CN109411396A - A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method - Google Patents
A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method Download PDFInfo
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- CN109411396A CN109411396A CN201811447717.5A CN201811447717A CN109411396A CN 109411396 A CN109411396 A CN 109411396A CN 201811447717 A CN201811447717 A CN 201811447717A CN 109411396 A CN109411396 A CN 109411396A
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- joint robot
- visual inspection
- silicon wafer
- piece basket
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 238000011179 visual inspection Methods 0.000 title claims abstract description 32
- 238000001514 detection method Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 5
- 241001465382 Physalis alkekengi Species 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention provides a kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection methods, including frame, six-joint robot, auxiliary lamp and piece basket, silicon wafer is placed in piece basket, six-joint robot, auxiliary lamp and piece basket are respectively positioned in frame, auxiliary lamp includes fluorescent lamp, strip light, major light and grating, six-joint robot is connect with frame upper bed-plate, fluorescent lamp and strip light are arranged on frame top, and it is located above piece basket, major light is fixed above piece basket, the side of major light is vertically arranged with grating, and six-joint robot is connect with six axis mouses.The present invention utilizes six-joint robot to assist visual inspection silicon chip surface quality, and using auxiliary visual inspection method, increase detection accuracy is high, time-consuming is short, can be automatically controled, reduces artificial participation, raising testing efficiency.
Description
Technical field
The invention belongs to semi-conductor silicon chip detection device fields, assist visual inspection silicon wafer more particularly, to a kind of six-joint robot
Device and aided detection method.
Background technique
In semiconductor silicon single crystal manufacturing field, the manual visual inspection of silicon wafer will have a direct impact on product qualification rate.Existing test skill
The shortcomings that art detection silicon chip surface quality, is that artificial visual inspection error, or even meeting maloperation can be generated.By assisting visual inspection equipment
Integrated optimization, it is possible to reduce artificial visual inspection error improves the degree of automation.It can be seen that accurately and rapidly visual inspection silicon wafer is
No qualification has very important application value to batch visual inspection silicon chip surface quality.
Summary of the invention
In view of this, the present invention is directed to propose a kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method,
Visual inspection silicon chip surface quality is assisted using six-joint robot, using auxiliary visual inspection method, increase detection accuracy is high, time-consuming is short, can
It automatically controls, reduces artificial participation, improves testing efficiency.
In order to achieve the above objectives, the technical scheme of the present invention is realized as follows:
A kind of six-joint robot auxiliary visual inspection silicon chip devices, including frame, six-joint robot, auxiliary lamp and piece basket, silicon
Piece is placed in piece basket, and six-joint robot, auxiliary lamp and piece basket are respectively positioned in frame, and auxiliary lamp includes fluorescent lamp, bar shaped
Lamp, major light and grating, six-joint robot are connect with frame upper bed-plate, and fluorescent lamp and strip light are arranged on frame top, and position
Above piece basket, major light is fixed above piece basket, and the side of major light is vertically arranged with grating, six-joint robot and six
The connection of axis mouse.Six-joint robot can make silicon wafer rotate and move along 6 freedom degrees, control silicon wafer placement position.Auxiliary lamp
It observes and identifies silicon wafer, when occurring identifying deviation, manually adjust silicon wafer using six axis mouses and put, it is identified, it is real
Now automatic detection.
Further, the lamp cap of major light diagonally downward, is radiated at from the silicon wafer that piece basket takes out.
Further, the lamp cap position of major light tilts down 60 °.
Further, grating model F3SJ-A0295N30, producer: Omron.
Further, fluorescent lamp model TL5-HE-14W830, producer: Philip.
Further, strip light model HX-30120-38W, brand ring are auspicious.
Further, six axis mouses include gyroscope and inertia meter.Everyone observation angle is different, automatically records its high frequency
The position of appearance;Another person's observation automatically records the position of another its high frequency appearance, and the mutual switching of different angle is convenient for
Everyone repetitive operation.
The present invention also provides can a kind of auxiliary visual inspection silicon chip devices auxiliary visual inspection of six-joint robot method, including walk as follows
It is rapid:
Step 1: six-joint robot is moved to the piece basket station that silicon wafer is filled on right side by the position HOME, draws silicon wafer;
Step 2: six-joint robot follows six axis mouses servo-actuated, the placement position of silicon wafer is constantly regulate, by largely learning
It practises, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: and then the silicon wafer got is sent to designated position respectively, when there is deviation in placement position, six-joint robot
Control is transferred to artificial six axis mouse operation and control and is recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot to control automatically after manual control six-joint robot completes detection
System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, underproof to be placed into unqualified basket, so recycles.
Compared with the existing technology, six-joint robot auxiliary visual inspection silicon chip devices of the present invention and aided detection method tool
There is following advantage:
Six-joint robot auxiliary visual inspection silicon chip devices of the present invention and aided detection method, may be implemented silicon wafer each
Visual inspection under a angle, various light efficiently avoids the drawbacks such as high, the acquisition uncertainty of artificial visual inspection error, error rate, mentions
High visual inspection accuracy, reduces cost, saves the time, improves working efficiency.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram that six-joint robot described in the embodiment of the present invention assists visual inspection silicon chip devices;
Fig. 2 is the positional relationship that six-joint robot described in the embodiment of the present invention assists each section inside visual inspection silicon chip devices
Schematic diagram.
Description of symbols:
1- frame;2- six-joint robot;3- fluorescent lamp;4- strip light;5- major light;6- grating;7- piece basket;Six axis mouse of 8-
Mark.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can
To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can
To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition
Concrete meaning in the present invention.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figs. 1-2, a kind of six-joint robot assists visual inspection silicon chip devices, including frame 1, six-joint robot 2, auxiliary
Lamps and lanterns and piece basket 7, silicon wafer are placed in piece basket 7, and six-joint robot 2, auxiliary lamp and piece basket 7 are respectively positioned in frame 1, auxiliary lamp
Tool includes fluorescent lamp 3, strip light 4, major light 5 and grating 6, and six-joint robot 2 is connect with 1 upper bed-plate of frame, fluorescent lamp 3 and item
The setting of shape lamp 4 is located at 7 top of piece basket on the top of frame 1, and major light 5 is fixed above piece basket 7, the side of major light 5
It is vertically arranged with grating 6, six-joint robot 2 is connect with six axis mouses 8.
The lamp cap of above-mentioned major light 5 diagonally downward, is radiated at from the silicon wafer that piece basket 7 takes out.
The lamp cap position of above-mentioned major light 5 tilts down 60 °.
Above-mentioned 6 model F3SJ-A0295N30 of grating, producer: Omron.
Above-mentioned 3 model TL5-HE-14W830 of fluorescent lamp, producer: Philip.
Above-mentioned 4 model HX-30120-38W of strip light, brand ring are auspicious.
Above-mentioned six axis mouse 8 includes gyroscope and inertia meter.
Working principle:
The following steps are included:
Step 1: six-joint robot 2 is moved to 7 station of piece basket that silicon wafer is filled on right side by the position HOME, silicon wafer is drawn;
Step 2: six-joint robot 2 follows six axis mouses 8 servo-actuated, the placement position of silicon wafer is constantly regulate, by a large amount of
Study, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: the silicon wafer got then is sent to designated position respectively, and when there is deviation in placement position, six-joint robot
2 controls are transferred to artificial six axis mouse 8 to manipulate and are recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot 2 to control automatically after manual control six-joint robot 2 completes detection
System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, and it is underproof to be placed into unqualified basket, so recycle.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of six-joint robot assists visual inspection silicon chip devices, it is characterised in that: including frame (1), six-joint robot (2), auxiliary
Lamps and lanterns and piece basket (7) are helped, silicon wafer is placed in piece basket (7), and six-joint robot (2), auxiliary lamp and piece basket (7) are respectively positioned on frame
(1) in, auxiliary lamp includes fluorescent lamp (3), strip light (4), major light (5) and grating (6), six-joint robot (2) and frame
(1) upper bed-plate connects, and fluorescent lamp (3) and strip light (4) are arranged on frame (1) top, and are located above piece basket (7), major light
(5) it is fixed at piece basket (7) above, the side of major light (5) is vertically arranged with grating (6), six-joint robot (2) and six axis
Mouse (8) connection.
2. six-joint robot according to claim 1 assists visual inspection silicon chip devices, it is characterised in that: the lamp of major light (5)
Head tilt is downward, is radiated at from the silicon wafer that piece basket (7) take out.
3. six-joint robot according to claim 2 assists visual inspection silicon chip devices, it is characterised in that: the lamp of major light (5)
Head position tilts down 60 °.
4. six-joint robot according to claim 1 assists visual inspection silicon chip devices, it is characterised in that: six axis mouses (8) packet
Include gyroscope and inertia meter.
5. a kind of side using six-joint robot according to any one of claims 1-4 auxiliary visual inspection silicon chip devices auxiliary visual inspection
Method, characterized by the following steps:
Step 1: six-joint robot (2) is moved to piece basket (7) station that silicon wafer is filled on right side by the position HOME, draws silicon wafer;
Step 2: six-joint robot (2) follows six axis mouses (8) servo-actuated, the placement position of silicon wafer is constantly regulate, by a large amount of
Study, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: and then the silicon wafer got is sent to designated position respectively, when there is deviation in placement position, six-joint robot (2)
Control is transferred to artificial six axis mouse (8) to manipulate and is recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot (2) to control automatically after manual control six-joint robot (2) completes detection
System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, underproof to be placed into unqualified basket, so recycles.
Priority Applications (1)
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CN201811447717.5A CN109411396B (en) | 2018-11-29 | 2018-11-29 | Six-axis robot auxiliary visual inspection silicon wafer device and auxiliary detection method |
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CN201811447717.5A CN109411396B (en) | 2018-11-29 | 2018-11-29 | Six-axis robot auxiliary visual inspection silicon wafer device and auxiliary detection method |
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CN109411396B CN109411396B (en) | 2024-06-04 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114408301A (en) * | 2022-03-01 | 2022-04-29 | 中环领先半导体材料有限公司 | Automatic packaging design method for large-diameter silicon wafer box |
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