CN109390492A - A kind of display equipment and preparation method thereof - Google Patents
A kind of display equipment and preparation method thereof Download PDFInfo
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- CN109390492A CN109390492A CN201710683611.4A CN201710683611A CN109390492A CN 109390492 A CN109390492 A CN 109390492A CN 201710683611 A CN201710683611 A CN 201710683611A CN 109390492 A CN109390492 A CN 109390492A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H—ELECTRICITY
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Abstract
The invention belongs to the field of display devicees, provide display equipment and preparation method thereof.Display equipment provided by the invention, including substrate, luminescent device, encapsulating structure and composite layer.Encapsulating structure is formed on substrate and luminescent device, to cover luminescent device；Composite layer is arranged between luminescent device and encapsulating structure.Composite layer is the composite layer of carbon nanomaterial and metal nano hexagonal structure material, since carbon nanomaterial has superior translucency, metal nanoparticle has superior heating conduction, the two, which combines to be formed, has superior translucency after composite material, the heat that device heating sheds also can be effectively absorbed simultaneously, to make the heat of device distribute in time, guarantee the continual and steady of its thermal conductivity, is conducive to the service life for improving device.
Description
Technical field
The invention belongs to the field of display devicees more particularly to a kind of display equipment and preparation method thereof.
Background technique
Quantum dot (Quantum dot, QD) is due to luminous, the shine line width, luminescence generated by light effect humorous with size adjustable
The features such as rate height and thermal stability, therefore the light emitting diode with quantum dots (QLED) using quantum dot as luminescent layer is great potential
Next-generation display and solid-state lighting light source.
Light emitting diode with quantum dots is shining in recent years because having many advantages, such as high brightness, low-power consumption, wide colour gamut, easy processing
Bright and display field obtains extensive concern and research.However, existing QLED device is due to waterproof performance itself and oxygen
Can be poor, water and oxygen in air are easily penetrated into QLED device inside, influence device performance.Therefore, the encapsulation skill of QLED
Art becomes the crucial processing procedure for improving QLED waterproof performance and oxygen performance.But the closed environment in encapsulation process is easy to cause
The heat that QLED is distributed can not shed in time, so that whole display temperature increases, influence its efficiency and service life.
Therefore, existing luminescent device since the closed environment and existing of encapsulation can not in time shed the heat of device and
Device is set to there is a problem of that luminous efficiency is low and service life is short.
Summary of the invention
The purpose of the present invention is to provide a kind of display equipment and preparation method thereof, it is intended to solve existing luminescent device by
The heat of device can not be shed in the closed environment and existing of encapsulation in time and make device there are luminous efficiency is low and using the longevity
Order short problem.
The present invention provides a kind of display equipment, comprising:
Substrate；
Luminescent device, the luminescent device setting is on the substrate；
Encapsulating structure, the encapsulating structure is arranged on the substrate and the luminescent device, to cover the photophore
Part；
Composite layer, the composite layer is arranged between the luminescent device and the encapsulating structure, described multiple
Condensation material layer is the composite layer of carbon nanomaterial and metal nano hexagonal structure material.
The present invention also provides a kind of preparation method for showing equipment, the preparation method includes the following steps:
Substrate is provided；
Luminescent device is formed on the substrate；
Composite layer is set on encapsulating structure；
The encapsulating structure for being provided with composite layer is arranged on the substrate and the luminescent device described in covering
Luminescent device, wherein the composite layer is between the luminescent device and the encapsulating structure, the composite layer
For the composite layer of carbon nanomaterial and metal nano hexagonal structure material.
The present invention also provides the preparation method of another display equipment, the preparation method includes the following steps:
Substrate is provided；
Luminescent device is formed on the substrate；
Composite layer is formed on the substrate and the luminescent device to cover the luminescent device；
Setting encapsulating structure is described by composite wood to cover on the substrate, the luminescent device covered by composite layer
The luminescent device of bed of material covering；Wherein the composite layer is answering for carbon nanomaterial and metal nano hexagonal structure material
Condensation material layer.
Display equipment provided by the invention, including substrate, luminescent device, encapsulating structure and composite layer.Encapsulation knot
It is configured on substrate and luminescent device, to cover luminescent device；Composite layer setting luminescent device and encapsulating structure it
Between.Composite layer is the composite layer of carbon nanomaterial and metal nano hexagonal structure material, due to carbon nanomaterial
With superior translucency, metal nanoparticle has after there is superior heating conduction, the two combination to form composite material
Superior translucency, while the heat that device heating sheds also can be effectively absorbed, so that the heat of device be made to distribute in time, protect
The continual and steady of its thermal conductivity is demonstrate,proved, the service life for improving device is conducive to.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the display equipment that the embodiment of the present invention provides；
Fig. 2 is the structural schematic diagram for the display equipment that another embodiment of the present invention provides；
Fig. 3 is the structural schematic diagram for the luminescent device that the embodiment of the present invention provides；
Fig. 4 is the structural schematic diagram of the display equipment for the corresponding diagram 1 that the embodiment of the present invention provides；
Fig. 5 is the structural schematic diagram of the display equipment for the corresponding diagram 2 that another embodiment of the present invention provides.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more of the features.In the description of the present invention,
The meaning of " plurality " is two or more, unless otherwise specifically defined.
Incorporated by reference to Fig. 1 and Fig. 2, the structural schematic diagram of display equipment provided in an embodiment of the present invention.The display equipment includes
(in Fig. 1, composite layer corresponds to 31 for substrate 1, luminescent device 2, composite layer；In Fig. 2, composite layer is corresponding 32)
And encapsulating structure 4.Encapsulating structure 3 is formed on substrate 1 and luminescent device 2, to cover luminescent device 2；Composite layer is set
It sets between luminescent device 2 and encapsulating structure 4.Composite layer is carbon nanomaterial and metal nano hexagonal structure material
Composite layer.Wherein, composite layer, which is arranged between luminescent device 2 and encapsulating structure 4, includes at least the setting of composite layer 31
Between the upper surface and encapsulating structure 4 of luminescent device 2 (as shown in Figure 1).In a kind of wherein embodiment, composite layer 32
It is also possible to be arranged in and covers luminescent device 2 (as shown in Figure 2) between the upper surface of luminescent device 2 and encapsulating structure 4 simultaneously.Its
In, the bottom surface of luminescent device 2 is connected to substrate 1, and opposite with the bottom surface is the upper surface of luminescent device 2 on one side.
In embodiments of the present invention, the selection of substrate 1 is unrestricted, can use rigid substrates, can also be using flexibility
Substrate.Wherein, rigid substrates include but is not limited to one of glass, metal foil or a variety of；Flexible base board includes but unlimited
In polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polyether-ether-ketone (PEEK), polystyrene
(PS), polyether sulfone (PES), polycarbonate (PC), poly- aryl acid esters (PAT), polyarylate (PAR), polyimides (PI), polychlorostyrene second
One of alkene (PV), polyethylene (PE), polyvinylpyrrolidone (PVP), textile fabric are a variety of.
In embodiments of the present invention, luminescent device 2 has conventional structure (please referring to Fig. 3), including being arranged on substrate 1
Hearth electrode 201 and the first functional layer 202 being successively set on hearth electrode 201, luminescent layer 203, the second functional layer 204, top electricity
Pole 205.Luminescent device 2 is not limited by device architecture, can be autologous device, can also be with the device of reciprocal form structure.
When the structure of luminescent device 2 is eurymeric structure, then hearth electrode 201 is anode, and the first functional layer 202 is hole functional layer, the
Two functional layers 204 are electronic work ergosphere, and top electrode 205 is cathode；When the structure of luminescent device 2 is reciprocal form structure, then bottom is electric
Pole 201 is cathode, and the first functional layer 202 is electronic work ergosphere, and the second functional layer 204 is hole functional layer, and top electrode 205 is sun
Pole.
Device is explained by eurymeric structure of the structure of luminescent device 2 in one of the embodiments, is needed
Illustrate, the present embodiment is not only limited in eurymeric knot the description of anode, hole functional layer, electronic work ergosphere and cathode
The description of structure is equally applicable to the description of the anode to reciprocal form structure, hole functional layer, electronic work ergosphere and cathode.
Further, hearth electrode 201 is anode, and on substrate 1, the selection of 201 material of hearth electrode is unrestricted, can for deposition
Selected from blended metal oxide, including but not limited to indium doping tin oxide (ITO), fluorine-doped tin oxide (FTO), Sb doped oxidation
Tin (ATO), aluminium-doped zinc oxide (AZO), Ga-doped zinc oxide (GZO), indium doping zinc oxide (IZO), magnesium doping zinc-oxide
(MZO), one of aluminium doping magnesia (AMO) or a variety of, can also be selected from doped or non-doped transparent metal oxide
Between clip the combination electrode of metal, including but not limited to AZO/Ag/AZO, AZO/Al/AZO, ITO/Ag/ITO, ITO/Al/
ITO、ZnO/Ag/ZnO、ZnO/Al/ZnO、TiO2/Ag/TiO2、TiO2/Al/TiO2、ZnS/Ag/ZnS、ZnS/Al/ZnS、TiO2/
Ag/TiO2、TiO2/Al/TiO2One of or it is a variety of.
Further, the first functional layer 202 is hole functional layer, is used for injection and transporting holes, includes but is not limited to set
Set at least one layer of hole transmission layer on hearth electrode.In the present embodiment, electric conductivity of the thickness of hole transmission layer to film layer
It is affected with the injection efficiency in hole, too thin then electric conductivity is weaker, and causes both hole and electron uneven, and luminous zone may be in electricity
Sub- transport layer is without in luminescent layer；It is too thick, it is unfavorable for injecting.In order to make film layer that there is stronger electric conductivity and higher hole
Injection efficiency, it is preferable that hole transmission layer with a thickness of 0nm-100nm, more preferentially, be 40nm-50nm.Specifically, hole
Transport layer can be selected from the organic material with cavity transmission ability and/or the inorganic material with cavity transmission ability.Wherein, have
There is the organic material of cavity transmission ability including but not limited to poly- (9,9- dioctyl fluorene-CO-N- (4- butyl phenyl) diphenylamines)
(TFB), polyvinylcarbazole (PVK), poly- (bis- bis- (phenyl) benzidine of (4- butyl phenyl)-N, N'- of N, N') (poly-TPD), poly-
(double-N of 9,9- dioctyl fluorene -co-, N- phenyl -1,4- phenylenediamine) (PFB), 4,4 ', 4 "-three (carbazole -9- base) triphenylamines
(TCTA), 4,4'- bis- (9- carbazole) biphenyl (CBP), N, N '-diphenyl-N, N '-two (3- aminomethyl phenyl) -1,1 '-biphenyl -4,
4 '-diamines (TPD), N, one of N '-diphenyl-N, N '-(1- naphthalene) -1,1 '-biphenyl -4,4 '-diamines (NPB) or more
Kind；Inorganic material with cavity transmission ability includes but is not limited to doped graphene, undoped graphene, C60, doping or non-
The MoO of doping3、VO2、WO3、CrO3、CuO、MoS2、MoSe2、WS2、WSe2, one of CuS or a variety of.
Further, luminescent layer 203 is arranged in the first functional layer 202, it is preferable that the thicknesses of layers of luminescent layer 203 is
10nm-100nm.Specifically, the material of luminescent layer 203 includes nanocrystalline inorganic semiconductor, inorganic Ca-Ti ore type semiconductor, has
Machine-inorganic hybridization Ca-Ti ore type is nanocrystalline, at least one of luminous organic material.Wherein, inorganic semiconductor is nanocrystalline includes
Doped or non-doped II-V compound semiconductor, Group III-V compound semiconductor, group IV-VI compound semiconductor and its
One of core-shell structure semiconductor is a variety of.Inorganic Ca-Ti ore type semiconductor can be it is doped or non-doped, specifically, nothing
The nanocrystalline general structure of machine Ca-Ti ore type is AMX3, wherein A is Cs+Ion, M are divalent metal, including but not limited to
Pb2+、Sn2+、Cu2+、Ni2+、Cd2+、Cr2+、Mn2+、Co2+、Fe2+、Ge2+、Yb2+、Eu2+, X is halide anion, including but unlimited
In Cl-、Br-、I-.Hybrid inorganic-organic Ca-Ti ore type semiconductor structure general formula is BMX3, wherein B is organic amine cation,
Including but not limited to CH3(CH2)n-2NH3 +(n >=2) or NH3(CH2)nNH3 2+(n >=2), as n=2, inorganic metal hal ide eight
Face body MX6 4-It is connected by way of total top, metal cation M is located at the octahedral body-centered of halogen, organic amine cation B filling
In gap between octahedron, the three-dimensional structure infinitely extended is formed；As n > 2, the inorganic metal that is connected in a manner of total top
Halide octahedron MX6 4-Layer structure, Intercalation reaction organic amine cation bilayer (proton are extended to form in two-dimensional directional
Change monoamine) or organic amine cation monolayer (protonation diamine), organic layer mutually overlaps with inorganic layer and forms stable two
Tie up layer structure；M is divalent metal, including but not limited to Pb2+、Sn2+、Cu2+、Ni2+、Cd2+、Cr2+、Mn2+、Co2+、
Fe2+、Ge2+、Yb2+、Eu2+；X is halide anion, including but not limited to Cl-、Br-、I-.Luminous organic material is that this field is conventional
Luminous organic material, it is without being limited thereto including Alq, Balq, DPVBi etc..According to the selection of the material of luminescent layer 203, luminescent layer
203 light emitting species correspond to organic light emission (OLED) device based on can shining with organic material；It can also be with quantum dot material
Based on material shines, correspond to quantum dot light emitting (QLED) device.
Further, the second functional layer 204 is electronic work ergosphere, is used for transmission electronics, and including but not limited to setting is being sent out
Electron transfer layer and electron injecting layer on photosphere 203.Wherein, preferably with a thickness of 30nm-60nm, electronics passes electron transfer layer
The material of defeated layer is unrestricted, can be Oxide Electron transmission material, such as N-shaped ZnO, TiO2、SnO、Ta2O3、AlZnO、
ZnSnO、InSnO、Alq3、Ca、Ba、CsF、LiF、CsCO3One of or it is a variety of, it is however preferred to have high electronic transmission performance
N-shaped zinc oxide；The material of electron transfer layer can also be sulfide electron transport material, Organic Electron Transport Material.Electronics
Injection layer material can choose the Ca of low work function, and the metals such as Ba also can choose CsF, LiF, CsCO3Equal compounds, may be used also
To be other Electrolyte type electron transport layer materials.
Further, top electrode 205 is cathode, and thickness is preferably 50nm-150nm, and material is various conductive carbon materials
One of material, conductive metal oxide material, metal material are a variety of；Wherein conductive carbon material include but is not limited to adulterate or
Undoped carbon nanotube, doped or non-doped graphene, doped or non-doped graphene oxide, C60, graphite, carbon fiber, mostly sky
Carbon or their mixture；Conductive metal oxide material includes but is not limited to ITO, FTO, ATO, AZO or their mixing
Object；Metal material includes but is not limited to Al, Ag, Cu, Mo, Au or their alloy；Wherein in the metal material, shape
State includes but is not limited to dense film, nano wire, nanosphere, nanometer rods, nanocone, nano-hollow ball or their mixture；
Preferably, the cathode is Ag, Al.
In embodiments of the present invention, encapsulating structure 4 is formed in substrate 1 and luminescent device 2 as the protective layer for stopping water oxygen
On, to cover luminescent device 2, in order to prevent emission defects caused by due to penetrating into luminescent device 2 water or oxygen；
Composite layer is provided between luminescent device 2 and encapsulating structure 4.Encapsulating structure 4, can be by the material with preferable leakproofness
Material is made, and further, in order to guarantee the performance of luminescent device 2, the material of encapsulating structure 4 can't be sent out with the embodiment of the present invention
The material of each layer of optical device 2 reacts.
In conjunction with Fig. 1 and Fig. 4, in a kind of wherein embodiment, as shown in figure 4, encapsulating structure 4 includes: between luminescent device 2
Separate the encapsulation cover plate 401 of pre-determined distance, and luminescent device 2 edge and be arranged between substrate 1 and cap 401
Frit layer 402；Composite layer 31 can refer to the upper table being arranged in 401 medial surface of encapsulation cover plate with luminescent device 2 at this time
The opposite one side in face.Wherein, pre-determined distance can be equal to the thickness of composite layer 31, can also be greater than composite layer 31
Thickness；Encapsulation cover plate 401 preferably can be packaged glass cover plate.
In conjunction with Fig. 2 and Fig. 5, in a kind of wherein embodiment, as shown in figure 5, composite layer 32 can be formed in substrate 1
With, completely to cover luminescent device 2, encapsulating structure 4 can be the package board being bonded on composite layer 3 on luminescent device 2
403.Wherein, bonding mode specifically can be encapsulation glue bond.
In embodiments of the present invention, composite layer is the compound of carbon nanomaterial and metal nano hexagonal structure material
Material layer is prepared by carbon nanomaterial and the heating of metal nano hexagonal structure material.Pass through carbon nanomaterial and metal
Nanometer hexagonal structure material heats the composite layer prepared, since carbon nanomaterial has superior translucency, gold
Metal nano-particle has superior heating conduction, and the two is combined and forms composite material, can meet light transmission required for encapsulation
Property, its thermal conductivity can also be met.Specifically, carbon nanomaterial translucency itself is good, metal nano hexagonal structure material itself
Thermal conductivity is high, specific surface energy is larger, and metal nano hexagonal structure material, which tends to particle agglomeration, during heating reduces certainly
Body surface can, the group's of being formed laminated structure, there are a large amount of hole between different group's laminated structures, carbon nanomaterial will not then be connect
The hole of touching connects, and it is thermally conductive to increase to form the structure of connection, thus composite layer has excellent thermal conductivity
And translucency, the heat given out in device operation can be effectively absorbed, the service life of device is extended.Wherein, metal nano
Hexagonal structure material include but is not limited to AgNPH, CuNPH, AuNPH, AlNPH, WNPH, FeNPH, NiNPH, PtNPH,
At least one of ZnNPH, SnNPH, MoNPH；Carbon nanomaterial include graphene, graphene oxide, in carbon nanotube extremely
Few one kind.
In the embodiment of the present invention, the thickness of composite layer is affected to the thermal conductivity and translucency of device, it is preferable that
Composite layer is the film layer of thickness 10nm-50nm.When thickness is less than 10nm, the poor thermal conductivity of composite layer is another
Aspect, when thickness is greater than 50nm, entire thickness of detector increases, and translucency weakens.
Display equipment provided in an embodiment of the present invention, including substrate 1, luminescent device 2, encapsulating structure 4 and composite material
Layer.Encapsulating structure 4 is formed on substrate 1 and luminescent device 2, to cover luminescent device 2；Composite layer is arranged in luminescent device
Between 2 and encapsulating structure 4.Composite layer is the composite layer of carbon nanomaterial and metal nano hexagonal structure material,
Since carbon nanomaterial has superior translucency, metal nanoparticle has superior heating conduction, and the two, which combines, to be formed again
There is superior translucency after condensation material layer, while also can effectively absorb the heat that device heating sheds, to make device
Heat distribute in time, guarantee the continual and steady of its thermal conductivity, be conducive to improve device service life.
Display equipment provided in an embodiment of the present invention can be prepared by the preparation method for the display equipment that following embodiment provides
It obtains.
The embodiment of the invention provides it is a kind of show equipment preparation method, the preparation method the following steps are included:
Step S101: substrate is provided.
Step S102: luminescent device is formed on substrate.
Step S103: composite layer is set on encapsulating structure.
Step S104: encapsulating structure and composite layer are encapsulated on substrate and luminescent device to cover luminescent device,
Wherein composite layer is between luminescent device and encapsulating structure, and composite layer is six side of carbon nanomaterial and metal nano
The composite layer of shape structural material.
In embodiments of the present invention, step S101, substrate involved in step S102, step S103 and step S104,
The associated description of luminescent device, composite layer and encapsulating structure substrate 1, the photophore being related to corresponding with previous embodiment
The description of part 2, composite layer and encapsulating structure 4 is consistent, no longer describes herein.
In embodiments of the present invention, step S101, step S102, step S103 and step S104 the step of sequence do not do
It limits.
In embodiments of the present invention, forming method of the luminescent device on substrate and composite wood is set on encapsulating structure
The method of the bed of material can be chemical method or physical method, and wherein chemical method includes but is not limited to chemical vapour deposition technique, continuous ionic
Layer absorption and one of reaction method, anodizing, strike, coprecipitation or a variety of；Physical method includes but unlimited
In physical coating method or solwution method, wherein solwution method includes but is not limited to that spin-coating method, transfer printing, print process, knife coating, dipping mention
Daraf(reciprocal of farad), infusion method, spray coating method, roll coating process, casting method, slit coating method, strip rubbing method；Physical coating method includes but unlimited
In thermal evaporation coating method, electron beam evaporation deposition method, magnetron sputtering method, multi-arc ion coating embrane method, physical vaporous deposition, atom
One of layer sedimentation, pulsed laser deposition are a variety of.
It further, include the hole transport being arranged on anode with autologous luminescent device and the first functional layer
For layer, the second functional layer include setting electron transfer layer on the light-emitting layer, then step S102 is specifically included:
Step S11: deposition anode and carrying out ultrasonic cleaning 10min-20min on substrate, dry.
As preferred embodiment, step S11 specifically may is that by the substrate for being deposited with anode be placed in order acetone,
It is cleaned by ultrasonic in washing lotion, deionized water and isopropanol, each of the above step ultrasound is both needed to continue 10min-20min, with clear
Except the impurity on substrate, the substrate for being deposited with anode is placed in cleaning oven after the completion of being cleaned by ultrasonic and is dried.
Step S12: deposition of hole transport layer on anode and in 100 DEG C -200 DEG C at a temperature of made annealing treatment
10min-30min。
Step S13: the luminescent layer is deposited on the hole transport layer.
Step S14: electron transfer layer is deposited on the light-emitting layer, and heats 20min- at a temperature of 60 DEG C -100 DEG C
40min。
As preferred embodiment, heating process can carry out on warm table, by 60 DEG C -100 DEG C at a temperature of
20min-40min is heated, remaining solvent on luminescent layer can be effectively removed.
Step S15: cathode is deposited on the electron transport layer.
As preferred embodiment, step S15, which specifically may is that, is placed in piece for having deposited each functional layer in vapor deposition storehouse
By the metallic silver or aluminium of one layer of 50nm-150nm of mask plate hot evaporation as cathode.
It further, include the electron-transport being arranged on cathode with the luminescent device of reciprocal form structure and the first functional layer
For layer, the second functional layer include setting hole transmission layer on the light-emitting layer, then step S102 is specifically included:
Step S21: depositing cathode on substrate and carry out ultrasonic cleaning 10min-20min, dry.
Step S22: electron transfer layer is deposited on cathode, and heats 20min-40min at a temperature of 60 DEG C -100 DEG C.
Step S23: depositing light emitting layer on the electron transport layer.
Step S24: it deposition of hole transport layer and is made annealing treatment at a temperature of 100 DEG C -200 DEG C on the light-emitting layer
10min-30min。
Step S25: deposition anode on the hole transport layer.
Further, step S103 is specifically included:
Step S1031: metal nano hexagonal structure material is dispersed in polar organic solvent and is formed containing mass fraction
For the solution of 2wt%-40wt% metal nano hexagonal structure material.
Step S1032: being added carbon nanomaterial in the solution, forms mixed solution.
Step S1033: the mixed solution is deposited on encapsulating structure, forms composite layer after heat treatment.
As preferred embodiment, step S1031, which specifically can be, is dispersed in pole for metal nano hexagonal structure material
Property organic solvent in formed containing mass fraction be 2wt%-40wt% metal nano hexagonal structure material solution, ultrasonic disperse
Uniformly.Wherein, polar organic solvent is the solution that can be dissolved each other with water and alcohols, it is therefore preferable to nmp solution.
As preferred embodiment, step S1032, which specifically can be, the carbon nanomaterial addition polarity of 1mg-10mg
The solution that concentration quality is 0.05mg/ml-0.5mg/ml is formed in solvent, after mixing, ultrasonic vibration is uniformly mixed.Wherein,
Different content carbon nanomaterial is affected to thermal conductivity, its content is lower than 0.05mg/ after solution is added in carbon nanomaterial
When ml, then hole when heating between difference group laminated structure cannot be connected by carbon nanomaterial completely, cause it fine
Ground is thermally conductive；Equally, it when carbon nanomaterial solution content is higher than 0.5mg/ml, since carbon nanomaterial increases significantly, will lead to
Nanometer hexagonal structure it is excessively overlapped, on the one hand will lead to heating rear film it is not smooth enough, be readily incorporated steam and air, influence
On the other hand device lifetime also results in the increase of hole amount, is unfavorable for thermally conductive.
As preferred embodiment, step S1033, which specifically can be, is tied liquid deposition in encapsulation by solwution method film forming
On structure, composite layer is formed after heating 20min-60min at 40 DEG C -200 DEG C.Gold can be increased by heat treatment
The surface-active for belonging to nanometer hexagonal structure material promotes it to form crumb structure, and then carbon nanomaterial is filled into agglomerate
In the gap of shape structure, continuous structure is formed, is facilitated thermally conductive.
It further, further include being cleaned and dried to encapsulating structure before step S103 as preferred embodiment
Reheating is handled afterwards.Specifically, it can be and ozone-ultraviolet baking 15min-30min carried out to encapsulating structure.
Illustratively illustrate preparation method below:
(1) ito substrate is placed in order in acetone, washing lotion, deionized water and isopropanol and is cleaned by ultrasonic, it is above
Each step ultrasound is both needed to continue 15min.It is dried for standby after which substrate is placed in cleaning oven after the completion of ultrasound.
(2) after ito substrate is dry, one layer of hole transmission layer TFB is deposited on it, with a thickness of 80nm, and this is placed in
15min is heated on 150 DEG C of warm table.
(3) after step (2) are cooling, deposit quantum dot on hole transmission layer TFB, this layer with a thickness of 40nm, be not required to
Heating.
(4) after, electron transfer layer ZnO is deposited, with a thickness of 40nm.Piece for having deposited electron transfer layer ZnO is put
It sets and is heated 30 minutes on 80 DEG C of warm table, remove remaining solvent.
(5) piece for having deposited each functional layer is placed in vapor deposition storehouse to the metal for passing through one layer of 100nm of mask plate hot evaporation
Silver.Luminescent device preparation is completed.
(6) it is toasted after cleaning up packaged glass cover plate, after dry, carry out UV ozone and handle 30min, then sealing
The composite layer of one layer of carbon nanomaterial and metal nano hexagonal structure material is deposited on glaze cover plate as composite layer,
The 30min that anneals is placed in 50 DEG C of thermal station.
(7) the packaged glass cover plate for being deposited with composite layer is encapsulated on ito substrate and luminescent device to cover hair
Optical device is in composite layer between luminescent device and encapsulating structure.After test it is spare.
The preparation method of display equipment provided in an embodiment of the present invention, it is good, hot can to prepare radiating efficiency height, translucency
Stability is strong, luminous efficiency is high and display equipment with long service life, and technology difficulty is low, and operation is simple, at low cost, can be real
Now it is mass produced.
Display equipment provided by the above embodiment can also be prepared by the preparation method for the display equipment that following embodiment provides
It obtains.
The embodiment of the invention provides the preparation method of another display equipment, the preparation method the following steps are included:
Step S201: substrate is provided.
Step S202: luminescent device is formed on substrate.
Step S203: composite layer is formed on substrate and luminescent device to cover luminescent device.
Step S204: encapsulating structure is set on substrate, luminescent device and composite layer with mulching composite layer；
Wherein composite layer is the composite layer of carbon nanomaterial and metal nano hexagonal structure material.
In embodiments of the present invention, the step S201, description of step S202 and previous embodiment step S101, step S102
Unanimously, it no longer describes herein.
Further, step S203 is specifically included:
Step S2031: metal nano hexagonal structure material is dispersed in polar organic solvent and is formed containing mass fraction
For the solution of 2wt%-40wt% metal nano hexagonal structure material.
Step S2032: being added carbon nanomaterial in the solution, forms mixed solution.
Step S2033: mixed solution is formed on substrate and luminescent device to cover luminescent device, shape after heat treatment
At composite layer.
Wherein, step S2031, the description of step S2032 is consistent with the description of step S1031, step S1032, herein not
It describes again.
As preferred embodiment, step S2033, which specifically can be, to be formed a film liquid deposition by solwution method in photophore
On part, composite layer is formed after heating 20min-60min at 40 DEG C -200 DEG C.
As preferred embodiment, step S204, which specifically can be, is encapsulated in substrate, hair for encapsulating structure by packaging plastic
With mulching composite layer on optical device and composite layer.
It further, further include being cleaned and dried to encapsulating structure before step S204 as preferred embodiment
Reheating is handled afterwards.Specifically, it can be and ozone-ultraviolet baking 15min-30min carried out to encapsulating structure.
The preparation method of display equipment provided in an embodiment of the present invention, it is good, hot can to prepare radiating efficiency height, translucency
Stability is strong, luminous efficiency is high and display equipment with long service life, and technology difficulty is low, and operation is simple, at low cost, can be real
Now it is mass produced.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of display equipment characterized by comprising
Substrate；
Luminescent device, the luminescent device setting is on the substrate；
Encapsulating structure, the encapsulating structure is arranged on the substrate and the luminescent device, to cover the luminescent device；
Composite layer, the composite layer are arranged between the luminescent device and the encapsulating structure, the composite wood
The bed of material is the composite layer of carbon nanomaterial and metal nano hexagonal structure material.
2. display equipment as described in claim 1, which is characterized in that the metal nano hexagonal structure material includes
At least one in AgNPH, CuNPH, AuNPH, AlNPH, WNPH, FeNPH, NiNPH, PtNPH, ZnNPH, SnNPH and MoNPH
Kind.
3. display equipment as described in claim 1, which is characterized in that the carbon nanomaterial includes graphene, graphite oxide
At least one of alkene and carbon nanotube.
4. as described in claim 1 display equipment, which is characterized in that the composite layer with a thickness of 10nm-50nm.
5. a kind of preparation method for showing equipment, which is characterized in that the preparation method includes the following steps:
Substrate is provided；
Luminescent device is formed on the substrate；
Composite layer is set on encapsulating structure；
The encapsulating structure for being provided with composite layer is arranged on the substrate and the luminescent device to cover described shine
Device, wherein the composite layer is arranged between the luminescent device and the encapsulating structure, the composite layer is
The composite layer of carbon nanomaterial and metal nano hexagonal structure material.
6. a kind of preparation method for showing equipment, which is characterized in that the preparation method includes the following steps:
Substrate is provided；
Luminescent device is formed on the substrate；
Composite layer is formed on the substrate and the luminescent device to cover the luminescent device；
In the substrate, described by described multiple to cover by setting encapsulating structure on luminescent device that the composite layer covers
The luminescent device of condensation material layer covering；Wherein the composite layer is carbon nanomaterial and metal nano hexagonal structure material
Composite layer.
7. preparation method as claimed in claim 5, which is characterized in that the composite layer is arranged on the encapsulating structure
Preparation include the following steps:
Metal nano hexagonal structure material is dispersed in polar organic solvent to be formed and contains mass fraction for 2wt%-40wt%
The solution of metal nano hexagonal structure material；
Carbon nanomaterial is added in the solution, forms mixed solution；
The mixed solution is deposited on the encapsulating structure, forms the composite layer after heat treatment.
8. preparation method as claimed in claim 6, which is characterized in that formed on the substrate and the luminescent device compound
The preparation of material layer includes the following steps:
Metal nano hexagonal structure material is dispersed in polar organic solvent to be formed and contains mass fraction for 2wt%-40wt%
The solution of metal nano hexagonal structure material；
Carbon nanomaterial is added in the solution, forms mixed solution；
The mixed solution is formed on substrate and luminescent device to cover luminescent device, is formed after heat treatment described compound
Material layer.
9. preparation method as claimed in claim 7 or 8, which is characterized in that matter of the carbon nanomaterial in the solution
Amount concentration is 0.05mg/ml-0.5mg/ml.
10. preparation method as claimed in claim 7 or 8, which is characterized in that the temperature of the heat treatment is 40 DEG C -200
℃；The time of the heat treatment is 20min-60min.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112635692A (en) * | 2021-01-05 | 2021-04-09 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
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| CN104538432A (en) * | 2015-01-05 | 2015-04-22 | 昆山工研院新型平板显示技术中心有限公司 | Display device |
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| US20140225063A1 (en) * | 2009-09-29 | 2014-08-14 | Research Triangle Institute | Quantum dot-fullerene junction based photodetectors |
| CN104183702A (en) * | 2013-05-23 | 2014-12-03 | 海洋王照明科技股份有限公司 | Flexible conductive graphene film and manufacturing method and application thereof |
| CN104538432A (en) * | 2015-01-05 | 2015-04-22 | 昆山工研院新型平板显示技术中心有限公司 | Display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112635692A (en) * | 2021-01-05 | 2021-04-09 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
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