇ m or less, more preferably 500 ⁇ m or less, further preferably 300 ⁇ m or less, preferably 2 ⁇ m or more, and more preferably 10 ⁇ m or more.
- the thickness of the thin metal wire 30 is not particularly limited, but can be selected from 0.00001 to 0.2 mm from the viewpoint of conductivity, but is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, and further preferably 0.01 to 9 ⁇ m. 0.05 to 5 ⁇ m is particularly preferable.
- the lattice 31 includes an opening region surrounded by the thin metal wires 30.
- the length W of one side of the grating 31 is preferably 1500 ⁇ m or less, more preferably 1300 ⁇ m or less, further preferably 1000 ⁇ m or less, preferably 5 ⁇ m or more, more preferably 30 ⁇ m or more, and further preferably 80 ⁇ m or more.
- the lattice 31 has a substantially rhombus shape.
- other polygonal shapes for example, a triangle, a quadrangle, a hexagon, and a random polygon
- the shape of one side may be a curved shape or a circular arc shape in addition to a linear shape.
- the arc shape for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inwardly convex arc shape.
- the shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.
- the patterned metal layer 14 has a mesh pattern, but is not limited to this form.
- the substrate is not particularly limited as long as it has a main surface and supports the patterned metal layer.
- a flexible substrate preferably an insulating substrate
- a resin substrate is more preferable.
- the resin substrate material include polyether sulfone resin, polyacrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene naphthalate, etc.), polycarbonate resin, polysulfone resin, polyamide resin. , Polyarylate resin, polyolefin resin, cellulose resin, polyvinyl chloride resin, and cycloolefin resin. Of these, polycarbonate resins (more preferably polycarbonates) are preferable from the viewpoint of heat resistance after molding.
- the thickness (mm) of the substrate is not particularly limited, but is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of balance between handleability and thinning.
- a multilayer structure may be sufficient as a board
- substrate for example, you may contain a functional film as the one layer.
- the substrate itself may be a functional film.
- the type of metal constituting the patterned metal layer is not particularly limited, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper Gold or silver is preferable, and copper or silver is more preferable.
- the conductive film having a three-dimensional shape can be produced by a known method. Details will be described later.
- step B one of the conductive films is disposed on one of the first mold and the second mold capable of forming a mold cavity, and the process B includes the first mold and the second mold.
- the other conductive film is placed on the other mold, the first mold and the second mold are clamped, and the resin is placed in the mold cavity formed by the first mold and the second mold.
- the conductive film 10 is disposed (mounted) on each of the first mold 20 and the second mold 22.
- the conductive film 10 includes a substrate 12 and a patterned metal layer 14 on the main surface of the substrate.
- the first mold 20 and the second mold 22 are clamped and not shown in the mold cavity C formed by the first mold 20 and the second mold 22.
- Resin is injected from the injection port (injection injection).
- injection injection the resin is usually heated by a known heating means, and the molten resin is injected into the mold cavity C.
- the mold first mold and / or second mold
- the mold is cooled to solidify the resin, and the wiring board 24a, which is a molded body, is removed from the mold.
- the wiring board 24 a contains the conductive film 10, the resin layer 26, and the conductive film 10 in this order.
- the mold cavity is a space for forming a resin layer provided between the first mold and the second mold.
- the shape of the first mold 20 is concave and the shape of the second mold 22 is convex.
- the shape is not limited to this, and the three-dimensional shape (three-dimensional shape) of the conductive film 10 is not limited.
- the mold having the optimum shape is selected according to the shape. That is, a mold having a shape corresponding to the three-dimensional shape of the conductive film 10 is selected.
- the resulting wiring board 24a is obtained as follows: substrate 12 / patterned metal layer 14 / resin layer 26 / pattern.
- the metal layer 14 / substrate 12 is provided in this order. That is, the patterned metal layers 14 included in the two conductive films are arranged to face each other via the resin layer 26, and each patterned metal layer 14 is in direct contact with the resin layer 26. Yes.
- the substrate 12 functions as a protective layer for the patterned metal layer 14. Therefore, even if a protective layer for the patterned metal layer 14 is not separately provided, the wiring substrate 24a is scratch resistant. It has the feature that it is more excellent in performance.
- FIG. 6A and FIG. 6B the modification of arrangement
- the first mold 20 has the conductive film 10 with the main surface on which the patterned metal layer 14 is disposed on the mold side
- the second mold 22 has the patterned metal.
- the conductive film 10 is disposed with the main surface on which the layer 14 is disposed facing the mold cavity.
- FIG. 6B the first mold 20 is provided with the conductive film 10 with the main surface on which the patterned metal layer 14 is arranged on the mold cavity side, and the second mold 22 is provided with a pattern.
- the conductive film 10 is disposed with the main surface on which the metal layer 14 is disposed on the mold side.
- the type of resin injected (filled) into the mold cavity is not particularly limited, and a known resin can be used.
- a known resin can be used.
- polycarbonate resins are preferable.
- the material of the substrate and the resin injected into the mold cavity may be the same or different. If the material of the board and the resin injected into the mold cavity are the same resin, the thermal expansion coefficients (thermal linear expansion coefficient and thermal expansion coefficient) of both are equal, so the wiring board changes in temperature. Even if, for example, heat is generated by use, stress and strain due to the difference in thermal expansion coefficient are unlikely to occur. Since the stress and strain hardly occur, the durability of the wiring board is further improved.
- the substrate material and the resin injected into the mold cavity are preferably polycarbonate resins in terms of heat resistance after molding.
- the method for manufacturing a wiring board according to the above embodiment may include an optional step other than the step A and the step B within a range in which a desired effect is obtained.
- the optional step include a self-healing layer forming step and a hard coat layer forming step.
- the self-healing layer formation process is a process of forming a self-healing layer on the main surface of the substrate. This step can be performed before step A, after step A, and / or after step B.
- the self-healing layer is a layer having a function (self-healing property) in which a scratch attached to the surface of the layer self-heals.
- the self-repairing property is a function of making a scratch difficult by repairing the scratch by elastic recovery. More specifically, the surface of the layer is rubbed with a brass brush loaded with a load of 500 g. Immediately after that, when the presence of scratches is visually confirmed, it is intended that the scratches recover within 3 minutes after being scratched in an environment of 20 to 25 ° C.
- examples of the self-healing layer include a layer containing a resin having a soft segment and a hard segment.
- the soft segment acts to cushion the external force by acting as a cushion and functions to elastically recover the wound, and the hard segment functions to resist the external force.
- examples of the material contained in the self-healing layer include a urethane resin having a polycarbonate skeleton, a urethane resin having a polycaprolactone skeleton, a urethane resin having a polyester skeleton, and the like.
- the skeleton, the polycaprolactone skeleton, and the polyester skeleton function as a soft segment, and the urethane bond functions as a hard segment.
- the thickness of the self-healing layer is preferably 0.5 to 50 ⁇ m, more preferably 1 to 30 ⁇ m.
- the method for forming the self-healing layer is not particularly limited, and a known forming method can be used.
- a method for forming the self-healing layer for example, a composition for forming a self-healing layer containing the above-described material is applied onto the main surface of the substrate, and dried and / or cured as necessary. Examples include a method of bringing the substrate into contact with the composition for forming a repair layer (for example, a method of immersing).
- a hard-coat layer formation process is a process of forming a hard-coat layer on the main surface of an electroconductive film. This step can be performed after step A or after step B, and is preferably performed after step A.
- the hard coat layer is not particularly limited, and a known layer can be used.
- Examples of the hard coat layer include a layer obtained by polymerizing and curing a compound containing an unsaturated double bond, and a layer obtained by thermosetting using a sol-gel reaction.
- the thickness of the hard coat layer is preferably 0.4 to 35 ⁇ m, more preferably 1 to 30 ⁇ m, and further preferably 1.5 to 20 ⁇ m.
- the method for forming the hard coat layer is not particularly limited, and includes, for example, a compound containing an unsaturated double bond, and additives used as necessary (for example, a polymerization initiator, translucent particles, a solvent).
- the composition for forming a hard coat layer is brought into contact with a conductive film, a coating film is formed on the conductive film, and the coating film is cured.
- the hard coat layer may be formed on one or both of the two conductive films, and the hard coat layer is preferably formed on one main surface of the substrate.
- the hard coat layer is preferably disposed at a portion that is touched by a user's finger during use.
- a compound having an unsaturated double bond can function as a binder after curing.
- the compound having an unsaturated double bond is preferably a polyfunctional monomer containing two or more polymerizable unsaturated groups. Moreover, it is more preferable that there are three or more polymerizable unsaturated groups.
- Examples of the compound containing an unsaturated double bond include compounds having a polymerizable unsaturated group such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Of these, a (meth) acryloyl group is preferred as the polymerizable unsaturated group.
- the compound containing an unsaturated double bond include (meth) acrylic acid diesters of alkylene glycol, (meth) acrylic acid diesters of polyoxyalkylene glycol, and (meth) acrylic acid diesters of polyhydric alcohols.
- additives contained in the hard coat layer forming composition include photopolymerization initiators, translucent particles, solvents, and the like described in paragraphs 0025 to 0043 of JP2012-103690A which is incorporated herein by reference.
- the wiring board obtained by the above procedure is a wiring board having a three-dimensional shape, which is formed by disposing two conductive films having a patterned metal layer on at least one main surface facing each other. It is.
- the wiring board includes, for example, a touch sensor (also referred to as “touch panel sensor”), a semiconductor chip, FPC (Flexible printed circuits), COF (Chip on Film), TAB (Tape Automated Bonding), an antenna, a multilayer wiring board, and It can be applied to various uses such as a mother board. Especially, it is preferable to use for a touch sensor (electrostatic capacitance type touch panel sensor).
- a patterned metal layer in the wiring board functions as a detection electrode or a lead wiring in the touch sensor.
- one of the two conductive films is a transmission conductive film and the other is a reception conductive film.
- the wiring board can also be used as a heating element. That is, by passing an electric current through the patterned metal layer, the temperature of the patterned metal layer rises, and the patterned metal layer functions as a hot wire.
- step A as a method of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, for example, the conductive film
- the method of manufacturing or the method of procuring is mentioned. It does not restrict
- Method 1 for producing conductive film includes a method comprising the following steps X1 to X4. Hereinafter, each process is explained in full detail.
- a patterned layer to be plated containing a functional group that interacts with the plating catalyst or its precursor (hereinafter also referred to as “interactive group”) is formed on the substrate, and the substrate with the layer to be plated is formed. It is the process of obtaining.
- the method in particular of forming the said pattern-like to-be-plated layer is not restrict
- Formation method 1 of pattern-like to-be-plated layer A step of forming a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor on the substrate, and a plating layer precursor layer through a photomask having a patterned opening Applying energy to the pattern in a pattern (for example, exposure); And developing a plated layer precursor layer after applying energy to obtain a patterned plated layer (photolithography method).
- a method (printing method) comprising: applying energy (for example, exposure) to the patterned plated layer precursor layer to obtain a patterned plated layer.
- the method for forming the plating layer precursor layer on the substrate is not particularly limited.
- a method for applying a composition for forming a layer to be plated, which will be described later, to the substrate, or formation of a layer to be plated And a method of bringing the composition into contact with the substrate for example, a method of immersing the substrate in the composition for forming a layer to be plated.
- coat the to-be-plated layer forming composition in pattern shape For example, a screen printing method or the inkjet method etc. are mentioned.
- the to-be-plated layer is obtained by curing a to-be-plated layer precursor layer formed by a composition for forming a to-be-plated layer containing a polymerization initiator and the following compound X or composition Y. .
- a composition for to-be-plated layer forming is demonstrated for every component.
- Polymerization initiator It does not restrict
- the polymerization initiator include benzophenones, acetophenones, ⁇ -aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram monosulfide Bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds, and derivatives thereof.
- the content of the polymerization initiator in the composition for forming a layer to be plated is not particularly limited, but is preferably 0.01 to 1% by mass with respect to the total solid content of the composition for forming a layer to be plated. More preferably, the content is 0.1 to 0.5% by mass.
- composition for forming a layer to be plated preferably contains the following compound X or composition Y.
- Compound X a functional group that interacts with the plating catalyst or its precursor (hereinafter, also simply referred to as “interactive group”), and a compound composition that contains a polymerizable group Y: mutual interaction with the plating catalyst or its precursor COMPOSITION CONTAINING COMPOUND CONTAINING FUNCTIONAL FUNCTIONALITY AND COMPOUND CONTAINING POLYMERIZABLE GROUP
- Compound X is a compound containing an interactive group and a polymerizable group.
- the interactive group is intended to be a functional group capable of interacting with a plating catalyst or a precursor thereof applied to the patterned layer to be plated.
- a functional group capable of forming an electrostatic interaction with the plating catalyst or a precursor thereof.
- a nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group capable of forming a coordination with the plating catalyst or its precursor.
- the polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group.
- a radical polymerizable group is preferable from the viewpoint of more excellent reactivity.
- radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like.
- Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups.
- a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, or a methacrylamide group is preferable, and a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable.
- compound X two or more polymerizable groups may be contained. Further, the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.
- the compound X may be a low molecular compound or a high molecular compound.
- a low molecular weight compound intends a compound having a molecular weight of less than 1000, and a high molecular weight compound intends a compound having a molecular weight of 1000 or more.
- the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, more preferably from 2,000 to 200,000, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is more preferably 20000 or more.
- the method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of JP-A-2009-280905) is used.
- a repeating unit containing a polymerizable group represented by the following formula (a) (hereinafter also referred to as a polymerizable group unit as appropriate), and an interactive group represented by the following formula (b)
- a copolymer containing a repeating unit (hereinafter also referred to as an interactive group unit as appropriate).
- R 1 to R 5 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, and Butyl group, etc.).
- the kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, and a fluorine atom.
- R 1 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
- R 2 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
- R 3 is preferably a hydrogen atom.
- R 4 is preferably a hydrogen atom.
- R 5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
- X, Y, and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group.
- the divalent organic group include a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), a substituted or unsubstituted group.
- Unsubstituted divalent aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms, for example, phenylene group), —O—, —S—, —SO 2 —, —N (R) — (R: alkyl group) ), —CO—, —NH—, —COO—, —CONH—, and a combination thereof (for example, an alkyleneoxy group, an alkyleneoxycarbonyl group, and an alkylenecarbonyloxy group).
- X, Y, and Z are a single bond, an ester group (—COO—), an amide group (—CONH—), an ether, because the polymer is easily synthesized and the adhesion of the patterned metal layer is more excellent.
- a group (—O—) or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (—COO—), or an amide group (—CONH—) is more preferable.
- L 1 and L 2 each independently represent a single bond or a substituted or unsubstituted divalent organic group.
- a divalent organic group it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
- L 1 is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic group) in that the polymer is easily synthesized and the adhesion of the patterned metal layer is more excellent.
- Group hydrocarbon group particularly those having 1 to 9 carbon atoms in total.
- the total number of carbon atoms of L 1 means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 1.
- L 2 is a single bond, a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of these in terms of better adhesion of the patterned metal layer.
- L 2 preferably has a single bond or a total carbon number of 1 to 15.
- the total number of carbon atoms of L 2 means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 2.
- W represents an interactive group.
- the definition of the interactive group is as described above.
- the content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer from the viewpoints of reactivity (curability and polymerization) and suppression of gelation during synthesis, 5 to 40 mol% is more preferable.
- the content of the interactive group unit is preferably 5 to 95 mol%, preferably 10 to 95 mol%, based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.
- R 11 to R 13 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
- the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group.
- the substituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group substituted with a methoxy group, a chlorine atom, a bromine atom, or a fluorine atom.
- R 11 is preferably a hydrogen atom or a methyl group.
- R 12 is preferably a hydrogen atom.
- R 13 is preferably a hydrogen atom.
- L 10 represents a single bond or a divalent organic group.
- the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —SO 2 —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, and a combination thereof (for example, Alkyleneoxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
- one preferred form of L 10 includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.
- W is synonymous with the definition of W in Formula (b), and represents an interactive group.
- the definition of the interactive group is as described above.
- a preferable form of W includes an ionic polar group, and a carboxylic acid group is more preferable.
- composition Y is a composition containing a compound containing an interactive group and a compound containing a polymerizable group. That is, the to-be-plated layer precursor layer contains two kinds of a compound containing an interactive group and a compound containing a polymerizable group.
- the definitions of the interactive group and the polymerizable group are as described above.
- the definition of the interactive group is as described above.
- Such a compound may be a low molecular compound or a high molecular compound.
- a polymer for example, polyacrylic acid having a repeating unit represented by the above-described formula (b) can be mentioned.
- a polymerizable group is not contained in the compound containing an interactive group.
- the compound containing a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer containing two or more polymerizable groups from the viewpoint that the pattern-form plated layer to be formed is more excellent in hardness. Specifically, it is preferable to use a monomer containing 2 to 6 polymerizable groups as the polyfunctional monomer. From the viewpoint of molecular mobility during the cross-linking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 800.
- the compound containing a polymerizable group may contain an interactive group.
- the mass ratio of the compound containing the interactive group and the compound containing the polymerizable group is not particularly limited. From the viewpoint of the balance between the strength and plating suitability of the patterned plated layer to be formed, 0.1 to 10 is preferable, and 0.5 to 5 is more preferable.
- composition for forming a layer to be plated In the composition for forming a layer to be plated, other components (for example, polymerization initiator, solvent, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, filler, particle, Flame retardants, lubricants, plasticizers, etc.) may be included.
- other components for example, polymerization initiator, solvent, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, filler, particle, Flame retardants, lubricants, plasticizers, etc.
- the method for bringing the composition for forming a layer to be plated into contact with the substrate is not particularly limited.
- the method for applying the composition for forming a layer to be plated on the substrate, or the substrate in the composition for forming the layer to be plated The method of immersing is mentioned.
- the method for imparting energy to the precursor layer to be plated is not particularly limited, and examples thereof include heat treatment or exposure treatment (light irradiation treatment), and exposure treatment is preferable in that the treatment is completed in a short time.
- heat treatment or exposure treatment light irradiation treatment
- exposure treatment is preferable in that the treatment is completed in a short time.
- the method in particular of providing a pattern-form energy to a to-be-plated layer precursor layer is not restrict
- a patterned plating layer can be obtained by performing development processing on the plating layer precursor layer to which energy is applied in the pattern.
- the development processing method is not particularly limited, and optimal development processing is performed according to the type of material used.
- As a developing solution an organic solvent and alkaline aqueous solution are mentioned, for example.
- the patterned to-be-plated layer precursor layer is formed on the substrate
- the patterned to-be-plated layer can be obtained by performing an exposure process without using a photomask.
- composition A a composition containing a compound containing an interactive group and not containing a polymerizable group
- the application method is not particularly limited, and the application method described above can be used. Among these, the screen printing method or the ink jet method is preferable.
- the said composition A may contain a solvent from an applicability viewpoint. When the composition A contains a solvent, it may further contain a heating step for drying the solvent after coating.
- the compound containing an interactive group and not containing a polymerizable group contained in the composition A is not particularly limited, and a known compound can be used.
- known compounds include, but are not limited to, polyvinyl pyrrole.
- Step X2 is a step of deforming the substrate with the layer to be plated to obtain the substrate with the layer to be plated having a three-dimensional shape.
- the layer to be plated is also deformed following the deformation of the substrate.
- the method for deforming the substrate with the layer to be plated is not particularly limited, and for example, known methods such as vacuum forming, blow molding, free blow molding, pressure forming, vacuum-pressure forming, and hot press forming can be used.
- the temperature of the heat treatment performed during the deformation is preferably a temperature equal to or higher than the thermal deformation temperature of the substrate material, and is preferably in the range of glass transition temperature (Tg) +50 to 350 ° C.
- the form of the three-dimensional shape is not particularly limited, and may be a hemispherical shape as shown in FIG. 2A or another shape.
- Step X3 is a step of forming a patterned metal layer on the patterned plated layer by plating the patterned plated layer in the substrate with the plated layer having a three-dimensional shape.
- this processing method it has further the process X4 which provides a plating catalyst or its precursor to a pattern-like to-be-plated layer before process X3, or a plating catalyst or its precursor is the pattern shape of process X1. It is contained in the layer to be plated. Below, the form which implements process X4 is explained in full detail.
- Step X4 is a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated. Since the above-mentioned interactive group is contained in the patterned layer to be plated, the above-mentioned interactive group adheres (adsorbs) the applied plating catalyst or its precursor depending on its function.
- the plating catalyst or a precursor thereof functions as a catalyst for plating treatment and / or an electrode. Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
- the plating catalyst used or its precursor is an electroless plating catalyst or its precursor.
- the electroless plating catalyst or its precursor will be described in detail.
- Any electroless plating catalyst can be used as long as it becomes an active nucleus at the time of electroless plating.
- metals that can be electrolessly plated include Pd, Ag, Cu, Ni, Pt, Au, and Co.
- a metal colloid may be used as the electroless plating catalyst.
- the electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction.
- the metal ions of the metals mentioned as the electroless plating catalyst are mainly used.
- a plating treatment is performed on the patterned layer to which the plating catalyst or its precursor is applied.
- the method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment).
- the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
- the procedures of the electroless plating process and the electrolytic plating process will be described in detail.
- the electroless plating process is a process in which a metal is deposited by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
- the electroless plating treatment is performed, for example, by immersing the substrate with the layer to be plated, to which the electroless plating catalyst has been applied, in water, removing excess electroless plating catalyst (metal) and then immersing it in an electroless plating bath.
- a known electroless plating bath can be used as the electroless plating bath used.
- the plating bath in addition to a solvent (for example, water), metal ions for plating, a reducing agent, and additives (stabilizers) that improve the stability of metal ions are mainly included.
- a solvent for example, water
- additives stabilizers
- electroplating can be performed on the patterned layer to which the catalyst or its precursor is applied.
- an electroplating process can be performed as needed after the said electroless-plating process.
- the thickness of the patterned metal layer to be formed can be adjusted as appropriate.
- process X4 Although the form which implements process X4 was described above, as above-mentioned, when a plating catalyst or its precursor is contained in the pattern-like to-be-plated layer of process X1, it is not necessary to implement process X3. .
- a patterned metal layer is formed on the patterned layer to be plated. Therefore, a desired electroconductive film can be obtained by forming a pattern-like to-be-plated layer according to the shape of the patterned metal layer to form.
- the two electroconductive films used for the manufacturing method of the wiring board which concerns on the said embodiment may be produced by the same method, and may be produced by a different method. That is, one conductive film may be produced by a photolithography method, and the other conductive film may be produced by a printing method.
- Method 3 for producing conductive film Also, for example, a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor and a polymerizable group is formed on the substrate to obtain a substrate with a plating layer precursor layer.
- Step Z1 A step Z2 of deforming the substrate with the precursor layer to be plated to obtain the substrate with the precursor layer to be plated having a three-dimensional shape;
- the exposed layer precursor layer to be exposed is developed to form a patterned plated layer Z4 and the patterned plated layer is plated to form a patterned metal layer on the patterned plated layer.
- a primer layer for improving the adhesion between the substrate and the patterned layer to be plated may be disposed.
- primer layer forming composition Preparation of primer layer forming composition
- the following components were mixed to obtain a primer layer forming composition.
- Cyclopentanone 98% by mass Zetpol0020 (manufactured by Zeon Corporation, hydrogenated nitrile rubber) 2% by mass
- composition 1 for forming plated layer [Preparation of composition 1 for forming plated layer] The following components were mixed to obtain a composition 1 for forming a layer to be plated.
- the primer layer forming composition was applied to a polycarbonate substrate (trade name: Panlite PC2151, manufactured by Teijin Ltd., thickness 125 ⁇ m) using a bar coater so as to have an average dry film thickness of 1 ⁇ m, thereby forming a primer layer.
- the composition 1 for plating layer formation was apply
- the substrate 1 with the patterned layer to be plated is provided with a patterned layer to be matched with the top drive pattern of True Touch (registered trademark) Evaluation kit CYTK58. -1 and a substrate 1-2 with a patterned plating layer having a patterned plating layer that matches the lower surface driving pattern.
- the substrates 1-1 and 1-2 with the patterned plated layer were vacuum thermoformed into a hemispherical shape (see FIG. 2A).
- the obtained substrates 1-1 and 1-2 with a hemispherical pattern-like layer to be plated are placed on a Pd catalyst-providing liquid Omnishield 1573 activator (Rohm and Haas Electronic Materials Co., Ltd.).
- the substrate with the hemispherical layer to be plated is immersed in an aqueous solution diluted with pure water to 6% by volume and adjusted to pH 4.0 with 0.1 N HCl at 45 ° C. for 5 minutes, and then And washed twice with pure water.
- the obtained hemispherical substrate with a layer to be plated was added to a 0.8% by volume aqueous solution of a reducing agent cycle positive PB oxide converter 60C (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 30 ° C. It was immersed for a minute and then washed twice with pure water. Thereafter, the obtained hemispherical substrate with a layer to be plated was added with 12% by volume of M agent, 6% by volume of A agent, and 10% by volume of B agent of Circuposit 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.).
- the patterned metal layers are arranged on the inner surfaces through the resin layer.
- Each was mounted on the first mold and the second mold. Thereafter, the mold was clamped to form a mold cavity, and polycarbonate was injection molded into the mold cavity to obtain a wiring board having a hemispherical curved surface.
- the wiring board was a touch sensor 1.
- the shape of the first mold is a shape corresponding to the three-dimensional shape of the obtained conductive film 1-1 (matched shape)
- the shape of the second mold is the obtained conductive film 1 -2 corresponding to the three-dimensional shape (matched shape).
- Example 2 [Production of touch sensor 2] Touch in the same manner as in Example 1 except that a self-healing layer (Z913-3 manufactured by Aika Industry Co., Ltd.) is formed on the main surface of the substrate on the opposite side of the substrate to be plated of the substrate to be plated. Sensor 2 was produced.
- a self-healing layer Z913-3 manufactured by Aika Industry Co., Ltd.
- Example 3 [Production of touch sensor 3]
- the conductive films 1-1 and 1-2 having a hemispherical curved surface are attached to the mold, the patterned metal layers are respectively directed to the mold side (in the obtained wiring board, the pattern-shaped metal layer).
- a touch sensor 3 was obtained in the same manner as in Example 1 except that the metal layers were arranged so that the metal layers were the outermost surfaces.
- the touch sensors 1 to 4 were confirmed to be driven as touch sensors. As a result, the touch sensors 1 and 2 were driven as a touch sensor without any problem. Further, the touch sensor 3 was scratched on the patterned metal layer and rubbed with the mold, and a part of the touch sensor 3 was disconnected, but the touch sensor was driven. On the other hand, the touch sensor 4 has air bubbles between the conductive films 1-1 and 1-2, and there is a difference in detection sensitivity within the surface of the touch sensor depending on the presence or absence of air bubbles. I could't put it to practical use as a touch sensor.
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Abstract
Description
また、製造した配線基板の2枚の導電性フィルムの間には、貼り合わせの際に生じた気泡が存在し、配線基板をタッチセンサーに適用した際、検出精度が低くなるという問題があることを知見した。 In general, a wiring board for a capacitive touch panel sensor (hereinafter also referred to as “touch sensor”) is formed by opposing two conductive films each having a patterned metal layer disposed on one side. Can be formed. The inventor tried to manufacture a touch sensor wiring board having a curved surface shape by laminating the three-dimensionally plated products described in Patent Document 1 above. When bonding two conductive films together In addition, wrinkles and misalignment occurred in the conductive film, making it difficult to manufacture a wiring board.
Moreover, there is a problem that air bubbles generated at the time of bonding exist between the two conductive films of the manufactured wiring board, and the detection accuracy is lowered when the wiring board is applied to the touch sensor. I found out.
また、本発明は、配線基板を提供することも課題とする。 Then, this invention makes it a subject to provide the manufacturing method of a wiring board which can manufacture more easily the wiring board formed by arrange | positioning two electroconductive films which have a three-dimensional shape facing each other.
Another object of the present invention is to provide a wiring board.
[2] 工程Aが、基板上に、めっき触媒又はその前駆体と相互作用する官能基を含有するパターン状被めっき層を形成して、被めっき層付き基板を得る工程X1と、被めっき層付き基板を変形させて、3次元形状を有する被めっき層付き基板を得る工程X2と、 3次元形状を有する被めっき層付き基板中のパターン状被めっき層にめっき処理を施して、パターン状被めっき層上にパターン状の金属層を形成する工程X3と、を有し、工程X2の後で、かつ、工程X3の前に、パターン状被めっき層にめっき触媒又はその前駆体を付与する工程X4をさらに有するか、又は、めっき触媒又はその前駆体が工程X1のパターン状被めっき層に含有される、[1]に記載の配線基板の製造方法。
[3] 被めっき層が、重合開始剤、及び、以下の化合物X又は組成物Yを含有する被めっき層形成用組成物により形成された被めっき層前駆体層を硬化させたものである、[2]に記載の配線基板の製造方法。
化合物X:めっき触媒又はその前駆体と相互作用する官能基、及び、重合性基を含有する化合物
組成物Y:めっき触媒又はその前駆体と相互作用する官能基を含有する化合物、及び、重合性基を含有する化合物を含有する組成物
[4] 工程X1が、基板上に、めっき触媒又はその前駆体と相互作用する官能基を含有する被めっき層前駆体層を形成する工程と、パターン状の開口部を備えるフォトマスクを介して、被めっき層前駆体層に対してパターン状にエネルギーを付与する工程と、エネルギー付与後の被めっき層前駆体層を現像して、パターン状被めっき層を得る工程と、を含有する[2]又は[3]に記載の配線基板の製造方法。
[5] 基板が、ポリカーボネートからなる、[1]~[4]のいずれかに記載の配線基板の製造方法。
[6] 樹脂が、ポリカーボネートからなる、[1]~[5]のいずれかに記載の配線基板の製造方法。
[7] 工程Bにおいて、第1金型及び第2金型のうちの一方の金型上に導電性フィルムの一方を配置し、第1金型及び第2金型のうちの他方の金型上に導電性フィルムの他方を配置する際、2枚の導電性フィルムが備えるパターン状の金属層が配置された主面が、それぞれ、金型キャビティ側となるよう配置される、[1]~[6]のいずれかに記載の配線基板の製造方法。
[8] 2枚の導電性フィルムの少なくとも一方が、パターン状の金属層が配置された主面と反対側の主面上に、自己修復層を備える、[1]~[7]のいずれかに記載の配線基板の製造方法。
[9] 配線基板が、タッチセンサー用の配線基板である、[1]~[8]のいずれかに記載の配線基板の製造方法。
[10] 配線基板が、静電容量式タッチセンサー用の配線基板であり、2枚の導電性フィルムのうち、一方が送信用導電性フィルムであり、他方が受信用導電性フィルムである、[1]~[9]のいずれかに記載の配線基板の製造方法。
[11] 基板及び基板の少なくとも一方の主面上に配置されたパターン状の金属層を備え、3次元形状を有する2枚の導電性フィルムと、樹脂層と、を含有し、2枚の導電性フィルムが、樹脂層を介して配置されてなる配線基板。
[12] 2枚の導電性フィルムがそれぞれ備えるパターン状の金属層が、樹脂層を介して対向して配置され、かつ、それぞれのパターン状の金属層が、樹脂層と直接接している、[11]に記載の配線基板。
[13] 2枚の導電性フィルムの少なくとも一方が、パターン状の金属層が配置された主面と反対側の主面上に、自己修復層を備える、[11]又は[12]に記載の配線基板。 [1] A step A including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, and preparing two conductive films having a three-dimensional shape; a first mold and a second One of the conductive films is disposed on one of the molds, the other of the conductive films is disposed on the other of the first mold and the second mold, and the first mold The mold and the second mold are clamped, and a resin is injected into a mold cavity formed by the first mold and the second mold, and two conductive films are arranged via a resin layer. A process for producing a wiring board, comprising: a process B for producing a wiring board that has been formed.
[2] Step X1 is a step X1 in which a patterned plating layer containing a functional group that interacts with the plating catalyst or its precursor is formed on the substrate to obtain a substrate with a plating layer; A step X2 of obtaining a substrate with a to-be-plated layer having a three-dimensional shape by deforming the substrate with a plating, and subjecting the pattern-like to-be-plated layer in the substrate with the to-be-plated layer having a three-dimensional shape to plating, A step of forming a patterned metal layer on the plating layer, and a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated after the step X2 and before the step X3. The method for producing a wiring board according to [1], further comprising X4, or containing a plating catalyst or a precursor thereof in the patterned layer to be plated in step X1.
[3] The plated layer is obtained by curing the plated layer precursor layer formed by the composition for forming a plated layer containing the polymerization initiator and the following compound X or composition Y. The manufacturing method of the wiring board as described in [2].
Compound X: a functional group that interacts with a plating catalyst or a precursor thereof, and a compound containing a polymerizable group Composition Y: a compound that contains a functional group that interacts with a plating catalyst or a precursor thereof, and polymerizability A composition containing a group-containing compound [4] Step X1 is a step of forming a plated layer precursor layer containing a functional group that interacts with a plating catalyst or a precursor thereof on a substrate; The step of applying energy in a pattern form to the precursor layer to be plated through a photomask having an opening of the pattern, and developing the precursor layer to be plated after energy application, A process for producing a wiring board according to [2] or [3], comprising:
[5] The method for manufacturing a wiring board according to any one of [1] to [4], wherein the board is made of polycarbonate.
[6] The method for manufacturing a wiring board according to any one of [1] to [5], wherein the resin is made of polycarbonate.
[7] In step B, one of the conductive films is disposed on one of the first mold and the second mold, and the other mold of the first mold and the second mold is disposed. When disposing the other of the conductive films on the top, the main surfaces on which the patterned metal layers of the two conductive films are disposed are respectively located on the mold cavity side, [1] to [1] to [6] The method for manufacturing a wiring board according to any one of [6].
[8] Any of [1] to [7], wherein at least one of the two conductive films includes a self-healing layer on a main surface opposite to the main surface on which the patterned metal layer is disposed. The manufacturing method of the wiring board as described in 2 ..
[9] The method for manufacturing a wiring board according to any one of [1] to [8], wherein the wiring board is a wiring board for a touch sensor.
[10] The wiring board is a wiring board for a capacitive touch sensor, and one of the two conductive films is a transmitting conductive film and the other is a receiving conductive film. [1] A method for manufacturing a wiring board according to any one of [9].
[11] Two conductive films each including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, two conductive films having a three-dimensional shape, and a resin layer. A wiring board in which a conductive film is disposed via a resin layer.
[12] The patterned metal layers respectively provided in the two conductive films are arranged to face each other via the resin layer, and each patterned metal layer is in direct contact with the resin layer. 11].
[13] The method according to [11] or [12], wherein at least one of the two conductive films includes a self-healing layer on a main surface opposite to the main surface on which the patterned metal layer is disposed. Wiring board.
また、本発明によれば、上記特性を有する配線基板を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a wiring board which can manufacture more easily the wiring board formed by arrange | positioning two conductive films which have a three-dimensional shape facing each other can be provided.
Moreover, according to this invention, the wiring board which has the said characteristic can be provided.
なお、本明細書において「~」を用いて表される数値範囲は、「~」の前後に記載される数値を下限値及び上限値として含有する範囲を意味する。また、本発明における図は発明の理解を容易にするための模式図であり、各層の厚みの関係又は位置関係等は必ずしも実際のものとは一致しない。
また、(メタ)アクリロイルとは、アクリロイル及び/又はメタクリロイルを意図する。また、(メタ)アクリルとは、アクリル及び/又はメタクリルを意図する。 Below, the manufacturing method of the wiring board which concerns on embodiment of this invention is explained in full detail.
In the present specification, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value. Further, the drawings in the present invention are schematic diagrams for facilitating understanding of the invention, and the thickness relationship or positional relationship of each layer does not necessarily match the actual one.
Moreover, (meth) acryloyl intends acryloyl and / or methacryloyl. Moreover, (meth) acryl intends acrylic and / or methacryl.
本発明の第一の実施形態に係る配線基板の製造方法は、3次元形状を有する2枚の導電性フィルムをそれぞれ2つの金型(第1金型、第2金型)上に配置して、上記金型によって形成される金型キャビティ内に樹脂を注入する(以下、上記の成形方法を「インサート成形」ともいう。)ことを特徴とする。
対向する2枚の導電性フィルムの間にインサート成形により樹脂を注入することにより、2枚の導電性フィルムの間に気泡が混入することがなく、より容易に配線基板を製造することができる。
以下では、図面を参照しながら、各工程の手順について詳述する。 [Wiring board manufacturing method 1]
In the method for manufacturing a wiring board according to the first embodiment of the present invention, two conductive films having a three-dimensional shape are arranged on two molds (first mold and second mold), respectively. A resin is injected into a mold cavity formed by the mold (hereinafter, the molding method is also referred to as “insert molding”).
By injecting resin between the two conductive films facing each other by insert molding, air bubbles are not mixed between the two conductive films, and the wiring board can be manufactured more easily.
Below, the procedure of each process is explained in full detail, referring drawings.
工程Aは、基板と基板の少なくとも一方の主面上に配置されたパターン状の金属層とを備え、3次元形状を有する導電性フィルムを2枚用意する工程である。
本明細書において、用意とは、上記導電性フィルムを、後述する原材料を用いて製造すること、又は、単に購入する等の方法により調達すること等を意図する。 [Process A]
Step A is a step of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
In this specification, preparation means that the conductive film is manufactured using raw materials described later, or is procured by a method such as simple purchase.
工程Aにおいて用意される導電性フィルムは、基板と、基板の少なくとも一方の主面上に配置されたパターン状の金属層とを備える。本明細書において、主面とは、上記基板を構成する面のうち、互いに向かい合う最も面積が大きい面を意図し、典型的には、基板の厚み方向に対向する面に該当する。
例えば、図7はロール状に巻き回された長尺の基板の模式図である。図7に示すように、長尺の基板70は、主面71を備える(なお、主面71と、厚み方向に対向する反対側の面も、もう一方の主面となる。)。 <Conductive film>
The conductive film prepared in Step A includes a substrate and a patterned metal layer disposed on at least one main surface of the substrate. In the present specification, the main surface means a surface having the largest area facing each other among the surfaces constituting the substrate, and typically corresponds to a surface facing the thickness direction of the substrate.
For example, FIG. 7 is a schematic view of a long substrate wound in a roll shape. As shown in FIG. 7, the
図1、図2A、及び、図2Bに示すように、導電性フィルム10は、基板12、及び、基板12の一方の主面上に配置されたパターン状の金属層14を含み、一部に半球状の3次元形状を有する。つまり、基板12は、半球部12a及び半球部12aの底部から外側に広がる平坦部12bを有し、パターン状の金属層14は主に半球部12a上に配置されている。また、図2Bに示すように、半球部12a上に配置されたパターン状の金属層14は、半球部12aの外面上に配置されている。 In FIG. 1, one Embodiment of the electroconductive film prepared by this process is shown. FIG. 2A is a perspective view of an embodiment of the conductive film, and FIG. 1 is a cross-sectional view taken along the line AA. FIG. 2B is a partially enlarged view of the conductive film.
As shown in FIGS. 1, 2A, and 2B, the
また、図1、図2A、及び、図2Bにおいては、パターン状の金属層14は基板12の半球部12aの外面上に配置されているが、この形態には制限されない。例えば、基板12の半球部12aの内面上に配置されていてもよい。
また、図2Aに示すように、パターン状の金属層14は、5本ストライプ状に配置されているが、この形態には制限されず、どのような配置パターンであってもよい。 In addition, in FIG. 1, FIG. 2A and FIG. 2B, although the form of the hemispherical conductive film was shown, if the conductive film has a three-dimensional shape (three-dimensional shape), this form Not limited. Examples of the three-dimensional shape include a three-dimensional shape containing a curved surface, and more specifically, a kamaboko shape, a corrugated shape, an uneven shape, and a cylindrical shape.
In FIG. 1, FIG. 2A, and FIG. 2B, the patterned
As shown in FIG. 2A, the patterned
金属細線30の線幅は特に制限されないが、1000μm以下が好ましく、500μm以下がより好ましく、300μm以下がさらに好ましく、2μm以上が好ましく、10μm以上がより好ましい。
金属細線30の厚みは特に制限されないが、導電性の観点から、0.00001~0.2mmから選択可能であるが、30μm以下が好ましく、20μm以下がより好ましく、0.01~9μmがさらに好ましく、0.05~5μmが特に好ましい。
格子31は、金属細線30で囲まれる開口領域を含んでいる。格子31の一辺の長さWは、1500μm以下が好ましく、1300μm以下がより好ましく、1000μm以下がさらに好ましく、5μm以上が好ましく、30μm以上がより好ましく、80μm以上がさらに好ましい。 FIG. 2C is a partially enlarged top view of the patterned
The line width of the
The thickness of the
The
なお、図2Cにおいては、パターン状の金属層14はメッシュ状のパターンを有するが、この形態には制限されない。 In FIG. 2C, the
In FIG. 2C, the patterned
基板は、主面を有し、パターン状の金属層を支持するものであれば、その種類は特に制限されない。基板としては、可撓性を有する基板(好ましくは絶縁基板)が好ましく、樹脂基板がより好ましい。
樹脂基板の材料としては、例えば、ポリエーテルスルホン系樹脂、ポリアクリル系樹脂、ポリウレタン系樹脂、ポリエステル系樹脂(ポリエチレンテレフタレート、及び、ポリエチレンナフタレート等)、ポリカーボネート系樹脂、ポリスルホン系樹脂、ポリアミド系樹脂、ポリアリレート系樹脂、ポリオレフィン系樹脂、セルロース系樹脂、ポリ塩化ビニル系樹脂、及び、シクロオレフィン系樹脂等が挙げられる。なかでも、成形後の耐熱性の点でポリカーボネート系樹脂(より好ましくはポリカーボネート)が好ましい。
基板の厚み(mm)は特に制限されないが、取り扱い性及び薄型化のバランスの点から、0.05~2mmが好ましく、0.1~1mmがより好ましい。
また、基板は複層構造であってもよく、例えば、その一つの層として機能性フィルムを含有してもよい。なお、基板自体が機能性フィルムであってもよい。 (substrate)
The substrate is not particularly limited as long as it has a main surface and supports the patterned metal layer. As the substrate, a flexible substrate (preferably an insulating substrate) is preferable, and a resin substrate is more preferable.
Examples of the resin substrate material include polyether sulfone resin, polyacrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene naphthalate, etc.), polycarbonate resin, polysulfone resin, polyamide resin. , Polyarylate resin, polyolefin resin, cellulose resin, polyvinyl chloride resin, and cycloolefin resin. Of these, polycarbonate resins (more preferably polycarbonates) are preferable from the viewpoint of heat resistance after molding.
The thickness (mm) of the substrate is not particularly limited, but is preferably 0.05 to 2 mm, more preferably 0.1 to 1 mm, from the viewpoint of balance between handleability and thinning.
Moreover, a multilayer structure may be sufficient as a board | substrate, for example, you may contain a functional film as the one layer. The substrate itself may be a functional film.
パターン状の金属層を構成する金属の種類は特に制限されず、例えば、銅、クロム、鉛、ニッケル、金、銀、すず、及び、及び、亜鉛等が挙げられ、導電性の観点から、銅、金、又は、銀が好ましく、銅又は銀がより好ましい。 (Patterned metal layer)
The type of metal constituting the patterned metal layer is not particularly limited, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper Gold or silver is preferable, and copper or silver is more preferable.
3次元形状を有する導電性フィルムは公知の方法により製造することができる。詳細については、後述する。 (Method for producing conductive film)
The conductive film having a three-dimensional shape can be produced by a known method. Details will be described later.
工程Bは、金型キャビティを形成可能な第1金型及び第2金型のうちの一方の金型上に導電性フィルムの一方を配置し、第1金型及び第2金型のうちの他方の金型上に導電性フィルムの他方を配置し、第1金型と第2金型とを型締めし、第1金型と第2金型とによって形成される金型キャビティ内に樹脂を注入して、2枚の導電性フィルムが樹脂層を介して配置されてなる配線基板を製造する工程である。 [Process B]
In step B, one of the conductive films is disposed on one of the first mold and the second mold capable of forming a mold cavity, and the process B includes the first mold and the second mold. The other conductive film is placed on the other mold, the first mold and the second mold are clamped, and the resin is placed in the mold cavity formed by the first mold and the second mold. Is a step of manufacturing a wiring board in which two conductive films are arranged via a resin layer.
その後、必要に応じて、金型を冷却して樹脂を固化させ、金型から成形体である配線基板24aを取り外す。図5に示すように、配線基板24aは、導電性フィルム10、樹脂層26、及び、導電性フィルム10をこの順で含有する。
上記工程を実施することにより、対向して配置された2枚の導電性フィルム10の間に、樹脂層26が空隙なく配置された、配線基板を得ることができる。 In this step, first, as shown in FIG. 3, the
Thereafter, if necessary, the mold is cooled to solidify the resin, and the
By carrying out the above steps, it is possible to obtain a wiring substrate in which the
また、図4においては、第1金型20の形状が凹状で、第2金型22の形状が凸状であるが、この形態には制限されず、導電性フィルム10の3次元形状(立体形状)に合わせて最適な形状の金型が選択される。つまり、導電性フィルム10の3次元形状に対応した形状を有する金型が選択される。 In this specification, the mold cavity is a space for forming a resin layer provided between the first mold and the second mold.
In FIG. 4, the shape of the
本実施形態のように、パターン状の金属層14がそれぞれ金型キャビティ側となるよう配置されていると、得られる配線基板24aは、基板12/パターン状の金属層14/樹脂層26/パターン状の金属層14/基板12をこの順に備える。すなわち、2枚の導電性フィルムがそれぞれ備えるパターン状の金属層14が、樹脂層26を介して対向して配置され、かつ、それぞれのパターン状の金属層14が、樹脂層26と直接接している。
この様な配線基板24aは、タッチセンサーに適用する際、基板12がパターン状の金属層14の保護層として機能するため、パターン状の金属層14の保護層を別途配置しなくても、耐傷性により優れるという特徴を有する。 In addition, in FIG. 3, it arrange | positions so that the main surface in which the pattern-shaped
When the patterned
When such a
また、図6Bにおいて、第1金型20には、パターン状の金属層14が配置された主面を金型キャビティ側にして導電性フィルム10が配置され、第2金型22には、パターン状の金属層14が配置された主面を金型側にして、導電性フィルム10が配置されている。 On the other hand, in FIG. 6A and FIG. 6B, the modification of arrangement | positioning of the
Further, in FIG. 6B, the
上記実施形態に係る配線基板の製造方法は、所望の効果が得られる範囲内において、工程A及び工程B以外の、任意工程を含有してもよい。任意工程としては例えば、自己修復層形成工程、及び、ハードコート層形成工程等が挙げられる。 [Optional process]
The method for manufacturing a wiring board according to the above embodiment may include an optional step other than the step A and the step B within a range in which a desired effect is obtained. Examples of the optional step include a self-healing layer forming step and a hard coat layer forming step.
自己修復層形成工程は、基板の主面上に自己修復層を形成する工程である。本工程は、工程Aの前、工程Aの後、及び/又は、工程Bの後に実施することができる。
本明細書において、自己修復層とは、層表面に付けられた傷が自己修復する機能(自己修復性)を有する層である。なお、自己修復性とは、弾性回復により傷を修復することにより、傷をつくにくくする機能であり、より具体的には、500gの荷重をかけた真鍮ブラシで層の表面を擦り、擦った直後にキズの存在を目視により確認したとき、20~25℃の環境下で、傷をつけてから3分以内に傷が回復する性質を意図する。 -Self-healing layer formation process The self-healing layer formation process is a process of forming a self-healing layer on the main surface of the substrate. This step can be performed before step A, after step A, and / or after step B.
In this specification, the self-healing layer is a layer having a function (self-healing property) in which a scratch attached to the surface of the layer self-heals. The self-repairing property is a function of making a scratch difficult by repairing the scratch by elastic recovery. More specifically, the surface of the layer is rubbed with a brass brush loaded with a load of 500 g. Immediately after that, when the presence of scratches is visually confirmed, it is intended that the scratches recover within 3 minutes after being scratched in an environment of 20 to 25 ° C.
より具体的には、自己修復層に含有される材料としては、例えば、ポリカーボネート骨格を有するウレタン樹脂、ポリカプロラクトン骨格を有するウレタン樹脂、及び、ポリエステル骨格を有するウレタン樹脂等が挙げられ、これらのポリカーボネート骨格、ポリカプロラクトン骨格、及び、ポリエステル骨格がソフトセグメントとして機能し、ウレタン結合がハードセグメントとして機能する。 A known layer can be used as the self-healing layer. For example, examples of the self-healing layer include a layer containing a resin having a soft segment and a hard segment. The soft segment acts to cushion the external force by acting as a cushion and functions to elastically recover the wound, and the hard segment functions to resist the external force.
More specifically, examples of the material contained in the self-healing layer include a urethane resin having a polycarbonate skeleton, a urethane resin having a polycaprolactone skeleton, a urethane resin having a polyester skeleton, and the like. The skeleton, the polycaprolactone skeleton, and the polyester skeleton function as a soft segment, and the urethane bond functions as a hard segment.
自己修復層は、上記配線基板をタッチパネルに適用した際、使用時に、使用者の指が触れる部分に配置されることが好ましい。従って、導電性フィルム基板のパターン状の金属層が配置された主面とは反対側の主面上に配置される形態が好ましい。 The self-healing layer may be formed on one side of the substrate or on both sides. The self-healing layer may be formed on one of the two conductive film substrates, or may be formed on both substrates.
When the wiring board is applied to a touch panel, the self-healing layer is preferably disposed at a portion that is touched by a user's finger during use. Therefore, the form arrange | positioned on the main surface on the opposite side to the main surface by which the pattern-shaped metal layer of a conductive film board | substrate is arrange | positioned is preferable.
ハードコート層形成工程は、導電性フィルムの主面上にハードコート層を形成する工程である。本工程は、工程Aの後、又は、工程Bの後に実施することができ、工程Aの後に実施することが好ましい。 -Hard-coat layer formation process A hard-coat layer formation process is a process of forming a hard-coat layer on the main surface of an electroconductive film. This step can be performed after step A or after step B, and is preferably performed after step A.
ハードコート層としては、例えば、不飽和二重結合を含有する化合物を重合硬化して得られる層、及び、ゾルゲル反応を用いて熱硬化して得られる層等が挙げられる。 The hard coat layer is not particularly limited, and a known layer can be used.
Examples of the hard coat layer include a layer obtained by polymerizing and curing a compound containing an unsaturated double bond, and a layer obtained by thermosetting using a sol-gel reaction.
ハードコート層の形成方法は特に制限されず、例えば、不飽和二重結合を含有する化合物、及び、必要に応じて用いられる添加剤(例えば、重合開始剤、透光性粒子、溶媒)を含有するハードコート層形成用組成物を、導電性フィルムと接触させて、導電性フィルム上に塗膜を形成し、塗膜を硬化することにより形成する方法が挙げられる。
ハードコート層は2枚の導電性フィルムのうち、片方に形成されてもよいし、両方に形成されてもよく、ハードコート層は、基板の片方の主面上に形成されることが好ましい。
ハードコート層は、上記配線基板をタッチセンサーに適用した際、使用時に、使用者の指が触れる部分に配置されることが好ましい。 The thickness of the hard coat layer is preferably 0.4 to 35 μm, more preferably 1 to 30 μm, and further preferably 1.5 to 20 μm.
The method for forming the hard coat layer is not particularly limited, and includes, for example, a compound containing an unsaturated double bond, and additives used as necessary (for example, a polymerization initiator, translucent particles, a solvent). The composition for forming a hard coat layer is brought into contact with a conductive film, a coating film is formed on the conductive film, and the coating film is cured.
The hard coat layer may be formed on one or both of the two conductive films, and the hard coat layer is preferably formed on one main surface of the substrate.
When the wiring board is applied to a touch sensor, the hard coat layer is preferably disposed at a portion that is touched by a user's finger during use.
不飽和二重結合を含有する化合物としては、(メタ)アクリロイル基、ビニル基、スチリル基、及び、アリル基等の重合性不飽和基を有する化合物が挙げられる。なかでも、重合性不飽和基としては、(メタ)アクリロイル基が好ましい。
不飽和二重結合を含有する化合物の具体例としては、アルキレングリコールの(メタ)アクリル酸ジエステル類、ポリオキシアルキレングリコールの(メタ)アクリル酸ジエステル類、多価アルコールの(メタ)アクリル酸ジエステル類、エチレンオキシド又はプロピレンオキシド付加物の(メタ)アクリル酸ジエステル類、エポキシ(メタ)アクリレート類、ウレタン(メタ)アクリレート類、及び、ポリエステル(メタ)アクリレート類等が挙げられる。 A compound having an unsaturated double bond can function as a binder after curing. The compound having an unsaturated double bond is preferably a polyfunctional monomer containing two or more polymerizable unsaturated groups. Moreover, it is more preferable that there are three or more polymerizable unsaturated groups.
Examples of the compound containing an unsaturated double bond include compounds having a polymerizable unsaturated group such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Of these, a (meth) acryloyl group is preferred as the polymerizable unsaturated group.
Specific examples of the compound containing an unsaturated double bond include (meth) acrylic acid diesters of alkylene glycol, (meth) acrylic acid diesters of polyoxyalkylene glycol, and (meth) acrylic acid diesters of polyhydric alcohols. (Meth) acrylic acid diesters of ethylene oxide or propylene oxide adducts, epoxy (meth) acrylates, urethane (meth) acrylates, polyester (meth) acrylates, and the like.
上記手順によって得られた配線基板は、少なくとも一方の主面上にパターン状の金属層が配置された導電性フィルムを2枚対向して配置することにより形成された、3次元形状を有する配線基板である。
上記配線基板は、例えば、タッチセンサー(「タッチパネルセンサー」ともいう。)、半導体チップ、FPC(Flexible printed circuits)、COF(Chip on Film)、TAB(Tape Automated Bonding)、アンテナ、多層配線基板、及び、マザーボード等の種々の用途に適用できる。なかでも、タッチセンサー(静電容量式タッチパネルセンサー)に用いることが好ましい。上記配線基板をタッチセンサーに適用する場合(上記配線基板がタッチセンサー用である場合)、配線基板中のパターン状の金属層がタッチセンサー中の検出電極又は引き出し配線として機能する。
また、上記配線基板をタッチセンサーに適用する場合、上記2枚の導電性フィルムのうち、1枚が送信用導電性フィルムであり、他方が受信用導電性フィルムであることが好ましい。
また、上記配線基板は、発熱体として用いることもできる。つまり、パターン状の金属層に電流を流すことにより、パターン状の金属層の温度が上昇して、パターン状の金属層が熱電線として機能する。 [Wiring board]
The wiring board obtained by the above procedure is a wiring board having a three-dimensional shape, which is formed by disposing two conductive films having a patterned metal layer on at least one main surface facing each other. It is.
The wiring board includes, for example, a touch sensor (also referred to as “touch panel sensor”), a semiconductor chip, FPC (Flexible printed circuits), COF (Chip on Film), TAB (Tape Automated Bonding), an antenna, a multilayer wiring board, and It can be applied to various uses such as a mother board. Especially, it is preferable to use for a touch sensor (electrostatic capacitance type touch panel sensor). When the wiring board is applied to a touch sensor (when the wiring board is for a touch sensor), a patterned metal layer in the wiring board functions as a detection electrode or a lead wiring in the touch sensor.
When the wiring board is applied to a touch sensor, it is preferable that one of the two conductive films is a transmission conductive film and the other is a reception conductive film.
The wiring board can also be used as a heating element. That is, by passing an electric current through the patterned metal layer, the temperature of the patterned metal layer rises, and the patterned metal layer functions as a hot wire.
上記導電性フィルムの製造方法としては特に制限されず、公知の製造方法を用いることができる。 In step A, as a method of preparing two conductive films having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate, for example, the conductive film The method of manufacturing or the method of procuring is mentioned.
It does not restrict | limit especially as a manufacturing method of the said electroconductive film, A well-known manufacturing method can be used.
導電性フィルムの製造方法の好適形態の一つとしては、以下の工程X1~工程X4を含有する方法が挙げられる。
以下、各工程について詳述する。 [Method 1 for producing conductive film]
One preferred embodiment of the method for producing a conductive film includes a method comprising the following steps X1 to X4.
Hereinafter, each process is explained in full detail.
工程X1は、基板上に、めっき触媒又はその前駆体と相互作用する官能基(以後、「相互作用性基」とも称する)を含有するパターン状被めっき層を形成して、被めっき層付き基板を得る工程である。
上記パターン状被めっき層を形成する方法は特に制限されないが、例えば、以下の方法が挙げられる。 [Process X1]
In the step X1, a patterned layer to be plated containing a functional group that interacts with the plating catalyst or its precursor (hereinafter also referred to as “interactive group”) is formed on the substrate, and the substrate with the layer to be plated is formed. It is the process of obtaining.
Although the method in particular of forming the said pattern-like to-be-plated layer is not restrict | limited, For example, the following method is mentioned.
基板上に、めっき触媒又はその前駆体と相互作用する官能基を含有する被めっき層前駆体層を形成する工程と、パターン状の開口部を備えるフォトマスクを介して、被めっき層前駆体層に対してパターン状にエネルギーを付与(例えば露光)する工程と、
エネルギー付与後の被めっき層前駆体層を現像して、パターン状被めっき層を得る工程と、を含有する方法(フォトリソグラフィー法)。 (Formation method 1 of pattern-like to-be-plated layer)
A step of forming a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor on the substrate, and a plating layer precursor layer through a photomask having a patterned opening Applying energy to the pattern in a pattern (for example, exposure);
And developing a plated layer precursor layer after applying energy to obtain a patterned plated layer (photolithography method).
基板上に、被めっき層形成用組成物をパターン状に塗布して、パターン状の被めっき層前駆体層を得る工程と、
パターン状の被めっき層前駆体層にエネルギーを付与(例えば露光)して、パターン状被めっき層を得る工程と、を含有する方法(印刷法)。 (Pattern-form to-be-plated layer forming method 2)
A step of applying a composition for forming a layer to be plated in a pattern on a substrate to obtain a patterned layer precursor layer to be plated;
A method (printing method) comprising: applying energy (for example, exposure) to the patterned plated layer precursor layer to obtain a patterned plated layer.
また、形成方法2において、被めっき層形成用組成物をパターン状に塗布する方法としては特に制限されないが、例えば、スクリーン印刷法、又は、インクジェット法等が挙げられる。 In the formation method 1, the method for forming the plating layer precursor layer on the substrate is not particularly limited. For example, a method for applying a composition for forming a layer to be plated, which will be described later, to the substrate, or formation of a layer to be plated And a method of bringing the composition into contact with the substrate (for example, a method of immersing the substrate in the composition for forming a layer to be plated).
Moreover, in the formation method 2, although it does not restrict | limit especially as a method to apply | coat the to-be-plated layer forming composition in pattern shape, For example, a screen printing method or the inkjet method etc. are mentioned.
被めっき層形成用組成物は、重合開始剤、及び、以下の化合物X又は組成物Yを含有することが好ましい。 <Composition for plating layer formation>
The composition for forming a layer to be plated preferably contains a polymerization initiator and the following compound X or composition Y.
重合開始剤としては特に制限されず、公知の重合開始剤を用いることができる。重合開始剤としては、例えば、ベンゾフェノン類、アセトフェノン類、α-アミノアルキルフェノン類、ベンゾイン類、ケトン類、チオキサントン類、ベンジル類、ベンジルケタール類、オキスムエステル類、アンソロン類、テトラメチルチウラムモノサルファイド類、ビスアシルフォスフィノキサイド類、アシルフォスフィンオキサイド類、アントラキノン類、アゾ化合物、及び、その誘導体等を挙げることができる。
被めっき層形成用組成物中における重合開始剤の含有量としては、特に制限されないが、被めっき層形成用組成物の全固形分に対して、0.01~1質量%であることが好ましく、0.1~0.5質量%であることがより好ましい。 (Polymerization initiator)
It does not restrict | limit especially as a polymerization initiator, A well-known polymerization initiator can be used. Examples of the polymerization initiator include benzophenones, acetophenones, α-aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxime esters, anthrones, tetramethylthiuram monosulfide Bisacylphosphine oxides, acylphosphine oxides, anthraquinones, azo compounds, and derivatives thereof.
The content of the polymerization initiator in the composition for forming a layer to be plated is not particularly limited, but is preferably 0.01 to 1% by mass with respect to the total solid content of the composition for forming a layer to be plated. More preferably, the content is 0.1 to 0.5% by mass.
被めっき層形成用組成物は、以下の化合物X又は組成物Yを含有することが好ましい。化合物X:めっき触媒又はその前駆体と相互作用する官能基(以後、単に「相互作用性基」とも称する)、及び、重合性基を含有する化合物
組成物Y:めっき触媒又はその前駆体と相互作用する官能基を含有する化合物、及び、重合性基を含有する化合物を含有する組成物 (Compound X or Composition Y)
The composition for forming a layer to be plated preferably contains the following compound X or composition Y. Compound X: a functional group that interacts with the plating catalyst or its precursor (hereinafter, also simply referred to as “interactive group”), and a compound composition that contains a polymerizable group Y: mutual interaction with the plating catalyst or its precursor COMPOSITION CONTAINING COMPOUND CONTAINING FUNCTIONAL FUNCTIONALITY AND COMPOUND CONTAINING POLYMERIZABLE GROUP
化合物Xは、相互作用性基と重合性基とを含有する化合物である。
相互作用性基とは、パターン状被めっき層に付与されるめっき触媒又はその前駆体と相互作用できる官能基を意図し、例えば、めっき触媒又はその前駆体と静電相互作用を形成可能な官能基、ならびに、めっき触媒又はその前駆体と配位形成可能な含窒素官能基、含硫黄官能基、及び、含酸素官能基等が挙げられる。
相互作用性基としてより具体的には、アミノ基、アミド基、イミド基、ウレア基、3級のアミノ基、アンモニウム基、アミジノ基、トリアジン環、トリアゾール環、ベンゾトリアゾール基、イミダゾール基、ベンズイミダゾール基、キノリン基、ピリジン基、ピリミジン基、ピラジン基、キナゾリン基、キノキサリン基、プリン基、トリアジン基、ピペリジン基、ピペラジン基、ピロリジン基、ピラゾール基、アニリン基、アルキルアミン構造を含有する基、イソシアヌル構造を含有する基、ニトロ基、ニトロソ基、アゾ基、ジアゾ基、アジド基、シアノ基、及び、シアネート基等の含窒素官能基;エーテル基、水酸基、フェノール性水酸基、カルボン酸基、カーボネート基、カルボニル基、エステル基、N-オキシド構造を含有する基、S-オキシド構造を含有する基、及び、N-ヒドロキシ構造を含有する基等の含酸素官能基;チオフェン基、チオール基、チオウレア基、チオシアヌール酸基、ベンズチアゾール基、メルカプトトリアジン基、チオエーテル基、チオキシ基、スルホキシド基、スルホン酸基、サルファイト基、スルホキシイミン構造を含有する基、スルホキシニウム塩構造を含有する基、スルホン酸基、及び、スルホン酸エステル構造を含有する基等の含硫黄官能基;ホスフェート基、ホスフォロアミド基、ホスフィン基、及び、リン酸エステル構造を含有する基等の含リン官能基;塩素原子、及び、臭素原子等のハロゲン原子を含有する基等が挙げられ、塩構造をとりうる官能基においてはそれらの塩も使用できる。
なかでも、極性が高く、めっき触媒又はその前駆体等への吸着能が高いことから、カルボン酸基、スルホン酸基、リン酸基、及びボロン酸基等のイオン性極性基、エーテル基、又は、シアノ基が好ましく、カルボン酸基、又は、シアノ基がより好ましい。
化合物Xには、相互作用性基が2種以上含まれていてもよい。 ・ Compound X
Compound X is a compound containing an interactive group and a polymerizable group.
The interactive group is intended to be a functional group capable of interacting with a plating catalyst or a precursor thereof applied to the patterned layer to be plated. For example, a functional group capable of forming an electrostatic interaction with the plating catalyst or a precursor thereof. And a nitrogen-containing functional group, a sulfur-containing functional group, and an oxygen-containing functional group capable of forming a coordination with the plating catalyst or its precursor.
More specifically, as an interactive group, amino group, amide group, imide group, urea group, tertiary amino group, ammonium group, amidino group, triazine ring, triazole ring, benzotriazole group, imidazole group, benzimidazole Group, quinoline group, pyridine group, pyrimidine group, pyrazine group, quinazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing alkylamine structure, isocyanuric Nitrogen-containing functional groups such as groups containing structures, nitro groups, nitroso groups, azo groups, diazo groups, azide groups, cyano groups, and cyanate groups; ether groups, hydroxyl groups, phenolic hydroxyl groups, carboxylic acid groups, carbonate groups , Carbonyl group, ester group, group containing N-oxide structure, S Oxygen-containing functional groups such as a group containing an oxide structure and a group containing an N-hydroxy structure; a thiophene group, a thiol group, a thiourea group, a thiocyanuric acid group, a benzthiazole group, a mercaptotriazine group, a thioether group, a thioxy group A sulfur-containing functional group such as a sulfoxide group, a sulfonic acid group, a sulfite group, a group containing a sulfoximine structure, a group containing a sulfoxynium salt structure, a sulfonic acid group, and a group containing a sulfonic acid ester structure; Phosphorus groups, phosphoroamide groups, phosphine groups, and phosphorus-containing functional groups such as groups containing phosphate ester structures; groups containing halogen atoms such as chlorine atoms and bromine atoms, etc., and salt structures These salts can also be used in functional groups capable of taking
Among them, since the polarity is high and the adsorption ability to the plating catalyst or its precursor is high, ionic polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and boronic acid groups, ether groups, or , A cyano group is preferable, and a carboxylic acid group or a cyano group is more preferable.
Compound X may contain two or more interactive groups.
化合物X中には、重合性基が2種以上含まれていてもよい。また、化合物X中に含有される重合性基の数は特に制限されず、1つでも、2つ以上でもよい。 The polymerizable group is a functional group that can form a chemical bond by applying energy, and examples thereof include a radical polymerizable group and a cationic polymerizable group. Among these, a radical polymerizable group is preferable from the viewpoint of more excellent reactivity. Examples of radical polymerizable groups include acrylic acid ester groups (acryloyloxy groups), methacrylic acid ester groups (methacryloyloxy groups), itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, and the like. Examples include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups. Among these, a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, or a methacrylamide group is preferable, and a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable.
In compound X, two or more polymerizable groups may be contained. Further, the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.
このような重合性基及び相互作用性基を有するポリマーの合成方法は特に制限されず、公知の合成方法(特開2009-280905号の段落[0097]~[0125]参照)が使用される。 When the compound X is a polymer, the weight average molecular weight of the polymer is not particularly limited, but is preferably from 1,000 to 700,000, more preferably from 2,000 to 200,000, from the viewpoint of better handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, it is more preferably 20000 or more.
The method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of JP-A-2009-280905) is used.
なお、R1としては、水素原子、メチル基、又は、臭素原子で置換されたメチル基が好ましい。R2としては、水素原子、メチル基、又は、臭素原子で置換されたメチル基が好ましい。R3としては、水素原子が好ましい。R4としては、水素原子が好ましい。R5としては、水素原子、メチル基、又は、臭素原子で置換されたメチル基が好ましい。 In the above formulas (a) and (b), R 1 to R 5 are each independently a hydrogen atom or a substituted or unsubstituted alkyl group (for example, a methyl group, an ethyl group, a propyl group, and Butyl group, etc.). The kind of the substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, and a fluorine atom.
R 1 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R 2 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom. R 3 is preferably a hydrogen atom. R 4 is preferably a hydrogen atom. R 5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a bromine atom.
L1としては、ポリマーの合成が容易で、パターン状の金属層の密着性がより優れる点で、脂肪族炭化水素基、又は、ウレタン結合もしくはウレア結合を有する2価の有機基(例えば、脂肪族炭化水素基)が好ましく、なかでも、総炭素数1~9であるものが好ましい。なお、ここで、L1の総炭素数とは、L1で表される置換又は無置換の2価の有機基に含有される総炭素原子数を意味する。 In the above formulas (a) and (b), L 1 and L 2 each independently represent a single bond or a substituted or unsubstituted divalent organic group. As a definition of a divalent organic group, it is synonymous with the divalent organic group described by X, Y, and Z mentioned above.
L 1 is an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, an aliphatic group) in that the polymer is easily synthesized and the adhesion of the patterned metal layer is more excellent. Group hydrocarbon group), particularly those having 1 to 9 carbon atoms in total. Incidentally, the total number of carbon atoms of L 1, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L 1.
また、上記相互作用性基ユニットの含有量は、めっき触媒又はその前駆体に対する吸着性の観点から、ポリマー中の全繰り返し単位に対して、5~95モル%が好ましく、10~95モル%がより好ましい。 The content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all repeating units in the polymer from the viewpoints of reactivity (curability and polymerization) and suppression of gelation during synthesis, 5 to 40 mol% is more preferable.
In addition, the content of the interactive group unit is preferably 5 to 95 mol%, preferably 10 to 95 mol%, based on all repeating units in the polymer, from the viewpoint of adsorptivity to the plating catalyst or its precursor. More preferred.
上記化合物がいわゆるモノマーである場合、好適形態の一つとして式(X)で表される化合物が挙げられる。 ..Preferred form of monomer When the compound is a so-called monomer, a compound represented by the formula (X) is mentioned as one of preferred forms.
式(X)中、L10の好適形態の一つとしては、-NH-脂肪族炭化水素基-、又は、-CO-脂肪族炭化水素基-が挙げられる。 L 10 represents a single bond or a divalent organic group. Examples of the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —SO 2 —, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, and a combination thereof (for example, Alkyleneoxy group, alkyleneoxycarbonyl group, alkylenecarbonyloxy group, etc.).
In Formula (X), one preferred form of L 10 includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.
式(X)中、Wの好適形態としては、イオン性極性基が挙げられ、カルボン酸基がより好ましい。 The definition of W is synonymous with the definition of W in Formula (b), and represents an interactive group. The definition of the interactive group is as described above.
In formula (X), a preferable form of W includes an ionic polar group, and a carboxylic acid group is more preferable.
組成物Yは、相互作用性基を含有する化合物、及び、重合性基を含有する化合物を含有する組成物である。つまり、被めっき層前駆体層が、相互作用性基を含有する化合物、及び、重合性基を含有する化合物の2種を含有する。相互作用性基及び重合性基の定義は、上述のとおりである。また、相互作用性基の定義は上述のとおりである。
このような化合物としては、低分子化合物であっても、高分子化合物であってもよい。相互作用性基を含有する化合物の好適形態としては、上述した式(b)で表される繰り返し単位を有する高分子(例えば、ポリアクリル酸)が挙げられる。なお、相互作用性基を含有する化合物には、重合性基は含まれない。
重合性基を含有する化合物とは、いわゆるモノマーであり、形成されるパターン状被めっき層の硬度がより優れる点で、2個以上の重合性基を含有する多官能モノマーであることが好ましい。多官能モノマーとは、具体的には、2~6個の重合性基を含有するモノマーを使用することが好ましい。反応性に影響を与える架橋反応中の分子の運動性の観点から、用いる多官能モノマーの分子量としては150~1000が好ましく、200~800がより好ましい。
重合性基を含有する化合物には、相互作用性基が含有されていてもよい。 ・ Composition Y
The composition Y is a composition containing a compound containing an interactive group and a compound containing a polymerizable group. That is, the to-be-plated layer precursor layer contains two kinds of a compound containing an interactive group and a compound containing a polymerizable group. The definitions of the interactive group and the polymerizable group are as described above. The definition of the interactive group is as described above.
Such a compound may be a low molecular compound or a high molecular compound. As a suitable form of the compound containing an interactive group, a polymer (for example, polyacrylic acid) having a repeating unit represented by the above-described formula (b) can be mentioned. In addition, a polymerizable group is not contained in the compound containing an interactive group.
The compound containing a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer containing two or more polymerizable groups from the viewpoint that the pattern-form plated layer to be formed is more excellent in hardness. Specifically, it is preferable to use a monomer containing 2 to 6 polymerizable groups as the polyfunctional monomer. From the viewpoint of molecular mobility during the cross-linking reaction that affects the reactivity, the molecular weight of the polyfunctional monomer used is preferably 150 to 1000, more preferably 200 to 800.
The compound containing a polymerizable group may contain an interactive group.
被めっき層形成用組成物には、必要に応じて、他の成分(例えば、重合開始剤、溶媒、増感剤、硬化剤、重合禁止剤、酸化防止剤、帯電防止剤、フィラー、粒子、難燃剤、滑剤、可塑剤等)が含まれていてもよい。 (Optional component)
In the composition for forming a layer to be plated, other components (for example, polymerization initiator, solvent, sensitizer, curing agent, polymerization inhibitor, antioxidant, antistatic agent, filler, particle, Flame retardants, lubricants, plasticizers, etc.) may be included.
被めっき層前駆体層にパターン状にエネルギー付与した場合、パターン状にエネルギーが付与された被めっき層前駆体層に対して、現像処理を施すことにより、パターン状被めっき層を得ることができる。
現像処理の方法は特に制限されず、使用される材料の種類に応じて、最適な現像処理が実施される。現像液としては、例えば、有機溶媒、及び、アルカリ水溶液が挙げられる。 In addition, the method in particular of providing a pattern-form energy to a to-be-plated layer precursor layer is not restrict | limited. There is a method of performing an exposure process through a photomask having a desired pattern shape.
When energy is applied in a pattern to the plating layer precursor layer, a patterned plating layer can be obtained by performing development processing on the plating layer precursor layer to which energy is applied in the pattern. .
The development processing method is not particularly limited, and optimal development processing is performed according to the type of material used. As a developing solution, an organic solvent and alkaline aqueous solution are mentioned, for example.
工程X1において、基板上に、相互作用性基を含有するパターン状被めっき層を形成して、被めっき層付き基板を得る工程としては、上記の形成方法に制限されない。
例えば、基板上に、以下の組成物Aをパターン状に塗布する方法が挙げられる。
組成物A:相互作用性基を含有し、かつ、重合性基を含有しない化合物を含有する組成物 (Pattern-form plated layer forming method 3)
In the process X1, as a process of forming the pattern to-be-plated layer containing an interactive group on a board | substrate and obtaining a board | substrate with a to-be-plated layer, it is not restrict | limited to said formation method.
For example, the method of apply | coating the following composition A in a pattern shape on a board | substrate is mentioned.
Composition A: a composition containing a compound containing an interactive group and not containing a polymerizable group
また、上記組成物Aは、塗布性の観点から、溶剤を含有してもよい。
組成物Aが溶剤を含有する場合、塗布後に、溶剤を乾燥させるための加熱工程をさらに含有してもよい。 The application method is not particularly limited, and the application method described above can be used. Among these, the screen printing method or the ink jet method is preferable.
Moreover, the said composition A may contain a solvent from an applicability viewpoint.
When the composition A contains a solvent, it may further contain a heating step for drying the solvent after coating.
工程X2は、被めっき層付き基板を変形させて、3次元形状を有する被めっき層付き基板を得る工程である。なお、工程X2では、少なくとも被めっき層の一部が変形するように、被めっき層付き基板を変形させることが好ましい。
上記のように、被めっき層付き基板を所望の形状に変形させると、基板の変形に追従して、被めっき層も合わせて変形する。
被めっき層付き基板の変形方法は特に制限されず、例えば、真空成形、ブロー成形、フリーブロー成形、圧空成形、真空-圧空成形、及び、熱プレス成形等の公知の方法を用いることができる。変形の際に実施される熱処理の温度としては、基板の材料の熱変形温度の以上の温度であることが好ましく、ガラス転移温度(Tg)+50~350℃の範囲とすることが好ましい。 [Process X2]
Step X2 is a step of deforming the substrate with the layer to be plated to obtain the substrate with the layer to be plated having a three-dimensional shape. In step X2, it is preferable to deform the substrate with the layer to be plated so that at least a part of the layer to be plated is deformed.
As described above, when the substrate with the layer to be plated is deformed into a desired shape, the layer to be plated is also deformed following the deformation of the substrate.
The method for deforming the substrate with the layer to be plated is not particularly limited, and for example, known methods such as vacuum forming, blow molding, free blow molding, pressure forming, vacuum-pressure forming, and hot press forming can be used. The temperature of the heat treatment performed during the deformation is preferably a temperature equal to or higher than the thermal deformation temperature of the substrate material, and is preferably in the range of glass transition temperature (Tg) +50 to 350 ° C.
工程X3は、3次元形状を有する被めっき層付き基板中のパターン状被めっき層にめっき処理を施して、パターン状被めっき層上にパターン状の金属層を形成する工程である。
なお、本処理方法においては、工程X3の前に、パターン状被めっき層にめっき触媒又はその前駆体を付与する工程X4をさらに有するか、又は、めっき触媒又はその前駆体が工程X1のパターン状被めっき層に含有される。
以下では、工程X4を実施する形態について詳述する。 [Step X3, Step X4]
Step X3 is a step of forming a patterned metal layer on the patterned plated layer by plating the patterned plated layer in the substrate with the plated layer having a three-dimensional shape.
In addition, in this processing method, it has further the process X4 which provides a plating catalyst or its precursor to a pattern-like to-be-plated layer before process X3, or a plating catalyst or its precursor is the pattern shape of process X1. It is contained in the layer to be plated.
Below, the form which implements process X4 is explained in full detail.
めっき触媒又はその前駆体は、めっき処理の触媒及び/又は電極として機能するものである。
そのため、使用されるめっき触媒又はその前駆体の種類は、めっき処理の種類により適宜決定される。
なお、用いられるめっき触媒又はその前駆体は、無電解めっき触媒又はその前駆体であることが好ましい。以下で、主に、無電解めっき触媒又はその前駆体等について詳述する。 Step X4 is a step of applying a plating catalyst or a precursor thereof to the patterned layer to be plated. Since the above-mentioned interactive group is contained in the patterned layer to be plated, the above-mentioned interactive group adheres (adsorbs) the applied plating catalyst or its precursor depending on its function.
The plating catalyst or a precursor thereof functions as a catalyst for plating treatment and / or an electrode.
Therefore, the type of plating catalyst or precursor used is appropriately determined depending on the type of plating treatment.
In addition, it is preferable that the plating catalyst used or its precursor is an electroless plating catalyst or its precursor. Hereinafter, mainly the electroless plating catalyst or its precursor will be described in detail.
この無電解めっき触媒としては、金属コロイドを用いてもよい。
本工程において用いられる無電解めっき触媒前駆体とは、化学反応により無電解めっき触媒となりうるものであれば、特に制限なく使用できる。主には、上記無電解めっき触媒として挙げた金属の金属イオンが用いられる。 Any electroless plating catalyst can be used as long as it becomes an active nucleus at the time of electroless plating. Specifically, a metal having a catalytic ability for an autocatalytic reduction reaction (lower ionization tendency than Ni). And those known as metals that can be electrolessly plated). Specific examples include Pd, Ag, Cu, Ni, Pt, Au, and Co.
A metal colloid may be used as the electroless plating catalyst.
The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction. The metal ions of the metals mentioned as the electroless plating catalyst are mainly used.
上記溶媒としては、水又は有機溶媒が適宜使用される。 Examples of a method for applying a plating catalyst or a precursor thereof to a patterned plating layer include, for example, preparing a solution in which a plating catalyst or a precursor thereof is dispersed or dissolved in an appropriate solvent, and using the solution as a patterned plating layer What is necessary is just to apply | coat to the top or immerse a board | substrate with a to-be-plated layer in the solution.
As the solvent, water or an organic solvent is appropriately used.
めっき処理の方法は特に制限されず、例えば、無電解めっき処理、又は、電解めっき処理(電気めっき処理)が挙げられる。本工程では、無電解めっき処理を単独で実施してもよいし、無電解めっき処理を実施した後にさらに電解めっき処理を実施してもよい。
以下、無電解めっき処理、及び、電解めっき処理の手順について詳述する。 Next, a plating treatment is performed on the patterned layer to which the plating catalyst or its precursor is applied.
The method for the plating treatment is not particularly limited, and examples thereof include electroless plating treatment or electrolytic plating treatment (electroplating treatment). In this step, the electroless plating process may be performed alone, or after the electroless plating process, the electrolytic plating process may be further performed.
Hereinafter, the procedures of the electroless plating process and the electrolytic plating process will be described in detail.
無電解めっき処理は、例えば、無電解めっき触媒が付与された被めっき層付き基板を、水洗して余分な無電解めっき触媒(金属)を除去した後、無電解めっき浴に浸漬して行うことが好ましい。使用される無電解めっき浴としては、公知の無電解めっき浴を使用することができる。 The electroless plating process is a process in which a metal is deposited by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
The electroless plating treatment is performed, for example, by immersing the substrate with the layer to be plated, to which the electroless plating catalyst has been applied, in water, removing excess electroless plating catalyst (metal) and then immersing it in an electroless plating bath. Is preferred. As the electroless plating bath used, a known electroless plating bath can be used.
なお、上述したように、本工程においては、上記無電解めっき処理の後に、必要に応じて、電解めっき処理を行うことができる。このような形態では、形成されるパターン状の金属層の厚みを適宜調整可能である。 When the plating catalyst or its precursor applied to the patterned layer to be plated has a function as an electrode, electroplating can be performed on the patterned layer to which the catalyst or its precursor is applied. .
In addition, as above-mentioned, in this process, an electroplating process can be performed as needed after the said electroless-plating process. In such a form, the thickness of the patterned metal layer to be formed can be adjusted as appropriate.
なお、上記実施形態に係る配線基板の製造方法に用いる2枚の導電性フィルムは、同一の方法で作製されてもいいし、ことなる方法で作成されてもよい。すなわち、一方の導電性フィルムをフォトリソグラフィー法で作製し、他方の導電性フィルムを印刷法で作製してもよい。 By carrying out the above treatment, a patterned metal layer is formed on the patterned layer to be plated. Therefore, a desired electroconductive film can be obtained by forming a pattern-like to-be-plated layer according to the shape of the patterned metal layer to form.
In addition, the two electroconductive films used for the manufacturing method of the wiring board which concerns on the said embodiment may be produced by the same method, and may be produced by a different method. That is, one conductive film may be produced by a photolithography method, and the other conductive film may be produced by a printing method.
なお、導電性フィルムの製造方法は、上記方法には制限されない。
例えば、基板上に、めっき触媒又はその前駆体と相互作用する官能基、及び、重合性基を含有するパターン状の被めっき層前駆体層を形成して、被めっき層前駆体層付き基板を得る工程Y1と、
被めっき層前駆体層付き基板を変形させて、3次元形状を有する被めっき層前駆体層付き基板を得る工程Y2と、
被めっき層前駆体層にエネルギーを付与して、パターン状被めっき層を形成する工程Y3と、
パターン状被めっき層にめっき処理を施して、パターン状被めっき層上にパターン状の金属層を形成する工程Y4と、を有し、
工程Y3の後で、かつ、工程Y4の前に、パターン状被めっき層にめっき触媒又はその前駆体を付与する工程Y5をさらに有するか、又は、めっき触媒又はその前駆体が工程Aのパターン状の被めっき層前駆体層に含有される方法が挙げられる。 [Method 2 for producing conductive film]
In addition, the manufacturing method of an electroconductive film is not restrict | limited to the said method.
For example, a substrate to be plated precursor layer is formed by forming a patterned layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor and a polymerizable group on the substrate. Obtaining step Y1,
Step Y2 of obtaining a substrate with a layer to be plated precursor layer having a three-dimensional shape by deforming the substrate with a layer to be plated precursor layer,
A step Y3 of applying energy to the plated layer precursor layer to form a patterned plated layer;
And a step Y4 of forming a patterned metal layer on the patterned plated layer by performing a plating process on the patterned plated layer,
After the process Y3 and before the process Y4, the process further includes a process Y5 for applying a plating catalyst or a precursor thereof to the patterned layer to be plated, or the plating catalyst or the precursor thereof is a pattern of the process A. The method of containing in the to-be-plated layer precursor layer of this is mentioned.
また、例えば、基板上に、めっき触媒又はその前駆体と相互作用する官能基、及び、重合性基を含有する被めっき層前駆体層を形成して、被めっき層前駆体層付き基板を得る工程Z1と、
被めっき層前駆体層付き基板を変形させて、3次元形状を有する被めっき層前駆体層付き基板を得る工程Z2と、
被めっき層前駆体層の面形状に対応した立体形状を有し、且つ、開口部を有するフォトマスクを介して、被めっき層前駆体層に対してパターン状に露光を行う工程Z3と、
露光後の被めっき層前駆体層を現像して、パターン状被めっき層を形成する工程Z4と
パターン状被めっき層にめっき処理を施して、パターン状被めっき層上にパターン状の金属層を形成する工程Z5と、を有し、
工程Z4の後で、かつ、工程Z5の前に、パターン状被めっき層にめっき触媒又はその前駆体を付与する工程Z6をさらに有するか、又は、めっき触媒又はその前駆体が工程Aのパターン状の被めっき層前駆体層に含有される方法が挙げられる。 [Method 3 for producing conductive film]
Also, for example, a plating layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor and a polymerizable group is formed on the substrate to obtain a substrate with a plating layer precursor layer. Step Z1,
A step Z2 of deforming the substrate with the precursor layer to be plated to obtain the substrate with the precursor layer to be plated having a three-dimensional shape;
A step Z3 of exposing the plated layer precursor layer in a pattern through a photomask having a three-dimensional shape corresponding to the surface shape of the plated layer precursor layer and having an opening;
The exposed layer precursor layer to be exposed is developed to form a patterned plated layer Z4 and the patterned plated layer is plated to form a patterned metal layer on the patterned plated layer. Forming Z5, and
After the step Z4 and before the step Z5, the method further includes a step Z6 of applying a plating catalyst or a precursor thereof to the patterned layer to be plated, or the plating catalyst or the precursor thereof is a pattern of the step A The method of containing in the to-be-plated layer precursor layer of this is mentioned.
〔プライマー層形成用組成物の調製〕
以下の成分を混合し、プライマー層形成用組成物を得た。
シクロペンタノン 98質量%
Zetpol0020(日本ゼオン社製、水素化ニトリルゴム) 2質量% [Example 1]
[Preparation of primer layer forming composition]
The following components were mixed to obtain a primer layer forming composition.
Cyclopentanone 98% by mass
Zetpol0020 (manufactured by Zeon Corporation, hydrogenated nitrile rubber) 2% by mass
以下の成分を混合し、被めっき層形成用組成物1を得た。
2-プロパノール 87.31質量%
ポリアクリル酸25%水溶液(和光純薬社製) 10.8質量%
下記一般式(A)で表される化合物(式(A)において、Rは水素原子) 1.8質量%
IRGACURE127(BASF製) 0.09質量% [Preparation of composition 1 for forming plated layer]
The following components were mixed to obtain a composition 1 for forming a layer to be plated.
2-Propanol 87.31% by mass
Polyacrylic acid 25% aqueous solution (Wako Pure Chemical Industries, Ltd.) 10.8% by mass
A compound represented by the following general formula (A) (in formula (A), R is a hydrogen atom) 1.8% by mass
IRGACURE127 (BASF) 0.09% by mass
ポリカーボネート製基板(商品名:パンライトPC2151、帝人社製、厚み125μm)にプライマー層形成用組成物を平均乾燥膜厚1μmになるようにバーコーターを用いて塗布し、プライマー層を形成した。その上に上記被めっき層形成用組成物1を0.5μmの乾燥膜厚になるようにバーコーターを用いて塗布し、被めっき層前駆体層付き基板1を得た。
次に被めっき層前駆体層付き基板1をTrue Touch Evaluation kit CYTK58(Cypress社製タッチ駆動用IC(Integrated Circuit))の駆動パターンに合うパターン状の金属層が得られるよう設計されたフォトマスクを介して露光し、その後、1質量%の炭酸ナトリウム水溶液で現像して、True Touch(登録商標) Evaluation kit CYTK58の上面駆動パターンに合うパターン状被めっき層を備えたパターン状被めっき層付き基板1-1と、同じく下面駆動パターンに合うパターン状被めっき層を備えたパターン状被めっき層付き基板1-2を得た。
次に、パターン状被めっき層付き基板1-1及び1-2を半球状に真空熱成形した(図2A参照)。次に、得られた半球状の形状を有するパターン状被めっき層付き基板1-1及び1-2を、Pd触媒付与液オムニシールド1573アクチベータ(ローム・アンド・ハース電子材料株式会社)を3.6体積%になるよう純水で希釈し、0.1規定のHClにてpHを4.0に調整した水溶液に、半球状の被めっき層付き基板を45℃にて5分間浸漬し、その後、純水にて2回洗浄した。次に、得られた半球状の被めっき層付き基板を、還元剤サーキューポジットPBオキサイドコンバータ60C(ローム・アンド・ハース電子材料株式会社製)の0.8体積%水溶液に30℃にて5分間浸漬し、その後、純水にて2回洗浄した。その後、得られた半球状の被めっき層付き基板を、サーキューポジット4500(ローム・アンド・ハース電子材料株式会社製)のM剤12体積%、A剤6体積%、及び、B剤10体積%を混合して無電解めっき液を調製し、半球上の被めっき層付き基板を45℃にて15分間浸漬し、その後、純水にて洗浄してパターン状の金属層を形成し、半球状の曲面(3次元形状)を有する導電性フィルム1-1と1-2を得た。
次に、半球状の曲面を有する導電性フィルム1-1と1-2を、金型キャビティを形成可能な第1金型と第2金型にそれぞれ装着した。なお、このとき、導電性フィルム1-1及び1-2のパターン状の金属層がそれぞれ向かい合うように(それぞれの導電性フィルムの、パターン状の金属層を備える主面が、それぞれ金型キャビティ側に配置されている。得られる配線基板において上記パターン状の金属層が樹脂層を介して内面同士になる。)それぞれ第1金型と第2金型に装着した。その後、金型を型締めして金型キャビティを形成し、金型キャビティ内にポリカーボネートを射出成形して、半球状の曲面を有する配線基板を得た。上記配線基板を、タッチセンサー1とした。
なお、第1金型の形状は、得られた導電性フィルム1-1の3次元形状に対応した形状(合致した形状)であり、第2金型の形状は、得られた導電性フィルム1-2の3次元形状に対応した形状(合致した形状)であった。 [Production of touch sensor 1]
The primer layer forming composition was applied to a polycarbonate substrate (trade name: Panlite PC2151, manufactured by Teijin Ltd., thickness 125 μm) using a bar coater so as to have an average dry film thickness of 1 μm, thereby forming a primer layer. The composition 1 for plating layer formation was apply | coated using the bar-coater so that it might become a dry film thickness of 0.5 micrometer on it, and the board | substrate 1 with a plating layer precursor layer was obtained.
Next, a photomask designed to obtain a patterned metal layer that matches the drive pattern of True Touch Evaluation kit CYTK58 (Cypress Touch IC (Integrated Circuit)) is applied to the substrate 1 with the precursor layer to be plated. Then, development is performed with a 1% by mass aqueous sodium carbonate solution, and the substrate 1 with the patterned layer to be plated is provided with a patterned layer to be matched with the top drive pattern of True Touch (registered trademark) Evaluation kit CYTK58. -1 and a substrate 1-2 with a patterned plating layer having a patterned plating layer that matches the lower surface driving pattern.
Next, the substrates 1-1 and 1-2 with the patterned plated layer were vacuum thermoformed into a hemispherical shape (see FIG. 2A). Next, the obtained substrates 1-1 and 1-2 with a hemispherical pattern-like layer to be plated are placed on a Pd catalyst-providing liquid Omnishield 1573 activator (Rohm and Haas Electronic Materials Co., Ltd.). The substrate with the hemispherical layer to be plated is immersed in an aqueous solution diluted with pure water to 6% by volume and adjusted to pH 4.0 with 0.1 N HCl at 45 ° C. for 5 minutes, and then And washed twice with pure water. Next, the obtained hemispherical substrate with a layer to be plated was added to a 0.8% by volume aqueous solution of a reducing agent cycle positive PB oxide converter 60C (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 30 ° C. It was immersed for a minute and then washed twice with pure water. Thereafter, the obtained hemispherical substrate with a layer to be plated was added with 12% by volume of M agent, 6% by volume of A agent, and 10% by volume of B agent of Circuposit 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.). % To prepare an electroless plating solution, and the substrate with the layer to be plated on the hemisphere is immersed at 45 ° C. for 15 minutes, and then washed with pure water to form a patterned metal layer. Conductive films 1-1 and 1-2 having a curved surface (three-dimensional shape) were obtained.
Next, the conductive films 1-1 and 1-2 having a hemispherical curved surface were respectively attached to the first mold and the second mold capable of forming a mold cavity. At this time, the patterned metal layers of the conductive films 1-1 and 1-2 face each other (the main surface of each conductive film provided with the patterned metal layer is on the mold cavity side, respectively. In the obtained wiring board, the patterned metal layers are arranged on the inner surfaces through the resin layer.) Each was mounted on the first mold and the second mold. Thereafter, the mold was clamped to form a mold cavity, and polycarbonate was injection molded into the mold cavity to obtain a wiring board having a hemispherical curved surface. The wiring board was a touch sensor 1.
The shape of the first mold is a shape corresponding to the three-dimensional shape of the obtained conductive film 1-1 (matched shape), and the shape of the second mold is the obtained conductive film 1 -2 corresponding to the three-dimensional shape (matched shape).
〔タッチセンサー2の作製〕
被めっき層前駆体層付き基板の被めっき層前駆体層の反対側の基板の主面上に自己修復層(アイカ工業製Z913-3)を形成した以外は実施例1と同様の方法によりタッチセンサー2を作製した。 [Example 2]
[Production of touch sensor 2]
Touch in the same manner as in Example 1 except that a self-healing layer (Z913-3 manufactured by Aika Industry Co., Ltd.) is formed on the main surface of the substrate on the opposite side of the substrate to be plated of the substrate to be plated. Sensor 2 was produced.
〔タッチセンサー3の作製〕
半球状の曲面を有する導電性フィルム1-1と1-2を金型に装着する際、パターン状の金属層が、それぞれ金型側を向くように(得られる配線基板において、上記パターン状の金属層がそれぞれ最外面になるように)配置した以外は、実施例1と同様にして、タッチセンサー3を得た。 [Example 3]
[Production of touch sensor 3]
When the conductive films 1-1 and 1-2 having a hemispherical curved surface are attached to the mold, the patterned metal layers are respectively directed to the mold side (in the obtained wiring board, the pattern-shaped metal layer). A touch sensor 3 was obtained in the same manner as in Example 1 except that the metal layers were arranged so that the metal layers were the outermost surfaces.
〔タッチセンサー4の作製〕
半球状の曲面を有する導電性フィルム1-1と1-2のパターン状の金属層が配置された主面上に、アクリサンデー接着剤(アクリサンデー社製、ポリカーボネート用接着剤)を塗布し、粘着剤が塗布されたパターン状の金属層が対向するように貼り合わせて、タッチセンサー4を得た。 [Comparative Example 1]
[Production of touch sensor 4]
An adhesive is applied on the main surface on which the patterned metal layers of the conductive films 1-1 and 1-2 having a hemispherical curved surface are disposed, and an adhesive is obtained. The touch-sensitive sensor 4 was obtained by pasting together so that the patterned metal layers coated with were opposed to each other.
タッチセンサー1~4についてタッチセンサーとしての駆動を確認した。
その結果、タッチセンサー1及び2はタッチセンサーとして問題なく駆動した。
また、タッチセンサー3には、パターン状の金属層に、金型と擦れたような傷があり、一部に断線している箇所はあったが、タッチセンサーとしては駆動した。
一方、タッチセンサー4は導電性フィルム1-1と1-2の間に気泡が存在し、気泡の有無により、タッチセンサー面内で検出感度に差があり、タッチセンサーとしては不十分な駆動しかせず、タッチセンサーとして実用できなかった。 [Evaluation: Drive as touch sensor]
The touch sensors 1 to 4 were confirmed to be driven as touch sensors.
As a result, the touch sensors 1 and 2 were driven as a touch sensor without any problem.
Further, the touch sensor 3 was scratched on the patterned metal layer and rubbed with the mold, and a part of the touch sensor 3 was disconnected, but the touch sensor was driven.
On the other hand, the touch sensor 4 has air bubbles between the conductive films 1-1 and 1-2, and there is a difference in detection sensitivity within the surface of the touch sensor depending on the presence or absence of air bubbles. I couldn't put it to practical use as a touch sensor.
12 :基板
12a :半球部
12b :平坦部
14 :パターン状の金属層
20 :第1金型
22 :第2金型
24a :配線基板
30 :金属細線
31 :格子
70 :基板
71 :主面
DESCRIPTION OF SYMBOLS 10: Conductive film 12: Board |
Claims (13)
- 基板と前記基板の少なくとも一方の主面上に配置されたパターン状の金属層とを備え、3次元形状を有する導電性フィルムを2枚用意する工程Aと、
第1金型及び第2金型のうちの一方の金型上に前記導電性フィルムの一方を配置し、
前記第1金型及び前記第2金型のうちの他方の金型上に前記導電性フィルムの他方を配置し、
前記第1金型と前記第2金型とを型締めし、
前記第1金型と前記第2金型とによって形成される金型キャビティ内に樹脂を注入して、2枚の前記導電性フィルムが樹脂層を介して配置されてなる配線基板を製造する工程Bと、
を含有する配線基板の製造方法。 Step A comprising two conductive films having a three-dimensional shape, comprising a substrate and a patterned metal layer disposed on at least one main surface of the substrate;
Placing one of the conductive films on one of the first mold and the second mold;
Placing the other of the conductive films on the other of the first mold and the second mold;
Clamping the first mold and the second mold,
Injecting resin into a mold cavity formed by the first mold and the second mold to manufacture a wiring board in which the two conductive films are arranged via a resin layer. B and
Of manufacturing a wiring board containing - 前記工程Aが、
前記基板上に、めっき触媒又はその前駆体と相互作用する官能基を含有するパターン状被めっき層を形成して、被めっき層付き基板を得る工程X1と、
前記被めっき層付き基板を変形させて、3次元形状を有する被めっき層付き基板を得る工程X2と、
前記3次元形状を有する被めっき層付き基板中の前記パターン状被めっき層にめっき処理を施して、前記パターン状被めっき層上にパターン状の金属層を形成する工程X3と、を有し、
前記工程X2の後で、かつ、前記工程X3の前に、前記パターン状被めっき層にめっき触媒又はその前駆体を付与する工程X4をさらに有するか、又は、めっき触媒又はその前駆体が前記工程X1の前記パターン状被めっき層に含有される、請求項1に記載の配線基板の製造方法。 Step A is
A step X1 of obtaining a substrate with a layer to be plated by forming a patterned layer to be plated containing a functional group that interacts with the plating catalyst or its precursor on the substrate;
Step X2 for obtaining a substrate with a layer to be plated having a three-dimensional shape by deforming the substrate with a layer to be plated;
A step X3 of forming a patterned metal layer on the patterned plated layer by plating the patterned plated layer in the substrate with the plated layer having the three-dimensional shape,
After the step X2 and before the step X3, the method further includes a step X4 of applying a plating catalyst or a precursor thereof to the patterned layer to be plated, or the plating catalyst or the precursor thereof is the step The manufacturing method of the wiring board of Claim 1 contained in the said pattern-like to-be-plated layer of X1. - 前記被めっき層が、重合開始剤、及び、以下の化合物X又は組成物Yを含有する被めっき層形成用組成物により形成された被めっき層前駆体層を硬化させたものである、請求項2に記載の配線基板の製造方法。
化合物X:めっき触媒又はその前駆体と相互作用する官能基、及び、重合性基を含有する化合物
組成物Y:めっき触媒又はその前駆体と相互作用する官能基を含有する化合物、及び、重合性基を含有する化合物を含有する組成物 The said to-be-plated layer hardens | cures the to-be-plated layer precursor layer formed with the polymerization initiator and the to-be-plated layer forming composition containing the following compound X or the composition Y, Claims A method for manufacturing a wiring board according to 2.
Compound X: a functional group that interacts with a plating catalyst or a precursor thereof, and a compound containing a polymerizable group Composition Y: a compound that contains a functional group that interacts with a plating catalyst or a precursor thereof, and polymerizability Composition containing a compound containing a group - 前記工程X1が、基板上に、めっき触媒又はその前駆体と相互作用する官能基を含有する被めっき層前駆体層を形成する工程と、
パターン状の開口部を備えるフォトマスクを介して、前記被めっき層前駆体層に対してパターン状にエネルギーを付与する工程と、
前記エネルギー付与後の前記被めっき層前駆体層を現像して、前記パターン状被めっき層を得る工程と、を含有する請求項2又は3に記載の配線基板の製造方法。 The step X1 forms a plated layer precursor layer containing a functional group that interacts with the plating catalyst or its precursor on the substrate; and
A step of applying energy in a pattern to the plated layer precursor layer through a photomask having a pattern-shaped opening;
The process for producing a wiring board according to claim 2, further comprising: developing the plated layer precursor layer after the application of energy to obtain the patterned plated layer. - 前記基板が、ポリカーボネートからなる、請求項1~4のいずれか一項に記載の配線基板の製造方法。 The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein the board is made of polycarbonate.
- 前記樹脂が、ポリカーボネートからなる、請求項1~5のいずれか一項に記載の配線基板の製造方法。 The method for manufacturing a wiring board according to any one of claims 1 to 5, wherein the resin is made of polycarbonate.
- 前記工程Bにおいて、
前記第1金型及び第2金型のうちの一方の金型上に前記導電性フィルムの一方を配置し、前記第1金型及び前記第2金型のうちの他方の金型上に前記導電性フィルムの他方を配置する際、
2枚の前記導電性フィルムが備える前記パターン状の金属層が配置された前記主面が、それぞれ、金型キャビティ側となるよう配置される、請求項1~6のいずれか一項に記載の配線基板の製造方法。 In step B,
One of the conductive films is disposed on one of the first mold and the second mold, and the other of the first mold and the second mold is on the other mold. When placing the other side of the conductive film,
7. The main surface according to claim 1, wherein the main surfaces on which the patterned metal layers included in the two conductive films are disposed are on the mold cavity side, respectively. A method for manufacturing a wiring board. - 2枚の前記導電性フィルムの少なくとも一方が、前記パターン状の金属層が配置された前記主面と反対側の主面上に、自己修復層を備える、請求項1~7のいずれか一項に記載の配線基板の製造方法。 The at least one of the two conductive films includes a self-healing layer on a main surface opposite to the main surface on which the patterned metal layer is disposed. The manufacturing method of the wiring board as described in 2 ..
- 前記配線基板が、タッチセンサー用の配線基板である、請求項1~8のいずれか一項に記載の配線基板の製造方法。 The method for manufacturing a wiring board according to any one of claims 1 to 8, wherein the wiring board is a wiring board for a touch sensor.
- 前記配線基板が、静電容量式タッチセンサー用の配線基板であり、2枚の前記導電性フィルムのうち、一方が送信用導電性フィルムであり、他方が受信用導電性フィルムである、請求項1~9のいずれか一項に記載の配線基板の製造方法。 The wiring board is a wiring board for a capacitive touch sensor, and one of the two conductive films is a transmitting conductive film and the other is a receiving conductive film. 10. The method for manufacturing a wiring board according to any one of 1 to 9.
- 基板及び前記基板の少なくとも一方の主面上に配置されたパターン状の金属層を備え、3次元形状を有する2枚の導電性フィルムと、
樹脂層と、を含有し、
前記2枚の導電性フィルムが、前記樹脂層を介して配置されてなる配線基板。 Two conductive films having a three-dimensional shape, comprising a substrate and a patterned metal layer disposed on at least one main surface of the substrate;
A resin layer,
A wiring board in which the two conductive films are arranged via the resin layer. - 前記2枚の導電性フィルムがそれぞれ備える前記パターン状の金属層が、前記樹脂層を介して対向して配置され、かつ、それぞれの前記パターン状の金属層が、前記樹脂層と直接接している、請求項11に記載の配線基板。 The patterned metal layers respectively provided in the two conductive films are arranged to face each other via the resin layer, and each of the patterned metal layers is in direct contact with the resin layer. The wiring board according to claim 11.
- 前記2枚の導電性フィルムの少なくとも一方が、前記パターン状の金属層が配置された前記主面と反対側の主面上に、自己修復層を備える、請求項11又は12に記載の配線基板。 The wiring board according to claim 11 or 12, wherein at least one of the two conductive films includes a self-repairing layer on a main surface opposite to the main surface on which the patterned metal layer is disposed. .
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