CN109346360A - For the dual function circuit unit and its manufacturing method of luminous button - Google Patents

For the dual function circuit unit and its manufacturing method of luminous button Download PDF

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Publication number
CN109346360A
CN109346360A CN201811137833.7A CN201811137833A CN109346360A CN 109346360 A CN109346360 A CN 109346360A CN 201811137833 A CN201811137833 A CN 201811137833A CN 109346360 A CN109346360 A CN 109346360A
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China
Prior art keywords
holes
pair
pins
circuit
light
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Application number
CN201811137833.7A
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Chinese (zh)
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CN109346360B (en
Inventor
陈在宇
郑鸿川
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Darfon Electronics Suzhou Co Ltd
Darfon Electronics Corp
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Darfon Electronics Suzhou Co Ltd
Darfon Electronics Corp
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Publication of CN109346360A publication Critical patent/CN109346360A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards

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  • Push-Button Switches (AREA)

Abstract

The present invention discloses a kind of dual function circuit unit and its manufacturing method for luminous button.Dual function circuit unit includes the first insulating substrate, the first circuit formed thereon, and it includes at least two make and break contacts that second circuit, which is formed in the road insulating layer Shang Bing,；Second macromolecule membrane has the first holes and at least one second holes, each second holes corresponds to a pair of pins, second insulating substrate fits on insulating layer, and is placed at least two make and break contacts in the first holes, and every a pair of pins is placed in corresponding second holes；Each light-emitting diode component is fixed in the second corresponding holes and pin is respectively welded together in the corresponding to pin of each light-emitting diode component；Elastic actuator is set to the periphery of the first holes, and makes the end of actuation column towards at least two make and break contacts.Dual function circuit unit of the invention has the function of thin film switch and light source circuit board function.

Description

For the dual function circuit unit and its manufacturing method of luminous button
Technical field
The present invention relates to a kind of dual function circuit units and its manufacturing method for luminous button, and especially close In the dual function circuit unit and its manufacturing method with thin film switch Yu light source circuit board function.
Background technique
Illuminated keyboard has been input peripheral device common on the market.The illuminated keyboard of prior art includes thin film switch group Part, the light source circuit board, light guide plate, the bottom plate that weld light-emitting diode component etc..About the assembling of illuminated keyboard, thin film switch group Part, flexible circuit board, light guide plate and the other assemblies of welding light-emitting diode component, component are sequentially arranged on bottom plate.
However, the thickness of membrane switch assemblies, light source circuit board and light guide plate accounts for slimming illuminated keyboard integral thickness Ratio is not low.So the integral thickness of the slimming illuminated keyboard of prior art be difficult to go again it is thinned.
In addition, the assembly program of the illuminated keyboard of prior art is also relatively complicated.
Summary of the invention
Therefore, the technical issues of present invention is to be solved is to provide a kind of dual function circuit group for luminous button Part and its manufacturing method.Dual function circuit unit of the invention has the function of thin film switch and light source circuit board function.Whereby, Illuminated keyboard comprising multiple luminous buttons using dual function circuit unit of the invention, integral thickness and prior art The integral thickness of slimming illuminated keyboard compare, can go and be thinned again.
In order to achieve the above object, the present invention proposes that the first, for the dual function circuit unit of luminous button, shines Key includes elastic actuator, and elastic actuator includes actuation column, and at least the end of actuation column is conductive tips, dual function electricity Road component includes: the first insulating substrate, the first circuit, insulating layer, second circuit, the second insulating substrate and at least one shine Diode assembly.First circuit is formed on the upper surface of the first insulating substrate, and the first circuit includes at least a pair of pins, wherein Definition has first line region on the upper surface of first insulating substrate, and the first circuit includes the first conductive paste bed of material and metal Layer, the first conductive paste bed of material are coated on first line region, and metal layer is deposited on the first electrocondution slurry by chemical plating processing procedure On layer；Insulating layer forms and covers the upper surface of the first circuit and the first insulating substrate, and makes at least a pair of pins exposure；The Two circuits are formed on insulating layer, and second circuit includes at least two make and break contacts；Second insulating substrate have the first holes and At least one second holes, each second holes correspond to the one pair of them pin at least a pair of pins, the second insulating substrate It fits on insulating layer, and is placed at least two make and break contacts in the first holes, and every a pair of pins is placed in corresponding In two holes；A pair of pins and second holes in the corresponding at least a pair of pins of each light-emitting diode component and Each light-emitting diode component includes a pair of of pin, each light-emitting diode component is fixed on the second corresponding holes It is interior and each light-emitting diode component corresponding to pin pin to be respectively welded together；Wherein elastic actuator It is set to the periphery of the first holes, and makes the end of actuation column towards at least two make and break contacts.
In addition, the present invention also proposes that second of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, dual function circuit unit includes: insulating substrate, the first circuit, insulating layer, Second circuit, separation layer, macromolecule membrane, tertiary circuit and at least one light-emitting diode component.First circuit is formed in On the upper surface of insulating substrate, the first circuit includes at least a pair of pins, and wherein definition has first on the upper surface of insulating substrate Land, the first circuit include the first conductive paste bed of material and metal layer, and the first conductive paste bed of material is coated on first line area On domain, metal layer is deposited on the first conductive paste bed of material by chemical plating processing procedure；Insulating layer formed and covered the first circuit and The upper surface of insulating substrate, and make at least a pair of pins exposure；Second circuit is formed on insulating layer, and second circuit includes at least One lower switch contact；Separation layer has the first holes and at least one second holes, each second holes is corresponding at least A pair of pins in a pair of pins, separation layer fit on insulating layer, and at least one lower switch contact is made to be placed in the first holes It is interior, and every a pair of pins is placed in the second corresponding holes；Macromolecule membrane has at least one third holes, each Third holes corresponds to second holes；Tertiary circuit is formed on the lower surface of macromolecule membrane, and tertiary circuit includes at least One upper switch contact, wherein macromolecule membrane following table face paste is together on separation layer, and sets at least one upper switch contact In in the first holes and being aligned or at least a lower switch contact, each third holes is aligned the second corresponding holes；Often A pair of pins, a third holes and second holes in the corresponding at least a pair of pins of one light-emitting diode component are simultaneously And each light-emitting diode component includes a pair of of pin, it is broken that each light-emitting diode component is fixed on corresponding third In hole and the second holes and it corresponding to pin is respectively welded together pin；Wherein elastic actuator is set to height On molecular film and elastic actuator be aligned the first holes, and make the end of actuation column towards at least one upper switch contact with extremely A few lower switch contact.
In addition, the present invention also proposes the third for the dual function circuit unit of luminous button, luminous button includes bullet Property actuator, elastic actuator include actuation column, at least the end of actuation column be conductive tips, dual function circuit unit packet Contain: the first insulating substrate, the first circuit, insulating layer, at least one light-emitting diode component, second circuit and the second insulation base Material.First circuit is formed on the lower surface of the first insulating substrate, and the first circuit includes at least a pair of pins, wherein the first insulation Definition has first line region on the lower surface of substrate, and the first circuit includes the first conductive paste bed of material and metal layer, and first leads The plasma-based bed of material is coated on first line region, and metal layer is deposited on the first conductive paste bed of material by chemical plating processing procedure；Insulation Layer forms and covers the lower surface of the first circuit and the first insulating substrate, and makes at least a pair of pins exposure；Each shines A pair of pins and each light-emitting diode component in the corresponding at least a pair of pins of diode assembly include a pair of of pin, often Pin is respectively welded together in one the corresponding to pin of light-emitting diode component；Second circuit is formed in first absolutely On the upper surface of edge substrate, second circuit includes at least two make and break contacts；Second insulating substrate has holes, the second insulating substrate It fits on the upper surface of the first insulating substrate, and is placed at least two make and break contacts in holes；Wherein elastic actuator is arranged In the periphery of holes, and make the end of actuation column towards at least two make and break contacts.
In addition, the present invention also proposes that the 4th kind of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, dual function circuit unit includes: insulating substrate, the first circuit, insulating layer, At least one light-emitting diode component, second circuit, separation layer, macromolecule membrane and tertiary circuit；First circuit is formed in On first lower surface of insulating substrate, the first circuit includes at least a pair of pins, wherein fixed on the first lower surface of insulating substrate Justice has a first line region, and the first circuit includes the first conductive paste bed of material and metal layer, and the first conductive paste bed of material is coated on the On one land, metal layer is deposited on the first conductive paste bed of material by chemical plating processing procedure；Insulating layer forms and covers first First lower surface of circuit and insulating substrate, and make at least a pair of pins exposure；Each light-emitting diode component is corresponding extremely A pair of pins and each light-emitting diode component in few a pair of pins include a pair of of pin, each light emitting diode group Pin is respectively welded together in the corresponding to pin of part；Second circuit is formed on the upper surface of insulating substrate, the Two circuits include at least one lower switch contact；Separation layer has holes, and separation layer fits on the upper surface of insulating substrate, and It is placed at least one lower switch contact in holes；Tertiary circuit is formed on the second lower surface of macromolecule membrane, third electricity Road includes at least one upper switch contact, and wherein macromolecule membrane is fitted on separation layer with the second lower surface, and makes at least one A upper switch contact is placed in holes and is aligned or at least a lower switch contact；Wherein elastic actuator is set to macromolecule membrane Upper and elastic actuator is aligned holes, and makes the end of actuation column towards at least one upper switch contact and at least one lower switch Contact.
In addition, the present invention also proposes that the 5th kind of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, at least the end of actuation column be conductive tips, dual function circuit unit packet Contain: metal base, the first insulating layer, the first circuit, second insulating layer, second circuit, insulating substrate and at least one shine Diode assembly.First insulating layer forms and covers the upper surface of metal base；First circuit is formed on the first insulating layer, the One circuit includes at least a pair of pins, wherein definition has first line region on the first insulating layer, the first circuit is led comprising first The plasma-based bed of material and metal layer, the first conductive paste bed of material are coated on first line region, and metal layer is heavy by chemical plating processing procedure Product is on the first conductive paste bed of material；Second insulating layer forms and covers the first circuit and the first insulating layer, and makes at least a pair of Pin exposure；Second circuit is formed in second insulating layer, and second circuit includes at least two make and break contacts；Insulating substrate has the One holes and at least one second holes, each second holes correspond to a pair of pins at least a pair of pins, and insulate base Material fits in second insulating layer, and is placed at least two make and break contacts in the first holes, and every a pair of pins be placed in it is right with it In the second holes answered；A pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and one second it is broken Hole and each light-emitting diode component include a pair of of pin, each light-emitting diode component is fixed on corresponding the In two holes and it corresponding to pin is respectively welded together pin；Wherein elastic actuator is set to the first holes Periphery, and make the end of actuation column towards at least two make and break contacts.
In addition, the present invention also proposes that the 6th kind of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, dual function circuit unit includes: metal base, the first insulating layer, first electricity Road, second insulating layer, second circuit, separation layer, macromolecule membrane, tertiary circuit and at least one light-emitting diode component. First insulating layer forms and covers the upper surface of metal base；First circuit is formed on the first insulating layer, and the first circuit includes At least a pair of pins, wherein definition has a first line region on the first insulating layer, the first circuit include the first conductive paste bed of material with And metal layer, the first conductive paste bed of material are coated on first line region, metal layer is deposited on first by chemical plating processing procedure and leads On the plasma-based bed of material；Second insulating layer forms and covers the first circuit and the first insulating layer, and makes at least a pair of pins exposure；The Two circuits are formed in second insulating layer, and second circuit includes at least one lower switch contact；Separation layer have the first holes with And at least one second holes, a pair of pins in the corresponding at least a pair of pins of each second holes, separation layer fit in the On two insulating layers, and it is placed at least one lower switch contact in the first holes, and every a pair of pins is placed in corresponding In two holes；Macromolecule membrane has at least one third holes, corresponding second holes of each third holes；Third electricity Road is formed on the lower surface of macromolecule membrane, tertiary circuit include at least one upper switch contact, wherein macromolecule membrane with Lower surface fits on separation layer, and is placed at least one upper switch contact in the first holes and is aligned or at least a lower switch Contact, each third holes are aligned the second corresponding holes；The corresponding at least a pair of each light-emitting diode component is drawn A pair of pins, a third holes and second holes and each light-emitting diode component in foot include a docking Foot, each light-emitting diode component be fixed on corresponding third holes in the second holes and it is corresponding to pin Pin is respectively welded together；Wherein elastic actuator is set on macromolecule membrane and elastic actuator alignment first is broken Hole, and make the end of actuation column towards at least one upper switch contact and at least one lower switch contact.
In addition, the present invention also proposes that the 7th kind of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, at least the end of actuation column be conductive tips, dual function circuit unit packet Contain: metal base, the first insulating layer, the first circuit, second insulating layer, at least one light-emitting diode component, third insulating layer, Second circuit and insulating substrate.First insulating layer forms and covers the lower surface of metal base；First circuit is formed in first On insulating layer, the first circuit includes at least a pair of pins, wherein definition has first line region, the first circuit on the first insulating layer Comprising the first conductive paste bed of material and metal layer, the first conductive paste bed of material is coated on first line region, and metal layer is by change Plating processing procedure is learned to be deposited on the first conductive paste bed of material；Second insulating layer forms and covers the first circuit and the first insulating layer, and Make at least a pair of pins exposure；A pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and each Light-emitting diode component includes a pair of of pin, and the corresponding to pin of each light-emitting diode component welds pin respectively It is connected together；Third insulating layer forms and covers the upper surface of metal base；Second circuit is formed on third insulating layer, and second Circuit includes at least two make and break contacts；Insulating substrate has holes, and insulating substrate fits on third insulating layer, and makes at least two Make and break contact is placed in holes；Wherein elastic actuator is set to the periphery of holes, and makes the end of actuation column towards at least two Make and break contact.
In addition, the present invention also proposes that the 8th kind of dual function circuit unit for luminous button, luminous button include bullet Property actuator, elastic actuator include actuation column, dual function circuit unit includes: metal base, the first insulating layer, first electricity Road, second insulating layer, at least one light-emitting diode component, third insulating layer, second circuit, separation layer, macromolecule membrane with And tertiary circuit.First insulating layer forms and covers the first lower surface of metal base；First circuit is formed in the first insulating layer On, the first circuit includes at least a pair of pins, wherein definition has a first line region on the first insulating layer, the first circuit includes the The one conductive paste bed of material and metal layer, the first conductive paste bed of material are coated on first line region, and metal layer is by chemically plating Journey is deposited on the first conductive paste bed of material；Second insulating layer forms and covers the first circuit and the first insulating layer, and makes at least A pair of pins exposure；A pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and each shine two Pole pipe component includes a pair of of pin, and the corresponding to pin of each light-emitting diode component is respectively welded at one to pin It rises；Third insulating layer forms and covers the upper surface of metal base；Second circuit is formed on third insulating layer, second circuit packet Containing at least one lower switch contact；Separation layer has holes, and separation layer fits on third insulating layer, and makes to open under at least one Coila is placed in holes；Tertiary circuit is formed on the second lower surface of macromolecule membrane, and tertiary circuit includes at least one Upper switch contact, wherein macromolecule membrane is fitted on separation layer with the second lower surface, and sets at least one upper switch contact In in holes and being aligned or at least a lower switch contact；Wherein elastic actuator is set on macromolecule membrane and elastic actuator It is aligned holes, and makes the end of actuation column towards at least one upper switch contact and at least one lower switch contact.
In addition, the method that the present invention also proposes the first manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and at least the end of actuation column is to lead Electric end, method comprises the steps of the first insulating substrate of preparation, wherein definition has first on the upper surface of the first insulating substrate Land；In the first conductive paste bed of material coating on first line region；Chemical plating is executed to the upper surface of the first insulating substrate Processing procedure, and then in deposited metal layer on the first conductive paste bed of material, wherein the first conductive paste bed of material and metal layer constitute the first circuit, First circuit includes at least a pair of pins；It forms insulating layer and covers the upper surface of the first circuit and the first insulating substrate, and Make at least a pair of pins exposure；In forming second circuit on insulating layer, wherein second circuit includes at least two make and break contacts；Preparation Second insulating substrate, wherein the second insulating substrate has the first holes and at least one second holes, each second holes A pair of pins in corresponding at least a pair of pins；The second insulating substrate is bonded on insulating layer, and sets at least two make and break contacts In in the first holes, and every a pair of pins is placed in its corresponding second holes；At least one light-emitting diode component is prepared, In a pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and second holes and each Light-emitting diode component includes a pair of of pin；Each light-emitting diode component is fixed in the second corresponding holes and is incited somebody to action It is corresponding to pin to be respectively welded together pin；Wherein elastic actuator is set to the periphery of the first holes, and Make the end of actuation column towards at least two make and break contacts.
In addition, the method that the present invention also proposes second of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and method comprises the steps of system Standby insulating substrate, wherein definition has first line region on the upper surface of insulating substrate；In on first line region coating first The conductive paste bed of material；Chemical plating processing procedure executed to the upper surface of insulating substrate, and then in deposited metal layer on the first conductive paste bed of material, Wherein the first conductive paste bed of material and metal layer constitute the first circuit, and the first circuit includes at least a pair of pins；Form insulating layer simultaneously The upper surface of the first circuit and insulating substrate is covered, and makes at least a pair of pins exposure；In forming second circuit on insulating layer, Wherein second circuit includes at least one lower switch contact；Separation layer is prepared, wherein separation layer has the first holes and at least One the second holes, each second holes correspond to a pair of pins at least a pair of pins；Macromolecule membrane is prepared, wherein high Molecular film has at least one third holes, corresponding second holes of each third holes；Under macromolecule membrane A tertiary circuit is formed on surface, wherein tertiary circuit includes at least one upper switch contact；Be bonded separation layer in insulating layer with Between the lower surface of macromolecule membrane, and at least one upper switch contact and at least one lower switch contact is made to be placed in the first holes It is interior, and every a pair of pins is placed in its corresponding second holes；At least one light-emitting diode component is prepared, wherein each is sent out A pair of pins, a third holes and second holes in the corresponding at least a pair of pins of optical diode component and each A light-emitting diode component includes a pair of of pin；Each light-emitting diode component is fixed in corresponding third holes and Corresponding to pin pin is respectively welded together in two holes and by it；Wherein elastic actuator is set to macromolecule On film and elastic actuator is aligned the first holes, and makes the end of actuation column towards at least one upper switch contact and at least one A lower switch contact.
In addition, the method that the present invention also proposes the third manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and at least the end of actuation column is to lead Electric end, method comprises the steps of the first insulating substrate of preparation, wherein definition has first on the lower surface of the first insulating substrate Land；In the first conductive paste bed of material coating on first line region；Chemical plating processing procedure is executed to the first insulating substrate, in turn In deposited metal layer on the first conductive paste bed of material, wherein the first conductive paste bed of material and metal layer constitute the first circuit, the first circuit Include at least a pair of pins；It forms insulating layer and covers the lower surface of the first circuit and the first insulating substrate, and make at least one To pin exposure；In forming second circuit on the upper surface of the first insulating substrate, wherein second circuit includes that at least two switches connect Point；The second insulating substrate is prepared, wherein the second insulating substrate has holes；The second insulating substrate is bonded in the first insulating substrate On upper surface, and it is placed at least two make and break contacts in holes；At least one light-emitting diode component is prepared, wherein each is sent out A pair of pins and each light-emitting diode component in the corresponding at least a pair of pins of optical diode component include a pair of of pin； Pin is respectively welded together in corresponding to pin by each light-emitting diode component；Wherein elastic actuator is set It is placed in the periphery of holes, and makes the end of actuation column towards at least two make and break contacts.
In addition, the method that the present invention also proposes the 4th kind of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and method comprises the steps of system Standby insulating substrate, wherein defines first line region on the first lower surface of insulating substrate；In being coated the on first line region The one conductive paste bed of material；Chemical plating processing procedure is executed to the first lower surface of insulating substrate, and then is deposited on the first conductive paste bed of material Metal layer, wherein the first conductive paste bed of material and metal layer constitute the first circuit, the first circuit includes at least a pair of pins；It is formed exhausted Edge layer and the first lower surface for covering the first circuit and insulating substrate, and make at least a pair of pins exposure；In insulating substrate Second circuit is formed on upper surface, wherein second circuit includes at least one lower switch contact；Separation layer is prepared, wherein separation layer With holes；Prepare macromolecule membrane；In forming tertiary circuit on the second lower surface of macromolecule membrane, wherein tertiary circuit packet Containing at least one upper switch contact；Be bonded separation layer in insulating substrate upper surface and macromolecule membrane the second lower surface it Between, and it is placed at least one upper switch contact and at least one lower switch contact in holes；Prepare at least one light-emitting diodes Tube assembly, wherein each light-emitting diode component corresponds to a pair of pins and each light-emitting diodes at least a pair of pins Tube assembly includes a pair of of pin；Corresponding to pin by each light-emitting diode component is respectively welded at one to pin It rises；Wherein elastic actuator is set on macromolecule membrane and elastic actuator is aligned holes, causes the end direction of actuation column At least one upper switch contact and at least one lower switch contact.
In addition, the method that the present invention also proposes the 5th kind of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and at least the end of actuation column is to lead Electric end, method, which comprises the steps of, prepares metal base；It forms the first insulating layer and covers the upper surface of metal base, In on the first insulating layer definition have first line region；In the first conductive paste bed of material coating on first line region；Absolutely to first Edge layer executes chemical plating processing procedure, and then in deposited metal layer on the first conductive paste bed of material, wherein the first conductive paste bed of material and metal Layer constitutes the first circuit, and the first circuit includes at least a pair of pins；It forms second insulating layer and covers the first circuit and first Insulating layer, and make at least a pair of pins exposure；In forming second circuit in second insulating layer, wherein second circuit includes at least two Make and break contact；Insulating substrate is prepared, wherein insulating substrate has the first holes and at least one second holes, each second A pair of pins in the corresponding at least a pair of pins of holes；Insulating substrate is bonded in second insulating layer, and connects at least two switches Point is placed in the first holes, and every a pair of pins is placed in its corresponding second holes；Prepare at least one light emitting diode group Part, wherein a pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and second holes and every One light-emitting diode component includes a pair of of pin；Each light-emitting diode component is fixed in the second corresponding holes And it corresponding to pin is respectively welded together pin；Wherein elastic actuator is set to the outer of the first holes It encloses, and makes the end of actuation column towards at least two make and break contacts.
In addition, the method that the present invention also proposes the 6th kind of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and method comprises the steps of system Standby metal base；It forms the first insulating layer and covers the upper surface of metal base, wherein definition has First Line on the first insulating layer Road region；In the first conductive paste bed of material coating on first line region；Chemical plating processing procedure is executed to the first insulating layer, and then in the Deposited metal layer on the one conductive paste bed of material, wherein the first conductive paste bed of material and metal layer constitute the first circuit, the first circuit includes At least a pair of pins；It forms second insulating layer and covers the first circuit and the first insulating layer, and make at least a pair of pins exposure； In forming second circuit in second insulating layer, wherein second circuit includes at least one lower switch contact；Separation layer is prepared, wherein Separation layer has the first holes and at least one second holes, a pair in the corresponding at least a pair of pins of each second holes Pin；Macromolecule membrane is prepared, wherein macromolecule membrane has at least one third holes, each third holes is one corresponding Second holes；Tertiary circuit is formed on the lower surface of macromolecule membrane, wherein tertiary circuit includes that at least one upper switch connects Point；Be bonded separation layer between second insulating layer and the lower surface of macromolecule membrane, and make at least one upper switch contact with extremely A few lower switch contact is placed in the first holes, and every a pair of pins is placed in the second corresponding holes；Preparation is at least One light-emitting diode component, wherein a pair of pins in the corresponding at least a pair of pins of each light-emitting diode component, one Third holes and second holes and each light-emitting diode component include a pair of of pin；Fix each shine two Pole pipe component corresponding to pin is respectively welded pin in corresponding third holes with the second holes and by it Together；Wherein elastic actuator is set on macromolecule membrane and elastic actuator is aligned the first holes, and makes actuation column End is towards at least one upper switch contact and at least one lower switch contact.
In addition, the method that the present invention also proposes the 7th kind of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and at least the end of actuation column is to lead Electric end, method, which comprises the steps of, prepares metal base；It forms the first insulating layer and covers the lower surface of metal base, In on the first insulating layer definition have first line region；In the first conductive paste bed of material coating on first line region；Absolutely to first Edge layer executes chemical plating processing procedure, and then in deposited metal layer on the first conductive paste bed of material, wherein the first conductive paste bed of material and metal Layer constitutes the first circuit, and the first circuit includes at least a pair of pins；It forms second insulating layer and covers the first circuit and first Insulating layer, and make at least a pair of pins exposure；Third insulating layer is formed to cover the upper surface of metal base；Form second circuit In on third insulating layer, wherein second circuit includes at least two make and break contacts；Insulating substrate is prepared, wherein insulating substrate has broken Hole；Insulating substrate is bonded on third insulating layer, and is placed at least two make and break contacts in holes；Prepare at least one shine two Pole pipe component, wherein a pair of pins in the corresponding at least a pair of pins of each light-emitting diode component and each shine two Pole pipe component includes a pair of of pin；Corresponding to pin by each light-emitting diode component is respectively welded at pin Together；Wherein elastic actuator is set to the periphery of holes, and makes the end of actuation column towards at least two make and break contacts.
In addition, the method that the present invention also proposes the 8th kind of manufacture dual function circuit unit, dual function circuit unit supply Luminous button is used, and luminous button includes elastic actuator, and elastic actuator includes actuation column, and method comprises the steps of system Standby metal base；It forms the first insulating layer and covers the first lower surface of metal base, wherein definition has the on the first insulating layer One land；In the first conductive paste bed of material coating on first line region；Chemical plating processing procedure is executed to the first insulating layer, in turn In deposited metal layer on the first conductive paste bed of material, wherein the first conductive paste bed of material and metal layer constitute the first circuit, the first circuit Include at least a pair of pins；It forms second insulating layer and covers the first circuit and the first insulating layer, and make at least a pair of pins Exposure；Third insulating layer is formed to cover the upper surface of metal base；Second circuit is formed on third insulating layer, wherein second Circuit includes at least one lower switch contact；Separation layer is prepared, wherein separation layer has holes；Prepare macromolecule membrane；It is formed Tertiary circuit is on the second lower surface of macromolecule membrane, and wherein tertiary circuit includes at least one upper switch contact；Fitting every Absciss layer makes at least one upper switch contact and at least one between third insulating layer and the second lower surface of macromolecule membrane Lower switch contact is placed in holes；At least one light-emitting diode component is prepared, wherein each light-emitting diode component is corresponding A pair of pins and each light-emitting diode component at least in a pair of pins include a pair of of pin；By each light-emitting diodes Pin is respectively welded together in the corresponding to pin of tube assembly；Wherein elastic actuator is set on macromolecule membrane And elastic actuator is aligned holes, and connects the end of actuation column at least one lower switch towards at least one upper switch contact Point.
Different from prior art, dual function circuit unit of the invention has the function of thin film switch and light source circuit board function Energy.Comprising using dual function circuit unit of the invention multiple luminous buttons illuminated keyboard, integral thickness and previously The integral thickness of the slimming illuminated keyboard of technology is compared, and can be gone and is thinned again, it might even be possible to exempt light guide plate or bottom plate.Using Dual function circuit unit of the invention, the assembly program of illuminated keyboard can simplify.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is the group using the luminous button of the dual function circuit unit of the first preferred embodiment according to the present invention Part, structural member development schematic diagram.
Fig. 2 is dual function circuit unit in Fig. 1 along the cross section view of line A-A.
Fig. 3 to Fig. 6 is schematically painted the dual function circuit of the first preferred embodiment of manufacture of the invention with cross section view The method of component.
Fig. 7 is the cross section view of the dual function circuit unit of the second preferred embodiment according to the present invention.
Fig. 8 to Figure 11 is schematically painted the dual function circuit of the second preferred embodiment of manufacture of the invention with cross section view The method of component.
Figure 12 is the cross section view of the dual function circuit unit of third preferred embodiment of the invention.
Figure 13 to Figure 16 is schematically painted the dual function electricity of manufacture third preferred embodiment of the invention with cross section view The method of road component.
Figure 17 is the cross section view of the dual function circuit unit of the 4th preferred embodiment according to the present invention.
Figure 18 to Figure 21 is schematically painted the dual function electricity of the 4th preferred embodiment of manufacture of the invention with cross section view The method of road component.
Figure 22 is the cross section view of the dual function circuit unit of the 5th preferred embodiment according to the present invention.
Figure 23 to Figure 26 is schematically painted the dual function electricity of the 5th preferred embodiment of manufacture of the invention with cross section view The method of road component.
Figure 27 is the cross section view of the dual function circuit unit of the 6th preferred embodiment according to the present invention.
Figure 28 to Figure 31 is schematically painted the dual function electricity of the 6th preferred embodiment of manufacture of the invention with cross section view The method of road component.
Figure 32 is the cross section view of the dual function circuit unit of the 7th preferred embodiment according to the present invention.
Figure 33 to Figure 36 is schematically painted the dual function electricity of the 7th preferred embodiment of manufacture of the invention with cross section view The method of road component.
Figure 37 is the cross section view of the dual function circuit unit of the 8th preferred embodiment of the invention.
Figure 38 to Figure 41 is schematically painted the dual function electricity of the 8th preferred embodiment of manufacture of the invention with cross section view The method of road component.
Specific embodiment
Fig. 1 and Fig. 2 is please referred to, the schemas such as this schematically depict the dual function of the first preferred embodiment according to the present invention Circuit unit 2.Fig. 1 is schematically painted the dual function using the first preferred embodiment of the invention with component, structural member development figure The luminous button 1 of circuit unit 2.Fig. 2 is dual function circuit unit 2 in Fig. 1 along the cross section view of line A-A.In order to illustrate side Just, in Fig. 2, only it is painted the cross section view of dual function circuit unit 2 and elastic actuator 12.
As shown in Figure 1, the luminous button of the dual function circuit unit 2 using the first preferred embodiment according to the present invention 1 includes bottom plate 10, dual function circuit unit 2, elastic actuator 12, keycap 14 and elevating mechanism 16.
Elevating mechanism 16 is set between bottom plate 10 and keycap 14.Elevating mechanism 16 limit keycap 14 in non-pressing position with It is moved between pressing position.
As shown in Figures 1 and 2, elastic actuator 12 includes the dome body 122 and actuation column 124 of elasticity.Dome body 122 With opening 1222 and top 1224.Actuation column 124 is formed in dome body 122, and towards the opening of dome body 122 1222 extend.12 system of elastic actuator is set on dual function circuit unit 2.
Elevating mechanism 16 can be the known elevating mechanisms such as scissor support device, butterfly support device.Shown in Fig. 1 The scissors kenel elevating mechanism 16 that is made of interior arm component 162 with outer arm component 164 of 16 system of elevating mechanism.Interior support arm Component 162 is rotatably connected to lower surface 142 and the bottom plate 10 of keycap 14 respectively.The outer difference of arm component 164 is rotationally It is connected to lower surface 142 and the bottom plate 10 of keycap 14.For example, as shown in Figure 1, two pairs of undertakings part 146 and 14 one of keycap at Type is on lower surface 142.Conduit 102 is received for two pairs to be integrally formed on bottom plate 10.Wherein, a pair of to accept part 146 and a pair Conduit 102 is received to connect interior arm component 162.Another pair accepts part 146 and receives conduit 102 to connect with another pair Outer arm component 164.
Elastic actuator 12 is coupled to the lower surface 142 of keycap 14.For example, as shown in Figure 1, keycap 14 also has pillar 144, pillar 144 is formed on the lower surface 142 of keycap 14.Pillar 144 is embedded in the top of the dome body 122 of elastic actuator 12 In groove 1226 at 1224, i.e. one end of pillar 144 is connected to the lower surface 142 of keycap 14, and the other end of pillar 144 is embedded in In groove 1226, to realize being of coupled connections for elastic actuator 12 and keycap 14.
As shown in Fig. 2, the luminous button 1 of the dual function circuit unit 2 using the first preferred embodiment of the invention, until The end 1242 of few actuation column 124 is conductive tips.In a specific embodiment, more graphite particles or more metallic particles are applied Cloth is on the end of actuation column 124 1242.
As shown in Fig. 2, the dual function circuit unit 2 of the first preferred embodiment of the invention includes the first insulating substrate 20, the first circuit 21, insulating layer 22, second circuit 23, the second insulating substrate 25 and at least one light-emitting diode component 26. In Fig. 1 and example shown in Fig. 2, a light-emitting diode component 26 is only painted as representative.In a specific embodiment, hair Optical diode component 26 can be the light-emitting diode component encapsulated, be also possible to the light-emitting diode component of bare crystalline kenel.
In a specific embodiment, the first insulating substrate 20 and the second insulating substrate 25 be can be using phenolic aldehyde cotton paper as substrate Substrate, using glass cloth as the substrate of substrate, ceramic base material (such as aluminium nitride, aluminium oxide, silicon carbide etc.), macromolecule membrane Deng.It can be by poly terephthalic acid second two respectively if the first insulating substrate 20 and the second insulating substrate 25 are macromolecule membranes Ester, polyimides, polyacids methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule Film.If the first insulating substrate 20 is ceramic base material, the thermal energy that 26 operation of light-emitting diode component can be assisted to generate dissipates Heat.
First circuit 21 is formed on the upper surface 202 of the first insulating substrate 20.First circuit 21 includes that at least a pair is drawn Foot 212.Insulating layer 22 is formed to cover the upper surface 202 of the first circuit 21 and the first insulating substrate 20, while making at least one To the exposure of pin 212.
Also shown in FIG. 2, in a specific embodiment, definition has first on the upper surface 202 of the first insulating substrate 20 Land 204.First circuit 21 may include the first conductive paste bed of material 214 and metal layer 216.The first conductive paste bed of material 214 are coated on first line region 204.Metal layer 216 can be deposited on the first conductive paste bed of material 214 by chemical plating processing procedure On.The first conductive paste bed of material 214 may include to be formed by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene and combinations thereof Conductive particle.The first conductive paste bed of material 214 can be coated on first line area by screen painting processing procedure (being not limited) On domain 204.
In a specific embodiment, the structure of metal layer 216 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
In a specific embodiment, insulating layer 22 can by first coated UV line hardening resin in the first circuit 21 and Irradiating ultraviolet light is hardened again on the upper surface 202 of first insulating substrate 20.
Second circuit 23 is formed on insulating layer 22.Second circuit 23 includes at least two make and break contacts 232.
In a specific embodiment, definition has the second land 222 on insulating layer 22.Second circuit 23 may include The two conductive paste bed of materials 234.The second conductive paste bed of material 234 is coated on the second land 222.The second conductive paste bed of material 234 can Comprising being formed by conductive particle by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene and combinations thereof.Second electrocondution slurry Layer 234 can be coated on the second land 222 by screen painting processing procedure (being not limited).
Second insulating substrate 25 has the first holes 252 and at least one second holes 254.Each second holes One pair of them pin 212 in 254 corresponding above-mentioned at least a pair of pins 212.In Fig. 1 and Fig. 2, it is only painted second holes 254 as representative.
Second insulating substrate 25 fits on insulating layer 22, and at least two make and break contacts 232 is made to be placed in the second insulating substrate In 25 the first holes 252, and every a pair of pins 212 is placed in the second corresponding holes 254.
In a specific embodiment, adhesion layer 24 is coated on second circuit 23 and insulating layer 22, and is made at least a pair of Pin 212 and the exposure of at least two make and break contacts 232.By adhesion layer 24, the second insulating substrate 25 is fitted on insulating layer 22. Adhesion layer 24 can be to be formed by coating glue, but is not limited thereto.
One pair of them pin 212 in the corresponding above-mentioned at least a pair of pins 212 of each light-emitting diode component 26 and One the second holes 254, and it includes a pair of of pin 262 that each light-emitting diode component 26 is corresponding.Each light-emitting diodes Tube assembly 26 is fixed in the second corresponding holes 254, and its this this corresponding to pin 262 is to pin 212 It is respectively welded together.
Further, transparent packing colloid 27 at least covers at least one above-mentioned second holes 254 and above-mentioned at least one A light-emitting diode component 26.At least one light-emitting diode component 26 emits light by driving, and is pointed into keycap 14.
Elastic actuator 12 is set to the periphery of the first holes 252, opens the end 1242 of actuation column 124 towards at least two Coila 232.When keycap 14 is moved to pressing position, the deformation of dome body 122 of elastic actuator 12 causes actuation column 124 Conductive end 1242 contacts at least two make and break contacts 232 and at least two make and break contacts 232 is connected each other, and then triggering makes this The luminous button 1 of invention is converted on state.When keycap 14 is released and is moved to non-pressing position, elastic actuator 12 Dome body 122 restore original configuration and separate the conductive end 1242 of actuation column 124 at least two make and break contacts 232.
The dual function circuit unit 2 of first preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.Using the dual function electricity of the first preferred embodiment according to the present invention The luminous button 1 of road component 2 can exempt light guide plate.
Fig. 3 to Fig. 6 is please referred to, present invention manufacture the first preferably implementation as shown in Figure 2 is schematically painted with cross section view The method of the dual function circuit unit 2 of example.The definition of its hatching of section shown in Fig. 3 to Fig. 6 is the same as the line A-A in Fig. 1.
Firstly, as shown in figure 3, method of the invention, firstly, the first insulating substrate 20 of preparation.
In a specific embodiment, the first insulating substrate 20 be can be using phenolic aldehyde cotton paper as the substrate of substrate, with glass cloth For the substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), macromolecule membrane etc. of substrate.If the first insulation base Material 20 is macromolecule membrane, be can be by polyethylene terephthalate, polyimides, polyacids methyl esters, poly-methyl methacrylate Ester or other similar commercial high molecular material are formed by insulating substrate.It, can be with if the first insulating substrate 20 is ceramic base material The thermal energy heat dissipation for assisting 26 operation of light-emitting diode component to generate.
Then, also shown in FIG. 3, in forming the first circuit 21 on the upper surface 202 of the first insulating substrate 20.First electricity Road 21 includes at least a pair of pins 212.
In a specific embodiment, definition has first line region 204 on the upper surface 202 of the first insulating substrate 20.The The forming step of one circuit 21 are as follows: prior to being coated the first conductive paste bed of material 214 on first line region 204.Then, absolutely to first The upper surface 202 of edge substrate 20 executes chemical plating processing procedure, and then in deposited metal layer 216 on the first conductive paste bed of material 214.First The conductive paste bed of material 214 and metal layer 216 constitute the first circuit 21.The first conductive paste bed of material 214 may include by silver, copper, gold, Aluminium, graphite, carbon nanotubes, graphene and combinations thereof are formed by conductive particle.The first conductive paste bed of material 214 can be by halftone Printing process (being not limited) is coated on first line region 204.
In a specific embodiment, the structure of metal layer 216 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, as shown in figure 4, forming insulating layer 22 to cover the upper surface of the first circuit 21 and the first insulating substrate 20 202, and make at least exposure of a pair of pins 212.
In a specific embodiment, insulating layer 22 can by first coated UV line hardening resin in the first circuit 21 and Irradiating ultraviolet light is hardened again on the upper surface 202 of first insulating substrate 20.
Then, also shown in FIG. 4, in formation second circuit 23 on insulating layer 22.Second circuit 23 is opened comprising at least two Coila 232.
In a specific embodiment, definition has the second land 222 on insulating layer 22.Second circuit 23 may include The two conductive paste bed of materials 234.The second conductive paste bed of material 234 is coated on the second land 222.The second conductive paste bed of material 234 can Comprising being formed by conductive particle by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene and combinations thereof.Second electrocondution slurry Layer 234 can be coated on the second land 222 by screen painting processing procedure (being not limited).
Then, as shown in figure 5, in being coated adhesion layer 24 on second circuit 23 and insulating layer 22, and draw at least a pair Foot 212 and the exposure of at least two make and break contacts 232.
In a specific embodiment, adhesion layer 24 is to form by coating glue, but be not limited thereto.
Then, also shown in FIG. 5, prepare the second insulating substrate 25.Second insulating substrate 25 have the first holes 252 with And at least one second holes 254.One pair of them pin in the corresponding at least a pair of pins 212 of each second holes 254 212。
In a specific embodiment, the second insulating substrate 25 be can be using phenolic aldehyde cotton paper as the substrate of substrate, with glass cloth For the substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), macromolecule membrane etc. of substrate.If insulating substrate 25 Macromolecule membrane, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or Other similar commercial high molecular material is formed by insulating substrate.
Then, also shown in FIG. 5, the second insulating substrate 25 is fitted in into insulation by adhesion layer 24 (being not limited) On layer 22, and be placed at least two make and break contacts 232 in first holes 252, and every a pair of pins 212 be placed in it is corresponding In second holes 254.
Then, as shown in fig. 6, preparing at least one light-emitting diode component 26.Each light-emitting diode component 26 is right Answer the one pair of them pin 212 and second holes 254 at least a pair of pins 212, and each light emitting diode Component 26 includes a pair of of pin 262.
Finally, it is also shown in FIG. 6, each light-emitting diode component 26 is fixed in its corresponding second holes 254, And pin 212 is respectively welded together in its this this corresponding to pin 262.
Further, also shown in FIG. 6, with transparent packing colloid 27 at least cover at least one second holes 254 with And at least one light-emitting diode component 26, that is, complete dual function circuit unit 2 as shown in Figure 2.Elastic actuator 12 is set It is placed in the periphery of the first holes 252 of the second insulating substrate 25, opens the conductive end 1242 of actuation column 124 towards at least two Coila 232.
Referring to Fig. 7, the schema schematically depicts the dual function circuit group of the second preferred embodiment according to the present invention Part 3.Fig. 7 is the cross section view of the dual function circuit unit 3 of the second preferred embodiment of the invention.Section shown in Fig. 7 its cut open The definition of upper thread is the same as the line A-A in Fig. 1.The dual function circuit unit 3 of second preferred embodiment of the invention can replace this The dual function circuit unit 2 of first preferred embodiment of invention, installation to luminous button 1 as shown in Figure 1.At this point, actuation The end 1242 of column 124 need not be conductive.For convenience of description, in Fig. 7, be only painted dual function circuit unit 3 and The cross section view of elastic actuator 12.
As shown in fig. 7, the dual function circuit unit 3 of the second preferred embodiment according to the present invention includes insulating substrate 30, the first circuit 31, insulating layer 32, second circuit 33, separation layer 35, macromolecule membrane 36, tertiary circuit 37 and at least one A light-emitting diode component 38.In example shown in Fig. 7, a light-emitting diode component 38 is only painted as representative.Yu Yi In specific embodiment, light-emitting diode component 38 can be the light-emitting diode component encapsulated, be also possible to bare crystalline kenel Light-emitting diode component.
In a specific embodiment, insulating substrate 30 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 30 is high Molecular film, insulating substrate 30 and macromolecule membrane 36 can be individually respectively by polyethylene terephthalate, polyimides, Polyacids methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed.If insulating substrate 30 is ceramics Substrate, the thermal energy heat dissipation that 38 operation of light-emitting diode component can be assisted to generate.
First circuit 31 is formed on the upper surface 302 of insulating substrate 30.First circuit 31 includes at least a pair of pins 312.Insulating layer 32 forms and covers the upper surface 302 of the first circuit 31 and insulating substrate 30, and makes at least a pair of pins 312 Exposure.
Also shown in FIG. 7, in a specific embodiment, definition has first line on the upper surface 302 of insulating substrate 30 Region 304.First circuit 31 may include the first conductive paste bed of material 314 and metal layer 316.The first conductive paste bed of material, 314 quilt It is overlying on first line region 304.Metal layer 316 can be deposited on the first conductive paste bed of material 314 by chemical plating processing procedure.The The one conductive paste bed of material 314, which may include, is formed by conduction by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene and combinations thereof Particle.The first conductive paste bed of material 314 can be coated on first line region 304 by screen painting processing procedure (being not limited) On.
In a specific embodiment, the structure of metal layer 316 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
In a specific embodiment, insulating layer 32 can by first coated UV line hardening resin in the first circuit 31 and Irradiating ultraviolet light is hardened again on the upper surface 302 of insulating substrate 30.
Second circuit 33 is formed on insulating layer 32.Second circuit 33 includes at least one lower switch contact 332.First is glutinous Layer 34a be coated on second circuit 33 and insulating layer 32, and connect at least a pair of pins 312 and at least one lower switch 332 exposure of point.
In a specific embodiment, definition has the second land 322 on insulating layer 32.Second circuit 33 may include The two conductive paste bed of materials 334.The second conductive paste bed of material 334 is coated on the second land 322.The second conductive paste bed of material 334 can Comprising being formed by and being led by any one and/or any combination thereof in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Electric particle.The second conductive paste bed of material 334 can be coated on the second land 322 by screen painting processing procedure (being not limited) On.
Separation layer 35 has the first holes 352 and at least one second holes 354.Each second holes 354 is corresponding One pair of them pin 312 at least in a pair of pins 312.Separation layer 35 is bonded by the first adhesion layer 34a (being not limited) In on insulating layer 32, and it is placed at least one lower switch contact 332 in first holes 352, and every a pair of pins 312 is placed in In the second corresponding holes 354.Second adhesion layer 34b is coated on separation layer 35, and do not cover the first holes 352 with And at least one second holes 354.In Fig. 7, second holes 354 is only painted as representative.
Macromolecule membrane 36 has at least one third holes 364.Each third holes 364 corresponds to second holes 354.Tertiary circuit 37 is formed on the lower surface 362 of macromolecule membrane 36.Tertiary circuit 37 includes that at least one upper switch connects Point 372.Macromolecule membrane 36 fits on separation layer 35 by the second following surface 362 adhesion layer 34b (being not limited), and It is placed at least one upper switch contact 372 in first holes and is aligned or at least a lower switch contact 332, each third Holes 364 is aligned the second corresponding holes 354.In Fig. 7, a third holes 364 is only painted as representative.
In a specific embodiment, the first adhesion layer 34a and the second adhesion layer 34b is formed by coating glue, but simultaneously It is not limited.
In a specific embodiment, definition has tertiary circuit region 366 on the lower surface 362 of macromolecule membrane 36.Third Circuit 37 may include the third conductive paste bed of material 374.The third conductive paste bed of material 374 is coated on tertiary circuit region 366.Third The conductive paste bed of material 374 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The third conductive paste bed of material 374 can be coating by screen painting processing procedure (being not limited) In on tertiary circuit region 366.In practical application, second circuit 33 and tertiary circuit 37 can have wire jumper design.
312, thirds of one pair of them pin in the corresponding at least a pair of pins 312 of each light-emitting diode component 38 Holes 364 and second holes 354, and each light-emitting diode component 38 includes a pair of of pin 382.Each hair Optical diode component 38 be fixed on corresponding third holes 364 in corresponding second holes 354, and its this to pin Pin 312 is respectively welded together in 382 corresponding these.
Further, transparent packing colloid 39 at least covers at least one above-mentioned third holes 364 and at least one hair Optical diode component 38.At least one light-emitting diode component 26 emits light by driving, and is pointed into keycap 14.
Elastic actuator 12 is set on macromolecule membrane 36 and is aligned the first holes 352, and makes the end of actuation column 124 End 1242 is towards at least one upper switch contact 372 and at least one lower switch contact 332.When keycap 14 is moved to pressing position When, the dome body 122 of elastic actuator 12, which deforms, causes the end 1242 of actuation column 124 to push so that opening at least one Coila 372 contacts at least one lower switch contact 332 and makes to be connected each other, and then triggering makes 1 turn of luminous button of the invention It is changed on state.When keycap 14 is released and is moved to non-pressing position, the dome body 122 of elastic actuator 12 restores former Beginning shape separates at least one lower switch contact 332 with a few upper switch contact 372.There is number identical as Fig. 2 in Fig. 7 The component of label has same or similar structure and function, does not repeat herein.
The dual function circuit unit 3 of second preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.Using the dual function circuit group of the second preferred embodiment of the invention The luminous button 1 of part 3 can exempt light guide plate.
Fig. 8 to Figure 11 is please referred to, present invention manufacture the second preferably implementation as shown in Figure 7 is schematically painted with cross section view The method of the dual function circuit unit 3 of example.The definition of its hatching of section shown in Fig. 8 to Figure 11 is the same as the line A-A in Fig. 1.
As shown in figure 8, in the manufacturing method of the present invention, firstly, preparing insulating substrate 30.
In a specific embodiment, insulating substrate 30 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 30 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.If insulating substrate 30 is ceramic base material, luminous two can be assisted The thermal energy heat dissipation that 38 operation of pole pipe component generates.
Then, also shown in FIG. 8, in forming the first circuit 31 on the upper surface of insulating substrate 30 302.First circuit 31 Include at least a pair of pins 312.
Also shown in FIG. 8, in a specific embodiment, definition has first line on the upper surface 302 of insulating substrate 30 Region 304.First circuit 31 may include the first conductive paste bed of material 314 and metal layer 316.The first conductive paste bed of material, 314 quilt It is overlying on first line region 304.Metal layer 316 can be deposited on the first conductive paste bed of material 314 by chemical plating processing procedure.The The one conductive paste bed of material 314 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Any combination is formed by conductive particle.The first conductive paste bed of material 314 (can be not limited) quilt by screen painting processing procedure It is overlying on first line region 304.
In a specific embodiment, the structure of metal layer 316 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, as shown in figure 9, forming insulating layer 32 to cover the upper surface 302 of the first circuit 31 and insulating substrate 30, And make at least exposure of a pair of pins 312.
In a specific embodiment, insulating layer 32 can by first coated UV line hardening resin in the first circuit 31 and Irradiating ultraviolet light is hardened again on the upper surface 302 of insulating substrate 30.
Then, also shown in FIG. 9, in formation second circuit 33 on insulating layer 32.Second circuit 33 includes at least one Lower switch contact 332.
In a specific embodiment, definition has the second land 322 on insulating layer 32.Second circuit 33 may include The two conductive paste bed of materials 334.The second conductive paste bed of material 334 is coated on the second land 322.The second conductive paste bed of material 334 can Comprising being formed by and being led by any one and/or any combination thereof in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Electric particle.The second conductive paste bed of material 334 can be coated on the second land 322 by screen painting processing procedure (being not limited) On.
Then, as shown in Figure 10, in the first adhesion layer 34a coating on second circuit 33 and insulating layer 32, and make at least A pair of pins 312 and the exposure of at least one lower switch contact 332.
Then, also shown in FIG. 10, prepare separation layer 35.Separation layer 35 have the first holes 352 and at least one Second holes 354.One pair of them pin 312 in the corresponding at least a pair of pins 312 of each second holes 354.
Then, also shown in FIG. 10, prepare macromolecule membrane 36.Macromolecule membrane 36 has at least one third holes 364.Each third holes 364 corresponds to second holes 354.
In a specific embodiment, macromolecule membrane 36 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
Then, also shown in FIG. 10, in formation tertiary circuit 37 on the lower surface of macromolecule membrane 36 362.Third electricity Road 37 includes at least one upper switch contact 372.
In a specific embodiment, definition has tertiary circuit region 366 on the lower surface 362 of macromolecule membrane 36.Third Circuit 37 may include the third conductive paste bed of material 374.The third conductive paste bed of material 374 is coated on tertiary circuit region 366.Third The conductive paste bed of material 374 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The third conductive paste bed of material 374 can be coating by screen painting processing procedure (being not limited) In on tertiary circuit region 366.In practical application, second circuit 33 and tertiary circuit 37 can have wire jumper design.
Then, also shown in FIG. 10, the second adhesion layer 34b is coated on the lower surface of macromolecule membrane 36 362, and is made The exposure of at least one upper switch contact 372.
In a specific embodiment, the first adhesion layer 34a and the second adhesion layer 34b can be to be formed by coating glue, But it is not limited thereto.
Then, also shown in FIG. 10, it will be every by the first adhesion layer 34a and the second adhesion layer 34b (being not limited) Absciss layer 35 fits between insulating layer 32 and the lower surface 362 of macromolecule membrane 36, and make at least one upper switch contact 372 with At least one lower switch contact 332 is placed in the first holes 352, and every a pair of pins 312 is placed in corresponding second and breaks In hole 354.
Then, as shown in figure 11, at least one light-emitting diode component 38 is prepared.Each light-emitting diode component 38 is right 312, third holes 364 of one pair of them pin and second holes 354 at least a pair of pins 312 are answered, and The dry component 38 of each light-emitting diode includes a pair of of pin 382.
Finally, it is also shown in FIG. 11, each light-emitting diode component 38 is fixed in corresponding third holes 364 Pin 312 is respectively welded together in corresponding second holes 354, and by its this this corresponding to pin 382.
Further, also shown in FIG. 11, with transparent packing colloid 39 at least cover at least one third holes 364 with And at least one light-emitting diode component 38, that is, complete dual function circuit unit 3 as shown in Figure 7.Elastic actuator 12 is set Be placed on macromolecule membrane 36 and be aligned the first holes 352, and make actuation column 124 end 1242 towards at least one on open Coila 372 and at least one lower switch contact 332.
Figure 12 is please referred to, which schematically depicts the dual function circuit unit 4 of third preferred embodiment of the invention. Figure 12 is the cross section view of the dual function circuit unit 4 of third preferred embodiment of the invention.Its section of section shown in Figure 12 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 4 of third preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, at least making The end 1242 of dynamic column 124 is conductive tips.For convenience of description, in Figure 12, be only painted dual function circuit unit 4 and The cross section view of elastic actuator 12.
As shown in figure 12, the dual function circuit unit 4 of third preferred embodiment of the invention includes the first insulating substrate 40, the first circuit 41, insulating layer 42, second circuit 43, the second insulating substrate 45 and at least one light-emitting diode component 46. In the example shown in Figure 12, a light-emitting diode component 46 is only painted as representative.In a specific embodiment, luminous two Pole pipe component 46 can be the light-emitting diode component encapsulated, be also possible to the light-emitting diode component of bare crystalline kenel.
In a specific embodiment, the first insulating substrate 40 and the second insulating substrate 45 can be individually with phenolic aldehyde cotton respectively Paper is the substrate of substrate, using glass cloth as the substrate of substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), height Molecular film etc..It can respectively be individually by poly- pair if the first insulating substrate 40 and the second insulating substrate 45 are macromolecule membranes Polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other similar commercial high molecular material institute The macromolecule membrane of formation.If the first insulating substrate 40 is ceramic base material, 46 operation of light-emitting diode component can be assisted The thermal energy of generation radiates.
First circuit 41 is formed on the lower surface 402 of the first insulating substrate 40.First circuit 41 includes that at least a pair is drawn Foot 412.Insulating layer 42 forms and covers the lower surface 402 of the first circuit 41 and the first insulating substrate 40, and makes at least a pair of The exposure of pin 412.
Also shown in FIG. 12, in a specific embodiment, definition has first on the lower surface 402 of the first insulating substrate 40 Land 404.First circuit 41 may include the first conductive paste bed of material 414 and metal layer 416.The first conductive paste bed of material 414 are coated on first line region 404.Metal layer 416 can be deposited on the first conductive paste bed of material 414 by chemical plating processing procedure On.The first conductive paste bed of material 414 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/ Or any combination thereof be formed by conductive particle.The first conductive paste bed of material 414 can by screen painting processing procedure (not as Limit) it is coated on first line region 404.
In a specific embodiment, the structure of metal layer 416 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
In a specific embodiment, insulating layer 42 can by first coated UV line hardening resin in the first circuit 41 and Irradiating ultraviolet light is hardened again on the lower surface 402 of first insulating substrate 40.
Second circuit 43 is formed on the upper surface 406 of the first insulating substrate 40.Second circuit 43 includes at least two switches Contact 432.
In a specific embodiment, definition has the second land 408 on the upper surface 406 of the first insulating substrate 40.The Two circuits 43 may include the second conductive paste bed of material 434.The second conductive paste bed of material 434 is coated on the second land 408.The The two conductive paste bed of materials 434 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Any combination is formed by conductive particle.The second conductive paste bed of material 434 (can be not limited) quilt by screen painting processing procedure It is overlying on the second land 408.
Adhesion layer 44 is coated on the upper surface 406 of second circuit 43 and the first insulating substrate 40, and makes at least two to open The exposure of coila 432.
In a specific embodiment, adhesion layer 44 is to form by coating glue, but be not limited thereto.
Second insulating substrate 45 has holes 452.Second insulating substrate 45 is bonded by adhesion layer 44 (being not limited) In on the upper surface 406 of the first insulating substrate 40, and at least two make and break contacts 432 is made to be placed in the holes of the second insulating substrate 45 In 452.
One pair of them pin 412 in the corresponding at least a pair of pins 412 of each light-emitting diode component 46, and it is each A light-emitting diode component 46 includes a pair of of pin 462.This of each light-emitting diode component 46 is corresponding to pin 462 This pin 412 is respectively welded together.
Further, transparent packing colloid 47 at least covers at least one light-emitting diode component 46.In practical application, Each light-emitting diode component 46 can be the light-emitting diode component of lateral direction light emission.Using third preferred embodiment of the invention The luminous button 1 of dual function circuit unit 4 light guide plate can also be set by least one above-mentioned light-emitting diode component 46 ray guidances emitted are pointed into keycap 14 in turn.
Elastic actuator 12 is set to the periphery of the holes 452 of the second insulating substrate 45, causes the end of actuation column 124 1242 direction at least two make and break contacts 432.When keycap 14 is moved to pressing position, the dome body 122 of elastic actuator 12 becomes Shape causes the conductive end 1242 of actuation column 124 to contact at least two make and break contacts 432 and make at least two make and break contacts 432 each other Conducting, and then triggering makes luminous button 1 of the invention be converted on state.When keycap 14 is released and it is moved to and does not press position When setting, the dome body 122 of elastic actuator 12, which restores original configuration, opens the conductive end 1242 of actuation column 124 at least two Coila 432 separates.With the component of number mark identical as Fig. 2 in Figure 12, there are same or similar structure and function, This is not repeated.
The dual function circuit unit 4 of third preferred embodiment according to the present invention has the function of thin film switch and light source electricity Road plate function, thickness can drop to 270 μm~350 μm.
Figure 13 to Figure 16 is please referred to, it is preferably real that present invention manufacture third as shown in figure 12 is schematically painted with cross section view The method for applying the dual function circuit unit 4 of example.The definition of its hatching of section shown in Figure 13 to Figure 16 is the same as the line A-A in Fig. 1.
As shown in figure 13, in the manufacturing method of the present invention, firstly, the first insulating substrate 40 of preparation.
In a specific embodiment, the first insulating substrate 40 be can be using phenolic aldehyde cotton paper as the substrate of substrate, with glass cloth For the substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), macromolecule membrane etc. of substrate.If the first insulation base Material 40 is macromolecule membrane, be can be by polyethylene terephthalate, polyimides, polyacids methyl esters, poly-methyl methacrylate It is macromolecule membrane that ester or other similar commercial high molecular material, which are formed,.If the first insulating substrate 40 is ceramic base material, can With the thermal energy heat dissipation for assisting 46 operation of light-emitting diode component to generate.
Then, also shown in FIG. 13, in forming the first circuit 41 on the lower surface 402 of the first insulating substrate 40.First Circuit 41 includes at least a pair of pins 412.
Also shown in FIG. 13, in a specific embodiment, definition has first on the lower surface 402 of the first insulating substrate 40 Land 404.First circuit 41 may include the first conductive paste bed of material 414 and metal layer 416.The first conductive paste bed of material 414 are coated on first line region 404.Metal layer 416 can be deposited on the first conductive paste bed of material 414 by chemical plating processing procedure On.The first conductive paste bed of material 414 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/ Or any combination thereof be formed by conductive particle.The first conductive paste bed of material 414 can by screen painting processing procedure (not as Limit) it is coated on first line region 404.
In a specific embodiment, the structure of metal layer 416 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, also shown in FIG. 13, insulating layer 42 is formed to cover the first circuit 41 and the first insulating substrate 40 Lower surface 402, and make at least exposure of a pair of pins 412.
In a specific embodiment, insulating layer 42 can by first coated UV line hardening resin in the first circuit 41 and Irradiating ultraviolet light is hardened again on the upper surface 302 of first insulating substrate 40.
Then, as shown in figure 14, in formation second circuit 43 on the upper surface 406 of the first insulating substrate 40.Second circuit 43 include at least two make and break contacts 432.
In a specific embodiment, definition has the second land 408 on the upper surface 406 of the first insulating substrate 40.The Two circuits 43 may include the second conductive paste bed of material 434.The second conductive paste bed of material 434 is coated on the second land 408.The The two conductive paste bed of materials 434 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Any combination is formed by conductive particle.The second conductive paste bed of material 434 (can be not limited) quilt by screen painting processing procedure It is overlying on the second land 408.
Then, as shown in figure 15, in adhesion layer coating on the upper surface 406 of second circuit 43 and the first insulating substrate 40 44, and make the exposure of at least two make and break contacts 432.
In a specific embodiment, adhesion layer 44 can be to be formed by coating glue, but is not limited thereto.
Then, also shown in FIG. 15, prepare the second insulating substrate 45.Second insulating substrate 45 has holes 452.
In a specific embodiment, the second insulating substrate 45 be can be using phenolic aldehyde cotton paper as the substrate of substrate, with glass cloth For the substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), macromolecule membrane etc. of substrate.If the second insulation base Material 45 is macromolecule membrane, be can be by polyethylene terephthalate, polyimides, polyacids methyl esters, poly-methyl methacrylate Ester or other similar commercial high molecular material are formed by macromolecule membrane.
Then, also shown in FIG. 15, the second insulating substrate 45 is fitted in by adhesion layer 44 (being not limited) On the upper surface 406 of one insulating substrate 40, and it is placed at least two make and break contacts 432 in holes 452.
Then, as shown in figure 16, at least one light-emitting diode component 46 is prepared.Each light-emitting diode component 46 is right Should one pair of them pin 412 at least in a pair of pins 412, and each light-emitting diode component 46 includes a pair of of pin 462。
Finally, also shown in FIG. 16, by each light-emitting diode component 46 this it is corresponding to pin 462 should Pin 412 is respectively welded together.
Further, also shown in FIG. 16, at least one light emitting diode group is covered at least with transparent packing colloid 47 Part 46 completes dual function circuit unit 4 as shown in figure 12.Elastic actuator 12 is set to the broken of the second insulating substrate 45 The periphery in hole 452, and make the conductive end 1242 of actuation column 124 towards at least two make and break contacts 432.
Figure 17 is please referred to, which schematically depicts the dual function circuit unit 5 of the 4th preferred embodiment of the invention. Figure 17 is the cross section view of the dual function circuit unit 5 of the 4th preferred embodiment of the invention.Its section of section shown in Figure 17 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 5 of 4th preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, actuation column 124 end 1242 needs not to be conductive.For convenience of description, in Figure 17, dual function circuit unit 5 and bullet are only painted The cross section view of property actuator 12.
As shown in figure 17, the dual function circuit unit 5 of the 4th preferred embodiment of the invention includes insulating substrate 50, the One circuit 51, insulating layer 52, second circuit 53, separation layer 55, macromolecule membrane 56, tertiary circuit 57 and at least one shine Diode assembly 58.In the example shown in Figure 17, a light-emitting diode component 58 is only painted as representative.It is specific real in one It applies in example, light-emitting diode component 58 can be the light-emitting diode component encapsulated, be also possible to luminous the two of bare crystalline kenel Pole pipe component.
In a specific embodiment, insulating substrate 50 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 50 is high Molecular film, insulating substrate 50 and macromolecule membrane 56 can be by polyethylene terephthalate, polyimides, polyacids respectively Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.If insulating substrate 50 be ceramic base material, the thermal energy heat dissipation that 58 operation of light-emitting diode component can be assisted to generate.
First circuit 51 is formed on the first lower surface 502 of insulating substrate 50.First circuit 51 includes that at least a pair is drawn Foot 512.Insulating layer 52 forms and covers the first lower surface 502 of the first circuit 51 and insulating substrate 50, and makes at least a pair of The exposure of pin 512.
Also shown in FIG. 17, in a specific embodiment, definition has first on the first lower surface 502 of insulating substrate 50 Land 504.First circuit 51 may include the first conductive paste bed of material 514 and metal layer 516.The first conductive paste bed of material 514 are coated on first line region 504.Metal layer 516 can be deposited on the first conductive paste bed of material 514 by chemical plating processing procedure On.The first conductive paste bed of material 514 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/ Or any combination thereof be formed by conductive particle.The first conductive paste bed of material 514 can by screen painting processing procedure (not as Limit) it is coated on first line region 504.
In a specific embodiment, the structure of metal layer 516 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
In a specific embodiment, insulating layer 52 can by first coated UV line hardening resin in the first circuit 51 and Irradiating ultraviolet light is hardened again on first lower surface 502 of insulating substrate 50.
Second circuit 53 is formed on the upper surface 506 of insulating substrate 50.Second circuit 53 includes at least one lower switch Contact 532.First adhesion layer 54a is coated on the upper surface 506 of second circuit 53 and insulating substrate 50, and makes at least one The exposure of lower switch contact 532.
In a specific embodiment, definition has the second land 508 on the upper surface 506 of insulating substrate 50.Second electricity Road 53 may include the second conductive paste bed of material 534.The second conductive paste bed of material 534 is coated on the second land 508.Second leads The plasma-based bed of material 534 may include any by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Combination is formed by conductive particle.The second conductive paste bed of material 534 can be coated on by screen painting processing procedure (being not limited) On second land 508.
Separation layer 55 has holes 552.Separation layer 55 fits in insulation base by the first adhesion layer 54a (being not limited) On the upper surface 506 of material 50, and it is placed at least one lower switch contact 532 in the holes 552 of separation layer 55.Second adhesion layer 54b is coated on the holes 552 for not covering on separation layer 55 and separation layer 55.
In a specific embodiment, the first adhesion layer 54a and the second adhesion layer 54b is formed by coating glue, but simultaneously It is not limited.
Tertiary circuit 57 is formed on the second lower surface 562 of macromolecule membrane 56.Tertiary circuit 57 includes at least one Upper switch contact 572.Macromolecule membrane 56 is fitted in by the second adhesion layer 54b (being not limited) with the second lower surface 562 On separation layer 55, and so that at least one upper switch contact 572 is placed in the holes 552 of separation layer 55 and is aligned or at least under one and open Coila 532.
In a specific embodiment, definition has tertiary circuit region 564 on the second lower surface 562 of macromolecule membrane 56. Tertiary circuit 57 may include the third conductive paste bed of material 574.The third conductive paste bed of material 574 is coated on tertiary circuit region 564. The third conductive paste bed of material 574 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/or Any combination thereof is formed by conductive particle.The third conductive paste bed of material 574 (can be not limited) by screen painting processing procedure It is coated on tertiary circuit region 564.In practical application, second circuit 53 and tertiary circuit 57 can have wire jumper design.
One pair of them pin 512 in the corresponding at least a pair of pins 512 of each light-emitting diode component 58, and it is each A light-emitting diode component 58 includes a pair of of pin 582.This of each light-emitting diode component 58 is corresponding to pin 582 This pin 512 is respectively welded together.
Further, transparent packing colloid 59 at least covers at least one light-emitting diode component 58.In practical application, Each light-emitting diode component 56 is the light-emitting diode component of lateral direction light emission.Using the 4th preferred embodiment of the invention The luminous button 1 of dual function circuit unit 5 can also be arranged light guide plate and be emitted above-mentioned at least light-emitting diode component 56 Ray guidance so that be pointed into keycap 14.
Elastic actuator 12 is set on macromolecule membrane 56 and is aligned the holes 552 of separation layer 55, and makes actuation column 124 end 1242 is towards at least one upper switch contact 572 and at least one lower switch contact 532.When keycap 14 is moved to When pressing position, the dome body 122 of elastic actuator 12, which deforms, causes the end 1242 of actuation column 124 to push so that at least One upper switch contact 572 contacts at least one lower switch contact 532 and makes to be connected each other, and then triggering makes of the invention shine Key 1 is converted on state.When keycap 14 is released and is moved to non-pressing position, the dome body of elastic actuator 12 122 recovery original configurations separate the end 1242 of actuation column 124 at least one upper switch contact 572, thus originally each other At least one upper switch contact 572 of contact is separated at least one lower switch contact 532.Have and Fig. 2 same No. in Figure 17 The component of code labeling has same or similar structure and function, does not repeat herein.
The dual function circuit unit 5 of 4th preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.
Figure 18 to Figure 21 is please referred to, the present invention is schematically painted with cross section view and manufactures as shown in figure 17 the 4th preferably in fact The method for applying the dual function circuit unit 5 of example.The definition of its hatching of section shown in Figure 18 to Figure 21 is the same as the line A-A in Fig. 1.
As shown in figure 18, in the manufacturing method of the present invention, firstly, preparing insulating substrate 50.
In a specific embodiment, insulating substrate 50 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 50 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.If insulating substrate 50 is ceramic base material, luminous two can be assisted The thermal energy heat dissipation that 58 operation of pole pipe component generates.
Then, also shown in FIG. 18, in forming the first circuit 51 on the first lower surface 502 of insulating substrate 50.First Circuit 51 includes at least a pair of pins 512.
Also shown in FIG. 18, in a specific embodiment, definition has first on the first lower surface 502 of insulating substrate 50 Land 504.First circuit 51 may include the first conductive paste bed of material 514 and metal layer 516.The first conductive paste bed of material 514 are coated on first line region 504.Metal layer 516 can be deposited on the first conductive paste bed of material 514 by chemical plating processing procedure On.The first conductive paste bed of material 514 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/ Or any combination thereof be formed by conductive particle.The first conductive paste bed of material 514 can by screen painting processing procedure (not as Limit) it is coated on first line region 504.
In a specific embodiment, the structure of metal layer 516 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, also shown in FIG. 18, insulating layer 52 is formed to cover the first of the first circuit 51 and insulating substrate 50 Lower surface 502, and make at least exposure of a pair of pins 512.
In a specific embodiment, insulating layer 52 can by first coated UV line hardening resin in the first circuit 51 and Irradiating ultraviolet light is hardened again on first lower surface 502 of insulating substrate 50.
Then, as shown in figure 19, in formation second circuit 53 on the upper surface of insulating substrate 50 506.Second circuit 53 wraps Containing at least one lower switch contact 532.
In a specific embodiment, definition has the second land 508 on the upper surface 506 of insulating substrate 50.Second electricity Road 53 may include the second conductive paste bed of material 534.The second conductive paste bed of material 534 is coated on the second land 508.Second leads The plasma-based bed of material 534 may include any by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Combination is formed by conductive particle.The second conductive paste bed of material 534 can be coated on by screen painting processing procedure (being not limited) On second land 508.
Then, as shown in figure 20, in the first adhesion layer coating on the upper surface 506 of second circuit 53 and insulating substrate 50 54a, and make the exposure of at least one lower switch contact 532.
Then, also shown in FIG. 20, prepare separation layer 55.Separation layer 55 has holes 552.
Then, also shown in FIG. 20, prepare macromolecule membrane 56.
In a specific embodiment, macromolecule membrane 56 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
Then, also shown in FIG. 20, in formation tertiary circuit 57 on the second lower surface 562 of macromolecule membrane 56.The Three-circuit 57 includes at least one upper switch contact 572.
In a specific embodiment, definition has tertiary circuit region 564 on the second lower surface 562 of macromolecule membrane 56. Tertiary circuit 57 may include the third conductive paste bed of material 574.The third conductive paste bed of material 574 is coated on tertiary circuit region 564. The third conductive paste bed of material 574 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/or Any combination thereof is formed by conductive particle.The third conductive paste bed of material 574 (can be not limited) by screen painting processing procedure It is coated on tertiary circuit region 564.In practical application, second circuit 53 and tertiary circuit 57 can have wire jumper design.
Then, also shown in FIG. 20, it is coated the second adhesion layer 54b on the second lower surface 562 of macromolecule membrane 56, And make the exposure of at least one upper switch contact 572.
In a specific embodiment, the first adhesion layer 54a and the second adhesion layer 54b can be to be formed by coating glue, But it is not limited thereto.
Then, also shown in FIG. 20, it will be every by the first adhesion layer 54a and the second adhesion layer 54b (being not limited) Absciss layer 55 fits between the upper surface 506 of insulating substrate 50 and the second lower surface 562 of macromolecule membrane 56, and makes at least one A upper switch contact 572 is placed in holes 552 at least one lower switch contact 532.
Then, as shown in figure 21, at least one light-emitting diode component 58 is prepared.Each light-emitting diode component 58 is right Should one pair of them pin 512 at least in a pair of pins 512 simultaneously, and each light-emitting diode component 58 includes a pair of of pin 582。
Finally, it is same as shown in figure 21, by each light-emitting diode component 58 this it is corresponding to pin 582 should Pin 512 is respectively welded together.
Further, same as shown in figure 21, at least one light emitting diode group is covered at least with transparent packing colloid 59 Part 58 completes dual function circuit unit 5 as shown in figure 17.Elastic actuator 12 be set on macromolecule membrane 56 and It is aligned holes 552, and makes the end 1242 of actuation column 124 towards at least one upper switch contact 572 and at least one lower switch Contact 532.
Figure 22 is please referred to, which schematically depicts the dual function circuit unit 6 of the 5th preferred embodiment of the invention. Figure 22 is the cross section view of the dual function circuit unit 6 of the 5th preferred embodiment of the invention.Its section of section shown in Figure 22 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 6 of 5th preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, at least making The end 1242 of dynamic column 124 is conductive tips.For convenience of description, in Figure 22, be only painted dual function circuit unit 6 and The cross section view of elastic actuator 12.
As shown in figure 22, the dual function circuit unit 6 of the 5th preferred embodiment of the invention includes metal base 60, the One insulating layer 61a, the first circuit 62, second insulating layer 61b, second circuit 63, insulating substrate 65 and at least one shine two Pole pipe component 66.In the example shown in Figure 22, a light-emitting diode component 66 is only painted as representative.In a specific implementation In example, light-emitting diode component 66 can be the light-emitting diode component encapsulated, be also possible to the light-emitting diodes of bare crystalline kenel Tube assembly.
In a specific embodiment, metal base 60 can be stainless sheet steel, aluminium sheet etc..Metal base 60 is conduct The bottom plate of the luminous button of prior art.
In a specific embodiment, insulating substrate 65 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 65 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.
First insulating layer 61a is formed and is covered the upper surface 602 of metal base 60.First circuit 62 is formed in the first insulation On layer 61a.First circuit 62 includes at least a pair of pins 622.
In a specific embodiment, the first insulating layer 61a can be executed by the upper surface 602 to metal base 60 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 60 602 Outer photo-hardening forms.
Same as shown in figure 22, in a specific embodiment, definition has first line region on the first insulating layer 61a 61a2.First circuit 62 may include the first conductive paste bed of material 624 and metal layer 626.The first conductive paste bed of material 624 is coated on On the 61a2 of first line region.Metal layer 626 can be deposited on the first conductive paste bed of material 624 by chemical plating processing procedure.First The conductive paste bed of material 624 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 624 can be coating by screen painting processing procedure (being not limited) In on the 61a2 of first line region.
In a specific embodiment, the structure of metal layer 626 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Second insulating layer 61b is formed to cover the first circuit 62 and the first insulating layer 61a, and makes at least a pair of pins 622 exposures.Second circuit 63 is formed on second insulating layer 61b.Second circuit 63 includes at least two make and break contacts 632.
In a specific embodiment, second insulating layer 61b can be by first coated UV line hardening resin in the first circuit 62 and first irradiating ultraviolet light is hardened again on insulating layer 61a.
In a specific embodiment, definition has the second land 61b2 on second insulating layer 61b.Second circuit 63 can be with Include the second conductive paste bed of material 634.The second conductive paste bed of material 634 is coated on the second land 61b2.Second electrocondution slurry Layer 634 may include by any one and/or any combination thereof institute in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene The conductive particle of formation.The second conductive paste bed of material 634 can be coated on the second line by screen painting processing procedure (being not limited) On the 61b2 of road region.
Adhesion layer 64 is coated on second circuit 63 and second insulating layer 61b, and makes at least a pair of pins 622 and extremely Few two make and break contacts 632 exposure.
In a specific embodiment, adhesion layer 64 can be to be formed by coating glue, but is not limited thereto.
Insulating substrate 65 has the first holes 652 and at least one second holes 654.Each second holes is corresponding extremely One pair of them pin 622 in few a pair of pins 622.In Figure 22, second holes 654 is only painted as representative.
Insulating substrate 65 fits on second insulating layer 61b by adhesion layer 64 (being not limited), and makes at least two to open Coila 632 is placed in the first holes 652 of insulating substrate 65, and every a pair of pins 622 is placed in corresponding second and breaks In hole 654.Each light-emitting diode component 66 corresponds to one pair of them pin 622 and one at least a pair of pins 622 Second holes 654, and each light-emitting diode component 66 includes a pair of of pin 662.Each light-emitting diode component 66 It is fixed in the second corresponding holes 654, and pin 622 is respectively welded in its this this corresponding to pin 662 Together.
Further, transparent packing colloid 67 at least cover at least one second holes 654 and at least one shine two Pole pipe component 66.At least one light-emitting diode component 66 emits light by driving, and is pointed into keycap 14.
Elastic actuator 12 is set to the periphery of the first holes 652 of insulating substrate 65, and make the conduction of actuation column 124 End 1242 is towards at least two make and break contacts 632.When keycap 14 is moved to pressing position, the dome body of elastic actuator 12 122 deformations cause the conductive end 1242 of actuation column 124 to contact at least two make and break contacts 632 and make at least two make and break contacts 632 are connected each other, and then triggering makes luminous button 1 of the invention be converted on state.When keycap 14 is released and it is moved to When non-pressing position, the dome body 122 of elastic actuator 12 restore original configuration make the conductive end 1242 of actuation column 124 with The separation of at least two make and break contacts 632.In Figure 22 with number mark identical as Fig. 2 component, have same or similar structure with And function, it does not repeat herein.
The dual function circuit unit 6 of 5th preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.Using the dual function circuit group of the 5th preferred embodiment of the invention The luminous button 1 of part 6 can exempt light guide plate.
Figure 23 to Figure 26 is please referred to, the present invention is schematically painted with cross section view and manufactures as shown in figure 22 the 5th preferably in fact The method for applying the dual function circuit unit 6 of example.The definition of its hatching of section shown in Figure 23 to Figure 26 is the same as the line A-A in Fig. 1.
As shown in figure 23, in the manufacturing method of the present invention, firstly, preparing metal base 60.
In a specific embodiment, metal base 60 can be stainless sheet steel, aluminium sheet etc..Metal base 60 is conduct The bottom plate of the luminous button of prior art.
Then, same as shown in figure 23, the first insulating layer 61a is formed to cover the upper surface 602 of metal base 60.
In a specific embodiment, the first insulating layer 61a can be executed by the upper surface 602 to metal base 60 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 60 602 Outer photo-hardening forms.
Then, it is same as shown in figure 23, in forming the first circuit 62 on the first insulating layer 61a.First circuit 62 includes extremely Few a pair of pins 622.
Same as shown in figure 23, in a specific embodiment, definition has first line region on the first insulating layer 61a 61a2.First circuit 62 may include the first conductive paste bed of material 624 and metal layer 626.The first conductive paste bed of material 624 is coated on On the 61a2 of first line region.Metal layer 626 can be deposited on the first conductive paste bed of material 624 by chemical plating processing procedure.First The conductive paste bed of material 624 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 624 can be coating by screen painting processing procedure (being not limited) In on the 61a2 of first line region.
In a specific embodiment, the structure of metal layer 626 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, as shown in figure 24, second insulating layer 61b is formed to cover the first circuit 62 and the first insulating layer 61a, and Make at least exposure of a pair of pins 622.
In a specific embodiment, second insulating layer 61b can be by first coated UV line hardening resin in the first circuit 62 and first irradiating ultraviolet light is hardened again on insulating layer 61a.
Then, it is same as shown in figure 24, in forming second circuit 63 on second insulating layer 61b.Second circuit 63 includes extremely Few two make and break contacts 632.
Same as shown in figure 24, in a specific embodiment, definition has the second land on second insulating layer 61b 61b2.Second circuit 63 may include the second conductive paste bed of material 634.The second conductive paste bed of material 634 is coated on the second land On 61b2.The second conductive paste bed of material 634 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any combination thereof are formed by conductive particle.The second conductive paste bed of material 634 can by screen painting processing procedure (not with This is limited) it is coated on the second land 61b2.
Then, as shown in figure 25, in adhesion layer 64 coating on second circuit 63 and second insulating layer 61b, and make at least A pair of pins 622 and the exposure of at least two make and break contacts 632.
In a specific embodiment, adhesion layer 64 can be to be formed by coating glue, but is not limited thereto.
Then, same as shown in figure 25, prepare insulating substrate 65.Insulating substrate 65 is with the first holes 652 and at least One the second holes 654.A pair of pins 622 in the corresponding at least a pair of pins 622 of each second holes 654.
In a specific embodiment, insulating substrate 65 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 65 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.
Then, same as shown in figure 25, insulating substrate 65 is fitted in second absolutely by adhesion layer 64 (being not limited) On edge layer 61b, and be placed at least two make and break contacts 632 in first holes 652, and every a pair of pins 622 be placed in it is right with it In the second holes 654 answered.
Then, as shown in figure 26, at least one light-emitting diode component 66 is prepared.Each light-emitting diode component 66 is right Should one pair of them pin 622 and second holes 654 at least in a pair of pins 622, and each light-emitting diodes Tube assembly 66 includes a pair of of pin 662.
Finally, it is same as shown in figure 26, each light-emitting diode component 66 is fixed in its corresponding second holes 654 It is interior, and pin 622 is respectively welded together in its this this corresponding to pin 662.
Further, it is same as shown in figure 26, with transparent packing colloid 67 at least cover at least one second holes 654 with And at least one light-emitting diode component 66.Elastic actuator 12 is set to the periphery of the first holes 652 of macromolecule membrane 65, And make the conductive end 1242 of actuation column 124 towards at least two make and break contacts 632.
Figure 27 is please referred to, which schematically depicts the dual function circuit unit 7 of the 6th preferred embodiment of the invention. Figure 27 is the cross section view of the dual function circuit unit 7 of the 6th preferred embodiment of the invention.Its section of section shown in Figure 27 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 7 of 6th preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, actuation column 124 end 1242 needs not to be conductive.For convenience of description, in Figure 27, dual function circuit unit 7 and bullet are only painted The cross section view of property actuator 12.
As shown in figure 27, the dual function circuit unit 7 of the 6th preferred embodiment of the invention includes metal base 70, the One insulating layer 71a, the first circuit 72, second insulating layer 71b, second circuit 73, separation layer 75, macromolecule membrane 76, third electricity Road 77 and at least one light-emitting diode component 78.In the example shown in Figure 24, it is only painted a light-emitting diode component 78 as representative.In a specific embodiment, light-emitting diode component 78 can be the light-emitting diode component 78 encapsulated, It can be the light-emitting diode component 78 of bare crystalline kenel.
In a specific embodiment, metal base 70 can be stainless sheet steel, aluminium sheet etc..Metal base 70 is conduct The bottom plate of the luminous button of prior art.
In a specific embodiment, macromolecule membrane 76 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
First insulating layer 71a is formed to cover the upper surface 702 of metal base 70.First circuit 72 is formed in the first insulation On layer 71a.First circuit 72 includes at least a pair of pins 722.
In a specific embodiment, the first insulating layer 71a can be executed by the upper surface 702 to metal base 70 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 70 702 Outer photo-hardening forms.
Same as shown in figure 27, in a specific embodiment, definition has first line region on the first insulating layer 71a 71a2.First circuit 72 may include the first conductive paste bed of material 724 and metal layer 726.The first conductive paste bed of material 724 is coated on On the 71a2 of first line region.Metal layer 726 can be deposited on the first conductive paste bed of material 724 by chemical plating processing procedure.First The conductive paste bed of material 724 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 724 can be coating by screen painting processing procedure (being not limited) In on the 71a2 of first line region.
In a specific embodiment, the structure of metal layer 726 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Second insulating layer 71b is formed to cover the first circuit 72 and the first insulating layer 71a, and makes at least a pair of pins 722 exposures.Second circuit 73 is formed on second insulating layer 71b.Second circuit 73 includes at least one lower switch contact 732. First adhesion layer 74a is coated on second circuit 73 and second insulating layer 71b, and makes at least a pair of pins 722 and at least One exposure of lower switch contact 732.
In a specific embodiment, second insulating layer 71b can be by first coated UV line hardening resin in the first circuit 72 and first irradiating ultraviolet light is hardened again on insulating layer 71a.
Same as shown in figure 27, in a specific embodiment, definition has the second land on second insulating layer 71b 71b2.Second circuit 73 may include the second conductive paste bed of material 734.The second conductive paste bed of material 734 is coated on the second land On 71b2.The second conductive paste bed of material 734 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any combination thereof are formed by conductive particle.The second conductive paste bed of material 734 can by screen painting processing procedure (not with This is limited) it is coated on the second land 71b2.
Separation layer 75 has the first holes 752 and at least one second holes 754.Each second holes 754 is corresponding One pair of them pin 722 at least in a pair of pins 722.Separation layer 75 is fitted in by the first adhesion layer 74 (being not limited) On second insulating layer 71b, and it is placed at least one lower switch contact 732 in first holes 752 of separation layer 75, and each Pin 722 is placed in its corresponding second holes 754.Second adhesion layer 74b is coated on separation layer 75 and does not cover One holes 752 and at least one second holes 754.In Figure 27, second holes 754 is only painted as representative.
Macromolecule membrane 76 has at least one third holes 764.Each third holes 764 corresponds to second holes 754.Tertiary circuit 77 is formed on the lower surface 762 of macromolecule membrane 76.Tertiary circuit includes at least one upper switch contact 772.Macromolecule membrane 76 fits on separation layer 75 by the second following surface 762 adhesion layer 74b (being not limited), and makes At least one upper switch contact 772 is placed in the first holes 752 of separation layer 75 and is aligned or at least a lower switch contact 732, often One third holes 764 is aligned the second corresponding holes 754.In Figure 27, a third holes 764 is only painted as generation Table.
In a specific embodiment, the first adhesion layer 74a and the second adhesion layer 74b is formed by coating glue, but simultaneously It is not limited.
In a specific embodiment, definition has tertiary circuit region 766 on the lower surface 762 of macromolecule membrane 76.Third Circuit 77 may include the third conductive paste bed of material 774.The third conductive paste bed of material 774 is coated on tertiary circuit region 766.Third The conductive paste bed of material 774 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The third conductive paste bed of material 774 can be coating by screen painting processing procedure (being not limited) In on tertiary circuit region 766.In practical application, second circuit 33 and tertiary circuit 77 can have wire jumper design.
Corresponding one pair of them pin 722, one at least in a pair of pins 722 of each light-emitting diode component 78 the Three holes 764 and second holes 754 and each light emitting diode 78 include a pair of of pin 782, each shines Diode assembly 78 be fixed on its corresponding third holes 764 in corresponding second holes 754, and its this to pin 782 Pin 722 is respectively welded together in this corresponding.
Further, transparent packing colloid 79 at least cover at least one third holes 764 and at least one shine two Pole pipe component 78.At least one light-emitting diode component 76 emits light by driving, and is pointed into keycap 14.
Elastic actuator 12 is set on macromolecule membrane 76 and is aligned the first holes 752 of separation layer 75, and makes to make The end 1242 of dynamic column 124 is towards at least one upper switch contact 772 and at least one lower switch contact 732.When keycap 14 moves When moving to pressing position, the dome body 122 of elastic actuator 12 deform cause the end 1242 of actuation column 124 to push so that At least one upper switch contact 772 contact at least one lower switch contact 732 and make to be connected each other, and then trigger make it is of the invention Luminous button 1 is converted on state.When keycap 14 is released and is moved to non-pressing position, the dome of elastic actuator 12 Body 122, which restores original configuration, separates the end 1242 of actuation column 124 with a few upper switch contact 772, to make script phase At least one the upper switch contact 772 mutually contacted is separated at least one lower switch contact 732.Have in Figure 27 identical as Fig. 2 The component of number mark has same or similar structure and function, does not repeat herein.
The dual function circuit unit 7 of 6th preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.Using the dual function circuit group of the 6th preferred embodiment of the invention The luminous button 1 of part 7 can exempt light guide plate.
Figure 28 to Figure 31 is please referred to, the present invention is schematically painted with cross section view and manufactures as shown in figure 27 the 6th preferably in fact The method for applying the dual function circuit unit 7 of example.The definition of its hatching of section shown in Figure 28 to Figure 31 is the same as the line A-A in Fig. 1.
As shown in figure 28, in the manufacturing method of the present invention, firstly, preparing metal base 70.
In a specific embodiment, metal base 70 can be stainless sheet steel, aluminium sheet etc..Metal base 70 is conduct The bottom plate of the luminous button of prior art.
Then, same as shown in figure 28, the first insulating layer 71a is formed to cover the upper surface 702 of metal base 70.
In a specific embodiment, the first insulating layer 71a can be executed by the upper surface 702 to metal base 70 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 70 702 Outer photo-hardening forms.
Then, as shown in figure 28, in forming the first circuit 72 on the first insulating layer 71a.First circuit 72 includes at least one To pin 722.
Same as shown in figure 28, in a specific embodiment, definition has first line region on the first insulating layer 71a 71a2.First circuit 72 may include the first conductive paste bed of material 724 and metal layer 726.The first conductive paste bed of material 724 is coated on On the 71a2 of first line region.Metal layer 726 can be deposited on the first conductive paste bed of material 724 by chemical plating processing procedure.First The conductive paste bed of material 724 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 724 can be coating by screen painting processing procedure (being not limited) In on the 71a2 of first line region.
In a specific embodiment, the structure of metal layer 726 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, as shown in figure 29, second insulating layer 71b is formed to cover the first circuit 72 and the first insulating layer 71a, and Make at least exposure of a pair of pins 722.
In a specific embodiment, second insulating layer 71b can be by first coated UV line hardening resin in the first circuit 72 and first irradiating ultraviolet light is hardened again on insulating layer 71a.
Then, it is same as shown in figure 29, in forming second circuit 73 on second insulating layer 71b.Second circuit 73 includes extremely A few lower switch contact 732.
Same as shown in figure 29, in a specific embodiment, definition has the second land on second insulating layer 71b 71b2.Second circuit 73 may include the second conductive paste bed of material 734.The second conductive paste bed of material 734 is coated on the second land On 71b2.The second conductive paste bed of material 734 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any combination thereof are formed by conductive particle.The second conductive paste bed of material 734 can by screen painting processing procedure (not with This is limited) it is coated on the second land 71b2.
Then, as shown in figure 30, in the first adhesion layer 74a coating on second circuit 73 and second insulating layer 71b, and make At least a pair of pins 722 and the exposure of at least one lower switch contact 732.
Then, same as shown in figure 30, prepare separation layer 75.Separation layer 75 have the first holes 752 and at least one Second holes 754.One pair of them pin 722 in the corresponding at least a pair of pins 722 of each second holes 754.
Then, same as shown in figure 30, prepare macromolecule membrane 76.Macromolecule membrane 76 has at least one third holes 764.Each third holes 764 corresponds to second holes 754.
In a specific embodiment, macromolecule membrane 76 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
Then, same as shown in figure 30, tertiary circuit 77 is formed on the lower surface of macromolecule membrane 76 762.Third electricity Road 77 includes at least one upper switch contact 772.
In a specific embodiment, definition has tertiary circuit region 766 on the lower surface 762 of macromolecule membrane 76.Third Circuit 77 may include the third conductive paste bed of material 774.The third conductive paste bed of material 774 is coated on tertiary circuit region 766.Third The conductive paste bed of material 774 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The third conductive paste bed of material 774 can be coating by screen painting processing procedure (being not limited) In on tertiary circuit region 766.In practical application, second circuit 73 and tertiary circuit 77 can have wire jumper design.
Then, it is same as shown in figure 30, be coated the second adhesion layer 74b on the lower surface of macromolecule membrane 76 762, and make The exposure of at least one upper switch contact 772.
In a specific embodiment, the first adhesion layer 74a and the second adhesion layer 74b can be to be formed by coating glue, But it is not limited thereto.
Then, it is same as shown in figure 30, will be every by the first adhesion layer 74a and the second adhesion layer 74b (being not limited) Absciss layer 75 fits between second insulating layer 71b and the lower surface 762 of macromolecule membrane 76, and makes at least one upper switch contact 772 are placed in the first holes 752 at least one lower switch contact 732, and every a pair of pins 722 is placed in corresponding the In two holes 754.
Then, as shown in figure 31, at least one light-emitting diode component 78 is prepared.Each light-emitting diode component 78 is right Should 722, third holes 764 of one pair of them pin and second holes 754 at least in a pair of pins 722, and And each light-emitting diode component 78 includes a pair of of pin 782.
Finally, it is same as shown in figure 31, each light-emitting diode component 78 is fixed in corresponding third holes 764 Pin 722 is respectively welded together in corresponding second holes 754, and by its this this corresponding to pin 782.
Further, it is same as shown in figure 31, with transparent packing colloid 79 at least cover at least one third holes 764 with And at least one light-emitting diode component 78, that is, complete dual function circuit unit 7 as shown in figure 27.Elastic actuator 12 is set Be placed on macromolecule membrane 76 and be aligned the first holes 752, and make actuation column 124 end 1242 towards at least one on open Coila 772 and at least one lower switch contact 732.
Figure 32 is please referred to, which schematically depicts the dual function circuit unit 8 of the 7th preferred embodiment of the invention. Figure 32 is the cross section view of the dual function circuit unit 8 of the 7th preferred embodiment of the invention.Its section of section shown in Figure 32 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 8 of 7th preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, at least making The end 1242 of dynamic column 124 is conductive tips.For convenience of description, in Figure 32, be only painted dual function circuit unit 8 and The cross section view of elastic actuator 12.
As shown in figure 32, the dual function circuit unit 8 of the 7th preferred embodiment of the invention includes metal base 80, the One insulating layer 81a, the first circuit 82, second insulating layer 81b, third insulating layer 81c, second circuit 83, insulating substrate 85 and At least one light-emitting diode component 86.In the example shown in Figure 28, a light-emitting diode component 86 is only painted as generation Table.In a specific embodiment, light-emitting diode component 86 can be the light-emitting diode component 86 encapsulated, be also possible to naked The light-emitting diode component 86 of crystal form state.
In a specific embodiment, metal base 80 can be stainless sheet steel, aluminium sheet etc..Metal base 80 is conduct The bottom plate of the luminous button of prior art.
In a specific embodiment, insulating substrate 85 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 85 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.
First insulating layer 81a is formed and is covered the lower surface 802 of metal base 80.First circuit 82 is formed in the first insulation On layer 81a.First circuit 82 includes at least a pair of pins 822.
In a specific embodiment, the first insulating layer 81a can be executed by the lower surface 802 to metal base 80 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the lower surface of metal base 80 802 Outer photo-hardening forms.
Same as shown in figure 32, in a specific embodiment, definition has first line region on the first insulating layer 81a 81a2.First circuit 82 may include the first conductive paste bed of material 824 and metal layer 826.The first conductive paste bed of material 824 is coated on On the 81a2 of first line region.Metal layer 826 can be deposited on the first conductive paste bed of material 824 by chemical plating processing procedure.First The conductive paste bed of material 824 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 824 can be coating by screen painting processing procedure (being not limited) In on the 81a2 of first line region.
In a specific embodiment, the structure of metal layer 826 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Second insulating layer 81b is formed to cover the first circuit 82 and the first insulating layer 81a, and makes at least a pair of pins 822 exposures.
In a specific embodiment, second insulating layer 81b can be by first coated UV line hardening resin in the first circuit 82 and first irradiating ultraviolet light is hardened again on insulating layer 81a.
Third insulating layer 81c is formed to cover the upper surface 804 of metal base 80.Second circuit 83 is formed in third insulation On layer 81c.Second circuit 83 includes at least two make and break contacts 832.
In a specific embodiment, third insulating layer 81c can be executed by the upper surface 804 to metal base 80 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 80 804 Outer photo-hardening forms.
In a specific embodiment, definition has the second land third insulating layer 81c2 on third insulating layer 81c.Second Circuit 83 may include the second conductive paste bed of material 834.The second conductive paste bed of material 834 is coated on the second land third insulating layer On 81c2.The second conductive paste bed of material 834 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any conjunction of its group are formed by conductive particle.The second conductive paste bed of material 834 can by screen painting processing procedure (not with This is limited) it is coated on the second land 81c2.
Adhesion layer 84 is coated on second circuit 83 and third insulating layer 81c, and keeps at least two make and break contacts 832 sudden and violent Dew.
In a specific embodiment, adhesion layer 84 can be to be formed by coating glue, but is not limited thereto.
Insulating substrate 85 has holes 852.It is exhausted that insulating substrate 85 by adhesion layer 84 (being not limited) fits in third On edge layer 81c, and it is placed at least two make and break contacts 832 in the holes 852 of insulating substrate 85.Each light-emitting diode component One pair of them pin 822 in 86 corresponding at least a pair of pins 822, and each light-emitting diode component 86 includes a docking Foot 862.Pin 822 is respectively welded together in this corresponding to pin 862 of each light-emitting diode component 86.
Further, transparent packing colloid 87 at least covers at least one light-emitting diode component 86.In practical application, In practical application, each light-emitting diode component 86 is the light-emitting diode component of lateral direction light emission.Using of the invention Light guide plate can also be arranged in the luminous button 1 of the dual function circuit unit 8 of seven preferred embodiments will at least light emitting diode group The ray guidance that part 86 is emitted is pointed into keycap 14 in turn.
Elastic actuator 12 is set to the periphery of the holes 852 of insulating substrate 85, and makes 1242 court of end of actuation column 124 To at least two make and break contacts 832.When keycap 14 is moved to pressing position, the deformation of dome body 122 of elastic actuator 12 causes The conductive end 1242 of actuation column 124 contacts at least two make and break contacts 832 and at least two make and break contacts 832 is connected each other, And then triggering makes luminous button 1 of the invention be converted on state.When keycap 14 is released and is moved to non-pressing position, The dome body 122 of elastic actuator 12, which restores original configuration, connects the conductive end 1242 of actuation column 124 at least two switches 832 separation of point.With the component of number mark identical as Fig. 2 in Figure 32, there are same or similar structure and function, herein not It repeats more.
The dual function circuit unit 8 of 7th preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.
Figure 33 to Figure 36 is please referred to, the present invention is schematically painted with cross section view and manufactures as shown in figure 32 the 7th preferably in fact The method for applying the dual function circuit unit 8 of example.The definition of its hatching of section shown in Figure 33 to Figure 36 is the same as the line A-A in Fig. 1.
As shown in figure 33, in the manufacturing method of the present invention, firstly, preparing metal base 80.
In a specific embodiment, metal base 80 can be stainless sheet steel, aluminium sheet etc..Metal base 80 is conduct The bottom plate of the luminous button of prior art.
Then, same as shown in figure 33, the first insulating layer 81a is formed to cover the lower surface 802 of metal base 80.
In a specific embodiment, the first insulating layer 81a can be executed by the lower surface 802 to metal base 80 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the lower surface of metal base 80 802 Outer photo-hardening forms.
Then, it is same as shown in figure 33, in forming the first circuit 82 on the first insulating layer 81a.First circuit 82 includes extremely Few a pair of pins 822.
Same as shown in figure 33, in a specific embodiment, definition has first line region on the first insulating layer 81a 81a2.First circuit 82 may include the first conductive paste bed of material 824 and metal layer 826.The first conductive paste bed of material 824 is coated on On the 81a2 of first line region.Metal layer 826 can be deposited on the first conductive paste bed of material 824 by chemical plating processing procedure.First The conductive paste bed of material 824 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 824 can be coating by screen painting processing procedure (being not limited) In on the 81a2 of first line region.
In a specific embodiment, the structure of metal layer 826 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, same as shown in figure 33, second insulating layer 81b is formed to cover the first circuit 82 and the first insulating layer 81a, and make at least exposure of a pair of pins 822.
In a specific embodiment, second insulating layer 81b can be by first coated UV line hardening resin in the first circuit 82 and first irradiating ultraviolet light is hardened again on insulating layer 81a.
Then, as shown in figure 34, third insulating layer 81c is formed to cover the upper surface 804 of metal base 80.
In a specific embodiment, third insulating layer 81c can be executed by the upper surface 804 to metal base 80 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 80 804 Outer photo-hardening forms.
Then, same as shown in figure 34, second circuit 83 is formed on third insulating layer 81c.Second circuit 83 includes extremely Few two make and break contacts 832.
Same as shown in figure 34, in a specific embodiment, definition has the second land on third insulating layer 81c 81c2.Second circuit 83 may include the second conductive paste bed of material 834.The second conductive paste bed of material 834 is coated on the second land On 81c2.The second conductive paste bed of material 834 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any combination thereof are formed by conductive particle.The second conductive paste bed of material 834 can by screen painting processing procedure (not with This is limited) it is coated on the second land 81c2.
Then, as shown in figure 35, in adhesion layer 84 coating on second circuit 83 and third insulating layer 81c, and make at least The exposure of two make and break contacts 832.
In a specific embodiment, adhesion layer 84 can be to be formed by coating glue, but is not limited thereto.
Then, same as shown in figure 35, prepare insulating substrate 85.Insulating substrate 85 has holes 852.
In a specific embodiment, insulating substrate 85 be can be using phenolic aldehyde cotton paper as the substrate of substrate, using glass cloth as base Substrate, ceramic base material (for example, aluminium nitride, aluminium oxide, silicon carbide etc.), the macromolecule membrane at bottom etc..If insulating substrate 85 is high Molecular film, can be by polyethylene terephthalate, polyimides, polyacids methyl esters, polymethyl methacrylate or other Similar commercial high molecular material is formed by macromolecule membrane.
Then, it is same as shown in figure 35, it is exhausted that insulating substrate 85 fitted in into third by adhesion layer 84 (being not limited) On edge layer 81c, and it is placed at least two make and break contacts 832 in holes 852.
Then, as shown in figure 36, at least one light-emitting diode component 86 is prepared.Each light-emitting diode component 86 is right Should one pair of them pin 822 at least in a pair of pins 822, and each light-emitting diode component includes a pair of of pin 862。
Finally, it is same as shown in figure 36, by each light-emitting diode component 86 this it is corresponding to pin 862 should Pin 822 is respectively welded together.
Further, same as shown in figure 36, at least one light emitting diode group is covered at least with transparent packing colloid 87 Part 86 completes dual function circuit unit 8 as shown in figure 32.Elastic actuator 12 is set to the holes of insulating substrate 85 852 periphery, and make the end 1242 of actuation column 124 towards at least two make and break contacts 832.
Figure 37 is please referred to, which schematically depicts the dual function circuit unit 9 of the 8th preferred embodiment of the invention. Figure 37 is the cross section view of the dual function circuit unit 9 of the 8th preferred embodiment of the invention.Its section of section shown in Figure 37 The definition of line is the same as the line A-A in Fig. 1.The dual function circuit unit 9 of 8th preferred embodiment of the invention can replace this hair The dual function circuit unit 2 of the first bright preferred embodiment, installation to luminous button 1 as shown in Figure 1.At this point, actuation column 124 end 1242 needs not to be conductive.For convenience of description, in Figure 37, dual function circuit unit 9 and bullet are only painted The cross section view of property actuator 12.
As shown in figure 37, the dual function circuit unit 9 of the 8th preferred embodiment of the invention includes metal base 90, the One insulating layer 91a, the first circuit 92, second insulating layer 91b, third insulating layer 91c, second circuit 93, separation layer 95, macromolecule Film 96, tertiary circuit 97 and at least one light-emitting diode component 98.In the example shown in Figure 37, it is only painted a hair Optical diode component 98 is as representative.In a specific embodiment, light-emitting diode component 98 can be luminous two encapsulated Pole pipe component is also possible to the light-emitting diode component of bare crystalline kenel.
In a specific embodiment, metal base 90 can be stainless sheet steel, aluminium sheet etc..Metal base 90 is conduct The bottom plate of the luminous button of prior art.
In a specific embodiment, macromolecule membrane 96 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
First insulating layer 91a is formed and is covered the first lower surface 902 of metal base 90.First circuit 92 is formed in first On insulating layer 91a.First circuit 92 includes at least a pair of pins 922.
In a specific embodiment, the first insulating layer 91a can be executed by the first lower surface 902 to metal base 90 Electricity insulation making form, can also be by first coated UV line hardening resin on the first lower surface 902 of metal base 90 Irradiating ultraviolet light is hardened again.
Same as shown in figure 37, in a specific embodiment, definition has first line region on the first insulating layer 91a 91a2.First circuit 92 may include the first conductive paste bed of material 924 and metal layer 926.The first conductive paste bed of material 924 is coated on On the 91a2 of first line region.Metal layer 926 can be deposited on the first conductive paste bed of material 924 by chemical plating processing procedure.First The conductive paste bed of material 924 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 924 can be coating by screen painting processing procedure (being not limited) In on the 91a2 of first line region.
In a specific embodiment, the structure of metal layer 926 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Second insulating layer 91b is formed to cover the first circuit 92 and the first insulating layer 91a, and makes at least a pair of pins 922 exposures.
In a specific embodiment, second insulating layer 91b can be by first coated UV line hardening resin in the first circuit 92 and first irradiating ultraviolet light is hardened again on insulating layer 91a.
Third insulating layer 91c is formed to cover the upper surface 904 of metal base 90.Second circuit 93 is formed in third insulation On layer 91c.Second circuit 93 includes at least one lower switch contact 932.First adhesion layer 94a be coated on second circuit 93 and On third insulating layer 91c, and make the exposure of at least one lower switch contact 932.
In a specific embodiment, third insulating layer 91c can be executed by the upper surface 904 to metal base 90 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 90 904 Outer photo-hardening forms.
In a specific embodiment, definition has the second land 91c2 on third insulating layer 91c.Second circuit 93 can be with Include the second conductive paste bed of material 934.The second conductive paste bed of material 934 is coated on the second land 91c2.Second electrocondution slurry Layer 934 may include by any one and/or any combination thereof institute in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene The conductive particle of formation.The second conductive paste bed of material 934 can be coated on the second line by screen painting processing procedure (being not limited) On the 91c2 of road region.
Separation layer 95 has holes 952.It is exhausted that separation layer 95 by the first adhesion layer 94a (being not limited) fits in third On edge layer 91c, and it is placed at least one lower switch contact 932 in the holes 952 of separation layer 95.Second adhesion layer 94b is coating In not covering on separation layer 95 and the holes 952 of separation layer 95.
Tertiary circuit 97 is formed on the second lower surface 962 of macromolecule membrane 96.Tertiary circuit 97 includes at least one Upper switch contact 972.Macromolecule membrane 96 is fitted in by the second adhesion layer 94b (being not limited) with the second lower surface 962 On separation layer 95, and so that at least one upper switch contact 972 is placed in the holes 952 of separation layer 95 and be aligned or at least a lower switch Contact 932.
In a specific embodiment, the first adhesion layer 94a and the second adhesion layer 94b is formed by coating glue, but simultaneously It is not limited.
In a specific embodiment, definition has tertiary circuit region 964 on the second lower surface 962 of macromolecule membrane 96. Tertiary circuit 97 may include the third conductive paste bed of material 974.The third conductive paste bed of material 974 is coated on tertiary circuit region 964. The third conductive paste bed of material 974 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/or Any combination thereof is formed by conductive particle.The third conductive paste bed of material 974 (can be not limited) by screen painting processing procedure It is coated on tertiary circuit region 964.In practical application, second circuit 93 and tertiary circuit 97 can have wire jumper design.
One pair of them pin 922 in the corresponding at least a pair of pins 922 of each light-emitting diode component 98, and it is each A light-emitting diode component 98 includes a pair of of pin 982.This of each light-emitting diode component 98 is corresponding to pin 982 This pin 922 is respectively welded together.
Further, transparent packing colloid 99 at least covers at least one light-emitting diode component 98.In practical application, Each light-emitting diode component 98 is the light-emitting diode component of lateral direction light emission.Using the 7th preferred embodiment of the invention The luminous button 1 of dual function circuit unit 9 can also be arranged light guide plate and be emitted at least one light-emitting diode component 98 Ray guidance so that be pointed into keycap 14.
Elastic actuator 12 is set on macromolecule membrane 96 and is aligned the holes 952 of separation layer 95, and makes actuation column 124 end 1242 is towards at least one upper switch contact 972 and at least one lower switch contact 932.When keycap 14 is moved to When pressing position, the dome body 122 of elastic actuator 12, which deforms, causes the end 1242 of actuation column 124 to push so that at least One upper switch contact 972 contacts at least one lower switch contact 932 and makes to be connected each other, and then triggering makes of the invention shine Key 1 is converted on state.When keycap 14 is released and is moved to non-pressing position, the dome body of elastic actuator 12 122 recovery original configurations separate the end 1242 of actuation column 124 with a few upper switch contact 972, so that script phase At least one the upper switch contact 972 mutually contacted is separated at least one lower switch contact 932.Have in Figure 37 identical as Fig. 2 The component of number mark has same or similar structure and function, does not repeat herein.
The dual function circuit unit 9 of 8th preferred embodiment of the invention has the function of thin film switch and light source circuit board Function, thickness can drop to 270 μm~350 μm.
Figure 38 to Figure 41 is please referred to, the present invention is schematically painted with cross section view and manufactures as shown in figure 37 the 8th preferably in fact The method for applying the dual function circuit unit 9 of example.The definition of its hatching of section shown in Figure 38 to Figure 41 is the same as the line A-A in Fig. 1.
As shown in figure 38, in the manufacturing method of the present invention, firstly, preparing metal base 90.
In a specific embodiment, metal base 90 can be stainless sheet steel, aluminium sheet etc..Metal base 90 is conduct The bottom plate of the luminous button of prior art.
Then, same as shown in figure 38, the first insulating layer 91a is formed to cover the first lower surface 902 of metal base 90.
In a specific embodiment, the first insulating layer 91a can be executed by the first lower surface 902 to metal base 90 Electricity insulation making form, can also be by first coated UV line hardening resin on the first lower surface 902 of metal base 90 Irradiating ultraviolet light is hardened again.
Then, it is same as shown in figure 38, in forming the first circuit 92 on the first insulating layer 91a.First circuit 92 includes extremely Few a pair of pins 922.
Same as shown in figure 38, in a specific embodiment, definition has first line region on the first insulating layer 91a 91a2.First circuit 92 may include the first conductive paste bed of material 924 and metal layer 926.The first conductive paste bed of material 924 is coated on On the 91a2 of first line region.Metal layer 926 can be deposited on the first conductive paste bed of material 924 by chemical plating processing procedure.First The conductive paste bed of material 924 may include by any one and/or its in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Meaning combination is formed by conductive particle.The first conductive paste bed of material 924 can be coating by screen painting processing procedure (being not limited) In on the 91a2 of first line region.
In a specific embodiment, the structure of metal layer 926 can be Cu layers of single layer, Ag/Au layers/multilayer of multilayer Ag/Au/ Cu layers of Sn/Ni layers/single layer, Cu layers of Sn layers/single layer of single layer, Cu layers of Ag layers/single layer of single layer, Cu layers of Au layers/single layer of single layer, single layer Ag Cu layers of Ni layers/single layer of layer/single layer, Cu layers of Ni layers/single layer of Au layers/single layer of single layer, Ag layers of Au layers/single layer of Sn layers/single layer of single layer/mono- Cu layers of Ni layers/single layer of layer etc..
Then, same as shown in figure 38, second insulating layer 91b is formed to cover the first circuit 92 and the first insulating layer 91a, and make at least exposure of a pair of pins 922.
In a specific embodiment, second insulating layer 91b can be by first coated UV line hardening resin in the first circuit 92 and first irradiating ultraviolet light is hardened again on insulating layer 91a.
Then, as shown in figure 39, third insulating layer 91c is formed to cover the upper surface 904 of metal base 90.
In a specific embodiment, third insulating layer 91c can be executed by the upper surface 904 to metal base 90 electricity Insulation making forms, can also be by first coated UV line hardening resin in irradiating purple again on the upper surface of metal base 90 904 Outer photo-hardening forms.
Then, same as shown in figure 39, second circuit 93 is formed on third insulating layer 91c.Second circuit 93 includes extremely A few lower switch contact 932.
Same as shown in figure 39, in a specific embodiment, definition has the second land on third insulating layer 91c 91c2.Second circuit 93 may include the second conductive paste bed of material 934.The second conductive paste bed of material 934 is coated on the second land On 91c2.The second conductive paste bed of material 934 may include by any one in silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene Kind and/or any combination thereof are formed by conductive particle.The second conductive paste bed of material 934 can by screen painting processing procedure (not with This is limited) it is coated on the second land 91c2.
Then, as shown in figure 40, in the first adhesion layer 94a coating on second circuit 93 and third insulating layer 91c, and make The exposure of at least one lower switch contact 932.
Then, same as shown in figure 40, prepare separation layer 95.Separation layer 95 has holes 952.
Then, same as shown in figure 40, prepare macromolecule membrane 96.
In a specific embodiment, macromolecule membrane 96 be can be by polyethylene terephthalate, polyimides, polyacids Methyl esters, polymethyl methacrylate or other similar commercial high molecular material are formed by macromolecule membrane.
Then, same as shown in figure 40, tertiary circuit 97 is formed on the second lower surface 962 of macromolecule membrane 96.The Three-circuit 97 includes at least one upper switch contact 972.
In a specific embodiment, definition has tertiary circuit region 964 on the second lower surface 962 of macromolecule membrane 96. Tertiary circuit 97 may include the third conductive paste bed of material 974.The third conductive paste bed of material 974 is coated on tertiary circuit region 964. The third conductive paste bed of material 974 may include by silver, copper, gold, aluminium, graphite, carbon nanotubes, graphene any one and/or Any combination thereof is formed by conductive particle.The third conductive paste bed of material 974 (can be not limited) by screen painting processing procedure It is coated on tertiary circuit region 964.In practical application, second circuit 93 and tertiary circuit 97 can have wire jumper design.
It is then, same to be coated the second adhesion layer 94b on the second lower surface 962 of macromolecule membrane 96 as shown in figure 40, And make the exposure of at least one upper switch contact 972.
In a specific embodiment, the first adhesion layer 94a and the second adhesion layer 94b can be to be formed by coating glue, But it is not limited thereto.
Then, it is same as shown in figure 40, will be every by the first adhesion layer 94a and the second adhesion layer 94b (being not limited) Absciss layer 95 fits between third insulating layer 91c and the second lower surface 962 of macromolecule membrane 96, and makes at least one upper switch Contact 972 and at least one lower switch contact 932 are placed in holes 952.
Then, as shown in figure 41, at least one light-emitting diode component 98 is prepared.Each light-emitting diode component 98 is right The one pair of them pin 922 at least a pair of pins 922 is answered, and each light-emitting diode component 98 includes a pair of of pin 982。
Finally, it is same as shown in figure 41, by each light-emitting diode component 98 this it is corresponding to pin 982 should Pin 922 is respectively welded together.
Further, same as shown in figure 41, at least one light emitting diode group is covered at least with transparent packing colloid 99 Part 98 completes dual function circuit unit 9 as shown in figure 37.Elastic actuator 12 be set on macromolecule membrane 96 and It is aligned holes 952, and opens the end 1242 of the actuation column 124 under at least one towards at least one upper switch contact 972 Coila 932.
It is thin by detailed description of the invention, being apparent that dual function circuit unit according to the present invention has above Membrane switch function and light source circuit board function.Hair comprising multiple luminous buttons using dual function circuit unit of the invention The integral thickness of the slimming illuminated keyboard of light keyboard, integral thickness and prior art is compared, and can be gone and is thinned again, or even can To exempt light guide plate or bottom plate.Using dual function circuit unit of the invention, the assembly program of illuminated keyboard be can simplify.
By the above detailed description of preferred embodiments, it is intended to more clearly describe feature and spirit of the invention, And not protection scope of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its purpose It is intended to cover various changes and has being arranged in the scope of protection of the claims of the invention to be applied of equality.Cause This, scope of protection of the claims of the invention should illustrate the most wide explanation of work according to above-mentioned, to cause it to cover institute Possible change and the arrangement of tool equality.

Claims (16)

1. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, and at least the end of the actuation column is conductive tips, it is characterised in that the dual function circuit unit includes:
First insulating substrate；
First circuit is formed on the upper surface of first insulating substrate, which includes at least a pair of pins, wherein should Definition has first line region on the upper surface of first insulating substrate, which includes the first conductive paste bed of material and gold Belong to layer, which is coated on the first line region, the metal layer by chemical plating processing procedure be deposited on this On the one conductive paste bed of material；
Insulating layer forms and covers first circuit and the upper surface of first insulating substrate, and makes this at least a pair is drawn Foot exposure；
Second circuit is formed on the insulating layer, which includes at least two make and break contacts；
Second insulating substrate, have the first holes and at least one second holes, each second holes correspond to this at least one To the one pair of them pin in pin, which is fitted on the insulating layer, and makes this at least two make and break contacts are set In in first holes, and every a pair of pins is placed in the second corresponding holes；And
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And second holes and each light-emitting diode component include a pair of of pin, each light-emitting diode component is fixed In corresponding second holes and this corresponding to pin of each light-emitting diode component is to pin point Do not weld together；Wherein the elastic actuator is set to the periphery of first holes, and makes the end direction of the actuation column At least two make and break contacts.
2. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, it is characterised in that the dual function circuit unit includes:
Insulating substrate；
First circuit, is formed on the upper surface of the insulating substrate, which includes at least a pair of pins, the wherein insulation Definition has first line region on the upper surface of substrate, which includes the first conductive paste bed of material and metal layer, is somebody's turn to do The first conductive paste bed of material is coated on the first line region, which is deposited on first conductive paste by chemical plating processing procedure On the bed of material；
Insulating layer forms and covers first circuit and the upper surface of the insulating substrate, and makes this at least a pair of pins is sudden and violent Dew；
Second circuit is formed on the insulating layer, which includes at least one lower switch contact；
Separation layer, has the first holes and at least one second holes, each second holes corresponds at least a pair of pins In a pair of pins, which fits on the insulating layer, and at least one lower switch contact is made to be placed in first holes It is interior, and every a pair of pins is placed in the second corresponding holes；
Macromolecule membrane has at least one third holes, corresponding second holes of each third holes；
Tertiary circuit is formed on the lower surface of the macromolecule membrane, which includes at least one upper switch contact, In the macromolecule membrane fitted on the separation layer with the lower surface, and it is first broken so that at least one upper switch contact is placed in this In hole and it is aligned at least one lower switch contact, each third holes is aligned the second corresponding holes；And
At least one light-emitting diode component, each light-emitting diode component correspond to a pair at least in a pair of pins and draw Foot, a third holes and second holes and each light-emitting diode component include a pair of of pin, each hair Optical diode component be fixed on corresponding third holes in the second holes and its this this corresponding to pin is to drawing Foot is respectively welded together；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned first holes, and makes the work The end of dynamic column is towards at least one upper switch contact and at least one lower switch contact.
3. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, and at least the end of the actuation column is conductive tips, it is characterised in that the dual function circuit unit includes:
First insulating substrate；
First circuit is formed on the lower surface of first insulating substrate, which includes at least a pair of pins, wherein should Definition has first line region on the lower surface of first insulating substrate, which includes the first conductive paste bed of material and gold Belong to layer, which is coated on the first line region, the metal layer by chemical plating processing procedure be deposited on this On the one conductive paste bed of material；
Insulating layer forms and covers first circuit and the lower surface of first insulating substrate, and makes this at least a pair is drawn Foot exposure；
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And each light-emitting diode component includes a pair of of pin, this of each light-emitting diode component is corresponding to pin Pin is respectively welded together in this；
Second circuit is formed on the upper surface of first insulating substrate, which includes at least two make and break contacts；And
Second insulating substrate has holes, which fits on the upper surface of first insulating substrate, and makes At least two make and break contacts are placed in the holes for this；
Wherein the elastic actuator is set to the periphery of the holes, and connects the end of the actuation column towards at least two switch Point.
4. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, it is characterised in that the dual function circuit unit includes:
Insulating substrate；
First circuit is formed on the first lower surface of the insulating substrate, which includes at least a pair of pins, wherein should Definition has first line region on first lower surface of insulating substrate, which includes the first conductive paste bed of material and gold Belong to layer, which is coated on the first line region, the metal layer by chemical plating processing procedure be deposited on this On the one conductive paste bed of material；
Insulating layer forms and covers first circuit and first lower surface of the insulating substrate, and makes this at least a pair is drawn Foot exposure；
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And each light-emitting diode component includes a pair of of pin, this of each light-emitting diode component is corresponding to pin Pin is respectively welded together in this；
Second circuit is formed on the upper surface of the insulating substrate, which includes at least one lower switch contact；
Separation layer has holes, which fits on the upper surface of the insulating substrate, and makes at least one lower switch Contact is placed in the holes；
Macromolecule membrane；And
Tertiary circuit is formed on the second lower surface of the macromolecule membrane, which includes that at least one upper switch connects Point, wherein the macromolecule membrane is fitted on the separation layer with second lower surface, and sets at least one upper switch contact In in the holes and being aligned at least one lower switch contact；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned the holes, and makes the actuation column End towards at least one upper switch contact and at least one lower switch contact.
5. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, and at least the end of the actuation column is conductive tips, it is characterised in that the dual function circuit unit includes:
Metal base；
First insulating layer forms and covers the upper surface of the metal base；
First circuit is formed on first insulating layer, which includes at least a pair of pins, wherein first insulating layer Upper definition has first line region, which includes the first conductive paste bed of material and metal layer, the first conductive paste bed of material It is coated on the first line region, which is deposited on the first conductive paste bed of material by chemical plating processing procedure；
Second insulating layer forms and covers first circuit and first insulating layer, and makes at least a pair of pins exposure；
Second circuit is formed in the second insulating layer, which includes at least two make and break contacts；
Insulating substrate has the first holes and at least one second holes, each second holes corresponds to this, and at least a pair is drawn A pair of pins in foot, the insulating substrate fit in the second insulating layer, and make at least two make and break contacts be placed in this first In holes, and every a pair of pins is placed in the second corresponding holes；And
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And second holes and each light-emitting diode component include a pair of of pin, each light-emitting diode component is fixed In the second corresponding holes and pin is respectively welded together in its this this corresponding to pin；
Wherein the elastic actuator is set to the periphery of first holes, and make the end of the actuation column towards this at least two open Coila.
6. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, it is characterised in that the dual function circuit unit includes:
Metal base；
First insulating layer forms and covers the upper surface of the metal base；
First circuit is formed on first insulating layer, which includes at least a pair of pins, wherein first insulating layer Upper definition has first line region, which includes the first conductive paste bed of material and metal layer, the first conductive paste bed of material It is coated on the first line region, which is deposited on the first conductive paste bed of material by chemical plating processing procedure；
Second insulating layer forms and covers first circuit and first insulating layer, and makes at least a pair of pins exposure；
Second circuit is formed in the second insulating layer, which includes at least one lower switch contact；
Separation layer, has the first holes and at least one second holes, each second holes corresponds at least a pair of pins In a pair of pins, which fits in the second insulating layer, and make at least one lower switch contact be placed in this first In holes, and every a pair of pins is placed in the second corresponding holes；
Macromolecule membrane has at least one third holes, corresponding second holes of each third holes；
Tertiary circuit is formed on the lower surface of the macromolecule membrane, which includes at least one upper switch contact, In the macromolecule membrane fitted on the separation layer with the lower surface, and it is first broken so that at least one upper switch contact is placed in this In hole and it is aligned at least one lower switch contact, each third holes is aligned the second corresponding holes；And
At least one light-emitting diode component, each light-emitting diode component correspond to a pair at least in a pair of pins and draw Foot, a third holes and second holes and each light-emitting diode component include a pair of of pin, each hair Optical diode component be fixed on corresponding third holes in the second holes and its this this corresponding to pin is to drawing Foot is respectively welded together；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned first holes, and makes the work The end of dynamic column is towards at least one upper switch contact and at least one lower switch contact.
7. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, and at least the end of the actuation column is conductive tips, it is characterised in that the dual function circuit unit includes:
Metal base；
First insulating layer forms and covers the lower surface of the metal base；
First circuit is formed on first insulating layer, which includes at least a pair of pins, wherein first insulating layer Upper definition has first line region, which includes the first conductive paste bed of material and metal layer, the first conductive paste bed of material It is coated on the first line region, which is deposited on the first conductive paste bed of material by chemical plating processing procedure；
Second insulating layer forms and covers first circuit and first insulating layer, and makes at least a pair of pins exposure；
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And each light-emitting diode component includes a pair of of pin, this of each light-emitting diode component is corresponding to pin Pin is respectively welded together in this；
Third insulating layer forms and covers the upper surface of the metal base；
Second circuit is formed on the third insulating layer, which includes at least two make and break contacts；And
Insulating substrate has holes, which fits on the third insulating layer, and makes this at least two make and break contacts are placed in In the holes；
Wherein the elastic actuator is set to the periphery of the holes, and connects the end of the actuation column towards at least two switch Point.
8. a kind of dual function circuit unit for luminous button, which includes elastic actuator, the resilient actuating Device includes actuation column, it is characterised in that the dual function circuit unit includes:
Metal base；
First insulating layer forms and covers the first lower surface of the metal base；
First circuit is formed on first insulating layer, which includes at least a pair of pins, wherein first insulating layer Upper definition has first line region, which includes the first conductive paste bed of material and metal layer, the first conductive paste bed of material It is coated on the first line region, which is deposited on the first conductive paste bed of material by chemical plating processing procedure；
Second insulating layer forms and covers first circuit and first insulating layer, and makes at least a pair of pins exposure；
At least one light-emitting diode component, each light-emitting diode component correspond to a pair of pins at least in a pair of pins And each light-emitting diode component includes a pair of of pin, this of each light-emitting diode component is corresponding to pin Pin is respectively welded together in this；
Third insulating layer forms and covers the upper surface of the metal base；
Second circuit is formed on the third insulating layer, which includes at least one lower switch contact；
Separation layer has holes, which fits on the third insulating layer, and is placed at least one lower switch contact In the holes；
Macromolecule membrane；And
Tertiary circuit is formed on the second lower surface of the macromolecule membrane, which includes that at least one upper switch connects Point, wherein the macromolecule membrane is fitted on the separation layer with second lower surface, and sets at least one upper switch contact In in the holes and being aligned at least one lower switch contact；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned the holes, and makes the actuation column End towards at least one upper switch contact and at least one lower switch contact.
9. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, and at least the end of the actuation column is conductive tips, feature It is that this method comprises the steps of
The first insulating substrate is prepared, wherein definition has first line region on the upper surface of first insulating substrate；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to the upper surface of first insulating substrate, and then in deposited metal on the first conductive paste bed of material Layer, wherein the first conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms insulating layer and covers first circuit and the upper surface of first insulating substrate, and make at least a pair of pins Exposure；
In forming second circuit on the insulating layer, wherein the second circuit includes at least two make and break contacts；
The second insulating substrate is prepared, wherein second insulating substrate has the first holes and at least one second holes, each A second holes corresponds to a pair of pins at least in a pair of pins；
Second insulating substrate is bonded on the insulating layer, and is placed at least two make and break contacts in first holes, and is every A pair of pins is placed in its corresponding second holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and second holes and each light-emitting diode component include a pair of of pin；And
Each light-emitting diode component is fixed in the second corresponding holes and by its this it is corresponding to pin should Pin is respectively welded together；
Wherein the elastic actuator is set to the periphery of first holes, and make the end of the actuation column towards this at least two open Coila.
10. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, it is characterised in that this method comprises the steps of
Insulating substrate is prepared, wherein definition has first line region on the upper surface of the insulating substrate；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure executed to the upper surface of the insulating substrate, and then in deposited metal layer on the first conductive paste bed of material, Wherein the first conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms insulating layer and simultaneously covers first circuit and the upper surface of the insulating substrate, and make this at least a pair of pins is sudden and violent Dew；
In forming second circuit on the insulating layer, wherein the second circuit includes at least one lower switch contact；
Separation layer is prepared, wherein the separation layer has the first holes and at least one second holes, each second holes pair It should a pair of pins at least in a pair of pins；
Macromolecule membrane is prepared, wherein the macromolecule membrane has at least one third holes, each third holes corresponding one A second holes；
In forming a tertiary circuit on the lower surface of the macromolecule membrane, wherein the tertiary circuit includes that at least one upper switch connects Point；
The separation layer is bonded between the insulating layer and the lower surface of the macromolecule membrane, and connects at least one upper switch Point is placed in first holes at least one lower switch contact, and every a pair of pins is placed in its corresponding second holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins, a third holes and second holes and each light-emitting diode component include a pair of of pin；With And
Each light-emitting diode component is fixed in corresponding third holes and the second holes and by its this to pin with Pin is respectively welded together in its corresponding this；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned first holes, and makes the work The end of dynamic column is towards at least one upper switch contact and at least one lower switch contact.
11. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, and at least the end of the actuation column is conductive tips, feature It is that this method comprises the steps of
The first insulating substrate is prepared, wherein definition has first line region on the lower surface of first insulating substrate；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first insulating substrate, and then in deposited metal layer on the first conductive paste bed of material, wherein should The first conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms insulating layer and covers first circuit and the lower surface of first insulating substrate, and make at least a pair of pins Exposure；
In forming second circuit on the upper surface of first insulating substrate, wherein the second circuit includes at least two make and break contacts；
The second insulating substrate is prepared, wherein second insulating substrate has holes；
Second insulating substrate is bonded on the upper surface of first insulating substrate, and makes this at least two make and break contacts is placed in this In holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and each light-emitting diode component include a pair of of pin；And
Pin is respectively welded together in this corresponding to pin of each light-emitting diode component；
Wherein the elastic actuator is set to the periphery of the holes, and connects the end of the actuation column towards at least two switch Point.
12. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, it is characterised in that this method comprises the steps of
Insulating substrate is prepared, wherein defines first line region on the first lower surface of the insulating substrate；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first lower surface of the insulating substrate, and then in deposited metal on the first conductive paste bed of material Layer, wherein the first conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms insulating layer and covers first circuit and first lower surface of the insulating substrate, and make at least a pair of pins Exposure；
In forming second circuit on the upper surface of the insulating substrate, wherein the second circuit includes at least one lower switch contact；
Separation layer is prepared, wherein the separation layer has holes；
Prepare macromolecule membrane；
In forming tertiary circuit on the second lower surface of the macromolecule membrane, wherein the tertiary circuit includes at least one upper switch Contact；
The separation layer is bonded between the upper surface of the insulating substrate and second lower surface of the macromolecule membrane, and makes this At least one upper switch contact and at least one lower switch contact are placed in the holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and each light-emitting diode component include a pair of of pin；And
Pin is respectively welded together in this corresponding to pin of each light-emitting diode component；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned the holes, causes the actuation column End towards at least one upper switch contact and at least one lower switch contact.
13. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, and at least the end of the actuation column is conductive tips, feature It is that this method comprises the steps of
Prepare metal base；
It forms the first insulating layer and covers the upper surface of the metal base, wherein definition has first line area on first insulating layer Domain；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first insulating layer, and then in deposited metal layer on the first conductive paste bed of material, wherein this The one conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms second insulating layer and covers first circuit and first insulating layer, and make at least a pair of pins exposure；
In forming second circuit in the second insulating layer, wherein the second circuit includes at least two make and break contacts；
Insulating substrate is prepared, wherein the insulating substrate has the first holes and at least one second holes, each is second broken Hole corresponds to a pair of pins at least in a pair of pins；
The insulating substrate is bonded in the second insulating layer, and is placed at least two make and break contacts in first holes, and is every A pair of pins is placed in its corresponding second holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and second holes and each light-emitting diode component include a pair of of pin；And
Each light-emitting diode component is fixed in the second corresponding holes and by its this it is corresponding to pin should Pin is respectively welded together；
Wherein the elastic actuator is set to the periphery of first holes, and make the end of the actuation column towards this at least two open Coila.
14. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, it is characterised in that this method comprises the steps of
Prepare metal base；
It forms the first insulating layer and covers the upper surface of the metal base, wherein definition has first line area on first insulating layer Domain；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first insulating layer, and then in deposited metal layer on the first conductive paste bed of material, wherein this The one conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms second insulating layer and covers first circuit and first insulating layer, and make at least a pair of pins exposure；
In forming second circuit in the second insulating layer, wherein the second circuit includes at least one lower switch contact；
Separation layer is prepared, wherein the separation layer has the first holes and at least one second holes, each second holes pair It should a pair of pins at least in a pair of pins；
Macromolecule membrane is prepared, wherein the macromolecule membrane has at least one third holes, each third holes corresponding one A second holes；
Tertiary circuit is formed on the lower surface of the macromolecule membrane, wherein the tertiary circuit includes that at least one upper switch connects Point；
The separation layer is bonded between the second insulating layer and the lower surface of the macromolecule membrane, and make this at least one on open Coila and at least one lower switch contact are placed in first holes, and every a pair of pins is placed in corresponding second and breaks In hole；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins, a third holes and second holes and each light-emitting diode component include a pair of of pin；With And
Each light-emitting diode component is fixed in corresponding third holes and the second holes and by its this to pin with Pin is respectively welded together in its corresponding this；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned first holes, and makes the work The end of dynamic column is towards at least one upper switch contact and at least one lower switch contact.
15. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, and at least the end of the actuation column is conductive tips, feature It is that this method comprises the steps of
Prepare metal base；
It forms the first insulating layer and covers the lower surface of the metal base, wherein definition has first line area on first insulating layer Domain；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first insulating layer, and then in deposited metal layer on the first conductive paste bed of material, wherein this The one conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms second insulating layer and covers first circuit and first insulating layer, and make at least a pair of pins exposure；
Third insulating layer is formed to cover the upper surface of the metal base；
Second circuit is formed on the third insulating layer, wherein the second circuit includes at least two make and break contacts；
Insulating substrate is prepared, wherein the insulating substrate has holes；
The insulating substrate is bonded on the third insulating layer, and makes this at least two make and break contacts is placed in the holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and each light-emitting diode component include a pair of of pin；And
Pin is respectively welded together in this corresponding to pin of each light-emitting diode component；
Wherein the elastic actuator is set to the periphery of the holes, and connects the end of the actuation column towards at least two switch Point.
16. a kind of method for manufacturing dual function circuit unit, the dual function circuit unit are used for luminous button, this shines Key includes elastic actuator, which includes actuation column, it is characterised in that this method comprises the steps of
Prepare metal base；
It forms the first insulating layer and covers the first lower surface of the metal base, wherein definition has First Line on first insulating layer Road region；
In the first conductive paste bed of material coating on the first line region；
Chemical plating processing procedure is executed to first insulating layer, and then in deposited metal layer on the first conductive paste bed of material, wherein this The one conductive paste bed of material and the metal layer constitute the first circuit, which includes at least a pair of pins；
It forms second insulating layer and covers first circuit and first insulating layer, and make at least a pair of pins exposure；
Third insulating layer is formed to cover the upper surface of the metal base；
Second circuit is formed on the third insulating layer, wherein the second circuit includes at least one lower switch contact；
Separation layer is prepared, wherein the separation layer has holes；
Prepare macromolecule membrane；
Tertiary circuit is formed on the second lower surface of the macromolecule membrane, wherein the tertiary circuit includes at least one upper switch Contact；
The separation layer is bonded between the third insulating layer and second lower surface of the macromolecule membrane, and makes this at least one Upper switch contact and at least one lower switch contact are placed in the holes；
At least one light-emitting diode component is prepared, wherein each light-emitting diode component corresponds to this at least in a pair of pins A pair of pins and each light-emitting diode component include a pair of of pin；And
Pin is respectively welded together in this corresponding to pin of each light-emitting diode component；
Wherein the elastic actuator is set on the macromolecule membrane and the elastic actuator is aligned the holes, and makes the actuation column End towards at least one upper switch contact and at least one lower switch contact.
CN201811137833.7A 2018-05-23 2018-09-28 Dual function circuit assembly for light emitting key and method of manufacturing the same Active CN109346360B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1516533A (en) * 2002-12-26 2004-07-28 Lg.������Lcd��ʽ���� Double-plate type organic electroluminescent device and its mfg. method
US20110050464A1 (en) * 2009-09-01 2011-03-03 Chung-Lin Tsai Key Structure Having Improved Light Emitting Efficiency
CN205004228U (en) * 2015-07-16 2016-01-27 群光电能科技股份有限公司 Thin type backlight module's structure
CN105304389A (en) * 2015-09-11 2016-02-03 苏州达方电子有限公司 Keyboard
CN106783308A (en) * 2016-12-29 2017-05-31 苏州达方电子有限公司 Luminous button and the illuminated keyboard comprising luminous button
CN107731606A (en) * 2017-11-09 2018-02-23 苏州达方电子有限公司 Illuminated keyboard

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1516533A (en) * 2002-12-26 2004-07-28 Lg.������Lcd��ʽ���� Double-plate type organic electroluminescent device and its mfg. method
US20110050464A1 (en) * 2009-09-01 2011-03-03 Chung-Lin Tsai Key Structure Having Improved Light Emitting Efficiency
CN205004228U (en) * 2015-07-16 2016-01-27 群光电能科技股份有限公司 Thin type backlight module's structure
CN105304389A (en) * 2015-09-11 2016-02-03 苏州达方电子有限公司 Keyboard
CN106783308A (en) * 2016-12-29 2017-05-31 苏州达方电子有限公司 Luminous button and the illuminated keyboard comprising luminous button
CN107731606A (en) * 2017-11-09 2018-02-23 苏州达方电子有限公司 Illuminated keyboard

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