CN106112182A - A kind of full-automatic ball attachment device and application thereof - Google Patents
A kind of full-automatic ball attachment device and application thereof Download PDFInfo
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- CN106112182A CN106112182A CN201610545950.1A CN201610545950A CN106112182A CN 106112182 A CN106112182 A CN 106112182A CN 201610545950 A CN201610545950 A CN 201610545950A CN 106112182 A CN106112182 A CN 106112182A
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- ball
- bulb
- net plate
- case
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of full-automatic ball attachment device and application thereof, this device includes ball mechanism, plant net plate (5) and six axis robot (7), ball mechanism includes for ball case (4), for bulb (1), for ball cylinder (2) and straight line module (8), it is erected on straight line module (8) for ball case (4), connect with for bulb (1), make for the solder ball in ball case (4) by being evenly distributed on the side planting net plate (5) for bulb (1) for ball cylinder (2) on-off action, plant the upper processing of net plate (5) corresponding with wafer PAD point, the mesh leak into for stannum ball, six axis robot (7) is fixed on plants net plate (5) side.Compared with prior art, the present invention has raising efficiency, advantages of simple structure and simple.
Description
Technical field
The invention belongs to quasiconductor high-end sealed in unit field, especially relate to a kind of full-automatic ball attachment device and answer
With, plant ball equipment during belonging to advanced package technologies.
Background technology
Wafer scale ball attachment machine is a kind of advanced semiconductor sealed in unit, helps weldering for being precisely positioned over to have printed by stannum ball
On the wafer of agent, the stannum ball sphere diameter that wafer current level ball attachment machine uses, typically in 75 μm～300 μ m, needs big when planting ball
The stannum ball of amount, is one of its key technology for ball.
Wafer scale is planted ball equipment and is substantially used tool for ball, automatic ball-embedding mechanism for ball, plant the modes such as ball, mesh manually
Front wafer ball attachment machine mainly uses automatic ball-embedding mechanism for ball, plants ball mode manually.
Tool is for ball aspect, Authorization Notice No. CN201529822U, Authorization Notice No. CN2691767Y, Authorization Notice No.
The Chinese patent of CN2691766Y discloses one tool identical with substrate or wafer size of making, tool makes and needs
Plant the corresponding pin of ball position or hole, utilize vacuum to be drawn onto on tool by microsphere at the feeder channel of vibrations or swing feeder channel, then
By accurate alignment system, microsphere is implanted wafer.This kind of mode tool makes complex and expensive, actuating mechanism complexity, needs figure
As identifying system, Precise Position System, high-performance detecting system etc., quality of hardware requires higher, and price is extremely expensive.
Automatic ball-embedding mechanism is for ball aspect, publication number: CN1984535A, Authorization Notice No. CN101604618B, mandate public affairs
The Chinese patent of announcement CN202796892U discloses plants ball for automatic brush or compensating squeeze head formula plants ball, and ball mechanism is with planting
Bulb moves together, and mechanism's design is complicated, tool changes trouble, and solder ball is likely to remain in ball attachment machine structure, is not easily cleaned, can
Bastard phenomenon can occur.
Planting ball aspect manually, the China of Authorization Notice No. CN203774257U Authorization Notice No. CN203617255U is specially
Profit discloses employing manual operations, and this kind of mode needs professional operator to operate, and is difficult to hold the demand of stannum ball, sometimes
The phenomenon of waste stannum ball occur, under the factory mass condition of production, planting ball quality may be affected by manually-operated.
Summary of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and a kind of raising efficiency, structure are provided
Simple full-automatic ball attachment device and application thereof.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of full-automatic ball attachment device, including ball mechanism, plants net plate and six axis robot,
Described ball mechanism includes that described is erected at for ball case for ball case, for bulb, for ball cylinder and straight line module
On straight line module, connecting with for bulb, described makes for the solder ball in ball case by equal for bulb for ball cylinder on-off action
Even it is distributed in the side planting net plate,
Described plants processing mesh corresponding with wafer PAD point, that leak on net plate for stannum ball,
Described six axis robot is fixed on plants net plate side, is supplied by ball mechanism along set path by planting ball scraper plate
The solder ball answered is planted on wafer by planting net plate.
Described supplies bulb at the degree of freedom of Z-direction for the control of ball cylinder.
Described straight line module control for bulb X to degree of freedom.
Described ball mechanism also includes that detection is for quantity detection sensor more than the stannum ball of solder ball quantity in ball case.
Described is connected on straight line module for ball case is detachable.
Described net plate of planting is provided with the laser sensor of multiple detection solder ball implantation amount.
A kind of application of full-automatic ball attachment device, employing following steps:
A () wafer is sent to plant below net plate via wafer transport mechanism, para-position rises to adsorb after adjusting plants net
Plate, six axis robot is in standby dodges position；
B () is initially case of bending for bulb, electromagnetic valve controls, for ball cylinder action, to drive and rise along Z-direction for ball case, supplies
Bulb is straightened by case of bending, falls into via confession bulb for the solder ball in ball case and plant net plate under the effect of self gravitation
Front side, straight line module drives for ball case with for bulb sweeping action, makes solder ball be evenly distributed in the front side planting net plate；
C () solder ball has supplied after, electromagnetic valve controls to drop to initial position for ball cylinder along Z-direction, bends for bulb,
Solder ball cannot flow out from for bulb, and to stop supply solder ball, ball mechanism is parked in dodges position of readiness；
D the drive of () six axis robot is planted ball scraper plate and is moved to plant ball initial position, the solder ball of ball mechanism supply pressed
Path of motion according to planning carries out planting ball.
Wafer PAD point described in step (a) and plant the mesh one_to_one corresponding of net plate.
Described net plate of planting is provided with the laser sensor of detection solder ball implantation amount, when certain region planted on net plate
Solder ball amount is too low, and laser sensor triggers ball mechanism and performs solder ball and replenish the supply action.
Compared with prior art, the invention have the advantages that
(1) this confession ball mode coordinates six degree of freedom mechanical hand to carry out automatic ball-embedding, can by programme-control stannum ball point
Cloth and quantity delivered, can realize uninterruptedly for ball, lifting means efficiency.
(2) design of this confession ball mode structure is simple, easy to control, can be huge for ball mode complexity to save automatic ball-embedding mechanism
Big mechanism, makes equipment be easily maintained.
(3) this confession ball mode can realize the solder ball of a kind corresponding one for ball case, change quick side for ball case
Just, it is to avoid when changing wafer kind, bastard phenomenon occurs.For ball case without special processing, belong to buying product, many product can be met
The wafer planted plants ball demand.
(4) big for ball case storage ball amount, it is possible to reduce the frequency of ball case tip-in, particularly plant produced 12Inch and above
Wafer, consumption ball amount is huge, and wafer needs to plant million solder ball.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the plan structure schematic diagram of the present invention；
Fig. 3 is the structural representation of ball mechanism；
Fig. 4 is structural representation during ball mechanism closedown；
Fig. 5 is structural representation during ball mechanism unlatching；
Fig. 6 is for structural representation during ball.
In figure, 1-for bulb, 2-for quantity detection sensor more than ball cylinder, 3-solder ball, 4-for ball case, 5-plant net plate,
6-plant ball scraper plate, 7-six axis robot, 8-straight line module, 9-wafer position, 10-servomotor, 11-solder ball region, 12-swash
Optical sensor.
Detailed description of the invention
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment
A kind of full-automatic ball attachment device, as shown in Figure 1-2, this device includes ball mechanism, plants net plate 5 and six its structure
Axis robot 7.The structure of ball mechanism is as it is shown on figure 3, include for ball case 4, for bulb 1, for ball cylinder 2, the detection of stannum ball surplus
Sensor 3, straight line module 8, by the degree of freedom controlling to supply bulb 1 in Z-direction for ball cylinder 2, straight line module 8 passes through servomotor
10 control for bulbs 1 X to degree of freedom.It is connected on straight line module 8 for ball case 4 is detachable, connects with for bulb 1, supply
Ball cylinder 2 on-off action makes for the solder ball in ball case 4 by being evenly distributed on the side planting net plate 5 for bulb 1, more than stannum ball
Quantity detection sensor 3 detection is for solder ball quantity in ball case 4.Plant processing on net plate 5 corresponding with wafer position 9, for stannum
The mesh that ball leaks into, plants net plate 5 and is provided with the laser sensor 12 of multiple detection solder ball implantation amount.Six axis robot 7 is solid
It is scheduled on and plants net plate 5 side, by the way of planting ball scraper plate 6 and planting ball manually along set path imitation, ball mechanism is supplied
The solder ball answered is planted on wafer by planting net plate 5.
This device is in use, wafer is sent to the appointment position planted below net plate 5 via wafer transport mechanism, by phase
After machine carries out para-position adjustment to wafer and web plate, wafer conveyance platform Z-direction mechanism rises makes wafer to planting ball position, adsorbs and plants
Net plate 5, wafer PAD point and plant the mesh one_to_one corresponding of net plate 5.Six axis robot 7 is now in standby dodging position, directly
Line module 8 and confession ball cylinder 2 can realize the degree of freedom of X and Z-direction respectively, by controlling supply solder ball for ball cylinder 2, pass through
Straight line module realizes solder ball and is planting being uniformly distributed on net plate 5.Specific implementation process is as follows: as shown in Figure 4 for ball cylinder 2
When being in original state, for bulb 1 in case of bending, cannot flow out from for bulb 1 for the solder ball in ball case 4.Such as Fig. 5 institute
Show, when electromagnetic valve controls, for ball cylinder 2 action, to drive and rise along Z-direction for ball case 4, be straightened by case of bending for bulb 1, supply
Solder ball in ball case 3 falls into the front side planting net plate 5, straight line module 8 simultaneously under the effect of self gravitation via confession bulb 1
Drive for ball case 4 and supply bulb 1 with constant speed sweeping action, making solder ball be evenly distributed in the front side planting net plate 5,
After solder ball supply is a certain amount of, electromagnetic valve controls to drop to initial position for ball cylinder 2 along Z-direction, bends for bulb 1, scolding tin
Ball cannot flow out from for bulb 1, and to stop supply solder ball, ball mechanism is parked in dodges position of readiness.Then six shaft mechanical
Hands 7 drive is planted ball scraper plate 6 and is moved to plant ball initial position, the solder ball of ball mechanism supply is entered according to the path of motion of planning
Row plants ball.As shown in Figure 6, owing to wafer is rounded, consume the amount of solder ball not planting ball scraper plate 6 direction of motion diverse location
With, it is provided with multiple laser sensor 12 and detects the solder ball amount planting on net plate 5, the weldering in the solder ball region 11 on web plate
When stannum ball amount is less than certain value, laser sensor 12 triggers, and ball mechanism performs solder ball supply action, and ball mechanism is planting ball
The front side of web plate 5 supplements solder ball, thus ensures to plant the abundant of stannum ball amount on net plate 5.More than solder ball, quantity detection sensor 3 is right
Detecting for the solder ball surplus in ball case 4, when solder ball is less than a certain amount, system alarm prompting adds solder ball.
For ball case can realize the solder ball of a kind corresponding one for ball case, when wafer kind is replaced, can easily from
For the dismounting of ball case clamping device for ball case 4 to switch the kind of solder ball, effectively prevent bastard phenomenon.
Claims (9)
1. a full-automatic ball attachment device, it is characterised in that this device includes ball mechanism, plants net plate (5) and six shaft mechanicals
Hands (7),
Described ball mechanism includes that described supplies ball for ball case (4), for bulb (1), for ball cylinder (2) and straight line module (8)
Box (4) is erected on straight line module (8), connects with for bulb (1), and described makes for ball case (4) for ball cylinder (2) on-off action
In solder ball plant the side of net plate (5) by being evenly distributed on for bulb (1),
Described plants net plate (5) upper processing mesh corresponding with wafer PAD point, that leak into for stannum ball,
Described six axis robot (7) is fixed on plants net plate (5) side, will be for ball along set path by planting ball scraper plate (6)
The solder ball of mechanism's supply is planted on wafer by planting net plate (5).
A kind of full-automatic ball attachment device the most according to claim 1, it is characterised in that described controls for ball cylinder (2)
Supply bulb (1) at the degree of freedom of Z-direction.
A kind of full-automatic ball attachment device the most according to claim 1, it is characterised in that described straight line module (8) controls
For bulb (1) X to degree of freedom.
A kind of full-automatic ball attachment device the most according to claim 1, it is characterised in that described ball mechanism also includes inspection
Quantity detection sensor (3) more than the stannum ball of solder ball quantity in survey confession ball case (4).
A kind of full-automatic ball attachment device the most according to claim 1, it is characterised in that described is detachable for ball case (4)
Formula is connected on straight line module (8).
A kind of full-automatic ball attachment device the most according to claim 1, it is characterised in that described planting sets on net plate (5)
There is the laser sensor (12) of multiple detection solder ball implantation amount.
7. the application of a full-automatic ball attachment device, it is characterised in that employing following steps:
A () wafer is sent to plant net plate (5) lower section via wafer transport mechanism, para-position rises to adsorb after adjusting plants net plate
(5), six axis robot (7) is in and standby dodges position；
B () is initially case of bending for bulb (1), electromagnetic valve controls for ball cylinder (2) action, drives for ball case (4) in Z-direction
Rise, be straightened by case of bending for bulb (1), for the solder ball in ball case (4) under the effect of self gravitation via for bulb
(1) falling into and plant the front side of net plate (5), straight line module (8) drives for ball case (4) with for bulb (1) sweeping action, makes solder ball
It is evenly distributed in the front side planting net plate (5)；
C () solder ball has supplied after, electromagnetic valve controls to drop to initial position for ball cylinder (2) along Z-direction, curved for bulb (1)
Folding, solder ball cannot be from for flowing out bulb (1), and to stop supply solder ball, ball mechanism is parked in dodges position of readiness；
D () six axis robot (7) drive is planted ball scraper plate (6) and is moved to plant ball initial position, the solder ball supplied by ball mechanism
Carry out planting ball according to the path of motion of planning.
The application of a kind of full-automatic ball attachment device the most according to claim 7, it is characterised in that described in step (a)
Wafer PAD point and plant the mesh one_to_one corresponding of net plate (5).
The application of a kind of full-automatic ball attachment device the most according to claim 7, it is characterised in that described plants net plate
(5) laser sensor (12) of detection solder ball implantation amount it is provided with, when certain the region solder ball amount mistake planted on net plate (5)
Low, laser sensor (12) triggers ball mechanism and performs solder ball and replenish the supply action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545950.1A CN106112182B (en) | 2016-07-12 | 2016-07-12 | A kind of full-automatic ball attachment device and its application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545950.1A CN106112182B (en) | 2016-07-12 | 2016-07-12 | A kind of full-automatic ball attachment device and its application |
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| CN106112182A true CN106112182A (en) | 2016-11-16 |
| CN106112182B CN106112182B (en) | 2018-09-04 |
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| CN201610545950.1A Active CN106112182B (en) | 2016-07-12 | 2016-07-12 | A kind of full-automatic ball attachment device and its application |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109285807A (en) * | 2018-09-28 | 2019-01-29 | 上海微松工业自动化有限公司 | A kind of smooth fixed equipment of wafer |
| CN109300809A (en) * | 2018-09-28 | 2019-02-01 | 上海理工大学 | A kind of wafer plant ball package system |
| CN109411396A (en) * | 2018-11-29 | 2019-03-01 | 天津中环领先材料技术有限公司 | A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method |
| CN114597146A (en) * | 2022-05-07 | 2022-06-07 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN116581041A (en) * | 2023-07-03 | 2023-08-11 | 上海世禹精密设备股份有限公司 | Perfect equipment for planting ball |
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| CN114597146B (en) * | 2022-05-07 | 2022-07-22 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN116581041A (en) * | 2023-07-03 | 2023-08-11 | 上海世禹精密设备股份有限公司 | Perfect equipment for planting ball |
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|---|---|
| CN106112182B (en) | 2018-09-04 |
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Inventor after: Liu Jinsong Inventor after: Guo Jian Inventor after: Zhang Jinzhi Inventor after: Zhang Yingwu Inventor after: Xie Xubo Inventor before: Liu Jinsong Inventor before: Qiu Jinjun Inventor before: Chen Huaming |
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