CN109346353A - A kind of preparation method of the high conductivity gradient-structure Cu-Cr alloy contact of high rigidity - Google Patents
A kind of preparation method of the high conductivity gradient-structure Cu-Cr alloy contact of high rigidity Download PDFInfo
- Publication number
- CN109346353A CN109346353A CN201811267429.1A CN201811267429A CN109346353A CN 109346353 A CN109346353 A CN 109346353A CN 201811267429 A CN201811267429 A CN 201811267429A CN 109346353 A CN109346353 A CN 109346353A
- Authority
- CN
- China
- Prior art keywords
- laser
- contact
- scanning
- static side
- moved end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
Abstract
The present invention provides a kind of preparation method of high conductivity gradient-structure Cu-Cr alloy contact of high rigidity, includes the following steps: to select two piece Cu-Cr alloy base materials of the Cr content in 20~60wt.% respectively as static side and moved end；By the adjustment of the laser parameter of laser in-situ equipment to equal than or when greater than conventional laser scanning parameter 1/3, so that laser is generated continuous laser and laser scanning carried out to static side superficial layer；By laser parameter adjustment to equal than or when lower than conventional laser scanning parameter 1/3, so that laser is generated continuous laser and laser scanning carried out to end surfaces layer, remove moved end after the completion of scanning；Static side and moved end with the different contact building form of two pieces of cladding layer thickness as same vacuum interrupter, and the cladding layer thickness of static side is greater than the cladding layer thickness of moved end.The present invention makes the contact resistance of contact material, impact resistance voltage value and capacitive load connecting-disconnecting function generate variation, and the profession that can satisfy dynamic and static contact design requires, and promotes comprehensive connecting-disconnecting function.
Description
Technical field
The invention belongs to material science and field of surface engineering technique, in particular to a kind of high conductivity gradient knot of high rigidity
The preparation method of structure Cu-Cr alloy contact.
Background technique
Cu-Cr alloy contact is widely used in mesohigh vacuum interrupter, and the exploitation of vacuum interrupter is a system work
Journey, if it is possible to combine the research and development of contact material with the improvement of the structure of vacuum switch tube, design and switching mechanism etc., just
It is possible that realizing the significant increase of vacuum interrupter performance.It is particular enable to solve when voltage is higher than 12kV, vacuum interrupter is opened
Disconnected short circuit current and passing cuts back-to-back capacitor group and because of overvoltage and can shove and cause to contact welding problems.
Currently, the mode of refinement Cu-Cr alloy surface microscopic structure mainly includes that electric ageing, plated film and electron beam surface change
The methods of property.
The history of the existing many decades of the development of electric ageing technology, process is more mature, but ageing low efficiency is uneven, always
Refining area is only 30%, 40 μm of ageing depth <.In addition, its energy injected on monolithic contact is larger, it is all larger than 10kJ, therefore
It will appear the phenomenon that reducing vacuum interrupter dielectric level during ageing, and ageing effect is unable to control, it can only be in pole
Enhance performance in limited range.
Vacuum chamber is evacuated to 1.5x10 by vacuum arc plating embrane method-2Pa is hereinafter, selected arc ion plating target, electric arc steam
Then the target particle deposition of sending is made annealing treatment in Cu-Cr alloy surface, annealing temperature is 400 DEG C, and soaking time is
1.5h.Coating layer thickness is less than 10 μm, and this method complex process and the requirement height to equipment, time-consuming for manufacturing process, and (monolithic is time-consuming
> 1.5h), and the promotion effect of surge voltage is unknowable, and the coating of formation is easy to fall off and has pollution to environment.
Pulsed electron beam machine carries out surface alloying and surface remelting to Cu-Cr alloy, by irradiating different numbers
It is obviously improved modified layer hardness.But modified layer superficial layer cannot cover entirely, be also easy to produce crackle, and electron beam machine price is high
Expensive (> 1,000 ten thousand), while needing to carry out operation in high vacuum environment, the needs of large-scale production line can not be adapted to.
In conclusion common method at least has that modified layer thickness small (50 μm of equal <), controllability be low, coverage rate at present
Low, the defects of energy consumption is high, it is difficult to meet industrial application demand, can not meet the needs of arc-chutes designer.
Summary of the invention
The object of the present invention is to provide a kind of preparation methods of the high conductivity gradient-structure Cu-Cr alloy contact of high rigidity.
Particularly, the present invention provides a kind of preparation method of high conductivity gradient-structure Cu-Cr alloy contact of high rigidity, packet
Include following steps:
Step 100, the contact that selection Cr content is respectively prepared in two pieces of Cu-Cr alloy base materials of 20~60wt.%, to it
It is polished and is cleaned in surface；
Step 200, using one of contact as static side, static side is first placed on inertia as moved end by another piece of contact
On workbench in gas shield storehouse, and it is fixed in its workspace by the temperature control fixture of laser in-situ equipment；
Step 300, by the adjustment of the laser parameter of laser in-situ equipment to equal than or parameter when scanning greater than conventional laser
1/3, so that laser is generated continuous laser and laser scanning is carried out to static side superficial layer；
Step 400, by controlling the static side after the completion of removing scanning on warm fixture and replacing with moved end, laser parameter is adjusted
To equal than or lower than conventional laser scanning when parameter 1/3, then make laser generate continuous laser to end surfaces layer carry out
Moved end is removed in laser scanning after the completion of scanning；
Step 500, abovementioned steps are repeated and produces all contacts, and contact the form side different with two pieces of cladding layer thickness
Static side and moved end of the formula as same vacuum interrupter, and the cladding layer thickness of static side is greater than the cladding layer thickness of moved end.
In an embodiment of the invention, the oxygen in the step 200 in inert gas shielding storehouse and nitrogen content are small
In 50ppm.
In an embodiment of the invention, the surface roughness of Cu-Cr alloy base material is 1~2 μm after the polishing.
In an embodiment of the invention, the laser parameter by laser in-situ equipment adjusts to equal than or is greater than
Conventional laser scan when parameter 1/3 when are as follows: laser power density: 6.4 × 104MW/m2~1.2 × 105MW/m2, laser scanning
Speed: 6~10m/min, overlapping rate: 20%~60%, wavelength: 1~3 μm.
In an embodiment of the invention, it is described by laser parameter adjustment to equal than or lower than conventional laser scanning when
The 1/3 of parameter are as follows: laser power density: 5.5 × 104MW/m2~7.6 × 104MW/m2, laser scanning speed: 8~12m/min,
Overlapping rate: 20%~60%, wavelength: 1~3 μm.
In an embodiment of the invention, in laser scanning, pass through the water cooling and laser scanning condition to contact
Cooperation so that the cooling velocity in molten bath is reached 105~106K/s。
In an embodiment of the invention, during laser scanning, laser beam uses progressive scanning mode, makes
Molten bath generates temperature gradient from scanning direction to non-scanning direction, is formed in molten bath using surface tension caused by temperature gradient
Convection current is to strengthen the disperse of Cr particle.
In an embodiment of the invention, temperature > Cr fusing point when laser scanning in molten bath and the fusing of Cr particle
At spherical shape.
In an embodiment of the invention, the alloy rigidity of the superficial layer of the static side after laser scanning and moved end
≥290HV0.25。
In an embodiment of the invention, the cladding layer of static side is with a thickness of 1~3 times of moved end cladding layer thickness.
The present invention keeps the energy on monolithic contact low (< 0.5J) by the adjustment to Laser Scanning Parameters, modified layer thickness
Controllably, crystallite dimension is controllable.The variation of microscopic structure results in the difference of contact performance again, make contact material contact resistance,
Impact resistance voltage value and capacitive load connecting-disconnecting function generate variation, and the profession that can satisfy dynamic and static contact design requires, and are promoted comprehensive
It runs cutting capacity jointly, improves safety and the service life of arc-chutes, reach the optimal using effect of vacuum interrupter.
Detailed description of the invention
Fig. 1 is the preparation method flow diagram of one embodiment of the present invention；
Fig. 2 is the static side arranged in pairs or groups in one embodiment of the present invention and the diagrammatic cross-section of moved end.
Specific embodiment
As shown in Figure 1, one embodiment of the present invention provides a kind of high conductivity gradient-structure Cu-Cr alloy touching of high rigidity
The preparation method of head, generally comprises the steps:
Step 100, the contact that selection Cr content is respectively prepared in two pieces of Cu-Cr alloy base materials of 20~60wt.%, to it
It is polished and is cleaned in surface；
Polishing is that Cu-Cr alloy substrate surface is made to generate corresponding roughness, and the roughness of the process can reach 1~2 μm.
Cleaning is the cladding effect to clear up Cu-Cr alloy substrate surface, when impurity or greasy dirt being avoided to influence laser scanning, concrete mode
Drying and processing after being cleaned by absolute alcohol.
The two pieces of Cu-Cr alloy base materials selected in this step have not needed any restrictions, as long as meeting the item of production contact
Part.
Step 200, using one of contact as static side, static side is first placed on inertia as moved end by another piece of contact
On workbench in gas shield storehouse, and it is fixed in its workspace by the temperature control fixture of laser in-situ equipment；
Here the division to two pieces of contacts merely to be taken respectively in subsequent step different Laser Scanning Parameters into
Row scanning.
Temperature control fixture is a component of laser in-situ equipment, for cooling down while fixed contact to contact, is dropped
Warm mode can be the modes such as water cooling, air-cooled, coolant liquid exchange.It is placed in inert gas shielding storehouse and can avoid contact surface oxygen
Change, wherein in inert gas the content of oxygen and nitrogen at least below 50ppm.
Step 300, by the adjustment of the laser parameter of laser in-situ equipment to equal than or parameter when scanning greater than conventional laser
1/3, so that laser is generated continuous laser and laser scanning is carried out to static side superficial layer；
When parameter when conventional laser in this step scans refers to that the industry is normally modified material surface, swash
Parameter used by light time.And parameter when in the step to static side laser scanning need be equal to or more than conventional laser scanning when
The purpose of parameter is so that the cladding layer on contact is shown certain thickness in the case where meeting modified preceding topic, to move with subsequent
End cladding layer thickness is distinguished.
For laser when being modified to contact surface, the temperature in the molten bath generated is preferably greater than the melting temperature of Cr, this
When Cu be capable of forming liquid phase, and the edge of Cr particle is to melt and form corresponding spherical shape, so as to increase mobility, makes disperse
Effect is more preferable.
In this step, mode when laser scanning is identical as conventional scanning mode, i.e., laser beam is closed perpendicular to Cu-Cr
Golden substrate surface layer, and be scanned with surface of the gradually progressive track to contact.Laser beam uses progressive scanning mode,
Molten bath can be made to generate temperature gradient from scanning direction to non-scanning direction, using surface tension caused by temperature gradient in molten bath
Convection current is formed to strengthen the disperse of Cr particle.
Wherein, by the adjustment of the laser parameter of laser in-situ equipment to equal than or when scanning greater than conventional laser parameter 1/3
Specific value are as follows: laser power density: 6.4 × 104MW/m2~1.2 × 105MW/m2, laser scanning speed: 6~10m/
Min, overlapping rate: 20%~60%, wavelength: 1~3 μm；Static side surface melting layer with a thickness of 180~330 μm under the parameter.This
In the parameter that limits be a value range, the static side being finally completed can be made to have different melting zone thickness in this way, be subsequent
The contact for selecting two different-thickness provides conveniently.
Step 400, by controlling the static side after the completion of removing scanning on warm fixture and replacing with moved end, laser parameter is adjusted
To equal than or lower than conventional laser scanning when parameter 1/3, then make laser generate continuous laser to end surfaces layer carry out
Moved end is removed in laser scanning after the completion of scanning；
To the scanning mode of moved end with require the identical of static side, be not repeated herein.It should be noted that moved end is finally complete
Cheng Houqi cladding layer is equally that different thickness can be shown according to parameter difference, so as to form different collocation sides from static side
Formula.Although in addition, present embodiment by arranging scheme using static side and moved end as the explanation being collocated with each other, in practical collocation
When, it can equally arrange in pairs or groups between the static side or moved end of different-thickness.
Wherein, by laser parameter adjustment to equal than or lower than conventional laser scan when parameter 1/3 when design parameter are as follows:
Laser power density: 5.5 × 104MW/m2~7.6 × 104MW/m2, laser scanning speed: 8~12m/min, overlapping rate: 20%
~60%, wavelength: 1~3 μm.Under the parameter, the cladding layer thickness of moved end is generally the 1/3 of static side cladding layer thickness.
Step 500, abovementioned steps are repeated and produces all contacts, and contact the form side different with two pieces of cladding layer thickness
Static side and moved end of the formula as same vacuum interrupter, and the cladding layer thickness of static side is greater than the cladding layer thickness of moved end.
When selecting the contact of different-thickness, different parameters distinguishes the step when can be according to laser scanning, as
It is independently placed after the contact record of one parameter processing, then corresponding static side is being selected according to performance requirement with clock synchronization and is being moved
End.
The purpose of present embodiment is to make the contact of different modified layer thickness, then by the collocation of respective thickness come
Configure the static side and moved end of a vacuum interrupter.
This is because in practical applications, the failure of Cu-Cr alloy contact is the failure of its modified layer mostly, in vacuum extinction
In the practical service environment of room, the contact applied to vacuum interrupter is divided into static contact (+) and moving contact (-) both ends, often adopts
It is placed in sound both ends in pairs with the contact of identical microscopic structure, but electric arc is corroding static contact (+) and dynamic touching in vacuum extinction room
It is often different at the form of head (-), especially hard arc mould is even up to when vacuum arc shape develops to anode spot mode
When the formula stage, the diameter for the arc spot that static side contact (+) surface occurs more concentration bigger compared with moved end (-), and occurring,
This is allowed in the resistance to voltage levels of static side (+) situation identical with moved end (-) resistance to voltage levels, the static side in same vacuum interrupter
(+) first fails and the case where moved end can also continue to use, this obviously can not promote the performance of arc-chutes to greatest extent.
Alloy rigidity >=290HV of the superficial layer of static side and moved end of the present embodiment after laser scanning0.25.Pass through
The contact that different cladding layer thickness are produced in production, collocation thickness different static side and moved end, comes when selecting for the later period
The vacuum interrupter requirement for meeting voltage rating in 12~40.5kV provides the foundation.
Since static contact (+) modified layer thickness is deeper than moving contact (-), damage in the entire lifetime of Cu-Cr contact can be met
The thickness of consumption extends static contact service life；The modified layer thickness on moving contact (-) surface is lower, and sound touching can be effectively reduced
The contact resistance value at head both ends reduces contact during breaking current and integrally generates heat；The Cr phase particle ratio on moving contact (-) surface
The diameter of static contact (+) is small, is conducive to the cathode protection hot localised points temperature decline that moving contact surface is tiny, disperses, and evaporation subtracts
It is few, and stationary contact head surface is since anode spot diameter is bigger, more assembles, so the size of surface C r phase particle is more compared with moved end
Greatly.There is the Cu-Cr contact of gradient-structure, and different dynamic and static end of arranging in pairs or groups by designing, designer can be made to design
Stage is not necessarily to using the performance of contact material as considering to require, and need to propose the particular/special requirement to contact performance, at laser surface
The design that different process carries out respective needle pair can be used in reason, to promote comprehensive connecting-disconnecting function.
Present embodiment keeps the energy on monolithic contact low (< 0.5J) by the adjustment to Laser Scanning Parameters, modified layer
Thickness is controllable, and crystallite dimension is controllable.The variation of microscopic structure results in the difference of contact performance again, makes the contact electricity of contact material
Resistance, impact resistance voltage value and capacitive load connecting-disconnecting function generate variation, and the profession that can satisfy dynamic and static contact design requires, and mention
Comprehensive connecting-disconnecting function is risen, safety and the service life of arc-chutes is improved, reaches the optimal using effect of vacuum interrupter.
It in an embodiment of the invention, can be by existing to setting when carrying out laser scanning to static side and moved end
Cooling system on temperature control fixture cools down to contact, simultaneously because setting of this programme to scanning speed and temperature, so that
Each molten bath quickly generates and disappears, and the heat generated not as good as spreading around, and in this condition, this programme passes through water
Cold and laser scanning condition cooperation can make the cooling velocity in molten bath reach 105~106K/s。
Implementation process of the invention is further described with specific numerical value below.
Embodiment one:
1. choose the Cu-Cr alloy contact that is prepared of powder mixing method, with a thickness of 3mm, wherein Cr weight content percentage is about
It is 30%；Stand-by Cu-Cr alloy contact is cleaned with absolute alcohol, is dried, guarantees the clear of Cu-Cr alloy contact surface
It is clean；
2. according to different machining parameters ready for use, (static side and dynamic is divided to Cu-Cr alloy contact to be processed
End), Cu-Cr alloy contact (static side) is placed in the controllable atmosphere box of oxygen content in (oxygen content≤20ppm), then is placed in
On temperature control fixture on numerical control table, NC table；
3. Cu-Cr alloy contact (static side) to be placed in the working region of laser in-situ alloying equipment, laser is adjusted
Parameter, laser power density: 9 × 104MW/m2, laser scanning speed: 8m/min, overlapping rate: 30%, wavelength: 3 μm；Pass through company
Continue the quick scan action of laser in Cu-Cr alloy (static side) surface, after the completion of laser scanning, Cu-Cr alloy contact (static side) is cutd open
Face forms about 330 μm of a layer thickness of melting zone, and Cr phase crystal grain diameter is 0.8~2 μm, as shown in the right side Fig. 2；
4. removing Cu-Cr alloy contact (static side), then Cu-Cr alloy contact (moved end) is placed in laser in-situ alloying
The working region of equipment, the parameter for adjusting laser generate laser；Laser power density: 6 × 104MW/m2, laser scanning speed:
10m/min, overlapping rate: 40%, wavelength: 1 μm；By the quick scan action of continuous laser in Cu-Cr alloy (moved end) surface, warp
After laser treatment, section forms about 120 μm of a layer thickness of melting zone, and Cr phase crystal grain diameter is 0.2~1 μm, such as the left side Fig. 2
It is shown；
5. the Cu-Cr alloy contact (static side) and Cu-Cr alloy contact (moved end) that will acquire are with melting zone thickness difference three
Combination again is arranged in pairs or groups；Can by after collocation static side and moved end be installed on voltage rating be 12kV (model 12/1600-
Vacuum extinction chamber interior 31.5N), carries out subsequent electric performance test；
17 μ Ω of static side (+-) loop contact resistance under specified contact pressure, 15 μ Ω of moved end (+-) loop contact resistance,
16 μ Ω of static side (+) moved end (-) loop contact resistance.When without laser treatment, impulse withstand voltage (peak value) is in air
85kV.Pressure voltage test is carried out, as a result as shown in the table, no matter which kind of collocation, resistance to after laser treatment presses value height
In the untreated pressure-resistant limit (85kV).The especially asymmetrical type collocation of static side (+) moved end (-), pressure voltage is compared with symmetrical
Collocation promotes 20.2~32.7%, and pressure voltage is more uniformly spread, capacitive load currents break performance test failure 0 time
(0/30)。
Pressure-resistant limit comparison in the impinging air of different dynamic and static contact collocation
Embodiment two
1. choose the Cu-Cr alloy contact that is prepared of powder mixing method, with a thickness of 3mm, wherein Cr weight content percentage is about
It is 50%；Stand-by Cu-Cr alloy contact is cleaned with absolute alcohol, is dried, guarantees the clear of Cu-Cr alloy contact surface
It is clean；
2. according to different machining parameters ready for use, (static side and dynamic is divided to Cu-Cr alloy contact to be processed
End), Cu-Cr alloy contact (static side) is placed in the controllable atmosphere box of oxygen content in (oxygen content≤20ppm), then is placed in
On temperature control fixture on numerical control table, NC table；
3. Cu-Cr alloy contact (static side) to be placed in the working region of laser in-situ alloying equipment, laser is adjusted
Parameter, laser power density: 105MW/m2, laser scanning speed: 10m/min, overlapping rate: 40%, wavelength: 3 μm；By continuous
The quick scan action of laser is in Cu-Cr alloy (static side) surface, after the completion of laser scanning, Cu-Cr alloy contact (static side) section
About 180 μm of a layer thickness of melting zone is formd, Cr phase crystal grain diameter is 5~7 μm；
4. removing Cu-Cr alloy contact (static side), then Cu-Cr alloy contact (moved end) is placed in laser in-situ alloying
The working region of equipment, the parameter for adjusting laser generate laser；Laser power density: 6.5 × 104MW/m2, laser scanning speed
Degree: 8m/min, overlapping rate: 40%, wavelength: 1 μm；By the quick scan action of continuous laser in Cu-Cr alloy (moved end) surface,
After laser treatment, section forms about 80 μm of a layer thickness of melting zone, and Cr phase crystal grain diameter is 1~3 μm；
5. the Cu-Cr alloy contact (static side) and Cu-Cr alloy contact (moved end) that will acquire are with melting zone thickness difference three
Combination again is arranged in pairs or groups；Can by after collocation static side and moved end be installed on voltage rating be 40.5kV (model 40.5/
Vacuum extinction chamber interior 1600-25C), carries out subsequent electric performance test；
16 μ Ω of static side (+-) loop contact resistance under specified contact pressure, 15 μ Ω of moved end (+-) loop contact resistance,
14 μ Ω of static side (+) moved end (-) loop contact resistance.When without laser treatment, impulse withstand voltage (peak value) in oil medium
For 185kV.The pressure voltage test in oil medium is carried out, no matter which kind of collocation, the resistance to value that presses after laser treatment are above
The untreated pressure resistance limit (185kV).Especially the asymmetrical type collocation of static side (+) moved end (-), pressure voltage are taken compared with symmetrically
With being promoted to 215kV, and the minimum and highest pressure voltage difference at dynamic and static both ends is smaller, capacitive load currents break performance
Test failure 0 time (0/20).
So far, although those skilled in the art will appreciate that present invention has been shown and described in detail herein multiple shows
Example property embodiment still without departing from the spirit and scope of the present invention, still can according to the present disclosure directly
Determine or deduce out many other variations or modifications consistent with the principles of the invention.Therefore, the scope of the present invention is understood that and recognizes
It is set to and covers all such other variations or modifications.
Claims (10)
1. a kind of preparation method of the high conductivity gradient-structure Cu-Cr alloy contact of high rigidity, which is characterized in that including walking as follows
It is rapid:
Step 100, the contact that selection Cr content is respectively prepared in two pieces of Cu-Cr alloy base materials of 20~60wt.%, to its surface
It is polished and is cleaned；
Step 200, using one of contact as static side, static side is first placed on inert gas as moved end by another piece of contact
On workbench in protecting bin, and it is fixed in its workspace by the temperature control fixture of laser in-situ equipment；
Step 300, by the adjustment of the laser parameter of laser in-situ equipment to equal than or when scanning greater than conventional laser parameter 1/3,
Then so that laser is generated continuous laser and laser scanning is carried out to static side superficial layer；
Step 400, by controlling the static side after the completion of removing scanning on warm fixture and replacing with moved end, by laser parameter adjust to etc.
The 1/3 of parameter when conventional laser scanning, then makes laser generate continuous laser and carries out laser to end surfaces layer
Moved end is removed in scanning after the completion of scanning；
Step 500, abovementioned steps are repeated and produce all contacts, and are come with the different contact building form of two pieces of cladding layer thickness
Static side and moved end as same vacuum interrupter, and the cladding layer thickness of static side is greater than the cladding layer thickness of moved end.
2. preparation method according to claim 1, which is characterized in that
Oxygen and nitrogen content in the step 200 in inert gas shielding storehouse are less than 50ppm.
3. preparation method according to claim 1, which is characterized in that
The surface roughness of Cu-Cr alloy base material is 1~2 μm after the polishing.
4. preparation method according to claim 1, which is characterized in that
The laser parameter adjustment by laser in-situ equipment to equal than or when being scanned greater than conventional laser parameter 1/3 when are as follows:
Laser power density: 6.4 × 104MW/m2~1.2 × 105MW/m2, laser scanning speed: 6~10m/min, overlapping rate: 20%
~60%, wavelength: 1~3 μm.
5. preparation method according to claim 1, which is characterized in that
It is described by laser parameter adjustment to equal than or lower than conventional laser scan when parameter 1/3 are as follows: laser power density: 5.5
×104MW/m2~7.6 × 104MW/m2, laser scanning speed: 8~12m/min, overlapping rate: 20%~60%, wavelength: 1~3 μ
m。
6. preparation method according to claim 1, which is characterized in that
In laser scanning, the cooling velocity in molten bath is set to reach 10 by the cooperation of water cooling and laser scanning condition to contact5~
106K/s。
7. preparation method according to claim 1, which is characterized in that
During laser scanning, laser beam uses progressive scanning mode, produces molten bath from scanning direction to non-scanning direction
Raw temperature gradient, forms convection current in molten bath using surface tension caused by temperature gradient to strengthen the disperse of Cr particle.
8. preparation method according to claim 1, which is characterized in that
Temperature > Cr fusing point and Cr particle when laser scanning in molten bath are fused into spherical shape.
9. preparation method according to claim 1, which is characterized in that
Alloy rigidity >=290HV of the superficial layer of static side and moved end after laser scanning0.25。
10. preparation method according to claim 1, which is characterized in that
The cladding layer of static side is with a thickness of 1~3 times of moved end cladding layer thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811267429.1A CN109346353B (en) | 2018-10-29 | 2018-10-29 | Preparation method of Cu-Cr alloy contact with high-hardness and high-conductivity gradient structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811267429.1A CN109346353B (en) | 2018-10-29 | 2018-10-29 | Preparation method of Cu-Cr alloy contact with high-hardness and high-conductivity gradient structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109346353A true CN109346353A (en) | 2019-02-15 |
| CN109346353B CN109346353B (en) | 2020-04-24 |
Family
ID=65312271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811267429.1A Active CN109346353B (en) | 2018-10-29 | 2018-10-29 | Preparation method of Cu-Cr alloy contact with high-hardness and high-conductivity gradient structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109346353B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834077A (en) * | 2010-04-16 | 2010-09-15 | 河南理工大学 | Method for manufacturing pure copper/copper chromium alloy composite contact material |
| CN105839037A (en) * | 2016-03-18 | 2016-08-10 | 中国科学院力学研究所 | Laser surface modification method of copper-chromium alloy contact |
| CN106296648A (en) * | 2016-07-21 | 2017-01-04 | 中国科学院力学研究所 | The method of relation between plasma and final modified effect when evaluating laser modified |
-
2018
- 2018-10-29 CN CN201811267429.1A patent/CN109346353B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834077A (en) * | 2010-04-16 | 2010-09-15 | 河南理工大学 | Method for manufacturing pure copper/copper chromium alloy composite contact material |
| CN105839037A (en) * | 2016-03-18 | 2016-08-10 | 中国科学院力学研究所 | Laser surface modification method of copper-chromium alloy contact |
| CN106296648A (en) * | 2016-07-21 | 2017-01-04 | 中国科学院力学研究所 | The method of relation between plasma and final modified effect when evaluating laser modified |
Non-Patent Citations (1)
| Title |
|---|
| 苗柏和: "激光表面熔凝CuCr50粉末冶金材料", 《应用激光》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109346353B (en) | 2020-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102316204B1 (en) | Laser-etched grain-oriented silicon steel resistant to stress-relief annealing and manufacturing method therefor | |
| CN100450694C (en) | A vacuum electron beam welding method | |
| JP7316008B2 (en) | Manufacturing method of high-purity nickel-based high-temperature alloy based on electron-beam-induced smelting and casting technology | |
| CN109514066B (en) | Device for controlling interlayer temperature based on electron beam fuse additive manufacturing | |
| CN106978586A (en) | A kind of overlay coating processing method of arc-chutes copper tungsten electrical contact material | |
| JP2021512218A (en) | Method for manufacturing low iron loss directional silicon steel with stress relief annealing | |
| CN114850494B (en) | Multi-beam electron beam additive manufacturing method for high-entropy alloy foam structure | |
| CN108468017B (en) | Magnetron sputtering method for preparing silver-graphite composite coating on surface of copper contact | |
| CN109346353A (en) | A kind of preparation method of the high conductivity gradient-structure Cu-Cr alloy contact of high rigidity | |
| CN105977446A (en) | System and method for processing nanostructure on surface of electrode for battery by utilizing femtosecond laser | |
| Huang et al. | Influence of operation number on arc erosion behavior of Ag/Ni electrical contact materials | |
| CN109402625B (en) | Method for eliminating laser deposition holes of alloy structural steel | |
| CN114481118A (en) | Method for repairing aluminum alloy by laser cladding in atmospheric environment | |
| CN111394659B (en) | Alloy powder for laser cladding of crystallizer copper plate and laser cladding method | |
| CN104120245A (en) | Method for processing surface of CuCr contact material for vacuum arc-extinguishing chamber | |
| CN111139471B (en) | Method for preparing superhard Zr on surface of zirconium alloyxMethod for CrCoFeNi high-entropy alloy coating | |
| CN108000294A (en) | A kind of workpiece surface intensifying method based on intelligent robot grinding | |
| CN114107857B (en) | High-temperature high-pressure shot peening strengthening method for improving ablation resistance of surface of refractory metal electrode | |
| CN1182800A (en) | Method of quick scan fusing hardening for surface of cast iron | |
| CN113584279A (en) | Stress-relief-resistant annealed notch oriented silicon steel and manufacturing method thereof | |
| CN117300530A (en) | Method for increasing surface area of plate heat exchanger rapidly without impurities | |
| Chen et al. | Observation on AgSnO 2 In 2 O 3 molten bridge phenomena under different currents | |
| CN113053705B (en) | Arc ablation resistant hafnium-copper composite electrode and preparation method thereof | |
| CN112725714B (en) | Method for refining uranium niobium alloy surface inclusions | |
| Li et al. | Relationship between Morphology Feature of Contact Surfaces and Impulse Breakdown Voltage in Vacuum Gap under a Non-uniform Electric Field |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |